GL05-HT3 to GL24-HT3
Vishay Semiconductors
Low Capacitance ESD Protection Diodes for High-Speed Data
Interfaces
Features
• Transient protection for data lines as per
IEC 61000-4-2 (ESD) 15 kV (air) 8 kV
(contact)
IEC 61000-4-5 (Lightning) see I
PPM
below
e3
• Small package for use in portable electronics
• Low capacitance for high speed data lines,
cellular handsets, USB port protection,
LAN equipment, peripherals
• Space saving LLP package
• Lead (Pb)-free component
• Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
Mechanical Data
Case: LLP75-3B Plastic case
Molding Compound Flammability Rating:
UL 94 V-0
Terminals: High temperature soldering guaranteed:
260 °C/10 sec. at terminals
Weight: approx. 5.2 mg
17914
Top view
Pin 1
3
12
Parts Table
Par t Ordering code Marking Remarks
GL05-HT3 GL05-HT3-GS08 50 Tape and Reel
GL12-HT3 GL12-HT3-GS08 51 Tape and Reel
GL15-HT3 GL15-HT3-GS08 52 Tape and Reel
GL24-HT3 GL24-HT3-GS08 53 Tape and Reel
Absolute Maximum Ratings
Ratings at 25 °C, ambient temperature unless otherwise specified
Parameter Test condition Symbol Val ue Unit
Peak pulse power 8/20 μs waveform P
Peak repetitive reverse
voltage (rectifier)
ESD voltage ESD per IEC 61000-4-2 V
V
PK
RRM
ESD
300 W
70 V
>25 kV
Thermal Characteristics
Ratings at 25 °C, ambient temperature unless otherwise specified
Parameter Test condition Symbol Val ue Unit
Operation temperature T
Storage temperature T
stg
, T
J
STG
- 55 to + 125 °C
- 55 to + 150 °C
Document Number 85823
Rev. 1.7, 29-Apr-05
www.vishay.com
1
GL05-HT3 to GL24-HT3
Vishay Semiconductors
Electrical Characteristic
Partnumber Marking
Code
GL05-HT3 50 5 6 20 9.8 11 17 5
GL12-HT3 51 12 13.3 1 19 24 12 5
GL15-HT3 52 15 16.7 1 24 33 10 5
GL24-HT3 53 24 26.7 1 43 55 5 5
Package Dimensions in mm (Inches)
V
RWM
V V μA V V A pF
V
BR(min)
@ It = 1.0 mA @ V
1 (0.039)
I
R(max)
0.3 (0.012)
RWM
V
C(max)
IPP = 1.0 A IPP = 5.0 A tp = 8/20 μs VR = 0V
I
PPM
12
Cj
Pin1 to Pin2
Pin3 NC
f = 1 MHz
18057
0.4 (0.016)
0.3 (0.012)
0.7 (0.027)
1.6 (0.062)
3
1 (0.039)
1.6 (0.062)
0.25 (0.010)
0.15 (0.006)
Top View
ISO Method E
www.vishay.com
2
Document Number 85823
Rev. 1.7, 29-Apr-05
GL05-HT3 to GL24-HT3
Vishay Semiconductors
Ozone Depleting Substances Policy Statement
It is the policy of Vishay Semiconductor GmbH to
1. Meet all present and future national and international statutory requirements.
2. Regularly and continuously improve the performance of our products, processes, distribution and operating
systems with respect to their impact on the health and safety of our employees and the public, as well as
their impact on the environment.
It is particular concern to control or eliminate releases of those substances into the atmosphere which are
known as ozone depleting substances (ODSs).
The Montreal Protocol (1987) and its London Amendments (1990) intend to severely restrict the use of ODSs
and forbid their use within the next ten years. Various national and international initiatives are pressing for an
earlier ban on these substances.
Vishay Semiconductor GmbH has been able to use its policy of continuous improvements to eliminate the use
of ODSs listed in the following documents.
1. Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments
respectively
2. Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental
Protection Agency (EPA) in the USA
3. Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C (transitional substances) respectively.
Vishay Semiconductor GmbH can certify that our semiconductors are not manufactured with ozone depleting
substances and do not contain such substances.
We reserve the right to make changes to improve technical design
and may do so without further notice.
Parameters can vary in different applications. All operating parameters must be validated for each
customer application by the customer. Should the buyer use Vishay Semiconductors products for any
unintended or unauthorized application, the buyer shall indemnify Vishay Semiconductors against all
claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal
damage, injury or death associated with such unintended or unauthorized use.
Vishay Semiconductor GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany
Document Number 85823
Rev. 1.7, 29-Apr-05
www.vishay.com
3
Legal Disclaimer Notice
Vishay
Notice
Specifications of the products displayed herein are subject to change without notice. Vishay Intertechnology, Inc.,
or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, by
estoppel or otherwise, to any intellectual property rights is granted by this document. Except as provided in Vishay's
terms and conditions of sale for such products, Vishay assumes no liability whatsoever, and disclaims any express
or implied warranty, relating to sale and/or use of Vishay products including liability or warranties relating to fitness
for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify Vishay for any damages resulting from such improper use or sale.
Document Number: 91000 www.vishay.com
Revision: 08-Apr-05 1
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