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Dual INT-A-PAK Low Profile “Half Bridge”
Dual INT-A-PAK Low Profile
PRODUCT SUMMARY
V
CES
DC at TC = 25 °C 530 A
I
C
(typical) at 300 A, 25 °C 1.24 V
V
CE(on)
Speed DC to 1 kHz
Package DIAP low profile
Circuit Half bridge
(Standard Speed IGBT), 300 A
FEATURES
• Gen 4 IGBT technology
• Standard: optimized for hard switching speed
•Low V
• Square RBSOA
•HEXFRED
• Industry standard package
•Al
• UL approved file E78996
• Designed for industrial level
• Material categorization: for definitions of compliance
600 V
BENEFITS
• Increased operating efficiency
• Performance optimized as output inverter stage for TIG
• Direct mounting on heatsink
• Very low junction to case thermal resistance
CE(on)
®
antiparallel diode with ultrasoft reverse
recovery characteristics
DBC
2O3
please see www.vishay.com/doc?99912
welding machines
GA300TD60S
Vishay Semiconductors
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS MAX. UNITS
Collector to emitter voltage V
Continuous collector current I
Pulsed collector current I
Clamped inductive load current I
Diode continuous forward current I
Gate to emitter voltage V
Maximum power dissipation (IGBT) P
RMS isolation voltage V
Note
(1)
Maximum continuous collector current must be limited to 500 A to do not exceed the maximum temperature of terminals
CES
C
CM
LM
ISOL
F
GE
(1)
D
TC = 25 °C 530
= 80 °C 376
T
C
TC = 25 °C 219
= 80 °C 145
T
C
TC = 25 °C 1136
T
= 80 °C 636
C
Any terminal to case
(V
t = 1 s, TJ = 25 °C)
RMS
600 V
800
800
± 20 V
3500 V
A
W
Revision: 12-Jun-15
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Document Number: 93362
GA300TD60S
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ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Collector to emitter breakdown voltage V
Gate threshold voltage V
Collector to emitter leakage current I
Diode forward voltage drop V
Gate to emitter leakage current I
BR(CES)VGE
CE(on)
GE(th)
CES
FM
GES
= 0 V, IC = 500 μA 600 - -
VGE = 15 V, IC = 150 A - 1.04 1.15
= 15 V, IC = 300 A - 1.24 1.45
V
GE
= 15 V, IC = 150 A, TJ = 125 °C - 0.96 1.06
V
GE
= 15 V, IC = 300 A, TJ = 125 °C - 1.22 1.42
V
GE
VCE = VGE, IC = 250 μA 2.9 4.8 6.3
VGE = 0 V, VCE = 600 V - 0.02 0.75
V
= 0 V, VCE = 600 V, TJ = 125 °C - 1.5 10
GE
IFM = 150 A - 1.23 1.39
= 300 A - 1.48 1.75
I
FM
= 150 A, TJ = 125 °C - 1.17 1.33
I
FM
= 300 A, TJ = 125 °C - 1.50 1.77
I
FM
VGE = ± 20 V - - ± 200 nA
Vishay Semiconductors
VCollector to emitter voltage V
mA
V
SWITCHING CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Turn-on switching loss E
Turn-off switching loss E
Total switching loss E
Turn-on switching loss E
Turn-off switching loss E
Total switching loss E
Turn-on delay time t
Rise time t
Turn-off delay time t
Fall time t
on
off
tot
on
off
tot
d(on)
r
d(off)
f
Reverse bias safe operating area RBSOA
Diode reverse recovery time t
Diode peak reverse current I
Diode recovery charge Q
Diode reverse recovery time t
Diode peak reverse current I
Diode recovery charge Q
rr
rr
rr
rr
rr
rr
IC = 300 A, VCC = 360 V, VGE = 15 V,
R
= 1.5 , L = 500 μH, TJ = 25 °C
g
IC = 300 A, VCC = 360 V, VGE = 15 V,
= 1.5 , L = 500 μH, TJ = 125 °C
R
g
= 150 °C, IC = 800 A, VCC = 400 V
T
J
V
= 600 V, Rg = 22 VGE = 15 V to 0 V,
P
L = 500 μH
IF = 300 A, dIF/dt = 500 A/μs,
V
= 400 V, TJ = 25 °C
CC
IF = 300 A, dIF/dt = 500 A/μs,
= 400 V, TJ = 125 °C
V
CC
-9-
-90-
-99-
-23-
mJ
- 133 -
- 156 -
- 442 -
- 301 -
- 406 -
ns
- 1570 -
Fullsquare
- 150 179 ns
-4359A
-3.96.3μC
- 236 265 ns
-6480A
- 8.6 11.1 μC
Revision: 12-Jun-15
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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Document Number: 93362
GA300TD60S
I
C
(A)
VCE (V)
0.25 0.750.50 1.00 1.50 2.001.25 1.75
0
93362_01
600
200
100
400
300
500
TJ = 25 °C
TJ = 125 °C
I
C
(A)
VCE (V)
0.25 0.50 1.00 1.50 2.001.250.75 1.75 2.25
93362_02
0
600
200
100
400
300
500
VGE = 9 V
VGE = 12 V
V
GE
= 15 V
V
GE
= 18 V
Allowable Case Temperature (°C)
IC - Continuous Collector Current (A)
400300200100 500
600
0
100
160
0
40
60
140
80
120
20
93362_03
DC
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THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL MIN. TYP. MAX. UNITS
Operating junction and storage temperature range T
Junction to case per leg
IGBT
Case to sink per module R
Mounting torque
case to heatsink: M6 screw 4 - 6
case to terminal 1, 2, 3: M5 screw 2 - 4
J
R
, T
thJC
thCS
Stg
Weight - 270 - g
-40 - 150 °C
- - 0.11
-0.05-
Vishay Semiconductors
°C/WDiode - - 0.4
Nm
Fig. 1 - Typical Output Characteristics,
Revision: 12-Jun-15
Fig. 2 - Typical Output Characteristics,
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T
= 25 °C, VGE = 15 V
J
(V)
CE
V
93362_04
1.7
1.6
1.5
1.4
1.3
1.2
1.1
1.0
0.9
0.8
0.7
0.6
20 40 80 120 16060 100 140
Case Temperature
400 A
150 A
Fig. 4 - Typical IGBT Collector to Emitter Voltage vs.
Fig. 3 - Maximum DC IGBT Collector Current vs.
T
= 125 °C
J
Junction Temperature,
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TJ (°C)
V
GE
300 A
= 15 V
Document Number: 93362
600
I
C
(A)
VCE (V)
1 10 100 1000
1
93362_07
10 000
10
100
1000
I
CES
(mA)
V
CES
(V)
100 600200 300 400 500
0.001
93362_08
10
0.1
0.01
1
TJ = 25 °C
TJ = 125 °C
Allowable Case Temperature (°C)
IF - Continuous Forward Current (A)
1601208040 200
240
0
100
160
0
40
60
140
80
120
20
93362_10
DC
500
400
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VCE = 20 V
GA300TD60S
Vishay Semiconductors
(A)
C
I
93362_05
(V)
geth
V
93362_06
300
200
100
0
41056 879
TJ = 125 °C
TJ = 25 °C
VGE (V)
Fig. 5 - Typical IGBT Transfer Characteristics
5.5
5.0
4.5
4.0
3.5
3.0
2.5
0.4 1.00.5 0.6 0.80.7 0.9
TJ = 25 °C
TJ = 125 °C
IC (mA)
Fig. 6 - Typical IGBT Gate Threshold Voltage
Fig. 8 - Typical IGBT Zero Gate Voltage Collector Current
600
500
TJ = 125 °C
(A)
F
I
93362_09
400
300
200
100
0
02.50.5 1.0 1.5 2.0
TJ = 25 °C
VFM (V)
Fig. 9 - Typical Diode Forward Characteristics
Revision: 12-Jun-15
T
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Fig. 7 - IGBT Reverse Bias SOA,
= 150 °C, VGE = 15 V, Rg = 22
J
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Fig. 10 - Maximum DC Forward Current vs. Case Temperature
4
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Energy (mJ)
IC (A)
0 50 100 200 250 300150 350
0
93362_11
150
100
125
50
75
25
E
on
E
off
Switching Time (ns)
IC (A)
0 50 250150100 300200 350
10
93362_12
10 000
100
1000
t
d(off)
t
d(on)
t
r
t
f
t
rr
(ns)
dIF/dt (A/μs)
100 200 400 600 800 1000300 500 700 900
100
300
240
120
160
200
260
280
140
180
220
93362_15
TJ = 25 °C
TJ = 125 °C
I
rr
(A)
dIF/dt (A/µs)
100 200 400 600 800 1000300 500 700 900
10
130
90
110
120
30
50
70
80
100
20
40
60
93362_16
TJ = 25 °C
TJ = 125 °C
10 000
GA300TD60S
Vishay Semiconductors
t
f
Fig. 11 - Typical IGBT Energy Loss vs. IC,
T
= 125 °C, VCC = 360 V, Rg = 1.5 ,
J
V
= 15 V, L = 500 μH
GE
1000
Switching Time (ns)
93362_14
t
d(off)
t
r
100
0 5 15 2010 25
Rg (Ω)
Fig. 14 - Typical IGBT Switching Time vs. R
T
= 125 °C, IC = 300 A, VCC = 360 V,
J
V
= 15 V, L = 500 μH
GE
t
d(on)
,
g
Fig. 12 - Typical IGBT Switching Time vs. I
T
= 125 °C, VCC = 360 V, Rg = 1.5 ,
J
V
= 15 V, L = 500 μH
GE
150
125
100
75
Energy (mJ)
50
25
93362_13
Revision: 12-Jun-15
0
0 5 10 2015 25
Fig. 13 - Typical IGBT Energy Loss vs. R
T
= 125 °C, IC = 300 A, VCC = 360 V,
J
V
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Rg (Ω)
= 15 V, L = 500 μH
GE
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
,
C
E
off
E
on
,
g
5
Fig. 15 - Typical Reverse Recovery Time vs. dI
V
= 400 V, IF = 300 A
CC
Fig. 16 - Typical Reverse Recovery Current vs. dI
V
= 400 V, IF = 300 A
CC
Document Number: 93362
F
/dt,
/dt,
F
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Q
rr
(μC)
dIF/dt (A/μs)
100 200 400 600 800 1000300 500 700 900
0
22
16
4
2
6
8
20
12
14
18
10
93362_17
TJ = 25 °C
TJ = 125 °C
0.001
0.01
0.1
1
0.00001
93362_18
0.0001 0.001 0.01 0.1 1
t1 - Rectangular Pulse Duration (s)
Z
thJC
- Thermal Impedance
Junction to Case (°C/W)
10
D = 0.50
D = 0.20
D = 0.10
D = 0.05
D = 0.02
D = 0.01
DC
0.001
0.01
0.1
1
0.00001
93362_19
0.0001 0.001 0.01 0.1 1
t1 - Rectangular Pulse Duration (s)
Z
thJC
- Thermal Impedance
Junction to Case (°C/W)
10
D = 0.50
D = 0.20
D = 0.10
D = 0.05
D = 0.02
D = 0.01
DC
GA300TD60S
Vishay Semiconductors
Fig. 17 - Typical Reverse Recovery Charge vs. dIF/dt,
V
= 400 V, IF = 300 A
CC
Fig. 18 - Maximum Thermal Impedance Z
thJC
Characteristics (IGBT)
Revision: 12-Jun-15
Fig. 19 - Maximum Thermal Impedance Z
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Characteristics (Diode)
thJC
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1 - Insulated Gate Bipolar Transistor (IGBT)
2 - A = Generation 4 IGBT
3 - Current rating (300 = 300 A)
4 - Circuit configuration (T = Half-bridge)
5 - Package indicator (D = Dual INT-A-PAK Low Profile)
6 - Voltage rating (60 = 600 V)
7 - Speed/type (S = Standard Speed IGBT)
Device code
51 32 4 6 7
G A 300 T D 60 S
4
5
1
6
7
3
2
ORDERING INFORMATION TABLE
CIRCUIT CONFIGURATION
GA300TD60S
Vishay Semiconductors
LINKS TO RELATED DOCUMENTS
Dimensions www.vishay.com/doc?95435
Revision: 12-Jun-15
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Document Number: 93362
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