D-PAK (TO-252AA)
DIMENSIONS in millimeters and inches
Outline Dimensions
Vishay High Power Products
Ø 2
(2) L5
b2
SYMBOL
(5)
(3)
3
A
L3 (3)
D (5)
b
0.010
Lead tip
0.010
B
L4
M
M
CAB
Detail “C”
CAB
Rotated 90 °CW
Ø 1
Detail “C”
Scale: 20:1
Gauge
plane
L2
E
b3
4
1
2
e
2 x
MILLIMETERS INCHES
MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX.
C
A
c2
A
Seating
plane
Ø
c
(L1)
C
C
L
D1
H
3241
A
A1
NOTES SYMBOL
E1
0.488 (12.40)
0.409 (10.40)
0.06
(1.524)
0.093 (2.38)
0.085 (2.18)
H
(7)
C
Seating
plane
MILLIMETERS INCHES
MIN.
Pad layout
0.265
MIN.
(6.74)
0.245
(6.23)
0.089
(2.28)
NOTES
A 2.18 2.39 0.086 0.094 e 2.29 BSC 0.090 BSC
A1 - 0.13 - 0.005 H 9.40 10.41 0.370 0.410
b 0.64 0.89 0.025 0.035 L 1.40 1.78 0.055 0.070
b2 0.76 1.14 0.030 0.045 L1 2.74 BSC 0.108 REF.
b3 4.95 5.46 0.195 0.215 3 L2 0.51 BSC 0.020 BSC
c 0.46 0.61 0.018 0.024 L3 0.89 1.27 0.035 0.050 3
c2 0.46 0.89 0.018 0.035 L4 - 1.02 - 0.040
D 5.97 6.22 0.235 0.245 5 L5 1.14 1.52 0.045 0.060 2
D1 5.21 - 0.205 - 3 Ø 0° 10° 0° 10°
E 6.35 6.73 0.250 0.265 5 Ø1 0° 15° 0° 15°
E1 4.32 - 0.170 - 3 Ø2 25° 35° 25° 35°
Notes
(1)
Dimensioning and tolerancing as per ASME Y14.5M-1994
(2)
Lead dimension uncontrolled in L5
(3)
Dimension D1, E1, L3 and b3 establish a minimum mounting surface for thermal pad
(4)
Section C - C dimension apply to the flat section of the lead between 0.13 and 0.25 mm (0.005 and 0.10") from the lead tip
(5)
Dimension D, and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at
the outermost extremes of the plastic body
(6)
Dimension b1 and c1 applied to base metal only
(7)
Datum A and B to be determined at datum plane H
(8)
Outline conforms to JEDEC outline TO-252AA
MIN.
MIN.
Document Number: 95016 For technical questions concerning discrete products, contact: diodes-tech@vishay.com
Revision: 04-Nov-08 For technical questions concerning module products, contact: ind-modules@vishay.com
www.vishay.com
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