• Short circuit rated ultrafast: Optimized for high
speed > 5.0 kHz, and short circuit rated to 10 μs
at 125 °C, V
• Fully isolated printed circuit board mount
package
• Switching-loss rating includes all “tail” losses
•HEXFRED
• UL approved file E78996
• Designed and qualified for industrial level
• Material categorization: For definitions of compliance
please see www.vishay.com/doc?99912
DESCRIPTION
The IGBT technology is the key to Vishay´s Semiconductors
advanced line of IMS (Insulated Metal Substrate) power
modules. These modules are more efficient than
comparable bipolar transistor modules, while at the same
time having the simpler gate-drive requirements of the
familiar power MOSFET. This superior technology has now
been coupled to a state of the art materials system that
maximizes power throughput with low thermal resistance.
This package is highly suited to motor drive applications and
where space is at a premium.
= 15 V
GE
®
soft ultrafast diodes
RoHS
COMPLIANT
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOLTEST CONDITIONSMAX. UNITS
Collector to emitter voltageV
Continuous collector currentI
Pulsed collector currentI
Clamped inductive load currentI
Short circuit withstand timet
Gate to emitter voltageV
Isolation voltageV
Maximum power dissipation, each IGBTP
Operating junction and storage temperature rangeT
Soldering temperatureFor 10 s, (0.063" (1.6 mm) from case)300
Mounting torque 6-32 or M3 screw
Notes
(1)
Repetitive rating; VGE = 20 V, pulse width limited by maximum junction temperature (see fig. 20)
(2)
VCC = 80 % (V
Revision: 11-Jun-13
For technical questions within your region: DiodesAmericas@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
), VGE = 20 V, L = 10 μH, RG = 10 (see fig. 19)
CES
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
CM
LM
J
CES
C
SC
GE
ISOL
, T
TC = 25 °C 24
= 100 °C13
T
C
(1)
(2)
TC = 100 °C9.3μs
t = 1 min, any terminal to case2500V
TC = 25 °C63
D
T
= 100 °C25
C
Stg
1
, DiodesAsia@vishay.com, DiodesEurope@vishay.com
600V
48
48
± 20V
- 55 to + 150
5 to 7
(0.55 to 0.8)
Document Number: 94488
lbf in
(N m)
A
RMS
W
°C
CPV364M4KPbF
www.vishay.com
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER SYMBOLTYP. MAX. UNITS
Junction to case, each IGBT, one IGBT in conductionR
Case to sink, flat, greased surfaceR
Weight of module
(IGBT)-2.2
thJC
(DIODE)-3.7
thJC
(MODULE)0.10-
thCS
20-g
0.7-oz.
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOLTEST CONDITIONS MIN. TYP. MAX. UNITS
(1)
Collector to emitter breakdown voltageV
Temperature coeff. of breakdown
voltage
Collector to emitter saturation voltageV
Gate threshold voltageV
Temperature coeff. of threshold voltageV
Forward transconductanceg
Zero gate voltage collector currentI
Diode forward voltage dropV
Gate to emitter leakage currentI
Notes
(1)
Pulse width 80 μs, duty factor 0.1 %
(2)
Pulse width 5.0 μs; single shot
V
(BR)CES
(BR)CES
CE(on)
GE(th)
GE(th)
fe
CES
FM
GES
/T
(2)
VGE = 0 V, IC = 250 μA600--V
TJVGE = 0 V, IC = 1.0 mA-0.63-V/°C
IC = 13 A
V
= 24 A-1.80-
I
C
= 13 A, TJ = 150 °C-1.561.73
I
C
GE
See fig. 2, 5
VCE = VGE, IC = 250 μA
J
VCE = 100 V, IC = 10 A1118-S
VGE = 0 V, VCE = 600 V--250
V
= 0 V, VCE = 600 V, TJ = 150 °C--3500
GE
IC = 15 A
I
= 15 A, TJ = 150 °C-1.21.6
C
See fig. 13
VGE = ± 20 V--± 100nA
Vishay Semiconductors
°C/WJunction to case, each DIODE, one DIODE in conductionR
-1.802.3
= 15 V
3.0-6.0
-- 13-mV/°C
-1.31.7
V
μA
V
Revision: 11-Jun-13
For technical questions within your region: DiodesAmericas@vishay.com
2
, DiodesAsia@vishay.com, DiodesEurope@vishay.com
Document Number: 94488
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
CPV364M4KPbF
www.vishay.com
SWITCHING CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOLTEST CONDITIONS MIN. TYP. MAX. UNITS
Total gate charge (turn-on)Q
Gate to collector charge (turn-on)Q
Turn-on delay timet
Rise timet
Turn-off delay timet
Fall timet
Turn-on switching lossE
Total switching lossE
Short circuit withstand timet
Turn-on delay timet
Rise timet
Turn-off delay timet
Fall timet
Total switching lossE
Internal emitter inductanceL
Input capacitanceC
Reverse transfer capacitanceC
Diode reverse recovery timet
Diode peak reverse recovery chargeI
Diode reverse recovery chargeQ
Diode peak rate of fall of recovery
during t
b
dI
g
ge
gc
d(on)
r
d(off)
f
on
off
ts
sc
d(on)
r
d(off)
f
ts
E
ies
oes
res
rr
rr
rr
(rec)M
IC = 13 A
= 400 V
V
CC
V
= 15 V
GE
See fig. 8
TJ = 25 °C
I
= 13 A, VCC = 480 V
C
V
= 15 V, RG = 10
GE
Energy losses include “tail” and diode
reverse recovery
See fig. 9, 10, 18
VCC = 360 V,TJ = 125 °C
V
= 15 V, RG = 10 , V
GE
CPK
< 500 V
TJ = 150 °C, see fig. 9, 10, 11, 18
I
= 13 A, VCC = 480 V
C
V
= 15 V, RG = 10
GE
Energy losses include “tail” and
diode reverse recovery
Measured 5 mm from package-7.5-nH
VGE = 0 V
= 30 V
V
CC
ƒ = 1.0 MHz
See fig. 7
/dt
TJ = 25 °C
T
= 125 °C -74120
J
TJ = 25 °C
T
= 125 °C -6.510
J
TJ = 25 °C
T
= 125 °C -220600
J
= 25 °C
T
J
T
= 125 °C -160-
J
See fig. 14
See fig. 15
See fig. 16
See fig. 17
I
= 15 A
F
V
= 200 V
R
dI/dt = 200 A/μs
Vishay Semiconductors
-110170
-1421
-4974
-50-
-30-
-110170
-91140
-0.56-
-0.28-
-0.841.1
10--μs
-47-
-30-
-250-
-150-
-1.28-mJ
-1600-
-130-
-55-
-4260
-4.06.0
-80180
-188-
nCGate to emitter charge (turn-on)Q
ns
mJTurn-off switching lossE
ns
pFOutput capacitanceC
ns
A
nC
A/μs
Revision: 11-Jun-13
For technical questions within your region: DiodesAmericas@vishay.com
3
, DiodesAsia@vishay.com, DiodesEurope@vishay.com
Document Number: 94488
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
www.vishay.com
0.1 1 10 100
0
2
4
6
8
10
12
14
16
18
f, Frequency (KHz)
LOAD CURRENT (A)
Tc = 90°C
Tj = 125°C
Power Factor = 0.8
Modulation Depth = 1.15
Vcc = 50% of Rat ed Voltage
0.00
0.59
1.17
1.76
Total Output Power (kW)
3.51
5.27
2.34
2.93
4.10
4.68
1
10
100
1 10
V , Collector-to-Emitter Voltage (V)
I , Collector-to-Emitter Current (A)
CE
C
V = 15V
20µs PULSE WIDTH
GE
T = 25 C
J
°
T = 150 C
J
°
1
10
100
5678910
V , Gate-to-Emitter Voltage (V)
I , Collector-to-Emitter Current (A)
GE
C
V = 50 V
5µs PULSE WIDTH
CC
T = 25 C
J
°
T = 150 C
J
°
051015202530
0
20
40
60
80
100
120
140
160
DC
Square wave (D=0.50)
80% rated Vr applied
see note (2)
TC, Case Temperature (°C)
Maximum DC Collector Current (A)
Fig. 1 - Typical Load Current vs. Frequency
(Load Current = I
of Fundamental)
RMS
CPV364M4KPbF
Vishay Semiconductors
Fig. 2 - Typical Output Characteristics
Revision: 11-Jun-13
Fig. 3 - Typical Output Characteristics
For technical questions within your region: DiodesAmericas@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
4
Fig. 4 - Maximum Collector Current vs.
Case Temperature
4.0
V = 15 V
GE
80 us PULSE WIDTH
3.0
2.0
CE
V , Collector-to-Emitter Voltage(V)
1.0
-60 -40 -20 0 20 40 60 80 100 120 140 160
T , Junction Temperature ( C)
Fig. 5 - Typical Collector to Emitter Voltage vs.
J
I = A26
C
I = A13
C
I = A6.5
C
°
Junction Temperature
, DiodesAsia@vishay.com, DiodesEurope@vishay.com
Document Number: 94488
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