Ultra Fast Avalanche Sinterglass Diode
Features
• Controlled avalanche characteristic
• Low forward voltage
• Ultra fast recovery time
• Glass passivated junction
• Hermetically sealed package
• Lead (Pb)-free component
• Component in accordance to RoHS 2002/95/EC
and WEEE 2002/96/EC
Applications
Very fast rectification e.g. for switch mode power supply
e2
Mechanical Data
Case: SOD-64 Sintered glass case
Terminals: Plated axial leads, solderable per
MIL-STD-750, Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: approx. 858 mg
BYV28/...
Vishay Semiconductors
949588
Parts Table
Part Type differentiation Package
BYV28-50 V
BYV28-100 V
BYV28-150 V
BYV28-200 V
= 50 V; I
R
= 100 V; I
R
= 150 V; I
R
= 200 V; I
R
= 3.5 A SOD-64
FAV
= 3.5 A SOD-64
FAV
= 3.5 A SOD-64
FAV
= 3.5 A SOD-64
FAV
Absolute Maximum Ratings
T
= 25 °C, unless otherwise specified
amb
Parameter Test condition Part Symbol Val ue Unit
Peak reverse voltage, non
repetitive
Reverse voltage = Repetitive
peak reverse voltage
Peak forward surge current t
Repetitive peak forward current I
Average forward current I
Pulse energy in avalanche
mode, non repetitive (inductive
load switch off)
Junction and storage
temperature range
see electrical characteristics BYV28/50 V
BYV28/100 V
BYV28/150 V
BYV28/200 V
see electrical characteristics BYV28/50 V
BYV28/100 V
BYV28/150 V
BYV28/200 V
= 10 ms, half sinewave I
p
I
= 1 A, Tj = 175 °C E
(BR)R
R
R
R
R
T
RSM
RSM
RSM
RSM
= V
= V
= V
= V
FSM
FRM
FAV
= T
j
R
RRM
RRM
RRM
RRM
stg
55 V
110 V
165 V
220 V
50 V
100 V
150 V
200 V
90 A
25 A
3.5 A
20 mJ
- 55 to + 175 °C
Document Number 86044
Rev. 1.6, 14-Apr-05
www.vishay.com
1
BYV28/...
Vishay Semiconductors
Maximum Thermal Resistance
T
= 25 °C, unless otherwise specified
amb
Parameter Test condition Symbol Val ue Unit
Junction ambient l = 10 mm, T
on PC board with spacing
25 mm
= constant R
L
thJA
R
thJA
Electrical Characteristics
T
= 25 °C, unless otherwise specified
amb
Parameter Test condition Symbol Min Ty p. Max Unit
Forward voltage I
Reverse current V
Reverse recovery time I
= 5 A V
F
I
= 5 A, Tj = 175 °C V
F
= V
R
RRM
V
RSM
V
= V
R
= 0.5 A, IR = 1 A, iR = 0.25 A t
F
, Tj = 165 °C I
RRM
F
F
I
R
I
R
R
rr
Typical Characteristics (Tamb = 25 °C unless otherwise specified)
25 K/W
70 K/W
1.1 V
0.89 V
1 µA
100 µA
150 µA
30 ns
40
30
20
ll
10
TL= constant
0
thJA
R –Therm.Resist. Junction/ Ambient ( K/W)
94 9548
0 5 10 15 25
20
l – Lead Length ( mm )
30
Figure 1. Max. Thermal Resistance vs. Lead Length
100.000
10.000
Tj=175°C
F
I – Forward Current (A)
1.000
0.100
0.010
Tj=25°C
4.0
3.5
3.0
2.5
2.0
1.5
R
70 K/W
≤
thJA
1.0
PCB:d=25mm
0.5
FAV
I –Average Forward Current( A )
0.0
0 20 40 60 80 100 120 140 160 180
T
16454
– Ambient Temperature( °C )
amb
VR=V
RRM
half sinewave
≤
R
25 K/W
thJA
l=10mm
Figure 3. Max. Average Forward Current vs. Ambient Temperature
1000
VR=V
RRM
100
10
R
I – Reverse Current (A)
0.001
0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2
16453
Figure 2. Forward Current vs. Forward Voltage
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2
VF– Forward Voltage(V)
1
25 50 75 100 125 150 175
16455
Tj– Junction Temperature ( ° C )
Figure 4. Reverse Current vs. Junction Temperature
Document Number 86044
Rev. 1.6, 14-Apr-05