Page 1
®
BYV26DGP and BYV26EGP
Vishay Semiconductors
formerly General Semiconductor
Document Number 88554 www.vishay.com
07-Mar-02 1
New Product
Glass Passivated Ultrafast Rectifier
Reverse V oltage 800 to 1000V
Forward Current 1.0A
Maximum Ratings & Thermal Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Parameter Symbol BYV26DGP BYV26EGP Unit
Maximum repetitive peak reverse voltage V
RRM
800 1000 V
Maximum RMS voltage V
RMS
560 700 V
Maximum DC blocking voltage V
DC
800 1000 V
Maximum average forward rectified current
0.375" (9.5mm) lead length (See Fig. 1)
I
F(AV)
1.0 A
Peak forward surge current 10ms single half
sine-wave superimposed on rated load
I
FSM
30 A
Non repetitive peak reverse energy (Note 1) E
RSM
10 mj
Typical ther mal resistance
(Note 2,3)
R
ΘJA
70
R
ΘJL
16
°C/W
Operating junction and storage temperature range TJ, T
STG
–65 to +175 °C
Electrical Characteristics Ratings at 25°C ambient temperature unless otherwise specified.
Minimum avalanche breakdown voltage at 100µAVBR900 1100 V
Maximum instantaneous T
J
= 25°C V
F
2.5
V
forward voltage at 1.0A TJ = 175°C 1.3
Maximum DC reverse current T
A
= 25°C 5.0
at rated DC blocking voltage TA = 165°C
I
R
150
µA
Max. reverse recovery time at IF=0.5A, IR =1.0A, Irr=0.25A t
rr
75 ns
Typical junction capacitance at 4.0V, 1MHz C
J
15 pF
Notes: (1) Peak reverse energy measured at IR = 400mA, TJ = TJmax. on inductive load, t = 20µs
(2) Thermal resistance from junction to ambient at 0.375" (9.5mm) lead length, mounted on P.C.B. with 0.5 x 0.5” (12 x 12mm) copper pads
(3) Thermal resistance from junction to lead at 0.375” (9.5mm) lead length with both leads attached to heatsink
Features
• High temperature metallurgically bonded construction
• Plastic package has Underwriters Laboratory
Flammability Classification 94V-0.
• Cavity-free glass passivated junction
• Ultrafast recovery time for high efficiency
• Low forward voltage, high current capability
• Capable of meeting environmental standards of
MIL-S-19500
• Low leakage current • High surge current capability
• Specified reverse surge capability
• High temperature soldering guaranteed: 350°C/10 seconds,
0.375" (9.5mm) lead length, 5 lbs. (2.3kg) tension
Mechanical Data
Case: JEDEC DO-204AC, molded plastic over glass body
Terminals: Plated axial leads, solderable per
MIL-STD-750, Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight: 0.015 oz., 0.4 g
0.034 (0.86)
0.028 (0.71)
Dia.
0.140 (3.6)
0.104 (2.6)
Dia.
0.230 (5.8)
0.300 (7.6)
1.0 (25.4)
min.
1.0 (25.4)
min.
*Glass-plastic encapsulation technique is covered by
Patent No.3,996,602 and brazed-lead assembly by Patent No.3,930,306.
Patented*
DO-204AC (DO-15)
Dimensions
in inches and
(millimeters)
Page 2
BYV26DGP and BYV26EGP
Vishay Semiconductors
formerly General Semiconductor
www.vishay.com Document Number 88554
2 07-Mar-02
Ratings and
Characteristic Curves(T
A
= 25°C unless otherwise noted)
Temperature (°C)
Fig. 1 – Maximum Forward Current
Derating Curve
Average Forward Rectified Current (A)
Fig. 3 – Typical Instantaneous
Forward Voltage Characteristics
Instantaneous Forward Voltage (V)
Instantaneous Forward Current (A)
Percent of Rated Peak Reverse Voltage (%)
Instantaneous Reverse Leakage
Current (µA)
Fig. 4 – Typical Reverse Leakage
Characteristics
Fig. 6 – Typical Transient
Thermal Impedance
Number of Cycles at 60 H
Z
t, Pulse Duration (sec.)
Fig. 2 – Maximum Non-Repetitive Peak
Forward Surge Current
Peak Forward Surge Current (A)
Reverse Voltage (V)
Junction Capacitance, pF
Transient Thermal Impedance (°C/W)
Fig. 5 – Typical Junction
Capacitance
0
25
50
75
100
125
150
175
0
0.2
0.4
0.6
0.8
1.0
1.2
Mounted on P.C.B.
0.375" (9.5mm) Lead Length
on 0.5 x 0.5" (12 x 12mm)
Copper Pads
Resistive or
Inductive Load
TA = Ambient Temperature
TL = Lead
T emperature
Lead Mounted
on Heatsinks
1
10
100
1
10
100
10ms, Single Half Sine-Wave
TJ = TJ max.
0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
0.01
0.1
1
10
20
T
J
= 25°C
Pulse Width = 300µs
1% Duty Cycle
0
20
40
60
80
100
0.01
0.1
1
10
100
1,000
0.1
1
10
100
1
10
100
TJ = 25°C
f = 1.0MH
Z
Vsig = 50mVp-p
0.01
0.1
1
10
100
1
10
100
Mounted on P.C.B.
0.375" (9.5mm) Lead Length
on 0.47 x 0.47" (12 x 12mm)
Copper Pads
TJ = 165°C
TJ = 25°C
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