VISHAY BCR Technical data
BCR
Vishay Electro-Films
Thin Film, Back-Contact Resistor
CHIP
RESISTORS
Product may not
be to scale
The Back Contact Resistor (BCR) series single-value
back-contact resistor chip is one of the smallest chips available.
The BCR requires only one wire bond thus saving hybrid space.
The BCRs are manufactured using Vishay Electro-Films
(EFI) sophisticated thin film equipment and manufacturing
technology. The BCRs are 100 % electrically tested and
visually inspected to MIL-STD-883.
• Wire bondable
• Only one wire bond required
• Small size: 0.020 inches square.
• Resistance range: 10 Ω to 1 MΩ
• Oxidized silicon substrate for good power dissipation
• Resistor material: Tantalum nitride, self-passivating
• Moisture resistant
APPLICATIONS
FEATURES
Vishay EFI BCR resistor chips are widely used in hybrid packages where space is limited. The bottom connection is made by
attaching the back of the chip to the substrate either eutectically or with conductive epoxy. The single wire bond is made to the
notched pad on the top of the chip. (The other rectangular pad on the top of the chip is a via hole, a low-ohmic contact connecting
the resistor to the bottom of the chip.)
TEMPERATURE COEFFICIENT OF RESISTANCE, VALUES AND TOLERANCES
Tightest Standard Tolerance Available
0.5 %1 %2 %5 %
0.2 %
± 100 ppm/°C
± 250 ppm/°C
20 Ω 50 Ω 200 Ω 1 kΩ
100 Ω10 Ω
± 25 ppm/°C
± 50 ppm/°C
0.1 %
200 kΩ
360 kΩ
620 kΩ
1 MΩ
CLASS H* CLASS K*
010 056
002 061
027 059
008 052
*MIL-PRF-38534 inspection criteria
PROCESS CODE
STANDARD ELECTRICAL SPECIFICATIONS
PARAMETER
Noise, MIL-STD-202, Method 308
100 Ω - 250 kΩ
< 100 Ω or > 251 kΩ
Moisture resistance, MIL-STD-202
Method 106
Stability, 1000 h, + 125 °C, 125 mW ± 1.0 % max. ΔR/R
Operating Temperature Range - 55 °C to + 125 °C
Thermal Shock, MIL-STD-202,
Method 107, Test Condition F
High Temperature Exposure, + 150 °C, 100 h ± 0.5 % max. ΔR/R
Dielectric Voltage Breakdown 200 V
Insulation Resistance 10
Operating Voltage 75 V max.
DC Power Rating at + 70 °C (Derated to Zero at + 175 °C) 250 mW
5 x Rated Power Short-Time Overload, + 25 °C, 5 s ± 0.25 % max. ΔR/R
www.vishay.com For technical questions, contact: efi@vishay.com
54 Revision: 12-Mar-08
- 35 dB typ.
- 20 dB typ.
± 0.5 % max. ΔR/R
± 0.25 % max. ΔR/R
12
min.
Document Number: 61023
BCR
Thin Film, Back-Contact Resistor
Vishay Electro-Films
DIMENSIONS in inches
0.020
0.004
TYPICAL RANGE
10 Ω - 23 Ω
Note:
• Notched shaded area represents top bonding pad. The backside of the chip constitutes the second resistor connection.
TYPICAL RANGE
24 Ω - 220 Ω
TYPICAL RANGE
1
80 Ω - 2.2 kΩ
TYPICAL RANGE
1.6 kΩ - 1 MΩ
SCHEMATIC
Bond Pad
Back of Chip
RESISTORS
CHIP
0.020
0.016
MECHANICAL SPECIFICATIONS in inches
PARAMETER
Chip Size 0.020 x 0.020 ± 0.002 (0.50 x 0.50 ± 0.05 mm)
Chip Thickness 0.010 ± 0.003 (0.253 ± 0.05 mm)
Chip Substrate Material Oxidized silicon, 10 kÅ minimum SiO
Resistor Material Tantalum nitride, self-passivating
Bonding Pad Size 0.004 x 0.004 (0.100 x 0.100 mm)
Number of Pads 1
Pad Material 10 kÅ minimum aluminum
Backing 3 kÅ minimum gold
Recommended Attachment Method Eutectic or conductive epoxy
Options: Gold bonding pads, 15 kÅ minimum thickness
Consult Applications Engineer
2
ORDERING INFORMATION
Example: 100 % visual, 16 kΩ, ± 1 %, ± 250 ppm/°C TCR, aluminum pads, class H visual inspection
W
INSPECTION/
PA CK A GI N G
W = 100 % visually inspected
parts in matrix tray per
MIL-STD-883
X = Sample, visually inspected
parts loaded in matrix trays
(4 % AQL)
Document Number: 61023 For technical questions, contact: efi@vishay.com
Revision: 12-Mar-08 55
BCR
PRODUCT
FAM ILY
008
PROCESS
CODE
See Process Code
table
significant digits of the
1600
RESISTANCE
VAL UE
Use first 4 digits
resistance
1
MULTIPLIER
CODE
B = 0.01
A = 0.1
0 = 1
1 = 10
2 = 100
3 = 1000
F
TOLERANCE
CODE
B = 0.1 %
C = 0.2 %
D = 0.5 %
F = 1.0 %
G = 2.0 %
H = 2.5 %
J = 5.0 %
K = 10 %
www.vishay.com
Loading...