The 8EWF..SPbF fast soft recovery rectifier
series has been optimized for combined short
reverse recovery time, low forward voltage drop
and low leakage current.
The glass passivation ensures stable reliable operation in
the most severe temperature and power cycling conditions.
This series is designed and qualified for industrial level and
D-PAK
1
--
Anode
3
Anode
lead (Pb)-free.
PRODUCT SUMMARY
VF at 8 A< 1.3 V
t
rr
V
RRM
80 ns
1000/1200 V
APPLICATIONS
• Output rectification and freewheeling diode in inverters,
choppers and converters
• Input rectifications where severe restrictions on conducted
EMI should be met
MAJOR RATINGS AND CHARACTERISTICS
SYMBOLCHARACTERISTICSVALUESUNITS
FEATURES/DESCRIPTION
I
F(AV)
V
RRM
I
FSM
V
F
t
rr
T
J
Sinusoidal waveform8A
1000/1200V
170A
8 A, TJ = 25 °C1.3V
1 A, 100 A/µs80ns
Range- 40 to 150°C
Available
RoHS*
COMPLIANT
VOLTAGE RATINGS
, MAXIMUM PEAK
V
RRM
PART NUMBER
8EWF10SPbF10001100
8EWF12SPbF12001300
REVERSE VOLTAGE
V
V
, MAXIMUM NON-REPETITIVE
RSM
PEAK REVERSE VOLTAGE
V
I
RRM
AT 150 °C
mA
4
ABSOLUTE MAXIMUM RATINGS
PARAMETERSYMBOLTEST CONDITIONSVALUESUNITS
Maximum average forward currentI
Maximum peak one cycle
non-repetitive surge current
2
Maximum I
Maximum I
* Pb containing terminations are not RoHS compliant, exemptions may apply
√t for fusing I2√tt = 0.1 to 10 ms, no voltage reapplied2000 A2√s
F(AV)
I
FSM
TC = 94 °C, 180° conduction half sine wave8
10 ms sine pulse, rated V
10 ms sine pulse, no voltage reapplied200
10 ms sine pulse, rated V
10 ms sine pulse, no voltage reapplied200
applied170
RRM
applied144
RRM
A
2
A
s
www.vishay.com
8EWF..SPbF Soft Recovery Series
Vishay High Power Products
Surface Mountable
Fast Soft Recovery Diode, 8 A
ELECTRICAL SPECIFICATIONS
PARAMETER SYMBOLTEST CONDITIONS VALUESUNITS
Maximum forward voltage dropV
FM
Forward slope resistancer
Threshold voltageV
Maximum reverse leakage currentI
F(TO)
RM
RECOVERY CHARACTERISTICS
PARAMETERSYMBOLTEST CONDITIONS VALUESUNITS
Reverse recovery timet
Reverse recovery currentI
rr
rr
Reverse recovery chargeQ
Snap factorS0.6
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETERSYMBOLTEST CONDITIONSVALUESUNITS
Maximum junction and
storage temperature range
Maximum thermal resistance,
junction to case
Typical thermal resistance,
junction to ambient (PCB mount)
Soldering temperatureT
Approximate weight
Marking deviceCase style D-PAK (TO-252AA)8EWF12S
Note
(1)
When mounted on 1" square (650 mm2) PCB of FR-4 or G-10 material 4 oz. (140 µm) copper 40 °C/W
For recommended footprint and soldering techniques refer to application note #AN-994
All product specifications and data are subject to change without notice.
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(collectively, “Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained herein
or in any other disclosure relating to any product.
Vishay disclaims any and all liability arising out of the use or application of any product described herein or of any
information provided herein to the maximum extent permitted by law. The product specifications do not expand or
otherwise modify Vishay’s terms and conditions of purchase, including but not limited to the warranty expressed
therein, which apply to these products.
No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this
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