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“Half Bridge” IGBT MTP (Warp 2 Speed IGBT), 70 A
PRODUCT SUMMARY
V
CES
typical at VGE = 15 V 2.1 V
V
CE(on)
at TC = 78 °C 70 A
I
C
600 V
70MT060WHTAPbF
Vishay Semiconductors
FEATURES
• NPT warp 2 speed IGBT technology with
positive temperature coefficient
•HEXFRED
reverse recovery
• SMD thermistor (NTC)
•Al
2O3
• Very low stay inductance design for high speed operation
• UL pending
• Speed 60 kHz to 150 kHz
• UL approved file E78996
• Compliant to RoHS directive 2002/95/EC
• Designed and qualified for industrial level
BENEFITS
• Optimized for welding, UPS and SMPS applications
• Lower coduction losses and switching losses
• Low EMI, requires less snubbing
• Direct mounting to heatsink
• PCB solderable terminals
®
antiparallel diodes with ultrasoft
BDC
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS MAX. UNITS
Collector to emitter voltage V
Continuous collector current I
Pulsed collector current I
Peak switching current I
Diode continuous forward current I
Peak diode forward current I
Gate to emitter voltage V
RMS isolation voltage V
Maximum power dissipation, IGBT P
CES
C
CM
LM
F
FM
GE
ISOL
D
TC = 25 °C 100
= 78 °C 70
T
C
TC = 78 °C 53
Any terminal to case, t = 1 min 2500
TC = 25 °C 347
T
= 100 °C 139
C
600 V
300
300
200
± 20
A
V
W
Revision: 05-Jul-11
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Document Number: 94469
70MT060WHTAPbF
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ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Collector to emitter breakdown voltage V
(BR)CESVGE
= 0 V, IC = 500 μA 600 - - V
VGE = 15 V, IC = 70 A - 2.1 2.4
= 15 V, IC = 140 A - 2.8 3.4
Collector to emitter voltage V
Gate threshold voltage V
Collector to emitter leaking current I
Gate to emitter leakage current I
CE(on)
GE(th)IC
CES
GES
V
GE
= 15 V, IC = 70 A, TJ = 150 °C - 2.7 3
V
GE
= 0.5 mA 3 - 6
VGE = 0 V, IC = 600 V - - 0.7
V
= 0 V, IC = 600 V, TJ = 150 °C - - 10
GE
VGE = ± 20 V - - ± 250 nA
SWITCHING CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Total gate charge (turn-on) Q
Gate to collector charge (turn-on) Q
Turn-on switching loss E
Turn-off switching loss E
Total switching loss E
Turn-on switching loss E
Turn-off switching loss E
Total switching loss E
Turn-on delay time td
Rise time t
Turn-off delay time td
Fail time t
Turn-on delay time td
Rise time t
Turn-off delay time td
Fail time t
Input capacitance C
Reverse transfer capacitance C
Reverse BIAS safe operating area RBSOA
ge
gc
on
off
ts
on
off
ts
on
r
off
f
on
r
off
f
ies
oes
res
g
IC = 70 A
= 480 V
V
CC
V
= 15 V
GE
Rg = 10
I
= 70 A, VCC = 480 V, VGE = 15 V, L = 200 μH
C
Energy losses include tail and diode reverse
recovery, T
= 25 °C
J
Rg = 10
= 70 A, V
I
C
= 480 V, VGE = 15 V, L = 200 μH
CC
Energy losses include tail and diode reverse
recovery, T
= 150 °C
J
Rg = 10
I
= 70 A, VCC = 480 V, VGE = 15 V, L = 200 μH
C
Energy losses include tail and diode reverse
recovery
Rg = 10
= 70 A, V
I
C
= 480 V, VGE = 15 V, L = 200 μH
CC
Energy losses include tail and diode reverse
recovery, T
= 150 °C
J
VGE = 0 V
= 30 V
V
CC
f = 1.0 MHz
= 150 °C, IC = 300 A
T
J
V
= 400 V, VP = 600 V
CC
R
= 22 , V GE = + 15 V to 0 V
g
Vishay Semiconductors
V
mA
- 460 690
- 160 250
- 70 130
-1 . 1-
-0 . 9-
-2-
-1 . 2 7-
-1 . 1 3-
-2 . 4-
- 314 -
-4 9-
- 308 -
-6 8-
- 312 -
-5 0-
- 320 -
-7 8-
- 8000 -
- 790 -
- 110 -
Fullsquare
nC Gate to emitter charge (turn-on) Q
mJ
ns
pF Output capacitane C
Revision: 05-Jul-11
2
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Document Number: 94469
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
70MT060WHTAPbF
R
0
R
1
------
1
T
0
-----
1
T
1
-----
–
exp =
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THERMISTOR SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Resistance R
Sensitivity index of the
thermistor material
0
(1)(2)
T0 = 25 °C - 30 - k
T0 = 25 °C
T
= 85 °C
1
(1)
Notes
(1)
T0, T1 are thermistor´s temperatures
(2)
, temperature in Kelvin
DIODE SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
IC = 70 A, VGE = 0 V - 1.64 2.1
Diode forward voltage drop V
Diode reverse recovery time t
Diode peak reverse current I
Diode recovery charge Q
Diode reverse recovery time t
Diode peak reverse current I
Diode recovery charge Q
FM
= 140 A, V
C
= 70 A, VGE = 0 V, TJ = 150 °C - 1.69 1.9
I
C
rr
rr
rr
rr
rr
rr
VCC = 200 V, IC = 70 A
dI/dt = 200 A/μs
VCC = 200 V, IC = 70 A
dI/dt = 200 A/μs
= 125 °C
T
J
= 0 V - 2.1 2.4
GE
Vishay Semiconductors
- 4000 - K
- 96 126 ns
- 9.4 12.8 A
- 440 750 nC
- 140 194 ns
-1 41 9A
- 950 1700 nC
V I
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Operating junction
temperature range
Storage temperature range T
Junction to case
Case to sink per module R
IGBT, Diode
IGBT
R
T
J
Stg
thJC
thCS
Heatsink compound thermal conductivity = 1 W/mK - 0.06 -
A mounting compound is recommended and the
Mounting torque to heatsink
torque should be checked after 3 hours to allow for
the spread of the compound. Lubricated threads.
Weight 66 g
- 40 - 150
°C Thermistor - 40 - 125
- 40 - 125
- - 0.36
°C/W Diode --0 . 8
3 ± 10 % Nm
Revision: 05-Jul-11
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
3
Document Number: 94469
1000
V
G E
- G ate to Emitter Voltag e (V)
OG - Total G ate Charg e (nC)
200 400 600 800 1000 0
VCC = 480 V
0
6
8
2
4
16
10
12
14
94469_04
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VGE = 15 V
70MT060WHTAPbF
Vishay Semiconductors
100
- Collector to Emitter Current (A)
C
I
94469_01
TJ = 25 °C
10
1
0.0
1.0 2.0 3.0 4.0
TJ = 150 °C
VCE - Collector to Emitter Voltag e (V)
Fig. 1 - Typical Output Characteristics
160
140
120
100
80
60
40
20
Allowab le Case Temperature (°C)
0
94469_02
20 40 60 80 100
0
Maximum DC Collector Current (A)
DC
Fig. 2 - Maximum Collector Current vs. Case Temperature
5.0
120
Fig. 4 - Typical Gate Charge vs. Gate to Emitter Votlage
1000
100
TJ = 150 °C
10
TJ = 25 °C
1
- Instantaneous Forward Current (A)
F
I
94469_05
0
0.5 1.0 1.5 2.0 2.5 3.0
V
- Forward Voltage Drop (V)
FM
Fig. 5 - Maximum Forward Voltage Drop vs.
Instantaneous Forward Current
3.5
- Collector to Emitter Voltag e (V)
CE
V
94469_03
Revision: 05-Jul-11
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
20 40 60 80 120 100 140
IC = 140 A
IC = 70 A
IC = 30 A
TJ - Junction Temperature (°C)
Fig. 3 - Typical Collector to Emitter Voltage vs.
160
10
150 °C
1.0
0.1
0.01
0.001
- Collector to Emitter Current (mA)
0.0001
CES
I
94469_06
200
300 400 500
V
- Collector to Emitter Voltag e (V)
CES
25 °C
Fig. 6 - Typical Zero Gate Voltage Collector Current
Junction Temperature
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4
Document Number: 94469
600
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V
G Eth
(V)
IC (mA)
1.0
0.1
2.5
3.0
4.5
3.5
4.0
94469_07
25 °C
125 °C
Energ y (μJ)
IC - Collector to Emitter Current (A)
20 40 60
80
0
E
on
E
off
0
400
200
800
600
1400
1200
1000
94469_08
S witching Time (ns)
IC - Collector to Emitter Current (A)
20 40 60
80
0
t
d(off)
t
d(on)
t
r
t
f
10
1000
100
94469_09
I
C
- Collector to Emitter Current (mA)
IC - Collector to Emitter Voltag e (V)
100 200 300 400 500 600
700
0
0
150
100
50
350
250
200
300
94469_10
5
10
15
20
25
30
35
40
100 1000
I
RRM
(A)
d IF/ d t (A/μs)
VR = 200 V
IF = 70 A, 125 °C
IF = 70 A, 25 °C
94469_12
70MT060WHTAPbF
Vishay Semiconductors
Fig. 7 - Typical Gate Threshold Voltage
Fig. 8 - Typical Energy Losses vs. I
( TJ = 150 °C)
C
Fig. 10 - Reverse BIAS SOA, TJ = 150 °C
160
(ns)
rr
t
94469_11
140
120
100
80
60
100 1000
IF = 70 A, 125 °C
IF = 70 A, 25 °C
dIF/dt (A/µs)
Fig. 11 - Typical Reverse Recovery Time vs. dI
VR = 200 V
/dt
F
Revision: 05-Jul-11
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
Fig. 9 - Switching Time vs. I
C
Fig. 12 - Typical Reverse Recovery Current vs. dI
5
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/dt
F
Document Number: 94469
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200
400
600
800
1000
1200
1400
1600
1800
2000
100 1000
Q
rr
(nC)
d IF/ d t (A/μs)
IF = 70 A, 25 °C
IF = 70 A, 125 °C
VR = 200 V
94469_13
0.001
0.01
0.1
1
S ingle puls e
(thermal res is tance)
0.00001
0.0001 0.001
0.01 0.1 1.0
10
Z
thJC
- Thermal Imped ance (°C/W)
t1 - Rectang ular Pulse Duration (s)
D = 0.75
D = 0.50
D = 0.33
D = 0.25
D = 0.20
94469_14
0.001
0.01
0.1
1.0
S ingle puls e
(thermal res is tance)
0.00001 0.0001 0.001 0.01 0.1 1.0
Z
thJC
- Thermal Imped ance (°C/W)
t1 - Rectang ular Pulse Duration (s)
94469_15
D = 0.75
D = 0.50
D = 0.50
D = 0.33
D = 0.25
D = 0.20
70MT060WHTAPbF
Vishay Semiconductors
Fig. 13 - Typical Stored Charge vs. dIF/dt
Fig. 14 - Maximum Thermal Impedance Z
Revision: 05-Jul-11
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Fig. 15 - Maximum Thermal Impedance Z
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6
thJC
thJC
Characteristics (IGBT)
Characteristics (Diode)
Document Number: 94469
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3, 4
11
12
5, 6
9
10
7, 8
Thermis tor
option
T
2
R
1
1 - Current rating (70 = 70 A)
2 - Essential part number
3 - Voltage rating (060 = 600 V)
4 - Speed/type (W = Warp IGBT)
5 - Circuit configuration (H = Half bridge)
6
- T = Thermistor
7
- A = Al2O3 DBC substrate
8
- Lead (Pb)-free
Device code
5 13 24678
70 MT 060 W H T A PbF
Fig. 16 - Electrical Diagram Fig. 17 - Functional Diagram
ORDERING INFORMATION TABLE
70MT060WHTAPbF
Vishay Semiconductors
3, 4
10
11
12
9
10
Ω
10 Ω
5, 6
10 Ω
10 Ω
7, 8
CIRCUIT CONFIGURATION
Dimensions www.vishay.com/doc?95175
Revision: 05-Jul-11
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ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
LINKS TO RELATED DOCUMENTS
7
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Document Number: 94469
DIMENSIONS in millimeters
Ø 1.1 Ø 5
3.5
33
31.8
12 ± 0.5
4
20.5
2.5
87654 3
2
1
13
9
10 11
12
1.8
8.1
45°
5.4 ± 0.1
5.7 ± 0.1
1.2 ± 0.1
7.2 ± 0.1
7.8 ± 0.1
3 ± 0.1
27.5
11.35
± 0.1
11.35
± 0.1
R2.6 (x 3)
R5.8 (x 2)
8.7 ± 0.1
6 ± 0.1
3 ± 0.1
8.5 ± 0.1
39.5 ± 0.1
44.5
48.7
63.5 ± 0.25
1.3
Outline Dimensions
Vishay Semiconductors
MTP
Note
• Unused terminals are not assembled in the package
Document Number: 95175 For technical questions, contact: indmodules@vishay.com
Revision: 18-Mar-08 1
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Disclaimer
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