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“Half Bridge” IGBT MTP (Warp 2 Speed IGBT), 70 A
PRODUCT SUMMARY
V
CES
typical at VGE = 15 V 2.1 V
V
CE(on)
at TC = 78 °C 70 A
I
C
600 V
70MT060WHTAPbF
Vishay Semiconductors
FEATURES
• NPT warp 2 speed IGBT technology with
positive temperature coefficient
•HEXFRED
reverse recovery
• SMD thermistor (NTC)
•Al
2O3
• Very low stay inductance design for high speed operation
• UL pending
• Speed 60 kHz to 150 kHz
• UL approved file E78996
• Compliant to RoHS directive 2002/95/EC
• Designed and qualified for industrial level
BENEFITS
• Optimized for welding, UPS and SMPS applications
• Lower coduction losses and switching losses
• Low EMI, requires less snubbing
• Direct mounting to heatsink
• PCB solderable terminals
®
antiparallel diodes with ultrasoft
BDC
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS MAX. UNITS
Collector to emitter voltage V
Continuous collector current I
Pulsed collector current I
Peak switching current I
Diode continuous forward current I
Peak diode forward current I
Gate to emitter voltage V
RMS isolation voltage V
Maximum power dissipation, IGBT P
CES
C
CM
LM
F
FM
GE
ISOL
D
TC = 25 °C 100
= 78 °C 70
T
C
TC = 78 °C 53
Any terminal to case, t = 1 min 2500
TC = 25 °C 347
T
= 100 °C 139
C
600 V
300
300
200
± 20
A
V
W
Revision: 05-Jul-11
For technical questions, contact: indmodules@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
1
Document Number: 94469
70MT060WHTAPbF
www.vishay.com
ELECTRICAL SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Collector to emitter breakdown voltage V
(BR)CESVGE
= 0 V, IC = 500 μA 600 - - V
VGE = 15 V, IC = 70 A - 2.1 2.4
= 15 V, IC = 140 A - 2.8 3.4
Collector to emitter voltage V
Gate threshold voltage V
Collector to emitter leaking current I
Gate to emitter leakage current I
CE(on)
GE(th)IC
CES
GES
V
GE
= 15 V, IC = 70 A, TJ = 150 °C - 2.7 3
V
GE
= 0.5 mA 3 - 6
VGE = 0 V, IC = 600 V - - 0.7
V
= 0 V, IC = 600 V, TJ = 150 °C - - 10
GE
VGE = ± 20 V - - ± 250 nA
SWITCHING CHARACTERISTICS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Total gate charge (turn-on) Q
Gate to collector charge (turn-on) Q
Turn-on switching loss E
Turn-off switching loss E
Total switching loss E
Turn-on switching loss E
Turn-off switching loss E
Total switching loss E
Turn-on delay time td
Rise time t
Turn-off delay time td
Fail time t
Turn-on delay time td
Rise time t
Turn-off delay time td
Fail time t
Input capacitance C
Reverse transfer capacitance C
Reverse BIAS safe operating area RBSOA
ge
gc
on
off
ts
on
off
ts
on
r
off
f
on
r
off
f
ies
oes
res
g
IC = 70 A
= 480 V
V
CC
V
= 15 V
GE
Rg = 10
I
= 70 A, VCC = 480 V, VGE = 15 V, L = 200 μH
C
Energy losses include tail and diode reverse
recovery, T
= 25 °C
J
Rg = 10
= 70 A, V
I
C
= 480 V, VGE = 15 V, L = 200 μH
CC
Energy losses include tail and diode reverse
recovery, T
= 150 °C
J
Rg = 10
I
= 70 A, VCC = 480 V, VGE = 15 V, L = 200 μH
C
Energy losses include tail and diode reverse
recovery
Rg = 10
= 70 A, V
I
C
= 480 V, VGE = 15 V, L = 200 μH
CC
Energy losses include tail and diode reverse
recovery, T
= 150 °C
J
VGE = 0 V
= 30 V
V
CC
f = 1.0 MHz
= 150 °C, IC = 300 A
T
J
V
= 400 V, VP = 600 V
CC
R
= 22 , VGE = + 15 V to 0 V
g
Vishay Semiconductors
V
mA
- 460 690
- 160 250
- 70 130
-1.1-
-0.9-
-2-
-1.27-
-1.13-
-2.4-
- 314 -
-49-
- 308 -
-68-
- 312 -
-50-
- 320 -
-78-
- 8000 -
- 790 -
- 110 -
Fullsquare
nCGate to emitter charge (turn-on) Q
mJ
ns
pFOutput capacitane C
Revision: 05-Jul-11
2
For technical questions, contact: indmodules@vishay.com
Document Number: 94469
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
70MT060WHTAPbF
R
0
R
1
------
1
T
0
-----
1
T
1
-----
–
exp=
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THERMISTOR SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Resistance R
Sensitivity index of the
thermistor material
0
(1)(2)
T0 = 25 °C - 30 - k
T0 = 25 °C
T
= 85 °C
1
(1)
Notes
(1)
T0, T1 are thermistor´s temperatures
(2)
, temperature in Kelvin
DIODE SPECIFICATIONS (TJ = 25 °C unless otherwise specified)
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
IC = 70 A, VGE = 0 V - 1.64 2.1
Diode forward voltage drop V
Diode reverse recovery time t
Diode peak reverse current I
Diode recovery charge Q
Diode reverse recovery time t
Diode peak reverse current I
Diode recovery charge Q
FM
= 140 A, V
C
= 70 A, VGE = 0 V, TJ = 150 °C - 1.69 1.9
I
C
rr
rr
rr
rr
rr
rr
VCC = 200 V, IC = 70 A
dI/dt = 200 A/μs
VCC = 200 V, IC = 70 A
dI/dt = 200 A/μs
= 125 °C
T
J
= 0 V - 2.1 2.4
GE
Vishay Semiconductors
- 4000 - K
- 96 126 ns
- 9.4 12.8 A
- 440 750 nC
- 140 194 ns
-1419A
- 950 1700 nC
VI
THERMAL AND MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS MIN. TYP. MAX. UNITS
Operating junction
temperature range
Storage temperature range T
Junction to case
Case to sink per module R
IGBT, Diode
IGBT
R
T
J
Stg
thJC
thCS
Heatsink compound thermal conductivity = 1 W/mK - 0.06 -
A mounting compound is recommended and the
Mounting torque to heatsink
torque should be checked after 3 hours to allow for
the spread of the compound. Lubricated threads.
Weight 66 g
- 40 - 150
°CThermistor - 40 - 125
- 40 - 125
- - 0.36
°C/WDiode --0.8
3 ± 10 % Nm
Revision: 05-Jul-11
For technical questions, contact: indmodules@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
3
Document Number: 94469