• High purity, high temperature epoxy
encapsulation for enhanced mechanical
strength and moisture resistance
• Guard ring for enhanced ruggedness and long term
reliability
• Lead (Pb)-free (“PbF” suffix)
• Designed and qualified for industrial level
DESCRIPTION
The 6TQ...PbF Schottky rectifier series has been optimized
for low reverse leakage at high temperature. The proprietary
barrier technology allows for reliable operation up to 175 °C
junction temperature. Typical applications are in switching
power supplies, converters, freewheeling diodes, and
reverse battery protection.
6TQ...PbF Series
Vishay High Power Products
Pb-free
Available
RoHS*
COMPLIANT
MAJOR RATINGS AND CHARACTERISTICS
SYMBOLCHARACTERISTICS VALUESUNITS
I
F(AV)
V
RRM
I
FSM
V
F
T
J
Rectangular waveform6A
Range35 to 45V
tp = 5 µs sine690A
6 Apk, TJ = 125 °C0.53V
Range- 55 to 175°C
VOLTAGE RATINGS
PARAMETER SYMBOL6TQ035PbF6TQ040PbF6TQ045PbFUNITS
Maximum DC reverse voltageV
Maximum working peak reverse voltageV
R
RWM
354045V
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOLTEST CONDITIONSVALUESUNITS
Maximum average forward current
See fig. 5
Maximum peak one cycle
non-repetitive surge current
See fig. 7
Non-repetitive avalanche energyE
Repetitive avalanche currentI
I
F(AV)
I
FSM
AR
50 % duty cycle at TC = 164 °C, rectangular waveform6A
5 µs sine or 3 µs rect. pulse
10 ms sine or 6 ms rect. pulse140
TJ = 25 °C, IAS = 1.20 A, L = 11.10 mH8mJ
AS
Current decaying linearly to zero in 1 µs
Frequency limited by T
maximum VA = 1.5 x VR typical
J
Following any rated load
condition and with rated
V
applied
RRM
690
A
1.20A
* Pb containing terminations are not RoHS compliant, exemptions may apply
Dimensioning and tolerancing as per ASME Y14.5M-1994
(2)
Lead dimension and finish uncontrolled in L1
(3)
Dimension D, D1 and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured
at the outermost extremes of the plastic body
(4)
Dimension b1, b3 and c1 apply to base metal only
(5)
Controlling dimension: inches
(6)
Thermal pad contour optional within dimensions E, H1, D2 and E1
(7)
Dimension E2 x H1 define a zone where stamping and singulation irregularities are allowed
(8)
Outline conforms to JEDEC TO-220, D2 (minimum) where dimensions are derived from the actual package outline
Document Number: 95221For technical questions within your region, please contact one of the following:www.vishay.com
Revision: 07-Mar-11DiodesAmericas@vishay.com
, DiodesAsia@vishay.com, DiodesEurope@vishay.com1
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