10TTS08SPbF High Voltage Series
Vishay High Power Products
Surface Mountable
Phase Control SCR, 10 A
2
(A)
D2PAK |
1 (K) (G) 3 |
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PRODUCT SUMMARY |
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VT at 6.5 A |
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< 1.15 V |
ITSM |
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140 A |
VRRM |
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800 V |
DESCRIPTION/FEATURES
The 10TTS08SPbF High Voltage Series of silicon controlled rectifiers are specifically designed for
medium power switching and phase control RoHS applications. The glass passivation technology COMPLIANT used has reliable operation up to 125 °C junction temperature.
Typical applications are in input rectification (soft start) and these products are designed to be used with Vishay HPP input diodes, switches and output rectifiers which are available in identical package outlines.
This product has been designed and qualified for industrial level and lead (Pb)-free.
OUTPUT CURRENT IN TYPICAL APPLICATIONS |
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APPLICATIONS |
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SINGLE-PHASE BRIDGE |
THREE-PHASE BRIDGE |
UNITS |
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NEMA FR-4 or G-10 glass fabric-based epoxy |
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2.5 |
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3.5 |
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with 4 oz. (140 µm) copper |
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A |
Aluminum IMS, RthCA = 15 °C/W |
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6.3 |
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9.5 |
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Aluminum IMS with heatsink, RthCA = 5 °C/W |
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14.0 |
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18.5 |
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Note |
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• T |
A |
= 55 °C, T = 125 °C, footprint 300 mm2 |
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J |
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MAJOR RATINGS AND CHARACTERISTICS |
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PARAMETER |
TEST CONDITIONS |
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VALUES |
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UNITS |
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IT(AV) |
Sinusoidal waveform |
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6.5 |
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A |
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IRMS |
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10 |
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VRRM/VDRM |
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800 |
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ITSM |
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140 |
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A |
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VT |
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6.5 A, TJ = 25 °C |
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1.15 |
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V |
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dV/dt |
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150 |
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V/µs |
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dI/dt |
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100 |
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A/µs |
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TJ |
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Range |
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- 40 to 125 |
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°C |
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VOLTAGE RATINGS |
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VRRM, MAXIMUM |
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VDRM, MAXIMUM PEAK |
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IRRM/IDRM |
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PART NUMBER |
PEAK REVERSE VOLTAGE |
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DIRECT VOLTAGE |
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AT 125 °C |
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V |
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V |
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mA |
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10TTS08SPbF |
800 |
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800 |
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1.0 |
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Document Number: 94562 |
For technical questions, contact: diodes-tech@vishay.com |
www.vishay.com |
Revision: 24-Apr-08 |
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1 |
10TTS08SPbF High Voltage Series
Vishay High Power Products |
Surface Mountable |
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Phase Control SCR, 10 A |
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ABSOLUTE MAXIMUM RATINGS |
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PARAMETER |
SYMBOL |
TEST CONDITIONS |
VALUES |
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Maximum average on-state current |
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IT(AV) |
TC = 112 °C, 180° conduction half sine wave |
6.5 |
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Maximum RMS on-state current |
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IT(RMS) |
10 |
A |
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Maximum peak, one-cycle, |
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ITSM |
10 ms sine pulse, rated VRRM applied, TJ = 125 °C |
120 |
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non-repetitive surge current |
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10 ms sine pulse, no voltage reapplied, TJ = 125 °C |
140 |
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Maximum I2t for fusing |
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I2t |
10 ms sine pulse, rated VRRM applied, TJ = 125 °C |
72 |
A2s |
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10 ms sine pulse, no voltage reapplied, TJ = 125 °C |
100 |
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Maximum I2√t for fusing |
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I2√t |
t = 0.1 to 10 ms, no voltage reapplied, TJ = 125 °C |
1000 |
A2√s |
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Maximum on-state voltage drop |
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VTM |
6.5 A, TJ = 25 °C |
1.15 |
V |
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On-state slope resistance |
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rt |
TJ = 125 °C |
17.3 |
mΩ |
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Threshold voltage |
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VT(TO) |
0.85 |
V |
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Maximum reverse and direct leakage current |
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IRM/IDM |
TJ = 25 °C |
VR = Rated VRRM/VDRM |
0.05 |
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TJ = 125 °C |
1.0 |
mA |
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Typical holding current |
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IH |
Anode supply = 6 V, resistive load, initial IT = 1 A |
30 |
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Maximum latching current |
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IL |
Anode supply = 6 V, resistive load |
50 |
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Maximum rate of rise of off-state voltage |
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dV/dt |
TJ = 25 °C |
150 |
V/µs |
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Maximum rate of rise of turned-on current |
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dI/dt |
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100 |
A/µs |
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TRIGGERING |
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PARAMETER |
SYMBOL |
TEST CONDITIONS |
VALUES |
UNITS |
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Maximum peak gate power |
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PGM |
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8.0 |
W |
Maximum average gate power |
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PG(AV) |
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2.0 |
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Maximum peak positive gate current |
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+IGM |
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1.5 |
A |
Maximum peak negative gate voltage |
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-VGM |
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10 |
V |
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Anode supply = 6 V, resistive load, TJ = - 65 °C |
20 |
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Maximum required DC gate current to trigger |
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IGT |
Anode supply = 6 V, resistive load, TJ = 25 °C |
15 |
mA |
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Anode supply = 6 V, resistive load, TJ = 125 °C |
10 |
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Maximum required DC gate |
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Anode supply = 6 V, resistive load, TJ = - 65 °C |
1.2 |
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VGT |
Anode supply = 6 V, resistive load, TJ = 25 °C |
1 |
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voltage to trigger |
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V |
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Anode supply = 6 V, resistive load, TJ = 125 °C |
0.7 |
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Maximum DC gate voltage not to trigger |
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VGD |
TJ = 125 °C, VDRM = Rated value |
0.2 |
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Maximum DC gate current not to trigger |
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IGD |
0.1 |
mA |
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SWITCHING |
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PARAMETER |
SYMBOL |
TEST CONDITIONS |
VALUES |
UNITS |
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Typical turn-on time |
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tgt |
TJ = 25 °C |
0.8 |
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Typical reverse recovery time |
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trr |
TJ = 125 °C |
3 |
µs |
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Typical turn-off time |
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tq |
100 |
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www.vishay.com |
For technical questions, contact: diodes-tech@vishay.com |
Document Number: 94562 |
2 |
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Revision: 24-Apr-08 |
10TTS08SPbF High Voltage Series
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Surface Mountable |
Vishay High Power Products |
|||
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Phase Control SCR, 10 A |
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THERMAL - MECHANICAL SPECIFICATIONS |
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PARAMETER |
SYMBOL |
TEST CONDITIONS |
VALUES |
UNITS |
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Maximum junction and storage |
TJ, TStg |
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- 40 to 125 |
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temperature range |
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°C |
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Soldering temperature |
TS |
For 10 s (1.6 mm from case) |
240 |
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Maximum thermal resistance, |
RthJC |
DC operation |
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1.5 |
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junction to case |
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°C/W |
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Typical thermal resistance, |
RthJA (1) |
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40 |
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junction to ambient (PCB mount) |
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Approximate weight |
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2 |
g |
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0.07 |
oz. |
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Marking device |
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Case style D2PAK (SMD-220) |
10TTS08S |
Note
(1)When mounted on 1" square (650 mm2) PCB of FR-4 or G-10 material 4 oz. (140 µm) copper 40 °C/W For recommended footprint and soldering techniques refer to application note #AN-994
Document Number: 94562 |
For technical questions, contact: diodes-tech@vishay.com |
www.vishay.com |
Revision: 24-Apr-08 |
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