D2PAK
PRODUCT SUMMARY
VT at 6.5 A < 1.15 V
I
TSM
V
RRM
10TTS08SPbF High Voltage Series
Surface Mountable
Phase Control SCR, 10 A
DESCRIPTION/FEATURES
The 10TTS08SPbF High Voltage Series of silicon
controlled rectifiers are specifically designed for
medium power switching and phase control
applications. The glass passivation technology
used has reliable operation up to 125 °C junction
temperature.
Typical applications are in input rectification (soft start) and
these products are designed to be used with Vishay HPP
input diodes, switches and output rectifiers which are
available in identical package outlines.
This product has been designed and qualified for industrial
level and lead (Pb)-free.
(A)
1 (K)
2
(G) 3
140 A
800 V
Vishay High Power Products
RoHS
COMPLIANT
OUTPUT CURRENT IN TYPICAL APPLICATIONS
APPLICATIONS SINGLE-PHASE BRIDGE THREE-PHASE BRIDGE UNITS
NEMA FR-4 or G-10 glass fabric-based epoxy
with 4 oz. (140 µm) copper
Aluminum IMS, R
Aluminum IMS with heatsink, R
Note
•T
= 55 °C, TJ = 125 °C, footprint 300 mm
A
= 15 °C/W 6.3 9.5
thCA
= 5 °C/W 14.0 18.5
thCA
2
2.5 3.5
MAJOR RATINGS AND CHARACTERISTICS
PARAMETER TEST CONDITIONS VALUES UNITS
I
T(AV)
I
RMS
V
RRM/VDRM
I
TSM
V
T
dV/dt 150 V/µs
dI/dt 100 A/µs
T
J
Sinusoidal waveform 6.5
10
800 V
140 A
6.5 A, TJ = 25 °C 1.15 V
Range - 40 to 125 °C
A
A
VOLTAGE RATINGS
, MAXIMUM
V
RRM
PART NUMBER
10TTS08SPbF 800 800 1.0
Document Number: 94562 For technical questions, contact: diodes-tech@vishay.com
Revision: 24-Apr-08 1
PEAK REVERSE VOLTAGE
V
V
, MAXIMUM PEAK
DRM
DIRECT VOLTAGE
V
I
RRM/IDRM
AT 125 °C
mA
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10TTS08SPbF High Voltage Series
Vishay High Power Products
Surface Mountable
Phase Control SCR, 10 A
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum average on-state current I
Maximum RMS on-state current I
Maximum peak, one-cycle,
non-repetitive surge current
2
Maximum I
Maximum I
t for fusing I2t
2
√t for fusing I2√t t = 0.1 to 10 ms, no voltage reapplied, TJ = 125 °C 1000 A2√s
Maximum on-state voltage drop V
On-state slope resistance r
Threshold voltage V
Maximum reverse and direct leakage current I
Typical holding current I
Maximum latching current I
Maximum rate of rise of off-state voltage dV/dt T
T(AV)
T(RMS)
I
TSM
TM
t
T(TO)
RM/IDM
H
L
TC = 112 °C, 180° conduction half sine wave
10
10 ms sine pulse, rated V
10 ms sine pulse, no voltage reapplied, T
10 ms sine pulse, rated V
10 ms sine pulse, no voltage reapplied, T
applied, TJ = 125 °C 120
RRM
= 125 °C 140
J
applied, TJ = 125 °C 72
RRM
= 125 °C 100
J
6.5 A, TJ = 25 °C 1.15 V
TJ = 125 °C
TJ = 25 °C
= 125 °C 1.0
T
J
V
= Rated V
R
RRM/VDRM
Anode supply = 6 V, resistive load, initial IT = 1 A 30
Anode supply = 6 V, resistive load 50
= 25 °C 150 V/µs
J
Maximum rate of rise of turned-on current dI/dt 100 A/µs
6.5
17.3 mΩ
0.85 V
0.05
A
A
mA
2
s
TRIGGERING
PARAMETER SYMBOL
P
+I
-V
P
GM
G(AV)
GM
GT
V
GT
V
GD
I
GD
GM
Maximum peak gate power
Maximum average gate power
Maximum peak positive gate current
Maximum peak negative gate voltage
Maximum required DC gate current to trigger I
Maximum required DC gate
voltage to trigger
Maximum DC gate voltage not to trigger
Maximum DC gate current not to trigger
Anode supply = 6 V, resistive load, TJ = - 65 °C
Anode supply = 6 V, resistive load, T
Anode supply = 6 V, resistive load, TJ = - 65 °C 1.2
Anode supply = 6 V, resistive load, T
Anode supply = 6 V, resistive load, T
TJ = 125 °C, V
TEST CONDITIONS
= Rated value
DRM
VALUES UNITS
= 25 °C 15
J
= 125 °C 10
J
= 25 °C 1
J
= 125 °C 0.7
J
8.0
2.0
W
1.5 A
10 V
20
mAAnode supply = 6 V, resistive load, T
V
0.2
0.1 mA
SWITCHING
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Typical turn-on time t
Typical turn-off time t
gt
rr
q
TJ = 25 °C 0.8
TJ = 125 °C
3
100
µsTypical reverse recovery time t
www.vishay.com For technical questions, contact: diodes-tech@vishay.com
Document Number: 94562
2 Revision: 24-Apr-08
10TTS08SPbF High Voltage Series
Surface Mountable
Vishay High Power Products
Phase Control SCR, 10 A
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum junction and storage
temperature range
Soldering temperature T
Maximum thermal resistance,
junction to case
Typical thermal resistance,
junction to ambient (PCB mount)
Approximate weight
Marking device Case style D
Note
(1)
When mounted on 1" square (650 mm2) PCB of FR-4 or G-10 material 4 oz. (140 µm) copper 40 °C/W
For recommended footprint and soldering techniques refer to application note #AN-994
T
, T
J
Stg
S
R
thJC
(1)
R
thJA
For 10 s (1.6 mm from case) 240
DC operation 1.5
2
PAK (SMD-220) 10TTS08S
- 40 to 125
40
2g
0.07 oz.
°C
°C/W
Document Number: 94562 For technical questions, contact: diodes-tech@vishay.com
Revision: 24-Apr-08 3
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