√t for fusing I2√tt = 0.1 to 10 ms, no voltage reapplied1800 A2√s
F(AV)
I
FSM
TC = 125 °C, 180° conduction half sine wave10
10 ms sine pulse, rated V
10 ms sine pulse, no voltage reapplied185
10 ms sine pulse, rated V
10 ms sine pulse, no voltage reapplied180
applied160
RRM
applied128
RRM
A
2
A
s
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10ETF..SPbF Soft Recovery Series
Vishay High Power Products
Fast Soft Recovery
Rectifier Diode, 10 A
ELECTRICAL SPECIFICATIONS
PARAMETER SYMBOLTEST CONDITIONS VALUESUNITS
Maximum forward voltage dropV
FM
Forward slope resistancer
Threshold voltageV
Maximum reverse leakage currentI
F(TO)
RM
RECOVERY CHARACTERISTICS
PARAMETERSYMBOLTEST CONDITIONS VALUESUNITS
Reverse recovery timet
Reverse recovery currentI
Reverse recovery chargeQ
Typical snap factorS0.6
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETERSYMBOLTEST CONDITIONSVALUESUNITS
Maximum junction and storage
temperature range
Maximum thermal resistance,
junction to case
Maximum thermal resistance,
junction to ambient (PCB mount)
Soldering temperatureT
Approximate weight
Marking device
Note
(1)
When mounted on 1" square (650 mm2) PCB of FR-4 or G-10 material 4 oz. (140 µm) copper 40 °C/W
For recommended footprint and soldering techniques refer to application note #AN-994
All product specifications and data are subject to change without notice.
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