Virtium’s StorFly™ 25 is solid state drive (SSD) technology designed for the unique capacity, workload
and product lifecycle requirements of a broad range of embedded systems including networking,
industrial automation, medical and gaming equipment as well as point-of-sale terminals, military data
recorders and wearable computers. StorFly™ 25 SSDs deliver stable configuration for long product life
and eliminate the need for frequent product re-qualifications. StorFly™ 25PE SSDs are designed for
optimum performance at low to moderate capacity points and are excellent solutions for write intensive
applications.
1.1 Features
• Capacities: 8, 16, 32, 64, 128GB
• Sequential performance (128GB)
o Read/write: 270.220 MB/s
• Random Performance (128GB)
o Read/write IOPS: 15K/4K
• Latency:
o Read/write (μs): TBD/TBD
• Temperature
o Commercial operating: 0oC to 70oC
o Industrial operating: -40oC to +85oC
o Non-operating: -55oC to +95oC
• Power
• Reliability
• S.M.A.R.T. attribute reporting
• Compliance
(1) Measured based on 70/30 random read/write. Power is vary depending upon capacities, see section 4.5 for completed
(1)
(128GB; 5V)
o Typical: 1.2W
o Idle: 1.07W
o UBER: 1 error per 1014 bits read
o MTBF: 2,000,000 hours
o Endurance: Upto 600 TBW (128GB)
o SAT revision 2.6 (SATA 3Gbps and
1.5Gbps)
o ATA/ATAPI-7
o FCC, CE, UL, RoHS
typical and maximum power measurement per capacities
• Mechanical Dimensions - L x W x H mm (in.)
o 100.5 (3.96) x 69.85 (2.75) x 9.5 (0.37)
• Weight
o 87 +/- 2 g (128GB)
• Environmental (Operating/non-operating):
o Shock: 50G (11ms/Axis) x 3 Axes
o Vibration: 10 to 2000 Hz, 16.4G, 3 Axes
o Altitude: 40000 feet
o Humidity: 95%
Product Specification
Capacity
Operating Temperature
Interface/Form Factor
Class
Virtium proprietary
StorFly 25
VSFA25PxxxxG-xxx
2.0 Ordering Information and Part Numbering System
2.0 ORDERING INFORMATION AND PART NUMBERING SYSTEM....................................................................2
3.0 TABLE OF CONTENTS......................................................................................................................................3
4.3.1 Temperature Range.......................................................................................................................................5
4.3.3 Shock and Vibration.......................................................................................................................................6
4.4 System Reliability...............................................................................................................................................6
4.4.1 Power Consumption.......................................................................................................................................7
4.5 Power Requirements..........................................................................................................................................7
4.6 FCC and CE Requirements................................................................................................................................7
6.0 ATA COMMANDS............................................................................................................................................11
6.3 Device Overlay Data Structure.........................................................................................................................21
TABLE 4: SHOCK AND VIBRATION...............................................................................................................................6
TABLE 5: SYSTEM RELIABILITY...................................................................................................................................6
TABLE 6: MEAN TIME BETWEEN FAILURES (MTBF)..................................................................................................7
TABLE 7: POWER CONSUMPTION...............................................................................................................................7
TABLE 16: OTHER COMMAND....................................................................................................................................13