Viglen D865GLC - Desktop Board Motherboard User Manual

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D865GLC Motherboard Manual
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Viglen, EMC and the ‘CE’ mark
CE Marking European standards are being harmonised across borders. If products comply to the same standards in all European countries, product exporting and importing is made simple - paving our way to a common market. If you buy a product with a 'CE' mark on it (shown below), on the box, in the manual, or on the guarantee - it complies with the currently enforced directive(s).
Introduction to EMC EMC (Electromagnetic Compatibility) is the term used to describe certain issues with RF (Radio Frequency) energy. Electrical items should be designed so they do not interfere with each other through RF emissions. E.g. If you turn on your microwave, your television shouldn't display interference if both items are CE marked to the EMC directive.
If emitted RF energy is not kept low, it can interfere with other electrical circuitry - E.g. Cars Automatic Braking Systems have been known to activate by themselves while in a strong RF field. As this has obvious repercussions ALL electrical products likely to cause RF related problems have to be 'CE' marked from 1st January 1996 onwards.
If a product conforms to the EMC directive, not only should its RF emissions be very low, but its immunity to RF energy (and other types) should be high. The apparatus has to resist many 'real world' phenomena such as static shocks and mains voltage transients.
Viglen’s Environment laboratory To gain a 'CE' mark, the Viglen computer range has had to undergo many difficult tests to ensure it is Electromagnetically Compatible. These are carried out in the in-house 'Environment lab' at Viglen Headquarters. We have made every effort to guarantee that each computer leaving our factory complies fully to the correct standards. To ensure the computer system maintains compliance throughout its functional life, it is essential you follow these guidelines.
>Install the system according to Viglen’s instructions >If you open up your Viglen: > Keep internal cabling in place as supplied. > Ensure the lid is tightly secured afterwards
> Do not remove drive bay shields unless installing a 'CE' marked peripheral in its place
> The clips or ‘bumps' around the lips of the case increase conductivity - do not remove or damage. > Do not remove the ferrite ring from the L.E.D cables. > Only use your Viglen computer with 'CE' marked peripherals
This system has been tested in accordance with European standards for use in residential and light industrial areas-this specifies a 10 meter testing radius for emissions and immunity. If you do experience any adverse affects which you think might be related to your computer, try moving it at least 10 meters away from the affected item. If you still experience problems, contact Viglen’s Technical Support department who will put you straight through to an EMC engineer - s/he will do everything possible to help. If modifications are made to your Viglen computer system, it might breach EMC regulations. Viglen take no responsibility (with regards to EMC characteristics) of equipment which has been tampered with or modified.
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Copyrights and Trademarks
Please note
The material in this manual is subject to change without notice.
Trademarks
Microsoft, Windows, Windows NT, Windows 95,Windows 98, Windows ME, Windows 2000 Pro, Windows XP Pro and MS-DOS are registered trademarks of Microsoft Corporation. IBM PC, XT, AT and PS/2 are trademarks of International Business Machines Corporation. Pentium and Pentium Pro are registered trademarks of Intel Corporation. AMI BIOS is a registered trademark of American Megatrends. All other trademarks are acknowledged. JAC-UP, Genie, Contender, Dossier, Vig, Viglen, and Envy are trademarks of Viglen Limited.
Copyright and Patents
This manual and all accompanying software and documentation are copyrighted and all rights reserved. This product, including software and documentation, may not, in whole or in part, be copied, photocopied, translated or reduced to any electronic or machine-readable form, without prior written consent except for copies retained by the purchaser for backup.
© Copyright 2003 Viglen Limited All Rights Reserved D865GLC Manual Version 1.0 Printed in the United Kingdom
Liability
No warranty or representation, either expressed or implied, is made with respect to this documentation, its quality, performance, merchantability or fitness for a particular purpose. As a result the documentation is licensed as is, and you, the licensee, are assuming the entire risk as to its quality and performance. The vendor reserves the right to revise this operation manual and all accompanying software and documentation and to make changes in the content without obligation to notify any person or organisation of the revision or change.
In no event will the vendor be liable for direct, indirect, special, incidental or consequential damages arising out of the use or inability to use this product or documentation, even if advised of the possibility of such damages. In particular, the vendor shall not have liability for any hardware, software or data stored or used with the product, including the costs of repairing, replacing or recovering such hardware, software or data.
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Contents
Chapter 1 Overview 5
System Board Components 6 Back Panel Connectors 7 Feature Summary 8 System Processor 9 System Memory 9 Memory Configurations 11 Intel 865G Chipset 15 Intel 865G Graphics Subsystem 16 USB Support 20 IDE Support 20 Real-Time Clock, CMOS SRAM and Battery 22 I/O Controller 22 Audio Subsystem 23 Audio Connectors 25 LAN Subsystem 26 Hardware Management Subsystem 27 Power Management 28 ACPI 28 Hardware Support 30
Chapter 2 System Board Options 33
Overview of Jumper Settings 35 System Board Jumper Settings 36 Motherboard Connectors 38 Front Panel Connectors 39 Upgrading the CPU 40 Installing & Removing Dual In-Line memory Modules 41 Replacing the Clock/CMOS RAM Battery 43
Chapter 3 Solving Problems 44
Resetting the System 44 Troubleshooting Procedures 45 Problems Operating Add-in Boards 46 Problems and Suggestions 47 Error and Information Messages 49 BIOS Beep Codes 50
Chapter 4 System BIOS 51
What is the BIOS? 51
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The Power-on Sequence 51 Intel/AMI BIOS 52 Configuring the Motherboard using BIOS Setup 58 Setting the Processor Speed 59 Clearing the Passwords 60 BIOS Setup Program 61 Maintenance Menu 62 Main Menu 62 Advanced Menu 64 Security Menu 79 Power Menu 81 Boot Menu 83 Exit Menu 88 Upgrading the BIOS 89 Recovering the BIOS 91
Chapter 5 Technical Information 93
Enhanced IDE 93 Operating Systems and Hard Drives 93 Connector Signal Details 95 Power Supply Connector 98 Motherboard Resources 101 Other Information 103
Chapter 6 Glossary 104
Notes 106
Chapter 7 Suggestions 107
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Chapter 1: Overview
Introduction
This manual describes the Viglen D865GLC motherboard inside your computer. The motherboard is the most important part of your computer. It contains all of the CPU, memory and graphics circuitry that make the computer work.
The motherboard contains the very latest CPU design, the Intel Pentium 4 processor, which includes Intel’s MMX Technology. MMX technology adds a total of 57 new instructions to the CPU, all of which are designed to vastly improve both multimedia and communications on your PC. The combination of the Intel processor, MMX technology and Viglen expertise make this a formidable computer.
This manual contains technical information about the Viglen D865GLC motherboard and other hardware components inside your computer. If you are new to computers we recommend that you read the user guide first. If you are an experienced computer user this manual should provide all the information you will need to perform simple upgrades and maintenance.
We hope that this manual is both readable and informative. If you have any comments for suggestions about how we could improve the format then please fill out the form at the back of the manual and send it to us.
Above all we hope that you enjoy using your Viglen computer.
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System Board Components
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Intel 865G
Chipset
PGA 478
Socket
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Figure 1: Motherboard Layout & Components
A Audio codec Q Parallel ATA IDE connectors B Front panel audio connector R Front chassis fan connector C ATAPI CD-ROM connector S Chassis intrusion connector D Ethernet PLC device (optional) T 4 Mbit Firmware Hub (FWH) E AGP connector U Speaker F Rear chassis fan connector V BIOS Setup configuration jumper block G Back panel connectors W Aux front panel power LED connector H +12V power connector (ATX12V) X Front panel connector I mPGA478 processor socket Y Serial ATA connectors J Processor fan connector Z Front panel USB connectors K Intel 82865G GMCH AA Intel 82801EB I/O Controller Hub (ICH5) L DIMM Channel A socket BB Front Panel USB connector M DIMM Channel B socket CC Battery N I/O controller DD PCI bus add-in card connectors O Power connector EE Aux line-in connector P Diskette drive connector
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Back Panel Connectors
The motherboard external IO connectors are attached to a metallic I/O shield. This shield serves several purposes:
It protects the sensitive motherboard from any external EMC interference.
It stops the computer from interfering with other electrical devices.
It allows the motherboard to be easily upgraded in the future without having to
resort to buying a whole new case. Simply change the I/O shield to match the motherboard.
The I/O shield provides external access to PS/2 keyboard and mouse connectors as well as one serial port, one parallel port, two USB ports, one LAN Port and the audio connectors.
Figure 2: Rear I/O Shield
Note: Power to the computer should be turned off before a keyboard or mouse is
connected or disconnected.
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Feature Summary
The D865GLC motherboard supports Intel Pentium 4 processors 478 pin with 512KB of second-level cache integrated in a micro PGA 478 Socket package operating at speeds up to 3.06GHz. The Celeron processor 478 pin with 128K second-cache with 400MHz system bus is also supported up to 2.4GHz.
Table 1: Feature Summary
Form Factor
Micro ATX Form Factor: 11.6 inches (L) x 9.6 inches (W) x 6 layers PCB
Processor
- Single Pentium 4/Celeron CPU
- 400/533/800MHz Quad-pumped bus
- Integrated 128/256/512KB second-level cache
- Socket micro PGA 478 connector
Memory
- Four 184-pin DDR SDRAM Dual Inline DIMM sockets.
- Support for up to 4GB of DDR266, DDR333 or DDR400 SRAM DIMMs using 2.5V memory
Chipset
Intel 865G Chipset
- Intel® 82865G Graphics and Memory Controller Hub (GMCH)
- Intel® 82801EB I/O Controller Hub (ICH5)
- 4 Mbit Firmware Hub (FWH)
Video
Intel Extreme Graphics 2 controller
- Universal 0.8V / 1.5V AGP 3.0 connector supporting 1x ,4x and 8x AGP cards or an AGP Digital Display (ADD card)
- Integrated retention mechanism
Audio
Flex 6 audio subsystem using the Analog Devices AD1985 codec
I/O Controller
SMSC LPC47M172LPC Bus I/O controller
USB
Support for USB 2.0 devices
Peripheral Interfaces
- Eight USB Ports
- One Serial Port
- One Parallel Port
- Two Serial ATA IDE interfaces
- Two Parallel ATA IDE interfaces with UDMA 33, ATA-66/100 support
- One diskette drive interface
- PS/2 keyboard and mouse ports
LAN Support
10/100 Mbit/sec LAN subsystem using the Intel 82562EZ Platform LAN Connect (PLC) device
BIOS
- Intel/AMI BIOS (resident in the 4 Mbit FWH)
- Support for Advanced Configuration and Power Interface (ACPI), Plug and Play SMBIOS
Instantly Available PC Technology
- Support for PCI Local Bus Specification Revision 2.2
- Suspended to RAM support
- Wake on PCI, RS-232, front panel, PS/2 devices and USB ports
Expansion Capabilities
Three PCI bus add-in card connectors
Hardware Monitor Subsystem
- Hardware monitoring and fan control ASIC
- Voltage sense to detect out of range power supply voltages
- Thermal sense to detect out of range thermal values
- Three fan connectors
- Three fan sense inputs used to monitor fan activity
- Fan speed control
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System Processor
The D865GLC motherboard supports a single Pentium 4 processor. The processor’s VID pins automatically program the voltage regulator on the motherboard to the required processor voltage. In addition, the front side bus speed is automatically selected. The motherboard currently supports processors that run internally up to
3.06GHz and have a 512 KB second-level cache running at full CPU Speed.
The processor implements MMX ™ technology and maintains full backward compatibility with the 8086, 80286, Intel386 ™, Intel486 ™, Pentium, Pentium Pro, Pentium II & Pentium III processors. The processor’s numeric coprocessor significantly increases the speed of floating-point operations and complies with ANSI/IEEE standard 754-1985.
Microprocessor Packaging
The Pentium 4 processor comes in a micro PGA 478 package that connects to the motherboard through a socket 478 connector. The package consists of:
Processor card including the processor core and the second-level cache,
burst pipelined synchronous static RAM (BSRAM) and tag RAM.
Thermal plate.
Back cover.
Second Level Cache
The second-level cache is located on the die of the CPU itself. The cache includes burst pipelined synchronous static RAM (BSRAM) and tag RAM. All supported onboard memory can be cached.
Processor Upgrades
The motherboard can be upgraded with a Pentium 4 processor that runs at higher speeds.
System Memory
Main Memory
The motherboard has four DDR SDRAM Dual Inline Memory Module (DIMM) sockets. Support for up to a maximum memory size of 4GB. The BIOS automatically detects memory type, size, and speed.
The motherboard supports the following memory features:
2.5 V (only) 184-pin DDR SDRAM DIMMs with gold-plated contacts
Unbuffered, single-sided or double-sided DIMMs with the following restriction:
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o Double-sided DIMMS with x16 organisation are not supported.
4 GB maximum total system memory.
Minimum total system memory: 64 MB
Non-ECC DIMMs
Serial Presence Detect
DDR400, DDR333, and DDR266 SDRAM DIMMs
Table 2: Supported System Bus Frequency and Memory Speed Combinations
To use this type of DIMM… The processor’s system bus frequency must be…
DDR400 800MHz DDR333 (Note) 800 or 533MHz DDR266 800, 533 or 400MHz
Note: When using an 800MHz system bus frequency processor, DDR333 memory is clocked at
320MHz. This minimises system latencies to optimise system throughput.
Notes:
Remove the AGP video card before installing or upgrading memory to avoid
interference with the memory retention mechanism.
To be fully compliant with all applicable DDR SDRAM memory specifications,
the board should be populated with DIMMs that support the Serial Presence
Detect (SPD) data structure. This allows the BIOS to read the SPD data and
program the chipset to accurately configure memory settings for optimum
performance. If non-SPD memory is installed, the BIOS will attempt to
correctly configure the memory settings, but performance and reliability may
be impacted or the DIMMs may not function under the determined frequency.
Below table lists the supported DIMM configuration
Table 3: Support Memory Configurations
DIMM Capacity
Configurations DDR SDRAM
Density
DDR SDRAM Configurations Front-side/Back-side
Number of DDR SDRAM Devices
64MB SS 64 Mbit 8 M x 8/empty 8 64MB SS 128 Mbit 8 M x 16/empty 4 128MB DS 64 Mbit 8 M x 8/8 M x 8 16 128MB SS 128 Mbit 16 M x 8/empty 8 128MB SS 256 Mbit 16 M x 16/empty 4 256MB DS 128 Mbit 16 M x 8/16 M x 8 16 256MB SS 256 Mbit 32 M x 8/empty 8 256MB SS 512 Mbit 32 M x 16/empty 4 512MB DS 256 Mbit 32 M x 8/32 M x 8 16 512MB SS 512 Mbit 64 M x 8/empty 8 1024MB DS 512Mbit 64 M x 8/64 M x 8 16
Note: In the second column, “DS” refers to double-sided memory modules (containing two rows of
DDR SDRAM) and “SS” refers to single-sided memory modules (containing one row of DDR SDRAM).
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Memory Configurations
The Intel 82865PE MCH component provides two features for enhancing memory throughput:
Dual Channel memory interface. The board has two memory channels, each
with two DIMM sockets, as shown in Figure 3
Dynamic Addressing Mode. Dynamic mode minimises overhead by reducing
memory accesses
Table 4 summarises the characteristics of Dual and Single Channel configurations with and without the use of Dynamic Mode.
Table 4: Characteristics of Dual/Single Channel Configurations with/without Dynamic Mode
Throughput Levels
Configurations Characteristics
Dual Channel with Dynamic mode All DIMMs matched
(Example Configurations are shown in Figure 4) Dual Channel without Dynamic mode
- DIMMs matched from Channel A to Channel B
- DIMMs not matched within channels
(Example configurations are shown in Figure 5) Single Channel with Dynamic Mode
Single DIMM or DIMMs matched with a channel
(Example configurations are shown in Figure 6)
Highest
Lowest
Single Channel without Dynamic Mode
DIMMs not matched
(Example configurations are shown in Figure 7)
Figure 3: Memory Channel Configurations
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Dual Channel Configurations with Dynamic Mode (All DIMMs matched)
Figure 4: Examples of Dual Channel configurations with Dynamic Mode
Dual Channel Configuration without Dynamic Mode
- DIMMs not matched within channel
- DIMMs match Channel A to Channel B
Figure 5: Examples of Dual Channel Configurations without Dynamic mode
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Single Channel Configurations with Dynamic Mode (Single DIMM or DIMMs matched within channel)
Figure 6: Examples of Single Channel Configurations with Dynamic mode
Single Channel Configurations without Dynamic Mode (DIMMs not matched)
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Figure 7: Examples of Single Channel Configurations without Dynamic mode
SDRAM
DDR (Double Data Rate) Synchronous DRAM (SDRAM) improves memory performance through memory access that is synchronous with the memory clock. This simplifies the timing design and increases memory speed because all timing is dependent on the number of memory clock cycles.
Note: All memory components and DIMMs used with the D865GLC motherboard
must comply with the PC SDRAM specifications. These include the PC SDRAM Specification (memory component specific) and the PC Serial Presence Detect Specification.
ECC Memory
Error checking and correcting (ECC) memory detects multiple-bit errors and corrects single-bit errors. When ECC memory is installed the BIOS supports both ECC and non-ECC mode. ECC mode is enabled in the Setup program. The BIOS automatically detects if ECC memory is installed and provides the Setup option for selecting ECC mode. If any non-ECC memory is installed, the Setup option for ECC configuration does not appear and ECC operation is not available.
The following table describes the effect of using Setup to put each memory type in each supported mode. Whenever ECC mode is selected in Setup, some performance loss occurs.
Table 5: Memory Type
Memory Error Detection Mode Established in Setup Program
ECC Disabled ECC Enabled
Non-ECC DIMM
No error detection N/A
ECC DIMM
No error detection Single-bit error correction,
multiple-bit error detection
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Intel 865G Chipset
The Intel 865G chipset consists of the following devices:
Intel 82865G Graphics and Memory Controller Hub (GMCH) with Accelerated
Hub Architecture (AHA) bus
Intel 82801EB I/O Controller Hub (ICH5) with AHA bus
Firmware Hub (FWH)
The GMCH is a centralised controller for the system bus, the memory bus, the AGP bus, and the Accelerated Hub Architecture interface. The ICH5 is a centralised controller for the board’s I/O paths. The FWH provides the nonvolatile storage of the BIOS. The component combination provides the chipset interfaces as shown in Figure 8.
Figure 8: Intel 865G Chipset Block Diagram
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Intel 865G Graphics Subsystem
The Intel 865G chipset contains two separate, mutually exclusive graphics options. Either the Intel Extreme Graphics controller (contained within the 82865G GMCH) is used, or an AGP add-in card can be used. When an AGP add-in card is installed, the Intel Extreme Graphics controller is disabled.
Intel ® Extreme Graphics 2 Controller
The Intel Extreme Graphics controller features the following:
Integrated graphics controller
o 32 bpp (Bits Per Pixel) graphics engine o 266 MHz core frequency o 256-bit internal data path for 2-D o 32-bit internal data path for 3-D o Motion video acceleration
3-D graphics visual and texturing enhancement
Display
o Integrated 24-bit 350 MHz RAMDAC o DDC2B compliant interface
Video
o Hardware motion compensation for software MPEG2 decode o Two multiplexed DVO port interfaces with 165 MHz pixel clocks using
an AGP Digital Display (ADD) card
Dynamic Video Memory Technology (DVMT) support up to 64 MB (driver
dependent)
Intel 865G Chipset
o 400/533/800 MHz Front Side Bus (FSB) o AGP 8x 1.5volt
Table 6: Supported Graphics Modes using an Analog CRT
Resolution Max Colour palette Max Refresh rate
640x480 16M 85Hz 800x600 16M 85Hz 1024x768 16M 85Hz 1280x1024 16M 85Hz 1600 x 1200 16M 85Hz 1920x1440 64K 75Hz
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Dynamic Video Memory Technology (DVMT)
DVMT enables enhanced graphics and memory performance through Direct AGP, and highly efficient memory utilisation. DVMT ensures the most efficient use of available system memory for maximum 2-D/3-D graphics performance. Up to 64 MB of system memory can be allocated to DVMT on systems that have 256 MB or more of total system memory installed. Up to 32 MB can be allocated to DVMT on systems that have 128 MB but less than 256 MB of total installed system memory. Up to 8 MB can be allocated to DVMT when less than 128 MB of system memory is installed. DVMT returns system memory back to the operating system when the additional system memory is no longer required by the graphics subsystem.
DVMT will always use a minimal fixed portion of system physical memory (as set in the BIOS Setup program) for compatibility with legacy applications. An example of this would be when using VGA graphics under DOS. Once loaded, the operating system and graphics drivers allocate additional system memory to the graphics buffer as needed for performing graphics functions.
Note: The use of DVMT requires operating system driver support
Zone Rendering Technology (ZRT)
The Intel Extreme Graphics 2 Controller supports Zone Rendering Technology (ZRT). ZRT is a process by which the screen is divided into several zones. Each zone is completely cached and rendered on chip before being written to the frame buffer. The benefits of ZRT include the following:
Increased memory efficiency via better localisation of data
Increased on-chip processing speed due to decreased wait time for data
Increased effective pixel fill rates
Increased headroom for larger resolution and color depth
Reduced power as a result of decreased memory bandwidth
Reduction in depth and color bandwidth associated with conventional
rendering
Rapid Pixel and Text Rendering (RPTR)
The Rapid Pixel and Text Rendering Engine (RPTR) architecture utilises special pipelines that allow 2D and 3D operations to overlap. By providing 8X compression, the RPTR engine reduces the memory bandwidth required to read texture memory, and reduces the amount of memory required for texture storage.
A dedicated, non-blocking, multi-tier cache is provided for textures, colors, Z and vertex rendering. With single-pass, quad texture support, the drivers can submit up to four textures that pass to the graphics engine concurrently. The graphics core can switch between 2D and 3D operations without having to complete all operations of the same mode, which minimises the overhead time required in switching between modes.
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2D Block Level Transfer (BLT) in the RPTR engine is extended to 256-bit, which supports fast blitter fill rate. This enables the blitter sequence of the same addresses to access the cache and offloads the memory bandwidth required to support blitter fill rate. Then the cache is emptied automatically when the sequence of operations are complete.
Intelligent Memory Management (IMM)
Intelligent Memory Management (IMM) technology is Intel’s unique UMA memory manager architecture, consisting of these key elements:
Tiled memory addressing capability
Deep display buffer implementation
Dynamic data management scheme
The memory addressing allows address remapping in the hardware for all graphics surfaces including textures, frame buffer, Z buffer, and video surfaces. Deep display buffers and dedicated screen refreshes improve visual performance, while the dynamic data management scheme manages burst size and page closing policies for memory accesses.
IMM reduces the aggregate processor latency and allows longer in-page bursts for higher system performance. IMM also increases page coherency and improves memory efficiency in texture loads, 2D blitters, color/Z, MPEG2 motion compression, and other operations.
Video Mixing Renderer (VMR)
PC/VCR requires a TV-tuner add-in card and a third party application. PC/VCR time shifted viewing allows the user to view and digitally record video pictures on their PC. Users can view stored images while recording and by using time-shifted viewing they can pause, resume, replay, and catch up to real time. The Intel Pentium 4 processor in combination with the Intel 82865G GMCH optimises performance so that the video output is smooth without leaving any visual artifacts. Video tearing and corruption is prevented by the use of multiple buffers within the Intel Extreme Graphics 2 controller.
Bi-Cubic Filtering
Bi-cubic filtering is a new 4X4 filter that allows images to be generated more smoothly in the 3D pipeline. The bi-cubic filter can be used to improve image quality for all 3D texture engine components.
AGP Digital Display (ADD) Card Support
The GMCH routes two 12-bit multiplexed DVO ports that are each capable of driving a 165 MHz pixel clock to the AGP connector. The DVO ports can be paired for dual channel mode. In dual channel mode, the GMCH is capable of driving a 24-bit 330 MHz pixel clock. When an AGP add-in card is used, the Intel Extreme Graphics 2
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controller is disabled and the AGP connector operates in AGP mode. When an ADD card is detected, the Intel Extreme Graphics 2 controller is enabled and the AGP connector is configured for DVO mode. DVO mode enables the DVO ports to be accessed by an ADD card. ADD cards can support up to two display devices with the following configurations:
TV-Out and Transition Minimised Differential Signaling (TMDS)
Low Voltage Differential Signaling (LVDS)
Single device operating in dual channel mode
Universal 0.8V / 1.5V AGP 3.0 Connector
The AGP connector supports the following:
4x, 8x AGP 3.0 add-in cards with 0.8 V I/O
1x, 4x AGP 2.0 add-in cards with 1.5 V I/O
AGP Digital Display (ADD) cards
AGP is a high-performance interface for graphics-intensive applications, such as 3D applications. While based on the PCI Local Bus Specification, Rev. 2.2, AGP is independent of the PCI bus and is intended for exclusive use with graphical display devices. AGP overcomes certain limitations of the PCI bus related to handling large amounts of graphics data with the following features:
Pipelined memory read and write operations that hide memory access latency
Demultiplexing of address and data on the bus for nearly 100 percent
efficiency
Notes:
AGP 2x operation is not supported.
Install memory in the DIMM sockets prior to installing the AGP video card to
avoid interference with the memory retention mechanism.
The AGP connector is keyed for Universal 0.8 V AGP 3.0 cards or 1.5 V AGP
2.0 cards only. Do not attempt to install a legacy 3.3 V AGP card. The AGP connector is not mechanically compatible with legacy 3.3 V AGP cards.
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USB Support
The motherboard has four USB 2.0 ports; note an optional front panel USB connector is required to use the internal USB header to provide 2 more additional ports. One USB peripheral can be connected to each port. For more than four USB devices, an external hub can be connected to either port. The motherboard fully supports the universal host controller interface (UHCI) and (EHCI) and uses UHCI­and EHCI- compatible drivers. The ICH5 provides the USB controller for all ports. The port arrangement is as follows:
Two ports are implemented with stacked back panel connectors, adjacent to
the PS/2 connectors
Two ports are implemented with stacked back panel connectors, adjacent to
the audio connectors
Four ports are routed to two separate front panel USB connectors
Note: USB 2.0 drivers are available for Windows 2000 Pro and Windows XP, and
currently not supported by any other operating system.
USB features include:
Self-identifying peripherals that can be plugged in while the computer is
running.
Automatic mapping of function to driver and configuration.
Supports isochronous and asynchronous transfer types over the same set of
wires.
Supports up to 127 physical devices.
Guaranteed bandwidth and low latencies appropriate for telephony, audio,
and other applications.
Error-handling and fault-recovery mechanisms built into the protocol.
Note: Computer systems that have an unshielded cable attached to a USB port may
not meet FCC Class B requirements, even if no device or a low-speed (sub-channel) USB device is attached to the cable. Use shielded cable that meets the requirements for high-speed (fully rated) devices.
IDE Support
The D865GLC motherboard provides four IDE interface connectors:
Two Parallel ATA IDE connectors, which support a total of four devices (two
per connector)
Two Serial ATA IDE connectors, which support one device per connector
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Parallel ATA IDE Interfaces
The ICH5’s Parallel ATA IDE controller has two independent bus-mastering Parallel ATA IDE interfaces that can be independently enabled. The Parallel ATA IDE interfaces support the following modes:
Programmed I/O (PIO): processor controls data transfer.
8237-style DMA: DMA offloads the processor, supporting transfer rates of up
to 16 MB/sec.
Ultra DMA: DMA protocol on IDE bus supporting host and target throttling and
transfer rates of up to 33 MB/sec.
ATA-66: DMA protocol on IDE bus supporting host and target throttling and
transfer rates of up to 66 MB/sec. ATA-66 protocol is similar to Ultra DMA and is device driver compatible.
ATA-100: DMA protocol on IDE bus allows host and target throttling. The
ICH5’s ATA-100 logic can achieve read transfer rates up to 100 MB/sec and write transfer rates up to 88 MB/sec.
Serial ATA Support
The ICH5’s Serial ATA controller offers two independent Serial ATA ports with a theoretical maximum transfer rate of 150 MB/s per port. One device can be installed on each port for a maximum of two Serial ATA devices. A point-to-point interface is used for host to device connections, unlike Parallel ATA IDE which supports a master/slave configuration and two devices per channel.
For compatibility, the underlying Serial ATA functionality is transparent to the operating system. The Serial ATA controller can operate in both legacy and native modes. In legacy mode, standard IDE I/O and IRQ resources are assigned (IRQ 14 and 15). In Native mode, standard PCI resource steering is used. Native mode is the preferred mode for configurations using the Windows XP and Windows 2000 operating systems.
LS-120 Support
LS-120 MB Diskette technology enables you to store 120MB of data on a single, 3.5” removable diskette. LS-120 technology is backward (both read and write) compatible with 1.44MB and 720KB DOS-formatted diskette and is supported by Windows 95 and Windows NT operating system.
The D865GLC board allows connection of an LS-120 compatible drive and a standard 3½” floppy drive. The LS-120 drive can be configured as a boot device before a floppy drive, if selected in the BIOS setup utility.
Note: If you connect an LS-120 drive to an IDE connector and configure it as the “A”
drive and configure a standard 3.5” floppy as “B” drive, the standard floppy must be connected to the floppy drive cable’s “A” connector (the connector at the end of the cable).
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The BIOS setup utility can be configured to boot firstly from either the LS120 or standard 3½ “ floppy drive.
Real-Time Clock, CMOS SRAM and Battery
A coin-cell battery (CR2032) powers the real-time clock and CMOS memory. When the computer is not plugged into a wall socket, the battery has an estimated life of three years. When the computer is plugged in, the standby current from the power supply extends the life of the battery. The clock is accurate to ± 13 minutes/year at 25 ºC with 3.3 VSB applied.
Note: If the battery and AC power fail, custom defaults, if previously saved, will be loaded into CMOS RAM at power-on.
I/O Controller
The I/O controller (SMSC LPC47M172 or National Semiconductor PC87372) provides the following features:
One serial port.
One parallel port with Extended Capabilities Port (ECP) and Enhanced
Parallel Port (EPP) support
Serial IRQ interface compatible with serialised IRQ support for PCI systems
PS/2-style mouse and keyboard interfaces
Interface for one 1.2 MB or 1.44 MB diskette drive
Intelligent power management, including a programmable wake-up event
interface
PCI power management support
Two fan tachometer inputs
Integrated USB hub
By default, the I/O controller interfaces are automatically configured during boot up. The I/O controller can also be manually configured in the Setup program.
Serial Ports
One 9-pin D-Sub serial port connector is located on the back panel and is compatible with NS16C550 UARTs.
Parallel Port
The connector for the multimode bi-directional parallel port is a 25-pin D-Sub connector located on the back panel. In the Setup program, the parallel port can be configured for the following:
Compatible (standard mode).
Bi-directional (PS/2 compatible).
Extended Parallel Port (EPP).
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Enhanced Capabilities Port (ECP).
Floppy Controller
The I/O controller is software compatible with the N82077 floppy drive controllers and supports both PC-AT and PS/2 modes. In the Setup program, the floppy interface can be configured for the following floppy drive capacities and sizes:
360 KB, 5.25-inch
1.2 MB, 5.25-inch
720 KB, 3.5-inch
1.2 MB, 3.5-inch (driver required)
1.25/1.44 MB, 3.5-inch
2.88 MB, 3.5-inch
PS/2 Keyboard and Mouse Interface
PS/2 keyboard and mouse connectors are located on the back panel. The +5 V lines to these connectors are protected with a PolySwitch circuit that, like a self-healing fuse, re-establishes the connection after an over-current condition is removed.
The keyboard controller contains the AMI Megakey keyboard and mouse controller code, provides the keyboard and mouse control functions, and supports password protection for power on/reset. A power on/reset password can be specified in Setup. The keyboard controller also supports the hot-key sequence <Ctrl><Alt><Del> for a software reset. This key sequence resets the computer’s software by jumping to the beginning of the BIOS code and running the Power-On Self Test (POST).
Audio Subsystem
The D865GLC motherboard provides a Flex 6 audio subsystem based on the Analog Devices AD1985 codec. The audio subsystem supports the following features:
Advanced jack sense with Auto Topology Switching that enables the audio
codec to recognise what device is connected to an audio port and alerts the user if the wrong type of device has been connected.
Split digital/analog architecture for improved S/N (signal-to-noise) ratio: > 94
dB
The Flex 6 audio subsystem includes the following features:
Intel 82801EB I/O Controller Hub (ICH5)
Analog Devices AD1985 audio codec
Microphone input that supports a single dynamic, condenser, or electrets
microphone
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The subsystem has the following connectors:
ATAPI-style CDROM connector
Front panel audio connector, including pins for:
o Line In o Mic in
Back panel audio connectors that are configurable through the audio devices
derivers. The available configurations are shown below:
Figure 9: Back Panel Audio Connector Options
Note: To access the S/PDIF signal with the 5.1 Digital Shared Jack option, connect
a 1/8-inch stereo phone plug to RCA jack adapter/splitter as shown in Figure 10.
Figure 10: Adapter for S/PDIF Back Panel Connector
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Audio Connectors
Front Panel Audio connector
A 2 x 5-pin connector provides mic in and line out signals for front panel audio connectors.
Auxiliary Line In Connector
A 1 x 4-pin ATAPI-style connector connects the left and right channel signals of an internal audio device to the audio subsystem.
ATAPI CDROM Audio Connector
A 1 x 4-pin ATAPI-style connector connects an internal ATAPI CD-ROM drive to the audio mixer.
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LAN Subsystem
The Network Interface Controller subsystem consists of the ICH5 (with integrated LAN Media Access Controller) and a physical layer interface device. Feature of the LAN subsystem include:
PCI Bus Master Interface
CSMA/CD Protocol Engine
Serial CSMA/CD unit interface that supports the following physical layer
interface devices:
o Intel® 82562EZ 10/100 Mbit/sec Platform LAN Connect (PLC) device
PCI Power Management
o Supports APM o Supports ACPI technology o Supports Wake up from suspend state (Wake-On-LAN † technology)
Intel ® 82562EZ Platform LAN Connect Device
The Intel 82562EZ component provides an interface to the back panel RJ-45 connector with integrated LEDs. This physical interface may alternately be provided via the CNR connector. The Intel 82562EZ provides the following functions:
Basic 10/100 Ethernet LAN Connectivity
Supports RJ-45 connector with status indicator LEDs
Full driver compatibility
Advanced Power Management support
Programmable transit threshold
Configuration EEPROM that contains the MAC address
RJ-45 LAN Connector LEDs
Two LEDs are built into the RJ-45 LAN connector. The following table describes the LED states when the board is powered up and the LAN subsystem is operating.
Table 7: LAN Connector LEDs
LED Colour LED State Condition
Green Off 10 Mbit/sec data rate is selected.
Green On 100 Mbit/sec date rate is selected. Yellow Off LAN link is not established. Yellow On (steady state) LAN link is established. Yellow On (brighter and pulsing) The computer is communicating with another computer
on the LAN.
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Hardware Management Subsystem
The hardware management features enable the Desktop Boards to be compatible with the Wired for Management (WfM) specification. The Desktop Board has several hardware management features, including the following:
Fan monitoring and control (through the hardware monitoring and fan control
ASIC)
Thermal and voltage monitoring
Chassis intrusion detection
Hardware Monitoring and Fan Control ASIC
The features of the hardware monitoring and fan control ASIC include:
Internal ambient temperature sensor
Two remote thermal diode sensors for direct monitoring of processor
temperature and ambient temperature sensing
Power supply monitoring of five voltages (+5 V, +12 V, +3.3 VSB, +1.5 V, and
+VCCP) to detect levels above or below acceptable values
Thermally monitored closed-loop fan control, for all three fans, that can adjust
the fan speed or switch the fans on or off as needed
SMBus interface
Thermal Monitoring
Figure 11 shows the location of the sensors and fan connectors.
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Item Description
A Thermal diode, located on processor die B Remote ambient temperature sensor C Ambient temperature sensor D Processor fan E Rear chassis fan F Front chassis fan
Figure 11: Thermal Sensors
Fan Monitoring
Fan monitoring can be implemented using Intel ® Active Monitor, LANDesk* software, or third-party software. The level of monitoring and control is dependent on the hardware monitoring ASIC used with the Desktop Board.
Chassis Intrusion and Detection
The D865GLC motherboard supports a chassis security feature that detects if the chassis cover is removed. The security feature uses a mechanical switch on the chassis that attaches to the chassis intrusion connector. When the chassis cover is removed, the mechanical switch is in the closed position.
Power Management
Power management is implemented at several levels, including:
Software support through Advanced Configuration and Power Interface
(ACPI)
Hardware support:
o Power connector o Fan connectors o LAN wake capabilities o Instantly Available PC technology o Resume on Ring o Wake from USB o Wake from PS/2 devices o Power Management Event signal (PME#) wake-up support
ACPI
ACPI gives the operating system direct control over the power management and Plug and Play functions of a computer. The use of ACPI with the D865GLC motherboard requires an operating system that provides full ACPI support. ACPI features include:
Plug and Play (including bus and device enumeration)
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Power management control of individual devices, add-in boards (some add-in
boards may require an ACPI-aware driver), video displays, and hard disk drives
Methods for achieving less than 15-watt system operation in the power-
on/standby sleeping state
A Soft-off feature that enables the operating system to power-off the computer
Support for multiple wake-up events
Support for a front panel power and sleep mode switch
Table 8 lists the system states based on how long the power switch is pressed, depending on how ACPI is configured with an ACPI-aware operating system.
Table 8: Effects of Pressing the Power Switch
If the system is in this state…
…and the power switch is pressed for
…the system enters this state
Off (ACPI G2/G5 – soft off)
Less that four seconds Power-on
(ACPI G0 – working) On (ACPI G0 – working state)
Less than four seconds Soft off/Standby
(ACPI G1 – sleeping state) On (ACPI G0 – working state)
More than four seconds Fail safe power-off
(ACPI G2/G5 – soft-off) Sleep (ACPI G1 – sleeping state)
Less that four seconds Wake-up
(ACPI G0 – working state) Sleep (ACPI G1 – sleeping state)
More than fore seconds Power-off
(ACPI G2/G5 – Soft off)
System States and Power States
Under ACPI, the operating system directs all system and device power state transitions. The operating system puts devices in and out of low-power states based on user preferences and knowledge of how devices are being used by applications. Devices that are not being used can be turned off. The operating system uses information from applications and user settings to put the system as a whole into a low-power state.
Table 9 lists the power states supported by the D865GLC motherboard along with the associated system power targets. See the ACPI specification for a complete description of the various system and power states.
Table 9: Power States and Targeted System Power
Global States Sleeping States Processor
States
Device States Targeted System
Power
G0 – working state
S0 – working C0 – working D0 – working state Full Power > 30W
G1 – sleeping state
S1 – Processor stopped
C1 – stop grant D1, D2, D3 – device
specification specific
5W < power <
52.5W G1 – sleeping state
S3 – Suspend to RAM.
No power D3 – no power except
for wake-up logic
Power < 5W
G1 – Sleeping state
S4 – Suspended to disk.
No power D3 – no power except
for wake-up logic
Power < 5W
G2/S5 S5 – Soft off.
saved
No power D3 – no power except
for wake-up logic
Power < 5W
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