VICOR V048K060T040 User Manual
vicorpower.com 800-735-6200 V•I Chip Voltage Transformation Module V048K060T040 Rev. 1.0
Page 1 of 15
PRELIMINARY
Product Description
The V048K060T040 V•I Chip Voltage Transformation
Module (VTM) excels at speed, density and efficiency to
meet the demands of advanced DSP, FPGA, and ASIC at
the point of load (POL) while providing isolation from
input to output. It achieves a response time of less than
1 µs and delivers up to 40.0 A in a volume of less than
0.25 in
3
with unprecedented efficiency. It may be
paralleled to deliver hundreds of amps at an output
voltage settable from 3.25 to 6.87 Vdc.
The VTM V048K060T040’s nominal output voltage is
6 Vdc from a 48 Vdc input Factorized Bus, Vf, and is
controllable from 3.25 to 6.87 Vdc at no load, and from
2.95 to 6.60 Vdc at full load, over a Vf input range of
26 to 55 Vdc. It can be operated either open- or closedloop depending on the output regulation needs of the
application. Operating open-loop, the output voltage
tracks its Vf input voltage with a transformation ratio,
K = 1/8 , for applications requiring a programmable
output voltage at high current and high efficiency.
Closing the loop back to an input Pre-Regulation Module
(PRM) or DC-DC converter enables tight load regulation.
The 6 V VTM achieves a power density of 974 W/in
3
in a
V•I Chip package compatible with standard pick-andplace and surface mount assembly processes. The
V•I Chip BGA package supports in-board mounting with
a low profile of 0.16" (4 mm) over the board. A J-lead
package option supports on-board surface mounting
with a profile of only 0.25" (6 mm) over the board. The
VTM’s fast dynamic response and low noise eliminate the
need for bulk capacitance at the load, substantially
increasing the POL density while improving reliability and
decreasing cost.
Parameter Values Unit Notes
+In to -In -1.0 to 60 Vdc
+In to -In 100 Vdc For 100 ms
PC to -In -0.3 to 7.0 Vdc
VC to -In -0.3 to 19.0 Vdc
+Out to -Out -0.1 to 15.0 Vdc
Isolation voltage 2,250 Vdc Input to Output
Output current 40.0 A Continuous
Peak output current 60.0 A For 1 ms
Output power 240 W Continuous
Peak output power 360 W For 1 ms
Case temperature 208 °C During reflow
Operating junction temperature
(1)
-40 to 125 °C T - Grade
-55 to 125 °C M - Grade
Storage temperature
-40 to 150 °C T - Grade
-65 to 150 °C M - Grade
V•I ChipTM– VTM
Voltage Transformation Module
•48V to 6 V V•I Chip Converter
• 40.0 A (60.0 A for 1 ms)
•High density – 974 W/in
3
•Small footprint – 220 W/in
2
• Low weight – 0.5 oz (14 g)
• Pick & Place / SMD
• 125°C operation
•1 µs transient response
• 3.5 million hours MTBF
•Typical efficiency 95%
• No output filtering required
• Surface mount BGA or J-Lead
packages
V048K060T040
Actual size
©
VTM
Note:
(1) The referenced junction is defined as the semiconductor having the highest temperature.
This temperature is monitored by a shutdown comparator.
K indicates BGA configuration. For other
mounting options see Part Numbering below.
Output Current
Designator
(=I
OUT)
V 048 K 060 T 040
Voltage
Transformation
Module
Input Voltage
Designator
Product Grade Temperatures (°C)
Grade Storage Operating
T -40 to150 -40 to125
M -65 to150 -55 to125
Configuration Options
F=On-board (Figure 15)
K=In-board (Figure 14)
Output Voltage
Designator
(=VOUT x10)
Part Numbering
Vf = 26 - 55 V
V
OUT = 3.25 - 6.87 V
I
OUT
= 40.0 A
K = 1/8
R
OUT = 7.5 mΩ max
Absolute Maximum Ratings
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vicorpower.com 800-735-6200 V•I Chip Voltage Transformation Module V048K060T040 Rev. 1.0
Page 2 of 15
V•I Chip Voltage Transformation Module
PRELIMINARY
Electrical Specifications
Parameter Min Typ Max Unit Note
Input voltage range 26 48 55 Vdc Operable down to zero V with VC voltage applied
Input dV/dt 1 V/µs
Input overvoltage turn-on 55.0 Vdc
Input overvoltage turn-off 59.0 Vdc
Input current 5.5 Adc
Input reflected ripple current 275 mA p-p Using test circuit in Figure 16; See Figure 1
No load power dissipation 2.3 3.5 W
Internal input capacitance 4.0 µF
Internal input inductance 20 nH
Input Specs (Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter Min Typ Max Unit Note
Output voltage
3.25 6.87 Vdc No load
2.95 6.60 Vdc Full load
Rated DC current 0 40.0 Adc 26 - 55 VIN
Peak repetitive current 60.0 A
Max pulse width 1ms, max duty cycle 10%,
baseline power 50%
Short circuit protection set point 42.8 49.9 55.0 Adc Module will shut down
Current share accuracy 5 10 % See Parallel Operation on Page 10
Efficiency
Half load 94.3 95.8 % See Figure 3
Full load 93.8 94.8 % See Figure 3
Internal output inductance 1.1 nH
Internal output capacitance 55.0 µF Effective value
Output overvoltage setpoint 6.9 Vdc Module will shut down
Output ripple voltage
No external bypass 230 300 mV See Figures 2 and 5
10 µF bypass capacitor 12.5 mV See Figure 6
Effective switching frequency 2.0 2.5 3.0 MHz Fixed, 1.25 MHz per phase
Line regulation
K 0.1238 1/8 0.1263 VOUT = K•VIN at no load
Load regulation
ROUT
5.5 7.5 mΩ See Figure 19
Transient response
Voltage overshoot 180 mV 40.0 A load step with 100 µF CIN; See Figures 7 and 8
Response time 200 ns See Figures 7 and 8
Recovery time 1 µs See Figures 7 and 8
Output Specs (Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified)
vicorpower.com 800-735-6200 V•I Chip Voltage Transformation Module V048K060T040 Rev. 1.0
Page 3 of 15
PRELIMINARY
Figure 1— Input reflected ripple current at full load and 48 Vf.
Figure 3— Efficiency vs. output current at 48 Vf.
Figure 4—Power dissipation as a function of output current at 48 Vf.
Waveforms
Figure 6—Output voltage ripple at full load and 6 Vout with 10 µF ceramic
external bypass capacitance and 20 nH distribution inductance.
Figure 5— Output voltage ripple at full load and 6 Vout; without any
external bypass capacitor.
Figure 2— Output voltage ripple vs. output current at 6 Vout with no POL
bypass capacitance.
Electrical Specifications (continued)
Output Ripple (mVpk-pk)
Ripple vs. Output Current
220
200
180
160
140
120
100
80
60
40
20
0481216 20 24 28 32 36 40
Output Current (A)
Efficiency vs. Output Current
96
95.5
95
94.5
94
93.5
93
Efficiency (%)
92.5
92
91.5
91
04812162024 28323640
Output Current (A)
Power Dissipation
14
13
12
11
10
9
8
7
6
5
4
Power Dissipation (W)
3
2
0481216 20 24 28 32 36 40
Output Current (A)
vicorpower.com 800-735-6200 V•I Chip Voltage Transformation Module V048K060T040 Rev. 1.0
Page 4 of 15
V•I Chip Voltage Transformation Module
PRELIMINARY
Parameter Min Typ Max Unit Note
Primary Control (PC)
DC voltage 4.8 5.0 5.2 Vdc
Module disable voltage 2.4 2.5 Vdc
Module enable voltage 2.5 2.6 Vdc VC voltage must be applied when module is enabled using PC
Current limit 2.4 2.5 2.9 mA Source only
Disable delay time 10 µs PC low to Vout low
VTM Control (VC)
External boost voltage 12.0 14.0 19.0 Vdc Required for VTM start up without PRM
External boost duration 10 ms Vin > 26 Vdc. VC must be applied continuously
if Vin < 26 Vdc.
Auxiliary Pins (Conditions are at 48 Vin, full load, and 25°C ambient unless otherwise specified)
Parameter Min Typ Max Unit Note
MTBF
MIL-HDBK-217F 3.5 Mhrs 25°C, GB
Isolation specifications
Voltage 2,250 Vdc Input to Output
Capacitance 3,000 pF Input to Output
Resistance 10 MΩ Input to Output
Agency approvals (pending)
cTÜVus UL/CSA 60950, EN 60950
CE Mark Low voltage directive
Mechanical parameters See Mechanical Drawing, Figures 10 and 12
Weight 0.5 / 14.0 oz / g
Dimensions(BGA version)
Length 1.26 / 32 in / mm
Width 0.85 / 21.5 in / mm
Height 0.23 / 5.9 in / mm
General
Figure 7— 0-40.0 A step load change with 100 µF input capacitance and
no output capacitance.
Figure 8— 40.0-0 A step load change with 100 µF input capacitance and
no output capacitance.
Electrical Specifications (continued)
vicorpower.com 800-735-6200 V•I Chip Voltage Transformation Module V048K060T040 Rev. 1.0
Page 5 of 15
PRELIMINARY
V•I Chip Stress Driven Product Qualification Process
Symbol Parameter Min Typ Max Unit Note
Over temperature shutdown 125 130 135 °C Junction temperature
Thermal capacity 0.61 Ws/°C
RθJC Junction-to-case thermal impedance 1.1 °C/W
RθJB Junction-to-BGA thermal impedance 2.1 °C/W
RθJA
Junction-to-ambient
(1)
6.5 °C/W
RθJA
Junction-to-ambient
(2)
5.0 °C/W
Thermal
Notes:
(1) V048K060T040 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
(2) V048K060T040 with optional 0.25"H Pin Fins surface mounted on FR4 board, 300 LFM.
Test Standard Environment
High Temperature Operational Life (HTOL) JESD22-A-108-B 125°C, Vmax, 1,008 hrs
Temperature cycling JESD22-A-104B -55°C to 125°C, 1,000 cycles
High temperature storage JESD22-A-103A 150°C, 1,000 hrs
Moisture resistance JESD22-A113-B Moisture sensitivity Level 5
Temperature Humidity Bias Testing (THB) EIA/JESD22-A-101-B 85°C, 85% RH, Vmax, 1,008 hrs
Pressure cooker testing (Autoclave) JESD22-A-102-C 121°C, 100% RH, 15 PSIG, 96 hrs
Highly Accelerated Stress Testing (HAST) JESD22-A-110B 130°C, 85% RH, Vmax, 96 hrs
Solvent resistance/marking permanency JESD22-B-107-A Solvents A, B & C as defined
Mechanical vibration JESD22-B-103-A 20g peak, 20-2,000 Hz, test in X, Y & Z directions
Mechanical shock JESD22-B-104-A 1,500g peak 0.5 ms pulse duration, 5 pulses in 6 directions
Electro static discharge testing – human body model EIA/JESD22-A114-A Meets or exceeds 2,000 Volts
Electro static discharge testing – machine model EIA/JESD22-A115-A Meets or exceeds 200 Volts
Highly Accelerated Life Testing (HALT)
Per Vicor Internal
Operation limits verified, destruct margin determined
Test Specification
(1)
Dynamic cycling
Per Vicor internal
Constant line, 0-100% load, -20°C to 125°C
test specification
(1)
Note:
(1) For details of the test protocols see Vicor’s website.
Test Standard Environment
BGA solder fatigue evaluation
IPC-9701 Cycle condition: TC3 (-40 to +125°C)
IPC-SM-785 Test duration: NTC-B (500 failure free cycles)
Solder ball shear test IPC-9701 Failure through bulk solder or copper pad lift-off
V•I Chip Ball Grid Array Interconnect Qualification
Electrical Specifications
(continued)
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