VIA Technologies QSM-8Q60 User Manual

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1.03-05242017-171300
USER MANUAL
QSM-8Q60
Qseven™ ARM module with
Cortex-A9 SoC
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Copyright
Copyright © 2015-2017 VIA Technologies Incorporated. All rights reserved.
No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language, in any form or by any means, electronic, mechanical, magnetic, optical, chemical, manual or otherwise without the prior written permission of VIA Technologies, Incorporated.
Trademarks
All trademarks are the property of their respective holders.
Disclaimer
No license is granted, implied or otherwise, under any patent or patent rights of VIA Technologies. VIA Technologies makes no warranties, implied or otherwise, in regard to this document and to the products described in this document. The information provided in this document is believed to be accurate and reliable as of the publication date of this document. However, VIA Technologies assumes no responsibility for the use or misuse of the information (including use or connection of extra device/equipment/add-on card) in this document and for any patent infringements that may arise from the use of this document. The information and product specifications within this document are subject to change at any time, without notice and without obligation to notify any person of such change.
VIA Technologies, Inc. reserves the right the make changes to the products described in this manual at any time without prior notice.
Regulatory Compliance
FCC-A Radio Frequency Interference Statement This equipment has been tested and found to comply with the limits for a class A digital device, pursuant to part 15 of the FCC rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a residential area is likely to cause harmful interference, in which case the user will be required to correct the interference at his personal expense.
Notice 1 The changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to operate the equipment.
Notice 2 Shielded interface cables and A.C. power cord, if any, must be used in order to comply with the emission limits.
Notice 3 The product described in this document is designed for general use, VIA Technologies assumes no responsibility for the conflicts or damages arising from incompatibility of the product. Check compatibility issue with your local sales representatives before placing an order.
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Battery Recycling and Disposal
Only use the appropriate battery specified for this product. Do not re-use, recharge, or reheat an old battery. Do not attempt to force open the battery. Do not discard used batteries with regular trash. Discard used batteries according to local regulations.
Safety Precautions
Always read the safety instructions carefully. Keep this User's Manual for future reference. All cautions and warnings on the equipment should be noted. Keep this equipment away from humidity. Lay this equipment on a reliable flat surface before setting it up. Make sure the voltage of the power source and adjust properly 110/220V before connecting the
equipment to the power inlet.
Place the power cord in such a way that people cannot step on it. Always unplug the power cord before inserting any add-on card or module. If any of the following situations arises, get the equipment checked by authorized service personnel:
The power cord or plug is damaged.
Liquid has penetrated into the equipment.
The equipment has been exposed to moisture.
The equipment has not worked well or you cannot get it work according to User's Manual.
The equipment has dropped and damaged.
The equipment has obvious sign of breakage.
Do not leave this equipment in an environment unconditioned or in a storage temperature above
70°C (158°F). The equipment may be damaged.
Do not leave this equipment in direct sunlight. Never pour any liquid into the opening. Liquid can cause damage or electrical shock. Do not place anything over the power cord. Do not cover the ventilation holes. The openings on the enclosure protect the equipment from
overheating
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Box Contents
QSM-8Q60-QP SKU
1 x QSM-8Q60 Qseven
module (with 1.0GHz NXP i.MX 6QuadPlus Cortex-A9 quad-core SoC)
1 x QSM-8Q60 evaluation carrier board (QSMDB2) 1 x DC power cable 1 x Console cable
QSM-8Q60 SKU
1 x QSM-8Q60 Qseven
module (with 1.0GHz NXP i.MX DualLite Cortex-A9 dual-core SoC)
1 x QSM-8Q60 evaluation carrier board (QSMDB2) 1 x DC power cable 1 x Console cable
Ordering Information
Part Number Description 10GEC10H40020
Qseven™ module with 1.0GHz NXP i.MX 6QuadPlus Cortex-A9, 4GB eMMC, 4MB SPI ROM, 2GB DDR3 SDRAM, HDMI, 4 x USB 2.0, USB OTG client, LVDS, 3 x COM (TX/RX), Gigabit Ethernet, 10/100Mbps Ethernet, 2 x CAN bus, PCIe x1, Micro SD card slot
10GEC10700020
Qseven™ module with 1.0GHz NXP i.MX 6DualLite Cortex-A9, 4GB eMMC, 4MB SPI ROM, 2GB DDR3 SDRAM, HDMI, 4 x USB 2.0, USB OTG client, LVDS, 3 x COM (TX/RX), Gigabit Ethernet, 10/100Mbps Ethernet, 2 x CAN bus, PCIe x1, Micro SD card slot
10GFL00000020
QSM-8Q60 evaluation carrier board (QSMDB2) with CAN bus cable and DC power cable
Optional Accessories
Wireless Modules
Part Number Description
00GO27100BU2B0D0
VNT9271BU0DB IEEE 802.11 b/g/n USB Wi-Fi dongle
EMIO-1541-00A1
VNT9485 IEEE 802.11 b/g/n miniPCIe Wi-Fi module with assembly kit
and antenna
EMIO-2531-00A1
VAB-820-W-M IEEE 802.11 b/g/n miniPCIe Wi-Fi & Bluetooth module with assembly kit and antenna
EMIO-2550-00A1
3.75G HSPA/UMTS mobile broadband full size miniPCIe module with GPS, SIM card slot, assembly kit and antenna
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Table of Contents
1. Product Overview ........................................................................................................................ 1
1.1. Key Features ........................................................................................................................................................ 1
1.2. Product Specifications ...................................................................................................................................... 2
1.3. Layout Diagram .................................................................................................................................................. 4
1.4. Product Dimensions .......................................................................................................................................... 5
2. Onboard Slot ................................................................................................................................ 6
2.1. Micro SD Card Slot ........................................................................................................................................... 6
3. Onboard Jumpers ......................................................................................................................... 7
3.1. Micro SD/SPI Boot Select Jumper .................................................................................................................. 8
4. Hardware Installation .................................................................................................................. 9
4.1. Installing the QSM-8Q60 Module on the QSMDB2 Carrier Board ........................................................ 9
5. Software and Technical Supports ........................................................................................... 12
5.1. Linux Support .................................................................................................................................................. 12
5.1.1. Driver Installation .................................................................................................................................... 12
5.2. Technical Supports and Assistance ............................................................................................................ 12
Appendix A. QSMDB2 Carrier Board Reference ........................................................................... 13
A.1. Board Specifications .......................................................................................................................................... 13
A.2. QSMDB2 External I/O Connectors ................................................................................................................ 14
A.2.1. Front Panel I/O ............................................................................................................................................ 14
A.3. QSMDB2 Layout Diagram................................................................................................................................. 14
A.3.1. QSMDB2 Onboard Connectors, Slots and Pin Headers ................................................................... 15
A.3.1.1. Qseven MXM Connector ................................................................................................................ 15
A.3.1.2. Audio Pin Header ............................................................................................................................. 18
A.3.1.3. Touch Panel Connector .................................................................................................................. 18
A.3.1.4. RTC Battery Connector ................................................................................................................... 19
A.3.1.5. DC-In Connector .............................................................................................................................. 19
A.3.1.6. COM Pin headers ............................................................................................................................. 20
A.3.1.7. Serial and I2C Pin Header ............................................................................................................... 21
A.3.1.8. CAN Bus Connector ........................................................................................................................ 22
A.3.1.9. GPIO Pin Header .............................................................................................................................. 23
A.3.1.10. LVDS Panel Connector ................................................................................................................. 24
A.3.1.11. LVDS Inverter Connector ............................................................................................................. 25
A.3.1.12. MiniPCIe Slot .................................................................................................................................. 26
A.3.1.13. SIM Card Slot .................................................................................................................................. 27
A.3.2. QSMDB2 Onboard Jumpers .................................................................................................................... 28
A.3.2.1. Backlight and Panel Power Select Jumper ................................................................................. 28
Appendix B. Installing Wireless Accessories ............................................................................... 29
B.1. Inserting VNT9271 USB Wi-Fi Dongle ........................................................................................................... 29
B.2. Installing EMIO-1541 miniPCIe Wi-Fi Module ............................................................................................. 30
B.3. Installing EMIO-2531 miniPCIe Wi-Fi + Bluetooth Module ..................................................................... 32
B.4. Installing EMIO-2550 miniPCIe Mobile Broadband Module .................................................................... 34
Appendix C. Inserting SIM Card...................................................................................................... 37
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List of Figures
Figure 1: Layout diagram of the QSM-8Q60 (top side) ..............................................................................................4
Figure 2: Layout diagram of the QSM-8Q60 (bottom side) .......................................................................................4
Figure 3: Dimensions of the QSM-8Q60 module (top view) ....................................................................................5
Figure 4: Dimensions of the QSM-8Q60 attached to the carrier board (top view) .............................................5
Figure 5: Dimensions of the QSMDB2 external I/O .....................................................................................................5
Figure 6: Micro SD card slot diagram ..............................................................................................................................6
Figure 7: Jumper settings example ...................................................................................................................................7
Figure 8: Micro SD/SPI boot select jumper diagram ....................................................................................................8
Figure 9: Mounting points and Qseven MXM connector ............................................................................................9
Figure 10: Installing the hex spacers on the QSMDB2 carrier board .......................................................................9
Figure 11: Installing QSM-8Q60 module .................................................................................................................... 10
Figure 12: Securing the QSM-8Q60 module .............................................................................................................. 10
Figure 13: Installing the heatsink ................................................................................................................................... 11
Figure 14: Securing the heatsink .................................................................................................................................... 11
Figure 15: QSMDB2 front panel I/O ............................................................................................................................. 14
Figure 16: QSMDB2 layout label (top side) ............................................................................................................... 14
Figure 17: QSMDB2 layout label (bottom side) ........................................................................................................ 14
Figure 18: Qseven MXM connector diagram .............................................................................................................. 15
Figure 19: Audio pin header diagram ........................................................................................................................... 18
Figure 20: Touch panel connector diagram ................................................................................................................ 18
Figure 21: RTC battery connector diagram .................................................................................................................. 19
Figure 22: DC-in connector diagram ............................................................................................................................. 19
Figure 23: COM4, COM 5, COM 6 and COM 7 pin header diagram .................................................................... 20
Figure 24: Serial and I2C pin header diagram ............................................................................................................. 21
Figure 25: CAN bus connector diagram ...................................................................................................................... 22
Figure 26: GPIO pin header diagram ............................................................................................................................ 23
Figure 27: LVDS panel connector diagram.................................................................................................................. 24
Figure 28: LVDS inverter connector diagram .............................................................................................................. 25
Figure 29: MiniPCIe slot diagram ................................................................................................................................... 26
Figure 30: SIM card slot diagram ................................................................................................................................... 27
Figure 31: Backlight and Panel power select jumper diagram ............................................................................... 28
Figure 32: Inserting VNT9271 USB Wi-Fi dongle ....................................................................................................... 29
Figure 33: Installing hex standoff screw for EMIO-1541 module .......................................................................... 30
Figure 34: Installing EMIO-1541 module ..................................................................................................................... 30
Figure 35: Securing EMIO-1541 module...................................................................................................................... 30
Figure 36: Installing Wi-Fi antenna of EMIO-1541 module ..................................................................................... 31
Figure 37: Connecting Wi-Fi antenna cable to the EMIO-1541 module .............................................................. 31
Figure 38: Removing screw on the EMIO-2531 module .......................................................................................... 32
Figure 39: Installing EMIO-2531 module ..................................................................................................................... 32
Figure 40: Securing EMIO-2531 module...................................................................................................................... 32
Figure 41: Installing Wi-Fi antenna of EMIO-2531 module ..................................................................................... 33
Figure 42: Connecting Wi-Fi antenna cable to the EMIO-2531 module .............................................................. 33
Figure 43: Connecting GPS antenna cable to the EMIO-2550 module ................................................................ 34
Figure 44: Installing EMIO-2550 module ..................................................................................................................... 34
Figure 45: Securing EMIO-2550 module...................................................................................................................... 35
Figure 46: Connecting 3G antenna cable to the EMIO-2550 module .................................................................. 35
Figure 47: Installing 3G and GPS antenna of EMIO-2550 module ........................................................................ 36
Figure 48: Inserting SIM card on QSMDB2 carrier board ......................................................................................... 37
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List of Tables
Table 1: Micro SD card slot pinout .................................................................................................................................6
Table 2: Micro SD/SPI boot select jumper settings .....................................................................................................8
Table 3: Qseven MXM connector pinout .................................................................................................................... 17
Table 4: Audio pin header pinout ................................................................................................................................. 18
Table 5: Touch panel connector pinout ...................................................................................................................... 18
Table 6: RTC battery connector pinout ....................................................................................................................... 19
Table 7: DC-in connector pinout .................................................................................................................................. 19
Table 8: COM pin header pinout .................................................................................................................................. 20
Table 9: Serial and I2C pin header pinout ................................................................................................................... 21
Table 10: CAN bus connector pinout .......................................................................................................................... 22
Table 11: GPIO pin header pinout ................................................................................................................................ 23
Table 12: LVDS panel connector pinout ..................................................................................................................... 24
Table 13: LVDS inverter connector pinout ................................................................................................................. 25
Table 14: MiniPCIe slot pinout ...................................................................................................................................... 26
Table 15: SIM card slot pinout ...................................................................................................................................... 27
Table 16: Backlight power select jumper settings .................................................................................................... 28
Table 17: Panel power select jumper settings ........................................................................................................... 28
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1. Product Overview
The VIA QSM-8Q60 is an ARM-based Qseven™ form factor module powered by a 1.0GHz NXP i.MX 6QuadPlus (or i.MX 6DualLite) Cortex-A9 SoC that delivers high performance and rich multimedia features in an ultra-compact package for a wide range of embedded system applications such as industrial automation, transportation, medical and infotainment.
Measuring 70mm x 70mm, the VIA QSM-8Q60 is fully compliant with the Qseven™ Rev. 2.0 embedded form factor standard adopted by the Standardization Group for Embedded Technologies e.V. (SGeT). Supporting a wide operating temperature of -20°C ~ 70°C, the VIA QSM-8Q60 is designed for optimum flexibility in the harshest environments.
The VIA QSM-8Q60 supports an onboard Micro SD card slot, 4GB eMMC Flash memory and 2GB DDR3 SDRAM, the module also offers rich I/O and display expansion options including four USB 2.0 ports, HDMI port, dual-channel 18/24-bit LVDS panel, three COM ports (TX/RX), Gigabit Ethernet, two CAN bus and PCIe x1.
The VIA QSM-8Q60 features a Linux BSP which includes the kernel and bootloader source codes. Other features include a Tool Chain to help make adjustments to the kernel and to support the VIA QSMDB2 carrier board I/O and other hardware features.
1.1. Key Features
Powered by 1.0GHz NXP i.MX 6QuadPlus or i.MX 6DualLite Cortex-A9 SoC
Qseven
Rev. 2.0 compliant
Supports one 18/24-bit dual-channel LVDS panel
Supports four USB 2.0 ports
Supports one Micro SD card slot
4GB onboard eMMC Flash memory
Wide operating temperature range: -20°C ~ 70°C
3.5” form factor carrier options
7-year longevity support
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1.2. Product Specifications
Processor
o 1.0GHz NXP i.MX 6QuadPlus Cortex-A9 quad-core SoC (QSM-8Q60-QP SKU) o 1.0GHz NXP i.MX 6DualLite Cortex-A9 dual-core SoC (QSM-8Q60 SKU)
System Memory
o 2GB DDR3 SDRAM
Storage
o 4GB eMMC Flash memory
Boot Loader
o 4MB SPI Flash ROM
Graphics
o Vivante GC2000+ GPU (QSM-8Q60-QP SKU)
Three Independent, integrated 3D/2D graphics processing units
Graphics engines support OpenGL
®
ES 2.0, OpenCL and OpenVG™ 1.1 hardware
acceleration
Support MPEG-2, VC1 and H.264 video decoding up to 1080p
Support SD encoding
o Vivante GC880 GPU (QSM-8Q60 SKU)
Two Independent, integrated 3D/2D graphics processing units
Graphics engines support OpenGL
®
ES 2.0, OpenVG™ 1.1 hardware acceleration
Support MPEG-2, VC1 video decoding up to 1080p
LAN
o Micrel KSZ9031RNX Gigabit Ethernet Transceiver with RGMII support
Audio
o I2S Audio Interface
HDMI
o Integrated HDMI Transmitter
USB
o SMSC USB2514 USB 2.0 High Speed 4-port hub controller
Supported Expansion I/O
o 1 x PCIe x1
Supported I/O
o 4 x USB 2.0 ports o 1 x USB OTG client o 1 x HDMI port o 1 x Dual-channel 18/24-bit LVDS panel connector o 1 x PWM o 3 x COM (TX/RX) ports o 1 x Gigabit Ethernet port o 2 x CAN bus o 1 x I2S o 1 x SPI o 1 x SDIO/GPIO o 1 x I
2
C
Onboard I/O
o 1 x Micro SD card slot (supports up to 32GB)
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Onboard Jumper
o 1 x Micro SD/SPI boot select jumper
Operating Temperature
o -20°C ~ 70°C
Operating Humidity
o 0% ~ 95% (non-condensing)
Form Factor
o
70mm x 70mm (2.76” x 2.76”)
Compliance
o Qseven
Rev. 2.0 module
Operating System
o Linux Kernel 4.1.15 (QSM-8Q60-QP SKU) o Linux Kernel 3.14.28 (QSM-8Q60 SKU)
Notes:
1. As the operating temperature provided in the specifications is a result of the test performed in VIA’s chamber, a number of variables can influence this result. Please note that the working temperature may vary depending on the actual situation and environment. It is highly suggested to execute a solid testing and take all the variables into consideration when building the system. Please ensure that the system runs well under the operating temperature in terms of application.
2.. Please note that the lifespan of the onboard eMMC memory chip may vary depending on the amount of
access. More frequent and larger data access on eMMC memory makes its lifespan shorter. Therefore, it is highly recommended to use a replaceable external storage (e.g., Micro SD card) for large data access.
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1.3. Layout Diagram
Micro SD card slot
eMMC
DDR3 SDRAM
NXP i.MX 6DualLite
Cortex A9 dual core SoC
Micro SD/SPI
boot select jumper
Figure 1: Layout diagram of the QSM-8Q60 (top side)
DDR3 SDRAM
Figure 2: Layout diagram of the QSM-8Q60 (bottom side)
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1.4. Product Dimensions
70mm
70mm
Figure 3: Dimensions of the QSM-8Q60 module (top view)
QSMDB2
137.19mm
95.24mm
3mm
102mm
3.68mm
146mm
Figure 4: Dimensions of the QSM-8Q60 attached to the carrier board (top view)
11.19mm
0.00
37.88mm
63.48mm
82.63mm
101.66mm
121.01mm
Figure 5: Dimensions of the QSMDB2 external I/O
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2. Onboard Slot
This chapter provides information about the QSM-8Q60’s onboard slot.
2.1. Micro SD Card Slot
The QSM-8Q60 module comes with a Micro SD card slot. The Micro SD card slot offers expandable storage of Micro SD card memory up to 32GB capacity. The pinout of the Micro SD card slot is shown below.
Figure 6: Micro SD card slot diagram
Pin Signal
1 SD0DATA2 2 SD0DATA3 3 SD0CMD 4 VDD (3.3V) 5 SD0CLK 6 GND 7 SD0DATA0 8 SD0DATA1 9 SD0_CD
Table 1: Micro SD card slot pinout
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3. Onboard Jumpers
This section will explain how to configure the QSM-8Q60 to match the needs of your application by setting the jumpers.
Jumper Description A jumper consists of pair conductive pins used to close in or bypass an electronic circuit to set up or
configure particular feature using a jumper cap. The jumper cap is a small metal clip covered by plastic. It performs like a connecting bridge to short (connect) the pair of pins. The usual colors of the jumper cap are black/red/blue/white/yellow.
Basic Jumper Configuration There are two settings of the jumper pin: “
Short
and
Open
”. The pins are “
Short
” when a jumper cap is
placed on the pair of pins. The pins are ”
Open
” if the jumper cap is removed.
In addition, there are jumpers that have three or more pins, and some pins are arranged in series. In case of a jumper with three pins, place the jumper cap on pin 1 and pin 2 or pin 2 and 3 to
Short
it.
Some jumper size is small or mounted on the crowded location on the board that makes it difficult to access. Therefore, using a long-nose pliers in installing and removing the jumper cap is very helpful.
Figure 7: Jumper settings example
Caution:
Make sure to install the jumper cap on the correct pins. Installing it in the wrong pin might cause damage and malfunction.
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3.1. Micro SD/SPI Boot Select Jumper
The Micro SD/SPI boot select jumper labeled as “J11” is set to specify the boot device. The default setting is the Micro SD. The jumper settings are shown below.
Figure 8: Micro SD/SPI boot select jumper diagram
Setting Pin 1 Pin 2 Pin 3 Micro SD (default) Short Short Open SPI Open Short Short
Table 2: Micro SD/SPI boot select jumper settings
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4. Hardware Installation
This chapter provides information about hardware installation procedures.
4.1. Installing the QSM-8Q60 Module on the QSMDB2
Carrier Board
Step 1
Locate the mounting points and the Qseven MXM slot on the QSMDB2 carrier board.
Figure 9: Mounting points and Qseven MXM connector
Step 2
Install four 5mm hex spacers on the carrier board. From the bottom of the carrier board, tighten the hex spacers by using the M2.5x4mm screws.
QSMDB2
Hex spacer
M2.5x4mm screw
Top side
Bottom side
QSMDB2 carrier board
Figure 10: Installing the hex spacers on the QSMDB2 carrier board
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Step 3
Align the notch on the QSM-8Q60 module with the protruding wedge on the Qseven™ MXM connector then insert the module at 30° angle. Once the module has been inserted, push down the module until the screw holes align with the hole of hex spacers.
Figure 11: Installing QSM-8Q60 module
Step 4
Secure the QSM-8Q60 module with four 7mm hex spacer screws.
Figure 12: Securing the QSM-8Q60 module
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Step 5
Install the heatsink on the QSM-8Q60 module.
QSMDB2
Figure 13: Installing the heatsink
Step 6
Secure the heatsink with M2.5x4mm screws.
QSMDB2
Heatsink
QSM-8Q60 module
QSMDB2 carrier board
M2.5x4mm screw
Figure 14: Securing the heatsink
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5. Software and Technical Supports
5.1. Linux Support
The VIA QSM-8Q60 module is highly compatible with Linux Kernel operating system.
Linux Kernel 4.1.15 (QSM-8Q60-QP SKU)
Linux Kernel 3.14.28 (QSM-8Q60 SKU)
5.1.1. Driver Installation
Linux Driver Support
Linux drivers are provided through various methods including:
Drivers provided by VIA
Using a driver built into a distribution package
Visiting
www.viatech.com
for the latest updated drivers
Installing a third party driver (such as the ALSA driver from the Advanced Linux Sound
Architecture project for integrated audio)
5.2. Technical Supports and Assistance
For utilities downloads, latest documentation and new information about the QSM-8Q60, go to
http://www.viatech.com/en/boards/modules/qsm-8q60/
For technical support and additional assistance, always contact your local sales representative or
board distributor, or go to
http://www.viatech.com/en/about/contact/
to fill up the form request.
For OEM clients and system integrators developing a product for long term production, other
code and resources may also be made available. Contact VIA to submit a request.
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Appendix A. QSMDB2 Carrier Board
Reference
A.1. Board Specifications
Qseven™ Rev. 2.0 compliant
o Support QSM-8Q60 module
Audio
o NXP SGTL5000 low power stereo codec
Front Panel I/O
o 2 x USB 2.0 ports o 1 x HDMI port o 1 x COM port (TX/RX for debug) o 1 x Gigabit Ethernet LAN port o 1 x 10/100Mbps Ethernet port o 1 x Power LED indicator o 1 x Wi-Fi activity LED indicator o 1 x Reset button
Onboard connectors and pin headers
o 1 x Qseven
MXM connector
o 1 x GPIO pin header (16 GPI + 16 GPO) o 1 x CAN bus connector (supports two CAN bus) o 4 x COM pin headers (RS-232/RS-422/RS-485) o 1 x Serial and I
²
C pin header (supports two COM ports for TX/RX, and one I2C)
o 1 x Audio pin header (for Line-in, Line-out and Mic-in) o 1 x Touch panel connector o 1 x RTC battery connector o 1 x DC-in connector o 1 x Dual-channel 18/24-bit LVDS panel connector o 1 x LVDS inverter connector o 1 x miniPCIe slot o 1 x SIM card slot
Onboard Jumper
o 1 x Backlight and Panel power select jumper
Power Supply
o 15V ~ 24V DC-in
Form Factor and Dimension
o 3.5” Form Factor 14.6cm x 10.2cm (5.75” x 4.01”)
Operating Temperature
o -20°C ~ 70°C
Operating Humidity
o 0% ~ 95% (non-condensing)
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A.2. QSMDB2 External I/O Connectors
The QSMDB2 carrier board has a wide selection of interfaces. It includes a selection of frequently used ports as part of the external I/O coastline.
A.2.1. Front Panel I/O
COM 2
Reset button
Power LED
USB 2.0
Wi-Fi LEDHDMI
Gigabit Ethernet
10/100Mbps Ethernet
Figure 15: QSMDB2 front panel I/O
A.3. QSMDB2 Layout Diagram
QSMDB2
CAN bus
Audio
GPIO
DC-in
COM 7
COM 6
COM 4
COM 5
Serial and I C
2
RTC battery connector
Touch panel
Backlight and Panel
power select jumper
Qseven MXM
Figure 16: QSMDB2 layout label (top side)
O
L
O
MiniPCIe


SIM card slot
Figure 17: QSMDB2 layout label (bottom side)
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A.3.1. QSMDB2 Onboard Connectors, Slots and Pin Headers
A.3.1.1. Qseven MXM Connector
The Qseven MXM connector labeled as “J2” is an onboard connector for connecting the Qseven™ modules (e.g. QSM-8Q60 module) to the carrier board. The Qseven MXM connector is consists of 230­pins. The pinout of the Qseven MXM connector is shown below.
QSMDB2
1
J
2
2

1
Figure 18: Qseven MXM connector diagram
Pin Signal Pin Signal
1 GND 2 GND 3 TXRXM_D 4 TXRXM_C 5 TXRXP_D 6 TXRXP_C 7 NC 8 NC
9 TXRXM_B 10 TXRXM_A 11 TXRXP_B 12 TXRXP_A 13 LED2_LINK- 14 LED1_ACT­15 NC 16 GPIO_19_PLED 17 NC 18 USB_OTG_PWR_EN 19 NC 20 NC 21 NC 22 NC 23 GND 24 GND 25 GND 26 NC 27 NC 28 RESET_N 29 SATA0_TX+ 30 UART3_RX 31 SATA0_TX- 32 UART3_TX 33 SATA_ACT- 34 GND 35 SATA0_RX+ 36 UART3_-CTS 37 SATA0_RX- 38 UART3_-RTS 39 GND 40 GND 41 NC 42 SD1_CLK 43 SD1_CD- 44 SD1_LED 45 SD1_CMD 46 SD1_WP 47 SD1_PWR- 48 SD1_DATA1 49 SD1_DATA0 50 SD1_DATA3 51 SD1_DATA2 52 SD1_DATA5 53 SD1_DATA4 54 SD1_DATA7 55 SD1_DATA6 56 NC
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57 GND 58 GND 59 AUD4_TXFS 60 UART2_RX 61 GPIO_0_CLKO 62 UART2_TX 63 AUD4_TXC 64 NC 65 AUD4_TXD 66 I2C3_SCL 67 AUD4_RXD 68 I2C3_SDA 69 NC 70 NC 71 NC 72 WDOG_B 73 GND 74 GND 75 NC 76 NC 77 NC 78 NC 79 NC 80 USB_4_OC 81 NC 82 USBD_T4­83 NC 84 USBD_T4+ 85 USB_2_3_OC 86 USB_0_OTG_OC 87 USBD_T3- 88 USBD_T2­89 USBD_T3+ 90 USBD_T2+ 91 NC 92 USBD_OTG_ID 93 OTG_USBD_T1- 94 USBD_T0­95 OTG_USBD_T1+ 96 USBD_T0+ 97 GND 98 GND 99 LVDS0_TX0_P 100 LVDS1_TX0_P
101 LVDS0_TX0_N 102 LVDS1_TX0_N 103 LVDS0_TX1_P 104 LVDS1_TX1_P 105 LVDS0_TX1_N 106 LVDS1_TX1_N 107 LVDS0_TX2_P 108 LVDS1_TX2_P 109 LVDS0_TX2_N 110 LVDS1_TX2_N 111 LVDS_PPEN 112 LVDS_BLEN 113 LVDS0_TX3_P 114 LVDS1_TX3_P 115 LVDS0_TX3_N 116 LVDS1_TX3_N 117 GND 118 GND 119 LVDS0_CLK_P 120 LVDS1_CLK_P 121 LVDS0_CLK_N 122 LVDS1_CLK_N 123 LVDS_PWM2 124 NC 125 I2C1_SDA 126 USB_0_2_3_4_EN 127 I2C1_SCL 128 HDMI_CEC_IN 129 CAN_TX1 130 CAN_RX1 131 HDMI_CLKP 132 TP_2 133 HDMI_CLKM 134 TP_3 135 GND 136 GND 137 HDMI_D1P 138 NC 139 HDMI_D1M 140 NC 141 GND 142 GND 143 HDMI_D0P 144 NC 145 HDMI_D0M 146 NC 147 GND 148 GND 149 HDMI_D2P 150 I2C2_SDA 151 HDMI_D2M 152 I2C2_SCL 153 HDMI_HPD 154 GND 155 PCIe_CREFCLKP 156 PCIE_WAKE_B 157 PCIe_CREFCLKM 158 PCIE_RST_B 159 GND 160 GND 161 NC 162 NC
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163 NC 164 NC 165 GND 166 GND 167 NC 168 NC 169 NC 170 NC 171 UART1_TX 172 UART1_-RTS 173 NC 174 CAN_TX2 175 NC 176 CAN_RX2 177 UART1_RX 178 UART1_CTS 179 PCIe_CTXP 180 PCIe_CRXP 181 PCIe_CTXM 182 PCIe_CRXM 183 GND 184 GND 185 GPIO6_IO11 186 GPIO_7 187 GPIO_2 188 GPIO_8 189 GPIO6_IO14 190 GPIO6_IO7 191 GPIO_5 192 GPIO6_IO16 193 VDD_RTC_IN 194 NC 195 NC 196 PWM_OUT1 197 GND 198 GND 199 CSPI3_MOSI 200 CSPI3_CS0 201 CSPI3_MISO 202 CSPI3_CS1 203 CSPI3_CLK 204 NC 205 NC 206 NC 207 NC 208 NC 209 NC 210 NC 211 5VIN 212 NC 213 5VIN 214 5VIN 215 5VIN 216 5VIN 217 5VIN 218 5VIN 219 5VIN 220 5VIN 221 5VIN 222 5VIN 223 5VIN 224 5VIN 225 5VIN 226 5VIN 227 5VIN 228 5VIN 229 5VIN 230 5VIN
Table 3: Qseven MXM connector pinout
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A.3.1.2. Audio Pin Header
The QSMDB2 carrier board has an Audio pin header for Line-in, Line-out and and Mic-in. The pin header is labeled as “AUDIO1”. The pinout of the Audio pin header is shown below.
QSMDB2
1
AUDIO1: Audio pin header
1
Figure 19: Audio pin header diagram
Pin Signal Pin Signal
1 HEAD_RIGHT 2 HEAD_LEFT 3 LINE_IN_R 4 LINE_IN_L 5 MIC_IN 6 MIC_IN 7 8 NC 9 GND_ANALOG 10 GND_ANALOG
Table 4: Audio pin header pinout
A.3.1.3. Touch Panel Connector
The Touch panel connector labeled as “TOUCH_C1” is used to connect the touch sensor controller for 5­wire/4-wire touch panel. The pinout of the touch panel connector is shown below.
QSMDB2
1
TOUCH_C1: Touch Panel connector
1
Figure 20: Touch panel connector diagram
Pin Signal
1 GND 2 I2C1_SDA 3
I2C1_SCL
4
5VIN 5 GPIO_2 6 GPIO6_IO11 7 3P3V
Table 5: Touch panel connector pinout
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A.3.1.4. RTC Battery Connector
The QSMDB2 carrier board is equipped with onboard RTC battery connector used for connecting the external cable battery that provides power to the 32.768 KHz crystal oscillator for Real Time Clock (RTC). The RTC battery connector is labeled as “J3”. The connector pinout is shown below.
QSMDB2
1
!"# $%& '())*+, -.//*-).+
0
Figure 21: RTC battery connector diagram
Pin Signal
1 VDD_RTC 2
GND
Table 6: RTC battery connector pinout
A.3.1.5. DC-In Connector
The QSMDB2 carrier board supports DC-in connector to provide power to the system. The 2-pin DC-in connector is used to connect the DC-in power jack. The connector is labeled as “J6”. The pinout of the DC-in connector is shown below.
QSMDB2
1
345 D6789 :;99<:=;>
?
Figure 22: DC-in connector diagram
Pin Signal
1 DCIN 2 GND
Table 7: DC-in connector pinout
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A.3.1.6. COM Pin headers
The QSMDB2 carrier board is equipped with four COM pin headers labeled as “COM4, COM5, COM6 and COM7” that supports RS-232/RS-422/RS-485 mode. The pinouts of COM pin headers are shown below.
QSMDB2
1
C@ABE C
OM 4 pin header
F
C@AGE C
OM 5 pin header
H
H
H
H
F
C@AIE C
OM 6 pin header
F
C@AKE C
OM 7 pin header
Figure 23: COM4, COM 5, COM 6 and COM 7 pin header diagram
Pin Signal Pin Signal
1 IC_DCD1 2 IC_RXD1 3 IC_TXD1 4 IC_DTR1 5 GND 6 IC_DSR1 7 IC_RTS1 8 IC_CTS1 9 COM_RI1 10
Table 8: COM pin header pinout
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A.3.1.7. Serial and I
2
C Pin Header
The QSMDB2 carrier board is equipped with Serial and I2C pin header labeled as “COM1_3”. The Serial and I2C pin header can support two COM ports (COM 1 and COM 3) used for TX/RX only, and one I2C device. The pinout of Serial and I2C pin header is shown below.
QSMDB2
1
1
MNPQRST
Serial and I C pin header
2
Figure 24: Serial and I2C pin header diagram
Pin Signal Pin Signal
1 COM_TXD1 2 COM_TXD3 3 COM_RXD1 4 COM_RXD3 5 GND 6 GND 7 GND 8 I2C3_SDA 9 10 I2C3_SCL
Table 9: Serial and I2C pin header pinout
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A.3.1.8. CAN Bus Connector
The QSMDB2 carrier board provides CAN bus connector that support CAN protocol specification Version
2.0B. The onboard CAN bus connector labeled as “CANBUS” supports two CAN bus ports. The pinout of the CAN bus connector is shown below.
Figure 25: CAN bus connector diagram
Pin Signal
1
NC 2 NC 3 NC 4 CANH1 5 NC 6 GND 7 CANL2 8 CANH2 9 GND
10 CANL1
Table 10: CAN bus connector pinout
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A.3.1.9. GPIO Pin Header
The QSMDB2 carrier board provides GPIO pin header labeled as “GPIO”. The 32 digital inputs and outputs can be programmed to read or control devices, with input or output defined. The GPIO pin header supports up to 16 GPI and 16 GPO signals. The pinout of the GPIO pin header is shown below.
Figure 26: GPIO pin header diagram
Pin Signal Pin Signal
1 GPIO0 2 GPIO4 3 GPIO1 4 GPIO5 5 GPIO2 6 GPIO6 7 GPIO3 8 GPIO7
9 GND 10 GND 11 GPIO10 12 GPIO14 13 GPIO11 14 GPIO15 15 GPIO12 16 GPIO16 17 GPIO13 18 GPIO17 19 GND 20 — 21 GPIO20 22 GPIO24 23 GPIO21 24 GPIO25 25 GPIO22 26 GPIO26 27 GPIO23 28 GPIO27 29 GND 30 GND 31 GPIO30 32 GPIO34 33 GPIO31 34 GPIO35 35 GPIO32 36 GPIO36 37 GPIO33 38 GPIO37 39 GND 40 GND
Table 11: GPIO pin header pinout
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A.3.1.10. LVDS Panel Connector
The QSMDB2 carrier board supports an onboard 40-pin LVDS connector used for connecting the panel’s LVDS cable directly to support LVDS panel without any need of a daughter card. The connector is labeled as “LVDS1”. The pinout of the LVDS connector is shown below.
U
V
W
X
Y
U
Z
[
LVDS1: LVDS panel connector
1
1
1
Figure 27: LVDS panel connector diagram
Pin Signal Pin Signal
1 LVDS1_TX0_NC 2 PVDD 3 LVDS1_TX0_PC 4 PVDD 5 GND 6 GND 7 LVDS1_TX1_NC 8 GND
9 LVDS1_TX1_PC 10 LVDS0_TX0_NC 11 GND 12 LVDS0_TX0_PC 13 LVDS1_TX2_NC 14 GND 15 LVDS1_TX2_PC 16 LVDS0_TX1_NC 17 GND 18 LVDS0_TX1_PC 19 LVDS1_CLK_NC 20 GND 21 LVDS1_CLK_PC 22 LVDS0_TX2_NC 23 GND 24 LVDS0_TX2_PC 25 LVDS1_TX3_NC 26 GND 27 LVDS1_TX3_PC 28 LVDS0_CLK_NC 29 GND 30 LVDS0_CLK_PC 31 5VIN 32 GND 33 3P3V 34 LVDS0_TX3_NC 35 NC 36 LVDS0_TX3_PC 37 NC 38 LVDS0_EDID_SCL 39 NC 40 LVDS0_EDID_SDA
Table 12: LVDS panel connector pinout
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A.3.1.11. LVDS Inverter Connector
The QSMDB2 carrier board provides LVDS inverter connector located on the bottom side of the board for supplying power to the backlight of the LCD panel. The connector is labeled as “INVERTER1”. The pinout of the LVDS inverter connector is shown below.
\
]
^
_
`
\
a
b
c
defghighjk dlmnopno qrllnqpro
j
c
Figure 28: LVDS inverter connector diagram
Pin Signal
1 IVDD 2 IVDD 3 LVDS_EN 4 DISP0_CONTRAST 5 LVDS_EN 6 DISP0_CONTRAST 7 GND 8 GND
Table 13: LVDS inverter connector pinout
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A.3.1.12. MiniPCIe Slot
The QSMDB2 carrier board is equipped with miniPCIe slot labeled as “MINIPCIE1”. The miniPCIe slot is for 3G module to provide a 3G function. The pinout of the MiniPCIe slot is shown below.
s
t
u
v
w
s
x
y
2
1
52
51
z{|{}~{ z}~{
e slot
Figure 29: MiniPCIe slot diagram
Pin Signal Pin Signal
1 PCIE_WAKE_B 2 MPCIE_3V3 3 NC 4 GND 5 NC 6 DDR_1_5V 7 NC 8 USIM_VCC
9 GND 10 USIM_DATA 11 PCIe_CREFCLKM 12 USIM_CLK 13 PCIe_CREFCLKP 14 USIM_RST 15 GND 16 USIM_VCC 17 NC 18 GND 19 NC 20 NC 21 GND 22 PCIE_RST_B 23 PCIe_CRXM 24 MPCIE_3V3 25 PCIe_CRXP 26 GND 27 GND 28 DDR_1_5V 29 GND 30 PCIe_SMB_CLK 31 PCIe_CTXM 32 PCIe_SMB_DATA 33 PCIe_CTXP 34 GND 35 GND 36 PCIE_USB_DM 37 GND 38 PCIE_USB_DP 39 MPCIE_3V3 40 GND 41 MPCIE_3V3 42 LED_WWAN_B 43 GND 44 LED_WLAN_B 45 NC 46 LED_WPAN_B 47 NC 48 DDR_1_5V 49 NC 50 GND 51 NC 52 MPCIE_3V3
Table 14: MiniPCIe slot pinout
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A.3.1.13. SIM Card Slot
The QSMDB2 carrier board is equipped with SIM card slot located on the bottom side of the board which can supports a 3G SIM card. Using the SIM card slot on QSMDB2 requires a 3G module installed in the MiniPCIe slot to enable the 3G function, otherwise the SIM card slot is disabled. The SIM card slot is labeled as “SIM1”. The pinout of the SIM card slot is shown below.

1
1
Figure 30: SIM card slot diagram
Pin Signal
1 USIM_DATA 2 USIM_CLK 3 USIM_VCC 4 USIM_RST 5 GND 6 USIM_VCC
Table 15: SIM card slot pinout
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A.3.2. QSMDB2 Onboard Jumpers
A.3.2.1. Backlight and Panel Power Select Jumper
The power selectors for backlight and panel are controlled by the jumper labeled as “J1”. It can select either +12V or +5V for backlight power and +3.3V or +5V for panel power. The jumper settings are shown below.
QSMDB2
2
1
4
6
3
5
 ¡¢£¤
+5V
Backlight power select settings
+3.3V (default)
+5V
Panel power select settings
J1: Backlight and Panel power select jumper
1 1
1 1
1
Figure 31: Backlight and Panel power select jumper diagram
Setting Pin 1 Pin 3 Pin 5 +12V (default) Short Short Open +5V Open Short Short
Table 16: Backlight power select jumper settings
Setting Pin 2 Pin 4 Pin 6 +3.3V (default) Short Short Open +5V Open Short Short
Table 17: Panel power select jumper settings
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Appendix B. Installing Wireless Accessories
This section provides information on how to install the optional wireless accessories to provide wireless connection such as Wi-Fi, Bluetooth, GPS and 3G.
B.1. Inserting VNT9271 USB Wi-Fi Dongle
Step 1
Locate a USB 2.0 port on the front panel I/O of the QSMDB2 carrier board.
Step 2
Insert the VNT9271 dongle in one of the USB 2.0 port.
Figure 32: Inserting VNT9271 USB Wi-Fi dongle
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B.2. Installing EMIO-1541 miniPCIe Wi-Fi Module
Step 1
Locate the miniPCIe slot and install the hex standoff screw to the QSMDB2 carrier board.
Carrier Board (Q
SMDB2)
Figure 33: Installing hex standoff screw for EMIO-1541 module
Step 2
Align the notch on the EMIO-1541 module with the protruding wedge on the miniPCIe slot then insert the module at 30° angle.
Carrier Board (Q
SMDB2)
30
Figure 34: Installing EMIO-1541 module
Step 3
Once the module has been inserted, push down the module until the screw hole align with the mounting hole on the hex standoff. Secure the module with screw to the standoff.
Carrier Board (Q
SMDB2)
Figure 35: Securing EMIO-1541 module
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Step 4
Insert the Wi-Fi antenna cable into the antenna hole from inside of the chassis. Insert the washer, and fasten it with the nut. Then install the external antenna.
SS
1
2
3
4
P
a
nel
I/O pl
a
te
Figure 36: Installing Wi-Fi antenna of EMIO-1541 module
Step 5
Connect the other end of the Wi-Fi antenna cable onto the micro-RF connector labeled “TRX” on the EMIO-1541 module.
Carrier Board (QSMDB2)
Figure 37: Connecting Wi-Fi antenna cable to the EMIO-1541 module
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B.3. Installing EMIO-2531 miniPCIe Wi-Fi + Bluetooth
Module
Step 1
Take off the screw and nut on the EMIO-2531 as shown in the illustration.
Figure 38: Removing screw on the EMIO-2531 module
Step 2
Align the notch on the EMIO-2531 module with the protruding wedge on the miniPCIe slot then insert the module at 30° angle.
Carrier Board (Q
SMDB2)
30
Figure 39: Installing EMIO-2531 module
Step 3
Once the module has been inserted, push down the module until the screw hole align with the mounting hole on the standoff. Reinstall the screw to secure the module to the standoff.
Carrier Board (Q
SMDB2)
Figure 40: Securing EMIO-2531 module
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Step 4
Insert the Wi-Fi antenna cable into the antenna hole from inside of the chassis. Insert the washer, fasten it with the nut and install the external antenna.
SS
1
2
3
4
P
a
nel
I/O p
l
a
te
Figure 41: Installing Wi-Fi antenna of EMIO-2531 module
Step 5
Gently connect the other end of the Wi-Fi antenna cable to the micro-RF connector labeled “MH2” on the EMIO-2531 module.
Carrier Board (Q
SMDB2)
Figure 42: Connecting Wi-Fi antenna cable to the EMIO-2531 module
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B.4. Installing EMIO-2550 miniPCIe Mobile Broadband
Module
Step 1
Insert the SIM card on the bottom side of the EMIO-2550 module. (EMIO-2550-00A1)
Step 2
Connect first the other end of the GPS antenna cable to the micro-RF connector labeled “GPS” on the bottom side of EMIO-2550 module. Insert the 3G and GPS antenna cables into the antenna holes from inside of the chassis then insert their respective washers, and fasten it with the nut.
Panel I/O plate
1
2
3
Figure 43: Connecting GPS antenna cable to the EMIO-2550 module
Step 3
Align the notch on the EMIO-2550 module with the protruding wedge on the miniPCIe slot then insert the module at 30° angle.
Carrier Board (Q
SMDB2)
Figure 44: Installing EMIO-2550 module
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Step 4
Once the module has been inserted, push down the module until the screw hole align with the mounting hole on the standoff. Secure the module with the screw to the standoff.
Carrier Board (Q
SMDB2)
Figure 45: Securing EMIO-2550 module
Step 5
Connect the other end of the 3G antenna cable onto the micro-RF connector labeled “MAN” on the EMIO-2550 module.
Carrier Board (Q
SMDB2)
Carrier Board (Q
SMDB2)
Figure 46: Connecting 3G antenna cable to the EMIO-2550 module
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Step 6
Install the 3G and GPS external antennas respectively.
Carrier Board (Q
SMDB2)
Figure 47: Installing 3G and GPS antenna of EMIO-2550 module
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Appendix C. Inserting SIM Card
This section provides information on how to insert the SIM card on the QSMDB2 carrier board.
Step 1
Push back firmly the SIM card slot to unlock the opening.
Step 2
Pull up the slot and place the SIM card inside the slot. Ensure the angled corner of the SIM card is placed in the correct way before closing the slot.
Step 3
Gently close the slot by pulling down the SIM slot.
Step 4
Lock the SIM slot by sliding back the slot.
Carrier Board (QSMDB2)
1 2 3 4
Figure 48: Inserting SIM card on QSMDB2 carrier board
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