VIA Technologies EPIA-E900 User Manual

USER MANUAL

EPIA-E900

Pico-ITXe board

1.00-10082015-144100

Copyright

Copyright © 2015 VIA Technologies Incorporated. All rights reserved.

No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language,
in any form or by any means, electronic, mechanical, magnetic, optical, chemical, manual or otherwise without the prior written
permission of VIA Technologies, Incorporated.

Trademarks

All trademarks are the property of their respective holders.

Disclaimer

No license is granted, implied or otherwise, under any patent or patent rights of VIA Technologies. VIA Technologies makes no
warranties, implied or otherwise, in regard to this document and to the products described in this document. The information
provided in this document is believed to be accurate and reliable as of the publication date of this document. However, VIA
Technologies assumes no responsibility for the use or misuse of the information (including use or connection of extra
device/equipment/add-on card) in this document and for any patent infringements that may arise from the use of this document.
The information and product specifications within this document are subject to change at any time, without notice and without
obligation to notify any person of such change.

VIA Technologies, Inc. reserves the right the make changes to the products described in this manual at any time without prior
notice.

Regulatory Compliance

FCC

FCC----A Radio Frequency I

A Radio Frequency Interference Statement

FCCFCC

A Radio Frequency IA Radio Frequency I
This equipment has been tested and found to comply with the limits for a class A digital device, pursuant to part 15 of the FCC
rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a
commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in
accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a
residential area is likely to cause harmful interference, in which case the user will be required to correct the interference at his
personal expense.

Notice 1

Notice 1

Notice 1Notice 1
The changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.

Notice 2

Notice 2

Notice 2Notice 2
Shielded interface cables and A.C. power cord, if any, must be used in order to comply with the emission limits.

Notice 3

Notice 3

Notice 3Notice 3
The product described in this document is designed for general use, VIA Technologies assumes no responsibility for the conflicts
or damages arising from incompatibility of the product. Check compatibility issue with your local sales representatives before
placing an order.

nterference Statement

nterference Statement nterference Statement

Tested To Comply
With FCC Standards
FOR HOME OR OFFICE USE

Battery Recycling and Disposal



Only use the appropriate battery specified for this product.



Do not re-use, recharge, or reheat an old battery.



Do not attempt to force open the battery.



Do not discard used batteries with regular trash.



Discard used batteries according to local regulations.

Safety Precautions



Always read the safety instructions carefully.



Keep this User's Manual for future reference.



All cautions and warnings on the equipment should be noted.



Keep this equipment away from humidity.



Lay this equipment on a reliable flat surface before setting it up.



Make sure the voltage of the power source and adjust properly 110/220V before connecting
the equipment to the power inlet.



Place the power cord in such a way that people cannot step on it.



Always unplug the power cord before inserting any add-on card or module.



If any of the following situations arises, get the equipment checked by authorized service
personnel:



The power cord or plug is damaged.



Liquid has penetrated into the equipment.



The equipment has been exposed to moisture.



The equipment has not worked well or you cannot get it work according to User's Manual.



The equipment has dropped and damaged.



The equipment has obvious sign of breakage.



Do not leave this equipment in an environment unconditioned or in a storage temperature
above 60°C (140°F). The equipment may be damaged.



Do not leave this equipment in direct sunlight.



Never pour any liquid into the opening. Liquid can cause damage or electrical shock.



Do not place anything over the power cord.



Do not cover the ventilation holes. The openings on the enclosure protect the equipment
from overheating

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Box Contents

EPIA

EPIA----E900

E900----11112QE

E900E900

2QE

2QE2QE

EPIAEPIA



1 x EPIA-E900 embedded board



1 x SATA data cable



1 x SATA power cable



1 x DC-In power cable

Ordering Information

Model Nam

Model Nameeee Description

Model NamModel Nam
EPIA

EPIA----E900

E900----12QE

EPIAEPIA

12QE Pico-ITXe board with 1.2 GHz VIA Eden® X4 processor, Mini

E900E900

12QE12QE

Description

DescriptionDescription

HDMI, 2 x USB 3.0, 2 x USB 2.0, 2 x COM, 2 x Gigabit Ethernet,
SATA and 12V DC-In

Optional Accessories

Wireless Accessories

Wireless Accessories

Wireless AccessoriesWireless Accessories

Model Number

Model Number Description

Model NumberModel Number
EMIO-1533-00A2 VNT9271 IEEE 802.11b/g/n USB WiFi module with assembly kit

Description

DescriptionDescription

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Table of Contents

1.

1. Product Overview

Product Overview................................

1.1.

Product OverviewProduct Overview

1.1.

Key Features and Benefits ........................................................................... 1

1.1.1. VIA Eden® X4 Processor ....................................................................... 1

1.1.2. VIA VX11H MSP Chipset....................................................................... 2

1.1.3. Expansion Option ................................................................................... 2

1.2.

Product Specifications................................................................................. 3

1.3.

Layout Diagram ............................................................................................. 6

1.4.

Dimensions .................................................................................................... 8

1.5.

Height Distribution....................................................................................... 9

2.

2. I/O Interface

I/O Interface................................

2.2.

I/O InterfaceI/O Interface

2.1.

External I/O Ports ....................................................................................... 10

2.1.1. LED Indicators........................................................................................ 11

2.1.2. Power Button ......................................................................................... 11

2.1.3. COM Connector.................................................................................... 12

2.1.4. USB 3.0 Port ........................................................................................... 13

2.1.5. Gigabit Ethernet Port............................................................................14

2.1.6. Mini HDMI® Port.................................................................................... 15

2.1.7. USB 2.0 Port ........................................................................................... 16

2.2.

Onboard Connectors ................................................................................17

2.2.1. DC-In Power Connector ...................................................................... 17

2.2.2. SATA Connector ...................................................................................18

2.2.3. SATA Power Connector ...................................................................... 19

2.2.4. SPI Pin Header ....................................................................................... 20

2.2.5. CPU Fan Connector ..............................................................................21

2.2.6. CMOS Battery Connector.................................................................... 22

2.2.7. WLAN Connector ................................................................................. 23

2.2.8. LPC Connector....................................................................................... 24

................................................................

................................................................

................................................................

................................................................

................................................................

................................................................

................................................................

................................................................

................................ 1111

................................................................

........................................

................................................................

........ 10

10

................

1010

3.

3. Jumpers

Jumpers ................................

3.3.

JumpersJumpers

3.1.

3.2.

4.

4. Expansion Connectors

Expansion Connectors................................

4.4.

Expansion ConnectorsExpansion Connectors

4.1.

4.2.

4.2.1. Installing a Memory Module .............................................................. 33

4.2.2. Removing a Memory Module ............................................................. 34

................................................................

................................................................

Clear CMOS Jumper.................................................................................. 26

AT/ATX Power Mode Select Jumper .................................................... 27

MXM Connector ......................................................................................... 28

DDR3 SODIMM Memory Socket............................................................. 32

................................................................

................................................................

................................................................

................................................................

...............................................

................................................................

.......................................................

................................................................

............... 25

..............................

....................... 28

..............................................

25

2525

28

2828

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5.

5. Hardware Installation

Hardware Installation ................................

5.5.

Hardware InstallationHardware Installation

5.1.

Installing into a Chassis............................................................................. 35

5.1.1. Suggested minimum chassis dimensions .........................................35

5.1.2. Suggested minimum chassis height................................................... 36

5.1.3. Suggested keepout areas .................................................................... 37

6666.... BIOS Setup Utility

BIOS Setup Utility ................................

BIOS Setup UtilityBIOS Setup Utility

6.1.

Entering the BIOS Setup Utility............................................................... 38

6.2.

Control Keys................................................................................................ 38

6.3.

Getting Help................................................................................................38

6.4.

System Overview........................................................................................39

6.4.1. BIOS Information................................................................................... 39

6.4.2. Memory Information ............................................................................. 39

6.4.3. System Language................................................................................... 39

6.4.4. System Date............................................................................................40

6.4.5. System Time ........................................................................................... 40

6.5.

Advanced Settings ..................................................................................... 41

6.5.1. ACPI Settings.......................................................................................... 42

6.5.2. S5 RTC Wake Settings .......................................................................... 43

6.5.3. CPU Configuration ................................................................................44

6.5.4. SATA Configuration.............................................................................. 45

6.5.5. USB Configuration................................................................................. 46

6.5.6. F81801 Super IO Configuration ......................................................... 48

6.5.7. F81801 H/W Monitor ...........................................................................49

6.5.8. Clock Generator Configuration..........................................................50

6.6.

OnBoard Device Configuration ............................................................... 51

6.6.1. S5 Wakeup by PME# ............................................................................ 51

6.7.

Chipset Settings ..........................................................................................52

6.7.1. DRAM Configuration ............................................................................53

6.7.2. Video Configuration ............................................................................. 55

6.7.3. PMU_ACPI Configuration .................................................................... 56

6.7.4. Others Configuration............................................................................58

6.8.

Boot Settings ............................................................................................... 59

6.8.1. Boot Configuration................................................................................59

6.8.2. Boot Option Priorities .......................................................................... 60

6.9.

Security ......................................................................................................... 61

6.9.1. Security Settings ....................................................................................61

6.10. Save & Exit ................................................................................................... 62

6.10.1. Save Changes and Exit ......................................................................... 62

6.10.2. Discard Changes and Exit....................................................................62

6.10.3. Save Changes and Reset ...................................................................... 62

................................................................

................................................................

................................................................

................................................................

........................................................

................................................................

..............................................................

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................................................

.............................. 38

............................................................

35

3535

38

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6.10.4. Discard Changes and Reset................................................................. 62

6.10.5. Save Changes ......................................................................................... 63

6.10.6. Discard Changes.................................................................................... 63

6.10.7. Save as User Defaults........................................................................... 63

6.10.8. Restore User Defaults .......................................................................... 63

7.

7. Software and Technical Supports

Software and Technical Supports ................................

7.7.

Software and Technical SupportsSoftware and Technical Supports

7.1.

Microsoft and Linux Support ................................................................... 64

7.1.1. Driver Installation.................................................................................. 64

7.2.

Technical Supports and Assistance........................................................ 64

................................................................

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Lists of Figures

Figure 1: Top side layout diagram ................................................................................. 6

Figure 2: Bottom side layout diagram........................................................................... 7

Figure 3: Top side dimensions (without heatsink)..................................................... 8

Figure 4: Front panel side dimensions .......................................................................... 8

Figure 5: Rear panel side dimensions ........................................................................... 8

Figure 6: Top side height distribution........................................................................... 9

Figure 7: Bottom side height distribution .................................................................... 9

Figure 8: Front Panel I/O................................................................................................ 10

Figure 9: Rear Panel I/O ................................................................................................. 10

Figure 10: LED indicators diagram ............................................................................... 11

Figure 11: Power button diagram ................................................................................ 11

Figure 12: COM connector diagram ........................................................................... 12

Figure 13: USB 3.0 port diagram ..................................................................................13

Figure 14: Gigabit Ethernet LAN port diagram ......................................................... 14

Figure 15: Mini HDMI® port diagram ..........................................................................15

Figure 16: USB 2.0 port diagram ..................................................................................16

Figure 17: DC-In power connector diagram .............................................................17

Figure 18: SATA connector diagram ........................................................................... 18

Figure 19: SATA power connector diagram ............................................................. 19

Figure 20: SPI pin header diagram ............................................................................... 20

Figure 21: CPU fan connector diagram....................................................................... 21

Figure 22: CMOS battery connector diagram ........................................................... 22

Figure 23: WLAN connector diagram ......................................................................... 23

Figure 24: LPC connector diagram............................................................................... 24

Figure 25: Jumper settings example............................................................................25

Figure 26: Clear CMOS jumper diagram .................................................................... 26

Figure 27: AT/ATX power mode select jumper diagram....................................... 27

Figure 28: MXM connecter diagram ............................................................................ 28

Figure 29: DDR3 SODIMM memory socket diagram............................................... 32

Figure 30: Inserting the memory module...................................................................33

Figure 31: Locking the memory module .................................................................... 33

Figure 32: Disengaging the SODIMM locking clips ................................................. 34

Figure 33: Removing the memory module ................................................................ 34

Figure 34: Suggested minimum chassis dimensions................................................35

Figure 35: Suggested minimum internal chassis ceiling height.............................36

Figure 36: Suggested keepout areas (top side)........................................................ 37

Figure 37: Suggested keepout areas (bottom side) ................................................ 37

Figure 38: Illustration of the Main menu screen....................................................... 39

Figure 39: Illustration of the Advanced Settings screen......................................... 41

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Figure 40: Illustration of the ACPI Settings screen .................................................. 42

Figure 41: Illustration of the S5 RTC Wake Settings screen................................... 43

Figure 42: Illustration of CPU Configuration screen................................................ 44

Figure 43: Illustration of SATA Configuration screen ............................................. 45

Figure 44: Illustration of PC Health Status screen ................................................... 46

Figure 45: Illustration of F81801 Super IO Configuration screen.........................48

Figure 46: Illustration of F81801 H/W Monitor ........................................................49

Figure 47: Illustration of Clock Generator Configuration screen ......................... 50

Figure 48: Illustration of OnBoard Device Configuration screen ......................... 51

Figure 49: Illustration of Chipset Settings screen..................................................... 52

Figure 50: Illustration of DRAM Configuration screen............................................ 53

Figure 51: Illustration of Video Configuration screen ............................................. 55

Figure 52: Illustration of PMU_ACPI Configuration screen.................................... 56

Figure 53: Illustration of Other Control screen........................................................ 56

Figure 54: Illustration of Others Configuration screen ........................................... 58

Figure 55: Illustration of Boot Settings screen.......................................................... 59

Figure 56: Illustration of Security Settings screen.................................................... 61

Figure 57: Illustration of Save & Exit screen.............................................................. 62

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Lists of Tables

Table 1: Top side layout description table................................................................. 6

Table 2: Bottom side layout description table .......................................................... 7

Table 3: Layout description table of external I/O ports........................................ 10

Table 4: COM connector pinouts ............................................................................... 12

Table 5: USB 3.0 port pinouts ......................................................................................13

Table 6: Gigabit Ethernet LAN port pinout............................................................... 14

Table 7: Gigabit Ethernet LED color definition ........................................................ 14

Table 8: Mini HDMI® port pinout ................................................................................15

Table 9: USB 2.0 port pinouts ......................................................................................16

Table 10: DC-In power connector pinout ................................................................. 17

Table 11: SATA connector pinout ..............................................................................18

Table 12: SATA power connector pinout ................................................................. 19

Table 13: SPI pin header pinout .................................................................................. 20

Table 14: CPU fan connector pinout .......................................................................... 21

Table 15: CMOS battery connector pinout .............................................................. 22

Table 16: WLAN connector pinout ............................................................................ 23

Table 17: LPC connector pinout .................................................................................. 24

Table 18: Clear CMOS jumper settings ..................................................................... 26

Table 19: AT/ATX power mode select jumper settings........................................ 27

Table 20: MXM connector pinout ...............................................................................31

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1.

1. Product Overview

Product Overview

1.1.

Product OverviewProduct Overview

The EPIA-E900 is a highly integrated Pico-ITXe board powered by a 1.2GHz
VIA Eden® X4 processor and VIA VX11H MSP chipset that delivers a high
performance and rich multimedia features in an ultra-compact package for a
wide range of embedded system applications such as industrial automation,
transportation, medical, and infotainment.

The EPIA-E900 board is fully compatible with Microsoft® and Linux operating
systems, and provides an impressive I/O such as COM connectors, mini HDMI®
port, Gigabit Ethernet (RJ-45) ports, USB 2.0 ports, USB 3.0 ports, SATA
connector for storage devices, and onboard MXM connector for an optional
E900-A expansion card. In addition, EPIA-E900 also includes one 1333 MHz
DDR3 SODIMM slot that support up to 8 GB memory size.

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1.1. Key Features and Benefits

1.1.1. VIA Eden

The VIA Eden® X4 is a 64-bit superscalar x86 multi-core processor combine
on two dies. It is based on advanced 28 nanometer process technology
packed into an ultra compact NanoBGA2 package measuring 21mm x 21mm.
The VIA Eden® X4 processor delivers a superb performance on multi-tasking,
multimedia playback, productivity and internet browsing in a low power
budget. In addition, it is ideal for most of multi-display environment, and
embedded system applications.

Note:

Note:

Note:Note:

For Windows 7 and Windows Server 2008 R2 users only:
If encounter the issue such as the operating system recognize the VIA Dual-Core CPU as two processors
instead of one processor with two cores. Download and install the hotfix released by Microsoft to
address this issue. The downloadable hotfix is available at http://support.microsoft.com/kb/25026

®

X4 Processor

http://support.microsoft.com/kb/2502664

http://support.microsoft.com/kb/25026http://support.microsoft.com/kb/25026

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1.1.2. VIA VX11H MSP Chipset

The VIA VX11H is the fourth generation, highly integrated Media System
Processor which provides high quality digital video streaming and high
definition video playback. It features the VIA Chrome™ 640 DX11 2D/3D
graphics and video processor, High Definition video decoder supports DDR3
1333 controller and USB 3.0 interface.

The VIA VX11H offers superb-graphics performance, immersive visual
experience, and supports DirectX 11.0 that allows realistic 3D rendering and
increased visual acuity. The VIA VX11H is based on a highly sophisticated
power efficient architecture that enables such rich integration into a compact
package.

1.1.3. Expansion Option

The EPIA-E900 further proves its versatility by providing an expansion MXM
connector for optional E900-A expansion card. The E900-A expansion card is
carrying multiple expansion I/O such as audio jack, USB 2.0 ports, SATA
connector, PCIe slot, LVDS panel connector, DisplayPort/HDMI port, DVP port
and etc.

The companies using the EPIA-E900 with E900-A expansion card obtain the
maximum benefits and enable to slowly roll out upgrades as necessary
instead of having to replace everything all at once.

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1.2. Product Specifications



Processor

Processor

ProcessorProcessor



VIA Eden X4 1.2 GHz processor















21 mm x 21 mm FCBGA

Chipset

Chipset

ChipsetChipset



VIA VX11H MSP chipset



33 mm x 33 mm FCBGA

Graphics

Graphics

GraphicsGraphics



Integrated VIA Chrome™ 640 DX11 2D/3D graphics and video processor



MPEG2, WMV9, VC1, H.264 Full HD video decoder

System Memory

System Memory

System MemorySystem Memory



1 x DDR3 1333 MHz SODIMM socket



Supports up to 8 GB memory size

BIOS

BIOS

BIOSBIOS



AMI Aptio UEFI BIOS, 32 Mbit flash memory

Onboard Peripherals

Onboard Peripherals

Onboard PeripheralsOnboard Peripherals



Serial ATA

Serial ATA

Serial ATASerial ATA



Supports up to 3.0 Gb/s



LAN

LAN

LANLAN



2 x Realtek RTL8111G PCIe Gigabit Ethernet controllers



Audio

Audio

AudioAudio



Through MXM support



Super I/O

Super I/O

Super I/OSuper I/O



Fintek F81801U-I Super I/O controller

Onboard I/O Connectors

Onboard I/O Connectors

Onboard I/O ConnectorsOnboard I/O Connectors



1 x DC-In power connector (12V DC)



1 x SATA connector



1 x SATA power connector



1 x MXM connector



1 x SPI pin header



1 x CPU fan connector



1 x Clear CMOS jumper



1 x AT/ATX jumper pin header



1 x LPC connector



1 x WLAN USB connector (supports VNT9271 WiFi module)



1 x CMOS external battery connector

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

Front Panel I/O

Front Panel I/O

Front Panel I/OFront Panel I/O



1 x HDD LED



1 x Power LED



1 x Power button



2 x USB 3.0 ports



2 x COM connectors



Rear

Rear Panel I/O

Panel I/O

RearRear

Panel I/O Panel I/O



2 x Gigabit Ethernet (LAN) ports



1 x Mini HDMI® port (Type C)



2 x USB 2.0 ports



MXM

MXM CCCConnector

onnector iiiinterface

MXM MXM

onnector onnector



Support one SATA connector



Support four USB 2.0 ports



Support one DisplayPort/HDMI interface



Support DVP port interface for two channel LVDS



Support LPC interface



Support SMBus interface



Support SPI interface



Support one Digital I/O (3GPI + 3GPO) interface



Support HD Audio interface



Support one fan controller for System fan



Support one PCIe x4 interface

nterface

nterfacenterface



Supported Operating System

Supported Operating System

Supported Operating SystemSupported Operating System



Microsoft Windows 10



Microsoft Windows 8.1



Microsoft Windows 8



Microsoft Windows 7



Microsoft Windows Embedded Standard 7



Linux



System Mo

System Monitoring & Management

System MoSystem Mo








nitoring & Management

nitoring & Managementnitoring & Management
Wake-on-LAN
Keyboard-Power-on
Timer-Power-on
System Power Management
AC power failure recovery
Watchdog Timer



Operating Conditions

Operating Conditions

Operating ConditionsOperating Conditions



Operating Temperature

Operating Temperature

Operating TemperatureOperating Temperature



0°C ~55°C



Operating Humidity

Operating Humidity

Operating HumidityOperating Humidity



0% ~ 95% (relative humidity; non-condensing)

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

For

Form Factor

m Factor

ForFor

m Factorm Factor



Pico-ITXe (13.8 cm x 7.2 cm)



Compliance

Compliance

ComplianceCompliance



CE



FCC

Note:

Note:

Note:Note:

As the operating temperature provided in the specifications is a result of the test performed in VIA’s
chamber, a number of variables can influence this result. Please note that the working temperature may
vary depending on the actual situation and environment. It is highly suggested to execute a solid
testing and take all the variables into consideration when building the system. Please ensure that the
system runs well under the operating temperature in terms of application.

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1.3. Layout Diagram

Figure

Figure 1111: Top side layout diagram

: Top side layout diagram

Figure Figure

: Top side layout diagram: Top side layout diagram

Item

Item Description

ItemItem

Table

Table 1111: Top side layout description table

: Top side layout description table

Table Table

: Top side layout description table: Top side layout description table

Description

DescriptionDescription
1 PWR: DC-In power connector
2 SATA: SATA connector
3 SATA_PW: SATA power connector
4 MXM: MXM connector
5 SPI: SPI pin header
6 CLEAR_CMOS: Clear CMOS jumper
7 CPUFAN: CPU fan connector
8 AT/ATX: AT/ATX mode jumper pin header
9 Chipset: VIA VX11H MSP

10 CPU: 1.2 GHz VIA Eden x4 processor

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Figure

Figure 2222: Bottom side layout diagram

: Bottom side layout diagram

Figure Figure

: Bottom side layout diagram: Bottom side layout diagram

Item

Item Description

ItemItem

Table

Table 2222: Bott

: Bottom side layout description table

Table Table

: Bott: Bott

Description

DescriptionDescription

11 SODIMM: DDR3 SODIMM socket
12 LPC: LPC connector
13 JWLAN: WiFi (WLAN) connector
14 CMOS battery connector

om side layout description table

om side layout description tableom side layout description table

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1.4. Dimensions

Figure

Figure 3333: Top side dimensions

: Top side dimensions (without heatsink)

Figure Figure

: Top side dimensions: Top side dimensions

(without heatsink)

(without heatsink) (without heatsink)

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Figure

Figure 4444: Front panel side dimensions

: Front panel side dimensions

Figure Figure

: Front panel side dimensions: Front panel side dimensions

Figure

Figure 5555: Rear panel

: Rear panel side dimensions

Figure Figure

: Rear panel : Rear panel

side dimensions

side dimensionsside dimensions

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1.5. Height Distribution

Figure

Figure 6666: Top side height distribution

: Top side height distribution

Figure Figure

: Top side height distribution: Top side height distribution

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Figure

Figure 7777:

: Bottom side h

Figure Figure

Bottom side height distribution

: :

Bottom side hBottom side h

eight distribution

eight distributioneight distribution

9

EPIA

2.

2. I/O Interface

I/O Interface

2.2.

I/O InterfaceI/O Interface

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The VIA EPIA-E900 has a wide selection of interfaces. It includes a selection of
frequently used ports as part of the external I/O coastline.

2.1. External I/O Ports

Figure

Figure 8888:

: Front P

Front Panel I/O

: :

Front PFront P

anel I/O

anel I/Oanel I/O

Figure Figure

Figure

Figure 9999: Rear Panel I/O

: Rear Panel I/O

Figure Figure

: Rear Panel I/O: Rear Panel I/O

Item

Item Description

ItemItem

Table

Table 3333: Layout desc

: Layout description table of external I/O ports

Table Table

: Layout desc: Layout desc

ription table of external I/O ports

ription table of external I/O portsription table of external I/O ports

Description

DescriptionDescription
1 Power status LED
2 HDD LED
3 Power button
4 COM 1 connector
5 COM 2 connector
6 USB 3.0 port 1
7 USB 3.0 port 2
8 Gigabit Ethernet port 1
9 Gigabit Ethernet port 2

10 Mini HDMI® port
11 USB 2.0 port 1
12 USB 2.0 port 2

10

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2.1.1. LED Indicators

There are two LEDs on the front panel that indicates the status of the system:



HDD LED flashes in red and indicates hard drive storage activity for
SATA drive.



Power Status LED flashes in green and indicates the system’s power
status.

Figure

Figure 10

10: LED indicators diagram

Figure Figure

: LED indicators diagram

1010

: LED indicators diagram: LED indicators diagram

2.1.2. Power Button

The EPIA-E900 comes with a power button that supports Soft power On/Off
(Instant Off or 4 second delay), and Suspend.

Figure

Figure 11

11: Power button diagram

Figure Figure

: Power button diagram

1111

: Power button diagram: Power button diagram

11

EPIA

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2.1.3. COM Connector

The EPIA-E900 provides two COM (D-sub 9-pin male) connectors located on
the front panel. The COM connectors labeled as COM1 and COM2 supports
RS-232 standard. The pinout of the COM connector is shown below.

Figure

Figure 12

12: COM connector diagram

Figure Figure

Table

Table 4444: COM connector pinout

Table Table

: COM connector diagram

1212

: COM connector diagram: COM connector diagram

Pin

Pin Signal

PinPin

1 COM_DCD1 1 COM_DCD2
2 COM_RXD1 2 COM_RXD2
3 COM_TXD1 3 COM_TXD2
4 COM_DTR1 4 COM_DTR2
5 GND 5 GND
6 COM_DSR1 6 COM_DSR2
7 COM_RTS1 7 COM_RTS2
8 COM_CTS1 8 COM_CTS2

: COM connector pinoutssss

: COM connector pinout: COM connector pinout

9 COM_RI1

COM 1

COM 1 COM 2

COM 1COM 1

Signal Pin

SignalSignal

COM 2

COM 2COM 2

Pin Signal

Signal

PinPin

SignalSignal

9 COM_RI2

12

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2.1.4. USB 3.0 Port

There are two USB 3.0 ports also known as SuperSpeed USB located on the
front panel. The USB 3.0 port has a maximum data transfer rate up to 5 Gbps
and offers a backwards compatible with previous USB 2.0 specifications. The
USB 3.0 ports are using the USB Type-A receptacle connector. The pinout of
the typical USB 3.0 port is shown below.

Figure

Figure 13

13: USB 3.0 port dia

Figure Figure

: USB 3.0 port diagram

1313

: USB 3.0 port dia: USB 3.0 port dia

Table

Table 5555: USB 3.0 port pi

: USB 3.0 port pinouts

Table Table

: USB 3.0 port pi: USB 3.0 port pi

gram

gramgram

USB 3.0 port 1

USB 3.0 port 1 USB 3.0 port 2

USB 3.0 port 1USB 3.0 port 1

Pin

Pin Signal

Signal Pin

PinPin

SignalSignal
1 +5V 1 +5V
2 Data1- 2 Data2­3 Data1+ 3 Data2+
4 GND 4 GND
5 RX1- 5 RX2­6 RX1+ 6 RX2+
7 GND 7 GND
8 TX1- 8 TX2­9 TX1+

nouts

noutsnouts

Pin Signal

PinPin

9 TX2+

USB 3.0 port 2

USB 3.0 port 2USB 3.0 port 2

Signal

SignalSignal

13