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1.03-03222018-171900
USER MANUAL
COMe-8X91
Computer-On-Module Express
Page 2
Tested To Comply
With FCC Standards
FOR HOME OR OFFICE USE
Copyright
Copyright © 2013 VIA Technologies Incorporated. All rights reserved.
No part of this document may be reproduced, transmitted, transcribed, stored in a retrieval system, or translated into any language,
in any form or by any means, electronic, mechanical, magnetic, optical, chemical, manual or otherwise without the prior written
permission of VIA Technologies, Incorporated.
Trademarks
All trademarks are the property of their respective holders.
Disclaimer
No license is granted, implied or otherwise, under any patent or patent rights of VIA Technologies. VIA Technologies makes no
warranties, implied or otherwise, in regard to this document and to the products described in this document. The information
provided in this document is believed to be accurate and reliable as of the publication date of this document. However, VIA
Technologies assumes no responsibility for the use or misuse of the information (including use or connection of extra
device/equipment/add-on card) in this document and for any patent infringements that may arise from the use of this document.
The information and product specifications within this document are subject to change at any time, without notice and without
obligation to notify any person of such change.
VIA Technologies, Inc. reserves the right the make changes to the products described in this manual at any time without prior
notice.
Regulatory Compliance
FCC-A Radio Frequency Interference Statement
This equipment has been tested and found to comply with the limits for a class A digital device, pursuant to part 15 of the FCC
rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a
commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not installed and used in
accordance with the instruction manual, may cause harmful interference to radio communications. Operation of this equipment in a
residential area is likely to cause harmful interference, in which case the user will be required to correct the interference at his
personal expense.
Notice 1
The changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
Notice 2
Shielded interface cables and A.C. power cord, if any, must be used in order to comply with the emission limits.
Notice 3
The product described in this document is designed for general use, VIA Technologies assumes no responsibility for the conflicts
or damages arising from incompatibility of the product. Check compatibility issue with your local sales representatives before
placing an order.
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Battery Recycling and Disposal
Only use the appropriate battery specified for this product.
Do not re-use, recharge, or reheat an old battery.
Do not attempt to force open the battery.
Do not discard used batteries with regular trash.
Discard used batteries according to local regulations.
Safety Precautions
Always read the safety instructions carefully.
Keep this User's Manual for future reference.
All cautions and warnings on the equipment should be noted.
Keep this equipment away from humidity.
Lay this equipment on a reliable flat surface before setting it up.
Make sure the voltage of the power source and adjust properly 110/220V before connecting
the equipment to the power inlet.
Place the power cord in such a way that people cannot step on it.
Always unplug the power cord before inserting any add-on card or module.
If any of the following situations arises, get the equipment checked by authorized service
personnel:
The power cord or plug is damaged.
Liquid has penetrated into the equipment.
The equipment has been exposed to moisture.
The equipment has not worked well or you cannot get it work according to User's Manual.
The equipment has dropped and damaged.
The equipment has obvious sign of breakage.
Do not leave this equipment in an environment unconditioned or in a storage temperature
above 60°C (140°F). The equipment may be damaged.
Do not leave this equipment in direct sunlight.
Never pour any liquid into the opening. Liquid can cause damage or electrical shock.
Do not place anything over the power cord.
Do not cover the ventilation holes. The openings on the enclosure protect the equipment
from overheating
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Box Contents
COMe-8X91
1 X COMe-8X91 COM Express Module Board
1 x Screw Bag
1 x Heatsink or Heatspreader (optional)
COMe-8X91 Starter Kit
1 x COMe-8X91 COM Express Module Board with Heatsink
1 x COMEDB3 COM Express Carrier Board
1 x SATA Cable
1 x Dual-Port USB 2.0 Cable
1 x COM Cable
1 x LPT Cable
1 x Quick Guide
1 x LVDS Cable (optional)
1 x Inverter Cable (optional)
1 x 12.1” LCM (optional)
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Table of Contents
1. Product Overview ................................................................................................ 1
1.1.
Key Components .......................................................................................... 1
1.1.1.
VIA Eden™ X2 Processor ....................................................................... 1
1.1.2.
VIA VX900 System Chipset................................................................... 2
1.2.
Product Specifications ................................................................................. 3
1.3.
Layout Diagram ............................................................................................. 5
2. Hardware Installation .......................................................................................... 7
2.1.
Install heatsink with fan/heatspreader on the COMe-8X91 ............... 7
2.2.
Install COMe-8X91 module on the COMEDB3 carrier board ........... 9
3. BIOS Setup Utility .............................................................................................. 13
3.1.
Entering the BIOS Setup Utility ............................................................... 13
3.2.
Control Keys ................................................................................................ 13
3.3.
Navigating the BIOS Menus ..................................................................... 14
3.4.
Getting Help................................................................................................ 14
3.5.
System Overview ........................................................................................ 15
3.5.1.
AMIBIOS .................................................................................................. 15
3.5.2.
Processor ................................................................................................. 15
3.5.3.
System Memory ..................................................................................... 15
3.5.4.
System Time ........................................................................................... 16
3.5.5.
System Date............................................................................................ 16
3.6.
Advanced Settings ..................................................................................... 17
3.6.1.
CPU Configuration ................................................................................ 18
3.6.2.
IDE Configuration .................................................................................. 19
3.6.3.
SuperIO Configuration ......................................................................... 21
3.6.4.
Hardware Health Configuration ........................................................ 23
3.6.5.
ACPI Configuration ............................................................................... 24
3.6.6.
APM Configuration ................................................................................ 26
3.6.7.
Spread Spectrum Configuration ........................................................ 29
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3.6.8.
USB Configuration ................................................................................. 30
3.6.9.
CRB Configuration ................................................................................. 32
3.7.
Advanced PCI/PnP Settings ...................................................................... 33
3.7.1.
Clear NVRAM......................................................................................... 33
3.7.2.
Plug & Play O/S ..................................................................................... 33
3.7.3.
PCI Latency Timer.................................................................................. 34
3.7.4.
Allocate IRQ to PCI VGA .................................................................... 34
3.7.5.
Palette Snooping ................................................................................... 34
3.7.6.
PCI IDE BusMaster ................................................................................. 34
3.7.7.
OffBoard PCI/ISA IDE Card ................................................................. 35
3.7.8.
IRQ3~15 .................................................................................................. 35
3.7.9.
DMA Channel 0~7 ................................................................................ 35
3.7.10. Reserved Memory Size......................................................................... 35
3.7.11. HotPlug Reserve I/O Port Size ........................................................... 35
3.7.12. HotPlug Reserve Memory Size ........................................................... 36
3.7.13. HotPlug Reserve PFMemory Size....................................................... 36
3.8.
Boot Settings ............................................................................................... 37
3.8.2.
Boot Device Priority .............................................................................. 40
3.9.
Security Settings ......................................................................................... 41
3.9.1.
Password Check .................................................................................... 41
3.10.
Advanced Chipset Settings ...................................................................... 43
3.10.2. South Bridge VIA VX900 Configuration ........................................... 52
3.11.
Exit Options ................................................................................................. 54
3.11.1. Save Changes and Exit ......................................................................... 54
3.11.2. Discard Changes and Exit .................................................................... 54
3.11.3. Save Changes ......................................................................................... 54
3.11.4. Load Optimal Defaults ........................................................................ 54
4. Driver Installation ............................................................................................... 55
4.1.
Microsoft Driver Support .......................................................................... 55
4.2.
Linux Driver Support.................................................................................. 55
Appendix A. COMEDB3 Carrier Board Reference .................................................. 57
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A.1. Board Specifications .......................................................................................... 57
A.2. External I/O Connectors ................................................................................... 60
A.2.1. Rear I/O ......................................................................................................... 60
A.3. COMEDB3 Layout Diagram .............................................................................. 61
A.3.1. Onboard Connectors, Ports and Sockets .............................................. 61
A.3.2. Onboard Pin headers ................................................................................. 62
A.3.3. Onboard Jumpers ....................................................................................... 67
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Lists of Figures
Figure 1: Layout diagram of the COMe-8X91 mainboard (top view) ................... 5
Figure 2: Layout diagram of the COMe-8X91 mainboard (bottom view) ............ 5
Figure 3: Heatsink/Heatspreader mounting points..................................................... 7
Figure 4: Aligned heatsink on module ......................................................................... 8
Figure 5: Aligned heatspreader on module ................................................................ 8
Figure 6: Installing carrier board hex spacers ............................................................. 9
Figure 7: Aligning COMe-8X91 and carrier board mount points......................... 10
Figure 8: Secure the COMe-8X91 (with heatsink) Module ................................... 11
Figure 9: Secure the COMe-8X91 (with heatspreader) Module .......................... 12
Figure 10: Illustration of the Main menu screen ....................................................... 15
Figure 11: Illustration of the Advanced Settings screen ......................................... 17
Figure 12: Illustration of the CPU Configuration screen ......................................... 18
Figure 13: Illustration of IDE Configuration screen .................................................. 19
Figure 14: Illustration of Primary IDE Master screen................................................ 20
Figure 15: Illustration of SuperIO Configuration screen ......................................... 21
Figure 16: Illustration of Hardware Health Configuration screen ........................ 23
Figure 17: Illustration of ACPI Configuration screen ............................................... 24
Figure 18: Illustration of APM Configuration screen ............................................... 26
Figure 19: Illustration of Spread Spectrum Configuration screen ........................ 29
Figure 20: Illustration of USB Configuration screen ................................................ 30
Figure 21: Illustration of CRB Configuration screen ................................................. 32
Figure 22: Illustration of Advanced PCI/PnP Settings screen ................................ 33
Figure 23: Illustration of Boot Settings screenBoot Settings Configuration ....... 37
Figure 24: Illustration of Boot Settings Configuration screen................................ 37
Figure 25: Illustration of Boot Device Priority screen ............................................. 40
Figure 26: Illustration of Security Settings screenChange Supervisor Password
............................................................................................................................................. 41
Figure 27: Illustration of Advanced Chipset Settings screenNorth Bridge VIA
VX900 Configuration ...................................................................................................... 43
Figure 28: Illustration of North Bridge VIA VX900 Configuration screen .......... 44
Figure 29: Illustration of DRAM Frequency/Timing Configuration screen .......... 45
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Figure 30: Illustration of OnChip VGA Configuration screen ............................... 48
Figure 31: Illustration of PCIE-NB Configuration screen ......................................... 50
Figure 32: Illustration of South Bridge VIA VX900 Configuration screen .......... 52
Figure 33: Illustration of Exit Options screen ........................................................... 54
Figure 34: Rear I/O ports and connectors .................................................................. 60
Figure 35: COMEDB3 slots and connectors layout ................................................. 61
Figure 36: COMEDB3 pin headers ............................................................................... 62
Figure 37: COMEDB3 jumpers ...................................................................................... 67
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Lists of Tables
Table 1: Serial port addresses and IRQs ................................................................... 21
Table 2: Layout diagram description table of the COMe-8X91 mainboard ...... 63
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1. Product Overview
The VIA COMe-8X91 is a compact and highly integrated Type 10 COM
Express Module. It comes with an integrated VIA Eden™ X2 800MHz
processor, boasting of ultra-low power consumption, cool and quiet
operation, and enhanced multi-tasking ability.
The COMe-8X91 is based on the VIA VX900 all-in-one single chipset featuring
the Integrated VIA C-9 HD DX9 2D/3D graphics processor and unified video
decoding accelerator for rich digital media performance. It provides support for
extensive connectivity options, including audio, USB, Ethernet, and graphics,
through board-to-board connectors to an I/O carrier board.
1.1. Key Components
1.1.1. VIA Eden™ X2 Processor
The VIA Eden X2 is a 64-bit superscalar x86 dual core processor based on a
40 nanometer process technology. Packed into an ultra compact NanoBGA2
package (measuring 21mm x 21mm), it delivers an energy-efficient yet
powerful performance, with cool and quiet operation. The VIA Eden X2
processor is ideal for embedded system applications such as industrial PCs,
test machines, measuring equipment, digital signage, medical PCs, monitoring
systems, gaming machines, in-vehicle entertainment, etc.
Note:
For Windows 7 and Windows Server 2008 R2 users only:
If encounter the issue such as the operating system recognize the VIA Dual-Core CPU as two processors
instead of one processor with two cores. Download and install the hotfix released by Microsoft to
address this issue. The downloadable hotfix is available at
http://support.microsoft.com/kb/2502664
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1.1.2. VIA VX900 System Chipset
The VIA VX900 Unified Digital Media Chipset is designed to enable high
quality digital video streaming and DVD playback in a new generation of
fanless, small form factor PCs and IA devices. The VIA VX900 features VIA C-9
HD DX9 2D/3D video processor with MPEG-2, WMV9/VC1, and H.264 video
decoding acceleration, DDR3 1066/800 MHz support, motion compensation
and dual display support to ensure a rich overall entertainment experience.
The VIA VX900 is packed in single chip package measuring 33mm x 33mm.
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1.2. Product Specifications
Core Processor
VIA Eden X2 800MHz NanoBGA2 processor
Chipset
VIA VX900 all-in-one system processor
System Memory
On board 1GB DDR3/DDR3L 1066
On-board BIOS
AMI BIOS
SPI 4/8Mbit flash memory
Operating System
Windows 7
Windows Embedded System 7
Windows XP
Windows XPe
Windows CE 6.0
Linux
Hardware Monitoring
CPU temperature reading
CPU fan speed reading
System voltage monitoring
WatchDog Timer
Software Programmable
Expansion Bus
3 x PCIe Gen2 x1
Video Chipset
Integrated VIA C-9 HD DX9 2D/3D graphics processor
LVDS Interface
1 x LVDS channel supports single-channel 18-bit or 24-bit LVDS
panel
Video Port
Either 1 x HDMI® port or 1 x DisplayPort (without HDCP
support)
Ethernet Chipset
VIA VT6130 Gigabit Ethernet Controller
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Input/Output Audio
Support 1 HD audio digital interface
LAN
Support 1 LAN port
USB
Support 8 USB 2.0 ports
SATA
Support up to 2 SATA 3.0Gbps ports
Serial
Support 2 serial ports with TX and RX signal
Expansion Buses
Support 1 SMBus interface
Support 1 I2C bus (default for Eup LAN control)
Support 1 SDIO interface (default)
Support 1 GPIO interface with 4 INs and 4 OUTs, shared with
SDIO (by request)
Support 1 LPC bus interface
Support SPI
Support speaker out, reset function, thermal protection,
suspend/wake signals, power button, power good and fan
control signals
Mechanical and
Environment
COM Express Compliance
COM Express™ Type 10, Mini Module
Input Power
12V
5V_SBY
Dimension
55 mm x 84 mm
Operating Temperature
0˚C up to 50˚C
Storage Temperature
-40˚C to 70˚C
Operating Humidity
0% to 95˚C (relative humidity; non-condensing)
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1.3. Layout Diagram
Figure 1: Layout diagram of the COMe-8X91 mainboard (top view)
Figure 2: Layout diagram of the COMe-8X91 mainboard (bottom view)
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2. Hardware Installation
2.1. Install heatsink with fan/heatspreader on the
COMe-8X91
Step 1
Locate the heatsink/heatspreader mounting holes.
Figure 3: Heatsink/Heatspreader mounting points
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Step 2
Align the heatsink/heatspreader over the mounting hole on COMe-8X91
Figure 4: Aligned heatsink on module
Figure 5: Aligned heatspreader on module
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2.2. Install COMe-8X91 module on the
COMEDB3 carrier board
Step 1
Identify the carrier board mounting points and the connector slots.
Figure 6: Installing carrier board hex spacers
Step 2
Install the hex spacers onto the carrier board. The hex spacers will be placed
on top of the board. From the bottom of the board, tighten the hex spacers by
using M2.5 x 4mm screws.
Note:
Make sure the thermal grease/paste has been applied on top of the processor and chipset before
installing the heatsink/heatspreader.
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Step 3
Align the connector of the COMe-8X91 module into the connector slot on the
COMEDB3 carrier board. Also, align mount points of COMe-8X91 module
into the hex spacers on the carrier board.
Figure 7: Aligning COMe-8X91 and carrier board mount points
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Step 4
Secure the COMe-8X91 module with the heatsink by screwing and tightening
the four screws (10mm screws).
Figure 8: Secure the COMe-8X91 (with heatsink) Module
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Figure 9: Secure the COMe-8X91 (with heatspreader) Module
Note:
For heatspreader model, user has to add his/her own thermal solution in order to provide sufficient
cooling to the board.
Step 5
Connect the CPU fan cable to the CPU fan connector on the COMEDB3 carrier
board.
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3. BIOS Setup Utility
3.1. Entering the BIOS Setup Utility
Power on the computer and press
Delete
during the beginning of the boot
sequence to enter the BIOS Setup Utility. If the entry point has passed, restart
the system and try again.
3.2. Control Keys
Up
Move up one row
Down
Move down one row
Left
Move to the left in the navigation bar
Right
Move to the right in the navigation bar
Enter
Access the highlighted item / Select the item
Esc
Jumps to the Exit screen or returns to the previous screen
Page up / +
1
Increase the numeric value
Page down / -
1
Decrease the numeric value
F1
General help2
F5
Restore the previous CMOS value
F9
Load optimized defaults
F10
Save all the changes and exit
Note:
1. Must be pressed using the 10-key pad.
2. The General help contents are only for the Status Page and Option Page setup menus.
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3.3. Navigating the BIOS Menus
The main menu displays all the BIOS setup categories. Use the <
Left
>/<
Right
>
and <Up>/<
Down
> arrow keys to select any item or sub-menu. Descriptions
of the selected/highlighted category are displayed at the bottom of the screen.
The small triangular arrowhead symbol next to a field indicates that a sub-
menu is available (see figure below). Press <
Enter
> to display the sub-menu.
To exit the sub-menu, press <
Esc
>.
3.4. Getting Help
The BIOS Setup Utility provides a “
General Help
” screen. This screen can be
accessed at any time by pressing F1. The help screen displays the keys for
using and navigating the BIOS Setup Utility. Press
Esc
to exit the help screen.
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3.5. System Overview
The System Overview screen is the default screen that is shown when the
BIOS Setup Utility is launched. This screen can be accessed by traversing the
navigation bar to the “Main” label.
Figure 10: Illustration of the Main menu screen
3.5.1. AMIBIOS
The content in this section of the screen shows the current BIOS version, build
date, and ID number.
3.5.2. Processor
The content in this section shows the CPU information that has been detected.
3.5.3. System Memory
This section shows the amount of available memory that has been detected.
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3.5.4. System Time
This section shows the current system time. Press
Tab
to traverse right and
Shift+Tab
to traverse left through the hour, minute, and second segments. The
+
and - keys on the number pad can be used to change the values. The time
format is [Hour : Minute : Second].
3.5.5. System Date
This section shows the current system date. Press
Tab
to traverse right and
Shift+Tab
to traverse left through the month, day, and year segments. The +
and - keys on the number pad can be used to change the values. The weekday
name is automatically updated when the date is altered. The date format is
[Weekday, Month, Day, Year].
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3.6. Advanced Settings
The Advanced Settings screen shows a list of categories that can provide
access to a sub-screen. Sub-screen links can be identified by the preceding
right-facing arrowhead.
Figure 11: Illustration of the Advanced Settings screen
The Advanced Settings screen contains the following links:
CPU Configuration
IDE Configuration
SuperIO Configuration
Hardware Health Configuration
ACPI Configuration
APM Configuration
Spread Spectrum Configuration
USB Configuration
CRB Configuration
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3.6.1. CPU Configuration
The CPU Configuration screen shows detailed information about the built-in
processor.
Figure 12: Illustration of the CPU Configuration screen
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3.6.2. IDE Configuration
The IDE Configuration screen shows links to the primary IDE Master and
primary IDE Slave hard drive information screens.
Figure 13: Illustration of IDE Configuration screen
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3.6.2.1. Primary IDE Master
When a hard drive is detected, the hard drive’s detailed information can be
displayed on the Primary IDE Master/Slave sub-screen.
Figure 14: Illustration of Primary IDE Master screen
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3.6.3. SuperIO Configuration
The SuperIO Configuration screen shows the specific addresses, IRQs and
types of the onboard serial ports.
Figure 15: Illustration of SuperIO Configuration screen
3.6.3.1. Serial Ports 1 to 2
This option allows the user to select the Serial Port 1 and 2 base I/O address
and interrupt request address. The Serial Port 1 to 2 has three selectable
options.
Port Address and IRQs
1 3F8/IRQ4, 3E8/IRQ4, 2E8/IRQ3
2 2F8/IRQ3, 3E8/IRQ4, 2E8/IRQ3
Table 1: Serial port addresses and IRQs
3.6.3.2. Parallel Port Address
This specifies the I/O port address and IRQ of the parallel port. The parallel
port has four options: Disabled, 378, 278 and 3BC.
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3.6.3.3. Parallel Port Mode
This specifies the parallel port mode. The parallel port mode has five options:
Normal, Bi-Directional, ECP, EPP, EPP+ECP.
3.6.3.4. Parallel Port IRQ
This specifies the parallel port interrupt request address. The parallel port IRQ
has 2 options: IRQ5 and IRQ7.
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3.6.4. Hardware Health Configuration
The Hardware Health Configuration screen displays the monitored aspects of
the mainboard such as CPU temperature, system temperature, fan speeds, and
voltages of the power planes.
Figure 16: Illustration of Hardware Health Configuration screen
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3.6.5. ACPI Configuration
ACPI grants the operating system direct control over system power
management. The ACPI Configuration screen can be used to set a number of
power management related functions.
Figure 17: Illustration of ACPI Configuration screen
3.6.5.1. Suspend Mode
The Suspend Mode field has three selectable options.
S1(POS)
S1/Power On Suspend (POS) is a low power state. In this state, no system
context (CPU or chipset) is lost and hardware maintains all system contexts.
S3(STR)
S3/Suspend To RAM (STR) is a power-down state. In this state, power is
supplied only to essential components such as main memory and wakeup-
capable devices. The system context is saved to main memory, and context is
restored from the memory when a "wakeup" event occurs.
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Auto
When the Suspend Mode is set to Auto, the operating system will control the
power state.
3.6.5.2. ACPI Version Features
The ACPI Version Features enables the BIOS to support the designated ACPI
specification. There are three versions to choose from: ACPI v1.0, ACPI v2.0,
and ACPI v3.0.
3.6.5.3. ACPI APIC Support
The ACPI APIC Supports enables the ACPI support in APIC. The ACPI APIC
Supports has two options: Enabled and Disabled. When select “Enabled”, the
ACPI APIC table pointer includes in the Root System Description Table (RSDT)
pointer lists. When select “Disabled”, support for this feature will be
unavailable.
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3.6.6. APM Configuration
APM enables the operating system to co-work with the BIOS to control the
system power management. The APM Configuration screen can be used to set
a number of power management functions.
Figure 18: Illustration of APM Configuration screen
3.6.6.1. Power Button Mode
The Power Button Mode has three options.
On/Off
When On/Off is selected, pressing the power button will instantly cause the
system to power on or off.
Standby
When Standby is selected, the power button must be pressed and held down
for 4 seconds before the system will power off.
Suspend
When Suspend is selected, pressing the power button will instantly cause the
system to enter suspend mode.
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3.6.6.2. Restore on AC/Power Loss
Restore on AC/Power Loss defines how the system will respond after AC
power has been interrupted while the system is on. There are three options.
Power Off
The Power Off option keeps the system in an off state until the power button
is pressed again.
Power On
The Power On option restarts the system when the power has returned.
Last State
The Last State option restores the system to its previous state when the power
was interrupted.
3.6.6.3. Wake-Up Key
The Wake-Up Key feature can only be set when
Resume on PS/2 KBC
is set to
“S3” or “S3/S4/S5”. Otherwise, this feature will not be selectable. This feature
has two options.
Any Key
The Any Key option enables any key on the keyboard to trigger the Wake-Up
event.
Specific Key
The Specific Key option unlocks the
Wake-Up Password
feature.
3.6.6.4. Wake-Up Password
The Wake-Up Password feature can only be set when the
Wake-Up Key
feature
is set to “Specific Key”. This feature enables the user to specify a key sequence
that must be entered in order to wake up the system.
The key sequence can consist of up to 6 alphanumeric characters and some
special characters. Function keys and modifier keys (such as Ctrl, Alt, Del, etc.)
cannot be used.
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3.6.6.5. Resume on RTC Alarm
Resume on RTC Alarm can only be used if
Resume on Software RTC Alarm
is
not enabled. This feature enables the BIOS to automatically power on the
system at a scheduled time. When enabled, the
RTC Alarm Date
and
System
Time
features will be unlocked.
3.6.6.6. RTC Alarm Date (Days)
The RTC Alarm Date feature is visible only when
Resume on RTC Alarm
is
enabled. This feature enables the user to specify a specific date each month or
daily recurrence. Use the + and - keys on the number pad to change the value
of the RTC Alarm Date.
Every Day
The Every Day option triggers the RTC Alarm daily.
1 – 31
When a specific numeric date is selected, the RTC Alarm will be triggered on
that day of the month.
3.6.6.7. System Time
The System Time option enables the user to specify the time the system
should power on for the date that is set in
RTC Alarm Date
.
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3.6.7. Spread Spectrum Configuration
The Spread Spectrum Configuration screen enables access to the CPU Spread
Spectrum Setting feature.
Figure 19: Illustration of Spread Spectrum Configuration screen
3.6.7.1. Spread Spectrum Setting
The CPU Spread Spectrum Setting feature enables the BIOS to modulate the
clock frequencies originating from the mainboard. This feature has two settings:
Disabled and 0.1%.
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3.6.8. USB Configuration
The USB Configuration screen shows the number of connected USB devices.
Additionally, support for various USB features can be enabled or disabled.
Figure 20: Illustration of USB Configuration screen
3.6.8.1. OnChip UHCI Device
The OnChip UHCI Device feature enables support for USB 1.1 devices. UHCI
corresponds with the USB_1 stack. UCHI2 corresponds with the USB_2 stack.
UCHI3 corresponds with the USB_3 pin header block. UCHI4 corresponds
with the USB_4 pin header block.
3.6.8.2. OnChip EHCI Device
The OnChip EHCI Device feature enables support for USB 2.0 devices on
USB_1, USB_2, USB_3, and USB_4.
3.6.8.3. Legacy USB Support
The Legacy USB Support feature has two options: “Enabled” and “Auto”.
When set to “Enabled”, the system enables support for legacy USB devices.
When set to “Auto”, the system automatically disables legacy support if no
USB Devices are connected.
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3.6.8.4. USB 2.0 Controller Mode
Configure the USB 2.0 controller in FullSpeed or HiSpeed. The FullSpeed
limits the USB 2.0 controller to transfer data at 12 Mbps. The HiSpeed enables
the USB 2.0 controller to transfer data at 480Mbps. The connected USB device
must support HiSpeed in order to benefit from this setting.
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3.6.9. CRB Configuration
The CRB Configuration screen includes several chipset settings.
Figure 21: Illustration of CRB Configuration screen
3.6.9.1. VIA USB Wireless LAN Control
This feature enables support for USB wireless LAN control: This feature has
two options: “Enabled” and “Disabled”.
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3.7. Advanced PCI/PnP Settings
The Advanced PCI/PnP Settings screen shows the features that relate to PCI
bus and Plug and Play devices. Only change these settings if a PCI or Plug and
Play device requires it.
Figure 22: Illustration of Advanced PCI/PnP Settings screen
3.7.1. Clear NVRAM
The Clear NVRAM feature will erase all contents of the non-volatile random
access memory when booting up the system. There are two options for this
feature: yes and no.
3.7.2. Plug & Play O/S
The Plug & Play O/S feature determines whether the operating system or the
BIOS controls the configuration of Plug and Play devices. There are two
options for this feature.
Yes
The Yes option forces the BIOS to ignore any resource conflicts and enables
the installed operating system to configure Plug and Play devices.
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No
The No option gives the BIOS control over handling resource conflicts caused
by Plug and Play devices.
3.7.3. PCI Latency Timer
The PCI Latency Timer feature enables the user to specify the number of PCI
bus cycles a connected PCI device can control before handing control of the
PCI bus to the next PCI device waiting to use it. Generally, longer cycles
increase PCI performance. The available cycles range from 32 to 248 in
increments of 32.
3.7.4. Allocate IRQ to PCI VGA
The Allocate IRQ to PCI VGA feature determines whether graphics cards on
the PCI bus can access IRQs. This feature has two options.
Yes
The Yes option enables the BIOS to respond to a request for an IRQ by a
connected PCI VGA card.
No
The No option forces the BIOS to ignore all requests for IRQ by a connected
PCI VGA card.
3.7.5. Palette Snooping
The Palette Snooping feature should be enabled if video decoder cards are
being used in the system. When enabled, video decoder cards can retrieve
information about the color palette being used by the system’s graphics
controller. This feature has two options: “Enabled” and “Disabled”.
3.7.6. PCI IDE BusMaster
The PCI IDE BusMaster feature enables IDE controllers on the PCI bus to
directly communicate with IDE hard disks connected to PCI IDE cards. This
feature has two options: “Enabled” and “Disabled”.
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3.7.7. OffBoard PCI/ISA IDE Card
Some PCI IDE cards may require this to be set to the PCI slot number (PCI Slot
1~6) that is holding the card.
Auto: Works for most PCI IDE cards.
3.7.8. IRQ3~15
The available IRQs range from 3 to 15. However, not all IRQs in the range are
available. IRQs 3, 4, 5, 7, 9, 10, 11, 14, and 15 can be set as either “Available”
or “Reserved”. When set to “Available”, any connected PCI or Plug and Play
device can use the IRQ.
3.7.9. DMA Channel 0~7
The available DMA Channels range from 0 to 7. However, not all DMA
Channels in the range are available. DMA Channels 0, 1, 3, 5, 6, and 7 can be
set as either “Available” or “Reserved”. When set to “Available”, any
connected PCI or Plug and Play device can use the DMA Channel.
3.7.10. Reserved Memory Size
The Reserved Memory Size feature enables the user to reserve a portion of the
Upper Memory Area for use by legacy devices. The available sizes are 16k,
32k, and 64k. This feature can also be disabled.
3.7.11. HotPlug Reserve I/O Port Size
The HotPlug Reserve I/P Port Size feature enables the user to set aside a
specified portion of the I/O port block for hot-swappable or CardBus devices.
The available options range from 4k to 28k in increments of 4k. There is also
an “Auto” option for enabling the BIOS to dynamically choose the size to
reserve.
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3.7.12. HotPlug Reserve Memory Size
The HotPlug Reserve Memory Size feature enables the user to set aside a
specified portion of the memory block for hot-swappable or CardBus devices.
The available options range from 8MB to 512MB. There is also an “Auto”
option for enabling the BIOS to dynamically choose the size to reserve.
3.7.13. HotPlug Reserve PFMemory Size
The HotPlug Reserve PFMemory Size feature enables the user to set aside a
specified portion of the pre-fetch memory block for hot-swappable or
CardBus devices. The available options range from 32MB to 2048MB. There is
also an “Auto” option for enabling the BIOS to dynamically choose the size to
reserve.
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3.8. Boot Settings
The Boot Settings screen has one link that goes to the
Boot Settings
Configuration
screen.
Figure 23: Illustration of Boot Settings screenBoot Settings Configuration
The Boot Settings Configuration screen has several features that can be run
during the system boot sequence.
Figure 24: Illustration of Boot Settings Configuration screen
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3.8.1.1. Quick Boot
The Quick Boot feature enables the BIOS to skip certain tests in order to
speed up the boot sequence. This feature has two options: “Enabled” and
“Disabled”.
3.8.1.2. Quiet Boot
The Quiet Boot feature hides all of the Power-on Self Test (POST) messages
during the boot sequence. Instead of the POST messages, the user will see an
OEM logo. This feature has two options: enabled and disabled.
3.8.1.3. AddOn ROM Display Mode
The AddOn ROM Display Mode feature determines whether or not
information from option ROMs is displayed during the boot sequence. There
are two options for this feature: “Force BIOS” and “Keep Current”. The “Force
BIOS” option ensures that all information from option ROMs is displayed.
3.8.1.4. Bootup Num-Lock
The Bootup Num-Lock feature determines how the 10-key pad will behave.
When the feature is enabled, the 10-key pad will behave as a number pad.
When the feature is disabled, the 10-key pad will behave as cursor navigation
keys.
3.8.1.5. Wait for ‘F1’ if Error
This feature determines how the system will respond if an error is detected
during the boot sequence. If this feature is enabled, the BIOS will pause
booting and wait for the user to press F1 to enter the BIOS setup menu. This
feature has two options: enabled and disabled.
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3.8.1.6. Hit ‘DEL’ Message Display
This feature determines if the BIOS will display a POST message that informs
the user how to access the BIOS Setup Utility.1 This feature has two options:
enabled and disabled.
Note:
1. If the Quiet Boot option is enabled, the settings of this feature will have no effect.
3.8.1.7. Interrupt 19 Capture
The Interrupt 19 Capture feature enables hard drives attached to add-on host
adaptors (e.g., SCSI cards, eSATA cards, etc) to function as bootable hard
drives. Enabling this feature will also grant access to any existing ROM BIOS
utilities on the host adapter. This feature has two options: “Enabled” and
“Disabled”.
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3.8.2. Boot Device Priority
Figure 25: Illustration of Boot Device Priority screen
3.8.2.1. 1st Boot Device
To specifies the boot sequence from the available devices. The available boot
devices are detected dynamically according to real situation and variable
options will be provided. This feature has two options: [Network: VIA
Networking Bootagent and Disabled]
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3.9. Security Settings
The Security Settings screen provides a way to restrict access to the BIOS or
even the entire system.
Figure 26: Illustration of Security Settings screenChange Supervisor Password
This option is for setting a password for accessing the BIOS setup utility.
When a password has been set, a password prompt will be displayed
whenever the BIOS setup utility is launched. This prevents an unauthorized
person from changing any part of the system configuration.
When a supervisor password is set, the
Password Check
option will be
unlocked.
3.9.1. Password Check
This feature is compulsory when the
Change Supervisor Password
option is set.
The user will have up to three chances to enter the correct password before
the BIOS forces the system to stop booting. If the user does not enter the
correct password, the keyboard will also lock up. The only way to get past
this is to do a hard reboot (i.e., use the system reset button or cut off the
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power to the system). A soft reboot (i.e., Ctrl+Alt+Del) will not work
because the keyboard will be locked. This feature has two options.
Setup
The Setup option forces users to enter a password in order to access the BIOS
Setup Utility.
Always
The Always option forces users to enter a password in order to boot up the
system.
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3.10. Advanced Chipset Settings
The Advanced Chipset Settings screen has two links for accessing North and
South bridge functions. Though the VX900 is a single chip solution, the North
and South bridge categories are still for grouping features.
Figure 27: Illustration of Advanced Chipset Settings screenNorth Bridge VIA VX900 Configuration
The North Bridge VIA VX900 Configuration screen contains four links to sub-
screens and three features.
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Figure 28: Illustration of North Bridge VIA VX900 Configuration screen
3.10.1.1. NB HDAudio Codec 1
The NB HDAudio Codec 1 feature enables the BIOS to control the high
definition audio codec in the chipset. This feature has two options: “Enable”
and “Disable”.
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3.10.1.2. DRAM Clock/Timing Configuration
The DRAM Clock/Timing Configuration screen has one feature for controlling
the system DRAM. All other DRAM features are automated and cannot be
accessed.
Figure 29: Illustration of DRAM Frequency/Timing Configuration screen
3.10.1.2.1. DRAM Clock
The DRAM Clock option enables the user to determine how the BIOS handles
the memory clock frequency. The memory clock can either be dynamic or
static. This feature has three options.
Auto
The Auto option enables the BIOS to select a compatible clock frequency for
the installed memory.
400 MHz
The 400 MHz option forces the BIOS to be fixed at 800 MHz for DDR3
memory modules.
533 MHz
The 533 MHz option forces the BIOS to be fixed at 1066 MHz for DDR3
memory modules.
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3.10.1.2.2. Bank Interleave
This item is for setting the interleave mode of the SDRAM interface.
Interleaving allows banks of SDRAM to alternate their refresh and access
cycles. One bank will undergo its refresh cycle while another is being
accessed. This improves performance of the SDRAM by masking the refresh
time of each bank.
This feature has 5 options: “SPD”, “Non-Page”, “2-Way”, “4-Way” and “8-Way”.
3.10.1.2.3. Output Impedance Control
This feature has 2 options: “Normal” and “Weak”.
3.10.1.2.4. DDR2 Memory Chip ODT [DDR2/DDR
This feature has 7 options: “Auto”, “Disabled”,“75 ohm/60 ohm”,“150 ohm/120
ohm”,“50 ohm/40 ohm”,“NA/20 ohm” and “NA/30 ohm”.
3.10.1.2.5. DDR3 Dynamic ODT
This feature has 4 options: “Auto”,“Disabled”,“R2Q/4” and “R2Q/2”.
3.10.1.2.6. BA0 SEL
This feature has 5 options: “A11”,“A13”,“A15”,“A17“ and “A19”.
3.10.1.2.7. BA1 SEL
This feature has 5 options: “A12”,“A14”,“A16”,“A18“ and “A20”.
3.10.1.2.8. BA2 SEL
This feature has 4 options: “A14”,“A15”,“A18“ and “A19”.
3.10.1.2.9. VR Interleave Address Bit 0
This feature has 4 options: “A15”,“A17”,“A19“ and “A21”.
3.10.1.2.10. VR Interleave Address Bit 1
This feature has 4 options: “A14”,“A16”,“A18“ and “A20”.
3.10.1.2.11. Virtual Rank Interleave
This feature has 2 options: “Auto” and “Disabled”.
3.10.1.2.12. BA Scramble
This feature has 2 options: “Enabled” and “Disabled”.
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3.10.1.2.13. RDRDY
This feature has 2 options: “Slowest” and “Default”.
3.10.1.2.14. Conversion Circuit
This feature has 2 options: “Auto” and “Async”.
3.10.1.2.15. DRAM 32-Bit data width
This feature has 2 options: “Enabled” and “Disabled”.
3.10.1.2.16. DramInitMethod
This feature has 2 options: “Auto” and “Force_SW”.
3.10.1.2.17. Dram Self Refresh
This feature has 2 options: “Disabled” and “Enabled”.
3.10.1.2.18. Dynamic CKE
This feature has 2 options: “Disabled” and “Enabled”.
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3.10.1.3. OnChip VGA Configuration
The OnChip VGA Configuration screen has features for controlling the
integrated graphics controller in the VX900 chipset.
Figure 30: Illustration of OnChip VGA Configuration screen
3.10.1.3.1. Hide D1F1
This feature has 2 options: “Disabled” and “Enabled”.
3.10.1.3.2. VGA Share Memory (Frame Buffer)
The VGA Share Memory feature enables the user to choose the amount of the
system memory to reserve for use by the integrated graphics controller. The
amount of memory that can be reserved ranges from 64 – 512 MB.
3.10.1.3.3. CPU Direct Access Frame Buffer
The CPU Direct Access Frame Buffer feature enables the CPU to write to the
portion of memory reserved for the integrated graphics controller. This feature
has two options: “Disabled” and “Enabled”.
3.10.1.3.4. Select Display Device Control
This feature has 2 options: “Auto” and “Manual”.
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3.10.1.3.5. Select Display Device 1 and 2
The Select Display Device feature enables the user to choose a specific
display interface. This feature has four options: CRT, LCD, HDMI® and DP. If
both Select Display Device 1 and Select Display Device 2 are set to the same
interface, then any display device connected to the other interface will not
function. For example, if both Select Display 1 and 2 are set to CRT, then no
data will be sent to the HDMI®, LCD and DP port.
3.10.1.3.6. Panel Type
The Panel Type feature enables the user to specify the resolution of the display
being used with the system. The panel types are predefined in the VGA VBIOS.
Panel Type Resolution Panel Type Resolution
00 640 x 480 08 800 x 480
01 800 x 600 09 1024 x 600
02 1024 x 768 10 1366 x 768
03 1280 x 768 11 1600 x 1200
04 1280 x 1024 12 1680 x 1050
05 1400 x 1050 13 1920 x 1200
06 1440 x 900 14 1920 x 1080
07 1280 x 800 15 1024 x 576
3.10.1.3.7. Backlight Control
The Backlight Control feature control enables the user to control the
brightness of the LCD backlight. This feature has five options.
Level 1
0% PW Duty
Level 1
25% PW Duty
Level 2
50% PW Duty
Level 3
75% PW Duty
Level 4
100% PW Duty
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3.10.1.4. PCIE-NB Configuration
The PCIE-NB Configuration screen has features for controlling the PCIE Express
interface in the VX900 chipset.
Figure 31: Illustration of PCIE-NB Configuration screen
3.10.1.4.1. Reset PCIE When Link Fail
This feature has 2 options: “Enabled” and “Disabled”.
3.10.1.4.2. Reset PE0 When Link Fail
This feature has 2 options: “Enabled” and “Disabled”.
3.10.1.4.3. Reset PE1 When Link Fail
This feature has 2 options: “Enabled” and “Disabled”.
3.10.1.4.4. Reset PE2 When Link Fail
This feature has 2 options: “Enabled” and “Disabled”.
3.10.1.4.5. Reset PE3 When Link Fail
This feature has 2 options: “Enabled” and “Disabled”.
3.10.1.4.6. PCIE Target Link Speed
This feature has 2 options: “Auto” and “Force Gen1”.
3.10.1.4.7. PCIE Root Port
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This feature has 2 options: “Enabled” and “Disabled”.
3.10.1.4.8. PCIE PE0 Control
This feature has 2 options: “Enabled” and “Disabled”.
3.10.1.4.9. PCIE PE1 Control
This feature has 2 options: “Enabled” and “Disabled”.
3.10.1.4.10. PCIE PE2 Control
This feature has 2 options: “Enabled” and “Disabled”.
3.10.1.4.11. PCIE PE3 Control
This feature has 2 options: “Enabled” and “Disabled”.
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3.10.2. South Bridge VIA VX900 Configuration
The South Bridge VIA VX900 Configuration screen has the following features.
Figure 32: Illustration of South Bridge VIA VX900 Configuration screen
3.10.2.1. SATA Gen2 Support
The SATA Gen2 Support feature enables to BIOS to determine whether SATA
3Gb/s or 1.5Gb/s specifications are followed. This feature has two options:
“Enabled” or “Disabled”.
3.10.2.2. OnChip HDAC Device
The OnChip HDAC Device feature enables the BIOS to control the high
definition audio codec in the chipset. This feature has two options: “Enable” or
“Disable”.
3.10.2.3. Serial ATA Controller
The Serial ATA Controller feature enables the BIOS to turn the SATA
controller in the chipset ON or OFF. This feature has two options: “Enabled”
or “Disabled”.
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3.10.2.4. OnChip UART Mode
This feature has two options: “Enabled” or “Disabled”.
3.10.2.5. SDIO Host Controller
This feature has two options: “Enable” or “Disable”.
3.10.2.6. HPET Support
The HPET Support feature enables the BIOS to determine if the high precision
event timer in the chipset is ON or OFF. This feature has two options:
“Enabled” or “Disabled”.
3.10.2.7. WATCHDOG Timer Enable
The WATCHDOG Timer Enable feature unlocks three other features that
enable the BIOS to monitor the state of the system. This feature has two
options: “Enabled” or “Disabled”.
3.10.2.8. OnBoard LAN Enable
This feature has two options: “Enabled” or “Disabled”.
3.10.2.9. EuP/ErP Lot6 support
The EuP/ErP Lot6 Support feature enables the BIOS to reduce the power draw
to less than 1W when the system is in standby mode. This feature has two
options: enabled and disabled.
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3.11. Exit Options
Figure 33: Illustration of Exit Options screen
3.11.1. Save Changes and Exit
Save all changes to the BIOS and exit the BIOS Setup Utility. The “F10” hotkey
can also be used to trigger this command.
3.11.2. Discard Changes and Exit
Exit the BIOS Setup Utility without saving any changes. The “Esc” hotkey can
also be used to trigger this command.
3.11.3. Save Changes
Save all changes to the BIOS.
3.11.4. Load Optimal Defaults
Load optimal default values for all the setup items. The default optimized values
are defined by the mainboard manufacturer to provide optimized environment for
a basic system. The “F9” hotkey can also be used to trigger this command.
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4. Driver Installation
4.1. Microsoft Driver Support
The VIA COMe-8X91 mainboard is compatible with Microsoft operating
systems. The latest Windows drivers can be downloaded from the VIA
Embedded website at www.viaembedded.com.
For embedded operating systems, the related drivers can be found in the VIA
Embedded website at www.viaembedded.com.
4.2. Linux Driver Support
The VIA COMe-8X91 mainboard is highly compatible with many Linux
distributions.
Support and drivers are provided through various methods including:
Drivers provided by VIA
Using a driver built into a distribution package
Visiting www.viaembedded.com for the latest updated drivers
Installing a third party driver (such as the ALSA driver from the
Advanced Linux Sound Architecture project for integrated audio)
For OEM clients and system integrators developing a product for long term
production, other code and resources may also be made available. Contact
VIA Embedded to submit a request.
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Appendix A.
COMEDB3 Carrier Board
Reference
A.1. Board Specifications
COM Express Module Type
Support Mini Form Factor Type 10
Audio
VIA VT2021 High Definition Audio Codec
Super I/O
VIA VT1211 LPC super I/O
BIOS
AMI BIOS
4/8 M bit LPC Flash BIOS, PLCC 32 pin or SPI BIOS
On Board Connector
1 x LVDS connector
1 x Inverter connector
1 x CD In w/housing connector
1 x SPDIF w/housing connector
1 x SD card connector, shared with DIO1 pin header
1 x ATX power connector
1 x AUX power connector
2 x SATA connectors
2 x FAN with housing connectors for CPU FAN & System FAN.
On Board Slot
1 x PCIe x1 slots
2 x Mini PCIe sockets
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Onboard Pin Header
1 x Serial pin header with 2 sets of TX and RX signals
2 x COM pin headers (support 2 COM ports with +5V/+12V power select option RI
pin)
1 x LPT pin header
1 x SPI pin header
1 x LPC pin header
1 x DIO1 pin header, shared with SDIO connector
1 x DIO2 pin header (from VIA VT1211)
1 x SMBus pin header
1 x I2C pin header
2 x USB 2.0 pin headers for four USB 2.0 ports
1 x Panel Power Select pin header
1 x Front LAN LED pin header
1 x Front Audio pin header
1 x Front Panel pin header for HDD LED, Power LED, Switch and Speaker
Onboard Jumper
1 x Clear CMOS jumper
1 x Inverter Voltage Select jumper
1 x Panel Power Select jumper
1 x COM voltage Select jumper
2 x BIOS Type Select jumpers (for select LPC/SPI BIOS)
2 x BIOS Select jumper (for select Module/Carrier board BIOS)
6 x USB Select jumper (for select USB header/MiniPCIe)
Switch
1 x Power button switch
1 x Reset switch
Form Factor and Dimension
Mini-iTX Form Factor
6 Layers
17 cm x 17 cm
Operating Temperature
0°C up to 50°C
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Storage Temperature
-40°C to 70°C
Operating and Storage Humidity
95% relative humidity
Operating System
Microsoft Windows 7
Microsoft Windows Embedded Standard 7
Microsoft Windows XP
Microsoft Windows XPe
Microsoft Windows CE 6.0
Linux
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A.2. External I/O Connectors
The COMEDB3 has a wide selection of interfaces. It includes a selection of
frequently used ports as part of the external I/O coastline.
A.2.1. Rear I/O
Figure 34: Rear I/O ports and connectors
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A.3. COMEDB3 Layout Diagram
A.3.1. Onboard Connectors, Ports and Sockets
Figure 35: COMEDB3 slots and connectors layout
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A.3.2. Onboard Pin headers
Figure 36: COMEDB3 pin headers
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Item Description
1 F_AUDIO: Front audio pin header
2 DIO2: DIO2 pin header
3 LPT: LPT pin header
4 SPI: SPI pin header
5 DIO1: DIO1 connector
6 F_PANEL: Front Panel pin header
7 USB_4/5: USB 2.0 pin header for port 4 and 5
8 FLAN_LED: Front LAN LED pin header
9 SER_PORT: Serial Port pin header
10 SMBUS: System Management Bus pin header
11 LPC: LPC pin header
12 USB_6/7: USB 2.0 pin header for port 6 and 7
13 VGA: VGA pin header
14 I2C_BUS: I2C pin header
15 COM2: COM2 pin header
16 COM1: COM1 pin header
Table 2: Layout diagram description table of the COMe-8X91 mainboard
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MIC2_FR_L 1 2 AGND
MIC2_FR_R 3 4 FNT_DET
HP_OUT_R 5 6 MIC2_JD
FNT_IO_SENSE 7 8 KEY
HP_OUT_L 9 10 LINE2_JD
+12V 11 12 +12V
AGND 13 14 AGND
5V_DIO2 1 2 12V_DIO2
SIO_GPO30 3 4 SIO_GPI34
SIO_GPO31 5 6 SIO_GPI35
SIO_GPO32 7 8 SIO_GPI36
SIO_GPO33 9 10 SIO_GPI37
GND 11 12 GND
-LP_STB 1 2 -LP_AFD
LP_D0 3 4 -LP_ERR
LP_D1 5 6 -LP_INIT
LP_D2 7 8 -LP_SLIN
LP_D3 9 10 GND
LP_D4 11 12 GND
LP_D5 13 14 GND
LP_D6 15 16 GND
LP_D7 17 18 GND
-LP_ACK 19 20 GND
LP_BUSY
21 22 GND
LP_PE 23 24 GND
LP_SLCT 25 26 KEY
SPI_VCC 1 2 GND
-SPI_SS0 3 4 SPI_CLK
SPI_DI 5 6 SPI_DO
KEY
7 8 RESET
5V_DIO1
1 2 12V_DIO1
COM_GPO0
3 4 COM_GPI0
COM_GPO1
5 6 COM_GPI1
COM_GPO2
7 8 COM_GPI2
COM_GPO3
9 10 COM_GPI3
GND11
12 GND
F_AUDIO
LPT
3
DIO2
2
4
SPI
DIO1
5
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FP_5V 1 2 FP_3V
FP_5V 3 4 -SATA_LED
-PLED 5 6 -PW_BTN
FP_5V 7 8 GND
NC 9 10 RST_SW
NC 11 12 GND
SPEAK 13 14 FP_5V
KEY
15 16 -SLEEP_LED
VUSB 1 2 VUSB
USBD_T4- 3 4 USBD_T5-
USBD_T4+ 5 6 USBD_T5+
GND 7 8 GND
KEY
9 10 W_LESS_LED
GND 11 12 -RF_ON
3VSUS
1 2 -LAN_ACT
3VSUS 3 4 NC
GND 5 6 W_LAN_LED
3VSUS 7 8 GND
KEY
9 10 GND
SER0_TX_CON
1
2 SER0_RX_CON
NC
3
4 NC
GND
5
6 NC
SER1_TX_CON
7
8 SER1_RX_CON
NC
9
10 KEY
1 I2C_CLK
2 I2C_DATA
3 GND
LPC_AD1 1 2 LPC_33M_CLK
-LPC_RESET 3 4 GND
LPC_AD0 5 6 NC
LPC_AD2 7 8 -LPC_FRAME
LPC_SERIRQ 9 10 LPC_AD3
-LPC_DRQ1 11 12 NC
+5V 13 14 +3.3V
+5V 15 16 +3.3V
GND 17 18 GND
GND 19 20 KEY
USB2_4/5
7
LPC
11
F_PANEL
6
FLAN_LED
8
SER_PORT
9
SMBUS
10
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VUSB 1 2 VUSB
USBD_T6- 3 4 USBD_T7-
USBD_T6+ 5 6 USBD_T7+
GND 7 8 GND
KEY
9 10 GND
GND 1 2 +5V
CRT_R 3 4 SPD2
CRT_G 5 6 SPCLK2
CRT_B 7 8 CRT_HS
GND 9 10 CRT_VS
GND 11 12 GND
GND 13 14 KEY
1 I2C_CLK
2 I2C_DATA
3 GND
COM_DCD2 1 2 COM_RXD2
COM_TXD2 3 4 COM_DTR2
GND 5 6 COM_DSR2
COM_RTS2 7 8 COM_CTS2
COM_RI2 9 10 KEY
COM_DCD1 1 2 COM_RXD1
COM_TXD1 3 4 COM_DTR1
GND 5 6 COM_DSR1
COM_RTS1 7 8 COM_CTS1
COM_RI1 9 10 KEY
USB2_6/7
12
I2C BUS
14
VGA
13
COM2
15
COM1
16
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A.3.3. Onboard Jumpers
Figure 37: COMEDB3 jumpers
Item Description
17 BIOS_SEL1: Module and carrier board BIOS select jumper
18 BIOS_SEL0: Module and carrier board BIOS select jumper
19 BIOS_DIS0: Module and carrier board BIOS select jumper
20 BIOS_DIS1: Module and carrier board BIOS select jumper
21 CLEAR_CMOS: Clear CMOS jumper
22 PVDD: LCD panel power select jumper
23 IVDD: Inverter power select jumper
24 JP_USB5_SEL+: USB 2_5 enabled select jumper (+)
25 JP_USB5_SEL-: USB 2_5 enabled select jumper (-)
26 JP_USB6_SEL+: USB 2_6 enabled select jumper (+)
27 JP_USB6_SEL-: USB 2_6 enabled select jumper (-)
28 JP_COM2_VSEL: COM2 voltage select jumper
29 JP_COM1_VSEL: COM1 voltage select jumper
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BIOS_SEL1 BIOS_SEL0
Pins Description
2-3 1-2 (default)
Select Module SPI BIOS.
1-2 2-3 Select Carrier LPC BIOS.
2-3
1-2
Select Carrier SPI BIOS.
Pins Description
1-2 Use +5V for the LCD panel power.
2-3 (default)
Use +3.3V for the LCD panel power.
Pins Description
1-2 Use +5V for the Inverter power.
2-3 (default)
Use +12V for the Inverter power.
BIOS_DIS0 BIOS_DIS1
Pin Description
1-2 1-2 (default)
Select Module SPI BIOS.
2-3 1-2 Select Carrier LPC BIOS.
2-3 2-3 Select Carrier SPI BIOS.
JP
_USB5_SEL+ JP_USB5_SEL-
Pins Description
1-2 1-2 (default)
Enabled USB_4/5 pin
header
2-3 2-3 Enabled MINI_PCIE
socket
Pins Description
1-2 (default)
Keep CMOS settings.
2-3 Clear CMOS settings.
25
JP_USB5_SEL-
24
JP_USB5_SEL+
17
BIOS_SEL1
18
BIOS_SEL0
19
BIOS_DIS0
20
BIOS_DIS1
21
CLEAR_CMOS
22 PVDD
23
IVDD
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JP
_USB6_SEL+ JP_USB6_SEL-
Pins Description
1-2 1-2 (default)
Enabled USB_6/7 pin
header
2-3 2-3 Enabled MINI_PCIE1
socket
Pins Description
1-2 Enabled COM2 connector to support +5V.
2-3 (default)
Normal
3-4 Enabled COM2 connector to support +12V.
Pins Description
1-2 Enabled COM1 pin header to support +5V.
2-3 (default)
Normal
3-4 Enabled COM1 pin header to support +12V.
28
JP_COM2_VSEL
29
JP_COM1_VSEL
27
JP_USB6_SEL-
26
JP_USB6_SEL+
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