VESTEL 11AK52 TABLE OF CONTENTS

TABLE OF CONTENTS
1.INTRODUCTION ....................................................................................................................................1
2.TUNER....................................................................................................................................................1
3.IF PART (TDA9885/86).......................................................................................................................... 1
4.VIDEO SWITCH TEA6415 .....................................................................................................................2
5.MULTI STANDARD SOUND PROCESSOR..........................................................................................2
6.SOUND OUTPUT STAGE WITH TDA7480L.........................................................................................2
8.VIDEO OUTPUT AMPLIFIER TDA6109................................................................................................3
9.POWER SUPPLY (SMPS) .....................................................................................................................3
10.MICROCONTROLLER SDA5550........................................................................................................3
10.1.General Features..........................................................................................................................3
10.2.External Crystal and Programmable Clock Speed ...................................................................3
10.3.Microcontroller Features.............................................................................................................3
10.4.Memory..........................................................................................................................................3
10.5.Display Features ..........................................................................................................................3
10.6.ROM Characters...........................................................................................................................4
10.7.Acquisition Features....................................................................................................................4
10.8.Ports ..............................................................................................................................................4
11.SERIAL ACCESS 32K EEPROM ........................................................................................................4
12.CLASS AB STEREO HEADPHONE DRIVER TDA1308....................................................................4
13.SAW FILTERS......................................................................................................................................4
14.IC DESCRIPTIONS ..............................................................................................................................5
14.1.TDA6109........................................................................................................................................5
14.1.1.General Description ..............................................................................................................5
14.1.2.Features..................................................................................................................................5
14.1.3.Pinning....................................................................................................................................5
14.2.27W401..........................................................................................................................................6
14.2.1.Description.............................................................................................................................6
14.2.2.Features..................................................................................................................................6
14.2.3.Connections...........................................................................................................................6
14.3.24LC32A........................................................................................................................................7
14.3.1.Description.............................................................................................................................7
14.3.2.Features..................................................................................................................................7
14.3.3.Pin Descriptions....................................................................................................................7
14.4.SDA5275........................................................................................................................................8
14.4.1.Features..................................................................................................................................8
14.4.2.Pin Definition and functions.................................................................................................8
14.5.DRAM 4MX4..................................................................................................................................9
14.5.1.General Description ..............................................................................................................9
14.5.2.Features................................................................................................................................10
14.5.3.Pin Assignment ...................................................................................................................10
14.6.SDA9400......................................................................................................................................10
14.6.1.General Description ............................................................................................................10
14.6.2.Features................................................................................................................................10
14.6.3.Pin Definition .......................................................................................................................11
14.7.LM317T........................................................................................................................................12
14.7.1.Description...........................................................................................................................12
14.7.2.Features................................................................................................................................12
14.8.DDP3310......................................................................................................................................12
14.8.1.Description...........................................................................................................................12
14.8.2.Features................................................................................................................................12
14.8.3.Pin connection and short descriptions.............................................................................13
14.9.SDA5550......................................................................................................................................14
14.9.1.General definition................................................................................................................14
14.9.2.Features................................................................................................................................15
14.10.TEA6415C..................................................................................................................................16
14.10.1.General Description ..........................................................................................................16
14.10.2.Features..............................................................................................................................16
14.10.3.Pinning................................................................................................................................16
14.11.VPC3230D .................................................................................................................................17
i
14.11.1.General Description ..........................................................................................................17
14.11.2.Pin Connections and Short Descriptions .......................................................................17
14.12.TDA1308T..................................................................................................................................19
14.12.1.General Description ..........................................................................................................19
14.12.2.Features..............................................................................................................................19
14.12.3.Pinning................................................................................................................................19
14.13.MSP34X1G (MSP3411G)..........................................................................................................19
14.13.1.Description.........................................................................................................................19
14.13.2.Features..............................................................................................................................20
14.13.3.Pin connections.................................................................................................................20
14.14.TL431.........................................................................................................................................22
14.14.1.Description.........................................................................................................................22
14.14.2.Features..............................................................................................................................22
14.14.3.Pin Configurations ............................................................................................................22
14.15.TDA9885/86...............................................................................................................................22
14.15.1.Introduction........................................................................................................................22
14.15.2.Features..............................................................................................................................22
14.15.3.Pin Configurations ............................................................................................................23
14.16.LM7808......................................................................................................................................23
14.16.1.Description.........................................................................................................................23
14.16.2.Features..............................................................................................................................23
14.17.TDA8177F..................................................................................................................................24
14.17.1.Description.........................................................................................................................24
14.17.2.Features..............................................................................................................................24
14.17.3.Pin connections.................................................................................................................24
14.17.4.Block Diagram ...................................................................................................................24
14.18.LM1086......................................................................................................................................24
14.18.1.Description.........................................................................................................................24
14.18.2.Features..............................................................................................................................24
14.18.3.Applications.......................................................................................................................25
14.18.4.Connection Diagrams .......................................................................................................25
14.19.MC44608....................................................................................................................................25
14.19.1.Description.........................................................................................................................25
14.19.2.General Features...............................................................................................................25
14.19.3.Pin Connections................................................................................................................26
14.20.TCET1102G...............................................................................................................................26
14.20.1.Description.........................................................................................................................26
14.20.2.Applications.......................................................................................................................26
14.20.3.Features..............................................................................................................................26
14.21.TDA7480L..................................................................................................................................27
14.21.1.Description.........................................................................................................................27
14.21.2.Features..............................................................................................................................27
14.21.3.Pin Functions.....................................................................................................................27
14.22.SAA3010T..................................................................................................................................27
14.22.1.Description.........................................................................................................................27
14.22.2.Features..............................................................................................................................28
14.22.3.Pinning................................................................................................................................28
15.AK52 CHASSIS MANUAL ADJUSTMENTS PROCEDURE.............................................................29
15.1.PRELIMINARY.............................................................................................................................29
15.2.SYSTEM VOLTAGE ADJUSTMENTS........................................................................................29
15.3.AFC ADJUSTMENTS..................................................................................................................29
15.4.FOCUS ADJUSTMENTS.............................................................................................................29
15.5.SCREEN ADJUSTMENTS..........................................................................................................29
15.6.IF ADJUSTMENT FOR L’ MODE................................................................................................29
16.AK52 CHASSIS PRODUCTION SERVICE MODE ADJUSTMENTS ...............................................29
16.1.PRELIMINARY.............................................................................................................................30
16.2.H/V (HORIZONTAL AND VERTICAL GEOMETRY ALIGNMENTS)..........................................30
16.3.VIDEO ALIGNMENTS.................................................................................................................33
16.4.SERVICE ALIGNMENTS.............................................................................................................34
17.BLOCK DIAGRAM.............................................................................................................................36
18.CIRCUIT DIAGRAMS.........................................................................................................................37
ii
1.INTRODUCTION
11AK52 is a 100Hz flicker free colour television capable of driving 28”4:3/16:9, 32” 16:9, 33”4:3 and 29”4:3 real flat picture tubes. The chassis is capable of operation in PAL, SECAM, NTSC (playback) colour standards and multiple transmission standards as B/G, D/K, I/I’, and L/L´. Sound system output is supplying 2x10W (10%THD) for left and right outputs of 8ohm speakers. TV supports the level 1.5 teletext standard. It is possible to decode transmissions including high graphical data. The chassis is equipped with two full EuroScarts, one SCART for AV input/output, one front-AV input, one back-AV input, one headphone output, one SVHS input (via SCART and SVHS connector), two external speaker outputs (left and right).
2.TUNER
The hardware and software of the TV is suitable for tuners, supplied by different companies, which are selected from the Service Menu. These tuners can be combined VHF, UHF tuners suitable for CCIR systems B/G, H, L, L´, I/I´, and D/K. The tuning is available through the digitally controlled I (PLL). Below you will find info on one of the Tuners in use.
General description of UV1316:
The UV1316 tuner belongs to the UV 1300 family of tuners, which are designed to meet a wide range of applications. It is a combined VHF, UHF tuner suitable for CCIR systems B/G, H, L, L’, I and I’. The low IF output impedance has been designed for direct drive of a wide variety of SAW filters with sufficient suppression of triple transient.
Features of UV1316:
1. Member of the UV1300 family small sized UHF/VHF tuners
2. Systems CCIR: B/G, H, L, L’, I and I’; OIRT: D/K
3. Digitally controlled (PLL) tuning via I
2
C-bus
4. Off-air channels, S-cable channels and Hyperband
5. World standardized mechanical dimensions and world standard pinning
6. Compact size
7. Complies to “CENELEC EN55020” and “EN55013”
2
C bus
Pinning:
1. Gain control voltage (AGC) : 4.0V, Max: 4.5V
2. Tuning voltage
3. I²C-bus address select : Max: 5.5V
4. I²C-bus serial clock : Min:-0.3V, Max: 5.5V
5. I²C-bus serial data : Min:-0.3V, Max: 5.5V
6. Not connected
7. PLL supply voltage : 5.0V, Min: 4.75V, Max: 5.5V
8. ADC input
9. Tuner supply voltage : 33V, Min: 30V, Max: 35V
10. Symmetrical IF output 1
11. Symmetrical IF output 2
3.IF PART (TDA9885/86)
The TDA9885 is an alignment-free single standard (without positive modulation, only PAL) vision and sound IF signal PLL. The TDA9886 is an alignment-free multistandard (PAL, SECAM and NTSC) vision and sound IF signal PLL Both devices can be used for TV, VTR, PC and set-top box applications. The following figure shows the simplified block diagram of the integrated circuit. The integrated circuit comprises the following functional blocks: VIF amplifier, Tuner and VIF-AGC, VIF-AGC detector, Frequency Phase-Locked Loop (FPLL) detector, VCO and divider, Digital acquisition help and AFC, Video demodulator and amplifier, Sound carrier trap, SIF amplifier, SIF-AGC detector, Single reference QSS mixer, AM demodulator, FM demodulator and acquisition help, Audio amplifier and mute time constant, I voltage stabilizer.
2
C-bus transceivers and MAD (module address), Internal
1
4.VIDEO SWITCH TEA6415
In case of three or more external sources are used, the video switch IC TEA6415 is used. The main function of this device is to switch 8 video-input sources on the 6 outputs. Each output can be switched on only one of each input. On each input an alignment of the lowest level of the signal is made (bottom of sync. top for CVBS or black level for RGB signals). Each nominal gain between any input and output is 6.5dB.For D2MAC or Chroma signal the alignment is switched off by forcing, with an external resistor bridge, 5VDC on the input. Each input can be used as a normal input or as a MAC or Chroma input (with external Resistor Bridge). All the switching possibilities are changed through the BUS. Driving 75ohm load needs an external resistor. It is possible to have the same input connected to several outputs.
5.MULTI STANDARD SOUND PROCESSOR
The MSP34x1G family of single-chip Multi-standard Sound Processors covers the sound processing of all analog TV-Standards worldwide, as well as the NICAM digital sound standards. The full TV sound processing, starting with analog sound IF signal-in, down to processed analog AF-out, is performed on a single chip. Signal conforming to the standard by the Broadcast Television Systems Committee (BTSC). The DBX noise reduction, or alternatively, MICRONAS Noise Reduction (MNR) is performed alignment free. Other processed standards are the Japanese FM-FM multiplex standard (EIA-J) and the FM Stereo Radio standard.
6.SOUND OUTPUT STAGE WITH TDA7480L
The TDA7480L is an audio class-D amplifier assembled in Power DIP package specially designed for high efficiency applications mainly for TV and Home Stereo sets. Mute stand-by function of the audio amplifier can be described as the following; the pin 12 (MUTE/STAND-BY) controls the amplifier status by two different thresholds, referred to ground. When Vpin 12 voltage is lower than 0.7V the amplifier is in Stand-by mode and the final stage generators are off. When Vpin 12 is higher than 4V, the amplifier is in play mode. The TDA7480L is a 10W+10W stereo sound amplifier with mute/stand-by facility. MUTE control signal coming from microcontroller (when it is at high level) activates the mute function. IC is muted when mute pin is at low level (pin12). MUTE pin can also be activated via an external pop-noise circuitry in order to eliminate pop noise when TV is turned off. Just after the TV is turned off, this circuit switches the IC to stand-by mode by pulling the mute pin voltage to ground.
7.VERTICAL OUTPUT STAGE WITH TDA8177F
The IC TDA8177F is the vertical deflection booster circuit. Two supply voltages, +12V and -12V are needed to scan the inputs VERT+ and VERT-, respectively. And a third supply voltage, +60V for the flyback limiting are needed. The vertical deflection coil is connected in series between the output and feedback to the input.
2
8.VIDEO OUTPUT AMPLIFIER TDA6109
The TDA6109 includes three video output amplifiers in order to drive the three cathodes of a colour picture tube directly. To obtain maximum performance, the amplifier is used with black-current control.
9.POWER SUPPLY (SMPS)
The DC voltages required at various parts of the chassis are provided by an SMPS transformer controlled by the IC MC44608, which is designed for driving, controlling and protecting switching transistor of SMPS. The transformer generates 135V for FBT input, +/-14V for audio amplifier, 8V stand by voltage and 8V, 12V and 5V supplies for other different parts of the chassis. An optocoupler is used to control the regulation of line voltage and stand-by power consumption. There is a regulation circuit in secondary side. This circuit produces a control voltage according to the changes in 135V DC voltage, via an optocoupler (TCET 1102G) to pin3 of the IC. During the switch on period of the transistor, energy is stored in the transformer. During the switch off period energy is fed to the load via secondary winding. By varying switch-on time of the power transistor, it controls each portion of energy transferred to the second side such that the output voltage remains nearly independent of load variations.
10.MICROCONTROLLER SDA5550
10.1.General Features
• Feature selection via special function register
• Simultaneous reception of TTX, VPS, PDC, and WSS (line 23)
• Supply Voltage 2.5 and 3.3 V
• ROM version is used.
10.2.External Crystal and Programmable Clock Speed
• Single external 6MHz crystal, all necessary clocks are generated internally
• CPU clock speed selectable via special function registers.
• Normal Mode 33.33 MHz CPU clock, Power Save mode 8.33 MHz
10.3.Microcontroller Features
• 8bit 8051 instruction set compatible CPU.
• 33.33-MHz internal clock (max.)
• 0.360 ms (min.) instruction cycle
• Two 16-bit timers
• Watchdog timer
• Capture compare timer for infrared remote control decoding
• Pulse width modulation unit (2 channels 14 bit, 6 channels 8 bit)
• ADC (4 channels, 8 bit)
• UART (rxd, txd)
10.4.Memory
• Up to 128 Kilobyte on Chip Program ROM
• Eight 16-bit data pointer registers (DPTR)
• 256-bytes on-chip Processor Internal RAM (IRAM)
• 128bytes extended stack memory.
• Display RAM and TXT/VPS/PDC/WSS-Acquisition-Buffer directly accessible via MOVX
• UP to 16KByte on Chip Extended RAM (XRAM) consisting of;
- 1 Kilobyte on-chip ACQ-buffer-RAM (access via MOVX)
- 1 Kilobyte on-chip extended-RAM (XRAM, access via MOVX) for user software
- 3 Kilobyte Display Memory
10.5.Display Features
• ROM Character set supports all East and West European Languages in single device
• Mosaic Graphic Character Set
• Parallel Display Attributes
• Single/Double Width/Height of Characters
• Variable Flash Rate
• Programmable Screen Size (25 Rows x 33...64 Columns)
• Flexible Character Matrixes (HxV) 12 x 9...16
• Up to 256 Dynamical Redefinable Characters in standard mode; 1024 Dynamical Redefinable Characters in Enhanced Mode
• CLUT with up to 4096 colour combinations
• Up to 16 Colours per DRCS Character
• One out of 8 Colours for Foreground and Background Colours for 1-bit DRCS and ROM Characters
3
10.6.ROM Characters
• Shadowing
• Contrast Reduction
• Pixel by Pixel Shiftable Cursor With up to 4 Different Colours
• Support of Progressive Scan and 100 Hz.
• 3 X 4Bits RGB-DACs On-Chip
• Free Programmable Pixel Clock from 10 MHz to 32MHz
• Pixel Clock Independent from CPU Clock
• Multinorm H/V-Display Synchronization in Master or Slave Mode
10.7.Acquisition Features
• Multi-standard Digital Data Slicer
• Parallel Multi-norm Slicing (TTX, VPS, WSS, CC, G+)
• Four Different Framing Codes Available
• Data Caption only limited by available Memory
• Programmable VBI-buffer
• Full Channel Data Slicing Supported
• Fully Digital Signal Processing
• Noise Measurement and Controlled Noise Compensation
• Attenuation Measurement and Compensation
• Group Delay Measurement and Compensation
• Exact Decoding of Echo Disturbed Signals
10.8.Ports
• One 8-bit I/O-port with open drain output and optional I
2
C Bus emulation support (Port0)
• Two 8-bit multifunction I/O-ports (Port1, Port3)
• One 4-bit port working as digital or analogue inputs for the ADC (Port2)
• One 2-bit I/O port with secondary function (P4.2, 4.3, 4.7)
• One 4-bit I/O-port with secondary function (P4.0, 4.1, 4.4) (Not available in P-SDIP 52)
11.SERIAL ACCESS 32K EEPROM
24LC32 is the 32Kbit electrically erasable programmable memory. The memory is compatible with the
2
I
C standard, two wire serial interface, which uses a bi-directional data bus and serial clock.
12.CLASS AB STEREO HEADPHONE DRIVER TDA1308
The TDA1308 is an integrated class AB stereo headphone driver contained in a DIP8 plastic package. The device is fabricated in a 1 mm CMOS process and has been primarily developed for portable digital audio applications.
13.SAW FILTERS
K3953M:
Standard
B/G, D/K, I, L/L’
Features
TV IF video filter with Nyquist slopes at 33,90 MHz and 38,90 MHz Constant group delay Suitable for CENELEC EN 55020
Terminals
Tinned CuFe alloy
Pin configuration
1 Input 2 Input - ground 3 Chip carrier - ground 4 Output 5 Output
K3958M:
Standard
B/G, D/K, I, L/L’
Features
TV IF video filter with Nyquist slopes at 33.90 MHz and 38.90 MHz Constant group delay Terminal and Pin configuration are the same with
K3953M
4
K9356M:
Standard
B/G, D/K, I, L
Features
TV IF audio filter with pass band for sound carriers at 32,40 MHz (D/K, L), 32,90 MHz (I) and 33,40 MHz (B/G) Terminal and Pin configuration are the same with
K3953M
K9656M:
Standard
B/G, D/K, I, L/L’
Features
TV IF audio filter with two channels Channel 1 (L’) with one pass band for sound carriers at 40,40 MHz (L’) and 39,75 MHz (L’- NICAM) Channel 2 (B/G, D/K, L, I) with one pass band for sound carriers between 32,35 MHz and 33,40 MHz Terminal and Pin configuration are the same with
K3953M
14.IC DESCRIPTIONS
TDA6109 27W401 24LC32 SDA5275 DRAM 4MX4 SDA9400 LM317T DDP3310 SDA5550 TEA6415 VPC3230D TDA1308T MSP3411G TL431 TDA9885/86 LM7808 TDA8177F LM1086 MC44608 TCET1102G TDA7480L SAA3010T
14.1.TDA6109
14.1.1.General Description
The TDA6109JF includes three video output amplifiers in one plastic DIL-bent-SIL 9-pin medium power (DBS9MPF) package (SOT111-1), using high-voltage DMOS technology, and is intended to drive the three cathodes of a colour CRT directly. To obtain maximum performance, the amplifier should be used with black­current control.
14.1.2.Features
· Typical bandwidth of 9.0 MHz for an output signal of 60 V (p-p)
· High slew rate of 1850 V/ms
· No external components required
· Very simple application
· Single supply voltage of 200 V
· Internal reference voltage of 2.5 V
· Fixed gain of 51
· Black-Current Stabilization (BCS) circuit
· Thermal protection
14.1.3.Pinning
SYMBOL PIN DESCRIPTION
V
i(1)
V
i(2)
V
i(3)
GND 4 ground (fin) I
om
V
DD
V
oc(3)
V
oc(2)
V
oc(1)
1 inverting input 1 2 inverting input 2 3 inverting input 3
5 black current measurement output 6 supply voltage 7 cathode output 3 8 cathode output 2 9 cathode output 1
5
14.2.27W401
14.2.1.Description
The M27W401 is a low voltage 4 Mbit EPROM offered in the two ranges UV (ultra violet erase) and OTP (one time programmable). It is ideally suited for microprocessor systems requiring large data or program storage and is organized as 524,288 by 8 bits. The M27W401 operates in the read mode with a supply voltage as low as 2.7V at –40 to 8C temperature range. The decrease in operating power allows either a reduction of the size of the battery or an increase in the time between battery re­charges. The FDIP32W (window ceramic frit-seal package) has a transparent lid, which allows the user to ex­pose the chip to ultraviolet light to erase the bit pat-tern. A new pattern can then be written to the device by following the programming procedure. For application where the content is programmed only one time and erasure is not required, the M27W401 is offered in PDIP32, PLCC32 and TSOP32 (8x20 mm) packages.
14.2.2.Features
2.7V to 3.6v Low voltage in Read Operation Access time: –70ns at V –80ns at V Pin Compatible with M27C4001 Low Power Consumption: –1mA max Standby Current – 15mA max Active Current at 5MHz Programming Time 10ms/byte High Reliability CMOS Technology – 2,000V ESD Protection – 200mA Latchup Protection Immunity Electronic Signature – Manufacturer Code: 20h – Device Code: 41h
= 3.0V to 3.6V
CC
= 2.7V to 3.6V
CC
14.2.3.Connections
DIP connections LCC Connections TSOP Connections
6
Signal Names
A0-A18 Address Inputs Q0-Q7 Data Outputs Chip Enable G Output Enable V
pp
V
cc
V
ss
Program Supply Supply Voltage Ground
14.3.24LC32A
14.3.1.Description
The Microchip Technology Inc. 24LC32A is a 4K x 8 (32K bit) Serial Electrically Erasable PROM capable of operation across a broad voltage range (2.5V to 6.0V). It has been developed for advanced, low power applications such as personal communications or data acquisition. The 24LC32A also has a page-write capability of up to 32 bytes of data. The 24LC32A is capable of both random and sequential reads up to the 32K boundary. Functional address lines allow up to eight 24LC32A devices on the same bus, for up to 256K bits address space. Advanced CMOS technology and broad voltage range make this device ideal for low-power/ low-voltage, nonvolatile code and data applications. The 24LC32A is available in the standard 8-pin plastic DIP and both 150 mil and 200 mil SOIC packaging.
14.3.2.Features
• Single supply with operation down to 2.5V
• Maximum write current 3 mA at 6.0V
• Standby current 1 mA max at 2.5V
• 2-wire serial interface bus, I 2 CÔ compatible
• 100 kHz (2.5V) and 400 kHz (5V) compatibility
• Self-timed ERASE and WRITE cycles
• Power on/off data protection circuitry
• Hardware write protect
• 1,000,000 Erase/Write cycles guaranteed
• 32 byte page or byte write modes available
• Schmitt trigger filtered inputs for noise suppression
• Output slope control to eliminate ground bounce
• 2 ms typical write cycle time, byte or page
• Up to eight devices may be connected to the same bus for up to 256K bits total memory
• Electrostatic discharge protection > 4000V
• Data retention > 200 years
• 8-pin PDIP and SOIC packages
• Temperature ranges
• Commercial (C): 0°C to +75°C
• Industrial (I): -40°C to +85°C
14.3.3.Pin Descriptions A0, A1, A2 Chip Address Inputs
The A0..A2 inputs are used by the 24LC32A for multiple device operation and conform to the 2-wire bus standard. The levels applied to these pins define the address block occupied by the device in the address map. A particular device is selected by transmitting the corresponding bits (A2, A1, A0) in the control byte.
SDA Serial Address/Data Input/Output
This is a Bi-directional pin used to transfer addresses and data into and data out of the device. It is an open drain terminal, therefore the SDA bus requires a pull up resistor to V
CC (typical 10 k for 100 kHz,
2 k for 400 kHz) For normal data transfer SDA is allowed to change only during SCL low. Changes during SCL HIGH are reserved for indicating the START and STOP conditions.
SCL Serial Clock
This input is used to synchronize the data transfer from and to the device.
7
WP
This pin must be connected to either V
SS or VCC. If tied to VSS, normal memory operation is enabled
(read/write the entire memory 000-FFF). If tied to VCC, WRITE operations are inhibited. The entire memory will be write-protected. Read operations are not affected.
W
CC
+2.5V to 6V Power Supply
SS
W
Ground
14.4.SDA5275
14.4.1.Features
• Single chip teletext IC
• Analog CVBS-input with onchip clamping circuitry
• Slicer
• Supports level 1, 2.5 and 3.5 ETSI teletext standard
• Stores up to 14 teletext pages on chip
• Stores up to 2048 teletext pages with external 16 M memory
• SDA 5275: full level 2.5 processing
• Analog RGB-output
• 41 Latin script languages
• 12 ´ 10 character size
• Parallel display attributes
• 64 from 4096 colors selectable
• Enhanced flash modes
• Dynamically redefinable character set (DRCS, PCS)
• Pixel graphics
• Full screen display (64 ´ 32 or 80 ´ 24 character positions)
• Horizontal and vertical scrolling
• Graphic cursors
• 4:3 and 16:9 display
• Multinorm display (50/60/100/120 Hz)
• RISC-processor
• Firmware downloadable
2
• I
C / 3 wire UART-interface (1 Mbit/s)
• Independent clocks for acquisition and display
• Tools for greatly simplified software development
• 24-Kbyte on-chip reconfigurable DRAM
• 44160-bit character ROM
• One external crystal for all standards
14.4.2.Pin Definition and functions
Pin No. P-LCC-68-1 Symbol Function
1 INTQ Interrupt request output to ext. controller 2 CLK-IO System clock input/output 3 TCSQ/FLD Composite sync output/ field output 4 VS/VCS Vertical sync input/output 5 HS Horizontal sync input/output 6 XOUT 20.5-MHz crystal oscillator output 7 XIN 20.5-MHz crystal oscillator input 8 GPO General purpose output 9 TM Test pin, leave open or connect VSS 10 CVBS CVBS-video signal input 11 VDD1 + 5 V digital supply 12 VDDA + 5 V analog supply 13 VSSA1 Analog ground 14 N.C. Not connected 15 N.C. Not connected 16 VDD2 + 5 V digital supply 17 RES Chip reset 18 N.C. Not connected
8
19 N.C. Not connected 20 N.C. Not connected 21 VDD3 + 5 V digital supply 22 N.C. Not connected 23 VREF + 3 V reference voltage input 24 N.C. Not connected 25 VDD4 + 5 V digital supply 26 A8 External DRAM-address 27 A7 External DRAM-address 28 A6 External DRAM-address 29 A5 External DRAM-address 30 A4 External DRAM-address 31 A3 External DRAM-address 32 A2 External DRAM-address 33 A1 External DRAM-address 34 A0 External DRAM-address 35 A9 External DRAM-address 36 A10 External DRAM-address 37 A11 External DRAM-address 38 RASQ Row address strobe (DRAM) 39 WEQ Write enable (DRAM) 40 D1 External DRAM-data 41 D0 External DRAM-data 42 D2 External DRAM-data 43 D3 External DRAM-data 44 VSS4 0 V digital supply 45 CASQ Column address strobe 46 N.C. Not connected 47 N.C. Not connected 48 N.C. Not connected 49 VSS3 0 V digital supply 50 N.C. Not connected 51 N.C. Not connected 52 N.C. Not connected 53 N.C. Not connected 54 N.C. Not connected 55 VSS2 0 V digital supply 56 VBB Substrate bias voltage N.C.* (depends on version) 57 N.C. Not connected 58 VSSA2 Analog ground 59 RGB-GND RGB-ground 60 VSS1 0 V digital supply 61 R Analog red display output 62 G Analog green display output 63 B Analog blue display output 64 BLAN Blanking signal open drain output 65 CORQ Contrast reduction open drain output 66 SCL Bi-directional I2C Bus clock port 67 SDA Bi-directional I2C Bus data port 68 I2CEN I2C Bus enable
14.5.DRAM 4MX4
14.5.1.General Description
The 4 Meg x 4 DRAM is a randomly accessed, solid-state memory containing 16,777,216 bits organized in a x4 con-figuration. RAS# is used to latch the row address (first 11 bits for 2K and first 12 bits for 4K). Once the page has been opened by RAS#, CAS# is used to latch the column address
latter 11 bits for 2K and
the latter 10 bits for 4K, address pins A10 and A11 are “don’t care”). READ and WRITE cycles are selected with the WE# input. A logic HIGH on WE# dictates READ mode, while a logic LOW on WE# dictates WRITE mode. During a WRITE cycle, data-in (D) is latched by the falling edge of WE# or CAS#, whichever occurs last. An EARLY WRITE occurs when WE# is taken LOW prior to CAS# falling. A LATE WRITE or READ-MODIFY-WRITE occurs when WE# falls after CAS# is taken LOW. During EARLY WRITE cycles, the data outputs (Q) will remain High-Z regardless of the state of OE#. During LATE WRITE or READ-MODIFY-WRITE cycles, OE# must be taken HIGH to disable the
9
(the
data outputs prior to applying input data. If a LATE WRITE or READ-MODIFY-WRITE is attempted while keeping OE# LOW, no write will occur, and the data outputs will drive read data from the accessed location. The four data inputs and the four data outputs are routed through four pins using common I/O, and pin direction is controlled by WE# and OE#.
14.5.2.Features
• Industry-standard x4 pin out, timing, functions and packages
• State-of-the-art, high-performance, low-power CMOS silicon-gate process
• Single power supply (+3.3V ±0.3V or +5V ±10%)
• All inputs, outputs and clocks are TTL-compatible
• Refresh modes: RAS#-ONLY, HIDDEN and CAS#-BEFORE- RAS# (CBR)
• Optional Self Refresh (S) for low-power data retention
• 11 row, 11 column addresses (2K refresh) or 12 row, 10 column addresses (4K refresh)
• Extended Data-Out (EDO) PAGE MODE access cycle
• 5V-tolerant inputs and I/Os on 3.3V devices
14.5.3.Pin Assignment
Top View
*NC on 2K refresh and A11 on 4K refresh options. Note: The “#” symbol indicates signal is active LOW.
14.6.SDA9400
14.6.1.General Description
The SDA9400 is a new component of the Micronas MEGAVISION ® IC set in a 0.35µm embedded DRAM technology (frame memory embedded). The SDA9400 is pin compatible to the SDA9401 (field memory embedded). The SDA9400 comprises all main functionalities of a digital feature box in one monolithic IC. The scan rate conversion to 100/120 Hz interlaced (50/60 Hz progressive) is based on a motion adaptive algorithm. The scan rate converted picture can be vertically expanded. The SDA9400 has a free running mode, therefore features like scan rate conversion to e.g. 70, 75 Hz with joint lines or multiple picture display (e.g. tuner scan) are possible. Due to the frame based signal processing, the noise reduction has been greatly improved. Furthermore separate motion detectors for luminance and chrominance have been implemented. For automatic controlling of the noise reduction parameters a noise measurement algorithm is included, which measures the noise level in the picture or in the blanking period. In addition a spatial noise reduction is implemented, which reduces the noise even in the case of motion. The input signal can be compressed horizontally and vertically with a certain number of factors. Therefore split screen is supported. Beside these additional functions like coloured background, windowing and flashing are implemented.
14.6.2.Features
• Two input data formats
- 4:2:2 luminance and chrominance parallel (2 x 8 wires)
- ITU-R 656 data format (8 wires)
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• Two different representations of input chrominance data
- 2‘s complement code
- Positive dual code
• Flexible input sync controller
• Flexible compression of the input signal
- Digital vertical compression of the input signal (1.0, 1.25, 1.5, 1.75, 2.0, 3.0, 4.0)
- Digital horizontal compression of the input signal (1.0, 2.0, 4.0)
• Noise reduction
- Motion adaptive spatial and temporal noise reduction (3D-NR)
- Temporal noise reduction for luminance frame based or field based
- Temporal noise reduction for chrominance field based
- Separate motion detectors for luminance and chrominance
- Flexible programming of the temporal noise reduction parameters
- Automatic measurement of the noise level (5-bit value, readable by I²C bus)
• 3-D motion detection
- High performance motion detector for scan rate conversion
- Global motion detection flag (readable by I²C bus)
- Movie mode and phase detector (readable by I²C bus)
• TV mode detection by counting line numbers (PAL, NTSC, readable by I²C bus)
• Embedded memory
- 5 Mbit embedded DRAM core for field memories
- 192 kbit embedded DRAM core for line memories
• Flexible clock and synchronization concept
- Decoupling of the input and output clock system possible
• Scan rate conversion
- Motion adaptive 100/120 Hz interlaced scan conversion
- Motion adaptive 50/60 Hz progressive scan conversion
- Simple static interlaced and progressive conversion modes for 100/120 Hz interlaced or 50/60 Hz progressive scan conversion: e.g. ABAB, AABB, AA*B*B, AAAA, BBBB, AB, AA*
- Simple progressive scan conversion with joint lines: 50 Hz -> 60, 70, 75 Hz progressive 60 Hz -> 70, 75 Hz progressive
- Large area and line flicker reduction
• Flexible digital vertical expansion of the output signal (1.0, ... [1/32] ..., 2.0)
• Flexible output sync controller
- Flexible positioning of the output signal
- Flexible programming of the output sync raster
- External synchronization by backend IC possible (e.g. split screen for one TV channel with joint lines and one PC VGA channel)
• Signal manipulations
- Insertion of coloured background
- Vertical and/or horizontal windowing with four different speed factors
- Flash generation (for supervising applications, motion flag readable by I²C bus)
- Still frame or field
- Support of split screen applications
- Multiple picture display - Tuner scan (4 and 16 times for 4:3, 12 times for 16:9 tubes)
- Support of multi picture display with PIP or front-end processor with integrated scaler (e.g. 9 times display of PIP pictures, picture tracking, random pictures, still-in-moving picture, moving­in-still picture)
• I²C-bus control (400 kHz)
• P-MQFP-64 package
• 3.3 V ± 5% supply voltage
14.6.3.Pin Definition
Pin No. Name Type Description
2,8,24,42,55 VSS1 S Supply voltage ( V SS = 0 V ) 9,25,41,56 VDD1 S Supply voltage ( V DD = 3.3 V ) 36,52,58 VSS2 S Supply voltage ( V SS = 0 V ) 35,51,53,57,59 VDD2 S Supply voltage ( V DD = 3.3 V ) 43,..,50 YIN0...7 I/TTL Data input Y (see input data format) 31,..,34;37,...,40 UVIN0...7 I/TTL Data input UV (for 4:2:2 parallel, see input data format)
11
PD (for CCIR 656, see input data format)
30 RESET I/TTL System reset. The RESET input is low active. In order to ensure
correct operation a "Power On Reset" must be performed. The RESET pulse must have a minimum duration of two clock periods of the system clock CLK1.
23 HIN I/TTL
PD
22 VIN I/TTL
PD 29 SYNCEN I/TTL Synchronization enable input 21 SDA I/O I2C-Bus data line (5V ability) 20 SCL I I I2C-Bus clock line (5V ability) 54 CLK1 I/TTL System clock 1 17,..,10 UVOUT0...7 O/TTL Data output UV (see output data format) 7,..,3;1;64;63 YOUT0...7 O/TTL Data output Y (see output data format) 62 HREF O/TTL Horizontal active video output 61 VOUT/
VEXT
60 HOUT/
HEXT 18 INTERLACED O/TTL Interlace signal for AC coupled vertical deflection 28 X1 / CLK2 I/TTL Crystal connection / System clock 2 27 X2 O/AN Crystal connection 26 CLKOUT O/TTL Clock output (depends on I²C parameters CLK11EN, CLK21EN,
19 TEST I/TTL Test input, connect to V SS for normal operation
I/O/ TTL I/O/ TTL
H-Sync input (only for full CCIR 656) V-Sync input (only for full CCIR 656)
EXSYN=0 (I²C-bus parameter): V-Sync output EXSYN=1: External V-Sync input for output part EXSYN=0 (I²C-bus parameter): H-Sync output EXSYN=1: External H-Sync input for output part
FREQR)
14.7.LM317T
14.7.1.Description
The LM317T is an adjustable 3 terminal positive voltage regulator capable of supplying in excess of 1.5 amps over an output range of 1.25 to 37 volts. This voltage regulator is exceptionally easy to use and requires only two external resistors to set the output voltage. Further, it employs internal current limiting, thermal shutdown and safe area compensation, making it essentially blow–out proof. The LM317 serves a wide variety of applications including local, on card regulation. This device can also be used to make a programmable output regulator, or by connecting a fixed resistor between the adjustment and output, the LM317 can be used as a precision current regulator.
14.7.2.Features
• Output Current in Excess of 1.5 A
• Output Adjustable between 1.2 V and 37 V
• Internal Thermal Overload Protection
• Internal Short Circuit Current Limiting Constant with Temperature
• Output Transistor Safe–Area Compensation
• Floating Operation for High Voltage Applications
• Available in Surface Mount D
2
PAK, and Standard 3–Lead Transistor Package
• Eliminates Stocking many Fixed Voltages
14.8.DDP3310
14.8.1.Description
The DDP 3310B is a single-chip digital Display and Deflection Processor designed for high-quality back-end applications in 100/120-Hz TV sets with 4:3 or 16:9 picture tubes. The IC can be combined with members of the DIGIT 3000 IC family (VPC 32xx, TPU 3040), or it can be used with third-party products. The IC contains the entire digital video component and deflection processing and all analog interface components.
14.8.2.Features Video processing
– linear horizontal scaling (0.25 … 4) – non-linear horizontal scaling “panorama-vision” – dynamic peaking
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– soft limiter (gamma correction) – color transient improvement – programmable RGB matrix – picture frame generator – two analog RGB/Fast-Blank inputs. The DDP 3310B is a single-chip digital Display and Deflection Processor designed for high-quality back-
Deflection processing
– scan velocity modulation output – high-performance H/V deflection – EHT compensation for vertical / East/West – soft start/stop of H-Drive – vertical angle and bow – differential vertical output – vertical zoom via deflection – horizontal and vertical protection circuit – adjustable horizontal frequency for VGA/SVGA display
Miscellaneous
– selectable 4:1:1/ 4:2:2 YC
r C b input
– selectable 27/ 32-MHz line-locked clock input – crystal oscillator for horizontal protection – automatic picture tube adjustment (cutoff, white-drive) – single 5-V power supply – hardware for simple 50/60-Hz to 100/ 120-Hz conversion (display frequency doubling)
2
– two I
C-controlled PWM outputs
– beam current limiter
14.8.3.Pin connection and short descriptions
NC = not connected LV = if not used, leave vacant X = obligatory; connect as described in circuit diagram IN = Input OUT = Output SUPPLY = Supply Pin
Pin no PLCCK 68 pin
1 VSUPP SUPPLY X Supply voltage, Output pin driver 2 GNDP SUPPLY X Ground, Output pin driver 3 VS2 IN GNDD Additional VSYNC input 4 FIFORRD OUT LV FIFO Read counter reset 5 FIFORD OUT LV FIFO Read Enable 6 FIFOWR OUT LV FIFO Write Enable 7 FIFORWR OUT LV FIFO Write counter reset 8 HOUT OUT X Horizontal Drive Output 9 HFLB IN Hout Horizontal Flyback Input 10 SAFETY IN GNDO Safety Input 11 VPROT IN GNDO Vertical protection Input 12 FREQSEL IN X Selection of H-Drive Frequency Range 13 CM1 IN X Clock select 40.5 or 27/32 MHz 14 CMO IN X Clock select 27/32 MHz 15 RSW2 OUT LV Range Switch2, Measurement ADC 16 RSW1 IN/OUT LV Range Switch1, Measurement ADC 17 SENSE IN GNDO Sense ADC Input 18 GNDM SUPPLY X Ground, MADC Input 19 VERT+ OUT GNDO Differantial Vertical Sawtooth Output 20 VERT- OUT GNDO Differantial Vertical Sawtooth Output 21 EW OUT GNDO Vertical Parabola Output 22 XREF IN X Reference Input for RGB DACs 23 SVM OUT VSUPO Scan Velocity Modulation 24 ROUT OUT VSUPO Analog Output Red 25 GOUT OUT VSUPO Analog Output Green 26 BOUT OUT VSUPO Analog Output Blue 27 GNDO SUPPLY X Ground, Analog Back-end 28 VSUPO SUPPLY X Supply Voltage, Analog Back-end
Pin name Type Connection
(if not used)
Short description
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29 VRD/BCS IN X DAC Reference, Beam Current Safety 30 FBLIN1 IN GNDO Fast-Blank1 Input 31 RIN1 IN GNDO Analog Red1 Input 32 GIN1 IN GNDO Analog Green1 Input 33 BIN1 IN GNDO Analog Blue1 Input 34 FBLIN2 IN GNDO Fast-Blank2 Input 35 RIN2 IN GNDO Analog Red2 Input 36 GIN2 IN GNDO Analog Green2 Input 37 BIN2 IN GNDO Analog Blue2 Input 38 TEST IN GNDD Test Pin 39 RESQ IN X Reset Input, active low 40 PWM1 OUT LV I2C-controlled DAC 41 PWM2 OUT LV I2C-controlled DAC 42 HCS IN GNDD Half-contrast 43 C0 IN GNDD Picture Bas Chroma (LSB) 44 C1 IN GNDD Picture Bas Chroma 45 C2 IN GNDD Picture Bas Chroma 46 C3 IN GNDD Picture Bas Chroma 47 C4 IN GNDD Picture Bas Chroma 48 C5 IN GNDD Picture Bas Chroma 49 C6 IN GNDD Picture Bas Chroma 50 C7 IN GNDD Picture Bas Chroma (MSB) 51 VSUPD SUPPLY X Supply Voltage, Digital Circuitry 52 GNDD SUPPLY X Ground, Digital Circuitry 53 LLC2 IN X System Clock Input (27/32/40.5 MHz) 54 Y0 IN GNDD Picture Bas Luma (LSB) 55 Y1 IN GNDD Picture Bas Luma 56 Y2 IN GNDD Picture Bas Luma 57 Y3 IN GNDD Picture Bas Luma 58 Y4 IN GNDD Picture Bas Luma 59 Y5 IN GNDD Picture Bas Luma 60 Y6 IN GNDD Picture Bas Luma 61 Y7 IN GNDD Picture Bas Luma (MSB) 62 LLC1 IN VSUPD Single Line-Locked Clock Input (13.5/16 MHz) 63 HS IN X Horizontal Sync Input 64 VS IN GNDD Vertical Sync Input 65 XTALK2 OUT X Analog Crystal Output (5-MHz Security Clock) 66 XTALK1 IN X Analog Crystal Input (5-MHz Security Clock) 67 SDA IN/OUT X I2C-Bus Data 68 SCL IN/OUT X I2C-Bus Clock
14.9.SDA5550
14.9.1.General definition
The SDA5550M is a single chip teletext decoder for decoding World System Teletext data as well as Video Programming System (VPS), Program Delivery Control (PDC), and Wide Screen Signalling (WSS) data used for PAL plus transmissions (Line 23). The device provides an integrated general­purpose, fully 8051-compatible Microcontroller with television specific hardware features. Microcontroller has been enhanced to provide powerful features such as memory banking, data pointers, and additional interrupts etc. The on-chip display unit for displaying Level 1.5 teletext data can also be used for customer defined on screen displays. Internal XRAM consists of up to 17 Kbytes. This device can support external memory up to 1Mbyte ROM and RAM.TVTEXT Controller contains a data slicer for VPS, WSS, PDC and TXT, an acceleration acquisition hardware module, a display generator for Level 1.5 TXT and powerful On screen Display capabilities based on parallel attributes, and pixel oriented characters (DRCS). The 8 bit Microcontroller operates at 360nsec cycle time (min). Controller with dedicated hardware does most of the internal TXT acquisition processing, transfer data to/from external memory interface and receives/transmits data via I realized in 0.25 micron technology with 2.5V supply voltage and 3.3V I/O compatible. The IC produces the following input or output control signals; AGC_CON, MODE_SW, L / L’, PIP_MODS, PIP_SEL, ON/OFF (stand-by), SC1..3_IN_AV (pin 8 information from 3 SCARTs), AFC, MUTE (to mute audio output IC), I
2
CEN.
14
2
C-firmware user interface. SDA5550M is
14.9.2.Features General
• Feature selection via special function register
• Simultaneous reception of TTX, VPS, PDC, and WSS (line 23)
• Supply Voltage 2.5 and 3.3 V
External Crystal and Programmable clock speed
Single external 6MHz crystal, all necessary clocks are generated internally CPU clock speed selectable via special function registers. Normal Mode 33.33 MHz CPU clock, Power Save mode 8.33 MHz
Microcontroller Features
• 8bit 8051 instruction set compatible CPU.
• 33.33-MHz internal clock (max.)
• 0.360ms (min.) instruction cycle
• Two 16-bit timers
• Watchdog timer
• Capture compare timer for infrared remote control decoding
• Pulse width modulation unit (2 channels 14 bit, 6 channels 8 bit)
• ADC (4 channels, 8 bit)
• UART
Memory
• Non-multiplexed 8-bit data and 16 … 20-bit address bus (ROMless Version)
• Memory banking up to 1Mbyte (Romless version)
• Up to 128 Kilobyte on Chip Program ROM
• Eight 16-bit data pointer registers (DPTR)
• 256-bytes on-chip Processor Internal RAM (IRAM)
• 128bytes extended stack memory.
• Display RAM and TXT/VPS/PDC/WSS-Acquisition-Buffer directly accessible via MOVX
• UP to 16KByte on Chip Extended RAM (XRAM) consisting of;
- 1 Kilobyte on-chip ACQ-buffer-RAM (access via MOVX)
- 1 Kilobyte on-chip extended-RAM (XRAM, access via MOVX) for user software
- 3 Kilobyte Display Memory
Display Features
• ROM Character Set Supports all East and West European Languages in single device
• Mosaic Graphic Character Set
• Parallel Display Attributes
• Single/Double Width/Height of Characters
• Variable Flash Rate
• Programmable Screen Size (25 Rows x 33...64 Columns)
• Flexible Character Matrixes (HxV) 12 x 9...16
• Up to 256 Dynamical Redefinable Characters in standard mode; 1024 Dynamical Redefinable Characters in Enhanced Mode
• CLUT with up to 4096 color combinations
• Up to 16 Colors per DRCS Character
• One out of Eight Colors for Foreground and Background Colors for 1-bit DRCS and ROM Characters
• Shadowing
• Contrast Reduction
• Pixel by Pixel Shiftable Cursor With up to 4 Different Colors
• Support of Progressive Scan and 100 Hz.
• 3 X 4Bits RGB-DACs On-Chip
• Free Programmable Pixel Clock from 10 MHz to 32MHz
• Pixel Clock Independent from CPU Clock
• Multinorm H/V-Display Synchronization in Master or Slave Mode
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