• Supports symmetric and non-symmetric arrays.
The V292BMC Revision D Burst DRAM
Controller is an enhanced version of the previous
V292BMC with improved timing and provides
dedicated Power and Ground rails to support the
increasingly popular 3.3V DRAM modules.
Timing parameters are also improved over the
older versions of the device.
The V292BMC provides the DRAM access
protocols, buffer signals, data multiplexer
signals, and bus timing resources required to
work with DRAM. By using the V2926BMC,
system designers can replace tedious design
work, expensive FPGAs and valuable board
space with a single, high-performance, easily
configured device. The processor interface of the
V292BMC implements the bus protocol of the
Am29030/40. The pin naming convention has
been duplicated on the V292BMC; simply wire
like-named pins together to create the interface.
The V292BMC supports a total DRAM memory
subsystem size of 512Mbytes. The array may be
• Software-configured operational parameters.
• Integrated Page Cache Management.
• 2Kbyte burst transaction support.
• On chip memory address multiplexer/drivers.
• Two 24-bit timers, 8-bit bus watch timer.
• Up to 40MHz operation.
• Low cost 132-pin PQFP package.
organized as 1 or 2 leafs of 32-bits each.
Standard memory sizes of 256Kbit to 64Mbit
devices are supported and 8, 16, and 32-bit
accesses are allowed. The V292BMC takes
advantage of Fast Page Mode or EDO DRAMs
and row comparison logic to achieve static RAM
performance using dynamic RAMs. Control
signals required for optional external data path
buffers/latches are also provided by the
V292BMC. The V292BMC provides an 8-bit bus
watch timer to detect and recover from accesses
to unpopulated memory regions.Two 24-bit
counters/timers can supply an external interrupt
signal at a constant frequency relative to the
system clock. The V292BMC is packaged in a
low-cost 132-pin PQFP package and is available
in 25, 33, or 40MHz versions.
This document contains the product codes,
pinouts, package mechanical information, DC
characteristics, and AC characteristics for the
V292BMC. Detailed functional information is
contained in the User’s Manual.
V3 Semiconductor reserves the right to change the specifications of this product without notice.
V292BMC is trademark of V3 Semiconductor. All other trademarks are the property of their respective owners.
PCI
PERIPHERAL
PCI SLOT or EDGE CONNECTOR
V292BMC Rev.D
V3 Semiconductor retains the rights to change documentation, specifications, or device
functionality at any time without notice. Please verify that you have the latest copy of all
documents before finalizing a design.
Table 2 below lists the pin types found on the V292BMC. Table 3 describes the function of each pin on
the V292BMC. Table 4 lists the pins by pin number. Figure 1 shows the pinout for the 132-pin PQFP
package and Figure 2 shows the mechanical dimensions of the package.
Table 2: Pin Types
Pin TypeDescription
I/O
12
ITTL input only pin
O
12
O
12-3
TTL I/O pin with 12 mA output drive
TTL Output pin with 12 mA output drive
TTL Output pin with 12 mA output drive that can be
configured for either 5 volt or 3.3 volt signaling, These
outputs can be configured for 3.3V operation by
connecting the Vcc3 power pins to a 3.3V power plane
(Vcc should always be connected to a 5V supply). Vcc3
can also be connected to the 5V plane if 5V signaling is
desired.
Leaf A and B row and column address, multiplexed on the same
O
12-3
X
pins. When non-interleaved operation is selected, only address bus
AA should be used.
Row Address Strobe. These strobes indicate the presence of a valid
O
12-3
H
row address on busses AA(B)[11:0]. These signals are to be connected one to each 32-bit leaf of memory.
O
12-3
O
12-3
Column Address Strobe. These strobes latch a column address from
H
AA(B)[11:0]. They are assigned one to each byte in a leaf.
Memory Write Enable. These are the DRAM write strobes. One is
H
supplied for each leaf to minimize signal loading.
Refresh in progress. This output is multi-function signal. The signal
name, as it appears on the logic symbol, is the default signal names.
O
12
H
This signal gives notice that a refresh cycle is to be executed. The
timing leads RAS only refresh by one cycle. The output may also
function as AUX timer interrupt.
Configuration
SignalTypeRDescription
MOD4ISelects Modulo 4 (word) bursting for multiplexed address AA(B).
Buffer Controls Signals
SignalTypeRDescription
Data Transmit A and B. These outputs are multi-function signals.
The signal names, as they appear on the logic symbol, are the
TXA
TXB
O
12
default signal names (Mode 0). The purpose of these outputs is to
H
control buffer output enables during data read transactions and, in
effect, control the multiplexing of data from each memory leaf onto
the Am29030/40 data bus.
These outputs are mode independent, however, the timing of the
signals change for different operational modes. They control transLEA
LEB
O
12
parent latches that hold data transmitted during a write transaction.
L
In modes 0 and 1, the latch controls follow the timing of CAS for
each leaf, while in modes 2 and 3 the timing of LEA and LEB is
Address Latch Enable: controls a set of transparent latches on the
address bus. When asserted high, the address input flows through
ALEI
I/DIData/Code.
BWE[3:0]ILocal bus byte write enables.
R/WIRead/write.
the latch. When ALE is low, the internal address holds the previous
value. With an Am29030/40 processor ALE is not typically used and
has an internal pull-up resistor that will keep it high when not con-
nected (to provide backward pin compatibility with earlier versions).
REQ
RDY
I
O
12
Asserted low to indicate the beginning of a bus cycle.
ZLocal bus data ready.
PRDYIProcessor ready
SUP/USI
Indicates supervisor mode. Required for access to configuration reg-
isters.
BURSTIBurst request.
ERR
O
HBus Time-out error.
12
Local interrupt request. This signal is asserted when the 24-bit
INT
O
12
H
counter reaches terminal count, and interrupt out is enabled. May
be programmed for pulse or level operation.
RESETILocal bus reset signal.
MEMCLKILocal bus clock.
ID[2:0]IThese inputs select the address offset of the configuration registers.
Power and Ground Signals
SignalTypeRDescription
Vcc-POWER leads intended for external connection to a 5V Vcc plane
Vcc3-POWER for DRAM control outputs. Can be connected to 3.3V or 5V.
GND-GROUND leads intended for external connection to a GND plane.