UTStarcom Korea Technologies CDMRF102 Users Manual

CDMRF102

TCU Phone Module

Component Technical Specification Manual

Ver. 0.1

Aug. 14. 2008

Table of Contents

CDMRF102..................................................................................................................................................... 1

TCU PHONE MODULE.................................................................................................................................. 1

1 INTRODUCTION / OVERVIEW .................................................................................................................. 6

1.1 QSC 6055 Chipset .............................................................................................................................. 6

1.1.1 QSC 6055 Features........................................................................................................................... 6

1.2 IS- Mobile Standards .......................................................................................................................... 7

1.3 Acronym Definitions........................................................................................................................... 8

1.4 Development Tools for the Phone Module....................................................................................... 8

1.4.1 LT Box...................................................................................................................................... ...……8

2 MECHANICAL DESCRIPTION .................................................................................................................. 9

2.1 Phone Module Mechanical Outline ................................................................................................... 9

2.2 Phone Module I/O Connector ............................................................................................................ 9

2.2.1 I/O Connector Drawing and Supplier Part Number…......................................................................... 9

2.2.2 I/O Connector Electrical Characteristics ….......................................................................................10

2.2.2.1 I/O Connector Pin Assignment ..................................................................................................... 10

3 OPERATING TEMPERATURE AND STORAGE ..................................................................................... 13

3.1 Temperature ...................................................................................................................................... 13

3.1.1 Storage Temperature….................................................................................................................... 13

3.1.2 Operating Temperature…................................................................................................................ 13

4 ELECTRICAL INTERFACE...................................................................................................................... 14

4.1 Design Guidelines ............................................................................................................................ 14

4.1.1 Component Derating…..................................................................................................................... 14

4.1.1.1 Ceramic Capacitors / Parallel Plate Capacitors……….................................................................. 14

4.1.1.2 Electrolytic Capacitors .................................................................................................................. 14

4.1.1.3 Tantalum Capacitors..................................................................................................................... 14

4.1.2 Communication Pins and Unused Pins............................................................................................ 14

4.2 Supply Voltage................................................................................................................................... 14

4.3 Current Draw ....................................................................................................................................... 15

4.4 Output Power ...................................................................................................................................... 16

4.5 Audio Interface.................................................................................................................................... 16

4.5.1 PCM Audio....................................................................................................................................…..16

4.5.1.1 QSC Timing Parameters ..............................................................................................................…16

4.5.1.2 PCM Sync Timing ........................................................................................................................... 16

4.5.1.3 QSC Receive Timing........................................................................................................................17

4.5.1.4 QSC Transmitting Timing................................................................................................................ 17

4.5.2 UART Data Interface.......................................................................................................................... 17

4.5.3 Cellular Antenna Open/Short Sense................................................................................................ ..19

1 INTRODUCTION / OVERVIEW

1.1 QSC6055 Chipset

The QSC60x5 family of devices represents the next generation of chipset architecture and

enhancements for the QCT value and multimedia tiers of products. The QSC60x5 family

includes the QSC6055 and QSC6065 devices (supporting CDMA2000 1x voice and data,

and Simultaneous-GPS (S-GPS)), the QSC6075 device (adding CDMA2000 EV-DO rel. 0

support) and the QSC6085 device (adding CDMA2000 EV-DO rev. A support). These

airlink and multimedia capabilities are supported by integrating Mobile Station Modem™

(MSM™) baseband, radioOne® RF, and power management functionality into a single 12

mm x 12 mm chip scale package (CSP). Together these functions perform all the signal

processing and power management tasks within a subscriber unit. This enables reduced

handset complexity, cost, time-to-market, and board-space requirements while providing

many features and functionalities.

The global expansion of 3G CDMA 1x networks has extended the availability of

high-speed, wireless data access. With increased accessibility comes increased demand for

wireless devices that function as cameras, camcorders, personal video players, MP3 audio

players, gaming consoles, and phones. To efficiently support next-generation data speeds

and functionality, wireless devices must integrate applications processors with

high-performance modems. The QSC60x5 devices extend the level of integration to

include radio frequency and power management functions.

3G products based upon the QSC60x5 devices may include:

■ Voice and data phones

■ Music player-enabled devices and applications

■ Camera phones

■ Multimedia phones, including gaming, streaming video, videoconferencing, and more

■ Position location devices

■ Other applications and devices

QSC60x5 benefits are applied to each of these product-types, including:

■ Higher integration to reduce PCB surface area, power consumption, time-to-market,

and BOM costs while adding capabilities and processing power

❒ Baseband functions, including multiple hardware cores

❒ radioOne RF and analog functions (Rx and Tx, both eliminating their intermediate

frequency (IF) components)

❒ Power management functions

■ Integrated hardware cores eliminate multimedia co-processors, providing superior

image quality and resolution for mobile devices while extending application times:

❒ Longer run-time for mobile devices over other industry solutions that use

companion processors

■ Location-based services and applications, including points of interest, personal

navigation, and friend finder

■ Single platform that provides dedicated support for all market leading CODECs and

other multimedia formats to support carrier deployments around the world

■ DC power reduction using innovative techniques, such as the QUALCOMM

IntelliCeiver™ technology and PA bypassing

1.1.1 QSC6055 Features

■ Modem microprocessor – a low-power, high-performance RISC microprocessor core

running at 192 MHz and featuring the ARM926EJ-S™ CPU and Jazelle™ accelerator

circuit from ARM® Limited.

■ Modem digital signal processor (mDSP) – the low-power, high-performance

QDSP4u8™ targeting 85 MHz.

■ Application digital signal processor (aDSP) – the low-power, high-performance

QDSP4u8™ targeting 115 MHz.

■ 96 MHz bus clock for 16-bit DDR SDRAM and 16/32-bit PSRAM

■ Dual-memory buses separating the high-speed memory subsystem (EBI1) from

low-speed peripherals (EBI2), such as LCD panels

■ 1.8 V memory interface support on EBI1

■ 1.8 V or 2.6 V memory interface support on EBI2

■ Memory types supported:

❒ 16-bit NOR flash (burst mode), including multiplexed address/data types

❒ 8-bit and 16-bit NAND flash and 16-bit OneNAND

❒ 16-bit DDR SDRAM

❒ 16-bit and 32-bit PSRAM requiring multiplexed address/data types

■ Bootup is supported from the following devices:

❒ Burst NOR on EBI1

❒ Any supported NAND memory type on EBI2

■ CDMA2000 1X revisions A and B

■ Enhanced GPS position location

❒ Integrated gpsOne functionality, featuring enhancements by SnapTrack®, Inc., to

enable a wide variety of location-based services and applications, including points

of interest, personal navigation, and friend finder

❒ Simultaneous-GPS (processes GPS on its Rx path while CDMA signals continue

to be processed on a separate Rx path)

❒ 1024x searcher, DFT accelerator, off-chip RAM for measured data storage

■ Two universal asynchronous receiver transmitter (UART) serial ports

1.2 Mobile Standards

Service Provisioning- OTASP ANSI TIA EIA-683
Parameter Administration - OTAPA ANSI TTA ETA-683
Caller ID IS-2000
Call Hold & Call Waiting IS-2000
Three-Way Calling IS-41
E911 Location Determination TIA EIA IS-801
CDMA 1xRTT Packet Data (153 Kbps forward
and reverse)
Mobile IP TIA EIA IS-835-A
Enhanced Variable Rate Codec-B (EVRC-B) 3GPP2 C.S0014.B
Enhanced Variable Rate Codec (EVRC) TIA EIA IS-127
EVRC TTY TDD Extension TTA ETA IS-127-3
SMS (MT,MO) IS-637

1.3 Acronym Definitions

Define all acronyms that will be used in the document

TIA EIA IS-2000