UTStarcom Korea Technologies CDMRF101 Users Manual

CDMRF101

TCU Phone Module

Component Technical Specification Manual

Ver. 00.1

Apr. 27. 2007

Notice

All data and information contained in or disclosed by this document are confidential and

proprietary information of UTStarcom Inc., and all rights therein are expressly reserved.

By accepting this material, the recipient agrees that this material and the information

contained therein are held in confidence and in trust and will not be used, copied,

reproduced, or distributed in whole or in part, nor its contents revealed in any manner

to others without the express written permission of UTStarcom Inc. UTStarcom Inc.

does not assume any liability arising out of the application or use of its products.

UTStarcom Inc. assumes no responsibility for any damage or loss resulting from the

misuse of its products. UTStarcom Inc. assumes no responsibility for any loss or claims

by third parties, which may arise through the use of its products. UTStarcom Inc.

assumes no responsibility for any damage or loss caused by the deletion or loss of data

as a result of malfunctions or repairs. The information contained in this document is

subject to change without notice. Information contained herein is for reference only and

does not constitute a commitment on the part of UTStarcom Inc. Although the
information in this document has been carefully reviewed and it’s believed to be reliable,

UTStarcom Inc. assumes no responsibility or liability for any errors or inaccuracies that

may appear in this document nor are they in anyway responsible for any loss or damage

resulting from the use (or misuse) of this document. It is advised for the customers to

contact our engineers for more information with respect to Keypad, audio interface, RF

interface and input power supply before they start an actual design.

OEM integrators and installers are instructed that the phrase. This device contains

transmitter FCC ID: O6Y-CDMRF101 must be placed on the outside of the host.

Warning: Exposure to Radio Frequency Radiation The radiated output

power of this device is far below the FCC radio frequency exposure

limits. Nevertheless, the device should be used in such a manner that

the potential for human contact during normal operation is minimized.

In order to avoid the possibility of exceeding the FCC radio

frequency exposure limits, human proximity to the antenna should

not be less than 20cm during normal operation. The gain of the

antenna for Cellular band must not exceed 0dBi. The gain of the

antenna for PCS band must not exceed -3dBi.

Table of Contents

CDMRF101...........................................................................................................................................................1

TCU PHONE MODULE........................................................................................................................................1

1 INTRODUCTION / OVERVIEW...................................................................................................................6

1.1 MSM 6050 Chipset.................................................................................................................................6

1.1.1 MSM 6050 Features........................................................................................................................6

1.2 IS- Mobile Standards.............................................................................................................................7

1.3 Acronym Definitions..............................................................................................................................8

1.4 Development Tools for the Phone Module..........................................................................................8

1.4.1 LT Box.............................................................................................................................................8

.....................................................................................................................................................................8

2 MECHANICAL DESCRIPTION ...................................................................................................................9

2.1 Phone Module Mechanical Outline ......................................................................................................9

2.2 Phone Module I/O Connector ...............................................................................................................9

2.2.1 I/O Connector Drawing and Supplier Part Number.........................................................................9

2.2.2 I/O Connector Electrical Characteristics.......................................................................................10

2.2.2.1 I/O Connector Pin Assignment..............................................................................................10

3 OPERATING TEMPERATURE AND STORAGE .....................................................................................13

3.1 Temperature.........................................................................................................................................13

3.1.1 Storage Temperature....................................................................................................................13

3.1.2 Operating Temperature.................................................................................................................13

4 ELECTRICAL INTERFACE.......................................................................................................................14

4.1 Design Guidelines ...............................................................................................................................14

4.1.1 Component Derating.....................................................................................................................14

4.1.1.1 Ceramic Capacitors / Parallel Plate Capacitors.....................................................................14

4.1.1.2 Electrolytic Capacitors...........................................................................................................14

4.1.1.3 Tantalum Capacitors..............................................................................................................14

4.1.2 Communication Pins and Unused Pins.........................................................................................14

4.2 Supply Voltage.....................................................................................................................................14

4.3 Current Draw........................................................................................................................................15

4.4 Inputs/Outputs Logic Levels ..............................................................................................................15

4.5 Output Power .......................................................................................................................................16

4.6 Audio Interface.....................................................................................................................................16

4.6.1 PCM Audio....................................................................................................................................16

4.6.1.1 MSM Timing Parameters.......................................................................................................16

4.6.1.2 PCM Sync Timing..................................................................................................................16

4.6.1.3 MSM Receive Timing.............................................................................................................17

4.6.1.4 MSM Transmitting Timing......................................................................................................17

4.6.2 UART Data Interface.....................................................................................................................17

4.6.3 Cellular Antenna Open/Short Sense............................................................................................. 19

4.6.4 I/O Interface Circuit Diagrams.......................................................................................................20

List of Tables

1 INTRODUCTION / OVERVIEW

1.1 MSM 6050 Chipset

The MSM6050 CDMA2000 1X solution is optimized to support voice and key data capabilities while

enabling CDMA2000 network benefits. Designed to support the CDMA2000 1X standard to address

enhanced features as simultaneous voice and data applications and utilize network optimizations, the

MSM6050 chipset will support packet data rates of 153 kbps on the forward and reverse links (FL and RL).

It provides a seamless migration path from 2G to 3G services and applications, and the increased voice

capacity of a CDMA2000 network. The MSM6050 solution will enable manufacturers to quickly develop

handsets meeting specifications for worldwide cdmaOne™ and CDMA2000 1X systems.

The MSM6050 CDMA 2000 1X solution will be used to build a phone module based solution where the

module will be used in a telematics module for an automotive application. The phone module will be

designed for use on the Verizon network. The phone module will not have the typical user interfaces

common to handsets (i.e. keypad, display, etc.). The phone module will have an I/O connector and an RF

connector. Likewise, the phone module will be designed to be certified by Verizon and FCC as a stand

alone module meant for embedded applications.

The MSM6050 chipset solution consists of the MSM6050 baseband processor, direct conversion RFR6155
™ and RFR6000™ receive devices, the direct conversion RFT61500™ transmit device MAX8629™

power management device and a compatible power amplifier device.

1.1.1 MSM 6050 Features

■gpsOne position location capabilities (not enabled in this module)

■CDMA2000 1X support, offering data rates up to 153 kbps on the forward and reverse links

■Quad-mode (CDMA cellular, CDMA PCS, AMPS cellular, gpsOne)

■Vocoder support (EVRC, 13K QCELP)

■Fast 800 Hz forward power control

■Quasi-Orthogonal functions

■Supplemental channel (SCH) support

■CDMA2000 1X Forward Quick Paging channel (F-QPCH)

■Convolutional and turbo codes on SCH

■ITU 144 kbps requirements achieved

■153 kbps on FL and RL (aggregate)

■Integrated wideband mono voice CODEC

■Voice recognition (VR) (not enabled in this application)

■Acoustic echo cancellation

■Audio AGC

■External stereo DAC support

■Internal Vocoder supporting 13kbps Pure Voice QCELP and EVRC

■Industry standard ARM7TDMI embedded microprocessor subsystem

■Internal watchdog and sleep timers

■Three universal asynchronous receiver transmitter (UART) serial ports

1.2 IS- Mobile Standards

Standard Description

IS-707 Data Service Options for Spread Spectrum Systems

IS-127 Enhanced Variable Rate Codec (EVRC) EVRC

High Rate Speech Service Option 17 for Wide Band Spread Spectrum

IS-733

Communication Systems

Data Services Option Standard for Wideband Spread Spectrum Digital Cellular

IS-99

System

IS-657 Packet Data Service Option Standard for Wideband Spread Spectrum Systems

Medium Speed Interface for Data Terminal Equipment and Data Circuit Terminating

IS-687

Equipment

Recommended Minimum Standards for 800-MHz Cellular Subscriber

IS-19

Units-Replaced by TIA/EIA-690

The protocol for 'roaming' within the USA, describing how services should 'hand

IS-41

over' between operators

IS-683 Over-the-Air Service Provisioning of Mobile Stations in Spread Spectrum Standards

IS-2000 Introduction to CDMA2000 Spread Spectrum Systems

Comment

13k codec

IS-801 Position Determination Service for cdma2000 Spread Spectrum Systems

Analog Cellular and PCS. The TIA version of the analog cellular standard,

IS-91

IS-95 XXXXXX

incorporating the functionality of IS-88 (narrowband analog) and IS-94 as well

as PCS band operation.

AMPS