UTMC 5962R9322604VZX, 5962R9322604VZC, 5962R9322604VZA, 5962R9322604VXC, 5962R9322604VXA Datasheet

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1
Standard Products
UT63M14x MIL-STD-1553A/B Bus Transceiver
Data Sheet
Sept. 1999
FEATURES
q 5-volt only operation (+10%) q Completely monolithic bipolar technology q Fit and functionally compatible to industry standard
transceiver
q Idle low transmitter inputs and receiver outputs q Dual-channel 50-mil center 24-lead Flatpack q Dual-channel 100-mil center 36-pin DIP q Full military operating temperature range, -55°C to +125°C,
screened to QML Q or QML V requirements
q Radiation hardened to 1.0E6 rads(Si) q Supports MIL-STD-1760 (UT63M145) and MIL-STD-1553
(UT63M147)
q Standard Microcircuit Drawing (SMD) 5962-93226
available
INTRODUCTION
The monolithic UT63M14x Transceivers are complete transmitter and receiver pairs for MIL-STD-1553A and 1553B applications. Encoder and decoder interfaces are idle low.
The receiver section of the UT63M14x series accepts biphase­modulated Manchester II bipolar data from a MIL-STD-1553 data bus and produces TTL-level signal data at its RXOUT and RXOUT outputs. An external RXEN input enables or disables the receiver outputs.
TXIN
RXOUT
RXEN
FROM ENCODER
TO DECODER
DRIVERS
COMPARE
F ILTER
LIMITER
and
F ILTER
TXIHB
Figure 1. Functional Block Diagram
RXIN
TXOUT
RXIN
TXOUT
RXOUT
TXIN
THRESHOLD REFERENCE
2
The transmitter section accepts biphase TTL-level signal data at its TXIN and TXIN and produces MIL-STD-1553 data signals. The transmitter’s output voltage is typically 12 V
PP, L-L
. Activating the TXIHB input or setting both data
inputs to the same logic level disables the transmitter outputs.
The UT63M14x series offers complete transmitter and receiver pairs packaged in a dual-channel 36-pin DIP or 24-lead flatpack configurations designed for use in any MIL-STD-1553 application.
Legend for TYPE field:
TI = TTL input TO = TTL output DO = Differential output DI = Differential input DIO = Differential input/output ( ) = Channel designator [ ] = 24-lead flatpack
TRANSMITTER
Note:
1.The 24-lead flatpack internally connects TXOUT to RXIN (CHA, CHB) and TXOUT to RXIN (CHA, CHB) for each channel.
NAME PIN
NUMBER
TYPE DESCRIPTION
TXOUT
1
(A)
TXOUT
(B)
1 [1]
10 [7]
DO
[DIO]
DO
[DIO]
Transmitter outputs: TXOUT and TXOUT are differential data signals.
TXOUT
1
(A)
TXOUT
(B)
2 [2]
11 [8]
DO
[DIO]
DO
[DIO]
TXOUT is the half-cycle complement of TXOUT.
TXIHB
(A)
TXIHB
(B)
34 [22]
25 [16]
TI
TI
Transmitter inhibit: This is an active high input signal.
TXIN
(A)
TXIN
(B)
35 [23]
26 [17]
TI
TI
Transmitter input: TXIN and TXIN are complementary TTL­level Manchester II encoder inputs.
TXIN
(A)
TXIN
(B)
36 [24]
27 [18]
TI
TI
TXIN is the complement of TXIN input.
3
RECEIVER
Note:
1.The 24-lead flatpack internally connects TXOUT to RXIN (CHA, CHB) and TXOUT to RXIN (CHA, CHB) for each channel.
POWER AND GROUND
NAME PIN
NUMBER
TYPE DESCRIPTION
RXOUT
(A)
RXOUT
(B)
5 [4]
14 [10]
TO
TO
Receiver outputs: RXOUT and RXOUT are complementary Manchester II decoder outputs.
RXOUT
(A)
RXOUT
(B)
8 [6]
17 [12]
TO
TO
RXOUT is the complement of RXOUT output.
RXEN
(A)
RXEN
(B)
6 [5]
15 [11]
TI
TI
Receiver enable/disable: This is an active high input signal.
RXIN
1
(A)
RXIN
(B)
29 [1]
20 [7]
DI
[DIO]
DI
[DIO]
Receiver input: RXIN and RXIN are biphase-modulated Manchester II bipolar inputs from MIL-STD-1553 data bus.
RXIN
1
(A)
RXIN
(B)
30 [2]
21 [8]
DI
[DIO]
DI
[DIO]
RXIN is the half-cycle complement of RXIN input.
NAME PIN
NUMBER
TYPE DESCRIPTION
V
CC
(A)
V
CC
(B)
33 [20]
24 [14]
PWR
PWR
+5 VDC power (±10%)
GND
(A)
GND
(B)
3, 7, 31
[3,19,21]
12, 16, 22
[9,13,15]
GND
GND
Ground reference
4
36
26
10 11
13 14 15
17 18
16
27
28
35 34 33 32 31
30 29
25 24 23
22 21 20 19
1 2
3 4
5 6 7
8 9
12
TXOUT
RXOUT
TXOUT
GND NC RXOUT
RXEN GND
NC
TXOUT
RXOUT
TXOUT
GND NC RXOUT
RXEN GND
NC
TXIN
RXIN
V
CC
TXIN TXIHB
NC GND
RXIN NC
TXIN
RXIN
V
CC
TXIN TXIHB
NC GND
RXIN NC
CHANNEL A
CHANNEL B
Figure 2a. Functional Pin Diagram -- Dual Channel (36)
24
17
7 8
10 11 12
18
23 22 21 20 19
16 15 14
13
1 2
3 4
5 6
9
CHA
CHA
GND RXOUT
RXEN
CHB
CHB
GND RXOUT
RXEN
TXIN
V
CC
TXIN TXIHB
GND
TXIN
V
CC
TXIN TXIHB
GND
CHANNEL A
CHANNEL B
Figure 2b. Functional Pin Diagram -- Dual Channel (24)
1
RXOUT
RXOUT
GND
GND
Note:
1.The 24-lead flatpack internally connects TXOUT to RXIN (CHA, CHB) and TXOUT to RXIN (CHA, CHB) for each channel.
5
TRANSMITTER
The transmitter section accepts Manchester II biphase TTL data and converts this data into differential phase-modulated current drive. Transmitter current drivers are coupled to a MIL-STD­1553 data bus via a transformer driven from the TXOUT and TXOUT terminals. Transmitter output terminals’ non­transmitting state is enabled by asserting TXIHB (logic “1”), or by placing both TXIN and TXIN at the same logic level. Table 1, Transmit Operating Mode, lists the functions for the output data in reference to the state of TXIHB. Figure 3 shows typical transmitter waveforms.
RECEIVER
The receiver section accepts biphase differential data from a MIL-STD-1553 data bus at its RXIN and RXIN inputs. The receiver converts input data to biphase Manchester II TTL format and is available for decoding at the RXOUT and RXOUT terminals. The outputs RXOUT and RXOUT represent positive and negative excursions (respectively) of the inputs RXIN and RXIN. Figure 4 shows typical receiver output waveforms.
Table 1. Transmit Operating Mode
Notes:
1.x = Don’t care.
2.Transmitter output terminals are in the non-transmitting mode during Off-time.
3.Transmitter output terminals are in the non-transmitting mode during Off-time, independent of TXIHB status.
Figure 3. Typical Transmitter
Wave
Figure 4. Typical Receiver Waveforms
TXIN TXIN TXIHB TXOUT
x
1
x 1
0 0 x 0 1 0 1 0 0 1 1 x
90%
10%
TXOUT, TXOUT
TXIN
TXIN
LINE-TO-LINE DIFFERENTIAL OUTPUT
TXIN
TXIHB
TXIN
t
TXDD
BOTH HIGH OR BOTH LOW
RXOUT
RXOUT
RXOUT
RXOUT
LINE-TO-LINE DIFFERENTIAL INPUT
t
RXDD
Off
2
Off
3
Off
3
On On
6
DATA BUS INTERFACE
1
The designer can connect the UT63M14x to the data bus via a short-stub (direct-coupling) connection or a long-stub (transformer-coupling) connection. Use a short-stub connection when the distance from the isolation transformer to the data bus does not exceed a one-foot maximum. Use a long-stub connection when the distance from the isolation transformer exceeds the one-foot maximum and is less than twenty feet. Figure 5 shows various examples of bus coupling configurations. The UT63M14x series transceivers are designed to function with MIL-STD-1553A and 1553B compatible transformers.
Note:
1.The 24-lead flatpack internally connects TXOUT to RXIN and TXOUT to RXIN for each channel.
RECOMMENDED THERMAL PROTECTION
All packages should mount to or contact a heat removal rail located in the printed circuit board. To insure proper heat transfer between the package and the heat removal rail, use a thermally­conductive material between the package and the heat removal rail. Use a material such as Mereco XLN-589 or equivalent to insure heat transfer between the package and heat removal rail.
Figure 8. Transceiver Test Circuit MIL-STD-1553B
Figure 5. Bus Coupling Configuration
55 OHMS
55 OHMS
20 FT MAX 1:1.4
Note:
ZO defined per MIL-STD-1553B, Section 4.5.1.5.2.1.
Z
O
Z
O
+5V DC OPERATION
1:1.79
1:2.5
SHORT-STUB DIRECT COUPLING 1 FT. MAX.
LONG-STUB TRANSFORMER COUPLING
.75 Z
O
.75 Z
O
TXOUT
RXIN
RXIN
TXOUT
7
RL =
15 pF
15 pF
55 OHMS
55 OHMS
35 OHMS
A
RECEIVER
TRANSMITTER
TP
TP
*
RXIN
RXEN
RXOUT
Figure 6. Direct Coupled Transceiver with Load
55 OHMS
55 OHMS
35 OHMS
TXOUT
TXIN
RXIN
RXOUT
TXIN
TXIHB
TXOUT
2KOHMS 2KOHMS
2.5:1
1:2.5
Notes:
1.TP = Test point.
2.RL removed for terminal input impedance test.
3.TXOUT and RXIN tied together. TXOUT and RXIN tied together.
V
in
V
CC
1:1.4
15 pF
15 pF
RECEIVER
TP
TP
TRANSMITTER
35 OHMS
A B
RXEN
1.79:1
1.4:1
RXOUT
V*CC
1:1.79
RXIN
RXIN
TXIN
TXIN
TXIHB
TXOUT
TXOUT
RXOUT
2KOHMS
2KOHMS
Notes:
1.TP = Test point.
2.RL removed for terminal impedance test.
3.TXOUT and RXIN tied together. TXOUT and RXIN tied together.
Figure 7. Transformer Coupled Transceiver with Load
.75 Z
O
.75 Z
O
V
in
8
ABSOLUTE MAXIMUM RATINGS
1
Notes:
1.Stress outside the listed absolute maximum rating may cause permanent damage to the devices. This is a stress rating only, and functional operation of the device at these or any other conditions beyond limits indicated in the operational sections of this specification is not recommended. Exposure to absolute maximum rating conditions for extended periods may affect device reliability.
2.Mounting per MIL-STD-883, Method 1012.
RECOMMENDED OPERATING CONDITIONS
PARAMETER LIMITS UNIT
V
CC
-0.3 to +7.0 V
Input voltage range (receiver) 10 V
PP, L-L
Logic input voltage range -0.3 to +5.5 V Power dissipation 100% duty cycle (per channel) 3.6 W
Thermal impedance junction to case
2
6.0 °C/W
Maximum junction temperature +175 °C Storage temperature -65 to +150 °C Receiver common mode input voltage range -5.0 to +5.0 V
PARAMETER LIMITS UNIT
Supply voltage range +4.50 to +5.50 V Logic input voltage range 0 to +5.0 V Receiver differential voltage 8.0 V
P-P
Receiver common mode voltage range +4.0 V Driver peak output current 600 mA Serial data rate 0.3 to 1 MHz Case operating temperature range (TC) -55 to +125 °C
A
TERMINAL
Notes:
1.Transformer Coupled Stub: Terminal is defined as transceiver plus isolation transformer. Point A is defined in figure 7.
2.Direct Coupled Stub: Terminal is defined as transceiver plus isolation transformer and fault resistors. Point A is defined in figure 6.
RL
TXOUT
TXOUT
Figure 8. Transceiver Test Circuit MIL-STD-1553
9
DC ELECTRICAL CHARACTERISTICS
1
VCC = 5.0V ±10%
-55°C < TC < +125°C
Note:
1.All tests guaranteed per test figure 6.
2.Guaranteed but not tested.
SYMBOL PARAMETER MINIMUM MAXIMUM UNIT CONDITION
V
IL
Input low voltage 0.8 V RXEN, TXIHB, TXIN, TXIN
V
IH
Input high voltage 2.0 V RXEN, TXIHB, TXIN, TXIN
I
IL
Input low current -0.1 mA VIL = 0.4V; RXEN, TXIHB, TXIN,
TXIN
I
IH
Input high current -40 40 µA VIH = 2.7V; RXEN, TXIHB, TXIN,
TXIN
V
OL
Output low voltage .55 V IOL = 4mA; RXOUT, RXOUT
V
OH
Output high voltage 2.4 V IOH = 0.4mA; RXOUT, RXOUT
I
CC
VCC supply current 22
200 380 650 740
mA mA mA mA
mA
0% duty cycle (non-transmitting) 25% duty cycle (ƒ = 1MHz) 50% duty cycle (ƒ = 1MHz)
87.5% duty cycle (ƒ = 1MHz) 100% duty cycle (ƒ = 1MHz)
2
10
RECEIVER ELECTRICAL CHARACTERISTICS
1
VCC = 5.0V ±10%
-55°C < TC < +125°C
Notes:
1.All tests guaranteed per test figure 6.
2.Capacitance is measured only for initial qualification and after any process or design changes which may affect input or output capacitance.
3.Pass/fail criteria per the test method described in MIL-HDBK-1553 Appendix A, RT Validation Test Plan, Section 5.1.2.2, Common Mode Rejection.
4. Guaranteed by design.
5. Guaranteed to the limits specified if not tested.
SYMBOL PARAMETER MINIMUM MAXIMUM UNIT CONDITION
C
IN
2
Input capacitance 15 pF RXEN; input ƒ = 1MHz @ 0V
C
OUT
2
Output capacitance 20 pF RXOUT, RXOUT; ƒ = 1MHz @ 0V
V
IC
5
Common mode input voltage
-5 5 V Direct-coupled stub; input 1.2 VPP,
200ns rise/fall time ±25ns, ƒ = 1MHz
V
TH
Input threshold voltage4 (no response)
Input threshold voltage (no response)
Input threshold voltage4 (response)
Input threshold voltage (response)
0.86
1.20
0.20
0.28
14.0
20.0
2
V
PP,L-L
V
PP,L-L
V
PP,L-L
V
PP,L-L
Transformer-coupled stub; input at ƒ = 1MHz, rise/fall time 200ns at
(Receiver output 0 1 transition) Direct-coupled stub; input at ƒ = 1MHz,
rise/fall time 200ns at (Receiver output 0 1 transition)
Transformer-coupled stub; input at ƒ = 1MHz, rise/fall time 200ns at (Receiver output 0 1 transition)
Direct-coupled stub; input at ƒ = 1MHz, rise/fall time 200ns at (Receiver output 0 1 transition)
CMRR
5
Common mode rejection ratio
Pass/Fail
3
N/A
11
TRANSMITTER ELECTRICAL CHARACTERISTICS
1
VCC = 5.0V ±10%
-55°C < TC < +125°C
Notes:
1.All tests guaranteed per test figure 6.
2.Guaranteed by device characterization. Capacitance is measured only for initial qualification and after any process or design changes which may affect input or output capacitance.
3. For MIL-STD-1760, 22 Vp-p, L-L min.
4. Test in accordance with the method described in MIL-STD-1553B output symmetry, section 4.5.2.1.1.4.
5. Guaranteed to the limits specified if not tested.
SYMBOL PARAMETER MINIMUM MAXIMUM UNIT CONDITION
VO Output voltage swing per
MIL-STD-1553B
3, 5
(see figure 9)
per MIL-STD-1553B (see figure 9)
per MIL-STD-1553A
5
(see figure 9)
18
6.0
6.0
27
9.0
20
V
PP,L-L
V
PP,L-L
V
PP,L-L
Transformer-coupled stub, Figure 8, Point A; input ƒ = 1MHz, RL = 70 ohms
Direct-coupled stub, Figure 8, Point A; input ƒ = 1MHz, RL = 35 ohms
Figure 7, Point A; input ƒ = 1MHz, RL = 35 ohms
V
NS
2
Output noise voltage differential (see figure 9)
14
5
mV-RMS
L-L
mV-RMS
L-L
Transformer-coupled stub, Figure 8, Point A; input ƒ = DC to 10MHz, R
L
= 70 ohms
Direct-coupled stub, Figure 8, Point A; input ƒ = DC to 10MHz, RL = 35 ohms
V
OS
4
Output symmetry -250
-90
+250
+90
mV
PP,L-L
mV
PP,L-L
Transformer-coupled stub, Figure 8, Point A; RL = 140 ohms,
measurement taken 2.5µs after end of transmission
Direct-coupled stub, Figure 8, Point A; RL = 35 ohms, measurement
taken 2.5µs after end of transmission
V
DIS
Output voltage distortion (overshoot or ring) (see figure 9)
-900
-300
+900
+300
mV
peak,L-L
mV
peak,L-L
Transformer-coupled stub, Figure 8, Point A; RL = 70 ohms
Direct-coupled stub, Figure 8, Point A; RL = 35 ohms
C
IN
2
Input capacitance 15 pF RXEN, TXIHB, TXIN, TXIN; input
ƒ = 1MHz @ 0V
T
IZ
5
Terminal input impedance
1
2
Kohm
Kohm
Transformer-coupled stub, Figure 7, Point A; input ƒ = 75KHz to 1MHZ (power on or power off; non­transmitting, RL removed from
circuit).
Direct-coupled stub, Figure 6, Point A; input ƒ = 75KHz to 1MHZ (power on or power off; non-transmitting, RL removed from circuit).
12
AC ELECTRICAL CHARACTERISTICS
1
VCC = 5.0V ±10%
-55°C < TC < +125°C
Notes:
1.All tests guaranteed per test figure 6.
2.Guaranteed by device characterization.
3.Supplied as a design limit but not guaranteed or tested.
4.Delay time from transmit inhibit (1.5V) rising to transmit off (280mV).
5.Delay time from not transmit inhibit (1.5V) falling to transmit off (1.2V).
SYMBOL PARAMETER MINIMUM MAXIMUM UNIT CONDITION
t
R, tF
Transmitter output rise/ fall time (see figure 10)
100 300 ns Input ƒ = 1MHz 50% duty cycle:
direct-coupled RL = 35 ohms output at 10% through 90% points TXOUT,
TXOUT. Figure 10.
t
RXDD
RXOUT delay -200 200 ns RXOUT to RXOUT, Figure 4.
t
TXDD
3
TXIN skew -25 25 ns TXIN to TXIN, Figure 3.
t
RZCD
Zero crossing distortion (see figure 11)
-150 150 ns Direct-coupled stub; input ƒ = 1MHz,
3 VPP (skew INPUT ±150ns), rise/fall time 200ns.
t
TZCS
Zero crossing stability (see figure 11)
-25 25 ns Input TXIN and TXIN should create Transmitter output zero crossings at 500ns, 1000ns, 1500ns, and 2000ns. These zero crossings should not deviate more than ±25ns.
t
RDXOFF
3,4
Transmitter off; delay from inhibit active
100 ns TXIN and TXIN toggling @ 1MHz;
TXIHB transitions from logic zero to one, see figure 12.
t
DXON
3,5
Transmitter on; delay from inhibit inactive
150 ns TXIN and TXIN toggling @ 1MHz;
TXIHB transitions from logic one to zero, see figure 13.
t
RCVOFF
3
Receiver off 50 ns Receiver turn off time, see figure 13.
t
RCVON
3
Receiver on 50 ns Receiver turn on time, see figure 13.
t
RCVPD
3
Receiver propagation 450 ns Receiver propagation delay, see
figure 13.
t
XMITPD
3
Transmitter propagation
200 ns Transmitter propagation delay, see
figure 12.
Table 2. Transformer Requirements
COUPLING TECHNIQUE
± 5V
DC
DIRECT-COUPLED: Isolation Transformer Ratio
2.5:1
TRANSFORMER-COUPLED: Isolation Transformer Ratio
1.79:1
Coupling Transformer Ratio 1:1.4
13
Figure 9. Transmitter Output Characteristics (V
DIS
, VNS, VO)
Figure 10. Transmitter Output Zero Crossing Stability, Rise Time, Fall Time (t
TZCS
, tR, tF)
Figure 11. Receiver Input Zero Crossing Distortion (t
RZCD
)
0 Volts 0 Volts
V
DIS
(Ring)
V
DIS
(Overshoot)
V
O
V
NS
90%
10%10%
90%
V
O
t
R
t
F
t
TZCS
t
RZCD
V
IN
14
10%
50%
50%
50%
zero crossing
t
DXON
t
XMITPD
t
DXOFF
TX OUTPUT
INHIBIT
TX IN and
TX IN
Figure 12. Transmitter Timing
50%
50% 50% 50%
50%
t
RCVPD
t
RCVON
t
RCVOFF
zero crossing
RX INPUT
RXEN
RX OUT and RX OUT
RXEN
Figure 13. Receiving Timing
10%
Figure 14. 36-Pin Side-Brazed DIP, Dual Cavity
Notes:
1.Package material: opaque ceramic.
2.All package finishes are per MIL-PRF-38535.
3.It is recommended that package ceramic be mounted on a heat removal rail in the printed circuit board. A thermally conductive material should be used.
LEAD 1 INDICATOR
0.005 MIN.
.610 MAX. .570 MIN.
.015 MAX. .008 MIN.
.620 MAX. .590 MIN.
(AT SEATING PLANE)
1.89 MAX.
0.001 MIN.
.023 MAX. .014 MIN.
0.155 MAX.
0.150 MIN.
0.100
16
Figure 15. 24-Lead Flatpack, Dual Cavity
(50-mil lead spacing)
Notes:
1.Package material: opaque ceramic.
2.All package plating finishes are per MIL-PRF-38535.
3.It is recommended that package ceramic be mounted to a heat removal rail located in the printed circuit board. A thermally conductive material should be used.
.810 MAX.
.600 MAX.
.400 MIN.
LEAD 1 INDICATOR
0.130 MAX.
0.070 ±0.010 (AT CERAMIC BODY)
.050
0.016 ±.002
.010 + .002 - .001
17
ORDERING INFORMATION
UT63M Monolithic Transceiver, 5V Operation: SMD
Lead Finish: (A) = Solder (C) = Gold (X) = Optional
Case Outline: (X) = 36 pin DIP (Z) = 24 pin FP
Class Designator: (Q) = Class Q (V) = Class V
Device Type (03) = Idle low (04) = 1760, Idle low
Drawing Number: 93226
Total Dose: (H) = 1E6 rads(Si) (G) = 5E5 ads(Si) (F) = 3E5 rads(Si) (R) = 1E5rads(Si) (-) = None
Federal Stock Class Designator: No options
5962 * 93226 * * * *
Notes:
1. Lead finish (A, C, or X) must be specified.
2. If an "X" is specified when ordering, part marking will match the lead finish and will be either "A" (solder) or "C" (gold).
3. Total dose must be specified for all QML Q and QML V devices.
4. Neutron irradiation limits will be added when available.
18
UT63M Monolithic Transceiver, 5V Operation
Total Dose: () = None
Lead Finish: (A) = Solder (C) = Gold (X) = Optional
Screening: (C) = Military Temperature (P) = Prototype
Package Type: (B) = 36-pin DIP (C) = 24-pin FP
Device Type Modifier: 147 = Idle Low Transceiver 145 = 1760, Idle Low Transceiver
UT63M- * * * *
Notes:
1. Lead finish (A, C, or X) must be specified.
2. If an "X" is specified when ordering, part marking will match the lead finish and will be either "A" (solder) or "C" (gold).
3. Military Temperature range devices are burned-in and tested at -55°C, room temperature, and 125°C. Radiation characteristics are neither tested nor
guaranteed and may not be specified.
4. Devices have prototype assembly and are tested at 25°C only. Radiation characteristics are neither tested nor guaranteed and may not be specified.
Lead finish is GOLD only.
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