UTC UNISONIC TECHNOLOGIES ULN 2003A Datasheet

UNISONIC TECHNOLOGIES CO., LTD

ULN2003

LINEAR INTEGRATED CIRCUIT

7CH DARLINGTON SINK
DRIVER

 DESCRIPTION

The UTC ULN2003 are high-voltage, high-current darlington

drivers comprised of seven NPN Darlington pairs.

All units feature integral clamp diodes for switching inductive

loads.

Applications include relay, hammer, lamp and display (LED)

drivers.

 FEATURES

*Output Current (Single Output): 500mA (MAX.)
*High Sustaining Voltage Output: 50V (MIN.)
*Output Clamp Diodes
*Inputs Compatible With Various Types Of Logic

 ORDERING INFORMATION

Ordering Number

Lead Free Halogen Free
ULN2003L-D16-T ULN2003G-D16-T DIP-16 Tube
ULN2003L-S16-R ULN2003G-S16-R SOP-16 Tape Reel
ULN2003L-S16-T ULN2003G-S16-T SOP-16 Tube

Package Packing

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ULN2003 LINEAR INTEGRATED CIRCUIT

 PIN CONNECTION

 BLOCK DIAGRAM

Note: The input and output parasitic diodes cannot be used as clamp diodes.

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ULN2003 LINEAR INTEGRATED CIRCUIT

 ABSOLUTE MAXIMUM RATINGS (T

=25°C)

A

PARAMETER SYMBOL RATING UNIT

Output Sustaining Voltage V

-0.5~50 V

OUT

Input Voltage VIN -0.5~30 V
Clamp Diode Reverse Voltage VR 50 V
Output Current I

500 mA / ch

OUT

Clamp Diode Forward Current IF 500 mA

Power Dissipation

DIP-16 1.47 W
SOP-16

PD

1.25 (Note2) W
Junction Temperature TJ +125 °C
Operating Temperature T
Storage Temperature T

-40~+85 °C

OPR

-55~+150 °C

STG

Note: 1. Absolute maximum ratings are those values beyond which the device could be permanently damaged.

Absolute maximum ratings are stress ratings only and functional device operation is not implied.

2. On PCB (Test Board: JEDEC 2s2p)

 RECOMMENDED OPERATING CONDITIONS (T

=-40～+85°C)

A

CHARACTERISTIC SYMBOL TEST CONDITIONS MIN TYP MAX UNIT

Output Sustaining Voltage V

DIP-16

Output Current

SOP-16

0 50 V

OUT

Duty = 10% 0 350
Duty = 50% 0 100
Duty = 10% 0 300
Duty = 50% 0 90

mA/ch

I

OUT

TPW = 25ms
7 Circuits
T

= 85°C

A

T

= 120°C

J

Input Voltage VIN 0 24 V
Input Voltage (Output On) V
Input Voltage (Output Off) V

I

IN (ON)

0 0.7 V

IN (OFF)

= 400mA 2.8 24 V

OUT

Clamp Diode Reverse Voltage VR 50 V
Clamp Diode Forward Current IF 350 mA

Power Dissipation

DIP-16 TA = 85°C 0.76
SOP-16

PD

T

= 85°C (Note) 0.65

A

W

Note: On PCB (Test Board: JEDEC 2s2p)



ELECTRICAL CHARACTERISTICS (T

=25°C unless otherwise specified)

A

CHARACTERISTIC SYMBOL TEST CIRCUIT TEST CONDITIONS MIN TYP MAX UNIT

Output Leakage Current I

Collector-Emitter Saturation
Voltage

V

1

LEAK

2

CEO(SAT)

VCE = 50 V, TA = 25°C 50

= 50 V, TA = 85°C 100

V

CE

I

= 350 mA, IIN = 500 μA 1.3 1.6

OUT

I

= 200 mA, IIN = 350 μA 1.1 1.3

OUT

I

= 100 mA, IIN = 250 μA 0.9 1.1

OUT

DC Current Transfer Ratio hFE 2 VCE = 2 V, I
Input Current (Output On) I
Input Current (Output Off) I

Input Voltage (Output On) V

Clamp Diode Reverse Current IR 6

3 VIN = 2.4 V, I

IN (ON)

4 I

IN (OFF)

5 VCE = 2 V

IN(ON)

= 500 µA, TA = 85°C 50 65 μA

OUT

VR = 50 V, TA = 25°C 50

= 50 V, TA = 85°C 100

V

R

= 350 mA 1000

OUT

= 350 mA 0.4 0.7 mA

OUT

I

= 350 mA 2.6

OUT

= 200 mA 2.0

I

OUT

μA

V

V

μA

Clamp Diode Forward Voltage VF 7 IF = 350 mA 2.0 V
Input Capacitance CIN 15 pF

V

= 50 V, RL = 125 Ω

Turn-On Delay tON 8

Turn-Off Delay t

8

OFF

OUT

C

L

V

OUT

C

L

= 15 pF

= 50 V, RL = 125 Ω

= 15 pF

0.1

μs

0.2

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ULN2003 LINEAR INTEGRATED CIRCUIT

 TEST CIRCUIT

Components in the test circuits are used only to obtain and confirm the device characteristics. These components

and circuits are not guaranteed to prevent malfunction or failure from occurring in the application equipment.

OPEN

1. I

LEAK

OPEN

I

LEAK

V

CE

V

IN

V

IN

2. V

CEO(SAT)

I

IN

,hFE

OPEN

VCE,V

I

OUT

CEO(SAT)

hFE=

I

OUT

I

IN

3. I

I

IN(ON)

OPEN

IN(ON)

4. I

I

IN(OFF)

IN(OFF)

OPEN

I

OUT

OPEN

V

IN

5. V

IN(ON)

6.
I

R

OPEN

I

R

V

R

V

IN(ON)

I

OUT

OPEN

V

CE

OPEN

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ULN2003 LINEAR INTEGRATED CIRCUIT

 TEST CIRCUIT(Cont.)

7. V

F

V

F

I

F

OPEN

OPEN

8. tON, t

PULSE

GENERATOR

INPUT

OUTPUT

OFF

INPUT OPEN

Note 2

t

R

90

50

10

T

ON

50

50µs

90

50

10

t

50

V

F

OUT

T

OFF

R

L

CL=15pF

(Note 3)(Note 1)

OUTPUT

V

IH

0

V

O

H

V

OL

Note 1: Pulse width 50µs ,duty cycle 10%

Output impedance 50ΩtR5ns, tF10ns

Note 2: See below

INPUT CONDITION

Note 3: C

TYPE NUMBER

ULN2003

includes probe and jig capacitance

L

R1

V

IH

0

3V

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ULN2003 LINEAR INTEGRATED CIRCUIT

 APPLICATION NOTES

This UTC ULN2003 does not include built-in protection circuits for over-current or over-voltage. If this IC is

subjected to over-current or over-voltage, it may be destroyed. Hence, the utmost care must be taken when systems
which incorporate this IC are designed. Utmost care is necessary in the design of the output line, COMMON and
GND line since IC may be destroyed due to short-circuit between outputs, air contamination fault, or fault by
improper grounding.

The UTC ULN2003 is a darlington driver array, and can be directly coupled to a general logic circuit such as TTL

or CMOS. Resistors are connected in series to each of the inputs to achieve a stable input current.

The load should be connected between the output and the power supply. To protect the IC from excessive swing

voltage, the COMMON pin (Pin 9) should be connected to the power supply.

The UTC ULN2003 can absorb the surge current because of the on-chip diode. The bottom Figure shows the

configuration of the on-chip diode.

In the construction of the surge-absorbing diode, there is parasitic PNP, output pin for emitter, COMMON pin for
base and the substrate (P-sub) for collector. When the diode is on, current flows from the output pin to the substrate.
When using the surge-absorbing diode, appropriate measures should be taken for the thermal characteristics of the
design considering the current. For example, when motor back-rush current or other conditions that can create
continued surge current flow to the surge-absorbing diode, we strongly recommend connecting a Schottky barrier
diode (or other type of diode with a low forward voltage) in parallel with the surge-absorbing diode to construct a
bypass route for the surge current.

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ULN2003 LINEAR INTEGRATED CIRCUIT

 NOTICE ON PRODUCT USE

(1) The absolute maximum ratings of the IC are a set of ratings that must not be exceeded, even for a moment.
Exceeding the rating(s) may cause the device breakdown, damage or deterioration, and may cause injury by
explosion or combustion.

(2) To ensure that a large current does not continuously flow in case of over current and/or IC failure, an
appropriate power supply fuse should be used. The IC will fully breakdown under conditions that exceed its absolute
maximum ratings. For example, when the wiring is routed improperly or when an abnormal pulse noise occurs from
the wiring or load, causing a large current to continuously flow and the breakdown can lead smoke or ignition. To
minimize the effects of the flow of a large current in case of breakdown, careful settings, such as fuse capacity,
fusing time and insertion circuit location, are required.

(3) If the design includes an inductive load such as a motor coil, the current resulting from the inrush current at
power ON or the negative current resulting from the back electromotive force at power OFF can cause device
malfunction or breakdown, so a protection circuit need to be incorporated into the design. IC breakdown may cause
injury, smoke or ignition. When the power supply is unstable, the build-in protection function may not operate,
causing IC breakdown. IC breakdown may cause injury, smoke or ignition.

(4) Do not mount devices in the wrong orientation or incorrectly. Make sure that the positive and negative
terminals of power supplies are connected properly. Otherwise, the current or power consumption may exceed the
absolute maximum rating, and may cause the device breakdown, damage or deterioration, and may result injury by
explosion or combustion. In addition, do not use any device that is applied the current with inserting in the wrong
orientation or incorrectly even just one time.

(5) Carefully select external components (such as inputs and negative feedback capacitors) and load components
(such as speakers), for example, power amp and regulator. If there is a large amount of leakage current such as
input or negative feedback condenser, the IC output DC voltage will increase. If this output voltage is connected to a
speaker with low input withstand voltage, over-current or IC failure can cause smoke or ignition. (The over-current
can cause smoke or ignition from the IC itself.) In particular, please pay attention to the Bridge Tied Load (BTL)
connection type IC that inputs output DC voltage to a speaker directly.

 POINTS TO REMEMBER ON PRODUCT USE

(1) Heat Radiation Design

When IC is used with large current flow such as power amp, regulator or driver, the heat radiation consideration
should be designed carefully, not to exceed the specified junction temperature (Tj) at any time and condition. An
inadequate IC heat radiation design can lead to decrease in IC life, deterioration of IC characteristics or IC
breakdown. Meanwhile, also should take into considerate the effect of IC heat radiation with peripheral components.

(2) Back-EMF

When a motor rotates in the reverse direction, stops or slows down abruptly, a current flow back to the motor’s
power supply due to the effect of back-EMF. The device’s motor power supply and output pins might be exposed to
conditions excessing absolute maximum ratings, when the current sink capability of the power supply is small. To
avoid happening, take the effect of back-EMF into consideration in system design.

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ULN2003 LINEAR INTEGRATED CIRCUIT

 TYPICAL CHARACTERISTICS

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ULN2003 LINEAR INTEGRATED CIRCUIT

 TYPICAL CHARACTERISTICS(Cont.)

Output Current IOUT (mA)

DC Current Transfer Ratio, hFE

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ULN2003 LINEAR INTEGRATED CIRCUIT

 TYPICAL CHARACTERISTICS(Cont.)

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UTC assumes no responsibility for equipment failures that result from using products at values that
exceed, even momentarily, rated values (such as maximum ratings, operating condition ranges, or
other parameters) listed in products specifications of any and all UTC products described or contained
herein. UTC products are not designed for use in life support appliances, devices or systems where
malfunction of these products can be reasonably expected to result in personal injury. Reproduction in
whole or in part is prohibited without the prior written consent of the copyright owner. The information
presented in this document does not form part of any quotation or contract, is believed to be accurate
and reliable and may be changed without notice.

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