
Description Package Dimensions
The MSL-824HG-G is designed based on in an industry
standard package for ease of handing and use. Units : mm
The package is water clear epoxy within white plastic.
Applications
l LCD backlighting
l Symbol backlighting
l Front panel indicator
Features
l High performance
l Excellent chip to chip consistency
l High reliability
A C
Absolute Maximum Ratings
Power Dissipation P
Continuous Forward Current I
Reverse Current(VR=5V) I
Operating Temperature Range T
Storage Temperature Range T
Lead Soldering Temperature 260oC for 5 second (2.0mm From Body)
Notes :
1. All dimensions are in millimeters.
2. Tolerance is ± 0.1 mm unless otherwise noted.
3. Lead plating is gold.
Parameter Symbol
@ TA=25oC
Unit
100 mW
30 mA
10
-40oC to +85oC
-40oC to +85oC
µA
Unity Opto Technology Co., Ltd.
11/06/2000

Optical-Electrical Characteristics
Typical Optical-Electrical Characteristic Curves
Relative Luminous Intensity
Relative Luminous Intensity
FIG.4 RELATIVE LUMINOUS INTENSITY
Forward Luminous
Spectral
Halfwidth
∆λ(nm)
PART NO
Color
Dominant
Wave
Langth
λD
Emitted Lens TYP MAX MIN TYP
(nm)
MSL-824HG-G Green Water Clear 570 15 2.2 2.5 30 45
Relative Luminous Intensity
Wavelength (nm)
FIG.1 RELATIVE LUMIINOUS INTENSITY VS. WAVELENGTH
Voltage Intensity
@IF=20mA @IF=20mA
(V) (mcd)
'@ TA=25oC
Viewing Angle
2θ
1/2
(deg)
100
30
20
10
Forward Current (mA)
0
1.0 1.5 2.0 2.5 3.0
Forward Voltage (V)
FIG.2 FORWARD CURRENT VS.
FORWARD VOLTAGE
=30mA
F
Normalized at I
0 10 20 30
Forward Current (mA)
VS. FORWARD CURRENT
40
(mA)
F
Forward Current I
30
20
10
0
0 10 20 30 40 50 60 70 80 90 100
Ambient Temperature T
FIG.3 FORWARD CURRENT
VS. AMBIENT TEMPERATURE
1.0
0.9
0.8
0.5 0.3 0.1 0.2 0.4 0.6
FIG.5 RADIATION PATTERN DIAGRAM
A
o
(oC)
30
40
50
60
70
80
90
o
o
o
o
o
o
o
Unity Opto Technology Co., Ltd.
11/06/2000