18-Line SCSI Terminator
UCC5618
FEATURES
• Complies with SCSI, SCSI-2, SCSI-3,
SPI and FAST-20 Standards
• 2pF Channel Capacitance During
Disconnect
• 50µA Supply Current in Disconnect
Mode
• 110Ω Termination
• SCSI Hot Plugging Compliant, 10nA
Typical
• +400mA Sinking Current for Active
Negation
• –650mA Sourcing Current for
Termination
• Trimmed Impedance to 5%
• Thermal Shutdown
• Current Limit
DESCRIPTION
The UCC5618 provides 18 lines of active termination for a SCSI (Small
Computers Systems Interface) parallel bus. The SCSI standard recommends and Fast-20 (Ultra) requires active termination at both ends of the
cable.
Pin for pin compatible with the UC5601 and UC5608, the UCC5618 is ideal
for high performance 5V SCSI systems, Termpwr 4.0-5.25V. During disconnect the supply current is only 50µA typical, which makes the IC attractive
for lower powered systems.
The UCC5618 is designed with a low channel capacitance of 2pF, which
eliminates effects on signal integrity from disconnected terminators at interim points on the bus.
The power amplifier output stage allows the UCC5618 to source full termination current and sink active negation current when all termination lines
are actively negated.
The UCC5618, as with all Unitrode terminators, is completely hot pluggable
and appears as high impedance at the terminating channels with
TRMPWR=0V or open.
Internal circuit trimming is utilized, first to trim the 110Ω impedance, and
then most importantly, to trim the output current as close to the max
SCSI-3 spec as possible, which maximizes noise margin in fast SCSI operation.
BLOCK DIAGRAM
This device is offered in low thermal resistance versions of the industry
standard 28 pin wide body SOIC, TSSOP and PLCC.
Patented Circuit Design
6/98
UDG-96005-1
ABSOLUTE MAXIMUM RATINGS
TEMPWR.......................................+7V
Signal Line Voltage ..........................0Vto+7V
Regulator Output Current ...........................1A
Storage Temperature ...................–65°C to +150°C
Operating Junction Temperature ..........–55°C to +150°C
Lead Temperature (Soldering, 10 Seconds) ..........300°C
All currents are positive into, negative out of the specified
terminal. Consult Packaging Section of Databook for thermal
limitations and considerations of packages.
CONNECTION DIAGRAMS
UCC5618
PLCC-28 (Top View)
QP Package
* DWP package pins 12–18 serve as both heatsink and signal
ground.
DIL-24 (Top View)
N Package
TSSOP-28 (Top View)
PWP Package
* PWP package pin 23 serves as signal ground; pins 7, 8, 9,
20, 21, and 22 serve as heatsink ground.
SOIC-28 (Top View)
DWP Package
Note: Drawings are not to scale.
* DWP package pin 28 serves as signal ground; pins 7, 8, 9,
20, 21, 22 serve as heatsink/ground.
2
UCC5618
ELECTRICAL CHARACTERISTICS:
Unless otherwise stated these specifications apply for TA= 0°C to 70°C,
TRMPWR = 4.75V, DISCNCT = 0V, TA=TJ.
PARAMETER TEST CONDITIONS MIN TYP MAX UNITS
Supply Current Section
TERMPWR Supply Current All Termination Lines = Open 1 2 mA
All Termination Lines = 0.2V 420 440 mA
Power Down Mode DISCNCT = TRMPWR 50 100
Output Section (Termination Lines)
Termination Impedance See Figure 1 104.5 110 115.5
Output High Voltage V
Max Output Current V
TRMPWR
LINE
V
LINE
V
LINE
= 4V (Note 1) 2.6 2.8 3 V
= 0.2V, TJ= 25°C –22.1 –23.3 –24 mA
= 0.2V –20.7 –23.3 –24 mA
= 0.2V, TERMPWR = 4V, TJ= 25°C
–21 –23.3 –24 mA
(Note 1)
= 0.2V, TRMPWR = 4V (Note 1) –20 –23 –24 mA
V
LINE
V
= 0.5V –22.4 mA
LINE
Output Leakage DISCNCT = 2.4V, TRMPWR = 0V to 5.25V,
REG = 0.2V, V
LINE
= 5.25V
10 400 nA
Output Capacitance DISCNCT = 2.4V (Note 2) 2 3.5 pF
Regulator Section
Regulator Output Voltage 2.6 2.8 3 V
Drop Out Voltage All Termination Lines = 0.2V 0.4 0.8 V
Short Circuit Current V
Sinking Current Capability V
= 0V –475 –650 –950 mA
REG
= 3.5V 200 400 800 mA
REG
Thermal Shutdown 170 °C
Thermal Shutdown Hysteresis 10 °C
Disconnect Section
Disconnect Threshold 0.8 1.5 2 V
Input Current DISCNCT = 0V –10 –30
Note 1: Measuring each termination line while other 17 are low (0.2V).
Note 2: Guaranteed by design. Not 100% tested in production.
µA
Ω
µA
Procedure:
1) Measure V
2) Set V
= 0.2V
L
3) Measure I
4) Impedance =
N.L.
REG
at 0.2V
MAX
VNL V
REG
...02
I
MAX
Figure 1. Termline Impedance Measurement Circuit
UDG-96102-1
3
PIN DESCRIPTIONS
DISCNCT: Taking this pin high or leaving it open causes
the 18 channels to become high impedance and the chip
to go into low-power mode; a low state allows the
channels to provide normal termination.
GND: Ground reference for the IC.
APPLICATION INFORMATION
UCC5618
LINE1–LINE18: 110Ω termination channels.
REG: Output of the internal 2.8V regulator.
TRMPWR: Power for the IC.
UDG-96012-1
UNITRODE CORPORATION
7 CONTINENTALBLVD. • MERRIMACK, NH 03054
TEL. (603) 424-2410 • FAX (603) 424-3460
4
PACKAGE OPTION ADDENDUM
www.ti.com
5-Feb-2007
PACKAGING INFORMATION
Orderable Device Status
(1)
Package
Type
Package
Drawing
Pins Package
Qty
Eco Plan
UCC5618DWP ACTIVE SOIC DW 28 20 Green (RoHS &
no Sb/Br)
UCC5618DWPG4 ACTIVE SOIC DW 28 20 Green (RoHS &
no Sb/Br)
UCC5618DWPTR ACTIVE SOIC DW 28 1000 Green (RoHS &
no Sb/Br)
UCC5618DWPTRG4 ACTIVE SOIC DW 28 1000 Green (RoHS &
no Sb/Br)
UCC5618PWP ACTIVE TSSOP PW 28 50 Green (RoHS &
no Sb/Br)
UCC5618PWPG4 ACTIVE TSSOP PW 28 50 Green (RoHS &
no Sb/Br)
UCC5618PWPTR ACTIVE TSSOP PW 28 2000 Green (RoHS &
no Sb/Br)
UCC5618PWPTRG4 ACTIVE TSSOP PW 28 2000 Green (RoHS &
no Sb/Br)
UCC5618QP ACTIVE PLCC FN 28 37 TBD Call TI Level-2-220C-1 YEAR
UCC5618QPTR ACTIVE PLCC FN 28 750 TBD Call TI Level-2-220C-1 YEAR
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Lead/Ball Finish MSL Peak Temp
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
CU NIPDAU Level-2-260C-1 YEAR
(3)
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
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In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
Addendum-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
TAPE AND REEL INFORMATION
11-Mar-2008
*All dimensions are nominal
Device Package
Type
UCC5618DWPTR SOIC DW 28 1000 330.0 32.4 11.35 18.67 3.1 16.0 32.0 Q1
UCC5618PWPTR TSSOP PW 28 2000 330.0 16.4 7.1 10.4 1.6 12.0 16.0 Q1
UCC5618QPTR PLCC FN 28 750 330.0 24.4 12.95 12.95 5.0 16.0 24.0 Q1
Package
Drawing
Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm)W(mm)
Pin1
Quadrant
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
UCC5618DWPTR SOIC DW 28 1000 346.0 346.0 49.0
UCC5618PWPTR TSSOP PW 28 2000 346.0 346.0 33.0
UCC5618QPTR PLCC FN 28 750 346.0 346.0 41.0
Pack Materials-Page 2
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