u blox VERAP173 User Manual

Abstract

This technical data sheet describes the VERA-P1 series transceiver
module that enables development of electronics for Vehicle-to­Everything (V2X) communication systems. The VERA-P1 series
includes an integrated MAC/LLC/Baseband processor and the
required RF front-end components. It is connected to a host
processor through a USB or SPI interface.

www.u-blox.com

UBX-17004377 - R04

VERA-P1 series

Host-based V2X transceiver module

Data Sheet

VERA-P1 series - Data Sheet

Document Information

Title

VERA-P1 series

Subtitle

Host-based V2X transceiver module

Document type

Data Sheet

Document number

UBX-17004377

Revision and date

R04

7-Dec-2017

Disclosure restriction

Confidential

Product Status

Corresponding content status

Functional Sample

Draft

For functional testing. Revised and supplementary data will be published later.

In Development /
Prototype

Objective Specification

Target values. Revised and supplementary data will be published later.

Engineering Sample

Advance Information

Data based on early testing. Revised and supplementary data will be published later.

Initial Production

Early Prod. Information

Data from product verification. Revised and supplementary data may be published later.

Mass Production /
End of Life

Production Information

Final product specification.

Product name

Type number

Firmware version

PCN reference

Product Status

VERA-P171

VERA-P171-00A-00

N/A

N/A

Prototype

VERA-P173

VERA-P173-00A-00

N/A

N/A

Prototype

VERA-P174

VERA-P174-00A-00

N/A

N/A

Prototype

This document applies to the following products:

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express or implied, is given, including but not limited, with respect to the accuracy, correctness, reliability and fitness for a particular purpose
of the information. This document may be revised by u-blox at any time. For most recent documents, visit www.u-blox.com.

Copyright © 2017, u-blox AG.

u-blox is a registered trademark of u-blox Holding AG in the EU and other countries.

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VERA-P1 series - Data Sheet

Contents

Contents .............................................................................................................................. 3

1 Functional description .................................................................................................. 5

1.1 Overview .............................................................................................................................................. 5

1.2 Product features ................................................................................................................................... 5

1.3 Block diagrams ..................................................................................................................................... 6

1.4 Product description ............................................................................................................................... 6

1.5 Supported features ............................................................................................................................... 7

2 Host interfaces ............................................................................................................. 8

2.1 USB interface ........................................................................................................................................ 8

2.2 SPI interface .......................................................................................................................................... 8

3 Pin Definition ................................................................................................................ 9

3.1 Pin description ...................................................................................................................................... 9

4 Electrical specification ................................................................................................ 14

4.1 Absolute maximum ratings ................................................................................................................. 14

4.2 Operating conditions .......................................................................................................................... 14

4.3 Digital pad ratings .............................................................................................................................. 14

4.4 Peak current consumption .................................................................................................................. 15

4.5 Current consumption.......................................................................................................................... 15

4.6 Radio specifications ............................................................................................................................ 16

5 Mechanical specifications .......................................................................................... 18

5.1 Physical dimensions ............................................................................................................................ 18

6 Qualification and approvals ...................................................................................... 20

6.1 Approvals ........................................................................................................................................... 20

6.1.1 European Union regulatory compliance ....................................................................................... 20

6.1.2 FCC compliance .......................................................................................................................... 20

6.1.3 IC compliance.............................................................................................................................. 20

6.1.4 FCC and IC IDs ............................................................................................................................ 20

6.1.5 Certification in other countries .................................................................................................... 21

7 Product handling & soldering .................................................................................... 22

7.1 Packaging ........................................................................................................................................... 22

7.1.1 Reels ........................................................................................................................................... 22

7.1.2 Tapes .......................................................................................................................................... 22

7.2 Shipment, storage and handling ......................................................................................................... 22

7.2.1 Moisture sensitivity levels ............................................................................................................. 22

7.2.2 Mounting process and soldering recommendations ..................................................................... 23

7.2.3 ESD handling precautions ............................................................................................................ 24

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VERA-P1 series - Data Sheet

8 Labeling and ordering information ........................................................................... 25

8.1 Product labeling .................................................................................................................................. 25

8.2 Explanation of codes........................................................................................................................... 25

8.3 Ordering codes ................................................................................................................................... 25

Appendix .......................................................................................................................... 26

Glossary ............................................................................................................................ 26

Related documents........................................................................................................... 27

Revision history ................................................................................................................ 27

Contact .............................................................................................................................. 28

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VERA-P1 series - Data Sheet

1 Functional description

1.1 Overview

The VERA-P1 series are compact, embedded transceiver modules that enables development of electronics for
Vehicle-to-Everything (V2X) communication systems. These automotive grade modules are designed for
applications such as traffic safety, intelligent traffic management and entertainment. The modules can be used
for in-vehicle units (OBU - On Board Unit) – their use in V2X infrastructure (RSU - Road Side Unit) is intended, but
not authorized yet. The VERA-P1 series modules provide superior performance compared to V2X systems based
on consumer-grade Wi-Fi chipsets, especially at high vehicle speeds and in non-line-of-sight (NLOS) conditions.

The VERA-P1 series includes an integrated MAC/LLC/Baseband processor and the required RF front-end
components. The module is connected to a host processor through USB or SPI interface. Both interfaces can be
used for data communication and firmware download.

1.2 Product features

Table 1: VERA-P1 series main features summary

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1.3 Block diagrams

Model

Description

VERA-P171

Single channel, no antenna diversity, one antenna

VERA-P173

Single channel, antenna diversity, two antennas

VERA-P174

Dual channel or single channel with antenna diversity, two antennas

VERA-P1 series - Data Sheet

Figure 1: Block diagram of VERA-P171

Figure 2: Block diagram of VERA-P173 and VERA-P174

1.4 Product description

Table 2: Product description

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1.5 Supported features

1

2

1

2

VERA-P1 series - Data Sheet

 Compliance with WAVE and ETSI ITS G5 for US and Europe operations
 USB and SPI
 Frequency band 5.850 – 5.925 MHz (channels 172, 174, 176, 178, 180, 182, 184)
 Channel bandwidth 10 MHz

host interfaces

 Data rates 3, 4.5, 6, 9, 12, 18, 24, 27 Mbps
 Antenna diversity (VERA-P173, VERA-P174) – CDD for TX and MRC for RX mode
 TX output power from -10 to +23 dBm (Class C), RX sensitivity -97 dBm at 3 Mbps
 Power supply 3.3 V and 5.0 V, 4 W maximum
 Operation temperature -40 °C to +95 °C
 Dimensions 29.6 x 24.8 x 3.5 mm

SPI is not recommended as the main host interface for communication due to performance limitations.
Support for 20 MHz mode is planned for future firmware releases subject to certain limitations, as the requirements for 20 MHz operation

have not been fully specified.

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VERA-P1 series - Data Sheet

3

2 Host interfaces

2.1 USB interface

The VERA-P1 series module supports a USB 2.0 high-speed interface for firmware loading (booting) and high
speed data transfer (> 200 Mbps). The USB interface of the module is powered with 3.3 V supply voltage. The
module acts as a device on the USB bus.

2.2 SPI interface

The VERA-P1 series module supports an SPI interface for firmware loading (booting) and data communication.
Firmware can be loaded by the host processor while the module operates as a slave or from the FLASH memory
while the module is in the master mode. When the module is configured as a master, it needs a USB interface
connection for communication to the host. The interface is capable of full-duplex operation in master or slave
mode. The maximum clock rate is 50 MHz in master mode, and 25 MHz in slave mode3.

SPI host interface for data communication in slave mode is tested only with 15 MHz clock rate.

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3 Pin Definition

3.1 Pin description

VERA-P1 series - Data Sheet

Figure 3: Pin allocation (top view)

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