VERA-P1 series
Host-based V2X transceiver module
Data Sheet
Abstract
This technical data sheet describes the VERA-P1 series transceiver
module that enables development of electronics for Vehicle-toEverything (V2X) communication systems. The VERA-P1 series
includes an integrated MAC/LLC/Baseband processor and the
required RF front-end components. It is connected to a host
processor through a USB or SPI interface.
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UBX-17004377 - R04
VERA-P1 series - Data Sheet
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Document Information
Title
VERA-P1 series
Subtitle
Host-based V2X transceiver module
Document type
Data Sheet
Document number
UBX-17004377
Revision and date
R04
7-Dec-2017
Disclosure restriction
Confidential
Product Status
Corresponding content status
Functional Sample
Draft
For functional testing. Revised and supplementary data will be published later.
In Development /
Prototype
Objective Specification
Target values. Revised and supplementary data will be published later.
Engineering Sample
Advance Information
Data based on early testing. Revised and supplementary data will be published later.
Initial Production
Early Prod. Information
Data from product verification. Revised and supplementary data may be published later.
Mass Production /
End of Life
Production Information
Final product specification.
This document applies to the following products:
Product name
Type number
Firmware version
PCN reference
Product Status
VERA-P171
VERA-P171-00A-00
N/A
N/A
Prototype
VERA-P173
VERA-P173-00A-00
N/A
N/A
Prototype
VERA-P174
VERA-P174-00A-00
N/A
N/A
Prototype
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express or implied, is given, including but not limited, with respect to the accuracy, correctness, reliability and fitness for a particular purpose
of the information. This document may be revised by u-blox at any time. For most recent documents, visit www.u-blox.com.
Copyright © 2017, u-blox AG.
u-blox is a registered trademark of u-blox Holding AG in the EU and other countries.
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Contents
Contents .............................................................................................................................. 3
1 Functional description .................................................................................................. 5
1.1 Overview .............................................................................................................................................. 5
1.2 Product features ................................................................................................................................... 5
1.3 Block diagrams ..................................................................................................................................... 6
1.4 Product description ............................................................................................................................... 6
1.5 Supported features ............................................................................................................................... 7
2 Host interfaces ............................................................................................................. 8
2.1 USB interface ........................................................................................................................................ 8
2.2 SPI interface .......................................................................................................................................... 8
3 Pin Definition ................................................................................................................ 9
3.1 Pin description ...................................................................................................................................... 9
4 Electrical specification ................................................................................................ 14
4.1 Absolute maximum ratings ................................................................................................................. 14
4.2 Operating conditions .......................................................................................................................... 14
4.3 Digital pad ratings .............................................................................................................................. 14
4.4 Peak current consumption .................................................................................................................. 15
4.5 Current consumption.......................................................................................................................... 15
4.6 Radio specifications ............................................................................................................................ 16
5 Mechanical specifications .......................................................................................... 18
5.1 Physical dimensions ............................................................................................................................ 18
6 Qualification and approvals ...................................................................................... 20
6.1 Approvals ........................................................................................................................................... 20
6.1.1 European Union regulatory compliance ....................................................................................... 20
6.1.2 FCC compliance .......................................................................................................................... 20
6.1.3 IC compliance.............................................................................................................................. 20
6.1.4 FCC and IC IDs ............................................................................................................................ 20
6.1.5 Certification in other countries .................................................................................................... 21
7 Product handling & soldering .................................................................................... 22
7.1 Packaging ........................................................................................................................................... 22
7.1.1 Reels ........................................................................................................................................... 22
7.1.2 Tapes .......................................................................................................................................... 22
7.2 Shipment, storage and handling ......................................................................................................... 22
7.2.1 Moisture sensitivity levels ............................................................................................................. 22
7.2.2 Mounting process and soldering recommendations ..................................................................... 23
7.2.3 ESD handling precautions ............................................................................................................ 24
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8 Labeling and ordering information ........................................................................... 25
8.1 Product labeling .................................................................................................................................. 25
8.2 Explanation of codes........................................................................................................................... 25
8.3 Ordering codes ................................................................................................................................... 25
Appendix .......................................................................................................................... 26
Glossary ............................................................................................................................ 26
Related documents........................................................................................................... 27
Revision history ................................................................................................................ 27
Contact .............................................................................................................................. 28
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1 Functional description
1.1 Overview
The VERA-P1 series are compact, embedded transceiver modules that enables development of electronics for
Vehicle-to-Everything (V2X) communication systems. These automotive grade modules are designed for
applications such as traffic safety, intelligent traffic management and entertainment. The modules can be used
for in-vehicle units (OBU - On Board Unit) – their use in V2X infrastructure (RSU - Road Side Unit) is intended, but
not authorized yet. The VERA-P1 series modules provide superior performance compared to V2X systems based
on consumer-grade Wi-Fi chipsets, especially at high vehicle speeds and in non-line-of-sight (NLOS) conditions.
The VERA-P1 series includes an integrated MAC/LLC/Baseband processor and the required RF front-end
components. The module is connected to a host processor through USB or SPI interface. Both interfaces can be
used for data communication and firmware download.
1.2 Product features
Table 1: VERA-P1 series main features summary
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1.3 Block diagrams
Figure 1: Block diagram of VERA-P171
Figure 2: Block diagram of VERA-P173 and VERA-P174
1.4 Product description
Model
Description
VERA-P171
Single channel, no antenna diversity, one antenna
VERA-P173
Single channel, antenna diversity, two antennas
VERA-P174
Dual channel or single channel with antenna diversity, two antennas
Table 2: Product description
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1.5 Supported features
Compliance with WAVE and ETSI ITS G5 for US and Europe operations
USB and SPI
1
host interfaces
Frequency band 5.850 – 5.925 MHz (channels 172, 174, 176, 178, 180, 182, 184)
Channel bandwidth 10 MHz
2
Data rates 3, 4.5, 6, 9, 12, 18, 24, 27 Mbps
Antenna diversity (VERA-P173, VERA-P174) – CDD for TX and MRC for RX mode
TX output power from -10 to +23 dBm (Class C), RX sensitivity -97 dBm at 3 Mbps
Power supply 3.3 V and 5.0 V, 4 W maximum
Operation temperature -40 °C to +95 °C
Dimensions 29.6 x 24.8 x 3.5 mm
1
SPI is not recommended as the main host interface for communication due to performance limitations.
2
Support for 20 MHz mode is planned for future firmware releases subject to certain limitations, as the requirements for 20 MHz operation
have not been fully specified.
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2 Host interfaces
2.1 USB interface
The VERA-P1 series module supports a USB 2.0 high-speed interface for firmware loading (booting) and high
speed data transfer (> 200 Mbps). The USB interface of the module is powered with 3.3 V supply voltage. The
module acts as a device on the USB bus.
2.2 SPI interface
The VERA-P1 series module supports an SPI interface for firmware loading (booting) and data communication.
Firmware can be loaded by the host processor while the module operates as a slave or from the FLASH memory
while the module is in the master mode. When the module is configured as a master, it needs a USB interface
connection for communication to the host. The interface is capable of full-duplex operation in master or slave
mode. The maximum clock rate is 50 MHz in master mode, and 25 MHz in slave mode3.
3
SPI host interface for data communication in slave mode is tested only with 15 MHz clock rate.
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3 Pin Definition
3.1 Pin description
Figure 3: Pin allocation (top view)
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