SARA-G3 / SARA-U2 series - System integration manual
UBX-13000995 - R28 Contents Page 6 of 217
C1-Public
2.10 Module placement .................................................................................................................................. 160
2.11 Module footprint and paste mask ........................................................................................................ 161
2.12 Thermal guidelines ................................................................................................................................. 162
2.13 ESD guidelines ......................................................................................................................................... 164
2.13.1 ESD immunity test overview ........................................................................................................ 164
2.13.2 ESD immunity test of u-blox SARA-G3 and SARA-U2 reference designs .......................... 164
2.13.3 ESD application circuits ................................................................................................................ 165
2.14 SARA-G3 / SARA-U2 ATEX modules integration in devices intended for use in potentially
explosive atmospheres ................................................................................................................................... 167
2.14.1 General guidelines .......................................................................................................................... 167
2.14.2 Guidelines for VCC supply circuit design ................................................................................... 169
2.14.3 Guidelines for antenna RF interface design .............................................................................. 170
2.15 Schematic for SARA-G3 / SARA-U2 series module integration .................................................... 172
2.15.1 Schematic for SARA-G300 / SARA-G310 modules integration ............................................ 172
2.15.2 Schematic for SARA-G340 / SARA-G350 modules integration ............................................ 173
2.15.3 Schematic for SARA-U2 series modules integration .............................................................. 174
2.16 Design-in checklist .................................................................................................................................. 175
2.16.1 Schematic checklist ....................................................................................................................... 175
2.16.2 Layout checklist .............................................................................................................................. 176
2.16.3 Antenna checklist ........................................................................................................................... 176
3 Handling and soldering .................................................................................................................... 177
3.1 Packaging, shipping, storage and moisture preconditioning ......................................................... 177
3.2 Handling ..................................................................................................................................................... 177
3.3 Soldering ................................................................................................................................................... 178
3.3.1 Soldering paste ............................................................................................................................... 178
3.3.2 Reflow soldering .............................................................................................................................. 178
3.3.3 Optical inspection ........................................................................................................................... 179
3.3.4 Cleaning ............................................................................................................................................ 179
3.3.5 Repeated reflow soldering ............................................................................................................ 180
3.3.6 Wave soldering ................................................................................................................................ 180
3.3.7 Hand soldering ................................................................................................................................ 180
3.3.8 Rework .............................................................................................................................................. 180
3.3.9 Conformal coating .......................................................................................................................... 180
3.3.10 Casting ............................................................................................................................................... 181
3.3.11 Grounding metal covers ................................................................................................................. 181
3.3.12 Use of ultrasonic processes .......................................................................................................... 181
4 Approvals .............................................................................................................................................. 182
4.1 Product certification approval overview ............................................................................................. 182
4.2 US Federal Communications Commission notice ............................................................................ 183
4.2.1 Safety warnings review the structure ........................................................................................ 183
4.2.2 Declaration of conformity ............................................................................................................. 183
4.2.3 Modifications ................................................................................................................................... 184
4.3 Innovation, Science and Economic Development Canada notice ................................................. 184