u-blox ODIN-W260, ODIN-W262, ODIN-W260-00B-00, ODIN-W262-00B-00 System Integration Manual

ODIN-W2 series

Stand-alone multiradio modules with Wi-Fi & Bluetooth

System Integration Manual

Abstract

This document describes the system integration of ODIN-W2 series multiradio module. The ODIN-W2 module is a compact, standalone, Wi-Fi IEEE 802.11-2012 (a/b/g/n), dual-

band 2x2 MIMO,

Bluetooth v2.1+EDR, Bluetooth Low Energy v4.

0, multiradio

solution in the compact ODIN form factor.

www.u-blox.com

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Document Information

Title ODIN-W2 series

Subtitle Stand-alone multiradio modules with Wi-Fi & Bluetooth

Document type System Integration Manual

Document number UBX-14040040

Revision and date R03 23-Sept-2015

Document status Advance Information

Document status explanation

Objective Specification Document contains target values. Revised and supplementary data will be published later.

Advance Information Document contains data based on early testing. Revised and supplementary data will be published later.

Early Production Information Document contains data from product verification. Revised and supplementary data may be published later.

Production Information Document contains the final product specification.

This document applies to the following products:

Product name Type number Firmware version PCN / IN reference

ODIN-W260 ODIN-W260-00B-00 1.0.0 TBD

ODIN-W262 ODIN-W262-00B-00 1.0.0 TBD

u-blox reserves all rights to this document and the information contained herein. Products, names, logos and designs described herein may in whole or in part be subject to intellectual property rights. Reproduction, use, modification or disclosure to third parties of this document or any part thereof without the express permission of u-blox is strictly prohibited.

The information contained herein is provided “as is” and u-blox assumes no liability for the use of the information. No warranty, either express or implied, is given, including but not limited, with respect to the accuracy, correctness, reliability and fitness for a particular purpose of the information. This document may be revised by u-blox at any time. For most recent documents, visit www.u-blox.com.

u-blox® is a registered trademark of u-blox Holding AG in the EU and other countries. ARM® is the registered trademark of ARM Limited in the EU and other countries.

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Contents

Contents .............................................................................................................................. 3

1 System description ....................................................................................................... 5

1.1 Product features ................................................................................................................................... 5

1.2 Architecture .......................................................................................................................................... 6

1.2.1 RF section ...................................................................................................................................... 6

1.2.2 Host processor............................................................................................................................... 6

1.3 Pin description ...................................................................................................................................... 7

1.4 Operating modes .................................................................................................................................. 9

1.4.1 Radio modes ................................................................................................................................. 9

1.4.2 Power modes ................................................................................................................................ 9

1.5 Power management ............................................................................................................................. 9

1.5.1 Module supply requirements (VCC) ............................................................................................... 9

1.5.2 Generic digital interfaces supply output (V_INT) ............................................................................. 9

1.5.3 VCC application circuits ................................................................................................................. 9

1.6 System function interfaces .................................................................................................................. 10

1.6.1 Module reset ............................................................................................................................... 10

1.6.2 External low power clock for power saving modes ...................................................................... 10

1.6.3 System input and output signals .................................................................................................. 10

1.6.4 Restoring default configuration ................................................................................................... 10

1.6.5 Firmware update ......................................................................................................................... 11

1.7 Antenna interfaces ............................................................................................................................. 11

1.7.1 Antenna connectors .................................................................................................................... 11

1.7.2 Internal antenna .......................................................................................................................... 11

1.8 Data communication interfaces .......................................................................................................... 11

1.8.1 Universal asynchronous serial interface (UART) ............................................................................ 11

1.8.2 Ethernet (RMII+SMI) .................................................................................................................... 12

1.9 Reserved pins (RSVD) .......................................................................................................................... 12

1.10 GND pins ........................................................................................................................................ 12

2 Design-in ..................................................................................................................... 14

2.1 Design guidelines................................................................................................................................ 14

2.1.1 Module supply (VCC) design ....................................................................................................... 14

2.1.2 Generic digital interfaces supply output (V_INT) design................................................................ 14

2.1.3 Low power clock (LPO_CLK) design ............................................................................................. 14

2.1.4 Asynchronous serial interface (UART) design ............................................................................... 14

2.2 Antenna interface design .................................................................................................................... 14

2.2.1 Antenna connectors .................................................................................................................... 15

2.2.2 Internal antenna design ............................................................................................................... 15

2.3 Module placement.............................................................................................................................. 16

2.4 Module footprint and paste mask ....................................................................................................... 16

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2.5 Thermal guidelines.............................................................................................................................. 17

2.5.1 Thermal protection ...................................................................................................................... 17

2.5.2 Heat dissipation ........................................................................................................................... 17

2.6 ESD guidelines .................................................................................................................................... 18

2.7 Schematic for ODIN-W2 ..................................................................................................................... 18

3 Handling and soldering ............................................................................................. 20

3.1 Packaging, shipping, storage and moisture preconditioning ............................................................... 20

3.2 Handling ............................................................................................................................................. 20

3.3 Soldering ............................................................................................................................................ 20

3.3.1 Solder paste ................................................................................................................................ 20

3.3.2 Reflow soldering ......................................................................................................................... 21

3.3.3 Optical inspection ........................................................................................................................ 22

3.3.4 Cleaning ...................................................................................................................................... 22

3.3.5 Repeated reflow soldering ........................................................................................................... 22

3.3.6 Wave soldering............................................................................................................................ 22

3.3.7 Hand soldering ............................................................................................................................ 22

3.3.8 Rework ........................................................................................................................................ 23

3.3.9 Conformal coating ...................................................................................................................... 23

3.3.10 Casting ........................................................................................................................................ 23

3.3.11 Grounding metal covers .............................................................................................................. 23

3.3.12 Use of ultrasonic processes .......................................................................................................... 23

4 Qualifications and Approvals .................................................................................... 24

4.1 Safety Compliance .............................................................................................................................. 24

4.2 FCC and IC compliance - Labeling Requirements for End Product ....................................................... 24

4.3 UL listing information ......................................................................................................................... 25

4.4 Japan Radio Equipment Compliance - Labeling Requirements for End Product.................................... 25

4.5 Compliance with RoHS directive ......................................................................................................... 25

Appendix A - Glossary ..................................................................................................... 26

Appendix B - Antennas .................................................................................................... 27

Antenna accessories................................................................................................................................... 27

Approved antennas.................................................................................................................................... 28

Appendix C – Design-in checklist .................................................................................... 31

Schematic checklist .................................................................................................................................... 31

Layout checklist ......................................................................................................................................... 31

Related documents........................................................................................................... 32

Revision history ................................................................................................................ 32

Contact .............................................................................................................................. 33

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1 System description

The ODIN-W2 series is a highly integrated multiradio module developed by u-blox for integration in demanding, reliable devices such as those needed for industrial and medical applications. The module is built around a multiradio chip, which includes Wi-Fi, Classic Bluetooth and Bluetooth Low Energy (Dual Mode / Bluetooth Smart Ready). The Wi-Fi support conforms to IEEE 802.11a/b/g/n, and has support for dual-band 2.4 GHz and 5 GHz operation and 2.4 GHz 2×2 MIMO.

The high performance ODIN-W2 series module is available in different versions (see Product features). The module has a small form factor and the interface layout is the same as previous Bluetooth and Wi-Fi modules from u-blox in the 15x22 mm ODIN form factor.

The module is complete with embedded driver, stack and application for wireless data transfer and AT-command configuration. The upcoming extensions of the module firmware include micro Access Point

and high speed

interfaces such as RMII for Ethernet applications. The ODIN-W2 series modules support IEEE 802.11d. IEEE 802.11d is an amendment to the IEEE 802.11

specification that adds support for "additional regulatory domains". IEEE 802.11d allows ODIN-W2 based devices to self-configure and operate according to the regulations of the country in which they operate. Its parameters include country name, channel quantity and maximum transmission level. The country information feature simplifies the creation of 802.11 wireless access points and client devices that meet the different regulations enforced in various parts of the world. For more information about 802.11d see the ODIN-W2 Series Datasheet [2].

1.1 Product features

Table 1: Key features of ODIN-W2 series

Planned for version 01B

Planned for version 02B

Planned feature

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1.2 Architecture

Figure 1: Block diagram of ODIN-W2 series

1.2.1 RF section

The radio frequency (RF) section contains an RF transceiver, RF switches, RF filters, RF diplexer and a high tolerance crystal oscillator. The transceiver has the following five RF ports:

• Bluetooth 2.4 GHz in/out, classic Bluetooth and Bluetooth low energy

• Wi-Fi 2.4 GHz band main port in/out

• Wi-Fi 5 GHz band In

• Wi-Fi 5 GHz band out

• Wi-Fi 2.4 GHz band MIMO port in/out

The Bluetooth and Wi-Fi 2.4 GHz main ports are switched together to a common RF path, which is filtered with a 2.4 GHz band pass filter. The in and out ports of Wi-Fi 5 GHz are switched together to a common in and out path. The 2.4 GHz and 5 GHz RF paths are combined together with a 2.4 and 5 GHz diplexer (the diplexer also have band pass characteristics) into a dual-band Wi-Fi and Bluetooth dual-mode in and out antenna port (main antenna port). The switches are controlled by the radio transceiver, which guarantees only one port is active at any given point of time.

The Wi-Fi MIMO port is separate from the other ports and connected directly to a coaxial U.FL. connector through a band pass filter. The U.FL. connector should be connected to an external antenna through a coaxial cable. See Approved antennas

section for more information about how to select the antennas.

The MIMO port/functionality is available only in the ODIN-W260 module.

Different antenna options are available depending on the chosen ODIN-W2 series model:

• ODIN-W260: A standard coaxial U.FL. connector that must be connected to an external antenna

through a coaxial cable. See Antenna connectors section for more information about the antenna connectors.

• ODIN-W262: An internal dual-band PIFA antenna. See Internal antenna subsection for more information

about the internal antenna.

Three internal DC/DC regulators generate 1.1 V, 1.8 V and 2.7 V to the RF parts.

1.2.2 Host processor

The host processor is composed of a high-performance ARM® Cortex™-M4 Microcontroller (MCU). The MCU operates at a system frequency of up to 168 MHz and has 2 MB of Flash and 256 KB of RAM memory. A 24 MHz crystal supplies the host for accurate interface timing. The host enables communication with the ODIN-W2 module over both UART and RMII.

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The power management is handled by a 1.8 V DC regulator that supplies the host core and IOs. The 1.8 V IO voltage is also available on the solder pads for use on an external interface logic. The 1.8 V is always available if the VCC supply to the module is stable.

1.3 Pin description

Figure 2: ODIN-W2 series pin assignment

The signals are available on castellation pads on the edge of the PCB. The unfilled circular pads are GND pads. Black circular pads are test and production points and are not used in customer applications.

Function No Name

I/O

Description

Remarks

Power A2 V_INT O Regulated output voltage

for external interface supply.

1.8 V, max output current 100mA. The maximum output current can be limited by the internal current consumption of the V_INT rail.

A4 VCC I Module power supply. 3.0 - 3.6 V power supply.

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Function No Name

I/O

Description

Remarks

GND N/A Ground All GND pads must be

connected to ground.

System IO

A1 RESET_N I External reset input. Internal active pull-up to V_INT.

A7 RED O Logic Red LED Signal. Active low.

A8 GREEN/SWITCH_1 O/I Logic Green LED Signal.

System Input Signal

Active low. The GREEN signal is not valid until 500ms after

startup. If the level on this pin is pulled-down during start-up

the unit goes back to default serial settings. The SWITCH_1 input is only active during the first 500ms after startup.

The module will revert to factory settings if both the SWITCH_1 and SWITCH_0 signals are low during start up.

A9 BLUE O Logic Blue LED Signal. Active low.

A6 SWITCH_0 I System Input Signal Active low. The module will revert to factory settings

if both the SWITCH_1 and SWITCH_0 signals are low during startup.

Clock C16 LPO_CLK I Low Power Oscillator clock

input

The modules require an external 32.768 kHz clock for low power modes. Should be left unconnected if not used.

UART A13 UART_RXD I UART Receive.

A11 UART_TXD O UART Transmit.

A12 UART_RTS O UART Request To Send,

Hardware flow control.

Active low.

A10 UART_CTS I UART Clear To Send,

Hardware flow control.

Active low.

A5 UART_DTR O UART Data Terminal Ready

System Output Signal

Active low. Is used as a System IO

A18 UART_DSR I UART Data Set Ready. Active low. Can also be used as a System IO.

RMII C14 RMII_MDC O Management data clock

line

C15 RMII_MDIO I/O Management data I/O line

D1 RMII_TXD0 O RMII Transmit 0

D2 RMII_TXD1 O RMII Transmit 1

D3 RMII_TX-EN O RMII Transmit enable Active high.

D4 RMII_CRS-DV I Carrier Sense/Receive Data

Valid input

Carrier Sense and Receive Data Valid signals are multiplexed together, multiplexing scheme varies with implementation.

D5 RMII_RXD0 I RMII Receive 0

D6 RMII_RXD1 I RMII Receive 1

D8 RMII_REF-CLK

I RMII Reference clock input Continuous 50 MHz reference clock input.

RSVD

N/A Reserved pin. All RSVD should be left unconnected

Table 2: ODIN-W2 pin description

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1.4 Operating modes

1.4.1 Radio modes

The ODIN-W2 series is a stand-alone multiradio module that supports Wi-Fi, Bluetooth classic, and Bluetooth low energy. It can run as a single radio module with only one radio-mode enabled or as a true multiradio module with both Bluetooth and Wi-Fi enabled concurrently.

When the ODIN-W2 series module runs as a multiradio module, coexistence is handled internally. In other words, the ODIN-W2 series module will swap between Bluetooth and Wi-Fi when needed and ensures that no transmissions occur simultaneously.

1.4.2 Power modes

Different modes will be available to optimize power consumption. This will be implemented in future software releases.

To enable any power saving mode, an external low power oscillator clock (LPO) is required. See the Low

power clock (LPO_CLK) design section for more information about the external LPO design.

1.5 Power management

1.5.1 Module supply requirements (VCC)

The ODIN-W2 series modules must be supplied with a DC power through VCC pins. Voltage must be stable, as during operation, the current drawn from the VCC can vary significantly depending on the power consumption profile of the Bluetooth (BT) and Wi-Fi technologies.

See Module supply requirements (VCC) section for power supply design information and the ODIN-W2 series Data Sheet [2] for information about voltage supply requirement.

1.5.2 Generic digital interfaces supply output (V_INT)

The ODIN-W2 series modules provide a 1.8 V supply rail output through the V_INT pin, which is internally generated when the module has VCC supplied. The same voltage domain is used internally to supply the generic digital interfaces of the modules. The V_INT supply output can be used instead of an external discrete regulator.

1.5.3 VCC application circuits

The ODIN-W2 series modules must be supplied with a proper DC power supply through the VCC pins, which can be one of the following:

• Switching regulator

• Low Drop Out (LDO) regulator

The switching step-down regulator is the right choice when the available primary supply source has a nominal voltage much higher (for example, greater than 5 V) than the operating supply voltage of the ODIN-W2 series. The use of switching step-down provides the best power efficiency for the overall application and minimizes current drawn from the main supply source. While selecting the switching step-down regulator, ensure that the output voltage is clean and does not inject noise to the module. Appropriate filtering might be needed.

The use of an LDO linear regulator is convenient for a primary supply with a relatively low voltage (for example, less than 5 V). In this case, the typical 90% efficiency of the switching regulator will diminish the benefit of voltage step-down and no true advantage will be gained in input current savings. On the other side, linear regulators are not recommended for high voltage step-down as they will dissipate a considerable amount of energy in thermal power.

Independent of the selected DC power supply, it is crucial that the ODIN-W2 series can handle the high peak currents generated by the RF transceiver and front end. It is recommended to use a supply that can deliver 1A. It is considered as best practice to have decoupling capacitors on the supply rails close to the ODIN-W2 series module, although depending on the design of the power routing on the host system, capacitance might not be needed.

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1.6 System function interfaces

1.6.1 Module reset

You can reset (reboot) the ODIN-W2 series modules using one of the following methods:

• Hardware reset: Low level on the RESET_N pin, which is normally set high by an internal pull-up, for a

valid time period (see ODIN-W2 series Data Sheet [2]). This causes an “external” or “hardware” reset of the module. The RESET_N line should be driven by open drain, open collector or contact switch.

• Software reset with an AT command: This causes an “internal” or “software” reset of the module.

See ODIN-W2 AT Commands Manual [1] for more information.

1.6.2 External low power clock for power saving modes

An external 32.768 kHz Low Power Clock (LPO) is required for using the power saving modes. See the ODIN-W2 AT Commands Manual [1] for more information about the different power saving modes. The clock must be available during start-up (after power on or while leaving the reset-state).

See the Low power clock (LPO_CLK) design section for more information about external LPO clock design. The LPO clock should be left unconnected if not needed in the design. See ODIN-W2 series Data Sheet [2] for electrical requirements.

1.6.3 System input and output signals

The module can be in Command mode, Data mode, and Extended Data mode and the RED, GREEN, BLUE and UART DTR signals are used to detect or indicate the status. See ODIN-W2 AT Commands Manual [1] for more information about the modes.

Table 4 describes the default setup of the System IOs - RED, GREEN and BLUE. For more information on the pins see Pin description section.

Mode Status RGB LED Color GREEN GPIO BLUE GPIO RED GPIO

Data mode, EDM IDLE Green LOW HIGH HIGH

Command mode IDLE Orange LOW HIGH LOW

Data mode, Command mode, EDM

CONNECTING2 Purple HIGH LOW LOW

Data mode, Command mode, EDM

CONNECTED2 Blue HIGH LOW HIGH

Table 3: LED Signal states in different module modes

The UART_DTR pin can be set to indicate if the module is in Data mode (Low) or Command mode (High) or indicate if there are any modules connected to the module (Low if at least one module is connected). It can also be set to always low.

The UART_DSR pin can be set put the module in Command mode (Low to High transition will set the module in Command mode if not already there) or it can be used to disconnect all remote pears.

For more information, see the ODIN-W2 AT Commands Manual [1].

1.6.4 Restoring default configuration

In some situations, it is necessary to restore the settings to their default values. The following two levels of restore to default configuration can be activated through hardware:

• Serial Settings: The serial settings are restored to default serial settings if the level on the SWITCH_1

pin is low during start-up. See the table in the Universal asynchronous serial interface (UART) section for more information about the default serial settings.

On data activity, the active LED flashes.

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• Factory Settings: The module will restore all factory settings if both the SWITCH_1 and SWITCH_0

signals are low during start-up. See the ODIN-W2 AT Commands Manual [1] for more information about the default factory settings.

1.6.5 Firmware update

See the ODIN-W2 AT Commands Manual [1] for information about firmware update.

1.7 Antenna interfaces

The antenna interface is different for each module version in the ODIN-W2 series.

1.7.1 Antenna connectors

The ODIN-W260 module has two RF antenna U.FL. connectors with a characteristic impedance of 50 ohm. The main supports both Bluetooth and dual-band Wi-Fi.

The MIMO antenna connector supports 2x2 MIMO 2.4 GHz single band Wi-Fi. The use of multiple antennas at both the transmitter and receiver improves communication performance. The MIMO technology significantly increases data throughput. A MIMO m x n system consists of m transmit and n receive antennas, where the data to be transmitted is divided into m independent data streams.

2x2 MIMO is not supported in the current firmware version.

Figure 3: ODIN-W260 antenna connectors for external antennas

1.7.2 Internal antenna

The ODIN-W262 module has an internal dual-band PIFA antenna. See Internal antenna design section for antenna design information.

1.8 Data communication interfaces

1.8.1 Universal asynchronous serial interface (UART)

The ODIN-W2 series module provides a Universal Asynchronous Serial Interface (UART) for data communication. The ODIN-W2 series module can be in configuration mode (Command mode) and data mode. See the ODIN-W2 AT Commands Manual [1] for more information about the different module modes.

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The following UART signals are available:

• Data lines (RXD as input, TXD as output)

• Hardware flow control lines (CTS as input, RTS as output)

The UART can be used as both 4 wire UART with hardware flow control and as 2-wire UART with only TXD and RXD. If using the UART in 2-wire mode CTS should be connected to GND on the ODIN-W2 module. The use of flow control is configured with an AT command. See the ODIN-W2 AT C ommands Manual [1] for more information.

The Link status pins (DTR as output, DSR as input) are available as System IO signals, this is described in chapter

1.6.3 System input and output signals. It is recommended to use CMOS compatible signal levels. The UART interface is also used for firmware upgrade. See the ODIN-W2 AT Commands Manual [1] for more

information about the firmware upgrade. See the ODIN-W2 series Data Sheet [2] for characteristic information about the UART interface.

Interface Default configuration

COM port 115200 baud, 8 data bits, no parity, 1 stop bit, hardware flow control

Table 4: Default settings for the COM port

1.8.2 Ethernet (RMII+SMI)

The IO voltage of the ODIN-W2 is 1.8 V, which means that the RMII interface operates outside the RMII

specification v1.2. If the RMII has to be connected to a PHY circuit, then that circuit must support 1.8 V operation. If a direct MAC to MAC connection is to be used, then a level shifter might be needed depending on the selected host. The selected hardware setup must be verified on the application board to guarantee operation.

RMII:

The ODIN-W2 series module includes a full RMII either for Ethernet MAC to MAC communication or for MAC to PHY communication using the included Station Management Interface (SMI). The RMII and SMI use 9 signals in total. The interface requires an external 50 MHz clock source either from a compatible PHY chip or from an external oscillator. The ODIN-W2 series module cannot provide this clock signal by itself.

SMI (MDC/MDIO management interface):

The two-wire SMI is used to configure PHY chip. It uses a clock line and a data line to setup the internal registers on PHY chip.

MAC to MAC connection:

If you connect the ODIN-W2 series module using a direct MAC to MAC connection, the SMI interface can be left unconnected. Depending on the routing of the RMII interface on the host PCB, termination resistors might also be needed.

An external 50 MHz oscillator is needed while running a MAC to MAC connection.

MAC to PHY connection:

If you connect the ODIN-W2 series module to an external PHY circuit, both the RMII and SMI interfaces must be connected. The default PHY address (0x0) must be configured on the PHY side. Follow the recommendations from the selected PHY chip for implementation details.

1.9 Reserved pins (RSVD)

Do not connect reserved (RSVD) pin. The reserved pins can be allocated for future interfaces and functionality.

1.10 GND pins

Good connection of the module's GND pins with solid ground layer of the host application board is required for correct RF performance. It significantly reduces EMC issues and provides a thermal heat sink for the module.

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The following two types of ground (GND) pads are available:

• GND pads and the PCB edge (castellations): Mainly for power supply return path and RF ground.

• Heat dissipation GND pads under the module: Mainly used for dissipation of heat, especially during

intensive Wi-Fi activity.

See the Module footprint and paste mask and Thermal guidelines sections for information about ground design.

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2 Design-in

2.1 Design guidelines

2.1.1 Module supply (VCC) design

Good connection of the module’s VCC pin with DC supply source is required for correct RF performance. The guidelines are summarized below:

• VCC connection must be as wide and short as possible.

• Any series component with Equivalent Series Resistance (ESR) greater than few milliohms must be

avoided.

• The VCC connection must be routed through a PCB area separated from sensitive analog signals and

sensitive functional units. It is a good practice to interpose at least one layer of PCB ground between VCC track and other signal routing.

There is no strict requirement of adding bypass capacitance to the supply net close to the module. But depending on the layout of the supply net and other consumers on the same net, bypass capacitors might still be beneficial. Though the GND pins are internally connected, connect all the available pins to solid ground on the application board, as a good (low impedance) connection to an external ground can minimize power loss and improve RF and thermal performance.

2.1.2 Generic digital interfaces supply output (V_INT) design

The ODIN-W2 series modules provide a 1.8 V supply rail output through the V_INT pin. The same voltage domain is used internally to supply the generic digital interfaces of the modules. The V_INT supply output can be used for interface logic. The External digital interface logic should have decoupling on the supply pins according to the respective datasheet.

• Do not apply loads, which might exceed the limit for maximum available current from V_INT supply (see

the ODIN-W2 series Data Sheet [2]) as this can cause malfunctions in internal circuitry.

• Since the V_INT supply is generated by an internal switching step-down regulator, it is not

recommended to supply sensitive analog circuitry without adequate filtering for digital noise.

• V_INT can only be used as an output. Do not connect any external supply source on V_INT.

• ESD sensitivity rating of the V_INT supply pin is 1 kV (Human Body Model according to JESD22-A114).

• Higher protection level could be required if the line is externally accessible and it can be achieved by

mounting an ESD protection (for example, EPCOS CA05P4S14THSG varistor array) close to the accessible point.

See Schematic for ODIN-W2 section for V_INT design examples.

2.1.3 Low power clock (LPO_CLK) design

The LPO_CLK input pin requires accurate layout design. Avoid injecting noise on these pins as it may affect the stability of the LPO timing reference. See the Schematic for ODIN-W2 section for additional information.

2.1.4 Asynchronous serial interface (UART) design

The layout of the UART bus should be done so that noise injection and cross talk are avoided. See the Schematic for ODIN-W2 section for additional information.

2.2 Antenna interface design

As the unit cannot be mounted arbitrary, the placement should be chosen with consideration so that it does not interfere with radio communication. The ODIN-W262 with an internal surface mounted antenna cannot be mounted in a metal enclosure. No metal casing or plastics using metal flakes should be used. Avoid metallic based paint or lacquer as well.

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2.2.1 Antenna connectors

This section provides an overview of the different antenna options for the external antenna connectors. The main antenna connector port is mandatory while the MIMO antenna connector is optional and used only in MIMO applications.

Figure 4: ODIN-W260 with connectors for external antennas

The sections below list the antennas that are included in the radio type approvals of the module. For each antenna, the "Approvals" field defines in which test reports the antenna is included. Definitions of the «Approvals» field are:

• FCC - The antenna is included in the FCC test reports and thus approved for use in countries that accept

the FCC radio approvals, primarily US.

• IC - The antenna is included in the IC (Industrie Canada) test reports and thus approved for use in

countries that accept the IC radio approvals, primarily Canada.

• R&TTE - The antenna is included in the R&TTE test reports and thus approved for use in countries that

accept the R&TTE radio approvals, primarily the European countries.

• MIC - The antenna is included in the Japanese government affiliated MIC test reports and thus approved

for use in the Japanese market.

In general, antennas with SMD connection, Reverse Polarity SMA connector or U.FL connector are included in FCC, IC, R&TTE and MIC radio tests. The antennas with SMA connector are included in R&TTE and MIC radio tests but not in FCC or IC due to FCC/IC regulations.

The external antennas are connected to the board through U.FL connectors. Some of the antennas are connected directly to the U.FL connector of the board and some are connected using an SMA or reversed polarity SMA connector through a short U.FL to SMA or reversed polarity SMA adapter cable. Antenna accessories and recommended antennas can be found in Appendix B.

2.2.2 Internal antenna design

Keep a minimum clearance of 5 mm between the antenna and the casing. Keep a minimum 10 mm free space from metal around the antenna including under. If a metal enclosure is required, ODIN-W260 with antenna connectors has to be used.

It is recommended to place the ODIN-W262 module so that the internal antenna is in the corner of the host PCB (Pin A18 should be in the corner) as seen in Figure 5. The antenna side (short side closest to the antenna),

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positioned along one side of the host PCB ground plane is the second best option. It is beneficial to have a large ground plane on the host PCB and have a good grounding on the ODIN- W2 module.

Figure 5: ODIN-W262 internal antenna

2.3 Module placement

An optimized module placement allows better RF performance. See Antenna interfaces section for more information on antenna consideration during module placement.

Ensure that the module is clearly separated from any possible source of radiated energy. In particular, digital circuits can radiate digital frequency harmonics, which can produce electromagnetic interference that affects the module, analog parts and performance of RF circuits.

The heat dissipation during continuous transmission at maximum power can significantly raise the

temperature of the application baseboard below the ODIN-W2 series modules; Hence, avoid placing temperature sensitive devices close to the module.

2.4 Module footprint and paste mask

Figure 6 describes the suggested footprint (that is, copper mask) layout for the ODIN-W2 series modules. The proposed land pattern layout reflects the pads layout of the modules and extends 0.2 mm outside the module outline.

The Non Solder Mask Defined (NSMD) pad type is recommended over the Solder Mask Defined (SMD) pad type, which implements the solder mask opening 50 μm larger per side than the corresponding copper pad.

The suggested paste mask layout for the ODIN-W2 series modules is to follow the copper mask layout as described in Figure 6.

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Figure 6: ODIN-W2 series footprint

These are recommendations only and not specifications. The exact mask geometries, distances and stencil

thicknesses must be adapted to the specific production processes (for example, soldering and so on) of the customer.

2.5 Thermal guidelines

The ODIN-W2 series modules have been successfully tested in -40°C to +85°C. The board will generate heat during high loads that must be dissipated to sustain the life time of the components. During high ambient temperature, it is critical to dissipate the generated heat efficiently to keep the die temperature low.

2.5.1 Thermal protection

The ODIN-W2 module has built in thermal protection if the die temperature reaches too high levels. The following two preventive steps are implemented in the ODIN-W2 series module to control heating:

• Disable/Enable MIMO: When the die temperature exceeds high threshold, +103°C device will switch to

SISO rates only (as MIMO PA heating is the main contributor for heating).

• Halt TX: Suspend traffic to allow device cooling when maximum allowable die temperature of +120°C is

reached.

When the die temperature returns below the low threshold limit of +80°C, the device will automatically Enable MIMO and TX transmission.

2.5.2 Heat dissipation

It is critical to design the host board in such a way that generated heat from the ODIN-W2 series module will be dissipated efficiently. Use the different approaches as mentioned below to achieve this:

• Connect each ground pin on the ODIN-W2 series module with a solid ground layer on the application

board on both the top layer and with multiple vias to other GND planes on lower layers.

• Provide a ground plane as wide as possible on the application board.

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• Optimize the thermal design of any high power component included in the application, such as linear

regulators and amplifiers to minimize the temperature distribution in the application device.

• Select the material, thickness and surface of the mechanical enclosure of the end product in such a way

that it provides good thermal dissipation.

• Force ventilation air-flow within the mechanical enclosure.

• Provide a heat sink component attached to the application board, on the opposite side of the ODIN-W2

module, as a large part of the heat is transported through the GND pads and dissipated over the backside of the application device.

2.6 ESD guidelines

The ODIN-W2 series module contains no ESD protection on any signals. Required ESD protection must be implemented by the interface board.

2.7 Schematic for ODIN-W2

Figure 7 is an example of an ODIN-W2 connected to a 3.3V application:

• A 3.3V/1.8 level converter (Texas Instrument TXS0108E

) between the 3.3V application processor and the

1.8 V ODIN-W2 UART Interface. The level converter is an 8-bit bidirectional voltage-level translator for Open-Drain and Push-Pull Application. Maximum speed for Push-Pull is 60 Mbps. If fewer signals are used (for example, only TxD/RxD and RTS/CTS) SN74AVC4T245

could be a good choice (2x2 bits). The

level converter is supplied with 1.8 V from the ODIN-W2 V_INT output supply pin.

• In the example below, a 3.3 V LPO is available in the application and shared with the ODIN-W2 through

the 3.3/1.8 V level converter.

• An RGB LED is controlled by the LED signals through the open drain "glue" logic 74LVC3G07. The logic

gates are supplied with 1.8 V from the ODIN-W2 V_INT output supply pin.

• Push buttons are connected to the SWITCH_0, SWITCH_1 and RESET_N signals. If the button pins have

to be externally accessible on the application device, an ESD protection device should be provided close to accessible point. The SWITCH_1 button is connected through series resistors to prevent a short circuit when the multiplexed (GREEN/SWITCH_1) signal is high.

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Figure 7: A complete ODIN-W2 design in a 3.3 V application

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3 Handling and soldering

No natural rubbers, hygroscopic materials or materials containing asbestos are employed.

3.1 Packaging, shipping, storage and moisture preconditioning

For information pertaining to the ODIN-W2 series reels/tapes, Moisture Sensitivity levels (MSL), shipment and storage information, and drying for preconditioning, refer to ODIN-W2 series Data Sheet [2] and u-blox Package Information Guide [3].

3.2 Handling

The ODIN-W2 series modules are Electro-Static Discharge (ESD) sensitive devices.

Ensure ESD precautions are implemented while handling the module.

The ESD is the sudden and momentary electric current that flows between two objects at different electrical potentials caused either by direct contact or induced by an electrostatic field. The term is usually used in the electronics and other industries to describe momentary unwanted currents that may cause damage to the electronic equipment.

The ESD sensitivity for each pin of the ODIN-W2 series modules (as Human Body Model according to JESD22A114F) is specified in the ODIN-W2 series Data Sheet [2].

The ESD prevention is based on establishing an Electrostatic Protective Area (EPA). The EPA can be a small working station or a large manufacturing area. The main principle of an EPA is that there are no highly charging materials near ESD sensitive electronics, all conductive materials are grounded, workers are grounded, and charge build-up on ESD sensitive electronics is prevented. International standards are used to define typical EPA and can be obtained for example, from International Electrotechnical Commission (IEC) or American National Standards Institute (ANSI).

In addition to standard ESD safety practices, the following measures should be taken into account while handling the ODIN-W2 series modules:

• Unless there is a galvanic coupling between the local GND (that is, the work table) and the PCB GND,

the first point of contact when handling the PCB, must always be between the local GND and PCB GND.

• Before mounting an antenna patch, connect ground of the device.

• When handling the module, do not come into contact with any charged capacitors and be careful when

contacting materials that can develop charges (for example, patch antenna, coax cable, soldering iron and so on).

• To prevent electrostatic discharge through the RF pin, do not touch any exposed antenna area. If there

is any risk that such exposed antenna area is touched in non ESD protected work area, implement proper ESD protection measures in the design.

• When soldering the module, make sure to use an ESD safe soldering iron.

For more robust designs, employ additional ESD protection measures on the application device integrating the ODIN-W2 series modules, as described in the ESD guidelines section.

3.3 Soldering

3.3.1 Solder paste

No clean solder paste is strongly recommended for the ODIN-W2 series modules as it does not require cleaning after the soldering process. The paste listed in Table 7 meets these criteria:

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Soldering Paste OM338 SAC405 / Nr.143714 (Cookson Electronics) Alloy specification

95.5% Sn / 3.9% Ag / 0.6% Cu (95.5% Tin / 3.9 % Silver / 0.6% Copper)

95.5% Sn / 4.0% Ag / 0.5% Cu (95.5% Tin / 4.0% Silver / 0.5% Copper)

Melting Temperature 217°C Stencil Thickness 150 μm for base boards

Table 7: Soldering paste information

The final choice of the solder paste depends on the approved manufacturing procedures. The paste-mask geometry for applying solder paste should meet the recommendations in Module footprint and paste mask section.

The quality of the solder joints on the connectors (’half vias’) should meet the appropriate IPC

specification.

3.3.2 Reflow soldering

A convection type-soldering oven is strongly recommended over the infrared type radiation oven. The convection heated ovens allow precise control of the temperature and all parts will be heated up evenly regardless of material properties, thickness of components, and surface color.

Consider the "IPC-7530 Guidelines for temperature profiling for mass soldering (reflow and wave) processes", published during 2001. Select the reflow profiles as per the following recommendations:

Failure to observe these recommendations can result in severe damage to the device!

Preheat phase

Initial heating of component leads and balls. Residual humidity will be dried out. Note that this preheat phase will not replace prior baking procedures.

• Temperature rise rate: maximum 3°C/s.

If the temperature rise is too rapid in the preheat phase it may cause excessive slumping.

• Time: 60 to 120 seconds:

If the preheat is insufficient, rather large solder balls could be generated. Conversely, if performed excessively, fine balls and large balls will be generated in clusters.

• End Temperature: 150 to 200°C:

If the temperature is too low, non-melting tends to be caused in areas containing large heat capacity.

Heating and reflow phase

The temperature rises above the liquidus temperature of 217°C. Avoid a sudden rise in temperature as the slump of the paste could become worse.

• Limit time above 217°C liquidus temperature: 40 to 60 s

• Peak reflow temperature: 245°C

Cooling phase

A controlled cooling avoids negative metallurgical effects (solder becomes more brittle) of the solder and possible mechanical tension in the products. Controlled cooling helps to achieve bright solder fillets with a good shape and low contact angle.

• Temperature fall rate: max 4°C/s

The modules should be placed on the topside of the motherboard during soldering to avoid falling off.

The soldering temperature profile chosen at the factory depends on additional external factors like choice of soldering paste, size, thickness and properties of the base board and so on.

Exceeding the maximum soldering temperature and the maximum liquidus time limit in the

recommended soldering profile can permanently damage the module.

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Figure 8: Recommended soldering profile

The modules must not be soldered with a damp heat process.

3.3.3 Optical inspection

After soldering the ODIN-W2 series modules, inspect the modules optically to verify that the module is properly aligned and centered.

3.3.4 Cleaning

Cleaning the modules is not recommended. Residues underneath the modules cannot be easily removed with a washing process.

• Cleaning with water will lead to capillary effects where water is absorbed in the gap between the

baseboard and the module. The combination of residues of soldering flux and encapsulated water leads to short circuits or resistor-like interconnections between neighboring pads. The water will also damage the sticker and the ink-jet printed text.

• Cleaning with alcohol or other organic solvents can result in soldering flux residues flooding into the

two housing areas that are not accessible for post-wash inspections. The solvent will also damage the sticker and the ink-jet printed text.

• Ultrasonic cleaning will permanently damage the module especially, the quartz oscillators.

For best results use a "no clean" soldering paste and eliminate the cleaning step after the soldering.

3.3.5 Repeated reflow soldering

Only a single reflow soldering process is encouraged for boards with a module populated on it. The reason for this is the risk of the ODIN-W2 module falling off due to high weight in relation to the adhesive properties of the solder or the mated RF coaxial cable.

3.3.6 Wave soldering

Boards with combined through-hole technology (THT) components and surface-mount technology (SMT) devices require wave soldering to solder the THT components. Only a single wave soldering process is encouraged for boards populated with the modules.

3.3.7 Hand soldering

Hand soldering is not recommended.

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3.3.8 Rework

Rework is not recommended.

Never attempt a rework on the module itself; for example, replacing individual components. Such actions

immediately terminate the warranty.

3.3.9 Conformal coating

Certain applications employ a conformal coating of the PCB using HumiSeal® or other related coating products. These materials affect the HF properties of the modules and it is important to prevent them from flowing into

the module. The RF shields do not provide protection for the module from coating liquids with low viscosity, therefore care is required while applying the coating.

Conformal coating of the module will void the warranty

3.3.10 Casting

If casting is required, use viscose or another type of silicon pottant. The OEM is strongly advised to qualify such processes in combination with the modules before implementing this in the production.

Casting will void the warranty.

3.3.11 Grounding metal covers

Attempts to improve grounding by soldering ground cables, wick or other forms of metal strips directly onto the EMI covers is done at the customer's own risk. The numerous ground pins should be sufficient to provide optimum immunity to interferences and noise.

u-blox gives no warranty for damages to the modules caused by soldering metal cables or any other forms

of metal strips directly onto the EMI covers.

3.3.12 Use of ultrasonic processes

The short range modules contain components that are sensitive to ultrasonic waves. Use of any ultrasonic processes (cleaning, welding and son) may cause damage to the module.

u-blox gives no warranty against damages to the modules caused by any ultrasonic processes.

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4 Qualifications and Approvals

The ODIN-W2 series modules are in Advance Information status as mentioned in Document status

explanation section. Hence, the following information is not fully valid and completed yet but will be when the module is fully tested and approved in the Production Information stage as mentioned in the Document status section:

• Safety Compliance

• FCC and IC Compliance

• Japan Radio Equipment Compliance

The required action needed by the module integrator is described in this chapter. For a complete description of the qualifications and approvals see the ODIN-W2 series Data Sheet [2].

4.1 Safety Compliance

In order to fulfill the safety standard EN 60950-1 the unit must be supplied by a limited power source.

4.2 FCC and IC compliance - Labeling Requirements for End Product

The ODIN-W2 series modules are in Advance Information status as mentioned in Document status

For an end product using the product cB-0965 there must be a label containing, at least, the following information:

This device contains FCC ID: PVH0965 IC: 5325A-0965

The label must be affixed on an exterior surface of the end product such that it will be visible upon inspection in compliance with the modular approval guidelines developed by the FCC.

In accordance with 47 CFR § 15.19 the end product shall bear the following statement in a conspicuous location on the device:

"This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions; (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired

operation."

When the device is so small or for such use that it is not practicable to place the statement above on it, the information shall be placed in a prominent location in the instruction manual or pamphlet supplied to the user or, alternatively, shall be placed on the container in which the device is marketed. However, the FCC ID label must be displayed on the device.

In case, where the final product will be installed in locations where the end-user is not able to see the FCC ID and/or this statement, the FCC ID and the statement shall also be included in the end-product manual.

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4.3 UL listing information

The ODIN-W2 series module is under development currently and more information will be available when

the module is fully tested and approved.

4.4 Japan Radio Equipment Compliance - Labeling Requirements for End

Product

The ODIN-W2 series modules are in Advance Information status as mentioned in Document status

When a product integrated with an ODIN-W2 module is placed on the Japanese market, either must:

• the ODIN-W2 module be affixed with a label with the Giteki marking below. In this case is it recommended that the product is marked with “Contains MIC ID: R 204-510009”.

• the product be affixed with a label with the Giteki marking below. The marking must be visible for

inspection.

204-510009

この製品は屋内においてのみ使用可能です

Figure 9: Giteki mark, R and the ODIN-W2 MIC certification number. The “Indoor use only” information translated into Japanese below is mandatory if the product is operating in the 5.2/5.3 GHz band.

The recommended size of the Giteki mark is Ø5.0 mm but the minimum size is Ø3.0 mm.

The end product holder should also include a copy of the Japan Radio Certificate to the end product technical documentation. Contact support@u-blox.com

for a copy of the Radio Certificate.

4.5 Compliance with RoHS directive

The ODIN-W2X product is produced according to the RoHS (Restriction of the use of certain Hazardous Substances in electrical and electronic equipment) directive and complies with the directive.

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Appendix A - Glossary

Name Definition

ADC Analog to Digital Converter

BP Band Pass

BPF Band Pass Filter

BT Bluetooth

CAN Controller Area Network

CTS Clear To Send

DC Direct Current

DSR Data Set Ready

DTR Data Terminal Ready

ESD ElectroStatic Discharge

FW Firmware

GND Ground

GPIO General Purpose Input Output

H High

I Input (means that this is an input port of the module)

IEEE Institute of Electrical and Electronics Engineers

I2C Inter-Integrated Circuit

L Low

LDO Low Drop Out

LPO Low Power Oscillator

MCU Microcontroller

MIMO Multi-Input Multi-Output

N/A Not Applicable

O Output (means that this is an output port of the module)

PCN / IN Product Change Notification / Information Note

PD Pull-Down

PIFA Planar inverted-F antenna

PU Pull-Up

RF Radio frequency

RMII Reduced Media Independent Interface

RTS Request To Send

RXD Receive Data

SDIO Secure Digital Input Output

SPI Serial Peripheral Interface

TBD To Be Defined

TXD Transmit Data

UART Universal Asynchronous Receiver-Transmitter serial interface

USB Universal Serial Bus

Table 5: Explanation of abbreviations used

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Appendix B - Antennas

Antenna accessories

Name U.FL to SMA adapter cable

Connector U.FL and SMA jack (outer thread and pin receptacle) Minimum cable length 120 mm Minimum cable loss 0.5 dB, The cable loss must be above the minimum cable loss

to meet the regulatory requirements Comment The SMA connector can be mounted in a panel Approval R&TTE, MIC

Name U.FL to Reverse Polarity SMA adapter cable

Connector U.FL and Reverse Polarity SMA jack (outer thread and pin) Minimum cable length 120 mm Minimum cable loss 0.5 dB, The cable loss must be above the minimum cable loss

to meet the regulatory requirements Comment The Reverse Polarity SMA connector can be mounted in a

panel Approval FCC, IC, R&TTE, MIC

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Approved antennas

Single band antennas

Ex-IT 2400 RP-SMA 28-001

Manufacturer ProAnt

Polarization Vertical Gain +3.0 dBi Size Ø 12.0 x 28.0 mm

Connector

Reverse Polarity SMA plug (inner thread and pin receptacle). To be mounted on the U.FL to Reverse Polarity SMA adapter cable.

Comment

An SMA version antenna is also available but not recommended for use (Ex-IT 2400 SMA 28-

001).

Approval FCC, IC, R&TTE and MIC

Ex-IT 2400 MHF 28

Manufacturer ProAnt

Polarization Vertical Gain +2.0 dBi Size Ø 12.0 x 28.0 mm Cable length 100 mm Connector U.FL. connector Comment To be mounted on the U.FL connector on the PCB. Approval FCC, IC, R&TTE and MIC

Ex-IT 2400 RP-SMA 70-002

Manufacturer ProAnt

Polarization Vertical Gain +3.0 dBi Size Ø 10 x 83 mm Connector Reverse Polarity SMA plug (inner thread and pin receptacle)

Comment

To be mounted on the U.FL to Reverse Polarity SMA adapter cable (cB-ACC-

38). An SMA version antenna is also available but not recommended for use (Ex-IT 2400 SMA 70-002).

Approval FCC, IC, R&TTE and MIC

Ex-IT 2400 MHF 70-001

Manufacturer ProAnt

Polarization Vertical Gain +3.0 dBi Size Ø 9.4 x 70.5 mm Cable length 100 mm Connector U.FL. connector Comment To be mounted on the U.FL connector on the PCB. Approval FCC, IC, R&TTE and MIC

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InSide-2400

Manufacturer ProAnt

Gain +3.0 dBi Size 27 x 12 mm (triangular) Cable length 100 mm Connector U.FL. connector Comment To be mounted on the U.FL connector on the PCB. Approval FCC, IC, R&TTE and MIC

FlatWhip-2400

Manufacturer ProAnt

Gain +3.0 dBi Size Ø 50.0 x 30.0 mm Connector SMA plug (inner thread and pin) Comment To be mounted on the U.FL to SMA adapter cable. Approval R&TTE and MIC

Outside-2400

Manufacturer ProAnt

Gain +3.0 dBi Size 36.0 x 18.0 x 16.0 mm Cable length 70 mm Connector U.FL. connector Comment To be mounted on the U.FL connector on the PCB. Approval FCC, IC, R&TTE and MIC

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Dual-band antennas

InSide-WLAN

Manufacturer ProAnt

Gain +3.0 dBi Size 27 x 12 mm (triangular) Cable length 100 mm Connector U.FL. connector Comment Dual-band (2.4 GHz / 5 GHz) antenna to be mounted on the U.FL connector on the

PCB.

Approval FCC, IC, R&TTE and MIC

InSide WLAN Square 403-100

Manufacturer ProAnt

Gain +3.0 dBi Size 24x22x1 mm with mounting hole Cable length 100 mm Connector U.FL. connector Comment Dual-band (2.4GHz / 5GHz) antenna to be mounted on the U.FL

connector on the PCB.

Approval FCC, IC, R&TTE and MIC

Ex-IT WLAN RPSMA / Ex-IT WLAN SMA

Manufacturer ProAnt

Type ½ wave dipole dual-band antenna Polarization Vertical Gain +3 dBi Size 107 mm (Straight) Connector

• Reverse Polarity SMA plug (inner thread and pin receptacle)

• SMA plug (inner thread and pin)

Comment To be mounted on the U.FL to SMA or reverse polarity SMA adapter cable. Approval FCC, IC, R&TTE and MIC

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Appendix C – Design-in checklist

Schematic checklist

No. Description

Status

1. Reserved pins not connected.

2. Correct voltage level for all interfaces.

3. Verify the startup sequence.

4. Errata reviewed for all chips and modules.

5. VCC supply must be provided and stay within operating conditions.

6. External LPO_CLK must stay within operating conditions, if applied.

7. Check UART signal direction.

8. Provide proper precautions for ESD immunity as required on the application board.

Table 6: Schematic checklist

Layout checklist

No. Description

Status

1. Avoid noise and crosstalk on LPO Clock routing.

2. Route power with trace wide enough to handle the power consumption of the ODIN-W2 module.

Also avoid injecting noise on the power trace.

3. Avoid routing on the top layer underneath the ODIN-W2 module.

4. Make sure to add good grounding underneath the ODIN-W2 series module. Multiple GND vias

should be used both for thermal relief and grounding.

Table 7: Layout checklist

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u-blox ODIN-W260, ODIN-W262, ODIN-W260-00B-00, ODIN-W262-00B-00 System Integration Manual

Specifications and Main Features

Frequently Asked Questions

User Manual