B3, and
NINA module family
Nested design and migration
Application note
Abstract
This application note describes design guidelines for NINA-B1, NINA-B2, NINA-W1, NINANINA-B4 short range modules. The guidelines can be used for designing a common PCB that allows
assembly of different generations of NINA modules.
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NINA module family - Application note
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Document Information
Title NINA module family
Subtitle Nested design and migration
Document type Application note
Document number UBX-17065600
Revision and date R03 30-Mar-2021
Disclosure Restriction C1-Public
This document applies to the following products:
Product name Type number Software version PCN reference
NINA-B111 All All N/A
NINA-B112 All All N/A
NINA-W101 All All N/A
NINA-W102 All All N/A
NINA-W106 All All N/A
NINA-W131 All All N/A
NINA-W132 All All N/A
NINA-W151 All All N/A
NINA-W152 All All N/A
NINA-W156 All All N/A
NINA-B221 All All N/A
NINA-B222 All All N/A
NINA-B301 All All N/A
NINA-B302 All All N/A
NINA-B306 All All N/A
NINA-B311 All All N/A
NINA-B312 All All N/A
NINA-B316 All All N/A
NINA-B400 All All N/A
NINA-B401 All All N/A
NINA-B406 All All N/A
NINA-B410 All All N/A
NINA-B411 All All N/A
NINA-B416 All All N/A
-blox or third parties may hold intellectual property rights in the products, names, logos and designs included in this
-blox.
-blox assumes no liability for its use. No warranty, either express or
to, with respect to the accuracy, correctness, reliability and fitness for a particular
ed by u-blox at any time without notice. For the most recent
-blox.com.
UBX-17065600 - R03 Document Information Page 2 of 17
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-blox AG.
NINA module family - Application note
Contents
Document Information ............................................................................................................................. 2
Contents ....................................................................................................................................................... 3
1 Overview ................................................................................................................................................ 4
2 Migration options ................................................................................................................................ 5
2.1 Migration rationales ................................................................................................................................... 5
2.2 Processor migration paths ........................................................................................................................ 6
3 NINA family design ............................................................................................................................. 7
3.1 Physical size and pad placement ............................................................................................................. 7
3.2 Antenna options .......................................................................................................................................... 7
3.3 Footprint and pinout .................................................................................................................................. 8
3.4 Electrical characteristics ........................................................................................................................... 8
3.5 Mechanical outline .................................................................................................................................... 10
3.5.1 NINA-B3x2 .......................................................................................................................................... 10
3.5.2 NINA-B316 ......................................................................................................................................... 12
4 Design considerations .................................................................................................................... 14
4.1 Migration strategy summary ................................................................................................................. 14
4.2 Paste mask ................................................................................................................................................. 14
Appendix .................................................................................................................................................... 15
A Glossary .............................................................................................................................................. 15
Related documents ................................................................................................................................ 16
Revision history ....................................................................................................................................... 16
Contact ....................................................................................................................................................... 17
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1 Overview
u-blox adheres to a core "nested design" philosophy that allows customers to maintain form factor,
mechanical compatibility, and software continuity. This design approach means that application
designs can be easily upgraded with future (or previous) generations of most suitable NINA modules
– without any necessary change in the PCB layout. With a common pinout and footprint, NINA
modules offer a flexible migration path for futureproof applications.
This document highlights the physical differences between NINA module generations and contains
the necessary hardware guidelines for designing generic host PCBs that integrate NINA modules.
☞ Use this application note together with the relevant system integration manual [1][5][7][9][11]
and datasheet [4][6][8][10][12] when designing your nested application design or planning for
migration to a new module platform.
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2 Migration options
Product feature adaption and cost reduction are the main objectives for migration. The inclusion or
removal of Bluetooth BR/EDR, Bluetooth Low Energy (LE) and Wi-Fi standards, as well the opportunity
to reduce costs by descaling to NINA modules with lesser functionality, drive the need to migrate
between the various modules in the NINA family.
2.1 Migration rationales
Figure 1 shows the migration options for u-connectXpress module variants.
Figure 1. Possible migration rationales for u-connectXpress variants
Figure 2 shows the migration options for Open CPU module variants.
Figure 2. Possible migration rationales for Open CPU variants
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2.2 Processor migration paths
NINA module variants comprise either Nordic nRF52 or Espressif ESP32 chipset. These two chip
alternatives offer separately exclusive migration paths – although migration between Nordic and
Espressif is possible when developing Bluetooth BR/EDR or WiFi solutions.
NINA modules come with either u-blox u-connectXpress software or Open CPU structures that allow
custom applications to leverage the full hardware capabilities of the embedded chip.
☞ To learn about the available features of each module, see u-blox short range line card [13].
Expressif migration u-connectXpress Chip Bluetooth BR/EDR Bluetooth LE WiFi GPIO
NINA-B2 ESP32 4.2 Yes No 16
NINA-W15 ESP32 4.2 Yes 2.4G b/g/n 16
NINA-W132 ESP32 4.2 Yes 2.4G b/g/n 16
Table 1: Espressif u-connectXpress
Expressif migration Chip Bluetooth BR/EDR Bluetooth LE Wi-Fi MCU RAM Flash GPIO
NINA-W10 ESP32 4.2 Yes 2.4G b/g/n LX6 520kB 2048/4096 kB 24
Table 2: Espressif Open CPU
Nordic migration Chip Bluetooth BR/EDR Bluetooth LE WiFi GPIO
NINA-B11 nRF52832 v5.0 Yes No 19
NINA-B31 nRF52840 v5.0 Yes No 24
NINA-B41 nRF52833 v5.1 Yes No 28
Table 3. Nordic u-connectXpress
Nordic migration Chip Bluetooth BR/EDR Bluetooth LE WiFi MCU RAM Flash GPIO
NINA-B30 nRF52840 v5.0 Yes No M4F 256kB 1024kB 24
NINA-B40 nRF52833 v5.1 Yes No M4F 128kB 512kB 28
Table 4. Nordic Open CPU
☞ The available memory capacity offered by each chip supplier is another important consideration
as this determines the complexity and scope of features that can be supported in the application
product.
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3 NINA family design
The physical size, footprint, pinout, electrical characteristics, mechanical outline, and antenna
options supported by each NINA variant influence the migration path that is best suited for any design
application.
To fully appreciate the limitations and possibilities for nested designs and product migration, the
most prominent physical differences are described in this chapter.
3.1 Physical size and pad placement
Table 1 describes the size and number of pads for each NINA variant.
NINA-B1 NINA-B2 NINA-W1 NINA-B3 NINA-B4
Number of pads 30 36 36 55 55
Size (mm) 10x14 10x14 10x14 10x15 10x15
Table 5: NINA number of pads and physical dimensions
Despite the difference in the module size and number of pads, the geometric size and placement of
common pads in each NINA variant is the same. This means the different NINA modules can be
mounted and assembled in the same application hardware.
The essential interfaces, such as the UART, VCC, GND, switches and LEDs, are positioned on the
same pins in all NINA modules. The additional pins of the more complex NINA variants are commonly
general purpose I/Os that can be used to connect peripheral components. In Open CPU modules, the
pins can be configured as additional interfaces in the software.
When planning to migrate to the slightly larger NINA-B3 and NINA-B4 variants, an additional 1 mm
keep-out area must be implemented in the design. See also section 2.3.
3.2 Antenna options
Each of the three different available antenna technologies must be handled separately. All requiring
unique and incompatible design of the host PCB GND artwork. This limits the migration possibilities
to modules having the same antenna technology. This is generally not an issue since all antenna
variants are available for most modules.
NINA variant Antenna technology
NINA-BXX1 Antenna pin to connect an external antenna
NINA-BXX2
NINA-WXX2
NINA-BXX6
NINA-WXX6
Table 6: NINA antenna technology
Embedded PIFA antenna
Embedded Niche antenna
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3.3 Footprint and pinout
NINA-B3 and NINA-B4 series modules are slightly larger than other modules in the NINA family, but
their pinout and footprint is nonetheless compatible and interchangeable in nested application
designs. See also section 3.1.
Since the mechanical outline of the NINA-B3 and NINA-B4 series module is larger and includes the full
complement of pads, these variants provide an ideal footprint for developing nested application
designs. All modules in the NINA family can be accommodated in this PCB footprint.
As the pad placement and dimensions are identical, any NINA variant can be assembled on the
footprint of another – even if it contains just a subset of pads supported in the original.
☞ Although all NINA module variants can (with adherence to the guidelines in this document) be
mounted arbitrarily on their potentially differing footprints, it is advisable to upgrade application
PCBs to include the correct footprint of the assembled module.
Figure 1 shows the pinout and size variations between the various NINA modules. The featured
modules are from left to right: NINA-B1, NINA-W132/NINA-B2, and NINA-B3/NINA-B4. Additional
pads are highlighted in red.
Figure 1: NINA modules pin-out and dimensions
3.4 Electrical characteristics
When designing for migration it is important to make sure that the chosen power supply complies
with the specified voltage tolerances and noise characteristics. It must also be able to source the
specified peak current. Detailed power management information is available in the respective module
datasheet [4][6][8][10][12].
Moreover, it is important to make sure that the interface voltage complies with the interfacing
components. This is generally not a concern If migrating to a module that comprises a chip of the
same chip manufacturer, but before migrating between Nordic and Espressif processors it is
important to study the module specifications given in the respective datasheet [4][6][8][10][12].
As Wi-Fi applications normally consume more power, it is especially important to study the
performance capabilities of the power management before migrating to modules that support Wi-Fi.
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Table 1 summarizes the pin out of NINA family modules and highlights the key electrical differences.
Pin NINA-B1: Pin 1–30 NINA-W1/B2: Pin 1–36 NINA-B3/B41: Pin 1–55 Comment one
1 Red Red Red
2 IO_2 GPI_2 IO_2 NINA-B4 supports external LPO on this
pin
3 IO_3 GPI_3 IO_3 NINA-B4 supports external LPO on this
pin
4 IO_4 GPI_4 IO_4
5 IO_5 LPO_IN IO_5 NINA-W1: In LPO_IN mode, the signal
needs to be 0/0.7 V; e.g., via an external
voltage divider
6 GND GND GND
7 Green/Switch_1 Green/Switch_1 Green/Switch_1
8 Blue
SWO/GPIO_8)*
9 VCC_IO VCC_IO VCC_IO
10 VCC VCC VCC NINA-W1 needs 300 mA
11 RSVD
(SWDCLK)*
12 GND GND GND
13 Ant Ant Ant For external antenna version only
14 GND GND GND
15 RSVD
(SWDIO)*
16 UART_DTR UART_DTR UART_DTR
17 UART_DSR UART_DSR UART_DSR
18 Switch_2 Switch_2 Switch_2
19 Reset_N Reset_N Reset_N
20 UART_RTS UART_RTS UART_RTS
21 UART_CTS UART_CTS UART_CTS
22 UART_TXD UART_TXD UART_TXD
23 UART_RXD UART_RXD UART_RXD
24 IO_24 GPIO_24 IO_24
25 IO_25 GPIO_25 IO_25 Bootstrap pin for NINA-W1
26 GND GND GND
27 IO_27 Sys_Boot IO_27 Bootstrap pin for NINA-W1
28 NFC1 GPIO_28 NFC1
29 NFC2 GPIO_29 NFC2
30 GND GND GND
31 GPIO_31 RSVD
32 GPIO_32 IO_32 Boot strap pin for NINA-W1, Pull up
33 RSVD IO_33
34 GPI_34 IO_34
35 GPIO_35 IO_35
36 GPIO_36 IO_36 Boot strap pin for NINA-W1, 10k pull-up
37 IO_37
38 IO_38
Blue Blue
(SWO/TRACE_D0/GPIO_8)*
RSVD RSVD
(SWDCLK)*
RSVD RSVD
(SWDIO)*
*Trace-Serial wire output available on the
NINA-B1 and NINA-B3 open CPU variants
*SWD interface for NINA-B1, NINA-B30X
and NINA-40X
*SWD interface for NINA-B1, NINA-B30X
and NINA-40X
Pull-up, Pull-down
Pull-up, Pull-down
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Pin NINA-B1: Pin 1–30 NINA-W1/B2: Pin 1–36 NINA-B3/B41: Pin 1–55 Comment one
39 IO_39
40 IO_40
41 IO_41
42 IO_42
43 IO_43
44 IO_44
45 IO_45
46 IO_46
47 IO_47
48 IO_48
49 IO_49
50 IO_50
51 IO_51
52 IO_52
53 GND
54 RSVD
55 RSVD
Table 7: Summary of pin differences and compatibility levels between different NINA modules
3.5 Mechanical outline
In this section NINA-B302 is shown as an example of a module that includes the full set of pads. NINAB306 is shown as an example of a module that includes the additional GND pads required for the Niche
antenna.
The mechanical outline of all NINA modules is found in the corresponding datasheet [4][6][8][10][12].
3.5.1 NINA-B3x2
Figure 3 shows the common footprint shared between the NINA-B312 and NINA-B412 modules. It
represents the largest and most extensive complement of pads. The footprint of all other NINA
modules is a derivative of this one.
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A
Module PCB length
15.0
ccc
Seating plane coplanarity
0.10
E
Vertical edge to lateral pin 1 edge
0.30
G
Depanelizing residual
0.10 H
Lateral and antenna row pin to pin pitch
1.00
J
Lateral and antenna row pin length
1.15
M
Horizontal pin 1 Edge to inner row pin edge [mm]
1.45
O
Central, inner and outer row pin width and length
0.70
R
Horizontal pin 1 edge to antenna row pin edge
8.7
T
Vertical pin 1 edge to outer row pin edge
0.35
V
PCB and shielding cover thickness
2.27 W
Module antenna width
3.8
Module weight [g]
<1.0
Figure 3: NINA-B3x2 mechanical outline
Parameter Description Typical [mm] [mil] Tolerance [mm] [mil]
B Module PCB width 10.0
C Module thickness 3.87
D Horizontal edge to lateral pin 1 edge 1.45
F Vertical pin 1 edge to lateral pin edge 2.35
I Lateral, antenna row and outer pin width 0.70
K Horizontal pin 1 edge to central pin edge 2.775
L Vertical pin 1 edge to central pin edge 2.625
N Vertical pin no.1 edge to inner row pin edge [mm] 1.6
P Central pin to central pin pitch 1.15
Q Inner row pin to pin pitch 1.1
S Outer row pin to pin pitch 1.0
U Horizontal pin 1 edge to outer row pin edge 1.15
X Antenna overhang outside module outline on any side 0.0 +0.60
Table 8: NINA-B3x2 mechanical outline data
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C
A
CCC A
B
A
ZA1
ZA2
ZB
ZL
ZL
G
Pin 1
Pin 1
Depanelizing
residual
3.5.2 NINA-B316
Modules that support Niche PCB antennas have additional GND pads, which are shown in red in
Figure 4. The extra pads, combined with the unique GND artwork requirements of the main PCB, make
these variants incompatible with NINA modules that support other antenna technologies. Details
about main PCB layout requirements are described in the respective System integration manual
[1][5][7][9][11].
Figure 4: NINA-B316 and NINA-B416 mechanical outline with additional GND pads shown in red
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C
Module thickness
2.23
87.8
+0.40/-0.20
+15.8/-7.9
D
Horizontal edge to pin 1 center
1.80
70.9
+/-0.10
+/-3.9
E
Vertical edge to pin 1 center
0.875
34.4
+/-0.10
+/-3.9
G
Depanelizing residual
0.10
3.9
+0.25/-0.1
+9.8/-3.9
I
Lateral, antenna row and outer pin width
0.70
27.6
+/-0.05
+/-2.0
L
Vertical pin 1 center to central pin center
2.40
94.5
+/-0.05
+/-2.0
Q
Inner row pin to pin pitch
1.10
43.3
+/-0.05
+/-2.0
S
Outer row pin to pin pitch
1.00
39.4
+/-0.05
+/-2.0
T
Vertical pin 1 center to outer row pin center
0.125
4.9
+/-0.05
+/-2.0
Y
Horizontal pin 1 center to lateral pin center
0.075
3.0
+/-0.05
+/-2.0
Module weight [g]
<1.0
Parameter Description Typical [mm] [mil] Tolerance [mm] [mil]
A Module PCB length 15.0 590.6 +0.20/-0.10 +7.9/-3.9
B Module PCB width 10.0 393.7 +0.20/-0.10 +7.9/-3.9
ccc Seating plane coplanarity 0.10 3.9 +0.02/-0.10 +0.8/-3.9
F Vertical pin 1 center to lateral pin center 2.125 83.7 +/-0.05
H Lateral and antenna row pin to pin pitch 1.00 39.4 +/-0.05
J Lateral and antenna row pin length 1.15 45.3 +/-0.05
K Horizontal pin 1 center to central pin center 6.225 245.1 +/-0.05
M Horizontal pin 1 center to inner row pin center 1.45 57.1 +/-0.05
N Vertical pin 1 center to inner row pin center 1.375 54.1 +/-0.05
O Central, inner, and outer row pin width and length 0.70 27.6 +/-0.05
P Central pin to central pin pitch 1.15 45.3 +/-0.05
R Horizontal pin 1 center to antenna row pin center 8.925 351.4 +/-0.05
U Horizontal pin 1 center to outer row pin center 1.15 45.3 +/-0.05
ZA1 Horizontal pin 1 center to first set of antenna GND
pins pin center
ZA2 Horizontal pin 1 center to second set of antenna GND
pins pin center
ZB Vertical pin no.1 center to antenna GND pin center 0.225 8.9 +/-0.05
ZL Antenna GND pin width and length 0.70 27.6 +/-0.05
10.0 393.7 +/-0.05
12.55 494.1 +/-0.05
+/-2.0
+/-2.0
+/-2.0
+/-2.0
+/-2.0
+/-2.0
+/-2.0
+/-2.0
+/-2.0
+/-2.0
+/-2.0
+/-2.0
+/-2.0
+/-2.0
Table 9: NINA-B316 and NINA-B416 mechanical dimensions
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4 Design considerations
4.1 Migration strategy summary
• As antenna technology puts incompatible requirements on the main PCB GND artwork,
migration is only possible between modules that support the same antenna technology.
• The footprint of the NINA-B3 and NINA-B4 series module contains the full set of pads, whereas
other NINA modules only contain a sub-set.
• The dimensions and placement of common pads is identical between the different
generations of NINA modules. This means that, with adherence to the guidelines included in
this document, different NINA modules can be mounted and assembled in the same
application hardware
• Power management requirements can differ between modules and must be considered when
preparing for migration.
• It is important to check that peripheral components are compatible with the NINA modules
chosen for the application.
• An appropriate footprint for chosen modules should be implemented on the PCB. Otherwise,
the paste mask must be designed for the specific NINA module that is chosen. Make sure that
soldering paste is not, accidentally or otherwise, applied on unused pins.
4.2 Paste mask
The proposed land pattern layout reflects the pad layout of the module.
As Non Solder Mask Defined (NSMD) pads have a solder mask opening that is 50 μm larger per side
than the corresponding copper pad, NSMD pad types are preferred over Solder Mask Defined (SMD)
types.
The suggested paste mask layout for NINA modules must follow the copper mask layout, as described
in the corresponding data sheet [4][6][8][10][12].
⚠ The guidelines in this document are recommendations and not specifications. The exact mask
geometries, distances, and stencil thicknesses must be adapted to the specific production
processes of the customer.
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Appendix
A Glossary
Abbreviation Definition
BOM Bill Of Materials
GPIO General Purpose Input Output
LED Light Emitting Diode
NSMD Non Solder Mask Defined
PCB Printed Circuit Board
SMD Solder Mask Defined
UART Universal Asynchronous Receiver-Transmitter
USB Universal Serial Bus
Table 10: Explanation of the abbreviations and terms used
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Related documents
[1] NINA-B1 series system integration manual, UBX-15026175
[2] NINA-B1 getting started guide, UBX-16009942
[3] u-connectXpress AT commands manual, UBX-14044127
[4] NINA-B1 series data sheet, UBX-15019243
[5] NINA-W1 series system integration manual, UBX-17005730
[6] NINA-W13 series data sheet, UBX-17006694
[7] NINA-B3 series system integration manual, UBX-17056748
[8] NINA-B3 series data sheet, UBX-17052099
[9] NINA-B2 series system integration manual, UBX-18011096
[10] NINA-B2 series data sheet, UBX-18006649
[11] NINA-B4 series system integration manual, UBX-19052230
[12] NINA-B41 series data sheet, UBX-20035327
[13] Short range line card, UBX-1400345
☞ For product change notifications and regular updates of u-blox documentation, register on our
website, www.u-blox.com.
Revision history
Revision Date Name Comments
R01 15-May-2018 fbro Initial release
R02 21- Sep-2018 fbro Changed the subtitle
R03 30-Mar-2021 lber Restructured content and added NINA-B41 to the scope of the document
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NINA module family - Application note
Contact
For complete contact information, visit us at www.u-blox.com.
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