u-blox NINA-B4 User manual

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Used together with the respective module data sheets that describe the pinout and module

range module in an end product. With several supporting examples, the

connectXpress module software in production

NINA-B4 series

Stand-alone Bluetooth 5.1 low energy modules

System integration manual

Abstract

functions, this manual provides a functional overview combined with best-practice design guidelines for integrating the shortdocument explains how applications are developed for NINA-B4 open cpu solutions using the Nordic SDK. It also describes the options for flashing the uenvironments.

UBX-19052230 - R06 C1-Public www.u-blox.com

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NINA-B4 series - System integration manual

u-blox or third parties may hold intellectual property rights in the products, names, logos and designs included in this document. Copying, reproduction, modification or disclosure to third permitted with the express written permission of u The information contained herein is provided “as is” and u implied, is given purpose of the information. This document may be revised by u documents, visit www.u Copyright © u

u-blox or third parties may hold intellectual property rights in the products, names, logos and designs included in this document. Copying, reproduction, modification or disclosure to third parties of this document or any part permitted with the express written permission of u The information contained herein is provided “as is” and u implied, is given, including but not limited purpose of the information. This document may be revised by u documents, visit www.u Copyright © u

Document information

Title

NINA-B4 series

Subtitle Stand-alone Bluetooth 5.1 low energy modules

Document type

Document number

System integration manual

UBX-19052230

Revision and date R06 22-Jan-2021

Disclosure restriction C1-Public

Document status Description

Functional sample Draft For functional testing. Revised and supplementary data will be published later.

In development / Prototype

Engineering sample Advance information Data based on early testing. Revised and supplementary data will be published later.

Initial production Early production information Data from product verification. Revised and supplementary data may be published later.

Mass production / End of life

Objective specification Target values. Revised and supplementary data will be published later.

Production information Document contains the final product specification.

This document applies to the following products:

Product name Document status

NINA-B400 Early Production Information

NINA-B401 Prototype NINA-B406 Early Production Information

NINA-B410 Early Production Information NINA-B411 Prototype

NINA-B416 Early Production Information

☞ For information about the related hardware, software, and status of listed product types, refer to

the respective data sheets [2][3].

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, including but not limited to, with respect to the accuracy, correctness, reliability and fitness for a particular

-blox.com.

-blox AG.

to, with respect to the accuracy, correctness, reliability and fitness for a particular

-blox.

-blox assumes no liability for its use. No warranty, either express or

parties of this document or any part thereof is only

-blox at any time without notice. For the most recent

thereof is only

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NINA-B4 series - System integration manual

Document information ............................................................................................................................. 2

Contents ....................................................................................................................................................... 3

1 Functional description ....................................................................................................................... 5

1.1 Overview ........................................................................................................................................................ 5

1.2 Applications ................................................................................................................................................. 6

1.3 Block diagrams ............................................................................................................................................ 7

1.3.1 NINA-B40 .............................................................................................................................................. 7

1.3.2 NINA-B41 .............................................................................................................................................. 8

1.4 Product description .................................................................................................................................... 9

1.4.1 NINA-B40 series .................................................................................................................................. 9

1.4.2 NINA-B41 series .................................................................................................................................. 9

1.5 Hardware options ........................................................................................................................................ 9

1.6 Software options ....................................................................................................................................... 10

1.6.1 Open CPU............................................................................................................................................ 11

1.6.2 u-connectXpress software ............................................................................................................. 11

1.7 Bluetooth device address ........................................................................................................................ 12

1.8 Pin configurations and functions .......................................................................................................... 12

1.8.1 NINA-B40 pins ................................................................................................................................... 12

1.8.2 NINA-B41 pins ................................................................................................................................... 13

1.9 Low power clock ........................................................................................................................................ 13

1.9.1 External crystal ................................................................................................................................. 14

1.9.2 Internal oscillator .............................................................................................................................. 14

1.9.3 External clock source ....................................................................................................................... 14

2 Design-in ............................................................................................................................................. 15

2.1 NINA family migration design................................................................................................................. 15

2.2 Supply interfaces ...................................................................................................................................... 15

2.2.1 Main supply input ............................................................................................................................. 15

2.2.2 Digital I/O interfaces reference voltage (VCC_IO) ...................................................................... 15

2.2.3 VCC application circuits .................................................................................................................. 15

2.3 Antenna interface ..................................................................................................................................... 16

2.3.1 External antenna selection ............................................................................................................. 17

2.3.2 NINA-B4x6 design-in ........................................................................................................................ 21

2.4 NFC interface ............................................................................................................................................. 22

2.4.1 Battery protection ............................................................................................................................ 23

2.5 Debug interface ......................................................................................................................................... 23

2.6 General layout guidelines ........................................................................................................................ 24

2.6.1 General considerations for schematic design and PCB floor-planning ................................. 24

2.6.2 Layout and manufacturing ............................................................................................................. 24

2.6.3 Thermal guidelines ........................................................................................................................... 25

2.6.4 ESD guidelines ................................................................................................................................... 25

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2.7 Product testing .......................................................................................................................................... 26

2.7.1 u-blox in-series production tests ................................................................................................... 26

2.7.2 OEM manufacturer production test ............................................................................................. 27

3 Open CPU software ......................................................................................................................... 28

3.1 Nordic SDK ................................................................................................................................................. 28

3.1.1 Getting started with the Nordic SDK ............................................................................................ 28

3.1.2 Bluetooth device (MAC) address and other production data .................................................. 31

3.1.3 Definition of Low Frequency clock source ................................................................................... 31

3.2 Flashing open CPU software .................................................................................................................. 31

3.2.1 Flashing over the SWD interface ................................................................................................... 31

3.2.2 Flashing over the UART interface ................................................................................................. 32

4 u-connectXpress software ............................................................................................................ 34

4.1 Flashing NINA-B41 u-connectXpress software .................................................................................. 34

4.1.1 Software flashing using s-center .................................................................................................. 34

4.1.2 Software flashing using AT command ......................................................................................... 35

4.2 Low frequency clock source .................................................................................................................... 37

5 Handling and soldering ................................................................................................................... 38

5.1 Packaging, shipping, storage, and moisture preconditioning ......................................................... 38

5.2 Handling ...................................................................................................................................................... 38

5.3 Soldering ..................................................................................................................................................... 38

5.3.1 Reflow soldering process ................................................................................................................ 38

5.3.2 Cleaning .............................................................................................................................................. 39

5.3.3 Other remarks ................................................................................................................................... 40

Appendix .................................................................................................................................................... 41

A Glossary .............................................................................................................................................. 41

Related documents ................................................................................................................................ 43

Revision history ....................................................................................................................................... 44

Contact ....................................................................................................................................................... 45

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art

that enable customer applications to

M4 with FPU. With 512 kB flash and 128 kB RAM, these modules offer

art

that enable customer applications to

512 kB flash and 128 kB RAM, these modules offer

art

B40 variants are open CPU modules that enable customer applications to

M4 with FPU. With 512 kB flash and 128 kB RAM, these modules offer

B406 has

specifically designed for embedded

1 Functional description

1.1 Overview

The NINA-B4 series is comprised of small, standalone Bluetooth low energy wireless modules featuring full Bluetooth 5.1.

Based on the Nordic Semiconductor nRF52833 chip that includes an integrated RF core and powerful Arm® Cortex®-M4 processor with FPU, NINA-B4 modules include the S140 SoftDevice radio stack that operates as a Bluetooth 5.1 low energy central and peripheral protocol stack solution – as well as in Thread, Zigbee 802.15.4, and Nordic proprietary modes (NINA-B40 only).

For a flexible and innovative approach to application design, two conceptually different architecture solutions are available: u-connectXpress (B41) or open cpu (B40). End-user products based on either architecture are developed on pre-certified u-blox reference designs that are qualified with the regional regulatory bodies for your chosen product markets. This approach to application development provides good opportunity for less compliance testing, lower development cost, and reduced time to market.

With an operational temperature range that spans from -40 up to +105°C, NINA-B4 modules are ideal for harsh industrial or lighting applications that must operate at high ambient temperatures. NINAB41 also caters towards applications in smart buildings, smart cities, industrial automation systems, sensor networks and asset tracking solutions.

Featuring Angle of Arrival (AoA) and Angle of Departure (AoD) transceivers, the NINA-B40 series supports the Bluetooth 5.1 Direction Finding service. The service can be used for indoor positioning, wayfinding, and asset tracking.

NINA-B4 modules integrates internal power management circuitry requiring only a single supply voltage in the range of 1.7 – 3.6 V. The broad supply range also makes the modules particularly useful in battery powered systems.

With the same pinout, physical size, and mechanical design of NINA-B3 modules, NINA-B4 offers a natural upgrade path for existing NINA applications.

Table 1 describes the various models in the NINA-B40 series.

Model Description

NINA-B400 Bluetooth 5.1 module that includes a powerful Arm® Cortex®-M4 with FPU and delivers state-of-the-

power performance. All NINA-B40 variants are open CPU modules run on the built-in Arm® Cortex®respectable capacity for customer applications on top of the Bluetooth Low Energy stack.

NINA-B400 has a U.FL connector for use with an external antenna.

NINA-B401 Bluetooth 5.1 module that includes a powerful Arm® Cortex®-M4 with FPU and delivers state-of-the-

power performance. All NINA-B40 variants are open CPU modules run on the built-in Arm® Cortex®-M4 with FPU. With respectable capacity for customer applications on top of the Bluetooth Low Energy stack.

NINA-B401 has an RF pin for use with an external antenna.

NINA-B406 Bluetooth 5.1 module that includes a powerful Arm® Cortex®-M4 with FPU and delivers state-of-the-

power performance. All NINArun on the built-in Arm® Cortex®respectable capacity for customer applications on top of the Bluetooth Low Energy stack. NINAan internal PCB trace antenna with an extensive range. The antenna is devices.

Table 1: NINA-B40 series

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specifically

Table 2 describes the different models in the NINA-B41 series.

Model Description

NINA-B410 Bluetooth 5.1 module that includes a powerful Arm® Cortex®-M4 with FPU and delivers state-of-the-

power performance. All NINA-B41 variants have u-connectXpress software pre-flashed. NINA-B410 has a U.FL connector for use with an external antenna.

NINA-B411 Bluetooth 5.1 module that includes a powerful Arm® Cortex®-M4 with FPU and delivers state-of-the-

power performance. All NINA-B41 variants have u-connectXpress software pre-flashed. NINA-B411 has an RF pin for use with an external antenna.

NINA-B416 Bluetooth 5.1 module that includes a powerful Arm® Cortex®-M4 with FPU and delivers state-of-the-

power performance. All NINA-B41 variants have u-connectXpress software pre-flashed. NINA-B416 has an internal PCB trace antenna with an extensive range. The antenna is

designed for embedded devices.

Table 2: NINA-B41 series

☞ Already globally certified for use with an internal antenna or range of external antennas, the time,

cost, and effort spent on deploying NINA-B4 modules into customer applications is reduced significantly.

1.2 Applications

• Industrial automation

• Smart buildings and cities

• Low power sensors

• Wireless-connected and configurable equipment

• Point-of-sales

• Health devices

• Real-time Location, RTLS

• Indoor positioning

• Asset tracking

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VCC_IO (1.7

VCC (1.7 Reset

2x UART

GPIO

I2C

PWM I2S

comparator

NFC

32.768 kHz

nRF52833

USB 2.0

QDEC

PDM

1.3 Block diagrams

Block diagrams of the NINA-B40 and NINA-B41 module designs are shown in Figure 1 and Figure 2.

1.3.1 NINA-B40

A block diagram of the NINA-B40 open-cpu module design showing the alternative U.FL connector (B400), antenna pin (B401), and PCB trace antenna (B406) solutions is shown in Figure 1.

☞ NINA-B400 modules include a U.FL connector for connecting an external antenna. The module size

is 10 x 15 x 2.2 mm.

☞ NINA-B401 modules include an ANT pad on the footprint for connecting an external antenna. The

module size is 10 x 11.6 x 2.2 mm.

☞ NINA-B406 module support an internal PCB trace antenna using antenna technology from Proant

AB. The module size is 10 x 15 x 2.2 mm.

(NINA-B400)

U.FL antenna connector

(NINA-B401)

Antenna pin

(NINA-B406)

PCB trace antenna

1.3 V

Nordic Semiconductor

System

power

128 kB

RAM

PLL

DC/DC and LDO regulators

Bluetooth LE

baseband

512 kB flash

RTC, timers

and counters

PLL

with FPU

Arm® Cortex®-M4

USB device

ADC and

Passive NFC tag

SPI

IO buffers

Analog

– 3.6 V)

32 MHz

Figure 1: NINA-B40 series block diagram

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VCC_IO (1.7

VCC (1.7 Reset

2x UART

GPIO

comparator

NFC

32.768 kHz

nRF52833

1.3.2 NINA-B41

A block diagram of the NINA-B4 u-connect module design showing the alternative U.FL connector (B410), antenna pin (B411), and PCB trace antenna (B416) solutions is shown in Figure 2.

☞ NINA-B410 modules support a U.FL connector to accommodate an external antenna. The module

size is 10 x 15 x 2.2 mm.

☞ NINA-B411 modules have a footprint arrangement that includes an ANT pad for connecting an

external antenna. The module size is 10 x 11.6 x 2.2 mm.

☞ NINA-B416 modules support an internal PCB trace antenna using antenna technology from

Proant AB. The module size is 10 x 15 x 2.2 mm.

(NINA-B410)

U.FL antenna connector

(NINA-B411)

Antenna pin

(NINA-B416)

PCB trace antenna

1.3 V

Nordic Semiconductor

System

power

128 kB

RAM

PLL

DC/DC and LDO regulators

Bluetooth LE

baseband

512 kB flash

RTC, timers

and counters

PLL

with FPU

Arm® Cortex®-M4

USB device

ADC and

Passive NFC tag

IO buffers

– 3.6 V)

32 MHz

Figure 2: NINA-B41 series block diagram

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1.4 Product description

Please see the data sheet for the respective product family [2] [3] for the latest data.

1.4.1 NINA-B40 series

Item NINA-B400 NINA-B401 NINA-B406

Bluetooth version 5.1 5.1 5.1

Band support 2.4 GHz, 40 channels 2.4 GHz, 40 channels 2.4 GHz, 40 channels

Typical conducted output power +8 dBm +8 dBm -

Radiated output power (EIRP) +11 dBm (with typical

antenna)

RX sensitivity (conducted) -95 dBm -95 dBm -95 dBm

RX sensitivity, long range mode (conducted)

Supported 2.4 GHz radio modes Bluetooth Low Energy

Supported Bluetooth LE data rates 1 Mbps

Module size 10.0 x 15.0 mm 10.0 x 11.6 mm 10.0 x 15.0 mm

Table 3: NINA-B40 series characteristics summary

-102 dBm -102 dBm -102 dBm

IEEE 802.15.4 Proprietary 2.4 GHz modes

2 Mbps 500 kbps 125 kbps

+11 dBm (with typical antenna)

Bluetooth Low Energy IEEE 802.15.4 Proprietary 2.4 GHz modes

1 Mbps 2 Mbps 500 kbps 125 kbps

+11 dBm

Bluetooth Low Energy IEEE 802.15.4 Proprietary 2.4 GHz modes

1 Mbps 2 Mbps 500 kbps 125 kbps

1.4.2 NINA-B41 series

Item NINA-B400 NINA-B401 NINA-B406

Bluetooth version 5.1 5.1 5.1

Band support 2.4 GHz, 40 channels 2.4 GHz, 40 channels 2.4 GHz, 40 channels

Typical conducted output power +8 dBm +8 dBm -

Radiated output power (EIRP) +11 dBm (with typical

antenna)

RX sensitivity (conducted) -95 dBm -95 dBm -95 dBm

RX sensitivity, long range mode (conducted)

Supported 2.4 GHz radio modes Bluetooth Low Energy

Supported Bluetooth LE data rates 1 Mbps

Module size 10.0 x 15.0 mm 10.0 x 11.6 mm 10.0 x 15.0 mm

Table 4: NINA-B41 series characteristics summary

-102 dBm -102 dBm -102 dBm

IEEE 802.15.4 Proprietary 2.4 GHz modes

2 Mbps 500 kbps 125 kbps

+11 dBm (with typical antenna)

Bluetooth Low Energy IEEE 802.15.4 Proprietary 2.4 GHz modes

1 Mbps 2 Mbps 500 kbps 125 kbps

+11 dBm

Bluetooth Low Energy IEEE 802.15.4 Proprietary 2.4 GHz modes

1 Mbps 2 Mbps 500 kbps 125 kbps

1.5 Hardware options

Except for the different antenna solutions, NINA-B4 series modules use an identical hardware architecture based on nRF52833.

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1.6 Software options

NINA-B4 modules are integrated with an Arm® Cortex®-M4 application processor with FPU, 512 kB flash memory and 128 kB RAM.

The structure of any software running on either NINA-B4 module variant includes the following components:

• Radio stack

• Boot loader (optional)

• Application software

Figure 3 shows the software architecture and implementation of software components for NINA-B40 and NINA-B41 modules:

• NINA-B40 modules host the customer application and optional boot loader software, developed using the Nordic SDK, in an open-CPU configuration on the module. See also section 1.7.1.

• NINA-B41 modules are pre-flashed with boot loader and u-connectXpress software that interfaces through an AT command interpreter for control by customer application software running on host MCUs. See also section 1.7.2.

• Both module variants include the Nordic S140 SoftDevice Bluetooth low energy protocol stack that supports GATT client and server, central and peripheral roles, and multidrop connections.

Figure 3: NINA-B4 software structure

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1.6.1 Open CPU

The open CPU architecture of NINA-B40 series modules allows module integrators to build their own applications. Table 7 describes the possible connectivity and application support that is enabled with NINA-B40 hardware in the recommended Nordic SDK environment.

Feature Support

Development environment Nordic SDK (including Bluetooth Mesh

HomeKit, AirFuel, IoT, Thread, Zigbee)

HW interfaces 2 x UART

3 x SPI

40 x GPIO pins

8 x ADC channels

1 x USB

2 x I2C

1 x I2S

4 x PWM

1 x QDEC

Security Secure boot ready

Secure Simple Pairing

128-bit AES encryption

Bluetooth low energy secure connections

Table 5: Open CPU software support

For further information about Open CPU software, see chapter 3.

1.6.2 u-connectXpress software

NINA-B41 modules are pre-flashed with u-connectXpress and boot loader software that interfaces through an AT command interpreter to control customer application software running on host MCUs. Table 8 describes the feature support in the u-connectXpress software.

Feature Support

Bluetooth u-blox Low Energy Serial Port Service (SPS)

GATT server and client using AT commands Beacons

2 Mbit/s modulation 125 Kbit/s modulation long range functionality

Advertising extensions

Configuration over air Wireless transmission of AT commands to

control the module

Extended Data Mode™

HW interfaces 2 x UART, GPIO Configuration AT commands

Support tools s-center

Operating modes Central role (7 simultaneous links)

Security Secure boot

For simultaneous AT commands and data, and multiple simultaneous data streams

Peripheral role (6 simultaneous links)

Simultaneous central and peripheral roles

(8 in total, where max 4 as peripheral and max 7 as central)

LE 1M PHY

LE 2M PHY

LE CODED PHY

Advertising extensions

LE data length extension

Secure Simple Pairing 128-bit AES encryption

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Feature Support

Bluetooth low energy secure connections

Throughput over UART 780 Kbit/s

Table 6: u-connectXpress software support

For further information about u-connectXpress software, see chapter 4.

1.7 Bluetooth device address

You can scan the data matrix barcode on the module label to retrieve the Bluetooth device address. For more information about the Bluetooth device address for NINA-B40x, see also section 3.1.2.

1.8 Pin configurations and functions

1.8.1 NINA-B40 pins

The pin functions of the versatile NINA-B40 open CPU should be selected with consideration to the pin-out and nRF52833 multiplexing. The pin assignments for NINA-B40 are shown in Figure 4.

Figure 4: NINA-B40 pin assignments

☞ For more detailed information about pin assignment, see the NINA-B40 series data sheet [2].

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1.8.2 NINA-B41 pins

The u-connectXpress software running on NINA-B41 modules has fixed pin multiplexing that implements a given set of features like the UART connection. The pin assignments for NINA-B41 are shown in Figure 5.

Figure 5: NINA-B41 pin assignments

☞ For more detailed information about pin assignment, see the NINA-B41 series data sheet [3].

1.9 Low power clock

NINA-B4 modules use a 32.768 kHz low power clock to enable different sleep modes.

The clock can be generated from either of the following sources:

• Internal oscillator

• External crystal (LFXO)

• External clock source such as a crystal oscillator (TCXO)

The u-connectXpress software automatically senses the clock input and uses the source from the external crystal – if one is available. Otherwise, the software uses the source from the internal oscillator. This automatic sense functionality adds some additional time delay during startup (about 1s). If the startup time is critical or more detailed settings are needed, set the low power clock settings using AT commands. See also section 1.10.

To reach the lowest sleep current consumption of the NINA-B4 module, an external crystal or external clock source shall be used. The internal oscillator gives higher sleep current but of course a leaner BOM. For more information about sleep and other power modes, see the respective data sheet [2] [3].

Sections 1.10.1 to 1.10.3 describe the different hardware options for the low power clock source and explain the implications the clock choices have on both the cost and performance of NINA-B4 modules. For practical guidance on how to configure the oscillator on nRF5 open CPU modules, see reference [21].

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1.9.1 External crystal

NINA-B4 modules have two input pins for connecting an external low-frequency crystal (LXFO) as source for the low power clock. This setup enables NINA-B4 modules to run with the lowest overall power consumption.

Table 3 describes the details of the crystal used on EVK-NINA-B4.

Component Value Note

Crystal oscillator 32.768 kHz – 20 ppm EPSON FC-12M used on NINA-B4 EVK

Table 7: Components used on the NINA-B4 EVK evaluation kit

☞ The specifications for external LFXO sources are described in the electrical specifications of the

respective data sheet [2][3].

1.9.2 Internal oscillator

Choosing to use NINA-B4 modules with the internal oscillator makes for a leaner BOM reduces the cost to end users. This choice of oscillator adversely provides slightly higher sleep mode power consumption.

When using the internal oscillator, pins XL1 and XL2 must be connected to ground. In NINA-B40 these pins can be reassigned and used for GPIO.

⚠ To ensure that the clock is stable at +/- 250ppm, the customer application software must check

the calibration of the internal oscillator at least once every 8 seconds.

1.9.3 External clock source

As an alternative to using an external crystal, an external clock source generated from a host CPU or a TCXO can be used. The clock source can be either a low-swing or full-swing signal.

The electrical parameters are stated in the respective product data sheets [2] and [3].

Pin name Parameter Min Typ Max Unit Remarks

XL1 Input characteristic:

Peak to Peak amplitude

XL2 - - - - Connect to GND

Table 8: Electrical parameters for a low-swing clock

Pin name Parameter Min Typ Max Unit Remarks

XL1

XL2 - - - - - Connect to GND

Table 9: Electrical parameters for a full-swing clock

Input characteristic: Low-level input

Input characteristic: high-level input

200 1000 mV Input signal must not swing outside

supply rails.

0 0.3*VCC V

0.7*VCC VCC V

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2 Design-in

2.1 NINA family migration design

NINA-B4 modules are based on the Nordic nRF52833 system on chip (SoC). The modules are compatible with the pin out of NINA-B3 modules. This means that application designs based on NINA-B3 modules can be easily upgraded for use with NINA-B4.

As the pin out supported in NINA-B1, NINA-B2, and NINA-W1 series modules share a common footprint, these modules can be positioned interchangeably in application designs. To accommodate the larger physical dimensions of NINA-B3 and NINA-B4 modules, a reserved “keepout” of approximately 1 mm should be included in the design. In all other respects, the mechanical design of NINA-B4 modules is identical to that of other NINA modules. For more information about how to make a common design, see the Nested design application note [6].

2.2 Supply interfaces

2.2.1 Main supply input

The NINA-B4 series uses an integrated DC/DC converter to transform the supply voltage presented at the VCC pin into a stable system core voltage. Due to this, the NINA-B4 modules are compatible for use in battery powered designs.

While using NINA-B4 with a battery, it is important that the battery type can handle the peak power of the module. In case of battery supply, consider adding extra capacitance on the supply line to avoid capacity degradation. For information about voltage supply requirement and current consumption, see the respective datasheet [2][3].

2.2.2 Digital I/O interfaces reference voltage (VCC_IO)

On NINA-B4 series modules, the I/O voltage level is the same as the supply voltage and VCC_IO is internally connected to the supply input VCC.

When using NINA-B4 with a battery, the I/O voltage level varies with battery output voltage. The battery voltage depends on the battery “state of charge”. Level shifters might be needed to stabilize the voltage – depending on the I/O voltage of the host system and interfacing components.

2.2.3 VCC application circuits

The power for NINA-B4 series modules is provided through the VCC pins. The VCC supply can be taken from any of the following sources:

• Switched Mode Power Supply (SMPS)

• Low Drop Out (LDO) regulator

• Battery

DC/DC efficiency should be evaluated as a tradeoff between active and idle duty cycle of the specific application. Although some DC/DC converters provide high efficiency with extremely light loads, their efficiency typically worsens when idle current drops below a few mA – greatly reducing the battery life.

2.2.3.1 Battery

The low current consumption and wide voltage range of NINA-B4 series modules means that a battery can be used as a main supply. In which case, the capacity of the battery must be selected to match the application. Ensure that the battery can deliver the peak current required by the module.

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For further information about current consumption and other performance data, see also the electrical specifications in respective product datasheet [2][3].

It is best practice to include bypass capacitors on the supply rails close to the NINA-B4 series module. Depending on the design of the power routing on the host system, capacitance might not be needed.

2.2.3.2 Switched Mode Power Supply

A Switched Mode Power Supply (SMPS) is ideal in situations where the available primary supply source has more than a moderately higher value than the operating supply voltage of the module. An SMPS minimizes the amount of current drawn from the main supply and optimizes power efficiency in the final application design.

⚠ When using an SMPS, ensure that the AC voltage ripple at switching frequency is kept as low as

possible. The layout design must minimize impact of high frequency ringing.

2.2.3.3 Low Drop Out (LDO) regulator

An LDO linear regulator provides a convenient primary supply option when the voltage difference between the main supply and module VCC is reasonably small. The benefit of an LDO source over SMPS is that an LDO is simpler to integrate and does not generate switching noise. However, with a larger voltage difference, the superior efficiency of an SMPS converter provides less heat dissipation and a longer operating time in battery-powered products.

As a contingency against “latch up”, include an over-current limiter to protect the module from electrical over stress (EOS). A LDO or SMPS will serve this purpose.

2.3 Antenna interface

To optimize the radiated performance of the final product, the selection and placement of both the module and antenna must be chosen with due regard to the mechanical structure and electrical design of the product. To avoid later redesigns, it is important to decide the positioning of these components at an early phase of the product design.

Carefully consider the placement of an embedded antenna in NINA-B4x6, or an external antenna (connected through SMD assembly or RF connector) in NINA-B4x0 and NINA-B4x1.

Choose a module variant that supports an external antenna if the product includes a metal product enclosure – or if any of the layout considerations for integrating an internal PCB trace antenna into the design (see section 2.3.2.1) prove impractical.

• NINA-B4x0 modules include a U.FL connector for connecting an external antenna. Some antennas connect directly to the U.FL, while others connect through a short U.FL or reversed polarity SMA adapter cable. o Antennas with SMD connections, either reverse-polarity SMA connectors or U.FL connectors,

are radio tested and verified against regulatory FCC, IC, RED, and MIC standards.

o Antennas with SMA connectors are radio tested and verified against regulatory RED and MIC

radio tests, but not against FCC or IC standards.

• NINA-B4x1 modules include an ANT pad for connecting an external antenna. The antenna can be either an external SMD antenna or an antenna that is connected through an externally assembled U.FL or SMA connector. Both integrations are described in sections 2.3.1.1 and

2.3.1.2, respectively.

• NINA-B4x6 modules include an embedded PCB Niche antenna. See section 2.3.2 for design-in information.

A list of u-blox-approved external antennas, together with regulatory information for NINA-B4x0 and NINA-B4x1, can be found in the NINA-B4 series certification application note [8].

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☞ Although customers are actively encouraged to add their own antennas and connector designs,

all custom antenna and connector designs must be approved by u-blox and in some cases, tested. Contact your local u-blox support team for more information about this process.

2.3.1 External antenna selection

Designers are encouraged to consider one of the u-blox certified antennas and follow the layout requirements outlined below:

• External antennas, such as linear monopole antennas: o External antennas do not impose any physical restrictions on the design of the PCB where the

module is mounted.

o Radiation performance depends mostly on the type of antenna used in the application product.

Choose antennas that provide an optimal radiating performance in each operating band.

o RF cables must be carefully selected to keep insertion losses to an absolute minimum. Low-

quality or long cables introduce additional insertion losses. Large insertion losses reduce the radiation performance.

o A high quality 50 Ω coaxial connector provides proper PCB-to-RF-cable transition.

• Integrated antennas, such as patch-like antennas:

o Internal integrated antennas impose physical restrictions on the PCB design:

An integrated antenna excites RF currents on its counterpoise, typically in the PCB ground plane of the device that effectively becomes part of the antenna. Consequently, the dimensions of the ground plane define the minimum frequency that can be radiated. To optimize radiation, the ground plane can be reduced to a minimum size that should not be less than a quarter of the wavelength frequency that needs to be radiated. The orientation of the ground plane related to the antenna element must be considered.

The RF isolation between antennas in the system must be as high as possible, and the correlation between the 3D radiation patterns of the antennas must be as low as possible. In general, an RF separation of at least a quarter wavelength between the two antennas is a minimal requirement for achieving isolation and pattern correlation. Consider increasing the separation to maximize performance – if possible.

As a numerical example, consider the following physical restrictions of the PCB design:

Frequency = 2.4 GHz  Wavelength = 12.5 cm  Quarter wavelength = 3.125 cm

o Radiation performance depends on the antenna system design, the mechanical design of the

final product, and the application use case. Choose antennas that offer optimal radiating performance in the operating bands and meet the mechanical specifications of the PCB and entire product application.

Table 8 summarizes the RF interface requirements of the antenna.

Item Requirements Remarks

Impedance

Frequency Range 2400 - 2500 MHz Bluetooth low energy.

Return loss S11 < -10 dB (VSWR

50 Ω nominal characteristic impedance

< 2:1) recommended

< -6 dB (VSWR

< 3:1) acceptable

The impedance of the antenna RF connection must match the 50 Ω impedance of the ANT pin.

The return loss or S (VSWR) measurement, S parameter indicates how well the primary antenna RF connection matches the 50 Ω characteristic impedance of the ANT pin.

To maximize the amount of the power transferred to the antenna, the impedance of the antenna termination must match (as much as possible)

, As a parameter of the of the standing waves ratio

refers to the amount of reflected power. This

Wavelength referred to a signal propagating in air

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Item Requirements Remarks

the 50 Ω nominal impedance of the ANT pin over the entire operating frequency range.

Efficiency > -1.5 dB ( > 70% )

recommended > -3.0 dB ( > 50% )

acceptable

Maximum Gain

Table 10: Summary of antenna interface (ANT) requirements for NINA-B4

+3 dBi

The radiation efficiency is the ratio of the radiated power against the power delivered to the antenna input; the efficiency is a measure of how well an antenna receives or transmits.

Although higher gain antennas can be used, these must be evaluated and/or certified. See NINA-B4 certification [8] for more information on regulatory requirements.

When selecting external or internal antennas, the following recommendations should be observed:

• Select antennas that provide optimal return loss (or VSWR) over all operating frequencies.

• Select antennas that provide optimal efficiency over all operating frequencies.

• Select antennas that provide an appropriate gain (that is, combined antenna directivity and

efficiency), so that the electromagnetic field radiation intensity does not exceed the regulatory limits specified in some countries (like the FCC in the United States for example).

2.3.1.1 External RF Connector Design-in (NINA-B4x1)

If the designer wants to implement an arbitrary external RF connector different to the U.FL connector available on NINA-B4x0 NINA-B4x1 can be used. NINA-B4x1 is smaller compared to NINA-B4x0 and can be used if a minimum size implementation is required.

Table 9 suggests some RF connector plugs that can be used by the designers to connect RF coaxial cables based on the declaration of the respective manufacturers. The Hirose U.FL-R-SMT RF receptacles (or similar parts) require a suitable mated RF plug from the same connector series. Due to wide usage of this connector, several manufacturers offer compatible equivalents. It is the responsibility of the designer to verify the compatibility between plugs and receptacles used in the design.

Manufacturer Series Remarks

Hirose U.FL® Ultra Small Surface Mount Coaxial Connector Recommended

I-PEX MHF® Micro Coaxial Connector

Tyco UMCC® Ultra-Miniature Coax Connector

Amphenol RF AMC® Amphenol Micro Coaxial

Lighthorse Technologies, Inc. IPX ultra micro-miniature RF connector

Table 11: U.FL compatible plug connector

Typically, the RF plug is available as a cable assembly. Different types of cable assemblies are available; the user should select the cable assembly best suited for the application. The key characteristics of an appropriate plug include:

• RF plug type: Select U.FL or equivalent

• Nominal impedance: 50 Ω

• Cable thickness: Select thicker cables, typically those with a thickness between 0.8 mm to

1.37 mm, to minimize insertion loss.

• Cable length: The standard cable length is typically 100 mm or 200 mm; custom lengths are available on request. Select shorter cables to minimize insertion loss.

• RF connector terminating the other side of the cable: for example another U.FL (for board-to-board connection) or SMA (for panel mounting).

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SMT connectors are typically rated for a limited number of insertion cycles. In addition, the RF coaxial cable may be relatively fragile compared to other types of cables. To increase application ruggedness, connect the U.FL connector to a more robust connector such as SMA fixed on panel.

☞ A de-facto standard for SMA connectors implies the usage of reverse polarity connectors (RP-

SMA) on Wi-Fi and Bluetooth end products to make it more difficult for end users to replace the antenna with higher gain versions that exceed the regulatory limits.

The following recommendations apply for proper layout of the connector:

• Strictly follow the connector manufacturer’s recommended layout: o SMA Pin-Through-Hole connectors require GND keep-out (that is, clearance, a void area) on all

the layers around the central pin up to annular pads of the four GND posts.

o UFL surface mounted connectors require no conductive traces (clearance or void) in the area

below the connector between the GND land pads.

• If the RF pad size of the connector is wider than the micro strip, remove the GND layer beneath the RF connector to minimize the stray capacitance and retain the RF line impedance of 50 Ω. For example, the active pad of the UF.L connector must have a GND keep-out (clearance or void area) – at least on the first inner layer to reduce parasitic capacitance to ground.

2.3.1.2 External antenna design-in (NINA-B4x1)

Observe the following guidelines if the design requires an external antenna to be mounted directly on the main PCB:

• The antenna design process should begin at the start of the product design process. Prototype PCBs with antenna assembly are useful in estimating overall efficiency and radiation pattern of the intended design.

• Use antennas designed by an antenna manufacturer providing the best possible return loss (or VSWR).

• Provide a ground plane large enough according to the related integrated antenna requirements. The ground plane of the application PCB may be reduced to a minimal size that is not less than a quarter of a wavelength of the minimum frequency that shall be radiated. The overall antenna efficiency may benefit from larger ground planes.

• Proper placement of the antenna and its surroundings is also critical for antenna performance. Avoid placing the antenna close to conductive or RF-absorbing parts such as metal objects, ferrite sheets. These parts can absorb part of the radiated power, shift the resonant frequency of the antenna, or affect the antenna radiation pattern.

• Strict adherence to the antenna manufacturer’s guidelines describing the installation and deployment of the antenna system, including the PCB layout and matching circuitry, is strongly advised.

• In addition to the custom PCB and product restrictions, antennas may require tuning/matching to comply with the required certification schemes. Consult the antenna manufacturer for the designin guidelines and plan the validation activities on the final prototypes, like tuning/matching and performance measures (see also Table 8).

• The RF section may be affected by noise sources like hi-speed digital buses. Avoid placing the antenna close to buses such as DDR or consider taking specific countermeasures like metal shields or ferrite sheets to reduce the interference.

⚠ Take care of interaction between co-located RF systems like LTE sidebands on 2.4 GHz band.

Transmitted power may interact or disturb the performance of NINA-B4 modules.

2.3.1.3 RF transmission line design (NINA-B4x1)

RF transmission lines connecting the ANT pad with the related antenna connector or antenna, must be designed with a 50 Ω impedance characteristic.

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Figure 11 shows the design options for PCB transmission lines, where:

• Micro strip is a trace coupled to a single ground plane, separated by dielectric material.

• Coplanar micro strip is a trace coupled to ground plane and adjacent conductors, separated by

dielectric materials).

• Strip line is a trace sandwiched between two parallel ground planes, separated by dielectric materials).

Figure 6: Transmission line trace design

Observe the following comments to design a proper 50 Ω transmission line:

• The designer shall provide enough clearance from adjacent traces and ground in the same layer.

The trace-to-ground clearance should be at least twice as wide as the trace width. The transmission line should be ‘guarded’ with ground planes on each side.

• The characteristic impedance can be calculated as a first iteration by using tools provided by the layout software. It is advisable to ask the PCB manufacturer for the final values that are usually calculated during the PCB production process using dedicated software and the available stackups. To measure the real impedance of the traces, it might also be possible to request that an impedance coupon be attached to the side of the panel.

• Despite the high losses anticipated at high frequencies, an FR-4 dielectric material can be considered in the RF designs, providing that:

o RF trace lengths are minimized to reduce dielectric losses. o If traces longer than a few centimeters are needed, coaxial connectors and cables are used to

reduce the anticipated losses.

o To ensure good impedance control during the PCB manufacturing process, the PCB stack-ups

allow for wide 50 Ω traces of at least 200 µm.

o FR-4 material exhibits poor thickness stability with less control of impedance over the trace

length. Contact the PCB manufacturer for specific tolerance of controlled impedance traces.

• The width and spacing of the transmission lines to GND must be uniform and routed as smoothly as possible. Route RF lines in arcs or at 45° angles.

• Add GND stitching vias around transmission lines.

• Include sufficient vias to ensure that a low-impedance connection is made between the main

ground layer and the adjacent metal layer on the PCB stack-up.

• To avoid crosstalk between RF traces and high-impedance or analog signals, route RF transmission lines far away from noise sources (like switching supplies and digital lines) and sensitive circuits.

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• Avoid stubs on the transmission lines; impedance matching components on the transmission line should be placed with the connected pad over the trace.

• Avoid unnecessary component on RF traces.

2.3.2 NINA-B4x6 design-in

NINA-B4x6 modules include an internal PCB trace antenna that is integrated on the module PCB using antenna technology from Proant AB. The RF signal is completely internal and not connected to any module pin.

NINA-B4x6 modules cannot be mounted inside a metal enclosure. Metal casings or plastics that include metal flakes should not be used. Metallic-based paints and lacquers should also be avoided.

The pre-certification of NINA-B4 modules minimizes the effort of certification testing in the test lab.

2.3.2.1 NINA-B4x6 antenna layout considerations

For optimal operating performance, observe the following layout considerations when developing the antenna layout:

• NINA-B4x6. To enable good antenna radiation performance, it is important to place the module on the edge of the main PCB with the antenna facing outwards.

• A ground plane extending at least 10 mm on both sides of the module is recommended, as shown in Figure 6.

• Include a non-disruptive GND plane underneath the module with a cut out underneath the antenna, as shown in Figure 7.

• Observe the antenna “keep-out” area on all layers, as shown in figures Figure 6 and Figure 7.

• NINA-B4x6 has four GND pads located close to the antenna, as shown in Figure 4. Connect these

pads to GND. Detailed dimensions of the footprint, including those related to these GND pads, can be found in the NINA-B4 series data sheet [2].

• To avoid degradation of the antenna characteristics, do not place physically tall or large components closer than 10 mm to the module antenna.

• To avoid any adverse impact on antenna performance, include a 10 mm clearance between the antenna and the casing. Polycarbonate (PC) and Acrylonitrile butadiene styrene (ABS) materials have less impact on antenna performance than other types of thermoplastic.

• Include plenty of stitching vias from the module ground pads to the GND plane layer. Ensure that the impedance between the module pads and ground reference is minimal.

• Connect all ground pads to the ground plane.

• Consider the end products use case and assembly to make sure that the antenna is not

obstructed by any external item.

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Figure 7: Extended host ground plane outside NINA-B4x6

Figure 8: NINA-B4x6 keep out area

2.4 NFC interface

⚠ As the pins for the NFC interface in NINA-B40 series modules can be used as normal GPIOs, it is

important that all NFC pins are correctly configured in the software. Connecting an NFC antenna to pins that are configured for GPIO can damage the module. In NINA-B41 series modules, NFC pins are always set to "NFC mode".

The NFC antenna coil must be connected differentially between the NFC1 and NFC2 pins of the device.

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Two external capacitors should be used to tune the resonance of the antenna circuit to 13.56 MHz.

The required tuning capacitor value is given by the below equations: an antenna inductance of L

ant

= 2 μH will give tuning capacitors in the range of 130 pF on each pin. For good performance, match the total capacitance on NFC1 and NFC2.

The NINA-B4 modules have been tested with a 3x3 cm PCB trace antenna, so it is recommended to keep an antenna design close to these measurements. You can still use a smaller or larger antenna as long as it is tuned to resonate at 13.56 MHz. To comply with European regulatory demands, the NFC antenna must be placed in such a way that the space between the NINA-B4 module and the remote NFC transmitter is always within 3 meters during transmission.

Figure 9: NFC antenna design



󰆒



(

2 × 13.56 

 



)





󰆒



× + 



+ 









(

2 × 13.56 

)





  





2.4.1 Battery protection

If the antenna is exposed to a strong NFC field, parasitic diodes and unintended ESD structures can cause the current to flow in the opposite direction of the supply.

If the battery used does not tolerate a return current, protect the battery with a series diode placed between the battery and the device.

2.5 Debug interface

NINA-B40x modules support Serial Wire debug (SWD) and Serial Wire Viewer, but not JTAG debug.

When designing your application with the NINA-B40x, the SWD interface (pins SWDCLK and SWDIO) to the module should ideally be made available in the application design.

To allow the module to be flashed using the UART or the SWD interface, the module is preloaded with boot loader software that is without security. A debug connector to the module is also useful during the software development.

For security reasons, the debug interface should also be disabled to prevent the upload or download insecure software – or software that has not been validated.

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Figure 9 shows the pinout of the 10-pin, 50 mil pitch connector used on the EVK-NINA-B40x. This compact debug header can also be used on a host board design. Other solutions, such as test points or spring-loaded connectors (Tag-Connect-pads [19]), can be used as well. Keep in mind that the GND and VDD_IO references are needed for the SWD interface to work.

Figure 10: Cortex debug connector pin out for SWD

2.6 General layout guidelines

The best practices described in sections 2.6.1 to 2.6.4 are valid for any bus in NINA-B4 series modules.

2.6.1 General considerations for schematic design and PCB floor-planning

• Low frequency signals are generally not critical to the layout and designers should focus on the

higher speed buses. One exception to this general rule is when high impedance traces (such as signals driven by weak pull resistors) might be affected by crosstalk. For these and similar traces, a supplementary isolation of 4w (four times the line width) from other buses is recommended.

• Verify which interface bus requires termination and add series resistor terminations to these

buses.

• Carefully consider the placement of the module with respect to antenna position and host

processor.

• Verify the controlled impedance dimensions of the selected PCB stack-up. The PCB manufacturer

might be able to provide test coupons.

• Verify that the power supply design and power sequence are compliant with NINA-B4 series

module specifications, as described in the respective NINA-B4 data sheet [2][3].

⚠ Take particular care not to place components close to the antenna area. Follow the

recommendations from the antenna manufacturer to determine the safe distance between the antenna and any other part of the system. Designers should also maximize the distance between the antenna and high-frequency buses, like DDRs and related components, or consider the use of an optional metal shield to reduce potential interference picked up by the module antenna.

2.6.2 Layout and manufacturing

• An optimized module placement provides for better RF performance. See also section 2.3.2.

• Bypass capacitors should be placed as close as possible to the module. Prioritize the placement of

capacitors with the least capacitance so that these are closest to module pads. The supply rails must be routed through the capacitors from the power supply to the supply pad on the module.

• Avoid stubs and through-hole vias on high-speed signals which might adversely affect signal

quality.

• Verify the recommended maximum signal skew for differential pairs and length matching of

buses.

• Minimize the routing length. Ensure that the maximum allowable length for high-speed buses is

not exceeded. Longer traces generally degrade signal performance.

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• Track impedance matched traces. Consult with your PCB manufacturer early in the project for

proper stack-up definition.

• Separate the RF and digital sections of the board.

• Ground splitting is not allowed under the module.

• Minimize the bus length to reduce potential EMI issues from digital buses.

• All traces (including low speed or DC traces) must couple with a reference plane (GND or power);

Hi-speed buses should be referenced against the ground plane. If any ground reference needs to be changed, an adequate number of GND vias must be added in the area that the layer is switched. This is necessary to provide a low impedance path between the two GND layers for the return current.

• Hi-Speed buses are not allowed to change reference plane. If changes in the reference plane are

unavoidable, capacitors must be added in the transition area of the reference planes. This is necessary to ensure that a low impedance return path exists through the different reference planes.

• Following the “3w rule”, keep traces at a distance of no less than three times that of its own width

from the routing edge of the ground plane.

• For EMC purposes and the need to shield against any potential radiation, it is advisable to add

GND stitching vias around the edge of the PCB. Traces on the PCB peripheral are not recommended.

2.6.3 Thermal guidelines

NINA-B4 series modules have been successfully tested from –40 °C to +105 °C. NINA-B4 modules are low-power devices that generate only a small amount of heat during operation. A good grounding should still be observed for temperature relief during high ambient temperatures.

2.6.4 ESD guidelines

Device immunity against Electrostatic Discharge (ESD) is a requirement for Electromagnetic Compatibility (EMC) conformance and use of the CE marking for products intended for sale in Europe. For any product that integrates u-blox modules to bear the CE mark it must be conformance tested in accordance with the R&TTE Directive (99/5/EC), EMC Directive (89/336/EEC), and Low Voltage Directive (73/23/EEC) issued by the Commission of the European Community.

Compliance with the above directives also implies conformity to the following European norms for device ESD immunity: ESD testing standard CENELEC EN 61000-4-2 [9] and radio equipment standards ETSI EN 301 489-1 [10], ETSI EN 301 489-7, ETSI EN 301 489-24. The ESD immunity requirements for each of these standards are summarized in Table 12.

The ESD immunity test is performed at the enclosure port, which is defined by ETSI EN 301 489-1 as the physical boundary through which the electromagnetic field radiates. If the device implements an integral antenna, the enclosure port is seen as all insulating and conductive surfaces housing the device. If the device implements a removable antenna, the antenna port can be separated from the enclosure port. The antenna port includes the antenna element and its interconnecting cable surfaces.

The applicability of ESD immunity test to the whole device depends on the device classification as defined by ETSI EN 301 489-1. Applicability of the ESD immunity test to the related device ports or the related interconnecting cables to auxiliary equipment depends on device accessible interfaces and manufacturer requirements, as defined by ETSI EN 301 489-1.

Contact discharges are performed at conductive surfaces, while air discharges are performed at insulating surfaces. Indirect contact discharges are performed on the measurement setup horizontal and vertical coupling planes as defined in CENELEC EN 61000-4-2.

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☞ For the definition of integral antenna, removable antenna, antenna port, and the device

classification, refer to the ETSI EN 301 489-1. For the contact and air discharges definitions, refer to CENELEC EN 61000 4-2.

Application Category Immunity level

All exposed surfaces of the radio equipment and ancillary equipment in a representative configuration

Table 12: Electromagnetic Compatibility ESD immunity requirements as defined by CENELEC EN 61000-4-2, ETSI EN 301 489-1, ETSI EN 301 489-7, ETSI EN 301 489-24

Indirect Contact Discharge ±8 kV

NINA-B4 is manufactured with consideration to specific standards that minimize the occurrence of ESD events; the highly automated process complies with IEC61340-5-1 (STM5.2-1999 Class M1 devices) standard [11], and designers should subsequently implement proper measures to protect any pin that might be exposed to the end user from ESD events.

Compliance with the standard protection level specified in EN61000-4-2 is achieved by including ESD protection close to any areas accessible by the end user.

2.7 Product testing

2.7.1 u-blox in-series production tests

With strong focus on the development of high-quality products, u-blox products are produced and fully tested automatically in the production line. Stringent quality control processes are observed during production, and all modules are tested using automatic test equipment (ATE).

For the purpose of quality control and future product improvement, all test and measurement data is archived in a production database, where the results from any defective test unit is thoroughly analyzed. A detailed test report for each module can be generated from the production data.

The following tests are performed during production:

• Digital self-test (software download, MAC address programming)

• Measurement of voltages and currents

• Functional tests

• Digital I/O tests

• Measurement of RF characteristics in all supported bands (such as receiver RSSI calibration,

frequency tuning of the reference clock, calibration of transmitter power levels, and so on.

Figure 10 shows the typical automatic test equipment (ATE) used in a production line.

Figure 11: Automatic test equipment for module testing

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2.7.2 OEM manufacturer production test

As production testing is already performed by u-blox, OEM manufacturers do not need to take any further RF performance measurements or repeat any test of the software or interfaces during production.

Consequently, OEMs are encouraged to focus testing of end-product applications towards:

• Verification of the module assembly; check that:

o Soldering and handling processes have not damaged the module components o All module pins are soldered on the device board o There are no short circuits between pins

• Verification of the component assembly on the device; check that:

o Communication with host controller can be established o The interfaces between the module and device are working o Overall RF performance test of the device including the antenna

Dedicated tests can be implemented to check the device. For example, the current consumption of module when set in a specified state can detect a short circuit if compared with a “Golden Device” result.

The standard operational module firmware and test software on the host can be used to perform functional tests (tests that that check the interfaces and communication with the host controller) and perform basic RF performance tests.

2.7.2.1 “Go/No go” tests for integrated devices

Go/No Go testing is used to test overall function of the device. In a good test setup, each component and soldering joint is related to a basic functional test. If the test is successful, the assembly is considered as functionally correct.

A “Go/No go” test compares the signal quality of the antenna under test with that of a “golden device” in common location and known signal quality. Go/no go tests are normally performed after connection with the external device has been established.

Go/no go tests are suitable for checking communication with the host controller and power supply. The tests also verify that the components are well-soldered.

A simple go/no go test would typically scan and check the signal for a known Bluetooth low energy device.

☞ Although a Bluetooth scan and subsequent comparative signal test approach is appropriate for

“go/no go” evaluation, this type of testing does not measure RF performance.

A basic RF functional test of the device that includes checking the antenna can be performed with standard Bluetooth low energy devices configured as remote stations. To obtain stable test results and prevent possible interference from other radio devices, the device containing the NINA-B4 series module and antenna should be arranged in a fixed position inside an RF shield box.

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3 Open CPU software

NINA-B40 series modules are used in an open CPU configuration allows customer applications to be developed in a Nordic SDK environment in the NINA-B4 module.

3.1 Nordic SDK

The Nordic nRF SDK includes a broad selection of drivers and libraries that provide a rich development environment for a broad range of devices and applications. The SDK is delivered in zip container file for easy installation.

The SDK comes with support for the SEGGER Embedded Studio, Keil microcontroller development kit, IAR embedded workbench IDE, as well as a GCC compiler that supports many platforms and languages.

3.1.1 Getting started with the Nordic SDK

When working with the Nordic SDK on the NINA-B4 series module, follow the steps below to get started with the Nordic Semiconductor toolchain and examples:

1. Download and install the nRF Connect that includes an embedded Programmer app for

programming over SWD.

2. Download and install the latest SEGGER embedded studio.

3. Download and extract the latest nRF5-SDK.

☞ When installing the SDK, be sure not to include any space characters in the file path. Keep the

folder structure intact. The examples in the SDK use relative folder references.

4. Read SDK release notes and check the nRF5 SDK documentation available from the Nordic

Semiconductor Infocenter [15].

3.1.1.1 Nordic tools

For further information and links to all Nordic tools, as well as the supported compilers, see

Nordic software and tools.

3.1.1.2 Support – Nordic development forum

For support on questions related to the development of software using the Nordic SDK, check out the Nordic DevZone forum.

3.1.1.3 Create a custom board support file for Nordic SDK

The predefined hardware boards included in the Nordic SDK are for Nordic development boards only. To add support for a custom board, create a support file with the name custom_board.h and save this to one of the folders:

•

<SDK folder>/components/boards to be valid for all examples, or

•

<SDK folder>/examples/<project>/pca10100/<softdevice>/config (valid for this project only).

☞ The above-mentioned directories are according to the Nordic nRF5 SDK version 16.0.0.

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An example of what a custom board support file could look like for the EVK-NINA-B4 can be found in the u-blox short range GitHub repository [20].

The custom board can then be selected by adding a define of the symbol

You can add the

BOARD_CUSTOM define statement in SEGGER Embedded Studio by following the

BOARD_CUSTOM to your build.

instructions below:

1. Right-click the Project I n “Project Explorer”.

2. Select Options…

Figure 12: Screenshot with steps to modify the Define statement in SEGGER Embedded Studio

3. Select the Common configuration.

4. Select the Code / Preprocessor.

5. Select the Preprocessor Definitions.

Figure 13: Screenshot with steps to modify the Define statement in SEGGER Embedded Studio

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6. Modify the “BOARD_” definition to define the BOARD_CUSTOM.

Figure 14: Screenshot with steps to modify the Define statement in SEGGER Embedded Studio

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3.1.2 Bluetooth device (MAC) address and other production data

The open CPU (B40x) variants of the NINA-B4 modules are provided with a unique, public Bluetooth device (MAC) address programmed. If required, this address can be used by the customer application.

The MAC address is programmed in the nRF52833 chip. The address can be read and written for example, using Segger J-Link utilities or the

nrfjprog utility from Nordic.

$ nrfjprog.exe --memrd 0x10001080 --n 8

The memory area can be saved and, if the flash is erased, written back later using the savebin and

loadbin utilities in the Segger J-link tool suite.

The UICR memory area also holds serial number and other information that can be valuable to save. If you want to save the whole memory area you can use

$ nrfjprog.exe --readuicr uicr.hex ... $ nrfjprog.exe --program uicr.hex

CUSTOMER[0] and CUSTOMER[1]registers in the UICR of the

☞ If the boot loader supplied by u-blox is not used for the open CPU development the UICR register

cannot be saved way that is described here. This is because the UICR registers that hold the boot loader start address confuse the boot process. In these instances, the MAC address has to be written separately.

For additional information and instructions on saving and using the public Bluetooth device address, see reference [18].

3.1.3 Definition of Low Frequency clock source

NINA-B4x modules are delivered without an external low frequency crystal oscillator (LFXO). To configure the software correctly for your configuration, follow the steps in the RC oscillator configuration application note [21].

EVK NINA-B40x is delivered with an external low frequency crystal oscillator mounted.

3.2 Flashing open CPU software

Modules with open CPU configuration can be flashed using various utility programs over the SWD or UART interface.

3.2.1 Flashing over the SWD interface

To flash NINA-B4 modules over the Serial Wire Debug (SWD) interface an external debugger must be connected to the SWD interface of the module. Third-party tools like J-Link Commander, J-Flash, nRF Command Line Utilities or nRF Connect Programmer, are used to flash the module.

☞ SEGGER J-Link BASE external debugger works with NINA-B40 modules.

☞ EVK-NINA-B40 incorporates an onboard debugger, which means that it can be flashed without an

external debugger.

⚠ Always make a note of your Bluetooth device address before starting the flashing procedure.

As flashing the software can erase the original u-blox Bluetooth device address, this address might need to be reinstated. The Bluetooth device address can be re-written manually or with the use of a script. See section 3.1.2 for more information.

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In the nRF Connect Programmer, drag and drop the hex files you want to program into the GUI, as shown in Figure 14, and then write them to the module using the GUI.

Figure 15 Selecting hex files in nRF Connect Programmer

3.2.2 Flashing over the UART interface

To flash NINA-B40 modules over the UART interface, the module must be pre-loaded with a boot loader based on DFU boot loader examples included in the Nordic Semiconductor nRF5 SDK. The boot loader is accessed using Nordic Semiconductor flash tools like nRF util.

The memory layout of the module as delivered from factory is described in Table 13. The shaded parts settings are flashed in the factory.

Usage S140 SoftDevice version 7.0.x

Boot loader settings 0x0007F000 -0x80000 MBR parameter storage 0x7E000-0x7F000

Boot loader 0x72000-0x7E000 Application 0x27000 – 0x72000

Softdevice 0x1000 – 0x27000 MBR 0x0 – 0x1000

Table 13 NINA-B40x flash layout that includes S140 SoftDevice

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☞ Note that memory sizes can vary dependent on the SoftDevice radio stack software running on

the module.

3.2.2.1 Building applications to be flashed using the boot loader

To flash an application to the module without destroying the master boot record (MBR) that is preflashed in the factory, the start address in flash must be changed to S140 SoftDevice) or SDK by changing the macro

0x1000 (applications without SoftDevice). This change can be done in the nRF5

FLASH_START – in a similar way to how the BOARD_CUSTOM flag was set in

section 3.1.1.3. The flag is set in the Section Linker->Section placement macros, as shown in Figure 15.

0x27000 (for applications with

Figure 16 Setting the FLASH_START macro

3.2.2.2 Preparing the Device Firmware Update (DFU) package

The package to be flashed is in a special DFU package format. The package is generated in the following way:

An application that does not use a SoftDevice:

nrfutil pkg generate --hw-version 52 --sd-req 0x00 --application-version 0 --application app.hex app.zip

An application with SoftDevice:

nrfutil pkg generate --hw-version 52 --sd-req 0xCA --sd-id 0xCA --softdevice s140_nrf52_7.0.1_softdevice.hex --application-version 0 --application app.hex sd_app.zip

3.2.2.3 Flashing the DFU package

The generated DFU package can be flashed on the module using the following nrfutil command:

nrfutil dfu serial -pkg app.zip -p COM95 -b 115200 -fc 1

☞ As there is no application to boot, the loader automatically stops in DFU mode when flashing is

done for the first time. On subsequent reboots, you need to stop the boot loader in DFU mode by driving SWITCH_2 low during startup.

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4 u-connectXpress software

NINA-B41 modules come preflashed with the u-connectXpress software and a boot loader.

To ensure that the module only boots with the original u-blox software, the secure boot loader initiates a signature verification on the flashed software binary before it is booted.

NINA-B41 u-connectXpress software can be reflashed over the UART interface using AT commands or the s-center client software available from the u-blox website.

4.1 Flashing NINA-B41 u-connectXpress software

NINA-B41 modules can be reflashed with AT commands over the UART interface whenever a new version of the u-connectXpress software is available.

NINA-B41 u-connectXpress software is distributed in a.zip container that contains two compressed binary files:

• Application software

• SoftDevice radio stack software

A signature file for each of the above-mentioned files is also included, as well as a .json header file.

NINA-B41X-SW-x.y.z-<build>.bin (Example: NINA-B41X-SW-1.0.0-001.bin)

NINA-S140-SD-a.b.c.bin (Example: NINA-S140-SD-7.2.0.bin)

☞ More information about the features, capabilities and use of connectXpress, see the

u-connectXpress user guide [17] and u-connect AT commands manual [6].

4.1.1 Software flashing using s-center

The s-center client is distributed as an executable file that can be downloaded from the u-blox website. Having installed the software on your workstation, follow the procedure below to flash NINA-B41 with s-center.

☞ Flashing of u-blox software requires s-center software version 5.2 or later. For more information

about using s-center, see the s-center user guide [22].

1. Select Tools > Software Update

as shown in the following screenshot:

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2. Select the .json file.

3. Secure Boot Mode is set automatically. Ensure that the correct COM port is selected and select

the Update button to start the process. The module then reboots into the boot loader and the flashing of the SoftDevice and application starts.

4.1.2 Software flashing using AT command

The flashing functionality in the NINA-B41x module can manage two signed binary images that contain the application (image 0) and SoftDevice radio software (image 1).

The SoftDevice is updated using dual-banked approach, which invalidates the application currently flashed in the module. Consequently, the application must be flashed after updating the SoftDevice.

Use AT command

AT+UFWUPD=<mode>,<baud_rate>[,<id>,<size>,<signature>,<name>,<flags>]

AT+UFWUPD to update the software:

The file download uses an XMODEM protocol. The UART hardware flow is not used during the software update. For information about the firmware update command, see the u-connect AT commands manual [6].

☞ XMODEM uses standard XMODEM-CRC16 protocol and 128 bytes packets.

4.1.2.1 Example commands executed while flashing the application only

In this section we describe a flashing scenario where just the application file is updated, and the SoftDevice is unchanged.

1. Run the

bin file for download. The application size can be found in the should be entered in decimal notation. The signature for the application is available in the

NINA-B41X-SI-x.x.x-xxx.txt file:

AT+UFWUPD command to trigger the u-connectXpress software to accept an application

NINA-B41X-CF-x.x.json file; the size

{ "Label": "ConnectivitySoftware", "Description": "NINA-B41X u-blox connectivity software", "File": "NINA-B41X-SW-1.0.0-001.bin", "Version": "NINA-B41X-SW-1.0.0-001", "Address": "0x27000", "Size": "0x35FA4", "Id": "0x0", "Permissions": "rwx", "SignatureFile": "NINA-B41X-SI-1.0.0-001.txt" },

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To set the module in FW download mode use the AT+UFWUPD AT command as shown below:

AT+UFWUPD=0,115200,0,221092, aCSLNDWWNHVb1hkJGvg+ZNd585WVKM+FaHaocxs2cOeDH4fjfiMrH51mearz3M8lvkx6A0VUv7rxgcOEdQ3qprWkaZ UBvmO5yM8HbUStaZ8QBT/KbkuJSzfT3AQgN7q/HwhZA5haVH4GufkACisGzoTHKhpkzNSR1O8ezf0dltuNeIC4Q/MR GQcAuEHSHpj+qNHxoV/o3YcTMC1EbcO3G/OzGr0eiC3txAtFIjfwjpWqr1Fq+vnWTHVMYYAqj6WqosPO5G3g9XYFl5 RWjSgxjV7noaMmt8qtb8wBlphBv/D5zk5EzqRigzDy02KY9bs5whSP+Es6Crk6/Hnq1xA3dQ==,NINA-B4APPLICATION,rwx

2. When a ‘C’ character is received from the module, XMODEM download is ready to begin from the

host.

CCCCC

3. Send the application bin file using XMODEM protocol.

4. After a successful file transfer, the module will automatically start the application.

+STARTUP

4.1.2.1.1 Example commands executed when flashing both the SoftDevice and

application

In this section we describe a flashing scenario where both the application file and the SoftDevice are updated.

1. Start the boot loader mode using either:

 The AT command -

AT+UFWUPD=1,115200

 Press the SW1 and SW2 buttons during a module reset

2. The “

s <imageid> <signature>” command stores the SoftDevice signature. The image id of the

SoftDevice is 1. The signature is available in the

> s 1 e4CHiTQB+LUzv7gYL5fDJ8H1VH7B1JWZjK2W3mMWWVYdY4W64or4+0IxKATg6LrbD1M8qQ+Io9++nTPxB++FDzI h+3hpP8GZe5h2SvE/JGLJScnu0PCygvH+5+7+qKB11Fz2kERy0Ly2A+ZCwigPfoYHjbslnfKLzvuVvwJekly/DW YQHVgEHmTRczvyc5psK73wHpUPKo+UPYKKSgTM87ZFWIBHFa4vQMlWsMl75Uq4nH3T7J+mgpaKGtCCbQy6LsAtQ oXENTda7efD3Irs2pb69mg9M+0pWEq48Tjaym1HiAgUoGc7AnuMPl78qRUGLA6Z/m2f7En0B9ldC67VZw==

NINA-S140-SI-x.x.x.txt file.

3. The “x <imageaddress> <imagesize> <imagename> <permissions> <imageid>” command triggers

the boot loader to accept a file transfer using XMODEM protocol. The image address and image size can be found in the NINA-B41X-CF-X.Y.json file. Set permission to read/write, rw.

{ "Label": "SoftDevice", "Description": "S140 softdevice from Nordic for NINA-NRF", "File": "NINA-S140-SD-7.2.0.bin", "Version": "NINA-S140-SD-7.2.0", "Address": "0x0", "Size": "0x26634", "Id": "0x1", "Permissions": "rw", "SignatureFile": "NINA-S140-SI-7.2.0.txt" }

Use the ‘x’ boot loader command to download the SoftDevice file:

> x 0 0x26634 NINA-B4-SOFTDEVICE rw 1

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4. When a “

C” character is received from the module, the XMODEM download is ready to begin from

the host.

CCCCC

5. After a successful download of the SoftDevice image, the application image must be flashed.

> x 0 0x26634 NINA-B4-SOFTDEVICE rw 1 CCCCCCCCC OK >

6. The application is flashed like the SoftDevice. Use image address and image size for the

application image, which can be found in the

NINA-B41X-CF-x.x.json under the label – u-connect.

The image id of the application is 0. The application’s signature is available in the NINA-B41X-SIx.x.x-xxx.txt file. Set permission to read/write/execute, rwx.

> s 0 aCSLNDWWNHVb1hkJGvg+ZNd585WVKM+FaHaocxs2cOeDH4fjfiMrH51mearz3M8lvkx6A0VUv7rxgcOEdQ3qprW kaZUBvmO5yM8HbUStaZ8QBT/KbkuJSzfT3AQgN7q/HwhZA5haVH4GufkACisGzoTHKhpkzNSR1O8ezf0dltuNeI C4Q/MRGQcAuEHSHpj+qNHxoV/o3YcTMC1EbcO3G/OzGr0eiC3txAtFIjfwjpWqr1Fq+vnWTHVMYYAqj6WqosPO5

G3g9XYFl5RWjSgxjV7noaMmt8qtb8wBlphBv/D5zk5EzqRigzDy02KY9bs5whSP+Es6Crk6/Hnq1xA3dQ== OK > x 0x27000 0x35FA4 NINA-B4-APPLICATION rwx 0

7. Store the application image (image id 0) as the startup image with the “

> f 0 OK > x 0x27000 0x35FA4 NINA-B4-APPLICATION rwx 0

f <imageid>” command.

8. Reset the module to start up the module with the newly flashed software.

> q +STARTUP

4.2 Low frequency clock source

NINA-B4x modules are delivered without an external low frequency crystal oscillator (LFXO). The low frequency oscillator is used for power save and by the radio block. The u-connectXpress software has an auto sense functionality to detect whether a low frequency crystal oscillator is mounted on the board. For further information see the respective datasheet [2][3].

The EVK NINA-B41x is delivered with an external low frequency crystal oscillator mounted.

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•

the local GND (workbench ground for

Before mounting an antenna patch,

•

the RF input, do not touch any exposed

an exposed antenna area is touched in a

ESD protected work area, implement

protection measures in the

•

antennas to the receiver’s RF pin, make

5 Handling and soldering

☞ No natural rubbers, hygroscopic materials or materials containing asbestos are employed.

5.1 Packaging, shipping, storage, and moisture preconditioning

For information pertaining to reels, tapes or trays, moisture sensitivity levels (MSL), shipment and storage, as well as drying for preconditioning, refer to the respective NINA-B4 series data sheet [2] [3] and u-blox package information guide [1].

5.2 Handling

NINA-B4 series modules are Electrostatic Discharge (ESD) sensitive devices and require special precautions during handling. Care must be exercised when handling patch antennas, due to the risk of electrostatic charges. In addition to standard ESD safety practices, the following measures should be considered whenever handling the receiver:

Unless there is a galvanic coupling between

example) and the PCB GND, the first point of contact when handling the PCB must be between the local GND and PCB GND.

•

connect the ground of the device When handling the RF pin, do not come into contact with any charged capacitors and be careful when contacting materials that can develop charges, for example, the patch antenna (~10 pF), coaxial cable (~50-80 pF/m), soldering iron, and so on. To prevent electrostatic discharge through

antenna area. If there is any risk that such

nonproper ESD design. When soldering RF connectors and patch

sure to use an ESD safe soldering iron (tip).

5.3 Soldering

5.3.1 Reflow soldering process

NINA-B4 series modules are surface mounted and supplied on a FR4-type PCB with gold-plated connection pads. The modules are manufactured in a lead-free process with lead-free soldering paste. The bow and twist of the PCB is maximum 0.75% according to IPC-A-610E. The thickness of solder resist between the host PCB top side and the bottom side of the NINA-B4 series module must be considered for the soldering process.

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The module is compatible with the industrial reflow profile for RoHS solders. Use of "No Clean" soldering paste is strongly recommended.

The reflow profile is dependent on the thermal mass of the entire populated PCB, heat transfer efficiency of the oven, and the particular type of solder paste that is used. The optimal soldering profile that is used must be trimmed for each case depending on the specific process and PCB layout.

Process parameter Unit Target

Pre-heat Ramp up rate to T

tS (from +25 °C) s 150

tS (Pre-heat) s 60 to 120

Peak TL °C 217

tL (time above TL) s 40 to 60

TP (absolute max) °C 245

Cooling Ramp-down from TL K/s 4

Allowed soldering cycles - 1

°C 150

SMIN

°C 200

SMAX

K/s 3

SMIN

Table 14: Recommended reflow profile

Figure 17: Reflow profile

☞ Lower value of T

and slower ramp down rate (2 – 3 °C/sec) is preferred.

☞ After reflow soldering, optical inspection of the modules is recommended to verify proper

alignment.

⚠ Target values in Table 11 should be taken as general guidelines for a Pb-free process. Refer to the

JEDEC J-STD-020C [9]standard for further information.

5.3.2 Cleaning

Cleaning the modules is not recommended. Residues underneath the modules cannot be easily removed with a washing process.

• Cleaning with water will lead to capillary effects where water is absorbed in the gap between the

baseboard and the module. The combination of residues of soldering flux and encapsulated water leads to short circuits or resistor-like interconnections between neighboring pads. Water will also damage the sticker and the ink-jet printed text.

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• Cleaning with alcohol or other organic solvents can result in soldering flux residues flooding into

the housings that are not accessible for post-wash inspections. The solvent will also damage the sticker and the ink-jet printed text.

• Ultrasonic cleaning will permanently damage the module, in particular the crystal oscillators. For

best results, use a "no clean" soldering paste and eliminate the cleaning step after the soldering process.

5.3.3 Other remarks

• Only a single reflow soldering process is allowed for boards with a module populated on them.

• Boards with combined through-hole technology (THT) components and surface-mount

technology (SMT) devices may require wave soldering to solder the THT components. Only a single wave soldering process is allowed for boards populated with the modules. The Miniature Wave Selective Solder process is preferred over the traditional wave soldering process.

• Hand soldering is not recommended.

• Rework is not recommended.

• Conformal coating may affect the performance of the module, so it is important to prevent the

liquid from flowing into the module. The RF shields do not provide protection for the module from coating liquids with low viscosity, and so care is required in applying the coating. Conformal coating of the module will void the warranty.

• Grounding metal covers: attempts to improve grounding by soldering ground cables, wick or other

forms of metal strips directly onto the EMI covers is made at the customer's own risk and will void the module’s warranty. The numerous ground pins are adequate to provide optimal immunity to interferences.

• The module contains components that are sensitive to ultrasonic waves. Use of any ultrasonic

processes, such as cleaning, welding, and so on, may damage the module. Use of ultrasonic processes on an end product integrating this module will void the warranty.

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Appendix

A Glossary

Abbreviation Definition

ABS Acrylonitrile butadiene styrene

ADC Analog to Digital Converter

ATE Automatic Test Equipment

LE Bluetooth Low Energy

CTS Clear To Send

DCX Data/Command Signal

DFU Device Firmware Update

DDR Dual-Data Rate

EMC Electro Magnetic Compatibility

EMI Electro Magnetic Interference

ESD Electro Static Discharge

FCC Federal Communications Commission

GATT Generic ATTribute profile

GND Ground

GPIO General Purpose Input/Output

I2C Inter-Integrated Circuit

IDE Integrated Development Environment

IEEE Institute of Electrical and Electronics Engineers

LDO Low Drop Out

LED Light-Emitting Diode

MAC Media Access Control

MISO Master Input, Slave Output

MOSI Master Output, Slave Input

MSL Moisture Sensitivity Level

NFC Near Field Communication

NSMD Non Solder Mask Defined

PCB Printed Circuit Board

PIFA Planar Inverted-F Antenna

PC Polycarbonate

QDEC Quadrature DECoder

QSPI Quad Serial Peripheral Interface

RF Radio Frequency

RoHS Restriction of Hazardous Substances

RSSI Received Signal Strength Indicator

RTS Request to Send

RXD Receive Data

SCL Signal Clock

SDL Specification and Description Language

SMA SubMiniature version A

SMD Solder Mask Defined

SMPS Switching Mode Power Supply

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SMT Surface-Mount Technology

SPI Serial Peripheral Interface

SWD Serial Wire Debug

Thread Networking protocol for Internet of Things (IoT) "smart" home automation devices to communicate on a

local wireless mesh network

THT Through-Hole Technology

TXD Transmit Data

UART Universal Asynchronous Receiver/Transmitter

UICR User Information Configuration Registers

USB Universal Serial Bus

VCC IC power-supply pin

VSWR Voltage Standing Wave Ratio

Zigbee Open standard protocol, full-stack solution for most large smart home ecosystem providers

Table 15: Explanation of the abbreviations and terms used

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Revision history

Revision Date Name Comments

R01 12-Dec-2019 fbro,mape Initial release.

R02 14-Jan-2020 mape Minor corrections.

R03 27-Mar-2020 hisa Updated NINA-B400 product status to “Prototype”. Updated front page

module images.

R04 20-Nov-2020 lber Updated the product status of NINA-B400 and NINA-B406 variants from

“Prototype” to “Engineering sample”. Revised SWD and UART flashing information in sections 2.5 and 3.2. Included editorial changes in all chapters.

R05 23-Dec-2020 mape Divided chapter 1.5 into two subchapters.

Added chapter 1.5.2. Minor corrections to 1.5.1 Added note in 3.12 about how to save MAC address when not using the u-

blox supplied boot loader. Minor corrections.

R06 22-Jan-2021 lber Added NINA-B401 and NINA-B411 product variants with subsequent

revision to the design-in and antenna descriptions in chapter 2. Added handling and soldering information, section 5.

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Contact

For complete contact information, visit us at www.u-blox.com.

u-blox Offices

North, Central and South America

u-blox America, Inc.

Phone: +1 703 483 3180 E-mail: info_us@u-blox.com

Regional Office West Coast:

Phone: +1 408 573 3640 E-mail: info_us@u-blox.com

Technical Support:

Phone: +1 703 483 3185 E-mail: support@u-blox.com

Headquarters Europe, Middle East, Africa

u-blox AG

Phone: +41 44 722 74 44 E-mail: info@u-blox.com Support: support@u-blox.com

Asia, Australia, Pacific

u-blox Singapore Pte. Ltd.

Phone: +65 6734 3811 E-mail: info_ap@u-blox.com Support: support_ap@u-blox.com

Regional Office Australia:

Phone: +61 2 8448 2016 E-mail: info_anz@u-blox.com Support: support_ap@u-blox.com

Regional Office China (Beijing):

Phone: +86 10 68 133 545 E-mail: info_cn@u-blox.com Support: support_cn@u-blox.com

Regional Office China (Chongqing):

Phone: +86 23 6815 1588 E-mail: info_cn@u-blox.com Support: support_cn@u-blox.com

Regional Office China (Shanghai):

Phone: +86 21 6090 4832 E-mail: info_cn@u-blox.com Support: support_cn@u-blox.com

Regional Office China (Shenzhen):

Phone: +86 755 8627 1083 E-mail: info_cn@u-blox.com Support: support_cn@u-blox.com

Regional Office India:

Phone: +91 80 405 092 00 E-mail: info_in@u-blox.com Support: support_in@u-blox.com

Regional Office Japan (Osaka):

Phone: +81 6 6941 3660 E-mail: info_jp@u-blox.com Support: support_jp@u-blox.com

Regional Office Japan (Tokyo):

Phone: +81 3 5775 3850 E-mail: info_jp@u-blox.com Support: support_jp@u-blox.com

Regional Office Korea:

Phone: +82 2 542 0861 E-mail: info_kr@u-blox.com Support: support_kr@u-blox.com

Regional Office Taiwan:

Phone: +886 2 2657 1090 E-mail: info_tw@u-blox.com Support: support_tw@u-blox.com

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u-blox NINA-B4 User manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Document information

Contents

1 Functional description

1.1 Overview

1.2 Applications

1.3 Block diagrams

1.3.1 NINA-B40

1.3.2 NINA-B41

1.4 Product description

1.4.1 NINA-B40 series

1.4.2 NINA-B41 series

1.5 Hardware options

1.6 Software options

1.6.1 Open CPU

1.6.2 u-connectXpress software

1.7 Bluetooth device address

1.8 Pin configurations and functions

1.8.1 NINA-B40 pins

1.8.2 NINA-B41 pins

1.9 Low power clock

1.9.1 External crystal

1.9.2 Internal oscillator

1.9.3 External clock source

2 Design-in

2.1 NINA family migration design

2.2 Supply interfaces

2.2.1 Main supply input

2.2.2 Digital I/O interfaces reference voltage (VCC_IO)

2.2.3 VCC application circuits

2.2.3.1 Battery

2.2.3.2 Switched Mode Power Supply

2.2.3.3 Low Drop Out (LDO) regulator

2.3 Antenna interface

2.3.1 External antenna selection

2.3.1.1 External RF Connector Design-in (NINA-B4x1)

2.3.1.2 External antenna design-in (NINA-B4x1)

2.3.1.3 RF transmission line design (NINA-B4x1)

2.3.2 NINA-B4x6 design-in

2.3.2.1 NINA-B4x6 antenna layout considerations

2.4 NFC interface

2.4.1 Battery protection

2.5 Debug interface

2.6 General layout guidelines

2.6.1 General considerations for schematic design and PCB floor-planning

2.6.2 Layout and manufacturing

2.6.3 Thermal guidelines

2.6.4 ESD guidelines

2.7 Product testing

2.7.1 u-blox in-series production tests

2.7.2 OEM manufacturer production test

2.7.2.1 “Go/No go” tests for integrated devices

3 Open CPU software

3.1 Nordic SDK

3.1.1 Getting started with the Nordic SDK

3.1.1.1 Nordic tools

3.1.1.2 Support – Nordic development forum

3.1.1.3 Create a custom board support file for Nordic SDK

3.1.2 Bluetooth device (MAC) address and other production data

3.1.3 Definition of Low Frequency clock source

3.2 Flashing open CPU software

3.2.1 Flashing over the SWD interface

3.2.2 Flashing over the UART interface

3.2.2.1 Building applications to be flashed using the boot loader

3.2.2.2 Preparing the Device Firmware Update (DFU) package

3.2.2.3 Flashing the DFU package

4 u-connectXpress software

4.1 Flashing NINA-B41 u-connectXpress software

4.1.1 Software flashing using s-center

4.1.2 Software flashing using AT command

4.1.2.1 Example commands executed while flashing the application only

4.2 Low frequency clock source

5 Handling and soldering

5.1 Packaging, shipping, storage, and moisture preconditioning

5.2 Handling

5.3 Soldering

5.3.1 Reflow soldering process