performance
concurrent
NEO-M8U
u-blox M8 untethered dead reckoning module including
3D inertial sensors
Hardware integration manual
Abstract
This document describes the features and specifications of NEO-M8U, a highuntethered dead reckoning module with 3D sensors. The module includes the u-blox M8
GNSS engine with reception of GPS, GLONASS, BeiDou, Galileo and QZSS signals.
www.u-blox.com
UBX-15016700 - R11
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NEO-M8U - Hardware integration manual
Declaration of
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document. Copying, reproduction, modification or disclosure to third parties of this document or any part thereof is only
permitted with the express written permission of u
The information conta
implied, is given, including but not limited
purpose of the
documents, visit www.u
Copyright © u
Document information
Title NEO-M8U
Subtitle u-blox M8 untethered dead reckoning module including 3D inertial sensors
Document type Hardware integration manual
Document number UBX-15016700
Revision and date R11 22-Mar-2021
Disclosure restriction C1-Public
Product status
In Development /
Prototype
Engineering Sample Advance Information Data based on early testing. Revised and supplementary data will be published later.
Initial Production Early Production Information Data from product verification. Revised and supplementary data may be published later.
Mass Production /
End of Life
Corresponding content status
Objective Specification Target values. Revised and supplementary data will be published later.
Production Information Document contains the final product specification.
European Union regulatory compliance
NEO-M8U compiles with all relevant requirements for RED 2014/53/EU. The NEO-M8U
Conformity (DoC) is available at www.u-blox.com within Support > Product resources > Conformity Declaration.
This document applies to the following products:
Product name Type number ROM/FLASH version PCN/IN reference
NEO-M8U NEO-M8U-0-10 Flash FW 3.01 UDR 1.00
NEO-M8U NEO-M8U-04B-00 FLASH FW 3.01 UDR 1.21 N/A Mass production
NEO-M8U NEO-M8U-05B-00 FLASH FW 3.01 UDR 1.31 UBX-20014805 Initial production
NEO-M8U NEO-M8U-06B-00 FLASH FW 3.01 UDR 1.50 UBX-20053641 Initial production
N/A Mass production
Product status
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-blox AG.
ined herein is provided “as is” and u-blox assumes no liability for its use. No warranty, either express or
to, with respect to the accuracy, correctness, reliability and fitness for a particular
information. This document may be revised by u-blox at any time without notice. For the most recent
-blox.com.
-blox.
NEO-M8U - Hardware integration manual
Contents
Document information ................................................................................................................................ 2
Contents .......................................................................................................................................................... 3
1 Hardware description ........................................................................................................................... 5
1.1 Overview ........................................................................................................................................................ 5
1.2 Configuration ............................................................................................................................................... 5
1.3 Connecting power ....................................................................................................................................... 5
1.3.1 VCC: Main supply voltage ................................................................................................................. 5
1.3.2 V_BCKP: Backup supply voltage ...................................................................................................... 5
1.3.3 VDD_USB: USB interface power supply ......................................................................................... 6
1.3.4 VCC_RF: Output voltage RF ............................................................................................................. 6
1.4 Interfaces ...................................................................................................................................................... 6
1.4.1 UART ..................................................................................................................................................... 6
1.4.2 USB ........................................................................................................................................................ 6
1.4.3 Display Data Channel (DDC) ............................................................................................................. 7
1.4.4 SPI .......................................................................................................................................................... 7
1.4.5 TX Ready signal ................................................................................................................................... 8
1.5 I/O pins ........................................................................................................................................................... 8
1.5.1 Electromagnetic interference on I/O lines ..................................................................................... 8
2 Design ..................................................................................................................................................... 10
2.1 Pin description ...........................................................................................................................................10
2.1.1 Pin name changes.............................................................................................................................11
2.2 Minimal design...........................................................................................................................................11
2.3 Layout: Footprint and paste mask ........................................................................................................11
2.4 Antenna .......................................................................................................................................................12
2.4.1 Antenna design with passive antenna .........................................................................................12
2.4.2 Active antenna design .....................................................................................................................13
3 Untethered dead reckoning............................................................................................................. 15
3.1 Implementation .........................................................................................................................................15
3.2 Installation ..................................................................................................................................................15
3.3 Initialization and calibration ...................................................................................................................15
4 Migration from NEO-M8L to NEO-M8U ...................................................................................... 16
4.1 Hardware migration NEO-M8L to NEO-M8U ......................................................................................16
5 Product handling ................................................................................................................................. 17
5.1 Packaging, shipping, storage and moisture preconditioning ..........................................................17
5.2 Soldering .....................................................................................................................................................17
5.3 EOS/ESD/EMI precautions ......................................................................................................................20
5.4 Applications with cellular modules ........................................................................................................23
Appendix ....................................................................................................................................................... 25
A.1 Recommended parts ................................................................................................................................25
A.2 Recommended antennas ........................................................................................................................26
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Related documents ................................................................................................................................... 27
Revision history .......................................................................................................................................... 27
Contact .......................................................................................................................................................... 28
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1 Hardware description
1.1 Overview
The NEO-M8U is an untethered dead reckoning (UDR) module bringing the benefits of dead reckoning
to a wider range of road-vehicle applications by eliminating the need for a speed or wheel-tick
connection to the vehicle. The module uses built-in gyroscope and accelerometer sensors and
features the high-performance u-blox M8 concurrent positioning engine. Available in the NEO
industry standard leadless chip carrier (LCC) package, it is easy to integrate and combines
exceptional positioning performance with highly flexible power, design, and connectivity options. SMT
pads allow fully automated assembly with standard pick & place and reflow-soldering equipment for
cost-efficient, high-volume production enabling short time-to-market.
☞ For more about product features see the NEO-M8U Data sheet [1].
☞ To determine which u-blox product best meets your needs, see the product selector tables on the
u-blox website www.u-blox.com.
1.2 Configuration
The configuration settings can be modified using UBX protocol configuration messages (see u-blox 8
/ u-blox M8 Receiver Description Including Protocol Specification [2]). The modified settings remain
effective until power-down or reset. If these settings have been stored in BBR (battery-backed RAM),
then the modified configuration will be retained, as long as there is no backup battery supply interrupt.
For NEO-M8U modules, the configuration can be saved permanently in SQI flash.
1.3 Connecting power
The NEO-M8U positioning module has up to three power supply pins: VCC, V_BCKP and VDD_USB.
1.3.1 VCC: Main supply voltage
The VCC pin provides the main supply voltage. During operation, the current drawn by the module can
vary by some orders of magnitude. For this reason, it is important that the supply circuitry be able to
support the peak power for a short time (see the NEO-M8U Data sheet [1] for specification).
☞ When switching from backup mode to normal operation or at start-up, the NEO-M8U module must
charge the internal capacitors in the core domain. In certain situations, this can result in a
significant current draw. It is important that the power supply or low ESR capacitors at the module
input can deliver this current/charge.
☞ Use a proper GND concept. Do not use any resistors or coils in the power line.
1.3.2 V_BCKP: Backup supply voltage
If the module supply has a power failure, the V_BCKP pin supplies the real-time clock (RTC) and
battery-backed RAM (BBR). Use of valid time and the GNSS orbit data at startup will improve the
GNSS performance, as with hot starts, warm starts, AssistNow Autonomous and AssistNow Offline.
If no backup battery is connected, the module performs a cold start at power up.
☞ A backup supply voltage should be provided to the NEO-M8U to enable navigation by dead
reckoning before the first GNSS fix.
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☞ Avoid high resistance on the V_BCKP line: During the switch from main supply to backup supply,
a short current adjustment peak can cause high voltage drop on the pin with possible
malfunctions.
☞ If no backup supply voltage is available, connect the V_BCKP pin to VCC.
☞ As long as power is supplied to the NEO-M8U module through the VCC pin, the backup battery is
disconnected from the RTC and the BBR to avoid unnecessary battery drain (see Figure 1). In this
case, VCC supplies power to the RTC and BBR.
Figure 1: Backup battery and voltage (for exact pin orientation, see the NEO-M8U Data sheet [1])
1.3.3 VDD_USB: USB interface power supply
VDD_USB supplies the USB interface. If the USB interface is not used, the VDD_USB pin must be
connected to GND. For more information about correctly handling the VDD_USB pin, see section 1.4.
1.3.4 VCC_RF: Output voltage RF
The VCC_RF pin can supply an active antenna or external LNA. For more information, see section 2.4.
1.4 Interfaces
1.4.1 UART
NEO-M8U 3D dead reckoning module includes a Universal Asynchronous Receiver Transmitter
(UART) serial interface RXD/TXD supporting configurable baud rates. The baud rates supported are
specified in the NEO-M8U Data Sheet [1].
The signal output and input levels are 0 V to VCC. An interface based on RS232 standard levels (+/12 V) can be implemented using level shifters such as Maxim MAX3232. Hardware handshake signals
and synchronous operation are not supported.
1.4.2 USB
A USB version 2.0 FS (full speed, 12 Mb/s) compatible interface is available for communication as an
alternative to the UART. The USB_DP integrates a pull-up resistor to signal a full-speed device to the
host. The VDD_USB pin supplies the USB interface.
u-blox provides Microsoft® certified USB drivers for Windows Vista, Windows 7, Windows 8 and
Windows 10. These drivers are available at our website at www.u-blox.com.
USB external components
The USB interface requires some external components to implement the physical characteristics
required by the USB 2.0 specification. These external components are shown in Figure 2 and listed in
Table 1. To comply with USB specifications, VBUS must be connected through an LDO (U1) to pin
VDD_USB on the module.
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Module
VDD
_USB
LDO
VDD
_USB
R4
USB_DP
USB
_DM
R5
C24 C23
D2
VBUS
DP
DM
GND
USB Device Connector
U1
EN R11
EN
In USB self-powered mode, the power supply (VCC) can be turned off and the digital block is not
powered. In this case, since VBUS is still available, the USB host would still receive the signal indicating
that the device is present and ready to communicate. This should be avoided by disabling the LDO
(U1) using the enable signal (EN) of the VCC-LDO or the output of a voltage supervisor. Depending on
the characteristics of the LDO (U1), it is recommended to add a pull-down resistor (R11) at its output
to ensure VDD_USB is not floating if the LDO (U1) is disabled or the USB cable is not connected, that
is, VBUS is not supplied.
☞ USB bus-powered mode is not supported.
Figure 2: USB interface
Name Component Function Comments
U1 LDO
C23, C24 Capacitors Required according to the specification of LDO U1
D2
R4, R5
R11 Resistor
Table 1: Summary of USB external components
Protection
diodes
Serial
termination
resistors
Regulates VBUS (4.4 …5.25 V)
down to a voltage of 3.3 V.
Protect circuit from overvoltage /
ESD when connecting.
Establish a full-speed driver
impedance of 28…44 Ω
Almost no current requirement (~1 mA) if the GNSS receiver is
operated as a USB self-powered device.
Use low capacitance ESD protection such as ST Microelectronics
USBLC6-2.
A value of 27 Ω is recommended.
100 kΩ is recommended for USB self-powered setup.
1.4.3 Display Data Channel (DDC)
An I2C-compatible Display Data Channel (DDC) interface is available with a NEO-M8U module for
serial communication with an external host CPU. The interface only supports operation in slave mode
(master mode is not supported). The DDC protocol and electrical interface are fully compatible with
the fast-mode of the I2C industry standard. DDC pins SDA and SCL have internal pull-up resistors.
For more information about the DDC implementation, see the u-blox 8 / u-blox M8 Receiver
Description Including Protocol Specification [2]. For bandwidth information, see the NEO-M8U Data
sheet [1]. For timing, parameters consult the I2C-bus specification [5].
☞ The NEO-M8U DDC interface supports serial communication with u-blox cellular modules. See the
specification of the applicable cellular module to confirm compatibility.
1.4.4 SPI
An SPI interface is available for communication to a host CPU.
☞ SPI is not available in the default configuration because its pins are shared with the UART and DDC
interfaces. The SPI interface can be enabled by connecting D_SEL to ground. For speed and clock
frequency, see the NEO-M8U Data sheet [1].
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1.4.5 TX Ready signal
The TX Ready signal indicates that the receiver has data to transmit. A listener can wait on the TX
Ready signal instead of polling the DDC or SPI interfaces. The UBX-CFG-PRT message lets you
configure the polarity and the number of bytes in the buffer before the TX Ready signal goes active.
The TX Ready signal can be mapped to UART TXD (PIO 06). The TX Ready function is disabled by
default.
☞ The TX Ready functionality can be enabled and configured by AT commands sent to the u-blox
cellular module supporting the feature. For more information, see GPS Implementation and Aiding
Features in u-blox wireless modules [6].
1.5 I/O pins
RESET_N: Reset input
Driving RESET_N low activates a hardware reset of the system. Use this pin to reset the module only.
Do not use RESET_N to turn the module on and off, since the reset state increases power
consumption, or as a POR. With the NEO-M8U module the RESET_N pin is an input only.
☞ RESET_N should be used only in critical situations to recover the system. The Real-Time Clock
(RTC) will also be reset and thus immediately afterwards the receiver cannot perform a hot start.
D_SEL: Interface select
The D_SEL pin selects the available interfaces. SPI cannot be used simultaneously with the
UART/DDC. If open, UART and DDC are available. If pulled low, the SPI interface is available. For more
information see the NEO-M8U Data sheet [1].
LNA_EN: LNA enable
In power save mode, the system can turn on/off an optional external LNA using the LNA_EN signal in
order to optimize power consumption.
TIMEPULSE
A configurable time pulse signal is available with the NEO-M8U module. It generates pulse trains
synchronized with GPS or UTC time grid with intervals configurable over a wide frequency range. The
time pulse signal is disabled by default. For more information, see the u-blox 8 / u-blox M8 Receiver
Description Including Protocol Specification [2].
☞ The NEO-M8U time pulse output is configured using messages for “TIMEPULSE2”.
☞ The time pulse output must not be held LOW during start-up.
1.5.1 Electromagnetic interference on I/O lines
Any I/O signal line with a length greater than approximately 3 mm can act as an antenna and may pick
up arbitrary RF signals transferring them as noise into the GNSS receiver. This specifically applies to
unshielded lines, in which the corresponding GND layer is remote or missing entirely, and lines close
to the edges of the printed circuit board.
If, for example, a cellular signal radiates into an unshielded high-impedance line, it is possible to
generate noise in the order of volts and not only distort receiver operation but also damage it
permanently.
On the other hand, noise generated at the I/O pins will emit from unshielded I/O lines. Receiver
performance may be degraded when this noise is coupled into the GNSS antenna (see Figure 15).
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To avoid interference by improperly shielded lines, it is recommended to use resistors (for example,
R>20 Ω), ferrite beads (for example, BLM15HD102SN1) or inductors (for example, LQG15HS47NJ02)
on the I/O lines in series. Choose these components carefully because they also affect the signal rise
times.
Figure 3 shows an example of EMI protection measures on the RX/TX line using a ferrite bead. More
information can be found in section 5.3.
Figure 3: EMI precautions design
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2 Design
2.1 Pin description
No. Name I/O Description
1 SAFEBOOT_N I SAFEBOOT_N, test-point for service use (Leave OPEN)
2 D_SEL I Interface select
3 TIMEPULSE I/O
4 EXTINT I External interrupt pin (disabled by default)
5 USB_DM I/O USB data
6 USB_DP I/O USB data
7 VDD_USB I USB supply
8 RESET_N I RESET_N
9 VCC_RF O Output voltage RF section
10 GND I Ground
11 RF_IN I GNSS signal input
12 GND I Ground
13 GND I Ground
14 LNA_EN O Antenna / External LNA control
15 Reserved - Reserved
16 Reserved - Reserved
17 Reserved - Reserved
18
SDA /
SPI CS_N
19
SCL /
SPI CLK
20
TXD /
SPI MISO
21
RXD /
SPI MOSI
22 V_BCKP I Backup voltage supply
23 VCC I Supply voltage
24 GND I Ground
Table 2: Pinout of NEO-M8U
I/O
I/O
O
I
Time pulse (disabled by default). Do not pull low during reset.
Note: configured using TIMEPULSE2 messages (see u-blox 8 / u-blox M8
Receiver Description Including Protocol Specification [2])
DDC data if D_SEL =1 (or open)
SPI chip select if D_SEL = 0
DDC clock if D_SEL =1 (or open)
SPI clock if D_SEL = 0
Serial port if D_SEL =1 (or open)
SPI MISO if D_SEL = 0
Serial Port if D_SEL =1 (or open)
SPI MOSI if D_SEL = 0
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2.1.1 Pin name changes
Selected pin names have been updated to agree with a common naming convention across u-blox
modules. The pins have not changed their operation and are the same physical hardware but with
updated names. The table below lists the pins that have changed name along with their old and new
names.
No Previous name New name
14 ANT_ON LNA_EN
18 SDA
SPI CS_N
19 SCL
SPI CLK
20
21
Table 3: Pin name changes in NEO-M8U
TxD
SPI MISO
RxD
SPI MOSI
SDA /
SPI CS_N
SCL /
SPI CLK
TXD /
SPI MISO
RXD /
SPI MOSI
2.2 Minimal design
This is a minimal design for a NEO-M8U GNSS receiver.
Figure 4: NEO-M8U passive antenna design
☞ Use series resistors in the UART lines to avoid electromagnetic interference as mentioned in
section
1.5.1.
2.3 Layout: Footprint and paste mask
Figure 5 describes the footprint and provides recommendations for the paste mask for NEO-M8U
modules. These are recommendations only and not specifications. Note that the copper and solder
masks have the same size and position.
To improve the wetting of the half vias, reduce the amount of solder paste under the module and
increase the volume outside of the module by defining the dimensions of the paste mask to form a Tshape (or equivalent) extending beyond the copper mask. For the stencil thickness, see section 5.2.
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☞ Consider the paste mask outline when defining the minimal distance to the next component. The
exact geometry, distances, stencil thicknesses and solder paste volumes must be adapted to the
specific production processes (for example, soldering) of the customer.
Figure 5: NEO-M8U footprint / NEO-M8U paste mask
2.4 Antenna
2.4.1 Antenna design with passive antenna
A design using a passive antenna requires more attention to the layout of the RF section. Typically, a
passive antenna is located near electronic components; therefore, care should be taken to reduce
electrical noise that may interfere with the antenna performance. Passive antennas do not require a
DC bias voltage and can be directly connected to the RF input pin RF_IN. Sometimes, they may also
need a passive matching network to match the impedance to 50 Ω.
Figure 6 shows a minimal setup for a design with a good GNSS patch antenna. For exact pin
orientation, see the NEO-M8U Data Sheet [1].
Figure 6: Module design with passive antenna Use an antenna that has sufficient bandwidth to receive all GNSS
constellations. For more information see the appendix and the GPS Antenna Application Note [3].
Figure 7 shows a design using an external LNA and SAW to increase the sensitivity for best
performance with passive antenna. For exact pin orientation, see the NEO-M8U Data sheet [1].
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Figure 7: Module design with passive antenna and an external LNA and SAW
The LNA_EN pin (LNA enable) can be used to turn an optional external LNA on and off.
The VCC_RF output can be used to supply the LNA with a filtered supply voltage.
☞ A standard GNSS LNA has enough bandwidth to amplify GPS/GLONASS/BeiDou signals.
2.4.2 Active antenna design
An active antenna makes use of an integrated low-noise amplifier, which requires a power supply that
will contribute to the total GNSS system power consumption budget with additional 5 to 20 mA
typically.
If the supply voltage of the NEO-M8U module matches the supply voltage of the active antenna (for
example, 3.0 V), use the filtered supply voltage available at pin VCC_RF as shown in Figure 8. For exact
pin orientation, see the NEO-M8U Data Sheet [1].
Active antenna design using VCC_RF pin to supply the active antenna
Figure 8: Active antenna design, external supply from VCC_RF
If the VCC_RF voltage does not match with the supply voltage of the active antenna, use a filtered
external supply as shown in Figure 9. For exact pin orientation, see the NEO-M8U Data sheet [1].
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Active antenna design powered from an external supply
Figure 9: Active antenna design, direct external supply
☞ The circuit shown in Figure 9 works with all u-blox M8 modules, including modules without VCC_RF
output.
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3 Untethered dead reckoning
3.1 Implementation
The NEO-M8U 3D untethered dead reckoning (UDR) module makes use of GNSS and internal
gyroscope and accelerometer sensors only with no need or provision for speed pulse or
forward/reverse information.
3.2 Installation
To achieve good performance, the NEO-M8U hardware needs to be mounted in the vehicle in such a
way that its alignment is stable to within 2°. It is important that the mounting design minimizes
vibration and mechanical resonance.
Figure 10: NEO-M8U with IMU sensor frame
3.3 Initialization and calibration
The benefits of dead reckoning are available once the receiver has completed its initialization phase
following installation. Initialization parameter values are subsequently stored in the battery-backed
RAM (BBR) for immediate use and may also be saved in the flash memory. The duration of the
initialization depends on the quality of the GNSS signals as well as the dynamics encountered by the
vehicle.
For details on Initialization and calibration, see the u-blox 8 / u-blox M8 Receiver Description Including
Protocol Specification [2].
☞ Note that the performance of the UDR solution relies on a stable sensor location and orientation
with respect to the vehicle frame. The module must be mounted securely within the vehicle.
☞ To read more about mandatory and optional configuration parameters, see the UDR configuration
section of u-blox 8 / u-blox M8 Receiver Description Including Protocol Specification [2].
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Pin
4 Migration from NEO-M8L to NEO-M8U
4.1 Hardware migration NEO-M8L to NEO-M8U
u-blox is committed to ensuring that NEO-M8U is backwards compatible to NEO-M8L. It is highly
advisable that customers consider a design review with the u-blox support team to ensure the
compatibility of key functionalities.
NEO-M8L NEO-M8U Remarks for migration
Pin name Typical assignment Pin name Typical assignment
1 SAFEBOOT_N Leave open SAFEBOOT_N Leave open No difference
2 D_SEL Selects the interface D_SEL Selects the interface No difference
3 TIMEPULSE Time pulse (1PPS) TIMEPULSE Time pulse (1PPS) No difference
4 WHEELTICK Wheel tick input EXTINT
5 USB_DM USB data USB_DM USB data No difference
6 USB_DP USB data USB_DP USB data No difference
7 VDD_USB USB supply VDD_USB USB supply No difference
8 RESET_N Reset input RESET_N Reset input No difference
9 VCC_RF
10 GND GND GND GND No difference
11 RF_IN GNSS signal input RF_IN GNSS signal input No difference
12 GND GND GND GND No difference
13 GND GND GND GND No difference
14 LNA_EN1
15 FWD
16 RESERVED2 Leave open RESERVED Leave open
17 RESERVED2 Leave open RESERVED Leave open
18 SDA DDC data / SPI CS_N SDA DDC data / SPI CS_N No difference
19 SCL DDC clock / SPI SCK SCL DDC clock / SPI SCK No difference
20 TXD Serial port / SPI MISO TXD Serial port / SPI MISO No difference
21 RXD Serial port / SPI MOSI RXD Serial port / SPI MOSI No difference
22 V_BCKP Backup supply voltage V_BCKP Backup supply voltage No difference
23 VCC Supply voltage VCC Supply voltage No difference
24 GND GND GND GND No difference
Table 4: Pinout comparison NEO-M8L vs. NEO-M8U
Can be used for active
antenna or external
LNA supply
Used to turn an
optional external LNA
on and off
Forward/reverse input
for speed pulse
VCC_RF
LNA_EN
RESERVED Leave open
External interrupt pin
(disabled by default)
Can be used for active
antenna or external LNA
supply
Used to turn an optional
external LNA on and off
No problem, disabled by default
No difference
No difference
If it was connected on NEO-M8L,
OK to do the same on NEO-M8U.
If it was connected on NEO-M8L,
OK to do the same on NEO-M8U.
If it was connected on NEO-M8L,
OK to do the same on NEO-M8U.
☞ For software migration and an overall description of the module software operation, see the u-blox
8 / u-blox M8 Receiver Description Including Protocol Specification
1
In NEO-M8L documentation prior to firmware ADR 4.00 the pin 14 name was ANT_ON. The functionality of the pin 14 remains
the same, keeping the backward compatibility.
2
In NEO-M8L documentation prior to firmware ADR 4.00 the pin name was NC.
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5 Product handling
5.1 Packaging, shipping, storage and moisture preconditioning
For information pertaining to reels and tapes, moisture sensitivity levels (MSL), shipment and storage
information, as well as drying for preconditioning see the NEO-M8U Data sheet [1].
Population of modules
☞ When populating the modules, make sure that the pick and place machine is aligned to the copper
pins of the module and not on the module edge.
5.2 Soldering
Soldering paste
Use of "no clean" soldering paste is highly recommended, as it does not require cleaning after the
soldering process. The paste in the example below meets these criteria.
Soldering paste: OM338 SAC405 / Nr.143714 (Cookson Electronics)
Alloy specification: Sn 95.5/ Ag 4/ Cu 0.5 (95.5% tin/ 4% silver/ 0.5% copper)
Melting temperature: 217 °C
Stencil thickness: See section 2.3
The final choice of the soldering paste depends on the approved manufacturing procedures. The
paste-mask geometry for applying soldering paste should meet the recommendations.
☞ The quality of the solder joints on the connectors (’half vias’) should meet the appropriate IPC
specification.
Reflow soldering
A convection type-soldering oven is highly recommended over the infrared type radiation oven.
Convection-heated ovens allow precise control of the temperature, and all parts will heat up evenly,
regardless of material properties, thickness of components and surface color.
As a reference, see IPC-7530 Guidelines for temperature profiling for mass soldering (reflow and
wave) processes, published in 2001.
Preheat phase
During the initial heating of component leads and balls, residual humidity will be dried out. Note that
this preheat phase will not replace prior baking procedures.
• Temperature rise rate: max 3 °C/s. If the temperature rise is too rapid in the preheat phase it may
cause excessive slumping.
• Time: 60 - 120 s. If the preheat is insufficient, rather large solder balls tend to be generated.
Conversely, if performed excessively, fine balls and large balls will be generated in clusters.
• End temperature: 150 - 200 °C. If the temperature is too low, non-melting tends to be caused in
areas containing large heat capacity.
Heating/ Reflow phase
The temperature rises above the liquidus temperature of 217 °C. Avoid a sudden rise in temperature
as the slump of the paste could become worse.
• Limit time above 217 °C liquidus temperature: 40 - 60 s
• Peak reflow temperature: 245 °C
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Cooling phase
A controlled cooling avoids negative metallurgical effects of the solder (solder becomes more brittle)
and possible mechanical tensions in the products. Controlled cooling helps to achieve bright solder
fillets with a good shape and low contact angle.
• Temperature fall rate: max 4 °C/s
☞ To avoid falling off, the NEO-M8U module should be placed on the topside of the motherboard
during soldering.
The final soldering temperature chosen at the factory depends on additional external factors like
choice of soldering paste, size, thickness and properties of the base board, and so on. Exceeding the
maximum soldering temperature in the recommended soldering profile may permanently damage the
module.
Figure 11: Recommended soldering profile
☞ NEO-M8U modules must not be soldered with a damp heat process.
Optical inspection
After soldering the NEO-M8U module, consider an optical inspection step to check that:
• The module is properly aligned and centered over the pads
• All pads are properly soldered
• No excess solder has created contacts to neighboring pads, or to nearby pad stacks and vias
Cleaning
In general, cleaning the populated modules is strongly discouraged. Residues underneath the
modules cannot be easily removed with a washing process.
• Cleaning with water will lead to capillary effects where water is absorbed in the gap between the
baseboard and the module. The combination of residues of soldering flux and encapsulated water
leads to short circuits or resistor-like interconnections between neighboring pads.
• Cleaning with alcohol or other organic solvents can result in soldering flux residues flooding into
the two housings, areas that are not accessible for post-wash inspections. The solvent will also
damage the sticker and the ink-jet printed text.
• Ultrasonic cleaning will permanently damage the module, in particular the quartz oscillators.
The best approach is to use a "no clean" soldering paste and eliminate the cleaning step after the
soldering.
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Repeated reflow soldering
Only single reflow soldering processes are recommended for boards populated with NEO-M8U
modules. To avoid upside down orientation during the second reflow cycle, the NEO-M8U module
should not be submitted to two reflow cycles on a board populated with components on both sides. In
this case, the module should always be placed on that side of the board which is submitted into the
last reflow cycle. The reason for this (besides others) is the risk of the module falling off due to the
significantly higher weight in relation to other components.
Two reflow cycles can be considered by excluding the upside down scenario described above and
taking into account the rework conditions described in section 5
.
☞ Repeated reflow soldering processes and soldering the module upside down are not
recommended.
Wave soldering
Base boards with combined through-hole technology (THT) components and surface-mount
technology (SMT) devices require wave soldering to solder the THT components. Only a single wave
soldering process is encouraged for boards populated with NEO-M8U modules.
Hand soldering
Hand soldering is allowed. Use a soldering iron temperature setting equivalent to 350 °C. Place the
module precisely on the pads. Start with a cross-diagonal fixture soldering (for example, pins 1 and
15), and then continue from left to right.
Rework
The NEO-M8U module can be unsoldered from the baseboard using a hot air gun. When using a hot
air gun for unsoldering the module, a maximum of one reflow cycle is allowed. In general, we do not
recommend using a hot air gun because this is an uncontrolled process and might damage the
module.
⚠ Attention: use of a hot air gun can lead to overheating and severely damage the module. Always
avoid overheating the module.
After the module is removed, clean the pads before placing and hand soldering a new module.
⚠ Never attempt a rework on the module itself, for example, replace individual components. Such
actions immediately terminate the warranty.
In addition to the two reflow cycles, manual rework on particular pins by using a soldering iron is
allowed. Manual rework steps on the module can be done several times.
Conformal coating
®
Certain applications employ a conformal coating of the PCB using HumiSeal
products. These materials affect the HF properties of the NEO-M8U module and it is important to
prevent them from flowing into the module. The RF shields do not provide 100% protection for the
module from coating liquids with low viscosity; therefore, care is required in applying the coating.
or other related coating
☞ Conformal coating of the module will void the warranty.
Casting
If casting is required, use viscose or another type of silicon potant. The OEM is strongly advised to
qualify such processes in combination with the NEO-M8U module before implementing this in the
production.
☞ Casting will void the warranty.
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Grounding metal covers
Attempts to improve grounding by soldering ground cables, wick or other forms of metal strips
directly onto the EMI covers is done at the customer's own risk. The numerous ground pins should be
sufficient to provide optimum immunity to interferences and noise.
☞ u-blox makes no warranty for damages to the NEO-M8U module caused by soldering metal cables
or any other forms of metal strips directly onto the EMI covers.
Use of ultrasonic processes
Some components on the u-blox M8 module are sensitive to ultrasonic waves. Use of any ultrasonic
processes (such as cleaning, welding) may cause damage to the GNSS receiver.
☞ u-blox offers no warranty against damages to the NEO-M8U module caused by any ultrasonic
processes.
5.3 EOS/ESD/EMI precautions
When integrating GNSS positioning modules into wireless systems, careful consideration must be
given to electromagnetic and voltage susceptibility issues. Wireless systems include components
that can produce Electrical Overstress (EOS) and Electro-Magnetic Interference (EMI). CMOS devices
are more sensitive to such influences because their failure mechanism is defined by the applied
voltage, whereas bipolar semiconductors are more susceptible to thermal overstress. The following
design guidelines are provided to help in designing robust yet cost effective solutions.
⚠ To avoid overstress damage during production or in the field it is essential to observe strict
EOS/ESD/EMI handling and protection measures.
⚠ To prevent overstress damage at the RF_IN of your receiver, never exceed the maximum input
power (see the NEO-M8U Data sheet [1]).
Electrostatic discharge (ESD)
Electrostatic discharge (ESD) is the sudden and momentary electric current that flows
between two objects at different electrical potentials caused by direct contact or
induced by an electrostatic field. The term is usually used in the electronics and other
industries to describe momentary unwanted currents that may cause damage to
electronic equipment.
ESD handling precautions
ESD prevention is based on establishing an Electrostatic Protective Area (EPA). The EPA can be a
small working station or a large manufacturing area. The main principle of an EPA is that there are no
highly charging materials near ESD sensitive electronics, all conductive materials are grounded,
workers are grounded, and charge build-up on ESD sensitive electronics is prevented. International
standards are used to define typical EPA and can be obtained for example from International
Electrotechnical Commission (IEC) or American National Standards Institute (ANSI).
GNSS positioning modules are sensitive to ESD and require special precautions when handling.
Particular care must be exercised when handling patch antennas, due to the risk of electrostatic
charges. In addition to standard ESD safety practices, take the following measures into account
whenever handling the receiver.
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•
•
, implement proper ESD protection
•
RF_IN
GNSS
Receiver
LN A
L
RF_IN
GNSS
Receiver
D
RF_IN
GNSS
Receiver
• Unless there is a galvanic coupling between the local GND
(i.e. the work desk) and the PCB GND, the first point of
contact when handling the PCB must always be between
the local GND and PCB GND.
• Before mounting an antenna patch, connect ground of the
device.
When handling the RF pin, do not come into contact with
any charged capacitors and be careful when contacting
materials that can develop charges (for example, patch
antenna ~10 pF, coax cable ~50 - 80 pF/m, soldering iron)
To prevent electrostatic discharge through the RF input, do
not touch any exposed antenna area. If there is any risk that
such exposed antenna area is touched in a non-ESD
protected work area
measures in the design.
When soldering RF connectors and patch antennas to the
receiver’s RF pin, make sure to use an ESD safe soldering
iron (tip).
⚠ Failure to observe these precautions can result in severe damage to the GNSS module!
ESD protection measures
⚠ GNSS positioning modules are sensitive to Electrostatic Discharge (ESD). Special precautions are
required when handling.
☞ For more robust designs, employ additional ESD protection measures. Using an LNA with
appropriate ESD rating can provide enhanced GNSS performance with passive antennas and
increases ESD protection.
Most defects caused by ESD can be prevented by following strict ESD protection rules for production
and handling. When implementing passive antenna patches or external antenna connection points,
then additional ESD measures can also avoid failures in the field as shown in Figure 12.
Small passive antennas (<2 dBic and
performance critical)
A
LNA with appropriate ESD rating
Figure 12: ESD precautions
Passive antennas (>2 dBic or
performance sufficient)
B
Active antennas
C
☞ Protection measure A is preferred because it offers the best GNSS performance and best level of
ESD protection.
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RF_IN
GNSS
Receiver
LN A
GPS
Bandpass
Filtler
RF_IN
GNSS
Receiver
L
GPS
Bandpass
Filtler
Electrical Overstress (EOS)
Electrical Overstress (EOS) usually describes situations when the maximum input power exceeds the
maximum specified ratings. EOS failure can happen if RF emitters are close to a GNSS receiver or its
antenna. EOS causes damage to the chip structures. If the RF_IN is damaged by EOS, it is hard to
determine whether the chip structures have been damaged by ESD or EOS.
EOS protection measures
☞ For designs with GNSS positioning modules and wireless (for example, GSM/GPRS) transceivers
in close proximity, ensure sufficient isolation between the wireless and GNSS antennas. If wireless
power output causes the specified maximum power input at the GNSS RF_IN to be exceeded,
employ EOS protection measures to prevent overstress damage.
For robustness, EOS protection measures as shown in Figure 13 are recommended for designs
combining wireless communication transceivers (e.g. GSM, GPRS) and GNSS in the same design or in
close proximity.
Small passive antennas (<2 dBic
and performance critical)
D
LNA with appropriate ESD rating
and maximum input power
Figure 13: EOS and ESD precautions
Passive antennas (>2 dBic or
performance sufficient)
E
GNSS Band pass Filter: SAW or
Ceramic with low insertion loss
and appropriate ESD rating
Active antennas (without internal filter which
need the module antenna supervisor circuits)
F
Electromagnetic interference (EMI)
Electromagnetic interference (EMI) is the addition or coupling of energy causing a spontaneous reset
of the GNSS receiver or resulting in unstable performance. In addition to EMI degradation due to selfjamming (see section 1.5) any electronic device near the GNSS receiver can emit noise that can lead
to EMI disturbances or damage.
The following elements are critical regarding EMI:
• Unshielded connectors (e.g. pin rows etc.)
• Weakly shielded lines on PCB (e.g. on top or bottom layer and especially at the border of a PCB)
• Weak GND concept (e.g. small and/or long ground line connections)
EMI protection measures are recommended when RF emitting devices are near the GNSS receiver. To
minimize the effect of EMI a robust grounding concept is essential. To achieve electromagnetic
robustness follow the standard EMI suppression techniques.
http://www.murata.com/products/emc/knowhow/index.html
http://www.murata.com/products/emc/knowhow/pdf/4to5e.pdf
Improved EMI protection can be achieved by inserting a resistor or better yet a ferrite bead or an
inductor (see Table 5) into any unshielded PCB lines connected to the GNSS receiver. Place the
resistor as close as possible to the GNSS receiver pin.
Alternatively, feed-through capacitors with good GND connection can be used to protect for example
the VCC supply pin against EMI. A selection of feed-through capacitors is listed in Table 5.
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1525
1550 1625
GPS input filte r
cha ract eristics
1575
1600
0
-110
Jammin
g signal
1525
1550 1625
Frequency [ MHz]
Po w er [ d Bm]
GPS input filte r
cha ract eristics
1575 1600
0
Jamming
signal
GPS
signals
GPS C arr ier
1575.4 MHz
5.4 Applications with cellular modules
GSM terminals transmit power levels up to 2 W (+33 dBm) peak, 3G and LTE up to 250 mW
continuous. Consult the Data sheet for the absolute maximum power input at the GNSS receiver.
☞ See the GPS Implementation and Aiding Features in u-blox wireless modules [6].
Isolation between GNSS and cellular antennas
In multi-antenna designs, an isolation of approximately 20 dB can be reached with careful placement
of the antennas. If such isolation cannot be achieved, for example, in the case of an integrated cellular
antenna, an additional input filter is needed on the GNSS side to block the high energy emitted by the
cellular transmitter. Examples of these kinds of filters would be the SAW Filters from Epcos (B9444
or B7839) or Murata.
Increasing interference immunity
Interference signals come from in-band and out-band frequency sources.
In-band interference
With in-band interference, the signal frequency is very close to the GNSS constellation frequency
used, for example, GPS frequency of 1575 MHz (see
caused by harmonics from displays, micro-controller, bus systems, and so on.
Figure 14). Such interference signals are typically
Figure 14: In-band interference signals
Figure 15: In-band interference sources
Measures against in-band interference include:
• Maintaining a good grounding concept in the design
• Shielding
• Layout optimization
• Filtering
• Placement of the GNSS antenna
• Adding a CDMA, GSM, WCDMA band pass filter before handset antenna
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Out-of-band interference
Out-of-band interference is caused by signal frequencies that are different from the GNSS carrier (see
Figure 16). The main sources are wireless communication systems such as GSM, CDMA, WCDMA,
Wi-Fi, BT, and so on.
Figure 16: Out-of-band interference signals
Measures against out-of-band interference include maintaining a good grounding concept in the
design and adding a SAW or band pass ceramic filter (as recommend in
input line to the GNSS receiver (see Figure 17).
section 5) into the antenna
Figure 17: Measures against out-of-band interference
☞ For design-in recommendations in combination to cellular operation see the appendix.
☞ See the GPS Implementation and Aiding Features in u-blox wireless modules [6].
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Appendix
A.1 Recommended parts
Recommended parts are selected on data sheet basis only. Other components may also be used.
Part Manufacturer Part ID Remarks Parameters to consider
Diode
semiconductor
SAW TDK/ EPCOS B8401: B39162-B8401-P810 GPS+GLONASS High attenuation
LNA JRC NJG1143UA2 LNA
Inductor Murata LQG15HS27NJ02 L, 27 nH
Capacitor Murata GRM1555C1E470JZ01 C, 47 pF DC-block
Ferrite
bead
Feedthrough
capacitor
for signal
Feed
through-
capacitor
Resistor
Table 5: Recommended parts
ON ESD9R3.3ST5G Standoff voltage>3.3 V Low capacitance < 0.5 pF
ESD9L3.3ST5G Standoff voltage>3.3 V
ESD9L5.0ST5G Standoff voltage>5 V Low Iiductance
B3913: B39162B3913U410 GPS+GLONASS+BeiDou For automotive application
B4310: B39162B4310P810 GPS+GLONASS Compliant to the AEC-Q200 standard
ReyConns NDF9169 GPS+ BeiDou
Murata SAFFB1G56KB0F0A GPS+GLONASS+BeiDou
SAFEA1G58KB0F00 GPS+GLONASS
SAFEA1G58KA0F00 GPS+GLONASS
SAFFB1G58KA0F0A GPS+GLONASS
SAFFB1G58KB0F0A GPS+GLONASS
TAI-SAW TA1573A GPS+GLONASS Low insertion loss
TA1343A GPS+GLONASS+BeiDou Low insertion loss
TA0638A GPS+GLONASS+BeiDou Low insertion loss
Murata BLM15HD102SN1 FB High IZI at fGSM
Murata NFL18SP157X1A3
NFA18SL307V1A45
Murata NFM18PC ….
NFM21P….
10 Ω ± 10%, min 0.250 W
560 Ω ± 5%
100 kΩ ± 5%
Monolithic type
Array type
0603 2A
0805 4A
R
bias
R2
R3, R4
Standoff voltage > Voltage for active
antenna
Low insertion loss, only for mobile
application
Low insertion loss, only for mobile
application
Low insertion loss, only for mobile
application
High attenuation, only for mobile
application
High attenuation, only for mobile
application
Low insertion loss, only for mobile
application
Low noise figure, up to 15 dBm RF
input power
Impedance at freq GPS > 500 Ω
Load capacitance appropriate to baud
rate
CL < xxx pF
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A.2 Recommended antennas
Manufacturer Order no. Comments
Hirschmann (www.hirschmann-car.com) GLONASS 9 M GPS+GLONASS active
Taoglas (www.taoglas.com) AA.160.301111 36 x 36 x 4 mm, 3-5 V 30 mA active
Taoglas (www.taoglas.com) AA.161.301111
INPAQ (www.inpaq.com.tw) B3G02G-S3-01-A 2.7 to 3.9 V / 10 mA active
Amotech (www.amotech.co.kr) B35-3556920-2J2 35 x 35 x 3 mm GPS+GLONASS passive
Amotech (www.amotech.co.kr) A25-4102920-2J3 25 x 25 x 4 mm GPS+GLONASS passive
Amotech (www.amotech.co.kr) A18-4135920-AMT04 18 x 18 x 4 mm GPS+GLONASS passive
INPAQ (www.inpaq.com.tw) ACM4-5036-A1-CC-S 5.2 x 3.7 x 0.7 mm GPS+GLONASS passive
Additional antenna Manufacturer: Allis Communications, 2J, Tallysman Wireless
Table 6: Recommended antennas
36 x 36 x 3 mm, 1.8 to 5.5 V / 10 mA at 3 V
active
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Related documents
[1] NEO-M8U Data sheet, UBX-15015679
[2] u-blox 8 / u-blox M8 Receiver Description Including Protocol Specification, UBX-13003221
[3] GPS Antenna Application note, GPS-X-08014
[4] GPS Compendium, GPS-X-02007
[5] I2C-bus specification and user manual, Revision 6, 20140404
http://www.nxp.com/documents/user_manual/UM10204.pdf
[6] GPS Implementation and Aiding Features in u-blox wireless modules, GSM.G1-CS-09007
[7] u-center User guide, UBX-13005250
[8] NEO-M8L, NEO-M8U Information note, UBX-20014805
☞ For regular updates to u-blox documentation and to receive product change notifications, register
on our homepage (www.u-blox.com).
Revision history
Revision Date Name Comments
R01 29-Feb-2015 jfur Objective Specification
Advance Information, Updated pin names in section 1.4, 1.4.5, 1.5, 2.4.1, ,
R02 19-May-2016 ghun/mpel
R03 27-Jun-2016 mpel Early Product Information
R04 20-Sep-2016 njaf Production Information, Updated Figure 2: USB Interface
R05 25-Oct-2017 njaf
R06 28-Jan-2019 njaf UDR 1.21 FW update
R07 18-Apr-2019 smos
R08 20-Mar-2020 ssid Advance information for NEO-M8U-05B, UDR 1.31
R09 20-May-2020 mala
R10 12-Feb-2021 njaf UDR 1.50 firmware and new type number added on page 2.
R11 22-Mar-2021 njaf Product status updated to initial production for NEO-M8U-06B on page 2.
Table 2, Figure 4, Figure 7, Figure 10, Table 3.
Updated section 3.3 Initialization and calibration.
Information on RED DoC added in European Union regulatory compliance
section. Legal statement updated.
Updated Contact with documentation feedback e-mail.
Corrected type number on page 2; footers and hyperlinks throughout
document corrected.
Early production information.
Added information on NEO-M8L, NEO-M8U information note in Document
information and Related documents.
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Contact
For complete contact information, visit us at www.u-blox.com.
u-blox Offices
North, Central and South America
u-blox America, Inc.
Phone: +1 703 483 3180
E-mail: info_us@u-blox.com
Regional Office West Coast:
Phone: +1 408 573 3640
E-mail: info_us@u-blox.com
Technical Support:
Phone: +1 703 483 3185
E-mail: support@u-blox.com
Headquarters
Europe, Middle East, Africa
u-blox AG
Phone: +41 44 722 74 44
E-mail: info@u-blox.com
Support: support@u-blox.com
Asia, Australia, Pacific
u-blox Singapore Pte. Ltd.
Phone: +65 6734 3811
E-mail: info_ap@u-blox.com
Support: support_ap@u-blox.com
Regional Office Australia:
Phone: +61 3 9566 7255
E-mail: info_anz@u-blox.com
Support: support_ap@u-blox.com
Regional Office China (Beijing):
Phone: +86 10 68 133 545
E-mail: info_cn@u-blox.com
Support: support_cn@u-blox.com
Regional Office China (Chongqing):
Phone: +86 23 6815 1588
E-mail: info_cn@u-blox.com
Support: support_cn@u-blox.com
Regional Office China (Shanghai):
Phone: +86 21 6090 4832
E-mail: info_cn@u-blox.com
Support: support_cn@u-blox.com
Regional Office China (Shenzhen):
Phone: +86 755 8627 1083
E-mail: info_cn@u-blox.com
Support: support_cn@u-blox.com
Regional Office India:
Phone: +91 80 405 092 00
E-mail: info_in@u-blox.com
Support: support_in@u-blox.com
Regional Office Japan (Osaka):
Phone: +81 6 6941 3660
E-mail: info_jp@u-blox.com
Support: support_jp@u-blox.com
Regional Office Japan (Tokyo):
Phone: +81 3 5775 3850
E-mail: info_jp@u-blox.com
Support: support_jp@u-blox.com
Regional Office Korea:
Phone: +82 2 542 0861
E-mail: info_kr@u-blox.com
Support: support_kr@u-blox.com
Regional Office Taiwan:
Phone: +886 2 2657 1090
E-mail: info_tw@u-blox.com
Support: support_tw@u-blox.com
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