u-blox NEO-8Q Series, NEO-M8 Series, NEO-M8T, NEO-M8N, NEO-8Q Hardware Integration Manual

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Abstract

This document describes the features and specifications of u-blox NEO-8Q and NEO-M8 series modules.

www.u-blox.com

UBX-15029985 - R04

NEO-8Q / NEO-M8

u-blox 8 / M8 GNSS modules

Hardware Integration Manual

NEO-8Q / NEO-M8 - Hardware Integration Manual

Document Information

Title

NEO-8Q / NEO-M8

Subtitle

u-blox 8 / M8 GNSS modules

Document type

Hardware Integration Manual

Document number

UBX-15029985

Revision and Date

R04

11-Nov-2017

Document status

Production Information

Document status explanation

Objective Specification

Document contains target values. Revised and supplementary data will be published later.

Advance Information

Document contains data based on early testing. Revised and supplementary data will be published later.

Early Production Information

Document contains data from product verification. Revised and supplementary data may be published later.

Production Information

Document contains the final product specification.

European Union regulatory compliance

Product name

Type number

ROM/FLASH version

PCN reference

NEO-M8N

NEO-M8N-0-10

FLASH FW SPG 3.01

UBX-15030279

NEO-M8M

NEO-M8M-0-10

ROM SPG 3.01

UBX-16013121

NEO-M8Q

NEO-M8Q-0-10

ROM SPG 3.01

UBX-16013121

NEO-M8T

NEO-M8T-0-10

FLASH FW3.01 TIM 1.10

UBX-16005636

NEO-8Q

NEO-8Q-0-10

ROM SPG 3.01

N/A

u-blox reserves all rights to this document and the information contained herein. Products, names, logos and designs described herein may in whole or in part be subject to intellectual property rights. Reproduction, use, modification or disclosure to third parties of this document or any part thereof without the express permission of u-blox is strictly prohibited.

The information contained herein is provided “as is” and u-blox assumes no liability for the use of the information. No warranty, either express or implied, is given, including but not limited, with respect to the accuracy, correctness, reliability and fitness for a particular purpose of the information. This document may be revised by u-blox at any time. For most recent documents, please visit www.u-blox.com.

u-blox is a registered trademark of u-blox Holding AG in the EU and other countries

NEO-8Q and NEO-M8N/M/Q/T modules comply with all relevant requirements for RED 2014/53/EU. The NEO-8Q andNEO-M8N/M/Q/T Declaration of Conformity (DoC) is available at www.u-blox.com within Support > Product resources > Conformity Declaration.

This document applies to the following products:

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Preface

u-blox Technical Documentation

As part of our commitment to customer support, u-blox maintains an extensive volume of technical documentation for our products. In addition to our product-specific technical data sheets, the following manuals are available to assist u-blox customers in product design and development.

 GPS Compendium: This document, also known as the GPS book, provides a wealth of information

regarding generic questions about GPS system functionalities and technology.

 Receiver Description including Protocol Specification: This document describes messages, configuration

and functionalities of the NEO-8Q / NEO-M8 software releases and receivers.

 Hardware Integration Manuals: These manuals provide hardware design instructions and information on

how to set up production and final product tests.

 Application Notes: These documents provide general design instructions and information that applies to all

u-blox GNSS positioning modules.

How to use this Manual

This manual has a modular structure. It is not necessary to read it from beginning to end. The following symbols highlight important information within the manual:

An index finger points out key information pertaining to module integration and performance.

A warning symbol indicates actions that could negatively influence or damage the module.

Questions

If you have any questions about NEO-8Q / NEO-M8 integration, please:

 Read this manual carefully.  Contact our information service on the homepage http://www.u-blox.com.  Read the questions and answers on our FAQ database on the homepage.

Technical Support

Worldwide Web

Our website (www.u-blox.com) is a rich pool of information. Product information, technical documents and helpful FAQ can be accessed 24h a day.

By E-mail

If you have technical problems or cannot find the required information in the provided documents, contact the closest Technical Support office. To ensure that we process your request as soon as possible, use our service pool email addresses rather than personal staff email addresses. Contact details are at the end of the document.

Helpful Information when Contacting Technical Support

When contacting Technical Support please have the following information ready:

 Receiver type (e.g. NEO-M8N-0-10), Datacode (e.g. 180200.1000) and firmware version (e.g. FLASH FW

SPG3.01)

 Receiver/module configuration  Clear description of your question or the problem (may include a u-center logfile)  A short description of the application  Your complete contact details

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Contents

Preface ........................................................................................................................................... 3

Contents ........................................................................................................................................ 4

1 Hardware description ............................................................................................................. 6

1.1 Overview .............................................................................................................................................................. 6

1.2 Configuration ....................................................................................................................................................... 6

1.3 Connecting power ................................................................................................................................................ 6

1.3.1 VCC: Main supply voltage ............................................................................................................................. 6

1.3.2 V_BCKP: Backup supply voltage .................................................................................................................... 6

1.3.3 VDD_USB: USB interface power supply ......................................................................................................... 7

1.3.4 VCC_RF: Output voltage RF .......................................................................................................................... 7

1.4 Interfaces.............................................................................................................................................................. 7

1.4.1 UART ............................................................................................................................................................ 7

1.4.2 USB .............................................................................................................................................................. 7

1.4.3 Display Data Channel (DDC) .......................................................................................................................... 8

1.4.4 SPI ................................................................................................................................................................ 8

1.4.5 TX_READY .................................................................................................................................................... 8

1.5 I/O pins ................................................................................................................................................................. 9

1.5.1 RESET_N: Reset ............................................................................................................................................. 9

1.5.2 EXTINT: External interrupt ............................................................................................................................. 9

1.5.3 SAFEBOOT_N ................................................................................................................................................ 9

1.5.4 D_SEL: Interface select .................................................................................................................................. 9

1.5.5 TIMEPULSE (TIMEPULSE1 on NEO-M8T) ......................................................................................................... 9

1.5.6 TIMEPULSE2 ............................................................................................................................................... 10

1.5.7 LNA_EN: LNA enable .................................................................................................................................. 10

1.6 Electromagnetic interference on I/O lines ............................................................................................................ 10

2 Design .................................................................................................................................... 11

2.1 Pin description .................................................................................................................................................... 11

2.1.1 Pin name changes ....................................................................................................................................... 12

2.2 Minimal design ................................................................................................................................................... 13

2.3 Layout: Footprint and paste mask ....................................................................................................................... 13

2.4 Antenna ............................................................................................................................................................. 14

2.4.1 Antenna design with passive antenna ......................................................................................................... 14

2.4.2 Active antenna design................................................................................................................................. 15

3 Migration to u-blox 8 / M8 modules .................................................................................... 17

3.1 Migrating u-blox 7 designs to NEO-8Q and NEO-M8 series modules .................................................................... 17

3.2 Hardware migration NEO-6 -> NEO-8Q and NEO-M8 series ................................................................................. 17

3.3 Software migration ............................................................................................................................................. 18

4 Product handling................................................................................................................... 19

4.1 Packaging, shipping, storage and moisture preconditioning ................................................................................ 19

4.2 Soldering ............................................................................................................................................................ 19

4.3 EOS/ESD/EMI precautions .................................................................................................................................... 22

4.4 Applications with cellular modules ...................................................................................................................... 26

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Appendix ..................................................................................................................................... 28

A Glossary ................................................................................................................................. 28

B Recommended parts ............................................................................................................. 29

Related documents ...................................................................................................................... 30

Revision history ........................................................................................................................... 30

Contact ......................................................................................................................................... 31

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1 Hardware description

1.1 Overview

u-blox NEO-8Q, NEO-M8N, NEO-M8Q, and NEO-M8M standard precision GNSS modules, and the NEO-M8T timing GNSS module, all feature the high performance u-blox M8 GNSS engine. Available in the industry standard NEO form factor in a leadless chip carrier (LCC) package, they are easy to integrate and combine exceptional positioning performance with highly flexible power, design, and connectivity options. SMT pads allow fully automated assembly with standard pick & place and reflow-soldering equipment for cost-efficient, high-volume production enabling short time-to-market.

For product features, see the corresponding product data sheet in the Related documents. To determine which u-blox product best meets your needs, see the product selector tables on the u-blox

website www.u-blox.com.

1.2 Configuration

The configuration settings can be modified using UBX protocol configuration messages, see the u-blox 8 / u-blox M8 Receiver Description including Protocol Specification [4]. The modified settings remain effective until power-

down or reset. If these settings have been stored in BBR (Battery Backed RAM), then the modified configuration will be retained, as long as the backup battery supply is not interrupted.

For the NEO-M8N module, configuration can be saved permanently in SQI flash.

1.3 Connecting power

The u-blox NEO-8Q and NEO-M8 series modules have three power supply pins: VCC, V_BCKP, and VDD_USB.

1.3.1 VCC: Main supply voltage

The VCC pin provides the main supply voltage. During operation, the current drawn by the module can vary by some orders of magnitude, especially if enabling low-power operation modes. For this reason, it is important that the supply circuitry be able to support the peak power for a short time (see the corresponding product data sheet in Related documents for the specifications).

When switching from backup mode to normal operation or at start-up, u-blox NEO-8Q and NEO-M8 series

modules must charge the internal capacitors in the core domain. In certain situations, this can result in a significant current draw. For low power applications using Power Save and backup modes, it is important that the power supply or low ESR capacitors at the module input can deliver this current/charge.

Use a proper GND concept. Do not use any resistors or coils in the power line.

1.3.2 V_BCKP: Backup supply voltage

If the module supply has a power failure, the V_BCKP pin supplies the real-time clock (RTC) and battery backed RAM (BBR). Use of valid time and the GNSS orbit data at start up will improve the GNSS performance, as with hot starts, warm starts, AssistNow Autonomous and AssistNow Offline. If no backup battery is connected, the module performs a cold start at power up.

Avoid high resistance on the V_BCKP line: During the switch from main supply to backup supply, a short

current adjustment peak can cause high voltage drop on the pin with possible malfunctions.

If no backup supply voltage is available, connect the V_BCKP pin to VCC. As long as power is supplied to the NEO-8Q and NEO-M8 series modules through the VCC pin, the backup

battery is disconnected from the RTC and the BBR to avoid unnecessary battery drain (see Figure 1). In this case, VCC supplies power to the RTC and BBR.

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Figure 1: Backup battery and voltage (for exact pin orientation, see the corresponding product data sheet in Related documents)

Real-Time Clock (RTC)

The RTC is driven by a 32 kHz oscillator using an RTC crystal. If the main supply voltage fails, and a battery is connected to V_BCKP, parts of the receiver switch off, but the RTC still runs providing a timing reference for the receiver. This operating mode is called Hardware Backup Mode, which enables all relevant data to be saved in the backup RAM to allow a hot or warm start later

1.3.3 VDD_USB: USB interface power supply

VDD_USB supplies the USB interface. If the USB interface is not used, the VDD_USB pin must be connected to GND. For more information about correctly handling the VDD_USB pin, see section 1.4

1.3.4 VCC_RF: Output voltage RF

The VCC_RF pin can supply an active antenna or external LNA. For more information, see section 2.4.

1.4 Interfaces

1.4.1 UART

The NEO-8Q and NEO-M8 series modules include a Universal Asynchronous Receiver Transmitter (UART) serial interface RXD/TXD supporting configurable baud rates. The baud rates supported are specified in the corresponding product data sheet in Related documents.

The signal output and input levels are 0 V to VCC. An interface based on RS232 standard levels (+/- 12 V) can be implemented using level shifters such as Maxim MAX3232. Hardware handshake signals and synchronous operation are not supported.

Designs must allow access to the UART pin for future service and reconfiguration.

1.4.2 USB

A USB version 2.0 FS (Full Speed, 12 Mbit/s) compatible interface is available for communication as an alternative to the UART. The USB_DP integrates a pull-up resistor to signal a full-speed device to the host. The VDD_USB pin supplies the USB interface.

u-blox provides Microsoft® certified USB drivers for Windows Vista, Windows 7, Windows 8 and Windows 10 operating systems. These drivers are available at our website at www.u-blox.com

USB external components

The USB interface requires some external components to implement the physical characteristics required by the USB 2.0 specification. These external components are shown in Figure 2 and listed in Table 1. To comply with USB specifications, VBUS must be connected through an LDO (U1) to pin VDD_USB on the module.

In USB self-powered mode, the power supply (VCC) can be turned off and the digital block is not powered. In this case, since VBUS is still available, the USB host would still receive the signal indicating that the device is

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Module

VDD_USB

LDO

VDD_USB

USB_DP

USB_DM

C24 C23

VBUS

GND

USB Device Connector

EN R11

Name

Component

Function

Comments

LDO

Regulates VBUS (4.4 …5.25 V)

down to a voltage of 3.3 V.

Almost no current requirement (~1 mA) if the GNSS receiver is operated as a USB self-powered device.

C23, C24

Capacitors

Required according to the specification of LDO U1

Protection diodes

Protect circuit from overvoltage / ESD when connecting.

Use low capacitance ESD protection such as ST Microelectronics USBLC6-2.

R4, R5

Serial termination resistors

Establish a full-speed driver impedance of 28…44 

A value of 27  is recommended.

R11

Resistor

100 k is recommended for USB self-powered setup.

present and ready to communicate. This should be avoided by disabling the LDO (U1) using the enable signal (EN) of the VCC-LDO or the output of a voltage supervisor. Depending on the characteristics of the LDO (U1) it is recommended to add a pull-down resistor (R11) at its output to ensure VDD_USB is not floating if the LDO (U1) is disabled or the USB cable is not connected i.e. VBUS is not supplied.

USB bus-powered mode is not supported.

Figure 2: USB Interface

Table 1: Summary of USB external components

1.4.3 Display Data Channel (DDC)

An I2C compatible Display Data Channel (DDC) interface is available on NEO-8Q and NEO-M8 series modules for serial communication with an external host CPU. The interface only supports operation in slave mode (master mode is not supported). The DDC protocol and electrical interface are fully compatible with the Fast-Mode of the I2C industry standard. DDC pins SDA and SCL have internal pull-up resistors.

For more information about the DDC implementation, see the u-blox 8 / u-blox M8 Receiver Description Including Protocol Specification [4]. For bandwidth information, see the corresponding product data sheet in the Related documents. For timing parameters, consult the I2C-bus specification [7].

The NEO-8Q and NEO-M8 series DDC interface supports serial communication with most u-blox cellular

modules. See the specification of the applicable cellular module to confirm compatibility.

1.4.4 SPI

An SPI interface is available for communication to a host CPU.

SPI is not available in the default configuration, because its pins are shared with the UART and DDC

interfaces. The SPI interface can be enabled by connecting D_SEL to ground. For speed and clock frequency, see the corresponding product data sheet in the Related documents.

1.4.5 TX_READY

The TX_READY function is used to indicate when the receiver has data to transmit. A listener can wait on the TX_READY signal instead of polling the DDC or SPI interfaces. The UBX-CFG-PRT message lets you configure the

polarity and the number of bytes in the buffer before the TX READY signal goes active. The TX_READY function can be mapped to TXD (PIO 06). The TX_READY function is disabled by default.

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The TX_READY functionality can be enabled and configured by AT commands sent to the u-blox cellular

module supporting the feature. For more information, see the GPS Implementation and Aiding Features in u-blox wireless modules [8].

1.5 I/O pins

1.5.1 RESET_N: Reset

Driving RESET_N low activates a hardware reset of the system. Use this pin only to reset the module. Do not use RESET_N to turn the module on and off, since the reset state increases power consumption. With NEO-8Q and NEO-M8 series modules RESET_N is an input only.

The RTC time is also reset (but not BBR)

1.5.2 EXTINT: External interrupt

EXTINT (EXTINT0 on NEO-M8T) is an external interrupt pin with fixed input voltage thresholds with respect to VCC (see the corresponding product data sheet in Related documents for more information). It can be used for

wake-up functions in Power Save Mode on NEO-8Q and NEO-M8 series modules and for aiding. Leave open if unused. The function is disabled by default.

EXTINT1 is an external interrupt pin on NEO-M8T with fixed input voltage thresholds with respect to VCC (see the corresponding product data sheet in Related documents for more information). It can be used for wake-up functions in Power Save Mode on NEO-M8T module and for aiding. Leave open if unused. The function is disabled by default.

Power Control

The power control feature allows overriding the automatic active/inactive cycle of Power Save Mode. The state of the receiver can be controlled through the EXTINT (EXTINT0 on NEO-M8T) pin. The receiver can also be forced OFF using EXTINT (EXTINT0 on NEO-M8T) when Power Save Mode is not active.

Frequency aiding

The EXTINT (EXTINT0 on NEO-M8T) pin can be used to supply time or frequency aiding data to the receiver. For time aiding, hardware time synchronization can be achieved by connecting an accurate time pulse to the

EXTINT (EXTINT0 on NEO-M8T) pin. Frequency aiding can be implemented by connecting a periodic rectangular signal with a frequency up to 500

kHz and arbitrary duty cycle (low/high phase duration must not be shorter than 50 ns) to the EXTINT (EXTINT0 on NEO-M8T) pin. Provide the applied frequency value to the receiver using UBX messages.

1.5.3 SAFEBOOT_N

The SAFEBOOT_N pin is for future service, updates and reconfiguration. On the NEO-M8T module, a configurable TIMEPULSE2 signal can be programmed on TP2/SAFEBOOT_N.

Do not pull low during reset

1.5.4 D_SEL: Interface select

The D_SEL pin selects the available interfaces. SPI cannot be used simultaneously with UART/DDC. If open, UART and DDC are available. If pulled low, the SPI interface is available. See the corresponding product data sheet in the Related documents.

1.5.5 TIMEPULSE (TIMEPULSE1 on NEO-M8T)

On NEO-8Q and NEO-M8 series modules, a configurable time pulse signal is available. By default, the time pulse signal is configured to one pulse per second. For more information, see the u-blox 8 / u-blox M8 Receiver

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Description including Protocol Specification [4]

1.5.6 TIMEPULSE2

On the NEO-M8T module, a configurable TIMEPULSE2 signal can be programmed on TP2/SAFEBOOT_N. For more information, see the u-blox 8 / u-blox M8 Receiver Description including Protocol Specification [4]

The TIMEPULSE2 output must not be held LOW during start-up.

1.5.7 LNA_EN: LNA enable

On NEO-M8N, NEO-M8Q, NEO-M8T and NEO-8Q modules, in Power Save Mode, the system can turn on/off an optional external LNA using the LNA_EN signal in order to optimize power consumption.

Signals: "high" = Turn ON LNA, "low" = Turn OFF LNA

1.6 Electromagnetic interference on I/O lines

Any I/O signal line with a length greater than approximately 3 mm can act as an antenna and may pick up arbitrary RF signals transferring them as noise into the GNSS receiver. This specifically applies to unshielded lines, in which the corresponding GND layer is remote or missing entirely, and lines close to the edges of the printed circuit board.

If, for example, a cellular signal radiates into an unshielded high-impedance line, it is possible to generate noise in the order of volts and not only distort receiver operation but also damage it permanently.

On the other hand, noise generated at the I/O pins will emit from unshielded I/O lines. Receiver performance may be degraded when this noise is coupled into the GNSS antenna (see Figure 15).

To avoid interference by improperly shielded lines, it is recommended to use resistors (e.g. R>20 ), ferrite beads (e.g. BLM15HD102SN1) or inductors (e.g. LQG15HS47NJ02) on the I/O lines in series. These components should be chosen with care because they will affect also the signal rise times.

Figure 3 shows an example of EMI protection measures on the RXD/TXD line using a ferrite bead. For more information, see section 4.3.

Figure 3: EMI Precautions

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2 Design

Function

I/O

Description

Remarks

Power

VCC

23 Supply Voltage

Provide clean and stable supply.

GND

10,12,13 , 24

Ground

Assure a good GND connection to all GND pins of the module, preferably with a large ground plane.

V_BCKP

22 Backup Supply Voltage

It is recommended to connect a backup supply voltage to V_BCKP in order to enable warm and hot start features on the positioning modules. Otherwise, connect to VCC.

VDD_USB

7 USB Power Supply

To use the USB interface, connect this pin to 3.0 – 3.6 V. If no USB serial port used connect to GND.

Antenna

RF_IN

11 I GNSS signal input from antenna

The connection to the antenna must be routed on the PCB. Use a controlled impedance of 50  to connect RF_IN to the antenna or the antenna connector.

VCC_RF

9 O Output Voltage RF section

VCC_RF can be used to power an external active antenna.

UART

TXD / SPI MISO

20 O UART_TX/ SPI MISO

Communication interface, Can be programmed as TX_READY for DDC interface. If pin 2 low => SPI MISO.

RXD / SPI MOSI

21 I UART_RX / SPI MOSI

Serial input. Internal pull-up resistor to VCC. Leave open if not used. If pin 2 low => SPI MOSI.

USB USB_DM

I/O

USB I/O line

USB bidirectional communication pin. Leave open if unused. USB_DP

I/O

USB I/O line

System

TIMEPULSE TIMEPULSE 1 (NEO-M8T)

3 O Timepulse Signal

Configurable Timepulse signal (one pulse per second by default). Leave open if not used.

SAFEBOOT_ N TP2/SAFEB OOT_N

(NEO-M8T)

SAFEBOOT_N

SAFEBOOT_N, leave OPEN

I/O

TP2 / SAFEBOOT_N

Configurable Timepulse2 signal

SAFEBOOT_N, leave open if not used. Do not pull low during reset. EXTINT

4 I External Interrupt

External Interrupt Pin. Internal pull-up resistor to VCC. Leave open if not used. Function is disabled by default.

EXTINT0 (NEO-M8T)

RESERVED

EXTINT1

(NEO-M8T)

Reserved

Leave open.

External Interrupt

External Interrupt Pin. Internal pull-up resistor to VCC. Leave open if not used. Function is disabled by default.

SDA / SPI CS_N

I/O

DDC Data / SPI CS_N

DDC Data If pin 2 low => SPI chip select.

SCL / SPI CLK

19 I DDC Clock / SPI SCK

DDC Clock. If pin 2 low => SPI clock.

LNA_EN

Antenna control can be used to turn on and off an optional external LNA.

RESERVED

(NEO-M8M)

Reserved

Leave open.

RESET_N

8 I Reset input

Reset input

D_SEL

2 I selects the interface

Allow selecting UART/DDC or SPI open-> UART/DDC; low->SPI

RESERVED

16,17

Reserved

Leave open.

2.1 Pin description

NEO-8Q / NEO-M8 - Hardware Integration Manual

Table 2: NEO-8Q and NEO-M8 series Pinout

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Previous Name

New name

ANT_ON

LNA_EN

TxD SPI MISO

TXD / SPI MISO

RxD SPI MOSI

RXD / SPI MOSI

2.1.1 Pin name changes

Selected pin names have been updated to agree with a common naming convention across u-blox modules. The pins have not changed their operation and are the same physical hardware but with updated names. The table below lists the pins that have changed name along with their old and new names.

Table 3: Pin name changes

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2.2 Minimal design

Stencil: 150m

10.4 mm [409.5 mil]

14.6 mm [575 mil]

12.2 mm [480 mil]

0.8 mm [31.5

mil

]

0.6 mm [23.5

mil

]

Figure 5: NEO-8Q and NEO-M8 series paste mask NEO-8Q and NEO-M8 series footprint

12.2 mm [480.3 mil]

16.0 mm [630

mil

]

1.0 mm

[39.3 mil]

0.8 mm [31.5

mil

]

0.8 mm

[31.5

mil

]

3.0 mm [118.1

mil

]

1.0 mm [39.3

mil

]

1.1 mm [43.3

mil

]

This is a minimal design for a NEO-8Q and NEO-M8 series GNSS receiver.

NEO-8Q / NEO-M8 - Hardware Integration Manual

Figure 4: NEO-8Q / NEO-M8 passive antenna design

NEO-M8M can have a passive antenna, but for optimal operation requires an external SAW and LNA, see

Figure 7.

2.3 Layout: Footprint and paste mask

Figure 5 describes the footprint of the NEO-8Q and NEO-M8 series modules and provides recommendations (not specifications) for the paste mask Note that the copper and solder masks have the same size and position.

To improve the wetting of the half vias, reduce the amount of solder paste under the module and increase the volume outside of the module by defining the dimensions of the paste mask to form a T-shape (or equivalent) extending beyond the copper mask. For the stencil thickness, see section 4.2.

Consider the paste mask outline when defining the minimal distance to the next component. The exact

geometry, distances, stencil thicknesses and solder paste volumes must be adapted to the specific production processes (e.g. soldering) of the customer.

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2.4 Antenna

2.4.1 Antenna design with passive antenna

A design using a passive antenna requires more attention to the layout of the RF section. Typically, a passive antenna is located near electronic components; therefore, care should be taken to reduce electrical noise that may interfere with the antenna performance. Passive antennas do not require a DC bias voltage and can be directly connected to the RF input pin RF_IN. Sometimes, they may also need a passive matching network to match the impedance to 50 .

Use an antenna that has sufficient bandwidth to receive all GNSS constellations. See Appendix.

Figure 6 shows a minimal setup for a design with a good GNSS patch antenna. For exact pin orientation, see the corresponding product data sheet in the Related documents.

Figure 6: NEO-M8N / NEO-M8T / NEO-M8Q / NEO-8Q passive antenna design

Figure 7 and Figure 8 show designs using an external LNA and SAW to increase the sensitivity for optimum performance with passive antenna. For exact pin orientation, see the corresponding product data sheet in the Related documents.

Figure 7: NEO-M8M module design with passive antenna and an external LNA and SAW

The VCC_RF output can be used to supply the LNA with a filtered supply voltage.

An external LNA is only required if the antenna is far away. In that case, the LNA must be placed close to

the passive antenna.

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Figure 8: NEO-M8N / NEO-M8Q / NEO-M8T / NEO-8Q module design with passive antenna and an external LNA

The LNA_EN pin (LNA enable) can be used to turn on and off an optional external LNA. The VCC_RF output can be used to supply the LNA with a filtered supply voltage.

A standard GNSS LNA has enough bandwidth to amplify GPS/GLONASS/Galileo/BeiDou signals. An external LNA is only required if the antenna is far away. In that case the LNA must be placed close to the

passive antenna.

2.4.2 Active antenna design

Active antennas have an integrated low-noise amplifier. Active antennas require a power supply that will contribute to the total GNSS system power consumption budget with additional 5 to 20 mA typically.

For maximum external gain see the corresponding product data sheet in Related documents. If the supply voltage of the NEO-8Q / NEO-M8 receiver matches the supply voltage of the antenna (e.g. 3.0 V),

use the filtered supply voltage available at pin VCC_RF as shown in Figure 9. For exact pin orientation, see the corresponding product data sheet in the Related documents.

Active antenna design using VCC_RF pin to supply the active antenna

Figure 9: Active antenna design, external supply from VCC_RF

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If the VCC_RF voltage does not match the supply voltage of the active antenna, use a filtered external supply, as shown in Figure 10. For the exact pin orientation, see the corresponding product data sheet in Related documents.

Active antenna design powered from external supply

Figure 10: Active antenna design, direct external supply

The circuit shown in Figure 10 works with all u-blox M8 modules, and also with modules without VCC_RF

output.

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NEO-6

NEO-8Q and NEO-M8 series

Remarks for Migration

Pin Name

Typical Assignment

Pin Name

Typical Assignment

SAFEBOOT_N

Leave open.

SAFEBOOT_N

Leave open.

No difference

SS_N

SPI Slave Select

D_SEL

selects the interface

-> Various functions, compatible only when not using SPI for communication.

TIMEPULSE 1

Timepulse 1 (1PPS)

TIMEPULSE/ TIMEPULSE1

Timepulse1

No difference

EXTINT0

External Interrupt Pin

EXTINT/ EXTINT0

External Interrupt

No difference

USB_DM

USB Data

USB_DM

USB Data

No difference

USB_DP

USB Data

USB_DP

USB Data

No difference

VDD_USB

USB Supply

VDD_USB

USB Supply

No difference

RESERVED

Pin 8 and 9 must be connected together.

RESET_N

Reset

If pin 8 is connected directly to pin 9, the RESET_N function is not available. If the RESET_N function shall be used, a 3k3 resistor from pin 8 to pin 9 in conjunction with an open drain buffer is required for u-blox 6. For NEO-8Q / NEO-M8 modules pin 8 can be connected to pin 9 or can be left open. Do not populate the 3k3 resistor. Behavior of RESET_N has changed; For u-blox 7 and M8, a RESET_N will erase the time information in the BBR, which has maintained in u-blox 6. Therefore, with u-blox 7 and M8 a RESET_N will not result in a hot start, etc.

VCC_RF

Can be used for active antenna or external LNA supply.

VCC_RF

Can be used for active antenna or external LNA supply.

No difference

GND

No difference

RF_IN

GNSS signal input

RF_IN

GNSS signal input

No difference

GND

No difference

GND

No difference

MOSI/ CFG_COM0

SPI MOSI / Configuration Pin. Leave open if not used.

LNA_EN

Used to turn on and off an optional external LNA

LNA_EN (Active Antenna Control) can be used to turn on and off an optional external LNA.

-> Different functions, no SPI MOSI and configuration pins with NEO-8Q / NEO-M8. If not used as default configuration, it must be set using software command! It is not possible to migrate from NEO-6 to NEO8Q / NEO-M8, if NEO-6 pin 14 is connected to GND. In this case, migrate to NEO-M8M!

3 Migration to u-blox 8 / M8 modules

3.1 Migrating u-blox 7 designs to NEO-8Q and NEO-M8 series modules

u-blox is committed to ensuring that products in the same form factor are backwards compatible over several technology generations. Utmost care has been taken to ensure there is no negative impact on function or performance and to make NEO-8Q and NEO-M8 series modules as fully compatible as possible with u-blox 7 modules. If using BeiDou, check the bandwidth of the external RF components and the antenna. For information about power consumption, see the corresponding product data sheet in the Related documents.

It is highly advisable that customers consider a design review with the u-blox support team to ensure the compatibility of key functionalities.

Selected pin names have been updated to agree with a common naming convention across u-blox modules.

The pins have not changed their operation and are the same physical hardware but with updated names.

3.2 Hardware migration NEO-6 -> NEO-8Q and NEO-M8 series

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NEO-6

NEO-8Q and NEO-M8 series

Remarks for Migration

Pin Name

Typical Assignment

Pin Name

Typical Assignment

MISO/ CFG_COM1

SPI MISO / Configuration Pin. Leave open if not used.

RESERVED

Leave open.

CFG_GPS0/ SCK

Power Mode Configuration Pin / SPI Clock. Leave open if not used.

RESERVED

Leave open.

RESERVED

Leave open.

RESERVED

Leave open.

No difference

SDA

DDC Data

SDA

DDC Data / SPI CS_N

No difference for DDC. If pin 2 low = SPI chip

select

SCL

DDC Clock

SCL

DDC Clock / SPI SCK

No difference for DDC. If pin 2 low = SPI clock

TxD

Serial Port TXD

UART_TX / SPI MISO

No difference for UART. If pin 2 low = SPI MISO

RxD

Serial Port RXD

UART_RX / SPI MOSI

No difference for UART. If pin 2 low = SPI MOSI

V_BCKP

Backup Supply Voltage

V_BCKP

Backup Supply Voltage

Check current in Data Sheet If on u-blox 6 module this was connected to GND, no problem to do the same in u-blox M8/8.

VCC

Supply voltage NEO6Q/M/P/V/T:

2.7 – 3.6 V

VCC

Supply voltage NEO-8Q / NEOM8:

2.7 – 3.6 V

No difference

GND

No difference

Table 4: Pin-out comparison NEO-6 vs. NEO-8Q and NEO-M8 series

Make sure that the RF path (antenna and filtering) matches that of the GNSS constellations used.

3.3 Software migration

For an overall description of the module software operation, see the u-blox 8 / u-blox M8 Receiver

Description including Protocol Specification [4]

For migration, see the u-blox M8 FW SPG3.01 Migration Guide [9].

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4 Product handling

4.1 Packaging, shipping, storage and moisture preconditioning

For information pertaining to reels and tapes, Moisture Sensitivity levels (MSL), shipment and storage information, as well as drying for preconditioning see the corresponding product data sheet in the Related documents.

Population of Modules

When populating the modules, make sure that the pick and place machine is aligned to the copper pins of

the module and not on the module edge.

4.2 Soldering

Soldering paste

Use of “No Clean” soldering paste is highly recommended, as it does not require cleaning after the soldering process has taken place. The paste listed in the example below meets these criteria.

Soldering Paste: OM338 SAC405 / Nr.143714 (Cookson Electronics) Alloy specification: Sn 95.5/ Ag 4/ Cu 0.5 (95.5% Tin/ 4% Silver/ 0.5% Copper) Melting Temperature: +217 °C Stencil Thickness: see section 2.3 The final choice of the soldering paste depends on the approved manufacturing procedures. The paste-mask geometry for applying soldering paste should meet the recommendations.

The quality of the solder joints on the connectors (’half vias’) should meet the appropriate IPC specification.

Reflow soldering

A convection type-soldering oven is highly recommended over the infrared type radiation oven.

Convection heated ovens allow precise control of the temperature, and all parts will heat up evenly, regardless of material properties, thickness of components and surface color.

As a reference, see the “IPC-7530 Guidelines for temperature profiling for mass soldering (reflow and wave) processes”, published in 2001.

Preheat phase

During the initial heating of component leads and balls, residual humidity will be dried out. Note that this preheat phase will not replace prior baking procedures.

 Temperature rise rate: max. 3 °C/s. If the temperature rise is too rapid in the preheat phase it may cause

excessive slumping.

 Time: 60 – 120 s. If the preheat is insufficient, rather large solder balls tend to be generated. Conversely, if

performed excessively, fine balls and large balls will be generated in clusters.

 End Temperature: 150 – 200 °C. If the temperature is too low, non-melting tends to be caused in areas

containing large heat capacity.

Heating/ Reflow phase

The temperature rises above the liquidus temperature of 217 °C. Avoid a sudden rise in temperature as the slump of the paste could become worse.

 Limit time above 217 °C liquidus temperature: 40 – 60 s  Peak reflow temperature: 245 °C

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Cooling phase

A controlled cooling avoids negative metallurgical effects (solder becomes more brittle) of the solder and possible mechanical tensions in the products. Controlled cooling helps to achieve bright solder fillets with a good shape and low contact angle.

 Temperature fall rate: max 4 °C/s

To avoid falling off, the u-blox module should be placed on the topside of the motherboard during

soldering.

The final soldering temperature chosen at the factory depends on additional external factors like choice of soldering paste, size, thickness and properties of the base board, etc. Exceeding the maximum soldering temperature in the recommended soldering profile may permanently damage the module.

Figure 11: Recommended soldering profile

u-blox modules must not be soldered with a damp heat process.

Optical inspection

After soldering the u-blox module, consider an optical inspection step to check whether:

 The module is properly aligned and centered over the pads  All pads are properly soldered  No excess solder has created contacts to neighboring pads, or possibly to pad stacks and vias nearby

Cleaning

In general, cleaning the populated modules is strongly discouraged. Residues underneath the modules cannot be easily removed with a washing process.

 Cleaning with water will lead to capillary effects where water is absorbed in the gap between the baseboard

and the module. The combination of residues of soldering flux and encapsulated water leads to short circuits or resistor-like interconnections between neighboring pads.

 Cleaning with alcohol or other organic solvents can result in soldering flux residues flooding into the two

housings, areas that are not accessible for post-wash inspections. The solvent will also damage the sticker and the ink-jet printed text.

 Ultrasonic cleaning will permanently damage the module, in particular the quartz oscillators.

The best approach is to use a “no clean” soldering paste and eliminate the cleaning step after the soldering.

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Repeated reflow soldering

Only single reflow soldering processes are recommended for boards populated with u-blox modules. u-blox modules should not be submitted to two reflow cycles on a board populated with components on both sides in order to avoid upside down orientation during the second reflow cycle. In this case, the module should always be placed on that side of the board, which is submitted into the last reflow cycle. The reason for this (besides others) is the risk of the module falling off due to the significantly higher weight in relation to other components.

Two reflow cycles can be considered by excluding the above described upside down scenario and taking into account the rework conditions described in section Product handling.

Repeated reflow soldering processes and soldering the module upside down are not recommended.

Wave soldering

Base boards with combined through-hole technology (THT) components and surface-mount technology (SMT) devices require wave soldering to solder the THT components. Only a single wave soldering process is encouraged for boards populated with u-blox modules.

Hand soldering

Hand soldering is allowed. Use a soldering iron temperature setting equivalent to 350 °C. Place the module precisely on the pads. Start with a cross-diagonal fixture soldering (e.g. pins 1 and 15), and then continue from left to right.

Rework

The u-blox module can be unsoldered from the baseboard using a hot air gun. When using a hot air gun for unsoldering the module, a maximum of one reflow cycle is allowed. In general, we do not recommend using a hot air gun because this is an uncontrolled process and might damage the module.

Attention: use of a hot air gun can lead to overheating and severely damage the module. Always

avoid overheating the module.

After the module is removed, clean the pads before placing and hand soldering a new module.

Never attempt a rework on the module itself, e.g. replacing individual components. Such actions

immediately terminate the warranty.

In addition to the two reflow cycles, manual rework on particular pins by using a soldering iron is allowed. Manual rework steps on the module can be done several times.

Conformal coating

Certain applications employ a conformal coating of the PCB using HumiSeal® or other related coating products. These materials affect the HF properties of the GNSS module and it is important to prevent them from flowing into the module. The RF shields do not provide 100% protection for the module from coating liquids with low viscosity; therefore, care is required in applying the coating.

Conformal Coating of the module will void the warranty.

Casting

If casting is required, use viscose or another type of silicon pottant. The OEM is strongly advised to qualify such processes in combination with the u-blox module before implementing this in the production.

Casting will void the warranty.

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Grounding metal covers

Attempts to improve grounding by soldering ground cables, wick or other forms of metal strips directly onto the EMI covers is done at the customer’s own risk. The numerous ground pins should be sufficient to provide optimum immunity to interferences and noise.

u-blox makes no warranty for damages to the modules caused by soldering metal cables or any other forms

of metal strips directly onto the EMI covers.

Use of ultrasonic processes

Some components on the modules are sensitive to Ultrasonic Waves. Use of any Ultrasonic Processes (cleaning, welding etc.) may cause damage to the GNSS Receiver.

u-blox offers no warranty against damages to the modules caused by any Ultrasonic Processes.

4.3 EOS/ESD/EMI precautions

When integrating GNSS positioning modules into wireless systems, careful consideration must be given to electromagnetic and voltage susceptibility issues. Wireless systems include components that can produce Electrical Overstress (EOS) and Electro-Magnetic Interference (EMI). CMOS devices are more sensitive to such influences because their failure mechanism is defined by the applied voltage, whereas bipolar semiconductors are more susceptible to thermal overstress. The following design guidelines are provided to help in designing robust yet cost effective solutions.

To avoid overstress damage during production or in the field it is essential to observe strict

EOS/ESD/EMI handling and protection measures.

To prevent overstress damage at the RF_IN of your receiver, never exceed the maximum input

power (see the corresponding product data sheet in the Related documents).

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 Unless there is a galvanic coupling between the local GND (i.e. the

work table) and the PCB GND, then the first point of contact when handling the PCB must always be between the local GND and PCB GND.

 Before mounting an antenna patch, connect ground of the device

 When handling the RF pin, do not come into contact with any

charged capacitors and be careful when contacting materials that can develop charges (e.g. patch antenna ~10 pF, coax cable ~50 – 80 pF/m, soldering iron, …)

 To prevent electrostatic discharge through the RF input, do not

touch any exposed antenna area. If there is any risk that such exposed antenna area is touched in non ESD protected work area, implement proper ESD protection measures in the design.

 When soldering RF connectors and patch antennas to the receiver’s

RF pin, make sure to use an ESD safe soldering iron (tip).

Electrostatic discharge (ESD)

Electrostatic discharge (ESD) is the sudden and momentary electric current that flows between two objects at different electrical potentials caused by direct contact or induced by an electrostatic field. The term is usually used in the electronics and other industries to describe momentary unwanted currents that may cause damage to electronic equipment.

ESD handling precautions

ESD prevention is based on establishing an Electrostatic Protective Area (EPA). The EPA can be a small working station or a large manufacturing area. The main principle of an EPA is that there are no highly charging materials near ESD sensitive electronics, all conductive materials are grounded, workers are grounded, and charge build-up on ESD sensitive electronics is prevented. International standards are used to define typical EPA and can be obtained for example from International Electrotechnical Commission (IEC) or American National Standards Institute (ANSI).

GNSS positioning modules are sensitive to ESD and require special precautions when handling. Particular care must be exercised when handling patch antennas, due to the risk of electrostatic charges. In addition to standard ESD safety practices, the following measures should be taken into account whenever handling the receiver.

Failure to observe these precautions can result in severe damage to the GNSS module!

ESD protection measures

GNSS positioning modules are sensitive to Electrostatic Discharge (ESD). Special precautions are

required when handling.

For more robust designs, employ additional ESD protection measures. Using an LNA with appropriate ESD

rating can provide enhanced GNSS performance with passive antennas and increases ESD protection.

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Small passive antennas (<2 dBic and performance critical)

Passive antennas (>2 dBic or performance sufficient)

Active antennas

RF_IN

GNSS

Receiver

LNA

RF_IN

GNSS

Receiver

RF_IN

GNSS

Receiver

LNA with appropriate ESD rating

Most defects caused by ESD can be prevented by following strict ESD protection rules for production and handling. When implementing passive antenna patches or external antenna connection points, then additional ESD measures can also avoid failures in the field as shown in Figure 12.

Figure 12: ESD Precautions

Protection measure A is preferred because it offers the best GNSS performance and best level of ESD

protection.

Electrical Overstress (EOS)

Electrical Overstress (EOS) usually describes situations when the maximum input power exceeds the maximum specified ratings. EOS failure can happen if RF emitters are close to a GNSS receiver or its antenna. EOS causes damage to the chip structures. If the RF_IN is damaged by EOS, it is hard to determine whether the chip structures have been damaged by ESD or EOS.

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Small passive antennas (<2 dBic and performance critical)

Passive antennas (>2 dBic or performance sufficient)

Active antennas (without internal filter which need the module antenna supervisor circuits)

RF_IN

GNSS

Receiver

LNA

GPS

Bandpass

Filtler

RF_IN

GNSS

Receiver

GPS

Bandpass

Filtler

LNA with appropriate ESD rating and maximum input power

GNSS Band pass Filter: SAW or Ceramic with low insertion loss and appropriate ESD rating

EOS protection measures

For designs with GNSS positioning modules and wireless (e.g. cellular) transceivers in close proximity, ensure

sufficient isolation between the wireless and GNSS antennas. If wireless power output causes the specified maximum power input at the GNSS RF_IN to be exceeded, employ EOS protection measures to prevent overstress damage.

For robustness, EOS protection measures as shown in Figure 13 are recommended for designs combining wireless communication transceivers (e.g. cellular) and GNSS in the same design or in close proximity.

Figure 13: EOS and ESD Precautions

Electromagnetic interference (EMI)

Electromagnetic interference (EMI) is the addition or coupling of energy causing a spontaneous reset of the GNSS receiver or resulting in unstable performance. In addition to EMI degradation due to self-jamming (see section 1.5) any electronic device near the GNSS receiver can emit noise that can lead to EMI disturbances or damage.

The following elements are critical regarding EMI:

 Unshielded connectors (e.g. pin rows etc.)  Weakly shielded lines on PCB (e.g. on top or bottom layer and especially at the border of a PCB)  Weak GND concept (e.g. small and/or long ground line connections)

EMI protection measures are recommended when RF emitting devices are near the GNSS receiver. To minimize the effect of EMI a robust grounding concept is essential. To achieve electromagnetic robustness follow the standard EMI suppression techniques.

http://www.murata.com/products/emc/knowhow/index.html http://www.murata.com/products/emc/knowhow/pdf/4to5e.pdf Improved EMI protection can be achieved by inserting a resistor or better yet a ferrite bead or an inductor (see

Table 6) into any unshielded PCB lines connected to the GNSS receiver. Place the resistor as close as possible to the GNSS receiver pin.

Alternatively, feed-thru capacitors with good GND connection can be used to protect e.g. the VCC supply pin against EMI. A selection of feed-thru capacitors are listed in Table 6.

Intended use

In order to mitigate any performance degradation of a radio equipment under EMC disturbance, system

integration shall adopt appropriate EMC design practice and not contain cables over three meters on signal and supply ports.

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1525 1550 1625

GPS input filter characteristics

1575 1600

-110

Jammin g signal

1525 1550 1625

Frequency [MHz]

Power [dBm]

GPS input filter characteristics

1575 1600

Jamming

signal

GPS

signals

GPS Carrier

1575.4 MHz

4.4 Applications with cellular modules

GSM terminals transmit power levels up to 2 W (+33 dBm) peak, 3G and LTE up to 250 mW continuous. Consult the corresponding product data sheet in Related documents for the absolute maximum power input at the GNSS receiver.

See the GPS Implementation and Aiding Features in u-blox wireless modules [8].

Isolation between GNSS and cellular antenna

In a handheld type design, an isolation of approximately 20 dB can be reached with careful placement of the antennas. If such isolation cannot be achieved, e.g. in the case of an integrated cellular /GNSS antenna, an additional input filter is needed on the GNSS side to block the high energy emitted by the cellular transmitter. Examples of these kinds of filters would be the SAW Filters from Epcos (B9444 or B7839) or Murata.

Increasing interference immunity

Interference signals come from in-band and out-band frequency sources.

In-band interference

With in-band interference, the signal frequency is very close to the GNSS constellation frequency used, e.g. GPS frequency of 1575 MHz (see Figure 14). Such interference signals are typically caused by harmonics from displays, micro-controller, bus systems, etc.

Figure 14: In-band interference signals

Figure 15: In-band interference sources

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Measures against in-band interference include:

 Maintaining a good grounding concept in the design  Shielding  Layout optimization  Filtering  Placement of the GNSS antenna  Adding a CDMA, cellular, WCDMA band pass filter before handset antenna

Out-band interference

Out-band interference is caused by signal frequencies that are different from the GNSS carrier (see Figure 16). The main sources are wireless communication systems such as cellular, CDMA, WCDMA, Wi-Fi, BT, etc.

Figure 16: Out-band interference signals

Measures against out-band interference include maintaining a good grounding concept in the design and adding a SAW or band pass ceramic filter (as recommend in section 4) into the antenna input line to the GNSS receiver (see Figure 17).

Figure 17: Measures against out-band interference

For design-in recommendations in combination to cellular operation see the Appendix See the GPS Implementation and Aiding Features in u-blox wireless modules [8]

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Appendix

Abbreviation

Definition

ANSI

American National Standards Institute

BeiDou

Chinese navigation satellite system

CDMA

Code Division Multiple Access

EMC

Electromagnetic compatibility

EMI

Electromagnetic interference

EOS

Electrical Overstress

EPA

Electrostatic Protective Area

ESD

Electrostatic discharge

Galileo

European navigation system

GLONASS

Russian satellite system

GND

Ground

GNSS

Global Navigation Satellite System

GPS

Global Positioning System

GSM

Global System for Mobile Communications

IEC

International Electrotechnical Commission

PCB

Printed circuit board

QZSS

Quasi-Zenith Satellite System

A Glossary

NEO-8Q / NEO-M8 - Hardware Integration Manual

Table 5: Explanation of abbreviations used

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Part

Manufacturer

Part ID

Remarks

Parameters to consider

Diode ON Semiconductor

ESD9R3.3ST5G

Standoff Voltage>3.3 V

Low Capacitance < 0.5 pF

ESD9L3.3ST5G

Standoff Voltage>3.3 V

Standoff Voltage > Voltage for active antenna

ESD9L5.0ST5G

Standoff Voltage>5 V

Low Inductance

SAW

TDK/ EPCOS

B8401: B39162-B8401-P810

GPS+GLONASS

High attenuation

TDK/ EPCOS

B3913: B39162B3913U410

GPS+GLONASS+BeiDou

For automotive application

TDK/ EPCOS

B4310: B39162B4310P810

GPS+GLONASS

Compliant to the AEC-Q200 standard

ReyConns

NDF9169

GPS+ BeiDou

Low insertion loss, Only for mobile application

muRata

SAFFB1G56KB0F0A

GPS+GLONASS+BeiDou

Low insertion loss, Only for mobile application

muRata

SAFEA1G58KB0F00

GPS+GLONASS

Low insertion loss, only for mobile application

muRata

SAFEA1G58KA0F00

GPS+GLONASS

High attenuation, only for mobile application

muRata

SAFFB1G58KA0F0A

GPS+GLONASS

High attenuation, only for mobile application

muRata

SAFFB1G58KB0F0A

GPS+GLONASS

Low insertion loss, Only for mobile application

TAI-SAW

TA1573A

GPS+GLONASS

Low insertion loss

TAI-SAW

TA1343A

GPS+GLONASS+BeiDou

Low insertion loss

TAI-SAW

TA0638A

GPS+GLONASS+BeiDou

Low insertion loss

LNA

JRC

NJG1143UA2

LNA

Low noise figure, up to 15 dBm RF input power

Inductor

Murata

LQG15HS27NJ02

L, 27 nH

Impedance @ freq GPS > 500 

Capacitor Murata

GRM1555C1E470JZ01

DC-block

, 47 pF

DC-block

Murata

X7R 10N 10% 16V

Bias

, 10nF

Bias-T

Ferrite Bead

Murata

BLM15HD102SN1

High IZI @ fGSM

Feed thru Capacitor for Signal

Murata

NFL18SP157X1A3

Monolithic Type

For data signals, 34 pF load capacitance

NFA18SL307V1A45

Array Type

For data signals, 4 circuits in 1 package

Feed thru Capacitor

Murata

NFM18PC …. NFM21P….

0603 2A 0805 4A

Rs < 0.5 

Resistor

10   10%, min 0.250 W

bias

560   5%

100 k  5%

R3, R4

Manufacturer

Order No.

Comments

Hirschmann (www.hirschmann-car.com)

GLONASS 9 M

GPS+GLONASS active

Taoglas (www.taoglas.com )

AA.160.301111

36*36*4 mm, 3-5 V 30mA active

Taoglas (www.taoglas.com )

AA.161.301111

36*36*3 mm, 1.8 to 5.5 V / 10 mA at 3 V active

INPAQ (www.inpaq.com.tw)

B3G02G-S3-01-A

2.7 to 3.9 V / 10 mA active

Amotech (www.amotech.co.kr)

B35-3556920-2J2

35x35x3 mm GPS+GLONASS passive

Amotech (www.amotech.co.kr)

A25-4102920-2J3

25x25x4 mm GPS+GLONASS passive

Amotech (www.amotech.co.kr)

A18-4135920-AMT04

18x18x4 mm GPS+GLONASS passive

Amotech (www.amotech.co.kr)

Amotech AGA363913S0-A1

GPS+GLONASS+ BeiDou active INPAQ (www.inpaq.com.tw)

ACM4-5036-A1-CC-S

5.2 x 3.7 x 0.7 mm GPS+GLONASS passive

Additional antenna Manufacturer: Allis Communications, 2J, Tallysman Wireless

B Recommended parts

Recommended parts are selected on data sheet basis only. Other components may also be used.

Table 6: Recommended parts

Recommended antennas

Table 7: Recommend antenna

UBX-15029985 - R04 Production Information Appendix

Page 29 of 31

NEO-8Q / NEO-M8 - Hardware Integration Manual

Revision

Date

Name

Status / Comments

R01

28-Jan-2016

jfur

Advance Information

R02

17-May-2016

jfur

Pin name updated (Table 2 and Table 4, section 1.5.2, section 1.5.5 and section 1.5.7), added NEO-M8M, NEO-M8Q, NEO-M8T and NEO-8Q variants.

R03

08-Aug-2016

jfur

Production Information

R04

11-Nov-2017

msul

Added Information on RED DoC in the European Union regulatory compliance section (page 2); added Intended use case for EMI in section 4.3 EOS/ESD/EMI precautions; updated legal statement on the cover page and added Documentation feedback e-mail address in contacts page.

u-blox NEO-8Q Series, NEO-M8 Series, NEO-M8T, NEO-M8N, NEO-8Q Hardware Integration Manual

Specifications and Main Features

Frequently Asked Questions

User Manual