u-blox MPCI-L2 User Manual

UBX-13004749 - R26 C1-Public www.u-blox.com

MPCI-L2 series

Multi-mode LTE Cat 4 Mini PCIe modules with HSPA+ and/or 2G fallback

Data sheet

Abstract

Technical data sheet describing MPCI-L2 series multi-mode cellular modules. The modules are a complete and cost efficient LTE/3G/2G multi-mode solution offering up to 150 Mbit/s download data rate and up to 50 Mbit/s upload data rate. The different variants offer a selection of coverage of up to six LTE bands, up to five WCDMA/DC-HSPA+ bands and up to four GSM/EGPRS bands. The modules have the industry standard PCI Express Mini Card form factor, which enables easy integration into an application board and is also ideal for manufacturing of small series.

MPCI-L2 series - Data sheet

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Document information

Title

MPCI-L2 series

Subtitle

Multi-mode LTE Cat 4 Mini PCIe modules with HSPA+ and/or 2G fallback

Document type

Data sheet

Document number

UBX-13004749

Revision and date

R26

09-Dec-2020

Disclosure restriction

C1-Public

Product status

Corresponding content status

Functional Sample

Draft

For functional testing. Revised and supplementary data will be published later.

In development / Prototype

Objective specification

Target values. Revised and supplementary data will be published later.

Engineering sample

Advance information

Data based on early testing. Revised and supplementary data will be published later.

Initial production

Early production information

Data from product verification. Revised and supplementary data may be published later.

Mass production / End of life

Production information

Document contains the final product specification.

MPCI-L2 series - Data sheet

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This document applies to the following products:

Product name

Type number

Modem version

Application version

PCN reference

Product status

MPCI-L200

MPCI-L200-00S-00

09.71

A01.15

UBX-14044437

Obsolete

MPCI-L200-00S-01

09.71

A01.30

UBX-16026448

Obsolete

MPCI-L200-02S-00

15.90

A01.00

UBX-15029946

Obsolete

MPCI-L200-02S-01

15.90

A01.10

UBX-16031212

End of life

MPCI-L200-03S-00

15.90

A01.50

UBX-17022983

Obsolete

15.90

A01.52

UBX-19058317

Mass production

MPCI-L201

MPCI-L201-01S-00

09.93

A01.07

UBX-18012849

End of life

MPCI-L201-02S-00

09.93 For Verizon: 09.94

A02.50 For Verizon: A01.02

UBX-17013932

End of life

09.93 For Verizon: 10.04

A02.52 For Verizon: A01.01

UBX-19058317

End of life

MPCI-L201-02S-01

20.03 For Verizon: 20.03

A01.02 For Verizon: A01.02

UBX-19000820

End of life

20.03 For Verizon: 20.04

A01.04 For Verizon: A01.00

UBX-19058317

End of life MPCI-L201-02S-02

20.06

A01.00

UBX-20036068

Mass production

MPCI-L210

MPCI-L210-00S-00

09.71

A01.15

UBX-14044437

Obsolete

MPCI-L210-02S-00

15.63

A01.03

UBX-15029946

Obsolete

MPCI-L210-02S-01

15.63

A01.10

UBX-16031212

Obsolete

MPCI-L210-03S-00

15.63

A01.50

UBX-17022983

End of life

15.63

A01.52

UBX-19058317

End of life

MPCI-L210-03S-01

16.19

A01.04

UBX-20027569

Mass production

MPCI-L210-60S-00

09.94

A01.00

UBX-15021694

Obsolete

MPCI-L210-60S-01

09.94

A01.01

UBX-19042394

End of life

09.94

A01.08

UBX-19058317

End of life

MPCI-L210-63S-00

09.94

A01.07

UBX-20009693

Mass production

MPCI-L220

MPCI-L220-02S-00

15.93

A01.00

UBX-16025501

Obsolete

15.93

A01.04

UBX-19058317

Mass production

MPCI-L220-62S-00

16.04

A01.00

UBX-17013073

Obsolete

16.04

A01.02

UBX-19058317

Mass production

MPCI-L280

MPCI-L280-02S-00

15.63

A01.03

UBX-15029946

Obsolete

MPCI-L280-02S-01

15.63

A01.10

UBX-16031212

End of life

MPCI-L280-03S-00

15.63

A01.50

UBX-17022983

Obsolete

15.63

A01.52

UBX-19058317

Mass production

u-blox or third parties may hold intellectual property rights in the products, names, logos and designs included in this document. Copying, reproduction, modification or disclosure to third parties of this document or any part thereof is only permitted with the express written permission of u-blox. The information contained herein is provided “as is” and u-blox assumes no liability for its use. No warranty, either express or implied, is given, including but not limited to, with respect to the accuracy, correctness, reliability and fitness for a particular purpose of the information. This document may be revised by u-blox at any time without notice. For the most recent documents, visit www.u-blox.com. Copyright © u-blox AG.

MPCI-L2 series - Data sheet

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1 Functional description

1.1 Overview

The MPCI-L2 series comprises complete and cost efficient LTE/3G/2G multi-mode cellular modules in the industry standard PCI Express Mini Card form factor, which enables an easy integration into an application board and it is also ideal for manufacturing of small series.

MPCI-L2modules support up to six LTE bands, up to five UMTS/DC-HSPA+ bands and up to four GSM/(E)GPRS bands for data transmission over different regions and network operators.

With LTE Category 4 data rates of 150 Mb/s (downlink) and 50 Mb/s (uplink), the modules are ideal for applications requiring the highest data-rates and high-speed internet access.

Typical applications are industrial computing, ruggedized terminals, video communications, wireless routers, alarm panels and surveillance, digital signage and payment systems.

1.2 Product features

Model

LTE

UMTS

GSM

Interfaces

Audio

Features

Grade

LTE FDD category Bands HSDPA category HSUPA category Bands GNSS via modem (E)GPRS multi

-slot class

Bands UART

USB 2.0 SDIO (Master)

DDC (I

2C)

GPIOs Analog audio Digital audio Network indication Antenna supervisor MIMO 2x2 / Rx Diversity Remote SIM Access Profile

Embedded TCP/UDP stack Embedded HTTP, FTP FOTA

Dual stack IPv4/IPv6

Standard Professional Automotive

MPCI-L200

4

2,4,5

7,17

24

6

1,2,4

5,8

●

12

Quad

●

● ●

■ ■ ■

●

MPCI-L201

4

2,4,5

13,17

24 6 2,5 ● ● ● ● ● ● ● ● ●

MPCI-L210 1

4

1,3,5

7,8,20

24

6

1,2 5,8

●

12

Quad

● ● ● ■ ■ ■ ● ●

MPCI-L220 2

4

1,3,5

6,8,19

24

6

1,6

8,19

●

● ●

● ● ●

●

MPCI-L280

4

1,3,5

7,8,28

24

6

1,2 5,8

●

12

Quad

●

● ●

● ● ●

●

● = supported by all product versions ■ = supported by all product versions except versions “00”, “60”, “63"

Table 1: MPCI-L2 series main features summary

1

MPCI-L210-63S product version does not support LTE band 20

2

MPCI-L220-62S product version does not support UMTS Radio Access Technology

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1.3 Block diagram

As described in Figure 1, each MPCI-L2 series module integrates one TOBY-L2 series module, which represents the core of the device, providing the related LTE/3G/2G modem and processing functionalities. Additional signal conditioning circuitry is implemented for PCI Express Mini Card compliance, and two U.FL connectors are available for easy antennas integration.

ANT1

SIM

USB

W_DISABLE#

TOBY-L2

series

Signal

conditioning

ANT2

PERST#

LED_WWAN#

U.FL

3.3Vaux (Supply)

Boost

converter

VCC

Figure 1: MPCI-L2 series block diagram

1.4 Product description

MPCI-L2 series modules provide 4G LTE, 3G WCDMA/DC-HSPA+, 2G GSM/(E)GPRS multi-mode technology:

• MPCI-L200 and MPCI-L201 are mainly designed for operation in America

• MPCI-L210 is mainly designed for operation in Europe, Asia and other countries

• MPCI-L220 is mainly designed for operation in Japan

• MPCI-L280 is mainly designed for operation in south-east Asia and Oceania

4G LTE

3G UMTS/HSDPA/HSUPA

2G GSM/GPRS/EDGE

3GPP Release 9 Long Term Evolution (LTE) Evolved UTRA (E-UTRA) Frequency Division Duplex (FDD) DL Multi-Input Multi-Output (MIMO) 2x2

3GPP Release 8 Dual-Cell HS Packet Access (DC-HSPA+) UMTS Terrestrial Radio Access (UTRA) Frequency Division Duplex (FDD) DL Rx diversity

3GPP Release 8 Enhanced Data rate GSM Evolution (EDGE) GSM EGPRS Radio Access (GERA) Time Division Multiple Access (TDMA) DL Advanced Rx Performance Phase 1

Band support 3:

• MPCI-L200:

• Band 17 (700 MHz)

• Band 5 (850 MHz)

• Band 4 (1700 MHz)

• Band 2 (1900 MHz)

• Band 7 (2600 MHz)

Band support:

• MPCI-L200:

• Band 5 (850 MHz)

• Band 8 (900 MHz)

• Band 4 (AWS, i.e. 1700 MHz)

• Band 2 (1900 MHz)

• Band 1 (2100 MHz)

Band support:

• MPCI-L200:

• GSM 850 MHz

• E-GSM 900 MHz

• DCS 1800 MHz

• PCS 1900 MHz

• MPCI-L201:

• Band 17 (700 MHz)

• Band 13 (750 MHz)

• Band 5 (850 MHz)

• Band 4 (1700 MHz)

• Band 2 (1900 MHz)

• MPCI-L201:

• Band 5 (850 MHz)

• Band 2 (1900 MHz)

3

MPCI-L2 series modules support all the E-UTRA channel bandwidths for each operating band as per 3GPP TS 36.521-1 [11].

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4G LTE

3G UMTS/HSDPA/HSUPA

2G GSM/GPRS/EDGE

• MPCI-L210 4:

• Band 20 (800 MHz)

• Band 5 (850 MHz)

• Band 8 (900 MHz)

• Band 3 (1800 MHz)

• Band 1 (2100 MHz)

• Band 7 (2600 MHz)

• MPCI-L210:

• Band 5 (850 MHz)

• Band 8 (900 MHz)

• Band 2 (1900 MHz)

• Band 1 (2100 MHz)

• MPCI-L210:

• GSM 850 MHz

• E-GSM 900 MHz

• DCS 1800 MHz

• PCS 1900 MHz

• MPCI-L220:

• Band 19 (850 MHz)

• Band 6 (850 MHz)

• Band 5 (850 MHz)

• Band 8 (900 MHz)

• Band 3 (1800 MHz)

• Band 1 (2100 MHz)

• MPCI-L220 5:

• Band 19 (850 MHz)

• Band 6 (850 MHz)

• Band 8 (900 MHz)

• Band 1 (2100 MHz)

• MPCI-L280:

• Band 28 (750 MHz)

• Band 5 (850 MHz)

• Band 8 (900 MHz)

• Band 3 (1800 MHz)

• Band 1 (2100 MHz)

• Band 7 (2600 MHz)

• MPCI-L280:

• Band 5 (850 MHz)

• Band 8 (900 MHz)

• Band 2 (1900 MHz)

• Band 1 (2100 MHz)

• MPCI-L280:

• GSM 850 MHz

• E-GSM 900 MHz

• DCS 1800 MHz

• PCS 1900 MHz

LTE Power Class

• Class 3 (23 dBm)

for LTE mode

WCDMA/HSDPA/HSUPA Power Class

• Class 3 (24 dBm)

for UMTS/HSDPA/HSUPA mode

GSM/GPRS (GMSK) Power Class

• Class 4 (33 dBm) in GSM/E-GSM band

• Class 1 (30 dBm) in DCS/PCS band

EDGE (8-PSK) Power Class

• Class E2 (27 dBm) in GSM/E-GSM band

• Class E2 (26 dBm) in DCS/PCS band

Data rate

• LTE category 4:

up to 150 Mb/s DL, 50 Mb/s UL

Data rate

• MPCI-L200, MPCI-L201:

• HSDPA cat.14, up to 21 Mb/s DL6

• HSUPA cat.6, up to 5.6 Mb/s UL

• MPCI-L210, MPCI-L220, MPCI-L280:

• HSDPA cat.24, up to 42 Mb/s DL

• HSUPA cat.6, up to 5.6 Mb/s UL

Data rate 7

• GPRS multi-slot class 12 8,

CS1-CS4, up to 85.6 kb/s DL/UL

• EDGE multi-slot class 12 8,

MCS1-MCS9 up to 236.8 kb/s DL/UL

Table 2: MPCI-L2 series LTE, 3G and 2G characteristics

1.5 AT command support

The MPCI-L2 series modules support AT commands according to 3GPP standards TS 27.007 [1],

27.005 [2] and the u-blox AT command extension.

☞ For the complete list of all the supported AT commands and their syntax, see the u-blox AT

commands manual [3].

RIL (Radio Interface Layer) software for Android is available for MPCI-L2 series modules free of charge. See the Android RIL source code application note [4] for the supported software deliveries and more information.

4

MPCI-L210-63S product version does not support LTE band 20

5

MPCI-L220-62S product version does not support 3G Radio Access Technology

6

HSDPA category 24 capable

7

GPRS/EDGE multi-slot class determines the number of timeslots available for upload and download and thus the speed at

which data can be transmitted and received, with higher classes typically allowing faster data transfer rates.

8

GPRS/EDGE multi-slot class 12 implies a maximum of 4 slots in Down-Link and 4 slots in Up-Link, with 5 slots in total.

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1.6 Supported features

Table 3 lists some of the main features supported by MPCI-L2 series modules. For more details, see

the TOBY-L2 / MPCI-L2 system integration manual [5] and u-blox AT commands manual [3].

Feature

Description

Network Indication

LED_WWAN# signal provides the Wireless Wide Area Network status indication as specified by the PCI Express Mini Card electromechanical specification [9].

Embedded TCP and UDP stack 9

Embedded TCP/IP and UDP/IP stack including the Direct Link mode for TCP and UDP sockets. Sockets can be set in Direct Link mode to establish a transparent end to end communication with an

already connected TCP or UDP socket via serial interface.

FTP 9, FTPS 10

File Transfer Protocol as well as Secure File Transfer Protocol (SSL encryption of FTP control channel) functionalities are supported via AT commands.

HTTP 9, HTTPS 10

Hyper-Text Transfer Protocol as well as Secure Hyper-Text Transfer Protocol (SSL encryption) functionalities are supported via AT commands.

Embedded TLS 1.2 10

With the support of X.509 certificates, Embedded TLS 1.2 provides server and client authentication, data encryption, data signature and enables TCP/IP applications communicate over a secured and trusted connection.

The feature can be configured and enabled by +USECMNG and +USECPRF AT commands.

DNS 9

Support for DNS functionality.

Dual stack IPv4/IPv6

Both Internet Protocol version 4 and Internet Protocol version 6 are supported in parallel.

BIP 11

Bearer Independent Protocol for Over-the-Air SIM provisioning. The data transfer to/from the SIM uses either an already active PDP context or a new PDP context established with the APN provided by the SIM card.

Multiple PDP contexts

Up to 8 PDP contexts can be activated, and multi secondary PDP contexts be associated to a primary PDP context

SMS via IMS 12

Allows SMS via embedded IP Multimedia Subsystem (IMS)

Firmware update Over AT commands (FOAT)

Firmware module upgrade over AT command interface (USB). The feature can be enabled and configured through the +UFWUPD AT command.

Firmware update Over The Air (FOTA) 9

Firmware module update over the LTE/3G/2G air interface. The feature can be enabled and configured through the +UFWINSTALL AT command.

LTE DL MIMO 2x2 and 3G DL Rx Diversity

Improved cellular link quality and reliability on all operating bands.

Smart Temperature Supervisor 13

Constant monitoring of the module board temperature:

• Warning notification when the temperature approaches an upper or lower predefined threshold

• Shutdown notified and forced when the temperature value is outside the specified range (shutdown

suspended in case of an emergency call in progress) The Smart Temperature Supervisor feature can be enabled and configured through the +USTS AT command.

☞ The sensor measures board temperature, which can differ from ambient temperature.

Remote SIM Access Profile (SAP)14

Allows access and use of a remote (U)SIM card instead of the local SIM card directly connected to the module (U)SIM interface. The module acts as an SAP Client establishing a connection and performing data exchange to a SAP Server directly connected to the remote SIM. The modules provide a dedicated USB SAP channel and a dedicated multiplexer SAP channel over UART for communication with the remote (U)SIM card.

The feature can be configured and enabled by +USAPMODE and + USAPIND AT commands.

9

Not supported by “00”, “60” and “63” product versions

10

Not supported by “00”, “01”, “60”, “63” and MPCI-L201-02S product versions.

11

Not supported by “00”, “60”, “63” product versions. Not supported by MPCI-L201-01S and MPCI-L201-02S-00 product versions

in AT&T configuration.

12

Not supported by “00”, “03”, “60”, “62”, “63”, MPCI-L200-02S, MPCI-L210-02S, MPCI-L220-02S and MPCI-L280-02S product

versions.

13

Not supported by “00”, “01”, “60” and “63” product versions.

14

Not supported by “00”, “01”, “02”, “60”, “62” and “63” product versions

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Feature

Description

Power saving

The power saving configuration is by default disabled, but it can be configured using the +UPSV AT command. When power saving is enabled, the module automatically enters the low power idle-mode whenever possible, reducing current consumption.

During idle-mode, the module processor core runs with the internal RTC 32 kHz reference clock.

Fast Dormancy

The Fast Dormancy feature, defined in 3GPP Rel.8, allows reduction of current consumption and network utilization during periods of data inactivity. It can be activated by +UFDAC and +UDCONF=61 AT commands.

Radio Policy Manager (RPM)15

The Radio Policy Manager (RPM) feature provides a more efficient access to the network, controlling the number of network accesses per service type over a fixed amount of time. For more details on the RPM feature see the GSMA IoT device connection efficiency guidelines [12].

The feature can be enabled through the +URPM and +URPMCONF AT commands.

Table 3: Some of the main features supported by MPCI-L2 series modules

15

Not supported by product versions "00", "02", "60", "62", "63" of MPCI -L2x0 modules, not supported by product version "01" of

MPCI -L201 modules, and not supported by product versions MPCI-L2x0-03S-00 and MPCI -L201-02S-00

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2 Interfaces

2.1 Module supply input

MPCI-L2 series modules must be supplied through the 3.3Vaux pins by a DC power supply. The voltage must be stable, because during this operation the current drawn from 3.3Vaux can vary significantly, based on the power consumption profile of the LTE/3G/2G systems (see the TOBY-L2 / MPCI-L2 system integration manual [5]).

2.2 Antenna RF interfaces

The modules have two RF interfaces over two standard U.FL connectors (Hirose U.FL-R-SMT) with a characteristic impedance of 50 . The primary RF port (ANT1) supports both Tx and Rx, providing the main antenna interface, while the secondary RF port (ANT2) supports Rx only for the LTE MIMO 2x2 and 3G Rx diversity configurations.

2.3 System functions

2.3.1 Module power-on

MPCI-L2 series can be switched on by:

• Rising edge on the 3.3Vaux pin to a valid voltage for module supply, i.e. applying module supply.

2.3.2 Module power-off

MPCI-L2 series can be properly switched off by:

• Sending the AT+CFUN=127 command (see the u-blox AT commands manual [3]) to configure the

module in the halt mode, and then removing the 3.3Vaux supply. In this way, the current parameter settings are saved in the module’s non-volatile memory and a proper network detach is performed.

An abrupt under-voltage shutdown occurs on MPCI-L2 modules when the 3.3Vaux supply is suddenly removed. If this is done without previously configuring the module in the halt mode, the storage of the current parameter settings in the module’s non-volatile memory and the proper network detach are not performed.

An over-temperature or an under-temperature shutdown occurs on MPCI-L2 modules when the temperature measured within the cellular module reaches the dangerous area, if the optional Smart Temperature Supervisor feature (not supported by the “00”, “01”, “60” and “63” product versions) is enabled and configured by the AT+USTS command. For more details, see the TOBY-L2 / MPCI-L2 system integration manual [5] and the u-blox AT commands manual [3].

2.3.3 Module reset

MPCI-L2 series can be reset (rebooted) by:

• AT+CFUN command (see the u-blox AT commands manual [3]).

• AT+CPWROFF command (see the u-blox AT commands manual [3]): this behavior differs than

TOBY-L2 modules, where MPCI-L2 series modules will boot back up, rather than remain powered off, due to the MPCI-L2 series module’s internal configuration.

In both cases, an “internal” or “software” reset of the module is executed: the current parameter settings are saved in the module’s non-volatile memory and a proper network detach is performed.

An abrupt “external” or “hardware” reset of the module occurs when a low level is applied on the PERST# pin (normally set high by an internal pull-up) for a valid time period (see section 4.2.7). The

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current parameter settings are not saved in the module’s non-volatile memory and a proper network detach is not performed. PERST# line should be driven by open drain, open collector or contact switch.

2.4 SIM interface

A SIM card interface is provided on the UIM_PWR, UIM_DATA, UIM_CLK, UIM_RESET pins of the system connector as well as on a micro-SIM (3FF) card holder solderable on the back side of the board: the high-speed SIM/ME interface is implemented as well as the automatic detection of the required SIM supporting voltage.

Both 1.8 V and 3 V SIM types are supported (1.8 V and 3 V ME). Activation and deactivation with automatic voltage switch from 1.8 V to 3 V is implemented, according to ISO-IEC 7816-3 specifications. The SIM driver supports the PPS procedure for baud-rate selection, according to the values proposed by the SIM card/chip.

2.5 USB interface

MPCI-L2 series modules include a high-speed USB 2.0 compliant interface with maximum 480 Mb/s data rate, representing the interface for any communication with an external host application processor. The module itself acts as a USB device and can be connected to any USB host equipped with compatible drivers.

The USB_D+ / USB_D- lines carry the USB serial bus data and signaling, providing all the functionalities for the bus attachment, configuration, enumeration, suspension or remote wakeup according to the Universal Serial Bus revision 2.0 specification [6].

MPCI-L2 series modules provide by default the following set of USB functions:

• CDC-ACM modem: AT commands interface is available over this modem COM port

• RNDIS network adapter: Ethernet-over-USB connection is available over this network adapter

The USB of MPCI-L2 series modules can be configured by the AT+UUSBCONF command to select different sets of USB functions available in a mutually exclusive way. The configured USB profile can thus consist of a specific set of functions with various capabilities and purposes, such as:

• CDC-ACM for AT commands and data

• CDC-ACM for remote SIM Access Profile (SAP)

16

• CDC-ACM for diagnostic

• RNDIS for Ethernet-over-USB

• CDC-ECM for Ethernet-over-USB

For more details regarding USB configurations and capabilities, see the TOBY-L2 / MPCI-L2 system integration manual [5] and the u-blox AT commands manual [3], +UUSBCONF AT command.

USB drivers are available for the following operating system platforms:

• Windows Vista

• Windows 7

• Windows 8

• Windows 8.1

• Windows 10

• Windows Embedded CE 6.0

17

• Windows Embedded Compact 7

17

• Windows Embedded Compact 2013

17

MPCI-L2 series modules are compatible with standard Linux/Android USB kernel drivers.

16

Not supported by “00”, “01”, “02”, “60”, “62” and “63” product versions

17

For more details see the Windows Embedded OS USB driver installation application note [7]

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2.6 W_DISABLE#

MPCI-L2 series includes the W_DISABLE# active-low input signal to disable the radio operations as specified by the PCI Express Mini Card electromechanical specification [9].

2.7 LED_WWAN#

MPCI-L2 series includes the LED_WWAN# active-low open drain output to provide the Wireless Wide Area Network status indication as specified by the PCI Express Mini Card electromechanical specification [9].

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3 Pin definition

3.1 Pin assignment

No

PCI Express Mini Card E.M. Spec. Rev. 2.0

MPCI-L2

Voltage domain

I/O

Description

Remarks

1

WAKE#

NC N/A Internally not connected

2

3.3Vaux

I

MPCI supply input

Connect to external 3.3 V supply. See 4.2.4 for detailed electrical specs.

3

COEX1

NC N/A Internally not connected

4

GND

N/A

Ground

Connect to ground

5

COEX2

NC N/A Internally not connected

6

1.5V

NC N/A Internally not connected

7

CLKREQ#

NC N/A Internally not connected

8

UIM_PWR

SIM O SIM supply output

1.8 V or 3.0 V output according to the SIM card/chip voltage type. See 4.2.6 for detailed electrical specs.

9

GND

N/A

Ground

Connect to ground

10

UIM_DATA

SIM

I/O

SIM data input/output

Internal 4.7 k pull-up to UIM_PWR. See 4.2.6 for detailed electrical specs.

11

REFCLK-

NC N/A Internally not connected

12

UIM_CLK

SIM O SIM clock output

3.25 MHz output for SIM card/chip. See 4.2.6 for detailed electrical specs.

13

REFCLK+

NC N/A Internally not connected

14

UIM_RESET

SIM O SIM reset output

Reset output for SIM card/chip. See 4.2.6 for detailed electrical specs.

15

GND

N/A

Ground

Connect to ground

16

UIM_SPU

NC N/A Internally not connected

17

UIM_IC_DM

NC N/A Internally not connected

18

GND

N/A

Ground

Connect to ground

19

UIM_IC_DP

NC N/A Internally not connected

20

W_DISABLE1#

W_DISABLE#

I

Wireless disable input

Internal 22 k pull-up to 3.3Vaux. See 4.2.8 for detailed electrical specs.

21

GND

N/A

Ground

Connect to ground

22

PERST#

I MPCI reset input

Internal 45 k active pull-up to 3.3 V. See 4.2.7 for detailed electrical specs.

23

PERn0

NC N/A Internally not connected

24

3.3Vaux

I

MPCI supply input

Connect to external 3.3 V supply. See 4.2.4 for detailed electrical specs.

25

PERp0

NC N/A Internally not connected

26

GND

N/A

Ground

Connect to ground

27

GND

N/A Connect to ground

28

1.5V

NC N/A Internally not connected

29

GND

N/A

Ground

Connect to ground

30

SMB_CLK

NC N/A Internally not connected

31

PETn0

NC N/A Internally not connected

32

SMB_DATA

NC N/A Internally not connected

33

PETp0

NC N/A Internally not connected

34

GND

N/A

Ground

Connect to ground

MPCI-L2 series - Data sheet

UBX-13004749 - R26 Pin definition Page 15 of 31 C1-Public

No

PCI Express Mini Card E.M. Spec. Rev. 2.0

MPCI-L2

Voltage domain

I/O

Description

Remarks

35

GND

N/A

Ground

Connect to ground

36

USB_D-

USB

I/O

USB Data Line D-

90  nominal differential impedance. Pull-up, pull-down and series resistors

as required by USB 2.0 specifications

[6] are part of the USB pin driver and

need not be provided externally. See 4.2.4 for detailed electrical specs.

37

GND

N/A

Ground

Connect to ground

38

USB_D+

USB

I/O

USB Data Line D+

90  nominal differential impedance. Pull-up, pull-down and series resistors as required by USB 2.0 specifications

[6] are part of the USB pin driver and

need not be provided externally. See 4.2.4 for detailed electrical specs.

39

3.3Vaux

I

MPCI supply input

Connect to external 3.3 V supply. See 4.2.4 for detailed electrical specs.

40

GND

N/A

Ground

Connect to ground

41

3.3Vaux

I

MPCI supply input

Connect to external 3.3 V supply. See 4.2.4 for detailed electrical specs.

42

LED_WWAN#

O LED indicator output

Open drain active low output. See 4.2.9 for detailed electrical specs.

43

GND

N/A

Ground

Connect to ground

44

LED_WLAN#

NC N/A Internally not connected

45

Reserved

NC N/A Internally not connected

46

LED_WPAN#

NC N/A Internally not connected

47

Reserved

NC N/A Internally not connected

48

1.5V

NC N/A Internally not connected

49

Reserved

NC N/A Internally not connected

50

GND

N/A

Ground

Connect to ground

51

W_DISABLE2#

NC N/A Internally not connected

52

3.3Vaux

I

MPCI supply input

Connect to external 3.3 V supply. See 4.2.4 for detailed electrical specs.

Table 4: MPCI-L2 series system connector pin assignment

MPCI-L2 series - Data sheet

UBX-13004749 - R26 Electrical specifications Page 16 of 31 C1-Public

4 Electrical specifications

⚠ Stressing the device above one or more of the ratings listed in the Absolute Maximum Rating

section may cause permanent damage. These are stress ratings only. Operating the module at these or at any conditions other than those specified in the Operating Conditions sections (chapter 4.1) of the specification should be avoided. Exposure to Absolute Maximum Rating conditions for extended periods may affect device reliability.

☞ Operating condition ranges define those limits within which the functionality of the device is

guaranteed.

☞ Electrical characteristics are defined according to verification on a representative number of

samples or according to simulation.

☞ Application information is advisory only and does not form part of the specification.

4.1 Absolute maximum rating

☞ Limiting values given below are in accordance with Absolute Maximum Rating System (IEC 134).

Symbol

Description

Condition

Min.

Max.

Unit

3.3Vaux

Module supply voltage

Input DC voltage at 3.3Vaux pins

–0.3

6.3 V USB

USB D+/D- pins

Input DC voltage at USB interface pins

3.6 V SIM

SIM interface

Input DC voltage at SIM interface pins

–0.3

3.6 V PERST#

MPCI reset input

Input DC voltage at PERST# input pin

–0.3

5.0 V W_DISABLE#

Wireless disable input

Input DC voltage at W_DISABLE# input pin

–0.3

3.6 V LED_WWAN#

LED indicator output

Input DC voltage at LED_WWAN# output pin

–0.3

6.0 V Rho_ANT

Antenna ruggedness

Output RF load mismatch ruggedness at ANT1 / ANT2

10:1

VSWR

Tstg

Storage temperature

–40

85

°C

Table 5: Absolute maximum ratings

⚠ The product is not protected against overvoltage or reversed voltages. If necessary, voltage spikes

exceeding the power supply voltage specification, given in table above, must be limited to values within the specified boundaries by using appropriate protection devices.

4.1.1 Maximum ESD

Parameter

Min

Typ

Max

Unit

Remarks

ESD sensitivity for all pins except ANT1 / ANT2

1000

V

Human Body Model according to JESD22-A114 ESD sensitivity for ANT1 / ANT2

1000

V

Human Body Model according to JESD22-A114

ESD immunity for ANT1 / ANT2

4000

V

Contact Discharge according to IEC 61000-4-2

8000

V

Air Discharge according to IEC 61000-4-2

Table 6: Maximum ESD ratings

⚠ u-blox cellular modules are Electrostatic Sensitive Devices and require special precautions when

handling. See section 7.2 for ESD handling instructions.

MPCI-L2 series - Data sheet

UBX-13004749 - R26 Electrical specifications Page 17 of 31 C1-Public

4.2 Operating conditions

☞ Unless otherwise indicated, all operating condition specifications are at an ambient temperature

of +25 °C.

⚠ Operation beyond the operating conditions is not recommended and extended exposure beyond

them may affect device reliability.

4.2.1 Operating temperature range

Parameter

Min.

Typical

Max.

Unit

Remarks

Normal operating temperature

–20

+25

+65

°C

Normal operating temperature range (fully functional and meet 3GPP / ETSI specifications)

Extended operating temperature

–40 +85

°C

Extended operating temperature range (RF performance may be affected outside normal

operating range, though module is fully functional)

Table 7: Environmental conditions

4.2.2 Current consumption

Mode

Condition

Tx power

Min

Typ

Max

Unit

Idle-Mode (Power Saving enabled by AT+UPSV, module in low power idle-mode, equivalent to +CFUN=4 or +COPS=2)

Averaged current value over a 100-ms period, USB connected and suspended

1.8 mA Cyclic Idle/Active-Mode (Power Saving enabled by AT+UPSV, Module registered with network)

Averaged current value over a 10-minute period, USB interface suspended

3.9 mA

Active-Mode (Power Saving disabled by AT+UPSV, Module registered with network)

Averaged current value over a 10-minute period, USB interface not suspended

59 mA

2G Connected Mode (Tx / Rx call enabled)

Pulse current during a 1-slot GMSK Tx burst, 850/900 MHz bands

Maximum

2.6 A

Averaged current value over a 10-second period, 2G GMSK call, 1 Tx + 1 Rx slot, 850/900 MHz

Maximum

380 mA

Averaged current value over a 10-second period, 2G GMSK call, 1 Tx + 1 Rx slot, 1800/1900 MHz

Maximum

295 mA

3G Connected Mode (Tx / Rx call enabled)

Averaged current value over a 10-second period, 3G call with Low data rate

Minimum

245 mA

0 dBm

265 mA

12 dBm

365 mA

18 dBm

505 mA

Maximum

680 mA

Averaged current value over a 10-second period, 3G call with Maximum data rate

Maximum )

790 mA

LTE Connected Mode (Tx / Rx call enabled)

Averaged current value over a 10-second period, LTE call with Low data rate

Minimum

395 mA

0 dBm

415 mA

12 dBm

520 mA

18 dBm

650 mA

Maximum

815 mA

Averaged current value over a 10-second period, LTE call with Maximum data rate

Maximum

880 mA

Table 8: Module 3.3Vaux supply current consumption

MPCI-L2 series - Data sheet

UBX-13004749 - R26 Electrical specifications Page 18 of 31 C1-Public

4.2.3 LTE/3G/2G RF characteristics

MPCI-L2 series LTE/3G/2G RF characteristics are specified in the TOBY-L2 series data sheet [10].

4.2.4 Supply/power pins

Symbol

Parameter

Min.

Typical

Max.

Unit

3.3Vaux

Module supply operating input voltage 18

3.00

3.30

3.60

V

Table 9: Input characteristics of Supply/Power pins

4.2.5 USB pins

USB data lines (USB_D+ / USB_D-) are compliant to the USB 2.0 high-speed specification. The values in Table 10 are for information only. See the USB 2.0 specifications [6] for detailed electrical characteristics.

Parameter

Min.

Typical

Max.

Unit

Remarks

High-speed squelch detection threshold (input differential signal amplitude)

100 150

mV High speed disconnect detection threshold (input differential signal amplitude)

525 625

mV

High-speed data signaling input common mode voltage range

–50 500

mV High-speed idle output level

–10 10

mV

High-speed data signaling output high level

360 440

mV

High-speed data signaling output low level

–10 10

mV Chirp J level (output differential voltage)

700 1100

mV

Chirp K level (output differential voltage)

–900

–500

mV

Table 10: USB pins characteristics

4.2.6 SIM pins

The SIM pins are a dedicated interface to the external SIM card/chip. The electrical characteristics fulfill regulatory specification requirements. The values in Table 11 are for information only.

Parameter

Min.

Typical

Max.

Unit

Remarks

UIM_PWR supply output

1.76

1.80

1.85 V 1.8 V SIM type

2.84

2.90

2.94 V 3.0 V SIM type

Low-level input

–0.30

0.63 V 1.8 V SIM type

–0.30

0.80 V 3.0 V SIM type

High-level input

1.17 2.10 V 1.8 V SIM type

2.00 3.30 V 3.0 V SIM type

Low-level output

0.00

0.45 V 1.8 V SIM type, Max value at IOL = +2.0 mA

0.00

0.40 V 3.0 V SIM type, Max value at IOL = +2.0 mA

High-level output

1.35

1.80 V

1.8 V SIM type, Min value at IOH = –2.0 mA

2.60

2.90 V

3.0 V SIM type, Min value at IOH = –2.0 mA

Input / Output leakage current

–500

500

nA

0 V < V

IN

< 0.63 V or 1.17 V < V

IN

< 2.10 V

0 V < V

IN

< 0.80 V or 2.00 V < V

IN

< 3.30 V

Clock frequency on UIM_CLK

3.25 MHz

Internal pull-up on UIM_DATA

4.7

k

Internal pull-up to UIM_PWR supply

Table 11: SIM pins characteristics

18

Input voltage at 3.3Vaux must be above the normal operating range minimum limit to switch-on the module.

MPCI-L2 series - Data sheet

UBX-13004749 - R26 Electrical specifications Page 19 of 31 C1-Public

4.2.7 PERST# pin

Pin Name

Parameter

Min.

Typical

Max.

Unit

Remarks

PERST#

Low-level input

0.00 1.10 V High-level input

2.60 3.70 V L-level input current

-82 µA

Pull-up resistance

35

45

k

Internal active pull-up to 3.3 V

PERST# low time

2.1 s Low time to reset the module

Table 12: PERST# pin characteristics

4.2.8 W_DISABLE# pin

Pin Name

Parameter

Min.

Typical

Max.

Unit

Remarks

W_DISABLE#

Low-level input

0.00 0.80 V High-level input

2.00 3.60 V

Pull-up resistance

22

k

Internal pull-up to 3.3Vaux

Table 13: W_DISABLE# pin characteristics

4.2.9 LED_WWAN# pin

Pin Name

Parameter

Min.

Typical

Max.

Unit

Remarks

LED_WWAN#

Low-level output

0.00

0.40 V Open-drain output Max value at IOL = +9.0 mA

Table 14: LED_WWAN# pin characteristics

MPCI-L2 series - Data sheet

UBX-13004749 - R26 Mechanical specifications Page 20 of 31 C1-Public

5 Mechanical specifications

MPCI-L2 series modules are fully compliant to the 52-pin PCI Express Full-Mini Card Type F2 form factor, with top-side and bottom-side keep-out areas, with 50.95 mm nominal length, 30 mm nominal width and all the other dimensions as defined by the PCI Express Mini Card electromechanical specification [9] except for the card thickness (nominal value is 3.7 mm), as described in Figure 2. MPCI-L2 series modules weight is about 9.7 g.

3.7 mm

30 mm

50.95 mm

Pin 52

Pin 2

Pin 1

Pin 51

ANT1

ANT2

Top

View

Bottom

View

Side

View

Hole

GND

Hole

GND

Hole

GND

Hole

GND

45.25 mm

19 mm

11 mm

Figure 2: MPCI-L2 series mechanical dimensions (top, side and bottom views)

☞ For further details regarding mechanical specifications, see the PCI Express Mini Card

electromechanical specification [9].

MPCI-L2 series - Data sheet

UBX-13004749 - R26 Qualification and approvals Page 21 of 31 C1-Public

6 Qualification and approvals

6.1 Reliability tests

Tests for product family qualifications according to ISO 16750 “Road vehicles - Environmental conditions and testing for electrical and electronic equipment”, and appropriate standards.

6.2 Approvals

MPCI-L2 series modules comply with the Directive 2011/65/EU of the European Parliament and the Council on the Restriction of Use of certain Hazardous Substances in Electrical and Electronic Equipment (EU RoHS 2) and its amendment Directive (EU) 2015/863 (EU RoHS 3).

MPCI-L2 series modules are RoHS 3 compliant.

No natural rubbers, hygroscopic materials, or materials containing asbestos are employed.

Table 15 summarizes the main Regulatory and Network Operator approvals for the MPCI-L2 modules.

Certification scheme

MPCI-L200

MPCI-L201

MPCI-L210

MPCI-L220

MPCI-L280

CE (European Conformity)

• • •

FCC (US Certification)

• • • •

FCC identification number

Contains FCC ID

XPYTOBYL200

Contains FCC ID

XPYTOBYL201

Contains FCC ID

XPYTOBYL210

Contains FCC ID

XPYTOBYL280

ISED (Canadian Certification)

• • • •

ISED certification number

Contains IC

8595A-TOBYL200

Contains IC

8595A-TOBYL201

Contains IC

8595A-TOBYL210

Contains IC

8595A-TOBYL280

ANATEL (Brazilian Certification)

• •

RCM (Australian Certification)

• •

NCC (Taiwanese Certification)

• •

GITEKI (Japanese Certification)

• •

NTT DoCoMo (Network Operator)

•

SoftBank (Network Operator)

•

AT&T (Network Operator)

•

Verizon (Network Operator)

•

Table 15: MPCI-L2 series main certification approvals summary

☞ The above listed certifications might not be available for all the different product type numbers.

Please contact the u-blox office or sales representative nearest you for the complete list of certification approvals available for the selected ordering number.

MPCI-L2 series - Data sheet

UBX-13004749 - R26 Product handling Page 22 of 31 C1-Public

7 Product handling

7.1 Packaging

MPCI-L2 modules are delivered as hermetically sealed trays of 16 pieces, 10 trays in 1 package (160 units in total), to enable efficient production, production lot set-up and tear-down. For more information about packaging, see the u-blox package information user guide [8].

Quantities of less than 160 pieces are also available. Contact u-blox for more information.

7.2 ESD precautions

⚠ MPCI-L2 series modules contain highly sensitive electronic circuitry and are Electrostatic

Sensitive Devices (ESD). Handling MPCI-L2 series modules without proper ESD protection may destroy or damage them permanently.

MPCI-L2 series modules are Electrostatic Sensitive Devices (ESD) and require special ESD precautions typically applied to ESD sensitive components.

Table 6 reports the maximum ESD ratings of the MPCI-L2 series modules.

Proper ESD handling and packaging procedures must be applied throughout the processing, handling and operation of any application that incorporates MPCI-L2 series module.

ESD precautions should be implemented on the application board where the module is mounted, as described in the TOBY-L2 / MPCI-L2 series system integration manual [5].

⚠ Failure to observe these recommendations can result in severe damage to the device!

MPCI-L2 series - Data sheet

UBX-13004749 - R26 Default settings Page 23 of 31 C1-Public

8 Default settings

Item

AT Settings

Comments

USB interface

Enabled

MPCI-L2 series modules provide by default the following set of USB functions:

• CDC-ACM for AT command and data

• RNDIS for Ethernet-over-USB connection

The USB can be configured by the AT+UUSBCONF command to select different sets of USB functions available in mutually exclusive way, configuring the active USB profile consisting of a specific set of functions with various capabilities and purposes (for more details, see the TOBY-L2 / MPCI-L2 system integration manual [5] and u-blox AT commands manual [3], +UUSBCONF AT command).

Power Saving

AT+UPSV=0

Disabled

Network registration

AT+COPS=0

Self network registration

Table 16: Default settings

MPCI-L2 series - Data sheet

UBX-13004749 - R26 Labeling and ordering information Page 24 of 31 C1-Public

9 Labeling and ordering information

9.1 Product labeling

The labels of MPCI-L2 series modules include important product information as described in this section.

Figure 3, Figure 4 and Figure 5 illustrate the label of MPCI-L2 series modules, which is placed on the

bottom side of the modules, including: the u-blox logo, Pb-free marking, product type number, production lot, certification numbers and production country.

xxS-xx

Figure 3: Label of MPCI-L2 series modules (except MPCI-L210-60S, MPCI-L210-63S and MPCI-L220)

MPCI-L210

60S-xx

D150057003

003-150063

Figure 4: Label of MPCI-L210-60S and MPCI-L210-63S modules

MPCI-L220

xxS-xx

AD160009003

003-160020

Figure 5: Label of MPCI-L220 modules

MPCI-L2 series - Data sheet

UBX-13004749 - R26 Labeling and ordering information Page 25 of 31 C1-Public

9.2 Explanation of codes

Three different product code formats are used. The Product Name is used in documentation such as this data sheet and identifies all u-blox products, independent of packaging and quality grade. The Ordering Code includes options and quality, while the Type Number includes the hardware and firmware versions. Table 17 details these 3 different formats:

Format

Structure

Product Name

MPCI-TGVV

Ordering Code

MPCI-TGVV-MMQ

Type Number

MPCI-TGVV-MMQ-XX

Table 17: Product code formats

Table 18 explains the parts of the product code.

Code

Meaning

Example

PPPP

Form factor

MPCI

TG

Platform (Technology and Generation)

• Dominant technology: G: GSM; U: HSUPA; C: CDMA 1xRTT; N: NB-IoT;

R: LTE low data rate (Cat 1 and below); L: LTE high data rate (Cat 3 and above)

• Generation: 1…9

L2

VV

Variant function set based on the same platform [00…99]

00

MM

Major product version [00…99]

00

Q

Product grade

• S = professional

• A = automotive

S

XX

Minor product version (not relevant for certification)

Default value is 00

Table 18: Part identification code

MPCI-L2 series - Data sheet

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9.3 Ordering information

Ordering No.

Product

MPCI-L200-00S

LTE bands 2 / 4 / 5 / 7 / 17, DC-HSPA+ bands 1 / 2 / 4 / 5 / 8, (E)GPRS band 850 / 900 / 1800 / 1900, PCI Express Mini Card module mainly designed for operation in America 51 x 30 x 3.7 mm, 160 pcs/package

MPCI-L200-02S

LTE bands 2 / 4 / 5 / 7 / 17, DC-HSPA+ bands 1 / 2 / 4 / 5 / 8, (E)GPRS band 850 / 900 / 1800 / 1900, PCI Express Mini Card module mainly designed for operation in America, supporting embedded TCP/UDP, HTTP/FTP, TLS/SSL, smart temperature supervisor 51 x 30 x 3.7 mm, 160 pcs/package

MPCI-L200-03S

LTE bands 2 / 4 / 5 / 7 / 17, DC-HSPA+ bands 1 / 2 / 4 / 5 / 8, (E)GPRS band 850 / 900 / 1800 / 1900, PCI Express Mini Card module mainly designed for operation in America, supporting embedded TCP/UDP, HTTP/FTP, TLS/SSL, smart temperature supervisor, SAP 51 x 30 x 3.7 mm, 160 pcs/package

MPCI-L201-01S

LTE bands 2 / 4 / 5 / 13 / 17, DC-HSPA+ bands 1 / 2 / 5 / 8, (E)GPRS band 850 / 900 / 1800 / 1900, PCI Express Mini Card module mainly designed for operation in America, supporting embedded TCP/UDP, HTTP/FTP 51 x 30 x 3.7 mm, 160 pcs/package

MPCI-L201-02S

LTE bands 2 / 4 / 5 / 13 / 17, DC-HSPA+ bands 1 / 2 / 5 / 8, (E)GPRS band 850 / 900 / 1800 / 1900, PCI Express Mini Card module mainly designed for operation in America, supporting embedded TCP/UDP, HTTP/FTP, smart temperature supervisor 51 x 30 x 3.7 mm, 160 pcs/package

MPCI-L210-00S

LTE bands 1 / 3 / 5 / 7 / 8 / 20, DC-HSPA+ bands 1 / 2 / 5 / 8, (E)GPRS band 850 / 900 / 1800 / 1900, PCI Express Mini Card module mainly designed for operation in Europe, Asia and other countries 51 x 30 x 3.7 mm, 160 pcs/package

MPCI-L210-60S

LTE bands 1 / 3 / 5 / 7 / 8 / 20, DC-HSPA+ bands 1 / 2 / 5 / 8, (E)GPRS band 850 / 900 / 1800 / 1900, PCI Express Mini Card module approved by SoftBank Japanese mobile network operator 51 x 30 x 3.7 mm, 160 pcs/package

MPCI-L210-63S

LTE bands 1 / 3 / 5 / 7 / 8, DC-HSPA+ bands 1 / 2 / 5 / 8, (E)GPRS band 850 / 900 / 1800 / 1900, PCI Express Mini Card module approved by SoftBank Japanese mobile network operator 51 x 30 x 3.7 mm, 160 pcs/package

MPCI-L210-02S

LTE bands 1 / 3 / 5 / 7 / 8 / 20, DC-HSPA+ bands 1 / 2 / 5 / 8, (E)GPRS band 850 / 900 / 1800 / 1900, PCI Express Mini Card module mainly designed for operation in Europe, Asia and other countries, supporting embedded TCP/UDP, HTTP/FTP, TLS/SSL, smart temperature supervisor 51 x 30 x 3.7 mm, 160 pcs/package

MPCI-L210-03S

LTE bands 1 / 3 / 5 / 7 / 8 / 20, DC-HSPA+ bands 1 / 2 / 5 / 8, (E)GPRS band 850 / 900 / 1800 / 1900, PCI Express Mini Card module mainly designed for operation in Europe, Asia and other countries, supporting embedded TCP/UDP, HTTP/FTP, TLS/SSL, smart temperature supervisor, SAP 51 x 30 x 3.7 mm, 160 pcs/package

MPCI-L220-02S

LTE bands 1 / 3 / 5 / 6 / 8 / 19, DC-HSPA+ bands 1 / 6 / 8 / 19, PCI Express Mini Card module mainly designed for operation in Japan, supporting embedded TCP/UDP, HTTP/FTP, TLS/SSL, smart temperature supervisor 51 x 30 x 3.7 mm, 160 pcs/package

MPCI-L220-62S

LTE bands 1 / 3 / 5 / 6 / 8 / 19, PCI Express Mini Card module approved by NTT DoCoMo Japanese mobile network operator, supporting embedded TCP/UDP, HTTP/FTP, TLS/SSL, smart temperature supervisor 51 x 30 x 3.7 mm, 160 pcs/package

MPCI-L280-02S

LTE bands 1 / 3 / 5 / 7 / 8 / 28, DC-HSPA+ bands 1 / 2 / 5 / 8, (E)GPRS bands 850 / 900 / 1800 / 1900, PCI Express Mini Card module mainly designed for operation in South East-Asia and Oceania, supporting embedded TCP/UDP, HTTP/FTP, TLS/SSL, smart temperature supervisor 51 x 30 x 3.7 mm, 160 pcs/package

MPCI-L280-03S

LTE bands 1 / 3 / 5 / 7 / 8 / 28, DC-HSPA+ bands 1 / 2 / 5 / 8, (E)GPRS bands 850 / 900 / 1800 / 1900, PCI Express Mini Card module mainly designed for operation in South East-Asia and Oceania, supporting embedded TCP/UDP, HTTP/FTP, TLS/SSL, smart temperature supervisor, SAP 51 x 30 x 3.7 mm, 160 pcs/package

Table 19: Product ordering codes

MPCI-L2 series - Data sheet

UBX-13004749 - R26 Appendix Page 27 of 31 C1-Public

Appendix

A Glossary

Abbreviation

Definition

ANATEL

Agência Nacional de Telecomunicações (Brazilian National Telecommunications Agency)

AT

Hayes ATtention Command Set

BIP

Bearer Independent Protocol

CBS

Cell Broadcast Services

CDC

Communication Device Class

CDMA

Code-Division Multiple Access

CE

Certification Mark for compliance in the European Union

CLK

Clock

DC

Direct Current

DCE

Data Communication Equipment

DCS

Digital Cellular System

DDC

Display Data Channel

DL

Down Link (Reception)

DTE

Data Terminal Equipment

EDGE

Enhanced Data rates for GSM Evolution

EGPRS

Enhanced General Packet Radio Service

EOL

End of Life

ESD

Electrostatic Discharge

FCC

Federal Communications Commission

FDD

Frequency Division Duplex

FOAT

Firmware (update) Over AT commands

FOTA

Firmware (update) Over-The-Air

FTP

File Transfer Protocol

GERA

GSM EGPRS Radio Access

GITEKI

Gijutsu kijun tekigō shōmei - Japan technical standard conformity certification

GMSK

Gaussian Minimum-Shift Keying modulation

GND

Ground

GNSS

Global Navigation Satellite System

GPRS

General Packet Radio Services

GSM

Global System for Mobile communications

HSDPA

High Speed Downlink Packet Access

HSPA

High Speed Packet Access

HSUPA

High Speed Uplink Packet Access

HTTP

HyperText Transfer Protocol

I/O

Input/Output

I2C

Inter-Integrated Circuit

IC

Integrated Circuit

IEC

International Electrotechnical Commission

IMS

IP Multimedia System

IP

Internet Protocol

ISED

Innovation, Science and Economic Development, formerly known as Industry Canada (IC)

MPCI-L2 series - Data sheet

UBX-13004749 - R26 Appendix Page 28 of 31 C1-Public

Abbreviation

Definition

ISO

International Organization for Standardization

LED

Light Emitting Diode

LTE

Long-Term Evolution

ME

Mobile Equipment

MIMO

Multiple In Multiple Out

N/A

Not Applicable

NCC

National Communications Commission

PCN

Product Change Notification

PPS

Protocol and Parameter Selection

RCM

Regulatory Compliance Mark

RF

Radio Frequency

RIL

Radio Interface Layer

RNDIS

Remote Network Driver Interface Specification

RTC

Real Time Clock

SAP

SIM Access Profile

SDIO

Secure Digital Input Output

SIM

Subscriber Identity Module

SMS

Short Message Service

SMT

Surface-Mount Technology

SSL

Secure Sockets Layer

TCP

Transmission Control Protocol

TCP/IP

Transmission Control Protocol/Internet Protocol

TDMA

Time-Division Multiple Access

TLS

Transport Layer Security

TS

Technical Specification

UART

Universal Asynchronous Receiver/Transmitter

UDP

User Datagram Protocol

UE

User Equipment

UL

Uplink (Transmission)

UMTS

Universal Mobile Telecommunications System

USB

Universal Serial Bus

VSWR

Voltage Standing Wave Ratio

WLAN

Wireless Local Area Network (IEEE 802.11 short range radio technology)

WWAN

Wireless Wide Area Network (GSM / UMTS / LTE cellular radio technology)

Table 20: Explanation of the abbreviations and terms used

MPCI-L2 series - Data sheet

UBX-13004749 - R26 Related documentation Page 29 of 31 C1-Public

Revision history

Revision

Date

Name

Status / Comments

R01

20-Dec-2013

jpod / sses

Initial release

R02

14-Oct-2014

lpah / sses

Advance Information document status; Updated module power-on, power-off and reset description; Updated module thickness and improved mechanical description; Minor corrections in PERST#, W_DISABLE#, LED_WWAN# description; Added module current consumption values; Added and updated other minor electrical characteristics

R03

28-Jan-2015

sses

Early Production Information document status

R04

19-Aug-2015

sses

Objective Specification document status; Added description of MPCI-L200-02S, MPCI-L210-02S and MPCI-L210-60S versions.

R05

25-Sep-2015

lpah

Advance Information status

R06

14-Oct-2015

sses

Objective Specification doc status; added description of MPCI-L280-02S version

R07

26-Nov-2015

lpah

Document status changed to Early Production Information

R08

22-Dec-2015

lpah / sses

Added description of MPCI-L201-01S version

R09

31-Mar-2016

sses

Updated features planned for future product versions. Minor other corrections and description improvements.

R10

27-Apr-2016

lpah

Extended document applicability to MPCI-L210-60S-01

R11

15-Jul-2016

sses

Document status reverted to Objective Specification Added description of MPCI-L201-02S version

R12

28-Sep-2016

sses

Document status updated to Advance Information Updated support of some minor features in specific product versions

R13

21-Oct-2016

lpah

Document status updated to Early Production Information. Extended document applicability to MPCI-L220-02S and MPCI-L280-72S

R14

25-Nov-2016

lpah

Extended document applicability to MPCI-L200-00S-01 and removed document applicability to MPCI-L280-72S

R15

19-Apr-2017

lpah

"Disclosure restriction" replaces "Document status" on page 2 and doc footer. Extended document applicability to the MPCI-L200-02S-01, MPCI-L210-02S-01,

MPCI-L220-62S and MPCI-L280-02S-01

R16

06-Jun-2017

lpah / sses

Updated MPCI-L201-02S product status to Intial Production

R17

23-Jun-2017

lpah / sses

Extended document applicability to the MPCI-L200-03S, MPCI-L210-03S and MPCI-L280-03S

R18

27-Jul-2017

lpah

Updated MPCI-L200-00S-01, MPCI-L210-00S-00 product status to End of Life

R19

03-Jan-2018

lpah / sses

Updated MPCI-L200-02S-01, MPCI-L210-02S-01, MPCI-L280-02S-01 product status to EOL. Updated absolute maximum rating of PERST# pin

R20

27-May-2018

lpah

Updated MPCI-L201-01S product status Packaging information (section 7.1) updated, Reformat

R21

14-Feb-2019

lpah / sses

Extended document applicability to MPCI-L201-02S-01. Updated packaging info (section 7.1) and the number of pieces for package Updated approvals info; minor other corrections and description improvements

R22

12-Apr-2019

lpah / sses

Updated MPCI-L201-02S-01 product status. Updated RoHS statement.

R23

31-Oct-2019

lpah

Updated MPCI-L210-60S-01 product status. Extended document applicability to MPCI-L210-63S product version.

R24

06-Apr-2020

lpah / sses

Updated MPCI-L210-63S product status.

R25

28-Aug-2020

lpah / sses

Extended document applicability to MPCI-L210-03S-01.

R26

09-Dec-2020

lpah / sses

Extended document applicability to MPCI-L201-02S-02.

MPCI-L2 series - Data sheet

UBX-13004749 - R26 Contact Page 31 of 31 C1-Public

Contact

For complete contact information, visit us at www.u-blox.com.

u-blox Offices

North, Central and South America

u-blox America, Inc.

Phone: +1 703 483 3180 E-mail: info_us@u-blox.com

Regional Office West Coast:

Phone: +1 408 573 3640 E-mail: info_us@u-blox.com

Technical Support:

Phone: +1 703 483 3185 E-mail: support@u-blox.com

Headquarters Europe, Middle East, Africa

u-blox AG

Phone: +41 44 722 74 44 E-mail: info@u-blox.com Support: support@u-blox.com

Asia, Australia, Pacific

u-blox Singapore Pte. Ltd.

Phone: +65 6734 3811 E-mail: info_ap@u-blox.com Support: support_ap@u-blox.com

Regional Office Australia:

Phone: +61 3 9566 7255 E-mail: info_anz@u-blox.com Support: support_ap@u-blox.com

Regional Office China (Beijing):

Phone: +86 10 68 133 545 E-mail: info_cn@u-blox.com Support: support_cn@u-blox.com

Regional Office China (Chongqing):

Phone: +86 23 6815 1588 E-mail: info_cn@u-blox.com Support: support_cn@u-blox.com

Regional Office China (Shanghai):

Phone: +86 21 6090 4832 E-mail: info_cn@u-blox.com Support: support_cn@u-blox.com

Regional Office China (Shenzhen):

Phone: +86 755 8627 1083 E-mail: info_cn@u-blox.com Support: support_cn@u-blox.com

Regional Office India:

Phone: +91 80 405 092 00 E-mail: info_in@u-blox.com Support: support_in@u-blox.com

Regional Office Japan (Osaka):

Phone: +81 6 6941 3660 E-mail: info_jp@u-blox.com Support: support_jp@u-blox.com

Regional Office Japan (Tokyo):

Phone: +81 3 5775 3850 E-mail: info_jp@u-blox.com Support: support_jp@u-blox.com

Regional Office Korea:

Phone: +82 2 542 0861 E-mail: info_kr@u-blox.com Support: support_kr@u-blox.com

Regional Office Taiwan:

Phone: +886 2 2657 1090 E-mail: info_tw@u-blox.com Support: support_tw@u-blox.com

u-blox MPCI-L2 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Document information

Contents

1 Functional description

1.1 Overview

1.2 Product features

1.3 Block diagram

1.4 Product description

1.5 AT command support

1.6 Supported features

2 Interfaces

2.1 Module supply input

2.2 Antenna RF interfaces

2.3 System functions

2.3.1 Module power-on

2.3.2 Module power-off

2.3.3 Module reset

2.4 SIM interface

2.5 USB interface

2.6 W_DISABLE#

2.7 LED_WWAN#

3 Pin definition

3.1 Pin assignment

4 Electrical specifications

4.1 Absolute maximum rating

4.1.1 Maximum ESD

4.2 Operating conditions

4.2.1 Operating temperature range

4.2.2 Current consumption

4.2.3 LTE/3G/2G RF characteristics

4.2.4 Supply/power pins

4.2.5 USB pins

4.2.6 SIM pins

4.2.7 PERST# pin

4.2.8 W_DISABLE# pin

4.2.9 LED_WWAN# pin

5 Mechanical specifications

6 Qualification and approvals

6.1 Reliability tests

6.2 Approvals

7 Product handling

7.1 Packaging

7.2 ESD precautions

8 Default settings

9 Labeling and ordering information

9.1 Product labeling

9.2 Explanation of codes

9.3 Ordering information

Appendix

Related documentation

Revision history

Contact