u-blox MPCI-L2 User Manual
UBX-13004749 - R26
C1-Public www.u-blox.com
MPCI-L2 series
Multi-mode LTE Cat 4 Mini PCIe modules with HSPA+
and/or 2G fallback
Data sheet
Abstract
Technical data sheet describing MPCI-L2 series multi-mode cellular modules. The modules are a
complete and cost efficient LTE/3G/2G multi-mode solution offering up to 150 Mbit/s download data
rate and up to 50 Mbit/s upload data rate. The different variants offer a selection of coverage of up
to six LTE bands, up to five WCDMA/DC-HSPA+ bands and up to four GSM/EGPRS bands. The
modules have the industry standard PCI Express Mini Card form factor, which enables easy
integration into an application board and is also ideal for manufacturing of small series.
MPCI-L2 series - Data sheet
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Document information
Title
MPCI-L2 series
Subtitle
Multi-mode LTE Cat 4 Mini PCIe modules with HSPA+ and/or 2G fallback
Document type
Data sheet
Document number
UBX-13004749
Revision and date
R26
09-Dec-2020
Disclosure restriction
C1-Public
Product status
Corresponding content status
Functional Sample
Draft
For functional testing. Revised and supplementary data will be published later.
In development /
Prototype
Objective specification
Target values. Revised and supplementary data will be published later.
Engineering sample
Advance information
Data based on early testing. Revised and supplementary data will be published later.
Initial production
Early production information
Data from product verification. Revised and supplementary data may be published later.
Mass production /
End of life
Production information
Document contains the final product specification.
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This document applies to the following products:
Product name
Type number
Modem version
Application version
PCN reference
Product status
MPCI-L200
MPCI-L200-00S-00
09.71
A01.15
UBX-14044437
Obsolete
MPCI-L200-00S-01
09.71
A01.30
UBX-16026448
Obsolete
MPCI-L200-02S-00
15.90
A01.00
UBX-15029946
Obsolete
MPCI-L200-02S-01
15.90
A01.10
UBX-16031212
End of life
MPCI-L200-03S-00
15.90
A01.50
UBX-17022983
Obsolete
15.90
A01.52
UBX-19058317
Mass production
MPCI-L201
MPCI-L201-01S-00
09.93
A01.07
UBX-18012849
End of life
MPCI-L201-02S-00
09.93
For Verizon: 09.94
A02.50
For Verizon: A01.02
UBX-17013932
End of life
09.93
For Verizon: 10.04
A02.52
For Verizon: A01.01
UBX-19058317
End of life
MPCI-L201-02S-01
20.03
For Verizon: 20.03
A01.02
For Verizon: A01.02
UBX-19000820
End of life
20.03
For Verizon: 20.04
A01.04
For Verizon: A01.00
UBX-19058317
End of life
MPCI-L201-02S-02
20.06
A01.00
UBX-20036068
Mass production
MPCI-L210
MPCI-L210-00S-00
09.71
A01.15
UBX-14044437
Obsolete
MPCI-L210-02S-00
15.63
A01.03
UBX-15029946
Obsolete
MPCI-L210-02S-01
15.63
A01.10
UBX-16031212
Obsolete
MPCI-L210-03S-00
15.63
A01.50
UBX-17022983
End of life
15.63
A01.52
UBX-19058317
End of life
MPCI-L210-03S-01
16.19
A01.04
UBX-20027569
Mass production
MPCI-L210-60S-00
09.94
A01.00
UBX-15021694
Obsolete
MPCI-L210-60S-01
09.94
A01.01
UBX-19042394
End of life
09.94
A01.08
UBX-19058317
End of life
MPCI-L210-63S-00
09.94
A01.07
UBX-20009693
Mass production
MPCI-L220
MPCI-L220-02S-00
15.93
A01.00
UBX-16025501
Obsolete
15.93
A01.04
UBX-19058317
Mass production
MPCI-L220-62S-00
16.04
A01.00
UBX-17013073
Obsolete
16.04
A01.02
UBX-19058317
Mass production
MPCI-L280
MPCI-L280-02S-00
15.63
A01.03
UBX-15029946
Obsolete
MPCI-L280-02S-01
15.63
A01.10
UBX-16031212
End of life
MPCI-L280-03S-00
15.63
A01.50
UBX-17022983
Obsolete
15.63
A01.52
UBX-19058317
Mass production
u-blox or third parties may hold intellectual property rights in the products, names, logos and designs included in this document.
Copying, reproduction, modification or disclosure to third parties of this document or any part thereof is only permitted with the
express written permission of u-blox.
The information contained herein is provided “as is” and u-blox assumes no liability for its use. No warranty, either express or
implied, is given, including but not limited to, with respect to the accuracy, correctness, reliability and fitness for a particular
purpose of the information. This document may be revised by u-blox at any time without notice. For the most recent documents,
visit www.u-blox.com.
Copyright © u-blox AG.
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Contents
Document information ................................................................................................................................ 2
Contents .......................................................................................................................................................... 4
1 Functional description ......................................................................................................................... 6
1.1 Overview ........................................................................................................................................................ 6
1.2 Product features ......................................................................................................................................... 6
1.3 Block diagram .............................................................................................................................................. 7
1.4 Product description .................................................................................................................................... 7
1.5 AT command support ................................................................................................................................ 8
1.6 Supported features .................................................................................................................................... 9
2 Interfaces ................................................................................................................................................ 11
2.1 Module supply input .................................................................................................................................. 11
2.2 Antenna RF interfaces .............................................................................................................................. 11
2.3 System functions ....................................................................................................................................... 11
2.3.1 Module power-on ............................................................................................................................... 11
2.3.2 Module power-off ............................................................................................................................... 11
2.3.3 Module reset ....................................................................................................................................... 11
2.4 SIM interface ...............................................................................................................................................12
2.5 USB interface ..............................................................................................................................................12
2.6 W_DISABLE# .............................................................................................................................................. 13
2.7 LED_WWAN# ............................................................................................................................................. 13
3 Pin definition ......................................................................................................................................... 14
3.1 Pin assignment .......................................................................................................................................... 14
4 Electrical specifications .................................................................................................................... 16
4.1 Absolute maximum rating....................................................................................................................... 16
4.1.1 Maximum ESD ................................................................................................................................... 16
4.2 Operating conditions ................................................................................................................................. 17
4.2.1 Operating temperature range ......................................................................................................... 17
4.2.2 Current consumption ........................................................................................................................ 17
4.2.3 LTE/3G/2G RF characteristics ....................................................................................................... 18
4.2.4 Supply/power pins ............................................................................................................................ 18
4.2.5 USB pins ............................................................................................................................................. 18
4.2.6 SIM pins .............................................................................................................................................. 18
4.2.7 PERST# pin ........................................................................................................................................ 19
4.2.8 W_DISABLE# pin ............................................................................................................................... 19
4.2.9 LED_WWAN# pin .............................................................................................................................. 19
5 Mechanical specifications ............................................................................................................... 20
6 Qualification and approvals.............................................................................................................. 21
6.1 Reliability tests ...........................................................................................................................................21
6.2 Approvals .....................................................................................................................................................21
7 Product handling .................................................................................................................................. 22
7.1 Packaging ................................................................................................................................................... 22
7.2 ESD precautions ........................................................................................................................................ 22
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8 Default settings .................................................................................................................................. 23
9 Labeling and ordering information ............................................................................................... 24
9.1 Product labeling ......................................................................................................................................... 24
9.2 Explanation of codes ................................................................................................................................ 25
9.3 Ordering information ................................................................................................................................ 26
Appendix ........................................................................................................................................................ 27
Related documentation ............................................................................................................................29
Revision history .......................................................................................................................................... 30
Contact ........................................................................................................................................................... 31
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1 Functional description
1.1 Overview
The MPCI-L2 series comprises complete and cost efficient LTE/3G/2G multi-mode cellular modules in
the industry standard PCI Express Mini Card form factor, which enables an easy integration into an
application board and it is also ideal for manufacturing of small series.
MPCI-L2modules support up to six LTE bands, up to five UMTS/DC-HSPA+ bands and up to four
GSM/(E)GPRS bands for data transmission over different regions and network operators.
With LTE Category 4 data rates of 150 Mb/s (downlink) and 50 Mb/s (uplink), the modules are ideal for
applications requiring the highest data-rates and high-speed internet access.
Typical applications are industrial computing, ruggedized terminals, video communications, wireless
routers, alarm panels and surveillance, digital signage and payment systems.
1.2 Product features
Model
LTE
UMTS
GSM
Interfaces
Audio
Features
Grade
LTE FDD category Bands HSDPA category HSUPA category Bands GNSS via modem (E)GPRS multi
-slot class
Bands UART
USB 2.0 SDIO (Master)
DDC (I
2C)
GPIOs Analog audio Digital audio Network indication Antenna supervisor MIMO 2x2 / Rx Diversity Remote SIM Access Profile
Embedded TCP/UDP stack Embedded HTTP, FTP FOTA
Dual stack IPv4/IPv6
Standard Professional Automotive
MPCI-L200
4
2,4,5
7,17
24
6
1,2,4
5,8
●
12
Quad
●
● ●
■ ■ ■
●
●
MPCI-L201
4
2,4,5
13,17
24 6 2,5 ● ● ● ● ● ● ● ● ●
MPCI-L210 1
4
1,3,5
7,8,20
24
6
1,2
5,8
●
12
Quad
● ● ● ■ ■ ■ ● ●
MPCI-L220 2
4
1,3,5
6,8,19
24
6
1,6
8,19
●
●
● ●
● ● ●
●
●
MPCI-L280
4
1,3,5
7,8,28
24
6
1,2
5,8
●
12
Quad
●
● ●
● ● ●
●
●
● = supported by all product versions ■ = supported by all product versions except versions “00”, “60”, “63"
Table 1: MPCI-L2 series main features summary
1
MPCI-L210-63S product version does not support LTE band 20
2
MPCI-L220-62S product version does not support UMTS Radio Access Technology
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1.3 Block diagram
As described in Figure 1, each MPCI-L2 series module integrates one TOBY-L2 series module, which
represents the core of the device, providing the related LTE/3G/2G modem and processing
functionalities. Additional signal conditioning circuitry is implemented for PCI Express Mini Card
compliance, and two U.FL connectors are available for easy antennas integration.
ANT1
SIM
USB
W_DISABLE#
TOBY-L2
series
Signal
conditioning
ANT2
PERST#
LED_WWAN#
U.FL
U.FL
3.3Vaux (Supply)
Boost
converter
VCC
Figure 1: MPCI-L2 series block diagram
1.4 Product description
MPCI-L2 series modules provide 4G LTE, 3G WCDMA/DC-HSPA+, 2G GSM/(E)GPRS multi-mode
technology:
• MPCI-L200 and MPCI-L201 are mainly designed for operation in America
• MPCI-L210 is mainly designed for operation in Europe, Asia and other countries
• MPCI-L220 is mainly designed for operation in Japan
• MPCI-L280 is mainly designed for operation in south-east Asia and Oceania
4G LTE
3G UMTS/HSDPA/HSUPA
2G GSM/GPRS/EDGE
3GPP Release 9
Long Term Evolution (LTE)
Evolved UTRA (E-UTRA)
Frequency Division Duplex (FDD)
DL Multi-Input Multi-Output (MIMO) 2x2
3GPP Release 8
Dual-Cell HS Packet Access (DC-HSPA+)
UMTS Terrestrial Radio Access (UTRA)
Frequency Division Duplex (FDD)
DL Rx diversity
3GPP Release 8
Enhanced Data rate GSM Evolution (EDGE)
GSM EGPRS Radio Access (GERA)
Time Division Multiple Access (TDMA)
DL Advanced Rx Performance Phase 1
Band support 3:
• MPCI-L200:
• Band 17 (700 MHz)
• Band 5 (850 MHz)
• Band 4 (1700 MHz)
• Band 2 (1900 MHz)
• Band 7 (2600 MHz)
Band support:
• MPCI-L200:
• Band 5 (850 MHz)
• Band 8 (900 MHz)
• Band 4 (AWS, i.e. 1700 MHz)
• Band 2 (1900 MHz)
• Band 1 (2100 MHz)
Band support:
• MPCI-L200:
• GSM 850 MHz
• E-GSM 900 MHz
• DCS 1800 MHz
• PCS 1900 MHz
• MPCI-L201:
• Band 17 (700 MHz)
• Band 13 (750 MHz)
• Band 5 (850 MHz)
• Band 4 (1700 MHz)
• Band 2 (1900 MHz)
• MPCI-L201:
• Band 5 (850 MHz)
• Band 2 (1900 MHz)
3
MPCI-L2 series modules support all the E-UTRA channel bandwidths for each operating band as per 3GPP TS 36.521-1 [11].
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4G LTE
3G UMTS/HSDPA/HSUPA
2G GSM/GPRS/EDGE
• MPCI-L210 4:
• Band 20 (800 MHz)
• Band 5 (850 MHz)
• Band 8 (900 MHz)
• Band 3 (1800 MHz)
• Band 1 (2100 MHz)
• Band 7 (2600 MHz)
• MPCI-L210:
• Band 5 (850 MHz)
• Band 8 (900 MHz)
• Band 2 (1900 MHz)
• Band 1 (2100 MHz)
• MPCI-L210:
• GSM 850 MHz
• E-GSM 900 MHz
• DCS 1800 MHz
• PCS 1900 MHz
• MPCI-L220:
• Band 19 (850 MHz)
• Band 6 (850 MHz)
• Band 5 (850 MHz)
• Band 8 (900 MHz)
• Band 3 (1800 MHz)
• Band 1 (2100 MHz)
• MPCI-L220 5:
• Band 19 (850 MHz)
• Band 6 (850 MHz)
• Band 8 (900 MHz)
• Band 1 (2100 MHz)
• MPCI-L280:
• Band 28 (750 MHz)
• Band 5 (850 MHz)
• Band 8 (900 MHz)
• Band 3 (1800 MHz)
• Band 1 (2100 MHz)
• Band 7 (2600 MHz)
• MPCI-L280:
• Band 5 (850 MHz)
• Band 8 (900 MHz)
• Band 2 (1900 MHz)
• Band 1 (2100 MHz)
• MPCI-L280:
• GSM 850 MHz
• E-GSM 900 MHz
• DCS 1800 MHz
• PCS 1900 MHz
LTE Power Class
• Class 3 (23 dBm)
for LTE mode
WCDMA/HSDPA/HSUPA Power Class
• Class 3 (24 dBm)
for UMTS/HSDPA/HSUPA mode
GSM/GPRS (GMSK) Power Class
• Class 4 (33 dBm) in GSM/E-GSM band
• Class 1 (30 dBm) in DCS/PCS band
EDGE (8-PSK) Power Class
• Class E2 (27 dBm) in GSM/E-GSM band
• Class E2 (26 dBm) in DCS/PCS band
Data rate
• LTE category 4:
up to 150 Mb/s DL, 50 Mb/s UL
Data rate
• MPCI-L200, MPCI-L201:
• HSDPA cat.14, up to 21 Mb/s DL6
• HSUPA cat.6, up to 5.6 Mb/s UL
• MPCI-L210, MPCI-L220, MPCI-L280:
• HSDPA cat.24, up to 42 Mb/s DL
• HSUPA cat.6, up to 5.6 Mb/s UL
Data rate 7
• GPRS multi-slot class 12 8,
CS1-CS4, up to 85.6 kb/s DL/UL
• EDGE multi-slot class 12 8,
MCS1-MCS9 up to 236.8 kb/s DL/UL
Table 2: MPCI-L2 series LTE, 3G and 2G characteristics
1.5 AT command support
The MPCI-L2 series modules support AT commands according to 3GPP standards TS 27.007 [1],
27.005 [2] and the u-blox AT command extension.
☞ For the complete list of all the supported AT commands and their syntax, see the u-blox AT
commands manual [3].
RIL (Radio Interface Layer) software for Android is available for MPCI-L2 series modules free of
charge. See the Android RIL source code application note [4] for the supported software deliveries and
more information.
4
MPCI-L210-63S product version does not support LTE band 20
5
MPCI-L220-62S product version does not support 3G Radio Access Technology
6
HSDPA category 24 capable
7
GPRS/EDGE multi-slot class determines the number of timeslots available for upload and download and thus the speed at
which data can be transmitted and received, with higher classes typically allowing faster data transfer rates.
8
GPRS/EDGE multi-slot class 12 implies a maximum of 4 slots in Down-Link and 4 slots in Up-Link, with 5 slots in total.
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1.6 Supported features
Table 3 lists some of the main features supported by MPCI-L2 series modules. For more details, see
the TOBY-L2 / MPCI-L2 system integration manual [5] and u-blox AT commands manual [3].
Feature
Description
Network Indication
LED_WWAN# signal provides the Wireless Wide Area Network status indication as specified by the
PCI Express Mini Card electromechanical specification [9].
Embedded TCP and
UDP stack 9
Embedded TCP/IP and UDP/IP stack including the Direct Link mode for TCP and UDP sockets.
Sockets can be set in Direct Link mode to establish a transparent end to end communication with an
already connected TCP or UDP socket via serial interface.
FTP 9, FTPS 10
File Transfer Protocol as well as Secure File Transfer Protocol (SSL encryption of FTP control
channel) functionalities are supported via AT commands.
HTTP 9, HTTPS 10
Hyper-Text Transfer Protocol as well as Secure Hyper-Text Transfer Protocol (SSL encryption)
functionalities are supported via AT commands.
Embedded TLS 1.2 10
With the support of X.509 certificates, Embedded TLS 1.2 provides server and client authentication,
data encryption, data signature and enables TCP/IP applications communicate over a secured and
trusted connection.
The feature can be configured and enabled by +USECMNG and +USECPRF AT commands.
DNS 9
Support for DNS functionality.
Dual stack IPv4/IPv6
Both Internet Protocol version 4 and Internet Protocol version 6 are supported in parallel.
BIP 11
Bearer Independent Protocol for Over-the-Air SIM provisioning. The data transfer to/from the SIM
uses either an already active PDP context or a new PDP context established with the APN provided by
the SIM card.
Multiple PDP contexts
Up to 8 PDP contexts can be activated, and multi secondary PDP contexts be associated to a primary
PDP context
SMS via IMS 12
Allows SMS via embedded IP Multimedia Subsystem (IMS)
Firmware update Over
AT commands (FOAT)
Firmware module upgrade over AT command interface (USB).
The feature can be enabled and configured through the +UFWUPD AT command.
Firmware update Over
The Air (FOTA) 9
Firmware module update over the LTE/3G/2G air interface.
The feature can be enabled and configured through the +UFWINSTALL AT command.
LTE DL MIMO 2x2 and
3G DL Rx Diversity
Improved cellular link quality and reliability on all operating bands.
Smart Temperature
Supervisor 13
Constant monitoring of the module board temperature:
• Warning notification when the temperature approaches an upper or lower predefined threshold
• Shutdown notified and forced when the temperature value is outside the specified range (shutdown
suspended in case of an emergency call in progress)
The Smart Temperature Supervisor feature can be enabled and configured through the +USTS AT
command.
☞ The sensor measures board temperature, which can differ from ambient temperature.
Remote SIM Access
Profile (SAP)14
Allows access and use of a remote (U)SIM card instead of the local SIM card directly connected to the
module (U)SIM interface. The module acts as an SAP Client establishing a connection and
performing data exchange to a SAP Server directly connected to the remote SIM. The modules
provide a dedicated USB SAP channel and a dedicated multiplexer SAP channel over UART for
communication with the remote (U)SIM card.
The feature can be configured and enabled by +USAPMODE and + USAPIND AT commands.
9
Not supported by “00”, “60” and “63” product versions
10
Not supported by “00”, “01”, “60”, “63” and MPCI-L201-02S product versions.
11
Not supported by “00”, “60”, “63” product versions. Not supported by MPCI-L201-01S and MPCI-L201-02S-00 product versions
in AT&T configuration.
12
Not supported by “00”, “03”, “60”, “62”, “63”, MPCI-L200-02S, MPCI-L210-02S, MPCI-L220-02S and MPCI-L280-02S product
versions.
13
Not supported by “00”, “01”, “60” and “63” product versions.
14
Not supported by “00”, “01”, “02”, “60”, “62” and “63” product versions
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Feature
Description
Power saving
The power saving configuration is by default disabled, but it can be configured using the +UPSV AT
command. When power saving is enabled, the module automatically enters the low power idle-mode
whenever possible, reducing current consumption.
During idle-mode, the module processor core runs with the internal RTC 32 kHz reference clock.
Fast Dormancy
The Fast Dormancy feature, defined in 3GPP Rel.8, allows reduction of current consumption and
network utilization during periods of data inactivity. It can be activated by +UFDAC and
+UDCONF=61 AT commands.
Radio Policy Manager
(RPM)15
The Radio Policy Manager (RPM) feature provides a more efficient access to the network, controlling
the number of network accesses per service type over a fixed amount of time. For more details on the
RPM feature see the GSMA IoT device connection efficiency guidelines [12].
The feature can be enabled through the +URPM and +URPMCONF AT commands.
Table 3: Some of the main features supported by MPCI-L2 series modules
15
Not supported by product versions "00", "02", "60", "62", "63" of MPCI -L2x0 modules, not supported by product version "01" of
MPCI -L201 modules, and not supported by product versions MPCI-L2x0-03S-00 and MPCI -L201-02S-00
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