u-blox JODY-W2 User Manual

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telematics applications with

JODY-W2 series

Host-based multiradio modules with Wi-Fi and Bluetooth 5

Data sheet

Abstract

This technical data sheet describes the JODY-W2 series modules with 1x1 802.11n/ac and dualmode Bluetooth 5. JODY-W2 is ideal for in-vehicle infotainment and simultaneous use cases requiring high data rates, such as in-car hotspots, Wi-Fi display applications such as Apple CarPlay, or video streaming across multiple clients. Connection to a host processor is through SDIO, or High-Speed UART interfaces (Bluetooth only).

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JODY-W2 series - Data sheet

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Document information

Title JODY-W2 series

Subtitle Host-based multiradio modules with Wi-Fi and Bluetooth 5

Document type Data sheet

Document number UBX-18017567

Revision and date R07 28-Jan-2021

Disclosure restriction C1 - Public

Product status

Functional Sample Draft For functional testing. Revised and supplementary data will be published later.

In Development / Prototype

Engineering Sample Advance information Data based on early testing. Revised and supplementary data will be published later.

Initial Production Early production information Data from product verification. Revised and supplementary data may be published later.

Mass Production / End of Life

This document applies to the following products:

Product name Type number Chipset PCN reference

JODY-W263-A JODY-W263-00A-00 88W8987A N/A Initial production JODY-W263-A JODY-W263-01A-00 88W8987S N/A Initial production

JODY-W263 JODY-W263-00B-00 88W8987 N/A Initial production

Corresponding content status

Objective specification Target values. Revised and supplementary data will be published later.

Production information Document contains the final product specification.

Product status

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-blox AG.

JODY-W2 series - Data sheet

Document information ............................................................................................................................. 2

Contents ....................................................................................................................................................... 3

1 Functional description ....................................................................................................................... 5

1.1 Overview ........................................................................................................................................................ 5

1.2 Applications ................................................................................................................................................. 5

1.3 Block diagram .............................................................................................................................................. 6

1.4 Product features ......................................................................................................................................... 7

1.4.1 Wi-Fi features ...................................................................................................................................... 7

1.4.2 Wi-Fi Simultaneous operation modes ............................................................................................ 8

1.4.3 Bluetooth features ............................................................................................................................. 8

1.4.4 General product features .................................................................................................................. 8

1.4.5 Reserved MAC addresses ................................................................................................................. 8

2 Interfaces .............................................................................................................................................. 9

2.1 Host interface configuration .................................................................................................................... 9

2.2 SDIO interface .............................................................................................................................................. 9

2.2.1 Default speed and high speed modes (1.8 V) ............................................................................. 10

2.2.2 SDR12, SDR25, SDR50 modes (up to 100 MHz, 1.8 V) ............................................................ 11

2.2.3 SDR104 mode (208 MHz, 1.8 V) .................................................................................................... 12

2.2.4 DDR50 Mode (50 MHz, 1.8 V) ......................................................................................................... 12

2.3 High Speed UART interface .................................................................................................................... 14

2.4 PCM Interface ............................................................................................................................................ 15

2.4.1 PCM Interface specifications ......................................................................................................... 15

2.5 LTE Coexistence interface ...................................................................................................................... 16

3 Pin definition...................................................................................................................................... 17

3.1 Pin description ........................................................................................................................................... 17

4 Electrical specification ................................................................................................................... 20

4.1 Absolute maximum ratings .................................................................................................................... 20

4.2 Operating conditions ................................................................................................................................ 20

4.3 Wi-Fi power consumption ....................................................................................................................... 21

4.4 Bluetooth power consumption ............................................................................................................... 22

4.5 Digital pad ratings ..................................................................................................................................... 22

4.6 Radio specifications ................................................................................................................................. 22

4.6.1 Bluetooth ............................................................................................................................................ 22

4.6.2 Wi-Fi .................................................................................................................................................... 23

5 Host drivers and firmware ............................................................................................................. 25

5.1 General principle ........................................................................................................................................ 25

5.2 Supported operating systems ............................................................................................................... 25

5.2.1 Linux .................................................................................................................................................... 25

5.2.2 Android ................................................................................................................................................ 25

6 Mechanical specifications ............................................................................................................. 26

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7 Approvals ............................................................................................................................................ 27

7.1 European Union regulatory compliance ............................................................................................... 27

7.1.1 Radio Equipment Directive (RED) 2014/53/EU .......................................................................... 27

7.1.2 Compliance with the RoHS directive ............................................................................................ 27

7.2 United States (FCC) ................................................................................................................................. 27

7.2.1 FCC compliance statement ............................................................................................................ 28

7.3 Canada (ISED) ............................................................................................................................................ 28

7.3.1 ISED compliance statement ........................................................................................................... 29

7.4 Certification in other countries .............................................................................................................. 30

7.5 Approved antennas .................................................................................................................................. 30

7.5.1 Wi-Fi / Bluetooth dual band antennas .......................................................................................... 30

7.5.2 Bluetooth antenna ............................................................................................................................ 30

8 Product handling .............................................................................................................................. 31

8.1 Packaging ................................................................................................................................................... 31

8.1.1 Reels .................................................................................................................................................... 31

8.1.2 Tapes ................................................................................................................................................... 31

8.2 Shipment, storage, and handling .......................................................................................................... 31

8.2.1 Moisture sensitivity levels .............................................................................................................. 31

8.2.2 Mounting process and soldering recommendations ................................................................ 32

8.2.3 ESD handling precautions .............................................................................................................. 32

9 Labeling and ordering information ............................................................................................. 33

9.1 Product labeling ......................................................................................................................................... 33

9.2 Explanation of codes ................................................................................................................................ 34

9.3 Ordering codes ........................................................................................................................................... 34

Appendix .................................................................................................................................................... 35

A Glossary .............................................................................................................................................. 35

Related documents ................................................................................................................................ 37

Revision history ....................................................................................................................................... 38

Contact ....................................................................................................................................................... 39

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JODY-W2 series - Data sheet

1 Functional description

1.1 Overview

The JODY-W2 series are compact modules based on the NXP 88W8987 chipset family. The chipsets used in the automotive grade JODY-W2 modules are AEC-Q100 compliant. They enable Wi-Fi, Bluetooth, and Bluetooth Low Energy (LE) communication, and are ideal for automotive and industrial applications.

The JODY-W2 modules can be operated in the following modes:

• Wi-Fi 1x1 802.11a/b/g/n/ac in 2.4 GHz or 5 GHz

• Dual-mode Bluetooth 5, including audio, can be operated fully simultaneous with Wi-Fi

JODY-W2 undergoes extended automotive qualification according to ISO 16750-4 and is manufactured in line with ISO/TS 16949. Connection to a host processor is through SDIO, or High-Speed UART interfaces.

1.2 Applications

Automotive applications

• In-car Access Point for internet access

• In the car applications such as Apple Car-Play, Miracast, and so on.

• Rear-seat display

• Rapid sync-n-go applications and fast content download to the vehicle.

• Hands-free equipment (Bluetooth)

Industrial applications

• Manufacturing floor automation, wireless control terminals and point-to-point backhaul

• Machine control

• Medical in-hospital applications

• Security and surveillance

• Outdoor content distribution

• Robust wireless connectivity in a broad range of industrial applications

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JODY-W2 series - Data sheet

1.3 Block diagram

Figure 1 shows the various components and interfaces supported in JODY-W2 series modules.

Figure 1: JODY-W263-A block diagram

☞ JODY-W2 variants with a dedicated LTE Coexistence Filter (2.4 GHz BPF) are available on

request. Coexistence filters are only needed if LTE bands 7, 38, 40, and 41 are used.

The type numbers and corresponding configuration options for JODY-W2 series modules are shown in Table 2.

Type number

JODY-W263-00A-00 JODY-W263-01A-00 JODY-W263-00B-00

Table 1: Supported JODY-W2 configurations

Antenna configuration LTE Coexistance BPF

ANT0 ANT1 BPF_0 BPF_1

Bluetooth 2.4 and 5 GHz Wi-Fi No No

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JODY-W2 series - Data sheet

1.4 Product features

Item JODY-W263-A JODY-W263

Grade Automotive Professional

Chipset NXP 88W8987A/S NXP 88W8987

Antenna type Two antenna pins for Wi-Fi and

Bluetooth

Supported Wi-Fi radio modes IEEE 802.11 a/b/g/n/ac IEEE 802.11 a/b/g/n/ac

Supported Wi-Fi bands 2.5 / 5 GHz 2.5 / 5 GHz

Max. Wi-Fi output power 19 dBm (at antenna pin) 19 dBm (at antenna pin)

Bluetooth version 5.0 5.0

Bluetooth profiles HCI HCI

Supported Bluetooth radio modes Bluetooth BR/EDR

Bluetooth Low Energy

Supported Bluetooth LE data rates 1 Mbps

2 Mbps

LTE coexistence filter - -

OS support Linux / Android Linux / Android

Interfaces SDIO 3.0 (Wi-Fi/Bluetooth)

UART (Bluetooth) PCM (Bluetooth digital audio)

Features Micro access point with max. 8

connected clients

Simultaneous client and access point mode

WPA3 WPA3

RF parameters/MAC addresses in OTP RF parameters/MAC addresses in OTP

Max. ambient operating temperature 85 °C (JODY-W263-00A)

105 °C (JODY-W263-01A)

Module size 19.8 x 13.8 mm 19.8 x 13.8 mm

Two antenna pins for Wi-Fi and Bluetooth

Bluetooth BR/EDR Bluetooth Low Energy

1 Mbps 2 Mbps

SDIO 3.0 (Wi-Fi/Bluetooth) UART (Bluetooth) PCM (Bluetooth digital audio)

Micro access point with max. 8 connected clients

Simultaneous client and access point mode

85 °C

Table 2: JODY-W2 series product features

1.4.1 Wi-Fi features

• Standards: IEEE 802.11a/b/g/n/ac/d/e/h/i/k/mc/r/u/v/w1

• IEEE 802.11ac PHY data rates up to 433 Mbit/s (80 MHz)

• 20/40/80 MHz bandwidth

• Simultaneous client and access point operation

• Support of Wi-Fi direct/P2P mode

• 128-bit AES hardware crypto engine. TKIP/WEP, AES/CCMP, AES/CMAC, AES/GCMP

• WPA/WPA2 and WAPI encryption is supported by hardware

• SDIO 3.0 host interface for Wi-Fi (and optionally Bluetooth)

• WPA3-SAE is supported in station and AP mode

802.11k/r/u/v in STA mode only

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JODY-W2 series - Data sheet

1.4.2 Wi-Fi Simultaneous operation modes

• AP Simultaneous operation

o AP + AP - Multi-BSS support (MAX_UAP_BSS = 2) o AP + AP + STA o AP + STA

• P2P Simultaneous operation

o P2P + STA o P2P + AP o P2P + STA + AP

☞ Please note that two or more Wi-Fi interfaces should operate in the same channel.

1.4.3 Bluetooth features

• Bluetooth 5 with Bluetooth Low Energy

• BDR and EDR packet types – 1 Mbit/s, 2 Mbit/s, and 3 Mbit/s

• LE 2 Mbit/s PHY

• LE Data Length Extension

• LE Advertising Extension

• Bluetooth Class 1 and 2

• Standard SDIO and UART HCI transport layer

• PCM interface for voice applications

1.4.4 General product features

• Driver support for Linux, Android

• Coexistence with cellular and other on-chip radios

• Small footprint (19.8 mm x 13.8 mm), LGA package

• Automotive qualification tests (climatic, mechanical, and operating life tests) in accordance with

ISO 16750-4 planned

1.4.5 Reserved MAC addresses

JODY-W2 series modules have four consecutive MAC addresses that are unique for each module variant. The first two of these four addresses are configured during production.

The first address is used for the Bluetooth communication, while the second address is configured for Wi-Fi communication. The Data Matrix Code shown on the product label includes the Bluetooth MAC address, as shown in section 9. The remaining two MAC addresses are not used in the manufacturing configuration but are reserved for module usage.

MAC address Assignment Last two bits of MAC address Example

Module1, address 1 Bluetooth 0b00

Module1, address 2 Wi-Fi 0b01 D4:CA:6E:44:00:05

Module1, address 3 (free for use) 0b10 D4:CA:6E:44:00:06

Module1, address 4 (free for use) 0b11 D4:CA:6E:44:00:07

Module2, address 1 Bluetooth 0b00

Module2, address 2 Wi-Fi 0b01 D4:CA:6E:44:00:09

Module2, address 3 (free for use) 0b10 D4:CA:6E:44:00:0A

Module2, address 4 (free for use) 0b11 D4:CA:6E:44:00:0B

D4:CA:6E:44:00:04

D4:CA:6E:44:00:08

Table 3: MAC address assignment

For further details about using the MAC address for secondary Wi-Fi interfaces, refer to section 3.8.1 in the JODY-W2 system integration manual [2].

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JODY-W2 series - Data sheet

2 Interfaces

2.1 Host interface configuration

The JODY-W2 series provides two configuration pins, CONFIG[0] and CONFIG[1], for selecting the host interface configuration and additional configuration pins are used to set parameters following a reset. To set a configuration bit to 0, attach a 100 kΩ resistor to GND. No external pull-up resistor is required to set a configuration bit to 1. Table 4 Table 5 show all strapping options.

CONFIG[1] CONFIG[0] Wi-Fi Bluetooth Firmware download Number of SDIO functions

1 0 SDIO UART SDIO+UART(parallel/Serial) 1 (Wi-Fi)

1 1 SDIO SDIO SDIO+SDIO(parallel/Serial) 2 (Wi-Fi, Bluetooth)

Table 4: Host interface configuration options

Additional configuration pins are listed in Table 5.

Name Pin Description

PCM_OUT 17 Set high during reset.

BT_UART_RTS 38 Set high during reset.

LTE_COEX_TX 13 Set high during reset.

BT_UART_TX 36 Set low during reset. A 51 kΩ pull down resistor is implemented on the module.

Table 5: Additional configuration pins

2.2 SDIO interface

The SDIO device interface conforms to the industry standard SDIO 3.0 specification (UHS-I, up to 104 MByte/s). The interface allows host controllers to access the Wi-Fi, and optionally Bluetooth, functions of JODY-W2 series modules using the SDIO bus protocol. The interface supports 4-bit SDIO transfer mode at the full clock range up to 208 MHz. For SDIO 2.0 running at 25 MHz and 50 MHz clock frequencies. Only a signal voltage of 1.8 V is supported for all bus speed modes.

Bus speed mode Max clock frequency [MHz] Signal voltage [V] Max. bus speed [MB/s]

DS: Default Speed 25 1.8 12.5

HS: High Speed 50 1.8 25

SDR12 25 1.8 12.5

SDR25 50 1.8 25

SDR50 100 1.8 50

SDR104 208 1.8 104

DDR50 50 1.8 50

Table 6: Supported SDIO bus speed modes

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JODY-W2 series - Data sheet

SDIO_CLK

INPUT

OUTPUT

THL

WLtWH

TLH

ODLY (max)

ODLY (min)

ISUtIH

SDIO_CLK

INPUT

OUTPUT

THL

WLtWH

TLH

ODLYtOH

ISUtIH

50% VCC

2.2.1 Default speed and high speed modes (1.8 V)

Figure 2: SDIO Protocol timing diagram - default speed mode (1.8 V)

Figure 3: SDIO Protocol timing diagram – high speed mode (1.8 V)

Symbol Parameter Condition Min. Typ. Max. Units

fPP Clock frequency – Data

Transfer Mode

High speed 0 - 50 MHz

fOD Clock frequency –

Identification Mode

High speed 0 - 400 KHz

tWL Clock low time Normal 10 - - ns

High speed 7 - - ns

tWH Clock high time Normal 10 - - ns

High speed 7 - - ns

Clock rise time Normal - - 10 ns

TLH

High speed - - 3 ns

Clock low time Normal - - 10 ns

THL

High speed - - 3 ns

Input setup time Normal 5 - - ns

ISU

High speed 6 - - ns

Normal 0 - 25 MHz

Normal 0 400 KHz

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JODY-W2 series - Data sheet

SDIO_CLK

INPUT

OUTPUT

ODLY

IStIH

50% VCC

CLK

Symbol Parameter Condition Min. Typ. Max. Units

tIH Input hold time Normal 5 - - ns

High speed 2 - - ns

Output delay time Normal - - 14 ns

ODLY

Output delay time CL ≤ 40

ODLY

High speed - - 14 ns

pF (1 card)

tOH Output hold time High speed 2.5 - - ns

Table 7: SDIO timing data – Default speed, High speed modes (1.8 V)

2.2.2 SDR12, SDR25, SDR50 modes (up to 100 MHz, 1.8 V)

Figure 4: SDIO protocol timing diagram – SDR12, SDR25, SDR50 modes (up to 100 MHz, 1.8 V)

Symbol Parameter Condition Min. Typ. Max. Units

fPP Clock frequency SDR12 0 - 25 MHz

SDR25 0 - 50 MHz

SDR50 0 - 100 MHz

tIS Input setup time SDR12/25/50 3 - - ns

tIH Input hold time SDR12/25/50 0.8 - - ns

Clock time SDR12/25/50 10 - 40 ns

CLK

Rise time, fall time

CR, tCF,

SDR12/25/50 - 0.2*T TCR, TCF < 2 ns (max) at 100 MHz C

= 10 pF

CARD

Output delay time

ODLY

≤ 30 pF

SDR12/25 - - 14 ns

SDR50 - 7.5

tOH Output hold time

= 15 pF

SDR12/25/50 1.5 - - ns

Table 8: SDIO timing data – SDR12, SDR25, SDR50 modes (up to 100 MHz, 1.8 V)

CLK

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JODY-W2 series - Data sheet

fPP

Clock frequency

SDR104

0 - 208

MHz

TIS

Input setup time

SDR104

1.4 - -

TIH

Input hold time

SDR104

0.8 - -

CLK

Clock time

SDR104

4.8 - -

CARD

TOP

Card output phase

SDR104

0 - 10

ODW

SDIO_CLK

INPUT

OUTPUT

ODW

50% VCC

CLK

SDIO_CLK

CMD INPUT

CMD OUTPUT

ODLY

OHLD

tISt

50% VCC

CLK

2.2.3 SDR104 mode (208 MHz, 1.8 V)

Figure 5: SDIO protocol timing diagram – SDR104 mode (208 MHz, 1.8 V)

Symbol Parameter Condition Min. Typ Max. Units

Rise time, fall time

CR, tCF,

Output timing of variable data window SDR104 2.88 - - ns

, TCF < 0.96 ns (max) at 208 MHz

= 10 pF

SDR104 - 0.2*T

Table 9: SDIO timing data – SDR104 mode (208 MHz) (1.8 V)

2.2.4 DDR50 Mode (50 MHz, 1.8 V)

Figure 6: SDIO CMD timing diagram – DDR50 mode (50 MHz, 1.8 V)

CLK

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u-blox JODY-W2 User Manual

Specifications and Main Features

Frequently Asked Questions

User Manual

Document information

Contents

1 Functional description

1.1 Overview

1.2 Applications

1.3 Block diagram

1.4 Product features

1.4.1 Wi-Fi features

1.4.2 Wi-Fi Simultaneous operation modes

1.4.3 Bluetooth features

1.4.4 General product features

1.4.5 Reserved MAC addresses

2 Interfaces

2.1 Host interface configuration

2.2 SDIO interface

2.2.1 Default speed and high speed modes (1.8 V)

2.2.2 SDR12, SDR25, SDR50 modes (up to 100 MHz, 1.8 V)

2.2.3 SDR104 mode (208 MHz, 1.8 V)

2.2.4 DDR50 Mode (50 MHz, 1.8 V)