u blox EMMYW165 Users Manual
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EMMY-W1 Antenna reference design
Topic :
Doc.No: UBX-16015910
Revision R02
Date: Name Signature
Created 01-Jul-2016 Stefano Bianconi sbia
Checked
Released 23-Sep-2016 Daniel Dietterle ddie
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EMMY-W1 Antenna reference design
1 Scope
This document defines the essential specifications necessary to implement the EMMY-W1 antenna reference
designs. The information contained herein and its references should be sufficient to guide a skilled person in an
attempt to implement the design on a host carrier. It will provide the designer with PCB layout details and
expected performance specifications.
The document supports the four different PCB designs for Wi-Fi:
• Two connector-based designs for the use of external antennas (one for each antenna pin of the module)
• Two designs based on SMD antennas (one for each antenna pin of the module)
This document also supports general guidelines for the design of the NFC interface.
2 FCC/IC ID reference
Model FCC ID IC ID
EMMY-W161
EMMY-W163
EMMY-W165
Table 1: FCC and IC IDs for different models of EMMY-W1 series
XPYEMMYW161 8595A-EMMYW161
XPYEMMYW163 8595A-EMMYW163
XPYEMMYW165 8595A-EMMYW165
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3 General description
When using the EMMY-W1 together with this antenna reference design, the circuit trace layout must be made
in strict compliance with the instructions below.
All the components placed on each RF trace must be kept as indicated in the reference design, even if not used.
The PCB areas of unused reference designs must be flooded with ground.
1
2
Figure 1: Antenna Reference design embedded in a host carrier PCB
Reference Description
1 Host carrier PCB (light green)
2 Antenna reference design (dark green)
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3.1 Floor plan and PCB stack-up
This section describes where the critical components are positioned on the reference design. It also presents the
stack-up of the four layers of the PCB.
10
3
4
5
6
7
8
9
Figure 2: EMMY-W1 antenna reference design
Reference Description
3 SMD antenna
4 Antenna impedance matching network
5 Connectors for external antenna
6 Antenna coplanar microstrip, matched to 50 Ω
7 Top layer GND-plane
8 Antenna impedance matching network
9 SMD antenna
10 ELLA-W1 module
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3.2 PCB stack-up
The stack-up used in the reference design is specified in Table 2.
PCB Layer Material Thickness
Soldermask Top Generic LPI Soldermask 25 µm
Top Copper Foil 35 µm
Dielectric Pre-preg 2x7628 360 µm
L2 Copper Foil 35 µm
Dielectric Core 700 µm +/-10%
L3 Copper Foil 35 µm
Dielectric Pre-preg 2x7628 360 µm
Bottom Copper Foil 35 µm
Soldermask Bottom Generic LPI Soldermask 25 µm
Table 2: Stack-up of EVK-EMMY-W1
3.2.1 RF trace specification
The 50 Ω coplanar micro-strip dimensions used in these reference designs are stated in Figure 3 and Table 3.
Figure 3: Coplanar micro-strip dimension specification
Item Value
S 400 µm
W 600 µm
T 35 µm
H 360 µm
Table 3: Coplanar micro-strip specification
3.3 Mechanical dimensions
The Mechanical dimensions and position of the components are specified in Figure 4.
The layers beneath the ‘top layer’ have the same dimensions and are filled with ground. No RF traces are routed
in those layers.
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