u blox EMMYW161, EMMYW165, EMMYW163 Data Sheet

Abstract
This technical data sheet describes the EMMY-W1 series modules with Wi-Fi 802.11ac, Bluetooth v4.2 (Bluetooth® Smart Ready) and Near-Field Communication (NFC) designed for both simultaneous and independent operation. These modules include an integrated MAC/baseband processor and RF front-end components and can connect to a host processor through SDIO 3.0 or high-speed UART interfaces. A PCM interface is available for Bluetooth audio applications. These modules are offered in both professional and automotive grades.
EMMY-W1 series
Host-based multiradio modules with Wi-Fi, Bluetooth and NFC
Data Sheet
EMMY-W1 series - Data Sheet
Document Information
Title
EMMY-W1 series
Subtitle
Host-based multiradio modules with Wi-Fi, Bluetooth and NFC
Document type
Data Sheet
Document number
UBX-15011785
Revision and date
R05
15-Dec-2016
Disclosure restriction
Product Status
Corresponding content status
Functional Sample
Draft
For functional testing. Revised and supplementary data will be published later.
In Development / Prototype
Objective Specification
Target values. Revised and supplementary data will be published later.
Engineering Sample
Advance Information
Data based on early testing. Revised and supplementary data will be published later.
Initial Production
Early Prod. Information
Data from product verification. Revised and supplementary data may be published later.
Mass Production / End of Life
Production Information
Final product specification.
Product name
Type number
Firmware version
PCN reference
Product Status
EMMY-W161
EMMY-W161-00B-00
EMMY-W161-00B
N/A
Initial Production
EMMY-W161-A
EMMY-W161-00A-00
EMMY-W161-00A
N/A
Initial Production
EMMY-W163
EMMY-W163-00B-00
EMMY-W163-00B
UBX-16017374
Initial Production
EMMY-W163-A
EMMY-W163-00A-00
EMMY-W163-00A
UBX-16017374
Initial Production
EMMY-W165
EMMY-W165-00B-00
EMMY-W165-00B
N/A
Initial Production
EMMY-W165-A
EMMY-W165-00A-00
EMMY-W165-00A
N/A
Initial Production
This document applies to the following products:
u-blox reserves all rights to this document and the information contained herein. Products, names, logos and designs described herein may in whole or in part be subject to intellectual property rights. Reproduction, use, modification or disclosure to third parties of this document or any part thereof without the express permission of u-blox is strictly prohibited.
The information contained herein is provided “as is” and u-blox assumes no liability for the use of the information. No warranty, either express or implied, is given, including but not limited, with respect to the accuracy, correctness, reliability and fitness for a particular purpose of the information. This document may be revised by u-blox at any time. For most recent documents, visit www.u-blox.com.
Copyright © 2017, u-blox AG.
u-blox® is a registered trademark of u-blox Holding AG in the EU and other countries. ARM® is the registered trademark of ARM Limited in the EU and other countries.
UBX-15011785 - R05 Page 2 of 47
EMMY-W1 series - Data Sheet

Contents

Contents .............................................................................................................................. 3
1 Functional description .................................................................................................. 5
1.1 Overview .............................................................................................................................................. 5
1.2 Applications .......................................................................................................................................... 5
1.3 Product features ................................................................................................................................... 6
1.4 Block diagrams ..................................................................................................................................... 6
1.5 Product description ............................................................................................................................... 7
1.6 Supported features ............................................................................................................................... 8
1.6.1 Wi-Fi features ................................................................................................................................ 8
1.6.2 Bluetooth features ......................................................................................................................... 8
1.6.3 NFC features ................................................................................................................................. 8
1.6.4 General product features ............................................................................................................... 8
1.6.5 Compliance ................................................................................................................................... 9
1.7 Additional reserved MAC addresses ...................................................................................................... 9
2 Interfaces .................................................................................................................... 10
2.1 Operation mode configuration ........................................................................................................... 10
2.2 SDIO interface .................................................................................................................................... 10
2.2.1 Default speed and High speed modes ......................................................................................... 10
2.2.2 SDR12, SDR25, SDR50 Modes (up to 100 MHz) (1.8 V) ............................................................... 11
2.2.3 SDR104 Mode (208 MHz) (1.8 V) ................................................................................................ 12
2.2.4 DDR50 Mode (50 MHz) (1.8 V) .................................................................................................... 13
2.3 High Speed UART interface ................................................................................................................. 14
2.4 PCM interface ..................................................................................................................................... 15
2.4.1 PCM interface specifications ........................................................................................................ 15
2.5 GPIO interface .................................................................................................................................... 16
3 Pin Definition .............................................................................................................. 18
3.1 Pin description .................................................................................................................................... 18
3.2 Reset configuration............................................................................................................................. 20
4 Electrical specification ................................................................................................ 21
4.1 Absolute maximum ratings ................................................................................................................. 21
4.2 Operating conditions .......................................................................................................................... 21
4.3 Digital pin ratings ............................................................................................................................... 22
4.4 Wi-Fi power consumption ................................................................................................................... 22
4.5 Bluetooth power consumption ........................................................................................................... 23
4.6 NFC power consumption .................................................................................................................... 23
4.7 Radio specifications ............................................................................................................................ 24
4.7.1 Wi-Fi ........................................................................................................................................... 24
4.7.2 Bluetooth .................................................................................................................................... 25
4.7.3 LTE co-existence .......................................................................................................................... 25
4.7.4 Near field communication ........................................................................................................... 26
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EMMY-W1 series - Data Sheet
5 Host drivers and firmware ......................................................................................... 27
5.1 General principle ................................................................................................................................ 27
5.2 Supported operating systems .............................................................................................................. 27
5.2.1 Linux ........................................................................................................................................... 27
6 Mechanical specifications .......................................................................................... 28
7 Qualification and approvals ...................................................................................... 30
7.1 Approvals ........................................................................................................................................... 30
7.1.1 European Union regulatory compliance ....................................................................................... 30
7.1.2 FCC compliance .......................................................................................................................... 31
7.1.3 IC compliance.............................................................................................................................. 32
7.1.4 Australia and New Zealand regulatory compliance ....................................................................... 33
7.1.5 Korean KCC compliance .............................................................................................................. 33
7.1.6 Japan radio equipment compliance ............................................................................................. 33
7.2 Approved antennas ............................................................................................................................ 34
7.2.1 Bluetooth antenna ...................................................................................................................... 34
7.2.2 NFC antenna ............................................................................................................................... 34
7.3 FCC and IC IDs ................................................................................................................................... 35
7.4 Korea KCC IDs .................................................................................................................................... 35
7.5 Japan Giteki IDs .................................................................................................................................. 35
7.6 Bluetooth qualification ....................................................................................................................... 35
7.6.1 Bluetooth host stack .................................................................................................................... 35
8 Product handling ........................................................................................................ 36
8.1 Packaging ........................................................................................................................................... 36
8.1.1 Reels ........................................................................................................................................... 36
8.1.2 Tapes .......................................................................................................................................... 36
8.2 Shipment, storage and handling ......................................................................................................... 37
8.2.1 Moisture sensitivity levels ............................................................................................................. 37
8.2.2 Mounting process and soldering recommendations ..................................................................... 37
8.2.3 ESD handling precautions ............................................................................................................ 38
9 Labeling and ordering information ........................................................................... 40
9.1 Product labeling .................................................................................................................................. 40
9.2 Explanation of codes........................................................................................................................... 41
9.3 Ordering codes ................................................................................................................................... 42
Appendix .......................................................................................................................... 43
A Glossary ...................................................................................................................... 43
Related documents........................................................................................................... 45
Revision history ................................................................................................................ 46
Contact .............................................................................................................................. 47
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EMMY-W1 series - Data Sheet
1
2

1 Functional description

1.1 Overview

The EMMY-W1 series provides a complete short range transceiver solution that can easily be integrated into automotive and industrial applications. The modules are designed for both simultaneous and independent operation of the following technologies:
IEEE 802.11a/b/g/n/ac data rates for Wi-Fi Dual-mode Bluetooth v4.2 NFC
The EMMY-W1 series is a surface-mount device (SMD) component and can be used as a Wi-Fi micro-access point supporting up to 10 clients. A coexistence feature at the chip level improves parallel use of Bluetooth and Wi-Fi communication. For highest throughput and performance, a module variant with separate Wi-Fi and Bluetooth antenna pins is also available.
The modules include an integrated MAC/baseband processor and RF front-end components and can connect to a host processor through SDIO 3.0 and high-speed UART interfaces. The EMMY-W1 series are offered in automotive and professional grades (see Ordering codes and Block diagrams). The automotive grade variant includes an automotive-qualified (AEC-Q100) chipset. A host driver for Linux 3.x is available free of charge. The modules are radio type approved for Europe (ETSI R&TTE), US (FCC CFR 47 part 15 unlicensed modular transmitter approval), Canada (IC RSS), Korea (KCC)1, Japan (MIC)1 and Australia / New Zealand (ACMA)2. Approvals for other countries may be possible upon inquiry.

1.2 Applications

Automotive applications
High definition (HD) video streaming (headrest displays, rear-view camera) and in-car gaming Rapid sync-n-go applications and fast content download to the vehicle Hands-free equipment (Bluetooth) Personalized adjustment of comfort functions through NFC
Industrial applications
Manufacturing floor automation, wireless control terminals and point-to-point backhaul Outdoor content distribution Mobile video streaming Robust wireless connectivity in a broad range of industrial applications
EMMY-W163 and EMMY-W163-A only EMMY-W161 and EMMY-W161-A only
UBX-15011785 - R05 Functional description
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1.3 Product features

Model
Radio
Interfaces
Power
Connectors
Features
Grade
Wi-Fi 2.4 GHz channels 1
-13
Wi-Fi 5 GHz channels 36
-165
Wi-Fi IEEE 802.11 version
NFC Bluetooth qualification Bluetooth profiles Max output power at antenna p
in
Antenna type LTE filter High
-speed UART
SDIO 3.0 PCM (Bluetooth audio) Power supply: 3.0
-3.6 V
Solder pins
Micro Access Point AES hardware support RF parameters in OTP memory MAC addre
sses in OTP memory
Standard Professional Automotive
EMMY-W161
• • a/b/g/n/ac
v4.2
H
18 dBm
1p • • • • • • • • • •
EMMY-W163
• • a/b/g/n/ac
v4.2 H 18 dBm
2p • • • • • • • • •
EMMY-W165
• • a/b/g/n/ac
v4.2
H
18 dBm
1p • • • • • • • • •
MAC/BB/RADIO
2.4GHz WLAN TX
2.4GHz WLAN/BT RX
BT TX
WLAN & BT ANT
5GHz WLAN TX/RX
5GHz BPF &
DIPLEXER
2.4GHz BPF
EMMY-W161 / EMMY-W165
SDIO
37.4 MHz Crystal
VIO1
UART
VIO2
PCM
VIO2
BT LTE
COEX
VIO2
BT LED
WLAN
LED
PDn
SP3T
3.3V VIO1 VIO2 GND
NFC
COIL
VIO2
GPIOs
DC/DC
3.3V
1.8V
1.1V
EMMY-W1 series - Data Sheet
H = HCI 1p = One pin for combined external antenna for Bluetooth and Wi-Fi
2p = Two pins for separate external antennas for Bluetooth and Wi-Fi
Table 1: EMMY-W1 series main features summary

1.4 Block diagrams

The block diagrams of the EMMY-W1 series are provided in this section.
Figure 1: EMMY-W161/EMMY-W165 block diagram - Single antenna variant
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EMMY-W1 series - Data Sheet
Model
Description
EMMY-W161
Professional grade module with 1 combined antenna pin for Wi-Fi and Bluetooth and integrated LTE filter
EMMY-W163
Professional grade module with 2 separate antenna pins for Wi-Fi and Bluetooth (no LTE filter)
EMMY-W165
Professional grade module with 1 combined antenna pin for Wi-Fi and Bluetooth (no LTE filter)
EMMY-W161-A
Automotive grade module with 1 combined antenna pin for Wi-Fi and Bluetooth and integrated LTE filter
EMMY-W163-A
Automotive grade module with 2 separate antenna pins for Wi-Fi and Bluetooth (no LTE filter)
EMMY-W165-A
Automotive grade module with 1 combined antenna pin for Wi-Fi and Bluetooth (no LTE filter)
MAC/BB/RADIO
2.4GHz WLAN TX
2.4GHz WLAN RX
BT RX/TX
WLAN
ANT
5GHz WLAN TX/RX
5GHz BPF &
DIPLEXER
2.4GHz BPF
EMMY-W163
SDIO
37.4 MHz Crystal
VIO1
UART
VIO2
PCM
VIO2
BT LTE
COEX
VIO2
BT LED
WLAN
LED
PDn
2.4GHz BPF
SP3T
3.3V VIO1 VIO2 GND
NFC
COIL
BT
ANT
VIO2
GPIOs
DC/DC
3.3V
1.8V
1.1V
In EMMY-W161, the band pass filter (2.4 GHz BPF) is a BAW filter that enables co-existence with
LTE. For the EMMY-W165 variant, the band pass filter provides no co-existence protection against a co-located LTE transmitter.
Figure 2: EMMY-W163 block diagram - Dual-antenna variant
In EMMY-W163, the bandpass filters (2.4 GHz BPF) are ceramic bandpass filters. An LTE co-existence variant
is not available in the dual-antenna configuration.

1.5 Product description

The EMMY-W161 is recommended for applications that have co-located Wi-Fi, Bluetooth and LTE antennas
and require co-existence of these wireless technologies. This module provides a dedicated BAW bandpass filter instead of the ceramic bandpass filter. This filter rejects the adjacent LTE bands B40, B7, B41 and B38. The integrated BAW filter is available only for the single-antenna configuration (EMMY-W161). The module pinout, operating conditions, and electrical characteristics are identical for all product variants. Differences in the RF parameters are explained in the Radio specifications section.
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EMMY-W1 series - Data Sheet
3
5
3
4
5

1.6 Supported features

1.6.1 Wi-Fi features

Wi-Fi standards: IEEE 802.11a/b/g/n/ac/d/e/h/i/k Simultaneous client and access point operation (up to 10 clients supported) Support of Wi-Fi direct mode IEEE 802.11ac 1x1 antenna configuration IEEE 802.11 PHY data rates up to 433 Mbps 64- and 128-bit AES hardware encryption engine WAPI encryption is supported by hardware SDIO 3.0 host interface for Wi-Fi

1.6.2 Bluetooth features

Bluetooth v4.2 with Bluetooth Low Energy and Classic Bluetooth v2.1+EDR over SDIO or high-speed
UART interface
PCM interface for audio MWS/LTE coexistence serial transport interface for connecting an external and co-located LTE device4

1.6.3 NFC features

NCI 1.0 support according to NFC Forum specification NFC support through SDIO or UART Full protocol support for ISO 14443A/B, ISO 15693
targets with data rates up to 848 Kbps
Deep Sleep Proprietary Low-Power Target Detection mode to reduce standby current consumption On-Host card emulation: supported in NFC A, B, F and V technologies Off-Host card emulation with UICCs and Embedded SEs (availability is package dependent):
o ETSI TS 102 613: SWP/CLT ISO14443 Type A (Mifare) and ISO18093 212/424 kbps passive
mode (FeliCa).
o ETSI TS 102 622: SWP/HCI ISO14443A/B and ISO18092 212/424 kbps passive mode o DCLB
Compliant with EMVCo book D (Contactless Communication Protocol) Reader/Writer, card emulation, and Peer-to-peer (P2P) modes Programmable carrier detection level for card emulation mode Programmable field detection level for RF anti-collision when operating as reader or active target UART host interface support (shared with Bluetooth when operating)
/r/v3/w
, ISO 18092, NFCIP-2, NFC forum, EMV contactless

1.6.4 General product features

Driver support for Linux Low-power and sleep modes for Bluetooth and Wi-Fi core Coexistence arbitration for Wi-Fi/Bluetooth/LE/NFC/LTE operation Small footprint (19.8 mm x 13.8 mm), LGA package Product variant with integrated LTE co-location filter available Automotive qualification tests (climatic, mechanical, and operating life tests) according ISO 16750-4
planned
Supported by hardware but not supported by firmware currently. Available on request For ISO 15693 VICC mode, the maximum supported 10-90% rise/fall times for receiving 10% ASK modulation is 1.18 μs.
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EMMY-W1 series - Data Sheet
MAC address
Assignment
Last two bits of MAC address
Example
Module1, address 1
Bluetooth
0b00
D4:CA:6E:44:00:04
Module1, address 2
Wi-Fi
0b01
D4:CA:6E:44:00:05
Module1, address 3
(free for use)
0b10
D4:CA:6E:44:00:06
Module1, address 4
(free for use)
0b11
D4:CA:6E:44:00:07
Module2, address 1
Bluetooth
0b00
D4:CA:6E:44:00:08
Module2, address 2
Wi-Fi
0b01
D4:CA:6E:44:00:09
Module2, address 3
(free for use)
0b10
D4:CA:6E:44:00:0A
Module2, address 4
(free for use)
0b11
D4:CA:6E:44:00:0B

1.6.5 Compliance

RoHS compliant Radio type approvals for Europe, USA, Canada, Korea, Japan, Australia, and New Zealand.

1.7 Additional reserved MAC addresses

The EMMY-W1 module series has four unique consecutive MAC addresses reserved for each module, from which the first two addresses are already stored in the configuration during production. The first address is used for the Bluetooth communication while the second address is configured for Wi-Fi communication. The Data Matrix Code on the label includes the Bluetooth MAC address (see section 9). The remaining two MAC addresses are not used in the manufacturing configuration, but are reserved for usage with the module.
Table 2: MAC address assignment
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EMMY-W1 series - Data Sheet
GPIO_3
GPIO_2
Wi-Fi
Bluetooth/NFC
Number of SDIO functions
0 0 SDIO
UART
1 (Wi-Fi)
0 1 SDIO
SDIO
3 (Wi-Fi, Bluetooth and NFC)
1 0 SDIO
UART
1 (Wi-Fi)
1
1
SDIO
SDIO
3 (Wi-Fi, Bluetooth and NFC)6
6

2 Interfaces

2.1 Operation mode configuration

EMMY-W1 series module uses the GPIO_3 and GPIO_2 pins as host interface configuration input to set the desired operation mode following a reset. The definitions of these pins are changed to their usual functions after reset. When you need to configure the pins for a certain module operation mode, you need to provide a 100 k pull down resistor to the ground. No external circuitry is required to set a configuration pin to high logical level.
External reset is not needed for proper operation due to internal power-up reset logic though it can be used by the host controller through the PDn pin (active low) in case of an abnormal module behavior.
After reset, GPIO_3 and GPIO_2 pins can be used as open drain outputs (depending on firmware/driver version) for Bluetooth and Wi-Fi activity LED indicators, but simultaneous usage of an LED connected to 3.3 V power line and a pull-down resistor is not allowed (LED acts as a strong pull-up circuitry). Do not connect LED if you need the pull-down resistors.
Depending on the firmware or driver used, you can use either one or both host interface operation modes:
Table 3: Module configuration

2.2 SDIO interface

EMMY-W1 series modules support an SDIO device interface that conforms to the industry standard SDIO 3.0 Full-Speed specification (4-bit SDIO up to 208 MHz) and allows a host controller using the SDIO bus protocol to access the Wi-Fi and Bluetooth functions. The interface supports 4-bit SDIO transfer mode at the full clock range of 0 to 208 MHz.

2.2.1 Default speed and High speed modes

Figure 3: SDIO protocol timing diagram- Default speed mode (3.3 V)
Default configuration. It is possible to use connected LEDs to both the pins.
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Figure 4: SDIO protocol timing diagram – High speed mode (3.3 V)
Symbol
Parameter
Condition
Min.
Typ
Max.
Units
fPP
Clock frequency
Normal
0 - 25
MHz
High speed
0 - 50
MHz
TWL
Clock low time
Normal
10 - -
ns
High speed
7 - -
ns
TWH
Clock high time
Normal
10 - -
ns
High speed
7 - -
ns
T
ISU
Input setup time
Normal
5 - -
ns
High speed
6 - -
ns
TIH
Input hold time
Normal
5 - -
ns
High speed
2 - -
ns
T
ODLY(max)
Maximal Output delay time
Normal
- 14
ns
T
ODLY(min)
Minimal Output delay time
Normal
- 0
ns
T
ODLY
Output delay time CL 40 pF (1 card)
Normal
- 14
ns TOH
Output hold time
High speed
2.5 - -
ns
EMMY-W1 series - Data Sheet
Table 4: SDIO timing data – Default speed, High speed modes (3.3 V)

2.2.2 SDR12, SDR25, SDR50 Modes (up to 100 MHz) (1.8 V)

Figure 5: SDIO protocol timing diagram – SDR12, SDR25, SDR50 modes (up to 100 MHz) (1.8 V)
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Symbol
Parameter
Condition
Min.
Typ
Max.
Units
fPP
Clock frequency
SDR12/25/50
25 - 100
MHz
TIS
Input setup time
SDR12/25/50
3 - -
ns
TIH
Input hold time
SDR12/25/50
0.8 - -
ns
T
CLK
Clock time
SDR12/25/50
10 - 40
ns
T
CR, TCF,
Rise time, fall time TCR, TCF < 2 ns (max) at 100 MHz C
CARD
= 10 pF
SDR12/25/50
- 0.2*T
CLK
ns T
ODLY
Output delay time CL 30 pF
SDR12/25/50
- 7.5
ns
TOH
Output hold time CL = 15 pF
SDR12/25/50
1.5 - -
ns
Table 5: SDIO timing data – SDR12, SDR25, SDR50 modes (up to 100 MHz) (1.8 V)
Symbol
Parameter
Condition
Min.
Typ
Max.
Units
fPP
Clock frequency
SDR104
0 - 208
MHz
TIS
Input setup time
SDR104
1.4 - -
ns
TIH
Input hold time
SDR104
0.8 - -
ns
T
CLK
Clock time
SDR104
4.8 - -
ns
T
CR, TCF,
Rise time, fall time TCR, TCF < 0.96 ns (max) at 208 MHz C
CARD
= 10 pF
SDR104
- 0.2*T
CLK
ns
TOP
Card output phase
SDR104
0 - 10
ns
T
ODW
Output timing of variable data window
SDR104
2.88 - -
ns

2.2.3 SDR104 Mode (208 MHz) (1.8 V)

EMMY-W1 series - Data Sheet
Figure 6: SDIO protocol timing diagram – SDR104 mode (208 MHz)
Table 6: SDIO timing data – SDR104 mode (208 MHz)
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2.2.4 DDR50 Mode (50 MHz) (1.8 V)

Figure 7: SDIO CMD timing diagram – DDR50 mode (50 MHz)
EMMY-W1 series - Data Sheet
Figure 8: SDIO DAT[3:0] timing diagram – DDR50 mode (50 MHz)
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EMMY-W1 series - Data Sheet
Symbol
Parameter
Condition
Min.
Typ
Max.
Units
Clock
T
CLK
Clock time 50 MHz (max) between rising edges
DDR50
20
ns
T
CR, TCF,
Rise time, fall time TCR, TCF < 4.00 ns (max) at 50 MHz C
CARD
= 10 pF
DDR50
0.2*T
CLK
ns
Clock Duty
DDR50
45 55
%
CMD Input (referenced to clock rising edge)
TIS
Input setup time C
CARD
10 pF (1 card)
DDR50
6
ns
TIH
Input hold time C
CARD
10 pF (1 card)
DDR50
0.8
ns
CMD Output (referenced to clock rising edge)
T
ODLY
Output delay time during data transfer mode CL 30 pF (1 card)
DDR50
13.7
ns
T
OHLD
Output hold time CL 15 pF (1 card)
DDR50
1.5
ns DAT[3:0] Input (referenced to clock rising and falling edges)
T
IS2x
Input setup time C
CARD
10 pF (1 card)
DDR50
3
ns
T
IH2x
Input hold time C
CARD
10 pF (1 card)
DDR50
0.8
ns DAT[3:0] Output (referenced to clock rising and falling edges)
T
ODLY2x (max)
Output delay time during data transfer mode CL 25 pF (1 card)
DDR50
7.0
ns
T
ODLY2x (min)
Output hold time CL 15 pF (1 card)
DDR50
1.5
ns
Baud Rate
1200
38400
460800
1500000
3000000
2400
57600
500000
1843200
3250000
4800
76800
921600
2000000
3692300
9600
115200
1000000
2100000
4000000
19200
230400
1382400
2764800
Table 7: SDIO timing data – DDR50 mode (50 MHz)

2.3 High Speed UART interface

The EMMY-W1 series modules support a high speed Universal Asynchronous Receiver/Transmitter (UART) interface in compliance with the industry standard 16550 specification. The main features of the UART interface are:
FIFO mode permanently selected for transmit and receive operations 2 pins for transmit and receive operations 2 flow control pins Interrupt triggers for low-power, high throughput operation High throughput (4 Mbps)
The UART interface operation includes:
Uploading the firmware to the module Supporting data input/output operation for peripheral devices connected through a standard UART
interface
Table 8: Supported UART Baud rates
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EMMY-W1 series - Data Sheet
Symbol
Parameter
Condition
Min.
Typ
Max.
Units
F
BCLK
- - - 2/2.048
-
MHz
Duty Cycle
BCLK
- - 0.4
0.5
0.6
-
T
BCLK rise/fall
- - - 3 -
Ns
TDO - - - -
15
ns
T
DISU
- -
20 - -
ns
T
DIHO
- -
15 - -
ns
TBF - - - -
15
ns

2.4 PCM interface

The EMMY-W1 series modules support a Pulse Code Modulation (PCM) interface that provides:
Master or slave mode PCM bit width size of 8 bits or 16 bits Up to 4 slots with configurable bit width and start positions Short frame and long frame synchronization

2.4.1 PCM interface specifications

Figure 9: PCM timing specification – Master mode
Table 9: PCM timing specification – Master mode
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