u-blox CAM-M8 User manual

Abstract

This document describes the hardware features and specifications of the CAM‑M8 chip antenna
modules, which feature the u blox M8 concurrent GNSS engine with reception of GPS, GLONASS,
BeiDou, Galileo and QZSS signals.

www.u-blox.com

UBX-15030063 - R05

CAM-M8

u-blox M8 concurrent GNSS antenna modules

Hardware integration manual

CAM-M8 - Hardware integration manual

Title

CAM-M8

Subtitle

u-blox M8 concurrent GNSS antenna modules

Document type

Hardware integration manual

Document number

UBX-15030063

Revision and date

R05

29-May-2020

Document status

Production information

Product status

Corresponding content status

In Development /
Prototype

Objective Specification

Target values. Revised and supplementary data will be published later.

Engineering Sample

Advance Information

Data based on early testing. Revised and supplementary data will be published later.

Initial Production

Early Production Information

Data from product verification. Revised and supplementary data may be published later.

Mass Production /
End of Life

Production Information

Document contains the final product specification.

European Union regulatory compliance

CAM-M8C and CAM-M8Q comply with all relevant requirements for RED 2014/53/EU. The CAM-M8 C/Q Declaration of
Conformity (DoC) is available at www.u-blox.com within Support > Product resources > Conformity Declaration.

Product name

Type number

Firmware version

PCN reference

CAM-M8C

CAM-M8C-0-10

ROM SPG 3.01

UBX-16016365

CAM-M8Q

CAM-M8Q-0-10

ROM SPG 3.01

UBX-16016365

u-blox or third parties may hold intellectual property rights in the products, names, logos and designs included in this
document. Copying, reproduction, modification or disclosure to third parties of this document or any part thereof is only
permitted with the express written permission of u-blox.
The information contained herein is provided “as is” and u-blox assumes no liability for its use. No warranty, either express or
implied, is given, including but not limited to, with respect to the accuracy, correctness, reliability and fitness for a particular
purpose of the information. This document may be revised by u-blox at any time without notice. For the most recent
documents, visit www.u-blox.com.
Copyright © u-blox AG.

Document information

This document applies to the following products:

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Contents

Document information ................................................................................................................................ 2

Contents .......................................................................................................................................................... 3

1 Hardware description ........................................................................................................................... 5

1.1 Overview ........................................................................................................................................................ 5

1.2 Configuration ............................................................................................................................................... 5

1.3 Connecting power ....................................................................................................................................... 5

1.4 Interfaces ...................................................................................................................................................... 6

1.4.1 UART ..................................................................................................................................................... 6

1.4.2 Display data channel (DDC) .............................................................................................................. 6

1.4.3 TX_READY ............................................................................................................................................ 7

1.5 I/O pins ........................................................................................................................................................... 7

1.5.1 RESET_N: Reset .................................................................................................................................. 7

1.5.2 EXTINT: External interrupt ............................................................................................................... 7

1.5.3 TIMEPULSE.......................................................................................................................................... 7

1.5.4 SAFEBOOT_N ...................................................................................................................................... 8

1.5.5 D_SEL: Interface select ..................................................................................................................... 8

1.5.6 LNA_EN: LNA enable .......................................................................................................................... 8

1.6 Electromagnetic interference on I/O lines ............................................................................................. 8

2 Design ........................................................................................................................................................ 9

2.1 Pin description ............................................................................................................................................. 9

2.1.1 Pin name changes.............................................................................................................................10

2.2 Minimal design...........................................................................................................................................10

2.3 Suggested pad layout ..............................................................................................................................11

2.4 Antenna .......................................................................................................................................................11

2.5 Embedded antenna operation ................................................................................................................13

2.6 PCB layout suggestion .............................................................................................................................15

2.7 Layout design-in: Thermal management .............................................................................................19

3 Migration: UC530(M) designs to CAM-M8 ................................................................................. 20

4 Product handling ................................................................................................................................. 22

4.1 Packaging, shipping, storage and moisture preconditioning ..........................................................22

4.2 Soldering .....................................................................................................................................................22

4.3 EOS/ESD/EMI precautions ......................................................................................................................25

4.3.1 Electromagnetic interference (EMI) .............................................................................................27

4.4 Applications with cellular modules ........................................................................................................28

Appendix ....................................................................................................................................................... 30

A Glossary ................................................................................................................................................. 30

B Recommended parts ......................................................................................................................... 30

Related documents ................................................................................................................................... 32

Revision history .......................................................................................................................................... 32

Contact .......................................................................................................................................................... 33

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1 Hardware description

1.1 Overview

The CAM‑M8 modules are concurrent GNSS chip antenna modules featuring the high-performance
u-blox M8 concurrent GNSS engine with reception of GPS, GLONASS, BeiDou, Galileo and QZSS
signals. Available in an industry standard form factor in leadless chip carrier (LCC) packages, it is easy
to integrate and combines exceptional positioning performance with highly flexible power, design, and
connectivity options. SMT pads allow fully automated assembly with standard pick and place and
reflow-soldering equipment for cost-efficient, high-volume production enabling short time-to­market.

☞ For product features see the CAM-M8 Data sheet [1].
☞ To determine which u-blox product best meets your needs, see the product selector tables on the

u-blox website (www.u-blox.com).

1.2 Configuration

The configuration settings can be modified using UBX protocol configuration messages; see the u­blox 8 / u-blox M8 Receiver Description including Protocol Specification [2]. The modified settings
remain effective until power-down or reset. If these settings have been stored in the battery-backed
RAM (BBR), the modified configuration will be retained as long as the backup battery supply is not
interrupted.

1.3 Connecting power

CAM‑M8 antenna modules have three power supply pins: VCC, V_BCKP, VCC_IO.

VCC: Main supply voltage

The VCC pin provides the main supply voltage. During operation, the current drawn by the module can
vary by some orders of magnitude, especially if enabling low-power operation modes. For this reason,
it is important that the supply circuitry be able to support the peak power for a short time (see the
CAM-M8 Data sheet [1] for specification).

☞ When switching from backup mode to normal operation or at start-up, CAM‑M8 antenna modules

must charge their internal capacitors in the core domain. In certain situations, this can result in a
significant current draw. For low-power applications using power save and backup modes, it is
important that the power supply or low ESR capacitors at the module input can deliver this
current/charge.

☞ Use a proper GND concept. Do not use any resistors or coils in the power line.

V_BCKP: Backup supply voltage

In case of a power failure on the module supply, V_BCKP supplies the real-time clock (RTC) and the
battery-backed RAM (BBR). Use of valid time and the GNSS orbit data at start-up will improve the
GNSS performance, that is, hot starts and warm starts. If no backup battery is connected, the module
performs a cold start at power-up.

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☞ Avoid high resistance on the V_BCKP line: During the switch from main supply to backup supply,

a short current adjustment peak can cause high voltage drop on the pin with possible
malfunctions.

☞ If no backup supply voltage is available, connect the V_BCKP pin to VCC.
☞ As long as VCC supplies the CAM‑M8 antenna module, the backup battery is disconnected from

the RTC and the BBR to avoid unnecessary battery drain (see Figure 1). In this case, VCC supplies
power to the RTC and BBR.

Figure 1: Backup battery and voltage

VCC_IO: IO supply voltage

VCC_IO from the host system supplies the digital I/Os. The wide range of VCC_IO allows seamless
interfacing to standard logic voltage levels independent of the VCC voltage level. In many applications,
VCC_IO is simply connected to the main supply voltage.

☞ Without a VCC_IO supply, the system will remain in reset state.

1.4 Interfaces

1.4.1 UART

CAM‑M8 antenna modules include a universal asynchronous receiver transmitter (UART) serial
interface, RXD/TXD, which supports configurable baud rates, as specified in the CAM-M8 Data sheet
[1]. The signal output and input level is 0 V to VCC. An interface based on RS232 standard levels (+/­12 V) can be implemented using level shifters, such as Maxim MAX3232. Hardware handshake signals
and synchronous operation are not supported.

1.4.2 Display data channel (DDC)

An I2C-compatible display data channel (DDC) interface is available with CAM‑M8 antenna modules
for serial communication with an external host CPU. The interface only supports operation in slave
mode (master mode is not supported). The DDC protocol and electrical interface are fully compatible
with the fast-mode of the I2C industry standard. DDC pins SDA and SCL have internal pull-up
resistors.

For more information about the DDC implementation, see the u-blox 8 / u-blox M8 Receiver
Description including Protocol Specification [2]. For bandwidth information, see the CAM-M8 Data
sheet [1]. For timing parameters, consult the I2C-bus specification [6].

☞ The CAM-M8 DDC interface supports serial communication with u-blox cellular modules. See the

specification of the applicable cellular module to confirm compatibility.

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1.4.3 TX_READY

The TX_READY function is used to indicate when the receiver has data to transmit. A listener can wait
on the TX_READY signal instead of polling the DDC or SPI interfaces. The UBX-CFG-PRT message lets
you configure the polarity and the number of bytes in the buffer before the TX READY signal goes
active. The TX_READY function can be mapped to TXD (PIO 06). The TX_READY function is disabled
by default.

☞ The TX_READY functionality can be enabled and configured by AT commands sent to the u-blox

cellular module supporting the feature. For more information see the GPS Implementation and
Aiding Features in u-blox wireless modules [7].

1.5 I/O pins

1.5.1 RESET_N: Reset

Driving RESET_N low activates a hardware reset of the system. Use this pin only to reset the module.
Do not use RESET_N to turn the module on and off, since the reset state increases power
consumption. The CAM-M8 RESET_N pin is for input only.

☞ The RTC time is also reset (but not BBR).

1.5.2 EXTINT: External interrupt

EXTINT is an external interrupt pin with fixed input voltage thresholds with respect to VCC (see the

CAM-M8 Data sheet [1] for more information). It can be used for wake-up functions in the power save
mode and for aiding. Leave open if unused, the function is disabled by default.

If EXTINT is not used for an external interrupt function, the pin can be used as a generic PIO (PIO13).
For example, the PIO13 can be configured to function as an output pin for the TXD_READY feature to
indicate that the receiver has data to transmit. For further information, see u-blox 8 / u-blox M8
Receiver Description including Protocol Specification [2].

Power control

The power control feature allows overriding the automatic active/inactive cycle of the power save
mode. The state of the receiver can be controlled through the EXTINT pin. The receiver can also be
forced OFF using EXTINT when the power save mode is not active.

Frequency aiding

The EXTINT pin can be used to supply time or frequency aiding data to the receiver.

For time aiding, hardware time synchronization can be achieved by connecting an accurate time pulse
to the EXTINT pin.

Frequency aiding can be implemented by connecting a periodic rectangular signal with a frequency up
to 500 kHz and arbitrary duty cycle (low/high phase duration must not be shorter than 50 ns) to the

EXTINT pin. Provide the applied frequency value to the receiver using UBX messages.

1.5.3 TIMEPULSE

A configurable time pulse signal is available with CAM‑M8 antenna modules. By default, the time
pulse signal is configured to one pulse per second. For more information, see the u-blox 8 / u-blox M8
Receiver Description including Protocol Specification [2]

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.

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1.5.4 SAFEBOOT_N

The SAFEBOOT_N pin is for future service, updates and reconfiguration.

☞ Do not pull low during reset.

1.5.5 D_SEL: Interface select

The D_SEL pin selects the available interfaces. SPI cannot be used simultaneously with UART/DDC. If
open, UART and DDC are available. If pulled low, the SPI interface is available, see the CAM-M8 FW3
Data sheet [1] for more information.

1.5.6 LNA_EN: LNA enable

In the power save mode in CAM‑M8, the system can turn on/off an optional external LNA using the
LNA_EN signal to optimize power consumption.

Signals:

 "high" = Turn on LNA
 "low" = Turn off LNA

1.6 Electromagnetic interference on I/O lines

Any I/O signal line with a length greater than approximately 3 mm can act as an antenna and may pick
up arbitrary RF signals transferring them as noise into the GNSS receiver. This specifically applies to
unshielded lines, in which the corresponding GND layer is remote or missing entirely, and lines close
to the edges of the printed circuit board.

If, for example, a cellular signal radiates into an unshielded high-impedance line, it is possible to
generate noise in the order of volts and not only distort the receiver operation, but also damage it
permanently.

On the other hand, noise generated at the I/O pins will emit from unshielded I/O lines. Receiver
performance may be degraded when this noise is coupled into the GNSS antenna (see Figure 17).

To avoid interference by improperly shielded lines, it is recommended to use resistors (for example,
R>20 ), ferrite beads (for example, BLM15HD102SN1) or inductors (for example, LQG15HS47NJ02)
on the I/O lines in series. Choose these components carefully because they will also affect the signal
rise times.

Figure 2 shows an example of EMI protection measures on the RXD/TXD line using a ferrite bead. For
more information, see section 4.3.

Figure 2: EMI precautions

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Function

Pin

No.

I/O

Description

Remarks

Power

VCC 9 I

Supply voltage

Provide clean and stable supply.

GND

4, 5, 10, 11,
12, 13, 14,
15, 18, 19,
21, 22, 27,
31

I

Ground

Assure a good GND connection to all GND pins of the module.

VCC_IO

1 I VCC_IO

IO supply voltage. Input must always be supplied. Usually
connect to VCC pin 9.

V_BCKP

8

I

Backup supply
voltage

It is recommended to connect a backup supply voltage to
V_BCKP to enable warm and hot start features on the
positioning module. Otherwise, connect to VCC.

Antenna

RF_IN

17

I

GNSS signal
input from
antenna

Antenna signal Input (50 ) Use a controlled impedance
transmission line of 50  to connect to RF_IN.

RF_OUT

16 O RF_OUT

Embedded antenna output (50 ), shall be connected
externally to RF_IN.

LNA_EN

30 O LNA_EN

External LNA control pin in power save mode.
LNA_EN pin voltage level is VCC_IO.

UART

TXD /
SPI MISO

25 O Serial port

Serial port if D_SEL =1 (or open), SPI MISO if D_SEL = 0.
Communication interface can be programmed as TX_Ready
for DDC interface. Leave open if not used.

RXD /
SPI MOSI

26 I Serial port

Serial port if D_SEL =1 (or open), SPI MOSI if D_SEL = 0.
Serial port input with internal pull-up resistor to VCC. Leave
open if not used. Do not use external pull up resistor.

System

RESET_N

23

I

Hardware reset
(active low)

Leave open if not used. Do not drive high.

TIMEPULSE

29

O

Time pulse
signal

Configurable time pulse signal (one pulse per second by
default). Leave open if not used.

EXTINT /
PIO13

7

I /
(O)

Ext. interrupt

External interrupt pin. Internal pull-up resistor to VCC. Leave
open if not used. The pin can also be used as a generic PIO
(PIO13).

SDA /
SPI CS_N

3

I/O

DDC pins

DDC data if D_SEL =1 (or open), SPI chip select if D_SEL = 0.
Leave open if not used.

SCL /
SPI CLK

6 I DDC pins

DDC clock if D_SEL =1 (or open), SPI clock if D_SEL = 0.
Leave open if not used.

D_SEL

20 I Selects the
interface

Allow selecting UART/DDC or SPI.
Open-> UART/DDC; low->SPI

SAFEBOOT_N

24 - SAFEBOOT_N

Leave open.

Reserved

2, 28

-

Reserved

Leave open.

2 Design

2.1 Pin description

Table 1: CAM-M8 pinout

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No

Previous name

New name

3

SDA
SPI CS_N

SDA /
SPI CS_N

6

SCL
SPI CLK

SCL /
SPI CLK

16

ANT

RF_OUT

20

DSEL

D_SEL

25

TXD
SPI MISO

TXD /
SPI MISO

26

RXD
SPI MOSI

RXD /
SPI MOSI

30

ANT_ON

LNA_EN

2.1.1 Pin name changes

Selected pin names have been updated to agree with the common naming convention across u-blox
modules. The pins have not changed their operation and are the same physical hardware but with
updated names. The table below lists the pins that have a changed name along with their old and new
names.

Table 2: Pin name changes

2.2 Minimal design

This is a minimal setup for a GNSS receiver with CAM-M8 modules:

Figure 3: CAM-M8 embedded antenna design

☞ In order to reduce risk for EMI leakage which can reduce GNSS performance, add 220  series

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resistors to TXD and RXD. Also add 220  external series resistors at each digital I/O signal, if being
used. See section

4.3

Electromagnetic interference (EMI).

CAM-M8 - Hardware integration manual

2.3 Suggested pad layout

The suggested paste mask openings are the same as the pad layout. Note the keep-out (void area) of

4.8 x 7.2 mm for copper and trace, and for components for all layers under the embedded chip
antenna.

☞ Be sure to comply with the special PCB layout design rules to ensure proper embedded antenna

operation when the customer PCB is used as part of antenna. This requires solid ground plane
around the module; see section 2.6 for layout suggestions.

Figure 4: Suggested pad layout and occupied area, top view

2.4 Antenna

CAM-M8 concurrent GNSS modules are designed with an integrated GNSS chip antenna. Optionally,
the CAM-M8 can be connected to an external active GNSS antenna.

Antenna input

The module has an embedded GNSS chip antenna and a SAW band-pass filter before LNA, which
provides excellent protection against out-of-band GNSS blocking caused by possible near-by wireless
transmitters. The signal is further amplified by the internal low noise amplifier (LNA), which is
available at RF_OUT output.

The antenna signal, RF_OUT, shall be connected externally to the RF_IN antenna input signal via a
short trace between pads. The RF_OUT signal and the RF_IN are internally AC-coupled.

☞ Be sure to comply with the special PCB layout design rules to ensure proper embedded antenna

operation when the customer PCB is used as part of antenna. This requires solid ground plane
around the module; see section 2.6 for layout suggestions.

External GNSS antenna connectivity

CAM-M8 modules can also use an external active antenna signal as an optional addition to the
embedded chip antenna. To select the path between RF_IN input and the external GNSS antenna
signal, an active antenna requires an external antenna switch. When the switch detects the external
active antenna presence by, for example, using the active antenna bias current detection, it switches
the antenna signal path to external antenna. When the module is in standby or backup state, the
antenna switch and bias can be switched off externally by using LNA_EN signal output.

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☞ Use 100 k (typical) external pull down resistor at LNA_EN signal whenever the signal is used

externally.

A second option is to use a suitable RF connector with built-in switching operation. The customer may
use an external active GNSS antenna connected with a RF connector (for example, MCX) + Switch
combo (for example, Aliner 36-301AA). It is suggested that the active antenna has a net gain

cable loss

noise (NF<1dB, G>15dB) amplifier. The antenna shall provide simultaneous reception of GPS,
GLONASS, BeiDou and QZSS signals.

in the range of +10 dB to +30 dB. The specified sensitivity is measured with an external low

including

Figure 5: External GNSS antenna

External active antenna

The LNA_EN pin can be used to turn an external LNA on and off. This reduces power consumption in
the power save mode (backup mode).

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Figure 6: External active antenna

2.5 Embedded antenna operation

The embedded GNSS antenna provides optimal radiation efficiency of 80% (typical) with an 80 x 40
mm ground plane. The antenna provides linear polarization with a peak gain of 1.1 dBi and a radiation
pattern optimized for portable devices. The antenna is insensitive to surroundings and has high
tolerance against frequency shifts. However, on small ground plane widths, the antenna gain and
radiation efficiency is reduced. For example, a 45-mm wide application board reduces signal levels by
at least 6 dB as compared to full 80 x 40 mm ground plane dimensions. Figure 7 shows the typical free
space radiation patterns at 1575 GHz. The radiation pattern of the embedded GNSS antenna is
shown in Figure 7 (on an 80 x 40 mm ground plane).

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Figure 7: 1.575 GHz typical free space radiation patterns

Avoid placing the module in the corner of the motherboard. This reduces radiation efficiency and
causes frequency shifts. The optimal placement is at the center of the top edge; keep at least a 10­mm distance to the nearest ground plane corner.

Place any tall nearby components (h > 3 mm) at least d = 6 mm away from the embedded antenna. In
addition, any adjacent conductive metal plane should have a distance of d = 6 mm to the top edge of
the module. An enclosure or plastic cover should have a minimum distance of d = 1.5 mm to the
antenna.

Placing the module near a human body (or any biological tissue) is accepted by keeping a minimum
distance of d = 10 mm between the motherboard and the body. With smaller distances to the body,
the radiation efficiency of the antenna starts to reduce due to signal losses in the biological tissue.

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Layer

Description

1

Components + ground plane (opening under CAM-M8 antenna)

2

Signals and RF trace (opening under CAM-M8 antenna)

3

Ground and power planes, signals (opening under CAM-M8 antenna)

4

Ground plane, short traces also allowed (opening under CAM-M8 antenna)

CAM-M8
antenna

>6mm

>6mm

Metal plane

Mother board

Tall
component

Human body

>10mm

Mother board

Metal plane

>1.5mm

Enclosure

For example, a d = 5 mm to biological tissue reduces GPS signal levels by about 6 dB. Note that the
body also acts as a reflector, and thus the radiation pattern will point perpendicular to the body.

Figure 8: Placement of CAM-M8 relative to surroundings

2.6 PCB layout suggestion

Table 3 presents the suggested four-layer PCB build-up.

Table 3: Suggested PCB build-up

CAM‑M8 antenna modules are intended to be placed at the top edge of the motherboard. The
embedded antenna operation relies on the ground plane on the motherboard. The optimum size is 80
x 40 mm, but a larger or a smaller ground plane can also be used. The suggested minimum ground
plane size is 45 x 20 mm for a rectangular and r = 60 mm for a circular ground plane. The optimal
placement is at the center of the top edge, but offset placement is allowed by keeping at least a 10­mm distance to the nearest ground plane edge. Although a ground plane width of 45 mm is the
suggested minimum, it is recommended to extend the width as far as possible to maximize
performance. Conversely, increasing the height of the ground plane beyond 20 mm has little to no
effect on the antenna performance.

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Figure 9: Motherboard ground plane and CAM-M8 placement

☞ The embedded GNSS antenna requires a small ground plane clearance and a void area (4.8 x 7.2

mm) for copper plane and trace for all layers under the antenna. Follow also the recommendations
for the GND via hole location.

Figure 10: Suggested minimum size is r = 60 mm for circular ground plane

Avoid routing signals directly under the module. This area should be dedicated as keep-out to both
traces and assigned to ground plane (copper plane), except for via holes, which can be placed close to
the pad under the module. If possible, the number of via holes underneath the module should be
minimized.

Note that the embedded GNSS antenna requires a small ground plane clearance and a void area
(4.8 x 7.2 mm) for copper plane and trace for all layers under the antenna. Placement of other
components is not allowed under the keep-out area on the opposite side.

For a multi-layer PCB, it is recommended that the inner layers below the CAM‑M8 antenna modules
are dedicated to signal traces and copper plane for the rest of the area. It is always better to route
very long signal traces in the inner layers of the PCB. This way, the trace can be easily shielded with
ground areas from above and below.

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Height

Width

To minimize the risk of EMI leakage, place the serial resistors at the I/O as close to the CAM‑M8
antenna modules as possible. For the same reason, connect the by-pass supply capacitors very close
to the module, with short traces to IO contacts and to the ground plane. Place the GND via hole as
close as possible to the capacitor. Other components on the motherboard can be added close to the
module, but maintain a solid ground plane requirement in the internal and/or on the opposite side of
the PCB.

Connect the GND soldering pads of the CAM‑M8 antenna modules to the ground plane with short
traces (thermals) to the via holes which are connected to the ground plane. Preferably, use one via
hole for each GND pad.

It is recommended to route an RF signal clearly away from other signals, between two ground planes
as a Stripline Transmission Line; this minimizes the possibility of interference and coupling. The
proper width for the 50  transmission line impedance depends on the dielectric material of the
substrate, width of the signal trace and the height (separation) of the two ground planes. With FR-4
material, the width of the trace shall be about 30% of the ground plane height. For example, a 0.4-mm
ground plane height results in a 0.15-mm trace width with FR-4 substrate.

Figure 11: Stripline transmission line

Any board space free of signal traces should be covered with copper areas connected to ground net;
this way, a solid RF ground plane is achieved throughout the circuit board. Several via holes should be
used to connect the ground areas between different layers.

Additionally, it is important that the PCB build-up is symmetrical on both sides of the PCB core. To
achieve this, choose identical copper content on each layer, and add copper areas to route-free areas.
If the circuit board is heavily asymmetric, the board may bend (wrap) during the PCB manufacturing
or reflow soldering. Bending and wrapping may cause soldering failures and reduce end product
reliability.

You can also use the reference board layout described in chapter 3 as a layout reference
implementation.

In addition, a two-layer PCB motherboard design is possible to reduce the PCB cost, but you must
make the layout design carefully to fulfill the ground plane minimum size requirements. Figure 12 and
Figure 13 show the suggested two-layer GND plane and signal trace routing.

Notes on a two-layer PCB motherboard design:

 Keep the bottom-side ground plane as solid as possible; at least the minimum recommended 45 x

20 mm.

 Route signal traces away from the module on the top layer.
 When necessary, allow signal swap from top to bottom layer clearly away from module > 20 mm.
 Use copper pour ground planes on the top and bottom layers; use multiple GND net via holes to tie

the separate ground plane areas tightly together.

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KEEPOUT FOR GND PLANE

Figure 12: Example of two-layer PCB, top layer

Figure 13: Example of two-layer PCB, bottom layer

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2.7 Layout design-in: Thermal management

During design-in do not place the module near sources of heating or cooling. The receiver oscillator is
sensitive to sudden changes in ambient temperature which can adversely impact satellite signal
tracking. Sources can include co-located power devices, cooling fans or thermal conduction via the
PCB. Take into account the following questions when designing in the module.

 Is the receiver placed away from heat sources?
 Is the receiver placed away from air-cooling sources?
 Is the receiver shielded by a cover/case to prevent the effects of air currents and rapid

environmental temperature changes?

⚠ High temperature drift and air vents can affect the GNSS performance. For best performance,

avoid high temperature drift and air vents near the SiP.

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Pin

UC530(M)

CAM-M8C/Q

Remarks for replace

Pin name

Typical assignment

Pin name

Typical assignment

1

32K/DR_INT

Not supported (leave signal
floating)

VCC_IO

Needs to be connected to same
as VCC (2.7-3.6 V)

2

UI_FIX

Valid fix indicator output

Reserved

Reserved

OK as is

3

TX1

Serial port

SDA /
SPI CS_N

DDC data
4

GND

Ground

GND

Ground

No difference

5

GND

Ground

GND

Ground

No difference

6

RX1

Serial port

SCL /
SPI CLK

DDC data

7

EINT1

Not a supported feature
(leave signal floating)

EXTINT

Normal u-blox M8 EXTINT
support

OK as is
8

VDD_B

Backup supply pin (2.0-4.3 V)

V_BCKP

Backup supply pin (1.4-3.6 V)

9

VDD

Supply (3.0-4.3 V)

VCC

Supply (2.7-3.6 V)

10

GND

Ground

GND

Ground

No difference

11

GND

Ground

GND

Ground

No difference

12

GND

Ground

GND

Ground

No difference

13

GND

Ground

GND

Ground

No difference

14

GND

Ground

GND

Ground

No difference

15

GND

Ground

GND

Ground

No difference

16

ANT

Embedded antenna output
(50 )

RF_OUT

Embedded antenna output
(50 )

No difference
17

RF_IN

Antenna signal input

RF_IN

Antenna signal input

No difference

18

GND

Ground

GND

Ground

No difference

19

GND

Ground

GND

Ground

No difference

20

GPIO9

Not a supported feature
(leave signal floating)

D_SEL

Open: UART/I2C, PD: SPI

OK as is
21

GND

Ground

GND

Ground

No difference

22

GND

Ground

GND

Ground

No difference

23

RESET_N

External reset input

RESET_N

External reset input

No difference

24

GPIO10

Reserved for future usage,
leave floating

SAFEBOOT_N

Reserved for future usage, leave
open

No difference

25

TX0

Serial port

TXD /
SPI MISO

Serial port if D_SEL =1 (or open)

OK as is

26

RX0

Serial port

RXD /
SPI MOSI

Serial port if D_SEL =1 (or open)

OK as is
27

GND

Ground

GND

Ground

No difference

3 Migration: UC530(M) designs to CAM-M8

There are small differences that you must take into account when migrating from UC530(M) designs
to CAM-M8 concurrent GNSS receiver modules.

 Different supply level(s)
 FORCE_ON is not supported in CAM-M8

It is highly advisable that customers consider a design review with the u-blox support team to ensure
the compatibility of key functionalities. Table 4 summarizes the pin-out and design differences.

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28

FORCE_ON
(UC530M)
TIMER
(UC530)

Wake up from low power
modes, to GND if not used.
Power control output to
control external VDD switch,
to GND if not used.

Reserved

Reserved

OK as is

29

PPS

PPS time mark output signal
(default)

TIMEPULSE

Time pulse (1 PPS)

No difference

30

WAKEUP

Control external LNA

LNA_EN

External LNA control pin in power
save mode.

OK as is
31

GND

Ground

GND

Ground

No difference

Table 4: Pin-out comparison UC530(M) vs. CAM-M8C/Q

For more information about CAM-M8 modules’ software migration from FW2 to FW3, see the GNSS
FW3.01 Release Notes [3] and the u-blox M8 FW SPG3.01 Migration Guide [8].

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4 Product handling

4.1 Packaging, shipping, storage and moisture preconditioning

For information pertaining to reels and tapes, moisture sensitivity levels (MSL), shipment and storage
information, as well as drying for preconditioning see the CAM-M8 Data sheet [1].

Population of modules

☞ When populating the modules, make sure that the pick and place machine is aligned to the copper

pins of the module and not to the module edge.

4.2 Soldering

Soldering paste

Use of "no clean" soldering paste is strongly recommended, as it does not require cleaning after the
soldering process has taken place. The paste in the example below meets these criteria.

Soldering paste: OM338 SAC405 / Nr.143714 (Cookson Electronics)

Alloy specification: Sn 95.5/ Ag 4/ Cu 0.5 (95.5% tin/ 4% silver/ 0.5% copper)

Melting temperature: 217 °C

Stencil thickness: 150 um

The final choice of the soldering paste depends on the approved manufacturing procedures.

The paste-mask geometry for applying soldering paste should meet the recommendations.

☞ The quality of the solder joints on the connectors (“half vias”) should meet the appropriate IPC

specification.

Reflow soldering

A convection-type soldering oven is highly recommended over the infrared-type radiation oven.

Convection-heated ovens allow precise control of the temperature, and all parts will heat up evenly,
regardless of material properties, thickness of components and surface color.

As a reference, see the "IPC-7530 Guidelines for temperature profiling for mass soldering (reflow
and wave) processes”, published in 2001.

Preheat phase

During the initial heating of component leads and balls, residual humidity will be dried out. Note that
this preheat phase will not replace prior baking procedures.

 Temperature rise rate: max. 3 °C/s. If the temperature rise is too rapid in the preheat phase it may

cause excessive slumping.

 Time: 60 - 120 s. If the preheat is insufficient, rather large solder balls tend to generate.

Conversely, if performed excessively, fine balls and large balls will be generated in clusters.

 End temperature: 150 - 200 °C. If the temperature is too low, non-melting tends to be caused in

areas containing large heat capacity.

Heating/ Reflow phase

The temperature rises above the liquidus temperature of 217 °C. Avoid a sudden rise in temperature
as the slump of the paste could become worse.

 Limit time above 217 °C liquidus temperature: 40 - 60 s

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 Peak reflow temperature: 245 °C

Cooling phase

A controlled cooling avoids negative metallurgical effects of the solder (the solder becomes more
brittle) and possible mechanical tensions in the products. Controlled cooling helps to achieve bright
solder fillets with a good shape and low contact angle.

 Temperature fall rate: max 4 °C/s

☞ To avoid falling off, place the CAM‑M8 antenna module on the topside of the motherboard during

soldering.

The final soldering temperature chosen at the factory depends on additional external factors such as
choice of soldering paste, size, thickness and properties of the baseboard. Exceeding the maximum
soldering temperature in the recommended soldering profile may permanently damage the module.

Figure 14: Recommended soldering profile

☞ CAM-M8 modules must not be soldered with a damp heat process.

Optical inspection

After soldering the CAM‑M8 antenna module, consider an optical inspection step to check whether:

 The module is properly aligned and centered over the pads
 All pads are properly soldered

 No excess solder has created contacts to neighboring pads, or possibly to pad stacks and vias

nearby

Cleaning

In general, cleaning the populated modules is strongly discouraged. Residues underneath the
modules cannot be easily removed with a washing process.

 Cleaning with water will lead to capillary effects where water is absorbed into the gap between the

baseboard and the module. The combination of residues of soldering flux and encapsulated water
leads to short circuits or resistor-like interconnections between neighboring pads.

 Cleaning with alcohol or other organic solvents can result in soldering flux residues flooding into

the two housings, areas that are not accessible for post-wash inspections. The solvent will also
damage the sticker and the ink-jet printed text.

 Ultrasonic cleaning will permanently damage the module, in particular the quartz oscillators.

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The best approach is to use a "no clean" soldering paste and eliminate the cleaning step after the
soldering.

Repeated reflow soldering

Only single reflow soldering processes are recommended for boards populated with CAM‑M8 antenna
modules. To avoid upside down orientation during the second reflow cycle, the CAM‑M8 antenna
modules should not be submitted to two reflow cycles on a board populated with components on both
sides. In such a case, the modules should always be placed on the side of the board that is submitted
into the last reflow cycle. This is because of the risk of the module falling off due to the significantly
higher weight in relation to other components.

Two reflow cycles can be considered by excluding the above described upside down scenario and
taking into account the rework conditions described in section 3.

☞ Repeated reflow soldering processes and soldering the module upside down are not

recommended.

Wave soldering

Baseboards with combined through-hole technology (THT) components and surface-mount
technology (SMT) devices require wave soldering to solder the THT components. Only a single wave
soldering process is encouraged for boards populated with CAM‑M8 antenna modules.

Hand soldering

Hand soldering is allowed. Use a soldering iron temperature setting equivalent to 350 °C. Place the
module precisely on the pads. Start with a cross-diagonal fixture soldering (for example, pins 1 and

15), and then continue from left to right.

Rework

The CAM-M8 modules can be unsoldered from the baseboard using a hot air gun. When using a hot
air gun for unsoldering the module, a maximum of one reflow cycle is allowed. In general, we do not
recommend using a hot air gun because this is an uncontrolled process and might damage the
module.

⚠ Attention: use of a hot air gun can lead to overheating and severely damage the module. Always

avoid overheating the module.

After the module is removed, clean the pads before placing and hand soldering a new module.

⚠ Never attempt a rework on the module itself, for example, replacing individual components. Such

actions immediately terminate the warranty.

In addition to the two reflow cycles, manual rework on particular pins by using a soldering iron is
allowed. Manual rework steps on the module can be done several times.

Conformal coating

Certain applications employ a conformal coating of the PCB using HumiSeal® or other related coating
products. These materials affect the HF properties of the GNSS module and it is important to prevent
them from flowing into the module. The RF shields do not provide 100% protection for the module
from coating liquids with low viscosity; therefore, apply the coating carefully.

☞ Conformal coating of the module will void the warranty.

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Casting

If casting is required, use viscose or another type of silicon pottant. The OEM is strongly advised to
qualify such processes in combination with the CAM‑M8 antenna modules before implementing this
in the production.

☞ Casting will void the warranty.

Grounding metal covers

Attempts to improve grounding by soldering ground cables, wick or other forms of metal strips
directly onto the EMI covers is done at the customer's own risk. The numerous ground pins should be
sufficient to provide optimum immunity to interferences and noise.

☞ u-blox makes no warranty for damages to the CAM‑M8 antenna modules caused by soldering

metal cables or any other forms of metal strips directly onto the EMI covers.

Use of ultrasonic processes

Some components on the CAM-M8 modules are sensitive to ultrasonic waves. Use of any ultrasonic
processes (cleaning, welding, and so on) may cause damage to the GNSS receiver.

☞ u-blox offers no warranty against damages to the CAM‑M8 antenna modules caused by any

ultrasonic processes.

4.3 EOS/ESD/EMI precautions

When integrating GNSS positioning modules into wireless systems, consider electromagnetic and
voltage susceptibility issues carefully. Wireless systems include components that can produce
electrical overstress (EOS) and electro-magnetic interference (EMI). CMOS devices are more sensitive
to such influences because their failure mechanism is defined by the applied voltage, whereas bipolar
semiconductors are more susceptible to thermal overstress. The following design guidelines are
provided to help in designing robust yet cost-effective solutions.

⚠ To avoid overstress damage during production or in the field it is essential to observe strict

EOS/ESD/EMI handling and protection measures.

⚠ To prevent overstress damage at the RF_IN of your receiver, never exceed the maximum input

power (see the CAM-M8 Data sheet [1]).

Electrostatic discharge (ESD)

Electrostatic discharge (ESD) is the sudden and momentary electric current that flows
between two objects at different electrical potentials caused by direct contact or
induced by an electrostatic field. The term is usually used in the electronics and other
industries to describe momentary unwanted currents that may cause damage to
electronic equipment.

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 Unless there is a galvanic coupling between the local GND

(i.e. the work table) and the PCB GND, the first point of
contact when handling the PCB must always be between
the local GND and PCB GND.

 Before mounting an antenna patch, connect ground of the

device.

 When handling the RF pin, do not come into contact with

any charged capacitors and be careful when contacting
materials that can develop charges (e.g. patch antenna ~10
pF, coax cable ~50 - 80 pF/m, soldering iron).

 To prevent electrostatic discharge through the RF input, do

not touch any exposed antenna area. If there is any risk that
such exposed antenna area is touched in a non-ESD
protected work area, implement proper ESD protection
measures in the design.

 When soldering RF connectors and patch antennas to the

receiver’s RF pin, make sure to use an ESD-safe soldering
iron (tip).

ESD handling precautions

ESD prevention is based on establishing an electrostatic protective area (EPA). The EPA can be a
small working station or a large manufacturing area. The main principle of an EPA is that there are no
highly-charging materials near ESD-sensitive electronics, all conductive materials are grounded,
workers are grounded, and charge build-up on ESD-sensitive electronics is prevented. International
standards are used to define typical EPA and can be obtained, for example, from International
Electrotechnical Commission (IEC) or American National Standards Institute (ANSI).

GNSS positioning modules are sensitive to ESD and require special precautions when handling.
Exercise particular care when handling patch antennas, due to the risk of electrostatic charges. In
addition to standard ESD safety practices, take the following measures into account whenever
handling the receiver.

⚠ Failure to observe these precautions can result in severe damage to the GNSS module!

ESD protection measures

⚠ GNSS positioning modules are sensitive to electrostatic discharge (ESD). Special precautions are

required when handling.

☞ For more robust designs, employ additional ESD protection measures. Using an active antenna

with appropriate ESD rating can provide increased ESD protection.

Most defects caused by ESD can be prevented by following strict ESD protection rules for production
and handling.

Electrical overstress (EOS)

Electrical overstress (EOS) usually describes situations where the maximum input power exceeds the
maximum specified ratings. EOS failure can happen if RF emitters are close to a GNSS receiver or its
antenna. EOS causes damage to the chip structures. If the RF_IN is damaged by EOS, it is hard to
determine whether the chip structures have been damaged by ESD or EOS.

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Active antennas (without internal filter which
need the module antenna supervisor circuits)

F

EOS protection measures

☞ For designs with GNSS positioning modules and wireless (for example, GSM/GPRS) transceivers

in close proximity, ensure sufficient isolation between the wireless and GNSS antennas. If wireless
power output causes the specified maximum power input at the GNSS RF_IN to exceed, employ
EOS protection measures to prevent overstress damage.

For robustness, the EOS protection measures shown in Figure 15 are recommended for designs
combining wireless communication transceivers (for example, GSM, GPRS) and GNSS in the same
design or in close proximity.

Figure 15: EOS and ESD precautions

4.3.1 Electromagnetic interference (EMI)

Electromagnetic interference (EMI) is the addition or coupling of energy originating from any RF
emitting device. This can cause a spontaneous reset of the GNSS receiver or result in unstable
performance. Any unshielded line or segment (>3 mm) connected to the GNSS receiver can effectively
act as an antenna and lead to EMI disturbances or damage.

The following elements are critical regarding EMI:

 Unshielded connectors (for example, pin rows)
 Weakly shielded lines on PCB (for example, on top or bottom layer and especially at the border of

a PCB)

 Weak GND concept (for example, small and/or long ground line connections)

EMI protection measures are recommended when RF emitting devices are near the GNSS receiver. To
minimize the effect of EMI a robust grounding concept is essential. To achieve electromagnetic
robustness follow the standard EMI suppression techniques.

http://www.murata.com/products/emc/knowhow/index.html
http://www.murata.com/products/emc/knowhow/pdf/4to5e.pdf

Improved EMI protection can be achieved by inserting a resistor (for example, R > 20 ), or, better yet,
a ferrite bead (BLM15HD102SN1) or an inductor (LQG15HS47NJ02) into any unshielded PCB lines
connected to the GNSS receiver. Place the resistor as close to the GNSS receiver pin as possible.

Alternatively, feed-through capacitors with good GND connection can be used to protect, for example,
the VCC supply pin against EMI. A selection of feed-through capacitors is listed in Table 6.

Intended use

☞ To mitigate any performance degradation of a radio equipment under EMC disturbance, system

integration shall adopt the appropriate EMC design practice and not contain cables over three
meters on signal and supply ports.

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1525 1550 1625

GPS input filter
characteristics

1575 1600

0

-110

Jammin
g signal

1525 1550 1625

Frequency [MHz]

Power [dBm]

GPS input filter
characteristics

1575 1600

0

Jamming

signal

GPS

signals

GPS Carrier

1575.4 MHz

4.4 Applications with cellular modules

GSM terminals transmit power levels up to 2 W (+33 dBm) peak, 3G and LTE up to 250 mW
continuous. Consult the corresponding product data sheet (listed in Error! Reference source not
ound.) for the absolute maximum power input at the GNSS receiver.

☞ See the GPS Implementation and Aiding Features in u-blox wireless modules [7].

Isolation between GNSS and cellular antenna

In a handheld type design, an isolation of approximately 20 dB can be reached with careful placement
of the antennas. If such isolation cannot be achieved, for example, in the case of an integrated cellular
/GNSS antenna, an additional input filter is needed on the GNSS side to block the high energy emitted
by the cellular transmitter. Examples of these kinds of filters would be the SAW filters from Epcos
(B9444 or B7839) or Murata.

Increasing interference immunity

Interference signals come from in-band and out-band frequency sources.

In-band interference

With in-band interference, the signal frequency is very close to the GNSS constellation frequency
used, for example, GPS frequency of 1575 MHz (see Figure 16). Such interference signals are typically
caused by harmonics from displays, micro-controller, bus systems, and so on.

Figure 16: In-band interference signals

Figure 17: In-band interference sources

Measures against in-band interference include:

 Maintaining a good grounding concept in the design
 Shielding
 Layout optimization
 Filtering
 Placement of the GNSS antenna
 Adding a CDMA, cellular, WCDMA band pass filter before handset antenna

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Out-band interference

Out-band interference is caused by signal frequencies that are different from the GNSS carrier (see
Figure 18). The main sources are wireless communication systems such as cellular, CDMA, WCDMA,
Wi-Fi, BT, and so on.

Figure 18: Out-band interference signals

Measures against out-band interference include maintaining a good grounding concept in the design
and adding a SAW or band pass ceramic filter (as recommend in section Error! Reference source not

ound.) into the antenna input line to the GNSS receiver (see Figure 19).

Figure 19: Measures against out-band interference

☞ See the GPS Implementation and Aiding Features in u-blox wireless modules [7].

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Abbreviation

Definition

ANSI

American National Standards Institute

BeiDou

Chinese navigation satellite system

CDMA

Code Division Multiple Access

EMC

Electromagnetic compatibility

EMI

Electromagnetic interference

EOS

Electrical Overstress

EPA

Electrostatic Protective Area

ESD

Electrostatic discharge

Galileo

European navigation system

GLONASS

Russian satellite system

GND

Ground

GNSS

Global Navigation Satellite System

GPS

Global Positioning System

GSM

Global System for Mobile Communications

IEC

International Electrotechnical Commission

PCB

Printed circuit board

QZSS

Quasi-Zenith Satellite System

Manufacturer

Part ID

Remarks

Parameters to consider

Diode ON
semiconductor

ESD9R3.3ST5G

Standoff voltage>3.3 V

Low capacitance < 0.5 pF

ESD9L3.3ST5G

Standoff voltage>3.3 V

Standoff voltage > Voltage for active
antenna

ESD9L5.0ST5G

Standoff voltage>5 V

Low inductance

SAW

TDK/ EPCOS

B8401: B39162-B8401­P810

GPS+GLONASS

High attenuation

TDK/ EPCOS

B3913:
B39162B3913U410

GPS+GLONASS+BeiDou

For automotive application
TDK/ EPCOS

B4310: B39162B4310P810

GPS+GLONASS

Compliant to the AEC-Q200 standard

ReyConns

NDF9169

GPS+BeiDou

Low insertion loss, only for mobile
application

Murata

SAFFB1G56KB0F0A

GPS+GLONASS+BeiDou

Low insertion loss, only for mobile
application

Murata

SAFEA1G58KB0F00

GPS+GLONASS

Low insertion loss, only for mobile
application

Murata

SAFEA1G58KA0F00

GPS+GLONASS

High attenuation, only for mobile
application

Appendix

A Glossary

Table 5: Explanation of the abbreviations and terms used

B Recommended parts

Recommended parts are selected on data sheet basis only. Other components may also be used.

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Manufacturer

Part ID

Remarks

Parameters to consider

Murata

SAFFB1G58KA0F0A

GPS+GLONASS

High attenuation, only for mobile
application

Murata

SAFFB1G58KB0F0A

GPS+GLONASS

Low insertion loss, only for mobile
application

TAI-SAW

TA1573A

GPS+GLONASS

Low insertion loss

TAI-SAW

TA1343A

GPS+GLONASS+BeiDou

Low insertion loss

TAI-SAW

TA0638A

GPS+GLONASS+BeiDou

Low insertion loss

LNA

JRC

NJG1143UA2

LNA

Low noise figure, up to 15 dBm RF input
power

Inductor

Murata

LQG15H series, e.g.
LQG15HS47NJ02
LQG15HN27NJ02

L, 47 nH down to 27 nH

Impedance at freq. GPS > 500 

Murata

LQW15A series, e.g.
LQW15AN47NJ80
LQW15AN75NJ80

L, 47 nH up to 75 nH

Johanson
Technology

L-07W series e.g. 39 nH L­07W39NJV4T

or any other inductance
compatible with the
above Murata inductors

Capacitor

Murata

GRM1555C1E470JZ01

C, 47 pF

DC-block

Ferrite bead

Murata

BLM15HD102SN1

FB

High IZI at fGSM

Feed­through
capacitor
for signal

Murata

NFL18SP157X1A3

Monolithic type

For data signals, 34 pF load capacitance

NFA18SL307V1A45

Array type

For data signals, 4 circuits in 1 package

Feed­through
capacitor

Murata

NFM18PC ….
NFM21P….

0603 2A
0805 4A

Rs < 0.5 

Resistor

10   10%, min 0.250 W

R

bias

560   5%

R2

100 k  5%

R3, R4

Manufacturer

Order no.

Comments

Hirschmann (www.hirschmann-car.com)

GLONASS 9 M

GPS+GLONASS active

Taoglas (www.taoglas.com )

AA.160.301111

36 x 36 x 4 mm, 3-5 V 30 mA active

Taoglas (www.taoglas.com )

AA.161.301111

36 x 36 x 3 mm, 1.8 to 5.5 V / 10 mA at 3 V
active

INPAQ (www.inpaq.com.tw)

B3G02G-S3-01-A

2.7 to 3.9 V / 10 mA active

Amotech (www.amotech.co.kr)

B35-3556920-2J2

35 x 35 x 3 mm GPS+GLONASS passive

Amotech (www.amotech.co.kr)

A25-4102920-2J3

25 x 25 x 4 mm GPS+GLONASS passive

Amotech (www.amotech.co.kr)

A18-4135920-AMT04

18 x 18 x 4 mm GPS+GLONASS passive

Amotech (www.amotech.co.kr)

Amotech AGA363913-S0-A1

GPS+GLONASS+ BeiDou active

INPAQ (www.inpaq.com.tw)

ACM4-5036-A1-CC-S

5.2 x 3.7 x 0.7 mm GPS+GLONASS passive

Additional antenna Manufacturer: Allis Communications, Tallysman Wireless

Table 6: Recommended parts

Recommended antennas

Table 7: Recommend antennas

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Revision

Date

Name

Comments

R01

15-Sep-2016

jfur

Advance Information

R02

8-Nov-2016

jesk

Production Information

R03

20-Nov-2017

msul

Added information on RED DoC in European Union regulatory compliance
(page 2), added Intended use statement in section 4.3 EOS/ESD/EMI
precautions, updated legal statement in cover page and added Documentation
feedback e-mail address in contacts page.

R04

7-Feb-2019

rmak

Added information on EXTINT pin usage as generic PIO13 in Section 2.1 and
Table 1: CAM-M8 pinout. Updated Table 6.

R05

29-May-2020

mala

Added section 2.7 Layout design-in: Thermal management.
Editorial updates to reflect the latest style guide changes.

Related documents

[1] CAM-M8 (FW3) Data sheet, UBX-15031574
[2] u-blox 8 / u-blox M8 Receiver Description including Protocol Specification, UBX-13003221
[3] GNSS FW3.01 Release Notes, UBX-16000319
[4] GPS Antenna Application Note, GPS-X-08014
[5] GPS Compendium, GPS-X-02007
[6] I2C-bus specification, Rev. 6 - 4 April 2014,

http://www.nxp.com/documents/user_manual/UM10204.pdf

[7] GPS Implementation and Aiding Features in u-blox wireless modules, GSM.G1-CS-09007
[8] u-blox M8 FW SPG3.01 Migration Guide, UBX-15028330

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CAM-M8 - Hardware integration manual

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UBX-15030063 - R05 Page 33 of 33
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