u blox BMD360 User Manual
BMD-360
Stand-alone Bluetooth 5.1 low energy and IEEE 802.15.4
module
Data sheet
Abstract
This technical data sheet describes the BMD-360 stand-alone Bluetooth® low energy and IEEE
802.15.4 module. The OEMs can embed their own application on top of the integrated Bluetooth low
energy stack using Nordic SDK integrated development environment (IDE).
www.u-blox.com
UBX-19039466 - R03
BMD-360 - Data sheet
Document information
Title BMD-360
Subtitle Stand-alone Bluetooth 5.1 low energy and IEEE 802.15.4 module
Document type Data sheet
Document number UBX-19039466
Revision and date R03 21-Oct-2019
Disclosure restriction
Product status Corresponding content status
Functional sample Draft For functional testing. Revised and supplementary data will be published later.
In development /
Prototype
Engineering sample Advance information Data based on early testing. Revised and supplementary data will be published later.
Initial production Early production information Data from product verification. Revised and supplementary data may be published later.
Mass production /
End of life
Objective specification Target values. Revised and supplementary data will be published later.
Production information Document contains the final product specification.
This document applies to the following products:
Product name Type number PCN reference Product status
BMD-360 BMD-360-A-R-00 N/A Engineering Sample
u-blox or third parties may hold intellectual property rights in the products, names, logos and designs included in this
document. Copying, reproduction, modification or disclosure to third parties of this document or any part thereof is only
permitted with the express written permission of u-blox.
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implied, is given, including but not limited to, with respect to the accuracy, correctness, reliability and fitness for a particular
purpose of the information. This document may be revised by u-blox at any time without notice. For the most recent
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Copyright © u-blox AG.
UBX-19039466 - R03 Document information Page 2 of 31
BMD-360 - Data sheet
Contents
Document information ................................................................................................................................ 2
Contents .......................................................................................................................................................... 3
1 Functional description ......................................................................................................................... 5
1.1 Features ........................................................................................................................................................ 5
1.2 Applications ................................................................................................................................................. 5
1.3 Block diagram .............................................................................................................................................. 6
1.4 Radio performance ..................................................................................................................................... 6
2 Pin definition ........................................................................................................................................... 8
2.1 Pin assignment ............................................................................................................................................ 8
2.2 Peripheral pin assignments ...................................................................................................................... 9
3 Electrical specifications ................................................................................................................... 10
3.1 Absolute maximum ratings ....................................................................................................................10
3.2 Operating conditions ................................................................................................................................10
3.3 General purpose I/O ..................................................................................................................................10
3.4 Module reset ..............................................................................................................................................11
3.5 Debug and programming .........................................................................................................................11
3.6 Clocks ..........................................................................................................................................................11
3.6.1 32.768 kHz crystal (LFXO) (preliminary)......................................................................................12
3.6.2 32.768 kHz clock source comparison ...........................................................................................12
4 Firmware ................................................................................................................................................ 13
4.1 Factory image ............................................................................................................................................13
4.2 SoftDevices ................................................................................................................................................13
4.2.1 S113 ....................................................................................................................................................13
4.2.2 IEEE 802.15.4 (Thread and Zigbee) ..............................................................................................13
4.3 Bluetooth address .....................................................................................................................................13
5 Mechanical specifications ............................................................................................................... 14
5.1 Dimensions .................................................................................................................................................14
5.2 Recommended PCB land pads ...............................................................................................................14
5.3 Module marking .........................................................................................................................................15
6 RF design notes ................................................................................................................................... 16
6.1 Recommended RF layout and ground plane ........................................................................................16
6.2 Mechanical enclosure ...............................................................................................................................16
7 Antenna patterns ............................................................................................................................... 17
7.1 X-Y plane .....................................................................................................................................................17
7.2 Y-Z plane .....................................................................................................................................................18
7.3 Z-X plane .....................................................................................................................................................18
8 BMD-360 evaluation development kit ......................................................................................... 19
9 Qualification and approvals............................................................................................................. 20
9.1 United States (FCC) (pending approval) ..............................................................................................20
9.1.1 Labeling and user information requirements .............................................................................20
UBX-19039466 - R03 Contents Page 3 of 31
BMD-360 - Data sheet
9.1.2 RF exposure .......................................................................................................................................21
9.2 Canada (ISED) (pending approval) .........................................................................................................21
9.2.1 Labeling and user information requirements .............................................................................21
9.2.2 RF exposure .......................................................................................................................................22
9.3 Europe (CE-RED) (pending approval) ....................................................................................................22
9.3.1 Labeling and user information requirements .............................................................................22
9.4 Australia / New Zealand (RCM) (pending approval) ...........................................................................22
9.5 Bluetooth qualification (pending) ..........................................................................................................23
10 Environmental...................................................................................................................................... 24
10.1 RoHS ............................................................................................................................................................24
10.2 REACH .........................................................................................................................................................24
10.3 California proposition 65 (P65) ..............................................................................................................24
11 Product handling ................................................................................................................................. 25
11.1 Packaging ...................................................................................................................................................25
11.2 Reel packaging ...........................................................................................................................................25
11.3 Carrier tape dimensions ..........................................................................................................................25
11.4 Moisture sensitivity level .........................................................................................................................25
11.5 Reflow soldering ........................................................................................................................................26
12 Labeling and ordering information ............................................................................................... 27
12.1 Batch Label .................................................................................................................................................27
12.2 Multipack label...........................................................................................................................................27
12.3 Ordering information ................................................................................................................................28
13 Life support and other high-risk use warning ........................................................................... 29
Related documents ................................................................................................................................... 30
Revision history .......................................................................................................................................... 30
Contact .......................................................................................................................................................... 31
UBX-19039466 - R03 Contents Page 4 of 31
BMD-360 - Data sheet
1 Functional description
The BMD-360 is a powerful, highly flexible, ultra-low power Bluetooth 5.1 and IEEE 802.15.4 (Thread
and Zigbee) module based on the nRF52811 SoC from Nordic Semiconductor. With an Arm® Cortex®
M4 CPU, embedded 2.4GHz transceiver, and integrated antenna, it provides a complete RF solution
with no additional RF design, allowing faster time to market. Providing full use of the nRF52811’s
capabilities and peripherals, the BMD-360 can power demanding applications, while simplifying
designs and reducing BOM costs. Angle of Arrival (AoA) and Angle of Departure (AoD) features of
Bluetooth 5.1 are supported. With an internal DC-DC converter and intelligent power control, the
BMD-360 provides class-leading power efficiency, enabling ultra-low power sensitive applications.
Regulatory pre-approvals reduce the burden to enter the market. As a drop-in replacement for the
BMD-300/301/330, the BMD-360 completes the BMD-300 Series lineup with an optimized peripheral
set that is attractive for a wide range of cost-sensitive applications.
1.1 Features
• Based on the Nordic Semiconductor nRF52811 SoC
• Bluetooth 5.1 2M PHY, 1M PHY, Coded PHY (long range), CSA #2, AoA, AoD
• IEEE 802.15.4 with Thread and Zigbee support
• Complete RF solution with an integrated DC-DC converter
• Nordic Semiconductor SoftDevice ready
• Over-the-Air (OTA) firmware updates
• No external components required
• Arm® Cortex®-M4 32-bit processor
• 192 kB embedded flash memory
• 24 kB RAM
• -40 °C to +85 °C Temperature Range
• 32 General Purpose I/O Pins
• 12-bit/200 KSPS ADC
• Serial Wire Debug (SWD)
• SPI Master/Slave (8 Mbps)
• 2-wire Master/Slave (I2C compatible)
• Footprint compatible with BMD-300, BMD-301, BMD-330, BMD-340, and BMD-341
• UART (w/ CTS/RTS and DMA)
• Temperature sensor
• 20 channel CPU independent Programmable Peripheral Interconnect (PPI)
• Quadrature Demodulator (QDEC)
• 128-bit AES HW encryption
• 3 x 32 bit Timer / Counter
• 2 x 24 bit Real-Time Counter (RTC)
• Dimensions: 14 x 9.8 x 1.9mm
1.2 Applications
• Beacons – iBeacon™, Eddystone, AltBeacon, AoA, AoD
• Low-Power Sensors
• Fitness devices
• Wearables
• Climate Control
• Lighting
• Safety and Security
• Home Appliances
UBX-19039466 - R03 Functional description Page 5 of 31
BMD-360 - Data sheet
• Access Control
• Internet of Things
• Home Health Care
• Advanced Remote Controls
• Smart Energy Management
• Low-Power Sensor Networks
• Interactive Entertainment
• Key Fobs
• Environmental Monitoring
• Hotel Automation
• Office Automation
1.3 Block diagram
BMD-360 Bluetooth 5 Low Energy SoC Module
nRF52811-QFAx
192kB
Flas h
24
kB RA M
SWD Debug &
Pro gram min g
Core LDO
DC/DC Buck
Regulator
DC-DC
Indu ctor
Figure 1: Block diagram of BMD-360
ARM Cortex-M4
@ 64MHz
Clo ck
Ma nag eme nt
Watc hdog
Ti mer
TWI
Master
TW I S lav e 4ch PWM PDM
Bulk
Capac it ors
Real Time
Count er x 2
Ti mer x 3
SPI
Master
SPI Slave
Decoupling
Capac it ors
1.4 Radio performance
Accel Addre ss
AES CCM M ode
Rand om Number
UA RT
Resolver
AES EC B
Enc ryp tion
Gen
GPIO x32
(Ana lo g x8)
2.4GHz Rad io
Multi-protocol
Programmable
Per ipheral
Inter connect
GP IO Ta sk
Eve nt B locks
Quadr ature
Decoder
32 MH z
Cry sta l
Temperature
S en so r
General
Purpos e
Comparator
8-ch 12-bit
ADC
Balun
Ma tch ing
Network
PCB
Antenna
Detail Description
Bluetooth
Bluetooth version Bluetooth 5 Low Energy, Peripheral (S113), 2M PHY, 1M PHY, Coded PHY,
CSA #2, AoA/AoD
Bluetooth security AES-128
LE connections Concurrent peripheral roles (S113)
IEEE 802.15.4
Thread stack OpenThread, Thread 1.1 compatible
Thread security AES-128
Zigbee stack Zigbee 3.0 compatible
Radio
Frequency 2.360 GHz to 2.500 GHz
UBX-19039466 - R03 Functional description Page 6 of 31
BMD-360 - Data sheet
Detail Description
Modulations GFSK at 1 Mbps and 2 Mbps, QPSK at 250 Kbps
Receiver sensitivity -97 dBm (Bluetooth low energy 1M mode), -104 dBm (Coded PHY mode)
Antenna Integrated (3 dBi peak)
Current consumption
TX only @ +4 dBm, 0 dBm @ 3V, DCDC enabled 7.0 mA, 4.6 mA
TX only @ +4 dBm, 0 dBm 15.4 mA, 10.1 mA
RX only @ 1 Mbps @ 3V, DCDC enabled 4.6 mA
RX only @ 1 Mbps 10.0 mA
RX only @ 2 Mbps @ 3V, DCDC enabled 5.2 mA
RX only @ 2 Mbps 11.2 mA
CPU @ 64 MHz from flash, from RAM 4.2 mA, 4.0 mA
CPU @ 64 MHz from flash, from RAM @ 3 V,
DCDC enabled
System Off, On 0.3 µA, 0.6 µA
Additional current for RAM retention 30 nA / 4 KB block
Dimensions
BMD-360 Length: 14.0 mm ± 0.3mm
Width: 9.8 mm ± 0.3mm
Height: 1.9 mm ± 0.1mm
Hardware
Interfaces SPI Master/Slave x 2
Power supply 1.7 V to 3.6 V
Temperature range -40 °C to +85 °C
Certifications
USA (FCC) (Pending)
Canada (IC) (Pending)
Europe (CE) (Pending)
Australia / New Zealand (RCM) (Pending)
Bluetooth (Pending)
Export
BMD-360 ECCN: 5A992.C, Exception 740.17(b)(1)
Nordic Semiconductor nRF52810 nRF52811 Product Specification
2.2 mA, 2.1 mA
UART
Two-Wire Master/Slave (I2C)
GPIO x 32
PWM
PDM
FCC part 15.247 modular certification
FCC ID: XPYBMD360
Industry Canada RSS-247 modular certification IC: 8595A-BMD360
EN 60950-1: A2:2013 3.1 (a): Health and Safety of the User
EN 301 489-1 V2.1.1 & 3.1 (b): Electromagnetic Compatibility
EN 301 489-17 V3.1.1
EN 300 328 V2.1.1 3.2: Effective use of spectrum allocated
AS/NZS 4268:2017, Radio equipment and systems – Short range devices
BMD-360 BT5 RF-PHY Component (Tested) – DID: Pending; QDID: Pending
HTS: 8473.30.1180
nRF5 Software Development Kit
UBX-19039466 - R03 Functional description Page 7 of 31
BMD-360 - Data sheet
2 Pin definition
2.1 Pin assignment
The BMD-360 shares an identical pin-out with the BMD-300, BMD-301, and BMD-330. This pin-out is
also a subset of the BMD-340/341 footprint, allowing a single design to support any of these modules.
Figure 2: BMD-360 Pin assignment (Top view)
No. Name I/O Description nRF52 pin Remarks
1 GND Power Electrical Ground
2 GND Power Electrical Ground
3 GND Power Electrical Ground
4 GND Power Electrical Ground
5 GND Power Electrical Ground
6 P0.25 I/O GPIO P0.25 Standard drive, low frequency I/O only
7 P0.26 I/O GPIO P0.26 Standard drive, low frequency I/O only
8 P0.27 I/O GPIO P0.27 Standard drive, low frequency I/O only
9 P0.28 I/O GPIO/AIN4 P0.28
10 P0.29 I/O GPIO/AIN5 P0.29
11 P0.30 I/O GPIO/AIN6 P0.30 Pin is analog capable
12 P0.31 I/O GPIO/AIN7 P0.31 Pin is analog capable
13 P0.00 I/O GPIO/XTAL1 (32.768 kHz) P0.00
14 P0.01 I/O GPIO/XTAL2 (32.768 kHz) P0.01
15 P0.02 I/O GPIO/AIN0 P0.02 Pin is analog capable
16 GND Power Electrical Ground
17 VCC Power 1.7 V to 3.6 V VDD
18 GND Power Electrical Ground
Pin is analog capable, standard drive, low frequency
GPIO only
Pin is analog capable, standard drive, low frequency
GPIO only
An internal 4.7 µF bulk capacitor is included on the
module. However, it is good design practice to add
additional bulk capacitance as required for your
application, i.e. those with heavy GPIO usage and/or
current draw.
UBX-19039466 - R03 Pin definition Page 8 of 31
BMD-360 - Data sheet
No. Name I/O Description nRF52 pin Remarks
19 P0.03 I/O GPIO/AIN1 P0.03 Pin is analog capable
20 P0.04 I/O GPIO/AIN2 P0.04 Pin is analog capable
21 P0.05 I/O GPIO/AIN3 P0.05 Pin is analog capable
22 P0.06 I/O GPIO P0.06
23 P0.07 I/O GPIO P0.07
24 P0.08 I/O GPIO P0.08
25 P0.09 I/O GPIO P0.09
26 P0.10 I/O GPIO P0.10
27 P0.11 I/O GPIO P0.11
28 P0.12 I/O GPIO P0.12
29 GND Power Electrical Ground
30 GND Power Electrical Ground
31 P0.13 I/O GPIO P0.13
32 P0.14 I/O GPIO P0.14
33 P0.15 I/O GPIO P0.15
34 P0.16 I/O GPIO P0.16
35 P0.17 I/O GPIO P0.17
36 P0.18 I/O GPIO P0.18
37 P0.19 I/O GPIO P0.19
38 P0.20 I/O GPIO P0.20
39 P0.21 I/O GPIO/RESET_N P0.21
40 P0.22 I/O GPIO P0.22
41 P0.23 I/O GPIO P0.23
42 P0.24 I/O GPIO P0.24
43 SWCLK I SWD Clock SWDCLK
44 SWDIO I/O SWD IO SWDIO
45 GND Power Electrical Ground
46 GND Power Electrical Ground
47 GND Power Electrical Ground
Table 1: BMD-360 pin-out
2.2 Peripheral pin assignments
The peripherals within the BMD-360 may be assigned to nearly any of the GPIO pins through the
application. There are some restrictions called out by the nRF52811 product specification. See the
Remarks in Table 1. Also note that certain peripherals are assigned to particular pins, such the
analog inputs.
UBX-19039466 - R03 Pin definition Page 9 of 31
BMD-360 - Data sheet
3 Electrical specifications
⚠
Stressing the device above one or more of the ratings listed in the Absolute maximum rating
section may cause permanent damage. These are stress ratings only. Operating the module at
these or at any conditions other than those specified in the Operating conditions section of this
document should be avoided. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
☞
Operating condition ranges define those limits within which the functionality of the device is
guaranteed. Where application information is given, it is advisory only and does not form part of
the specification.
3.1 Absolute maximum ratings
Symbol Description Min Max Unit
V
Voltage on supply pin -0.3 3.9 V
CC_MAX
V
Voltage on GPIO pins (VCC > 3.6V) -0.3 3.9 V
IO_MAX
V
Voltage on GPIO pins (VCC ≤ 3.6V) -0.3 VCC + 0.3 V V
IO_MAX
TS Storage Temperature Range -40 125 °C
Table 2: Absolute maximum ratings
⚠
The product is not protected against overvoltage or reversed voltages. If necessary, voltage spikes
exceeding the power supply voltage specification, given in table above, must be limited to values
within the specified boundaries by using appropriate protection devices.
3.2 Operating conditions
☞
⚠
Unless otherwise specified, all operating condition specifications are at an ambient temperature
of 25 °C and a supply voltage of 3.3 V.
Operation beyond the specified operating conditions is not recommended and extended exposure
beyond them may affect device reliability.
Symbol Parameter Min Typ. Max Unit
VCC Operating supply voltage 1.7 3.0 3.6 V
T
Supply rise time (0 V to 1.7 V) - - 60 ms
R_VCC
TA Operating Ambient Temperature Range -40 25 85 °C
Table 3: Operating conditions
3.3 General purpose I/O
The general purpose I/O is organized as one port enabling access and control of the 32 available GPIO
pins through one port. Each GPIO can be accessed individually with the following user configurable
features:
• Input/output direction
• Output drive strength
• Internal pull-up and pull-down resistors
• Wake-up from high- or low-level triggers on all pins
• Trigger interrupt on all pins
UBX-19039466 - R03 Electrical specifications Page 10 of 31
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