u blox BMD360 User Manual



BMD-360

Stand-alone Bluetooth 5.1 low energy and IEEE 802.15.4
module

Data sheet

Abstract

This technical data sheet describes the BMD-360 stand-alone Bluetooth® low energy and IEEE

802.15.4 module. The OEMs can embed their own application on top of the integrated Bluetooth low
energy stack using Nordic SDK integrated development environment (IDE).

www.u-blox.com

UBX-19039466 - R03

BMD-360 - Data sheet

Document information

Title BMD-360

Subtitle Stand-alone Bluetooth 5.1 low energy and IEEE 802.15.4 module

Document type Data sheet

Document number UBX-19039466

Revision and date R03 21-Oct-2019

Disclosure restriction

Product status Corresponding content status

Functional sample Draft For functional testing. Revised and supplementary data will be published later.

In development /
Prototype

Engineering sample Advance information Data based on early testing. Revised and supplementary data will be published later.

Initial production Early production information Data from product verification. Revised and supplementary data may be published later.

Mass production /
End of life

Objective specification Target values. Revised and supplementary data will be published later.

Production information Document contains the final product specification.

This document applies to the following products:

Product name Type number PCN reference Product status

BMD-360 BMD-360-A-R-00 N/A Engineering Sample

u-blox or third parties may hold intellectual property rights in the products, names, logos and designs included in this
document. Copying, reproduction, modification or disclosure to third parties of this document or any part thereof is only
permitted with the express written permission of u-blox.
The information contained herein is provided “as is” and u-blox assumes no liability for its use. No warranty, either express or
implied, is given, including but not limited to, with respect to the accuracy, correctness, reliability and fitness for a particular
purpose of the information. This document may be revised by u-blox at any time without notice. For the most recent
documents, visit www.u-blox.com.
Copyright © u-blox AG.

UBX-19039466 - R03 Document information Page 2 of 31

BMD-360 - Data sheet

Contents

Document information ................................................................................................................................ 2

Contents .......................................................................................................................................................... 3

1 Functional description ......................................................................................................................... 5

1.1 Features ........................................................................................................................................................ 5

1.2 Applications ................................................................................................................................................. 5

1.3 Block diagram .............................................................................................................................................. 6

1.4 Radio performance ..................................................................................................................................... 6

2 Pin definition ........................................................................................................................................... 8

2.1 Pin assignment ............................................................................................................................................ 8

2.2 Peripheral pin assignments ...................................................................................................................... 9

3 Electrical specifications ................................................................................................................... 10

3.1 Absolute maximum ratings ....................................................................................................................10

3.2 Operating conditions ................................................................................................................................10

3.3 General purpose I/O ..................................................................................................................................10

3.4 Module reset ..............................................................................................................................................11

3.5 Debug and programming .........................................................................................................................11

3.6 Clocks ..........................................................................................................................................................11

3.6.1 32.768 kHz crystal (LFXO) (preliminary)......................................................................................12

3.6.2 32.768 kHz clock source comparison ...........................................................................................12

4 Firmware ................................................................................................................................................ 13

4.1 Factory image ............................................................................................................................................13

4.2 SoftDevices ................................................................................................................................................13

4.2.1 S113 ....................................................................................................................................................13

4.2.2 IEEE 802.15.4 (Thread and Zigbee) ..............................................................................................13

4.3 Bluetooth address .....................................................................................................................................13

5 Mechanical specifications ............................................................................................................... 14

5.1 Dimensions .................................................................................................................................................14

5.2 Recommended PCB land pads ...............................................................................................................14

5.3 Module marking .........................................................................................................................................15

6 RF design notes ................................................................................................................................... 16

6.1 Recommended RF layout and ground plane ........................................................................................16

6.2 Mechanical enclosure ...............................................................................................................................16

7 Antenna patterns ............................................................................................................................... 17

7.1 X-Y plane .....................................................................................................................................................17

7.2 Y-Z plane .....................................................................................................................................................18

7.3 Z-X plane .....................................................................................................................................................18

8 BMD-360 evaluation development kit ......................................................................................... 19

9 Qualification and approvals............................................................................................................. 20

9.1 United States (FCC) (pending approval) ..............................................................................................20

9.1.1 Labeling and user information requirements .............................................................................20

UBX-19039466 - R03 Contents Page 3 of 31

BMD-360 - Data sheet

9.1.2 RF exposure .......................................................................................................................................21

9.2 Canada (ISED) (pending approval) .........................................................................................................21

9.2.1 Labeling and user information requirements .............................................................................21

9.2.2 RF exposure .......................................................................................................................................22

9.3 Europe (CE-RED) (pending approval) ....................................................................................................22

9.3.1 Labeling and user information requirements .............................................................................22

9.4 Australia / New Zealand (RCM) (pending approval) ...........................................................................22

9.5 Bluetooth qualification (pending) ..........................................................................................................23

10 Environmental...................................................................................................................................... 24

10.1 RoHS ............................................................................................................................................................24

10.2 REACH .........................................................................................................................................................24

10.3 California proposition 65 (P65) ..............................................................................................................24

11 Product handling ................................................................................................................................. 25

11.1 Packaging ...................................................................................................................................................25

11.2 Reel packaging ...........................................................................................................................................25

11.3 Carrier tape dimensions ..........................................................................................................................25

11.4 Moisture sensitivity level .........................................................................................................................25

11.5 Reflow soldering ........................................................................................................................................26

12 Labeling and ordering information ............................................................................................... 27

12.1 Batch Label .................................................................................................................................................27

12.2 Multipack label...........................................................................................................................................27

12.3 Ordering information ................................................................................................................................28

13 Life support and other high-risk use warning ........................................................................... 29

Related documents ................................................................................................................................... 30

Revision history .......................................................................................................................................... 30

Contact .......................................................................................................................................................... 31

UBX-19039466 - R03 Contents Page 4 of 31

BMD-360 - Data sheet

1 Functional description

The BMD-360 is a powerful, highly flexible, ultra-low power Bluetooth 5.1 and IEEE 802.15.4 (Thread
and Zigbee) module based on the nRF52811 SoC from Nordic Semiconductor. With an Arm® Cortex®
M4 CPU, embedded 2.4GHz transceiver, and integrated antenna, it provides a complete RF solution
with no additional RF design, allowing faster time to market. Providing full use of the nRF52811’s
capabilities and peripherals, the BMD-360 can power demanding applications, while simplifying
designs and reducing BOM costs. Angle of Arrival (AoA) and Angle of Departure (AoD) features of
Bluetooth 5.1 are supported. With an internal DC-DC converter and intelligent power control, the
BMD-360 provides class-leading power efficiency, enabling ultra-low power sensitive applications.
Regulatory pre-approvals reduce the burden to enter the market. As a drop-in replacement for the
BMD-300/301/330, the BMD-360 completes the BMD-300 Series lineup with an optimized peripheral
set that is attractive for a wide range of cost-sensitive applications.

1.1 Features

• Based on the Nordic Semiconductor nRF52811 SoC

• Bluetooth 5.1 2M PHY, 1M PHY, Coded PHY (long range), CSA #2, AoA, AoD

• IEEE 802.15.4 with Thread and Zigbee support

• Complete RF solution with an integrated DC-DC converter

• Nordic Semiconductor SoftDevice ready

• Over-the-Air (OTA) firmware updates

• No external components required

• Arm® Cortex®-M4 32-bit processor

• 192 kB embedded flash memory

• 24 kB RAM

• -40 °C to +85 °C Temperature Range

• 32 General Purpose I/O Pins

• 12-bit/200 KSPS ADC

• Serial Wire Debug (SWD)

• SPI Master/Slave (8 Mbps)

• 2-wire Master/Slave (I2C compatible)

• Footprint compatible with BMD-300, BMD-301, BMD-330, BMD-340, and BMD-341

• UART (w/ CTS/RTS and DMA)

• Temperature sensor

• 20 channel CPU independent Programmable Peripheral Interconnect (PPI)

• Quadrature Demodulator (QDEC)

• 128-bit AES HW encryption

• 3 x 32 bit Timer / Counter

• 2 x 24 bit Real-Time Counter (RTC)

• Dimensions: 14 x 9.8 x 1.9mm

1.2 Applications

• Beacons – iBeacon™, Eddystone, AltBeacon, AoA, AoD

• Low-Power Sensors

• Fitness devices

• Wearables

• Climate Control

• Lighting

• Safety and Security

• Home Appliances

UBX-19039466 - R03 Functional description Page 5 of 31

BMD-360 - Data sheet

• Access Control

• Internet of Things

• Home Health Care

• Advanced Remote Controls

• Smart Energy Management

• Low-Power Sensor Networks

• Interactive Entertainment

• Key Fobs

• Environmental Monitoring

• Hotel Automation

• Office Automation

1.3 Block diagram

BMD-360 Bluetooth 5 Low Energy SoC Module

nRF52811-QFAx

192kB

Flas h

24

kB RA M

SWD Debug &

Pro gram min g

Core LDO

DC/DC Buck

Regulator

DC-DC

Indu ctor

Figure 1: Block diagram of BMD-360

ARM Cortex-M4

@ 64MHz

Clo ck

Ma nag eme nt

Watc hdog

Ti mer

TWI

Master

TW I S lav e 4ch PWM PDM

Bulk

Capac it ors

Real Time

Count er x 2

Ti mer x 3

SPI

Master

SPI Slave

Decoupling

Capac it ors

1.4 Radio performance

Accel Addre ss

AES CCM M ode

Rand om Number

UA RT

Resolver

AES EC B

Enc ryp tion

Gen

GPIO x32

(Ana lo g x8)

2.4GHz Rad io

Multi-protocol

Programmable

Per ipheral

Inter connect

GP IO Ta sk

Eve nt B locks

Quadr ature

Decoder

32 MH z

Cry sta l

Temperature

S en so r

General
Purpos e

Comparator

8-ch 12-bit

ADC

Balun

Ma tch ing

Network

PCB

Antenna

Detail Description

Bluetooth

Bluetooth version Bluetooth 5 Low Energy, Peripheral (S113), 2M PHY, 1M PHY, Coded PHY,

CSA #2, AoA/AoD

Bluetooth security AES-128

LE connections Concurrent peripheral roles (S113)

IEEE 802.15.4

Thread stack OpenThread, Thread 1.1 compatible

Thread security AES-128

Zigbee stack Zigbee 3.0 compatible

Radio

Frequency 2.360 GHz to 2.500 GHz

UBX-19039466 - R03 Functional description Page 6 of 31

BMD-360 - Data sheet

Detail Description

Modulations GFSK at 1 Mbps and 2 Mbps, QPSK at 250 Kbps

Receiver sensitivity -97 dBm (Bluetooth low energy 1M mode), -104 dBm (Coded PHY mode)

Antenna Integrated (3 dBi peak)

Current consumption

TX only @ +4 dBm, 0 dBm @ 3V, DCDC enabled 7.0 mA, 4.6 mA

TX only @ +4 dBm, 0 dBm 15.4 mA, 10.1 mA

RX only @ 1 Mbps @ 3V, DCDC enabled 4.6 mA

RX only @ 1 Mbps 10.0 mA

RX only @ 2 Mbps @ 3V, DCDC enabled 5.2 mA

RX only @ 2 Mbps 11.2 mA

CPU @ 64 MHz from flash, from RAM 4.2 mA, 4.0 mA

CPU @ 64 MHz from flash, from RAM @ 3 V,
DCDC enabled

System Off, On 0.3 µA, 0.6 µA

Additional current for RAM retention 30 nA / 4 KB block

Dimensions

BMD-360 Length: 14.0 mm ± 0.3mm

Width: 9.8 mm ± 0.3mm

Height: 1.9 mm ± 0.1mm

Hardware

Interfaces SPI Master/Slave x 2

Power supply 1.7 V to 3.6 V

Temperature range -40 °C to +85 °C

Certifications

USA (FCC) (Pending)

Canada (IC) (Pending)
Europe (CE) (Pending)

Australia / New Zealand (RCM) (Pending)
Bluetooth (Pending)

Export

BMD-360 ECCN: 5A992.C, Exception 740.17(b)(1)

Nordic Semiconductor nRF52810 nRF52811 Product Specification

2.2 mA, 2.1 mA

UART
Two-Wire Master/Slave (I2C)
GPIO x 32
PWM
PDM

FCC part 15.247 modular certification
FCC ID: XPYBMD360
Industry Canada RSS-247 modular certification IC: 8595A-BMD360
EN 60950-1: A2:2013 3.1 (a): Health and Safety of the User
EN 301 489-1 V2.1.1 & 3.1 (b): Electromagnetic Compatibility
EN 301 489-17 V3.1.1
EN 300 328 V2.1.1 3.2: Effective use of spectrum allocated
AS/NZS 4268:2017, Radio equipment and systems – Short range devices
BMD-360 BT5 RF-PHY Component (Tested) – DID: Pending; QDID: Pending

HTS: 8473.30.1180

nRF5 Software Development Kit

UBX-19039466 - R03 Functional description Page 7 of 31

BMD-360 - Data sheet

2 Pin definition

2.1 Pin assignment

The BMD-360 shares an identical pin-out with the BMD-300, BMD-301, and BMD-330. This pin-out is
also a subset of the BMD-340/341 footprint, allowing a single design to support any of these modules.

Figure 2: BMD-360 Pin assignment (Top view)

No. Name I/O Description nRF52 pin Remarks

1 GND Power Electrical Ground

2 GND Power Electrical Ground

3 GND Power Electrical Ground

4 GND Power Electrical Ground

5 GND Power Electrical Ground

6 P0.25 I/O GPIO P0.25 Standard drive, low frequency I/O only

7 P0.26 I/O GPIO P0.26 Standard drive, low frequency I/O only

8 P0.27 I/O GPIO P0.27 Standard drive, low frequency I/O only

9 P0.28 I/O GPIO/AIN4 P0.28

10 P0.29 I/O GPIO/AIN5 P0.29

11 P0.30 I/O GPIO/AIN6 P0.30 Pin is analog capable

12 P0.31 I/O GPIO/AIN7 P0.31 Pin is analog capable

13 P0.00 I/O GPIO/XTAL1 (32.768 kHz) P0.00

14 P0.01 I/O GPIO/XTAL2 (32.768 kHz) P0.01

15 P0.02 I/O GPIO/AIN0 P0.02 Pin is analog capable

16 GND Power Electrical Ground

17 VCC Power 1.7 V to 3.6 V VDD

18 GND Power Electrical Ground

Pin is analog capable, standard drive, low frequency
GPIO only

Pin is analog capable, standard drive, low frequency
GPIO only

An internal 4.7 µF bulk capacitor is included on the
module. However, it is good design practice to add
additional bulk capacitance as required for your
application, i.e. those with heavy GPIO usage and/or
current draw.

UBX-19039466 - R03 Pin definition Page 8 of 31

BMD-360 - Data sheet

No. Name I/O Description nRF52 pin Remarks

19 P0.03 I/O GPIO/AIN1 P0.03 Pin is analog capable

20 P0.04 I/O GPIO/AIN2 P0.04 Pin is analog capable

21 P0.05 I/O GPIO/AIN3 P0.05 Pin is analog capable

22 P0.06 I/O GPIO P0.06

23 P0.07 I/O GPIO P0.07

24 P0.08 I/O GPIO P0.08

25 P0.09 I/O GPIO P0.09

26 P0.10 I/O GPIO P0.10

27 P0.11 I/O GPIO P0.11

28 P0.12 I/O GPIO P0.12

29 GND Power Electrical Ground

30 GND Power Electrical Ground

31 P0.13 I/O GPIO P0.13

32 P0.14 I/O GPIO P0.14

33 P0.15 I/O GPIO P0.15

34 P0.16 I/O GPIO P0.16

35 P0.17 I/O GPIO P0.17

36 P0.18 I/O GPIO P0.18

37 P0.19 I/O GPIO P0.19

38 P0.20 I/O GPIO P0.20

39 P0.21 I/O GPIO/RESET_N P0.21

40 P0.22 I/O GPIO P0.22

41 P0.23 I/O GPIO P0.23

42 P0.24 I/O GPIO P0.24

43 SWCLK I SWD Clock SWDCLK

44 SWDIO I/O SWD IO SWDIO

45 GND Power Electrical Ground

46 GND Power Electrical Ground

47 GND Power Electrical Ground

Table 1: BMD-360 pin-out

2.2 Peripheral pin assignments

The peripherals within the BMD-360 may be assigned to nearly any of the GPIO pins through the
application. There are some restrictions called out by the nRF52811 product specification. See the
Remarks in Table 1. Also note that certain peripherals are assigned to particular pins, such the
analog inputs.

UBX-19039466 - R03 Pin definition Page 9 of 31

BMD-360 - Data sheet

3 Electrical specifications

⚠

Stressing the device above one or more of the ratings listed in the Absolute maximum rating
section may cause permanent damage. These are stress ratings only. Operating the module at
these or at any conditions other than those specified in the Operating conditions section of this
document should be avoided. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.

☞

Operating condition ranges define those limits within which the functionality of the device is
guaranteed. Where application information is given, it is advisory only and does not form part of
the specification.

3.1 Absolute maximum ratings

Symbol Description Min Max Unit

V

Voltage on supply pin -0.3 3.9 V

CC_MAX

V

Voltage on GPIO pins (VCC > 3.6V) -0.3 3.9 V

IO_MAX

V

Voltage on GPIO pins (VCC ≤ 3.6V) -0.3 VCC + 0.3 V V

IO_MAX

TS Storage Temperature Range -40 125 °C

Table 2: Absolute maximum ratings

⚠

The product is not protected against overvoltage or reversed voltages. If necessary, voltage spikes
exceeding the power supply voltage specification, given in table above, must be limited to values
within the specified boundaries by using appropriate protection devices.

3.2 Operating conditions

☞

⚠

Unless otherwise specified, all operating condition specifications are at an ambient temperature
of 25 °C and a supply voltage of 3.3 V.

Operation beyond the specified operating conditions is not recommended and extended exposure
beyond them may affect device reliability.

Symbol Parameter Min Typ. Max Unit

VCC Operating supply voltage 1.7 3.0 3.6 V

T

Supply rise time (0 V to 1.7 V) - - 60 ms

R_VCC

TA Operating Ambient Temperature Range -40 25 85 °C

Table 3: Operating conditions

3.3 General purpose I/O

The general purpose I/O is organized as one port enabling access and control of the 32 available GPIO
pins through one port. Each GPIO can be accessed individually with the following user configurable
features:

• Input/output direction

• Output drive strength

• Internal pull-up and pull-down resistors

• Wake-up from high- or low-level triggers on all pins

• Trigger interrupt on all pins

UBX-19039466 - R03 Electrical specifications Page 10 of 31

BMD-360 - Data sheet

• All pins can be used by the PPI task/event system; the maximum number of pins that can be
interfaced through the PPI at the same time is limited by the number of GPIOTE channels

• All pins can be individually configured to carry serial interface or quadrature demodulator signals

Symbol Parameter Min. Typ. Max. Unit

VIH Input High Voltage 0.7 x VCC - VCC V

VIL Input Low Voltage GND - 0.3 x VCC V

VOH Output High Voltage VCC − 0.4 - VCC V

VOL Output Low Voltage GND - GND + 0.4 V

RPU Pull-up Resistance 11 13 16 kΩ

RPD Pull-down Resistance 11 13 16 kΩ

Table 4: GPIO

3.4 Module reset

GPIO pin P0.21 may be used for a hardware reset. In order to utilize P0.21 as a hardware reset, the
UICR registers PSELRESET[0] and PSELRESET[1] must be set alike, to the value of 0x7FFFFF15.
When P0.21 is programmed as RESET, the internal pull-up is automatically enabled. Nordic
Semiconductor example applications and development kits program P0.21 as RESET.

3.5 Debug and programming

The BMD-360 series supports the two pin Serial Wire Debug (SWD) interface and offers flexible and
powerful mechanism for non-intrusive debugging of program code. Breakpoints, single stepping, and
instruction trace capture of code execution flow are part of this support.

The BMD-360 also supports ETM and ITM trace. The trace data from the ETM and the ITM is sent to
an external debugger via a 4-bit wide parallel trace port. In addition to parallel trace, the TPIU supports
serial trace via the Serial Wire Output (SWO) trace protocol.

3.6 Clocks

The BMD-360 requires two clocks, a high frequency clock and a low frequency clock. The high
frequency clock is provided on-module by a high-accuracy 32 MHz crystal as required by the
nRF52811 for radio operation.

The low frequency clock can be provided internally by an RC oscillator or synthesized from the fast
clock, or externally by a 32.768 kHz crystal. An external crystal provides the lowest power
consumption and greatest accuracy. Using the internal RC oscillator with calibration provides
acceptable performance for Bluetooth low energy applications at a reduced cost and slight increase
in power consumption.

☞

☞

The ANT protocol requires the use of an external crystal.

f

TOL_LFXO_BLE

and f

TOL_LFXO_ANT

are the maximum allowed for Bluetooth low energy and ANT

applications. Actual tolerance depends on the crystal used.

UBX-19039466 - R03 Electrical specifications Page 11 of 31

BMD-360 - Data sheet

3.6.1 32.768 kHz crystal (LFXO) (preliminary)

Symbol Parameter Typ. Max. Unit

F

F

f

TOL_LFX O_ANT

C

C

R

C

Crystal frequency 32.768 - kHz

NOM_LFXO

TOL_LFXO_BLE

Frequency tolerance, Bluetooth low energy applications - ±500 ppm

Frequency Tolerance, ANT applications - ±50 ppm

Load Capacitance - 12.5 pF

L_LFXO

Shunt Capacitance - 2 pF

0_LFXO

Equivalent series resistance - 100 kΩ

S_LFXO

Input Capacitance on XL1 & XL2 pads 4 - pF

pin

Table 5: 32.768 kHz Crystal (LFXO)

3.6.2 32.768 kHz clock source comparison

Symbol Parameter Min. Typ. Max. Unit

f

TOL_LFXO_BLE

f

TOL_LFX O_ANT

f

f

f

Frequency Tolerance, 32.768 kHz RC Oscillator - - ±2 %

TOL_LFRC

TOL_CAL_LFRC

TOL_LF SYNT

Frequency Tolerance, 32.768 kHz Synthesized Oscillator - - ±8 ppm

Table 6 – 32.768 kHz Clock source comparison

Frequency Tolerance, 32.768 kHz Crystal Oscillator (Bluetooth low

- - ±250 ppm

energy Stack)

Frequency Tolerance, 32.768 kHz Crystal Oscillator (ANT Stack) - - ±50 ppm

Frequency tolerance, 32.768 kHz RC after calibration - - ±500 ppm

UBX-19039466 - R03 Electrical specifications Page 12 of 31

BMD-360 - Data sheet

4 Firmware

u-blox recommends that projects for the BMD-360 utilize Nordic Semiconductor’s SDK, DFU, and

examples and the nRF52811 tools for any new development. This will allow access to the very latest

Bluetooth support from Nordic Semiconductor and provide an ongoing path as new features are
released.

4.1 Factory image

The BMD-360 module is not loaded with a factory firmware image.

4.2 SoftDevices

Nordic Semiconductor protocol stacks are known as SoftDevices. SoftDevices are pre-compiled,
pre-linked binary files. SoftDevices can be programmed in nRF52 series SoCs and are downloadable
from the Nordic Semiconductor website. The BMD-360 with the nRF52811 SoC supports the S113
(Bluetooth low energy Peripheral) SoftDevices.

4.2.1 S113

The S113 SoftDevice is a Bluetooth low energy peripheral protocol stack solution. It supports up to
four peripheral connections with an additional broadcaster role running concurrently. The S113
SoftDevice integrates a Bluetooth low energy Controller and Host and provides a full and flexible API
for building Bluetooth low energy nRF52 System on Chip (SoC) solutions.

4.2.2 IEEE 802.15.4 (Thread and Zigbee)

IEEE 802.15.4 based protocols, such as Thread and Zigbee, on the BMD-360 are not implemented
using a SoftDevice. Nordic Semiconductor provides an IEEE 802.15.4 compliant MAC stack which
does not require a SoftDevice to be loaded to operate. Nordic Semiconductor also provides
pre-compiled Thread and Zigbee stacks. See the
on developing applications that utilize IEEE 802.15.4. Both allow for concurrent operation with
Bluetooth low energy SoftDevices.

Nordic Semiconductor SDK

for more information

4.3 Bluetooth address

The BMD-360 modules are preprogrammed from the factory with a unique public Bluetooth address
stored in the UICR. The Bluetooth address is the Organizationally Unique Identifier (94:54:93)
combined with the six characters that are printed on a 2D barcode and in human-readable text on the
module label, as described in section 5.3.

UICR Register Address Description

NRF_UICR + 0x80 0x10001080 Bluetooth_addr [0] (0xCC)

NRF_UICR + 0x81 0x10001081 Bluetooth_addr [1] (0xBB)

NRF_UICR + 0x82 0x10001082 Bluetooth_addr [2] (0xAA)

NRF_UICR + 0x83 0x10001083 Bluetooth_addr [3] (0xEB)

NRF_UICR + 0x84 0x10001084 Bluetooth_addr [4] (0x1D)

NRF_UICR + 0x85 0x10001085 Bluetooth_addr [5] (0x6C)

Table 7: Bluetooth address

UBX-19039466 - R03 Firmware Page 13 of 31

BMD-360 - Data sheet

5 Mechanical specifications

5.1 Dimensions

Figure 3: BMD-360 mechanical drawing

5.2 Recommended PCB land pads

Figure 4: Recommended PCB land pads

☞ The RF Keep-out area extends vertically to the board edge.

UBX-19039466 - R03 Mechanical specifications Page 14 of 31

BMD-360 - Data sheet

5.3 Module marking

The labels of the BMD-360 modules include important product information as described in this
section.

Figure 5 illustrates the label of the BMD-360 modules, which includes the u-blox logo, product version,
product name, Bluetooth address, and certification numbers.

2

1

3

4

Figure 5: Module marking

Reference Description

1 Date of unit production (year/week)

2 Product version

3 Product name

4

Table 8: BMD-360 label description

Data Matrix (QR code) with unique serial number of six alphanumeric symbols, also in human-readable form.
The full Bluetooth address consists of the IEEE OUI (94:54:93) with the six symbols appended:
94:54:93:AA:BB:CC

UBX-19039466 - R03 Mechanical specifications Page 15 of 31

BMD-360 - Data sheet

6 RF design notes

6.1 Recommended RF layout and ground plane

For the BMD-360, the integrated antenna requires a suitable ground plane to radiate effectively.

The area under and extending out from the antenna portion of the module should be kept clear of
copper and other metal. The module should be placed at the edge of the PCB with the antenna edge
facing out. Reducing the ground plane from that shown in Figure 6 will reduce the effective radiated
power. For example, a 27 mm x 29 mm board (about the size of a coin cell) has approximately 3dB
lower output than the BMD-360 Evaluation Board.

These RF guidelines for the BMD-360 are the same as the BMD-300 module. Designs incorporating
the BMD-300 will have similar RF performance with the BMD-360 module.

Figure 6: Recommended RF layout and ground plane for BMD-360

6.2 Mechanical enclosure

Care should be taken when designing and placing the BMD-360 module into an enclosure. Metal
should be kept clear from the antenna area, both above and below. Any metal around the module can
negatively impact RF performance.

The module is designed and tuned for the antenna and RF components to be in free air. Any potting,
epoxy fill, plastic over-molding, or conformal coating can negatively impact RF performance and must
be evaluated by the customer.

UBX-19039466 - R03 RF design notes Page 16 of 31

BMD-360 - Data sheet

7 Antenna patterns

Antenna patterns are based on the BMD-300 Evaluation Kit with a ground plane size of
82 mm x 56 mm. The BMD-300 module was replaced with a BMD-360 module. The X-Y-Z orientation
is shown in Figure 7:

Figure 7: BMD-360 Evaluation kit X -Y-Z orientation

7.1 X-Y plane

Figure 8: X-Y Plane Antenna Pattern

X

Y

☞

The outer-most ring is +5 dB. Each division is -5 dB

UBX-19039466 - R03 Antenna patterns Page 17 of 31

BMD-360 - Data sheet

7.2 Y-Z plane

Y

Z

Figure 9: Y-Z Plane Antenna Pattern

☞

The outer-most ring is +5 dB. Each division is -5 dB.

7.3 Z-X plane

Figure 10: Z-X Plane Antenna Pattern

Z

X

☞

The outer-most ring is +5 dB. Each division is -5 dB.

UBX-19039466 - R03 Antenna patterns Page 18 of 31

BMD-360 - Data sheet

8 BMD-360 evaluation development kit

The BMD-360-EVAL is a full featured evaluation board that provides a complete I/O pin out to headers,
on-board programming and debugging, 32.768 kHz crystal, power & virtual COM port over USB, four
user LEDs, and four user buttons. The evaluation boards also provide the option to be powered from
a CR2032 coin cell battery and have current sense resistors and headers to allow for convenient
current measurements. An Arduino Uno R3 style header is provided for easy prototyping of additional
functions. The evaluation boards also support programming off-board BMD-300 Series modules.

Figure 11: BMD-360 evaluation board

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BMD-360 - Data sheet

9 Qualification and approvals

9.1 United States (FCC) (pending approval)

The BMD-360 module has received Federal Communications Commission (FCC) CFR47
Telecommunications, Part 15 Subpart C “Intentional Radiators” modular approval in accordance with
Parts 15.212 and 15.247. The modular approval allows the end user to integrate the module into a
finished product without obtaining subsequent and separate FCC approvals for intentional radiation,
provided no changes or modifications are made to the module circuitry. Changes or modifications
could void the user’s authority to operate the equipment. The end user must comply with all of the
instructions provided by the Grantee, which indicate installation and/or operating conditions
necessary for compliance.

The finished product is required to comply with all applicable FCC equipment authorizations
regulations, requirements and equipment functions not associated with the transmitter module
portion. For example, compliance must be demonstrated to regulations for other transmitter
components within the host product; to requirements for unintentional radiators (Part 15 Subpart B
“Unintentional Radiators”), such as digital devices, computer peripherals, radio receivers, etc.; and to
additional authorization requirements for the non-transmitter functions on the transmitter module
(that is, Verification, or Declaration of Conformity) (for example, transmitter modules may also
contain digital logic functions) as appropriate.

☞

⚠

Modification to this product will void the users’ authority to operate this equipment.

The OEM is still responsible for verifying end product compliance with FCC Part 15, subpart B
limits for unintentional radiators through an accredited test facility.

KDB 996369 D03 sections 2.4 (limited module procedures) and 2.5 (trace antenna designs)
are not applicable to the BMD-360.

9.1.1 Labeling and user information requirements

The BMD-360 is assigned the FCC ID number: XPYBMD360

If the FCC ID is not visible when the module is installed inside another device, then the outside of the
finished product into which the module is installed must also display a label referring to the enclosed
module. This exterior label can use the following or similar wording:

Contains FCC ID: XPYBMD360

In addition to marking the product with the appropriate FCC ID, the end product shall bear the
following statement in a conspicuous location on the device (FCC Rules, Title 47, Subchapter A, Part

15, Subpart B, Chapter §15.19):

This device complies with part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must
accept any interference received, including interference that may cause undesired operation.

When the device is so small or for such use that it is impracticable to label it with the statement
specified above in a font that is four-point or larger, and the device does not have a display that can
show electronic labeling, then the information required by this paragraph shall be placed in the user
manual and must also either be placed on the device packaging or on a removable label attached to
the device.

The user manual may also require specific information based on the digital device classification. Refer
to the FCC Rules, Title 47, Subchapter A, Part 15, Subpart B, Chapter §15.105 for specific wording of
these notices.

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9.1.2 RF exposure

All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498 General

RF Exposure Guidance provides guidance in determining whether proposed or existing transmitting

facilities, operations or devices comply with limits for human exposure to Radio Frequency (RF) fields
adopted by the Federal Communications Commission (FCC).

This module is approved for installation into mobile and/or portable host platforms and must not be
co-located or operating in conjunction with any other antenna or transmitter except in accordance
with FCC multi-transmitter guidelines. End users must be provided with transmitter operating
conditions for satisfying RF Exposure compliance.

9.2 Canada (ISED) (pending approval)

The BMD-360 module is certified for use in Canada under Innovation, Science and Economic
Development Canada (ISED) Radio Standards Specification (RSS) RSS-247 Issue 2 and RSSGen.

9.2.1 Labeling and user information requirements

The BMD-360 is assigned the IC ID number: 8595A-BMD360

Labeling Requirements for the Host Device (from Section 3.2.1, RSS-Gen, Issue 3, December 2010):
The host device shall be properly labeled to identify the module within the host device. The Industry
Canada certification label of a module shall be clearly visible at all times when installed in the host
device, otherwise the host device must be labeled to display the Industry Canada certification number
of the module, preceded by the words “Contains transmitter module”, or the word “Contains”, or
similar wording expressing the same meaning, as follows:

Contains transmitter module IC: 8595A-BMD360

User Manual Notice for License-Exempt Radio Apparatus (from Section 7.1.3 RSS-Gen, Issue 3,
December 2010): User manuals for license-exempt radio apparatus shall contain the following or
equivalent notice in a conspicuous location in the user manual or alternatively on the device or both:

This device contains licence-exempt transmitter(s)/receiver(s) that comply with Innovation, Science
Canada’s licence-exempt RSS(s). Operation is subject to the following two conditions:

1. This device may not cause interference.

2. This device must accept any interference, including interference that may cause undesired operation of the device.
L’émetteur/récepteur exempt de licence contenu dans le présent appareil est conforme aux CNR d’Innovation,
Sciences et Développement économique Canada applicables aux appareils radio exempts de licence.

L’exploitation est autorisée aux deux conditions suivantes :

1. L’appareil ne doit pas produire de brouillage;

2. L’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en
compromettre le fonctionnement.

Transmitter Antenna (from Section 7.1.2 RSS-Gen, Issue 3, December 2010): User manuals
for transmitters shall display the following notice in a conspicuous location:

Under Industry Canada regulations, this radio transmitter may only operate using an antenna
of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To
reduce potential radio interference to other users, the antenna type and its gain should be so
chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that
necessary for successful communication.

and Economic Development

Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut
fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour
l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique
à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la

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BMD-360 - Data sheet

puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à
l'établissement d'une communication satisfaisante.

9.2.2 RF exposure

All transmitters regulated by IC must comply with RF exposure requirements listed in RSS-102 - Radio
Frequency (RF) Exposure Compliance of Radio communication Apparatus (All Frequency Bands). This
module is approved for installation into mobile and/or portable host platforms and must not be co­located or operating in conjunction with any other antenna or transmitter except in accordance with
Industry Canada's multi-transmitter guidelines. End users must be provided with transmitter
operating conditions for satisfying RF Exposure compliance.

9.3 Europe (CE-RED) (pending approval)

The BMD-360 is a Radio Equipment Directive assessed radio module that is CE complaint and have
been manufactured and tested with the intention of being integrated into a final product.

The BMD-360 has been tested to current Radio Equipment Directives

• EN 60950-1: 2006 + A11: 2009 + A1: 2010 + A12: 2011 + A2: 2013

• ETSI EN 300 328 V 2.1.1

• ETSI EN 301 489-1 V2.1.1

• ETSI EN 301 489-17 V3.1.1

The Radio Equipment Directive – Compliance Association (RED-CA) provides guidance on modular
devices at the RED-CA website: http://www.redca.eu/Pages/Documents%201.htm.

9.3.1 Labeling and user information requirements

The label on the final products which contain a BMD-360 module must follow CE marking
requirements. The “R&TTE Compliance Association Technical Guidance Note 01” provides guidance
on final product CE marking.

9.4 Australia / New Zealand (RCM) (pending approval)

The BMD-360 has been tested to comply with the AS/NZS 4268:2017, Radio equipment and systems
– Short range devices – Limits and methods of measurement. The report may be obtained from your
local FAE, and may be used as evidence in obtaining permission to use the Regulatory Compliance
Mark (RCM).

Information on registration as a Responsible Party, license and labeling requirements may be found
at the following websites:

Australia: http://www.acma.gov.au/theACMA/radiocommunications-short-range-devices-standard-

2004

New Zealand: http://www.rsm.govt.nz/compliance

Only Australian-based and New Zealand-based companies who are registered may be granted
permission to use the RCM. An Australian-based or New Zealand-based agent or importer may also
register as a Responsible Party to use the RCM on behalf of a company not in Australia or New
Zealand.

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BMD-360 - Data sheet

9.5 Bluetooth qualification (pending)

The Bluetooth SIG maintains the Bluetooth Specification, and ensures that products are properly
tested and comply with the Bluetooth license agreements. Companies that list products with the
Bluetooth SIG are required to be members of the SIG and submit the listed fees. Refer to this link for
details: https://www.bluetooth.com/develop-with-bluetooth/qualification-listing

The BMD-360 Bluetooth Low Energy module based on the Nordic Semiconductor nRF52811 is listed
as a “Tested Component”, with Qualified Design IDs (QDID) (Pending). This allows an end-product
based on a BMD-360 module to inherit the component listings without the need to run through all of
the tests again. The end-product will often inherit several QDIDs, and are identified on a “Declaration
of Compliance”.

The BMD-360 primarily utilizes the 113 SoftDevice

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BMD-360 - Data sheet

10 Environmental

10.1 RoHS

The BMD-360 module is in compliance with Directive 2011/65/EU, 2015/863/EU of the European
Parliament and the Council on the restriction of the use of certain hazardous substances in electrical
and electronic equipment.

10.2 REACH

Rigado’s modules listed below do not contain the 201 SVHC (Substance of Very High Concern), as
defined by Directive EC/1907/2006 Article according to REACH Annex XVII.

10.3 California proposition 65 (P65)

This product can expose you to Nickel (metallic), which is known to the State of California to cause
cancer. For more information go to www.P65Warnings.ca.gov. Warnings are not required where the

listed chemical is inaccessible to the average user of the end product.

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BMD-360 - Data sheet

11 Product handling

11.1 Packaging

11.2 Reel packaging

Modules are packaged on 330 mm reels loaded with 1000 modules. Each reel is placed in an antistatic
bag with a desiccant pack and humidity card and placed in a 340 x 350 x 65 mm box. An antistatic
warning and reel label are adhered to the outside of the bag.

Figure 12 – Reel cartons

11.3 Carrier tape dimensions

Figure 13 – Carrier tape dimensions

11.4 Moisture sensitivity level

The BMD-360 is rated for MSL 3, 168-hour floor life after opening.

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11.5 Reflow soldering

Figure 14: Reflow profile for lead free solder

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BMD-360 - Data sheet

12 Labeling and ordering information

12.1 Batch Label

Figure 15 shows an example of the layout and contents of the batch label. The label is affixed to reels,
sealed bags, and individual packing cartons (inner cartons).

Figure 15: Batch label example

12.2 Multipack label

Figure 16 shows an example of the layout and contents of the multipack label. The label is affixed to
shipping parcels (outer cartons).

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BMD-360 - Data sheet

Figure 16: Multipack label example

12.3 Ordering information

Ordering Code Product

BMD-360-A-R BMD-360 module, Rev A, Tape & Reel, 1000 piece multiples

BMD-360-Evaluation kit BMD-360 Evaluation Kit w/ SEGGER J-Link-OB debug probe

Table 9: Product ordering codes

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BMD-360 - Data sheet

13 Life support and other high-risk use warning

This product is not designed nor intended for use in a life support device or system, nor for use in other
fault-intolerant, hazardous or other environments requiring fail-safe performance, such as any
application in which the failure or malfunction of the product could lead directly or indirectly to death,
bodily injury, or physical or property damage (collectively, “High-Risk Environments”).

⚠ u-blox expressly disclaims any express or implied warranty of fitness for use in high-risk

environments.

The customer using this product in a High-Risk Environment agrees to indemnify and defend u-blox
from and against any claims and damages arising out of such use.

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BMD-360 - Data sheet

Related documents

[1] Nordic Semiconductor, nRF52811 Product Specification
[2] Nordic Semiconductor, nRF5 Software Development Kit

☞ For regular updates to u-blox documentation and to receive product change notifications, register

on our homepage (www.u-blox.com).

Revision history

Revision Date Name Comments

0.5 15-Apr-2019 Preliminary release for engineering.

0.6 01-Jul-2019

R03 21-Oct-2019

Corrected typos. Updated Nordic Semiconductor documentation link. Updated
images.

Document converted from Rigado BMD-360 data sheet to u-blox BMD-360
data sheet.

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BMD-360 - Data sheet

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