u blox BMD341 User Manual
Abstract
This technical data sheet describes the BMD-341 stand-alone Bluetooth® low energy module. The
OEMs can embed their own application on top of the integrated Bluetooth low energy stack using
Nordic Semiconductor SDK or Arm® Mbed™ integrated development environment (IDE).
www.u-blox.com
UBX-19033643 - R03
BMD-341
Stand-alone Bluetooth 5 low energy modules
Data sheet
BMD-341 - Data sheet
Title
BMD-341
Subtitle
Stand-alone Bluetooth 5 low energy modules
Document type
Data sheet
Document number
UBX-19033643
Revision and date
R03
27-Sep-2019
Disclosure restriction
Product status
Corresponding content status
Functional sample
Draft
For functional testing. Revised and supplementary data will be published later.
In development /
Prototype
Objective specification
Target values. Revised and supplementary data will be published later.
Engineering sample
Advance information
Data based on early testing. Revised and supplementary data will be published later.
Initial production
Early production information
Data from product verification. Revised and supplementary data may be published later.
Mass production /
End of life
Production information
Document contains the final product specification.
Product name
Type number
Firmware version
PCN reference
Product status
BMD-341
BMD-341-A-R-00
N/A
N/A
Initial production
u-blox or third parties may hold intellectual property rights in the products, names, logos and designs included in this
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permitted with the express written permission of u-blox.
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implied, is given, including but not limited to, with respect to the accuracy, correctness, reliability and fitness for a particular
purpose of the information. This document may be revised by u-blox at any time without notice. For the most recent
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Copyright © u-blox AG.
Document information
This document applies to the following products:
UBX-19033643 - R03 Document information Page 2 of 36
BMD-341 - Data sheet
Contents
Document information ................................................................................................................................ 2
Contents .......................................................................................................................................................... 3
1 Functional description ......................................................................................................................... 5
1.1 Features ........................................................................................................................................................ 5
1.2 Applications ................................................................................................................................................. 6
1.3 Block diagram .............................................................................................................................................. 6
1.4 Radio performance ..................................................................................................................................... 7
2 Pin definition ........................................................................................................................................... 9
2.1 Pin assignment ............................................................................................................................................ 9
2.2 Peripheral pins ...........................................................................................................................................11
2.3 BMD-300 series footprint compatibility and migration ....................................................................12
2.3.1 BMD-300/301/330/360 to BMD-341 pad differences ..............................................................13
2.3.2 BMD-300/301/330/360 to BMD-341 design migration ...........................................................13
2.4 BMD-341 fan-out example ......................................................................................................................14
3 Electrical specifications ................................................................................................................... 15
3.1 Absolute maximum ratings ....................................................................................................................15
3.2 Operating conditions ................................................................................................................................15
3.3 Power and DCDC configuration ..............................................................................................................15
3.3.1 USB power ..........................................................................................................................................16
3.3.2 Normal (LV) power mode examples ..............................................................................................16
3.3.3 High voltage (HV) power mode examples ....................................................................................17
3.4 General purpose I/O ..................................................................................................................................18
3.5 Module reset ..............................................................................................................................................18
3.6 Debug and programming .........................................................................................................................19
3.7 Clocks ..........................................................................................................................................................19
3.7.1 32.768 kHz crystal (LFXO) ..............................................................................................................19
3.7.2 32.768 kHz clock source comparison ...........................................................................................19
4 Firmware ................................................................................................................................................ 20
4.1 Factory image ............................................................................................................................................20
4.2 SoftDevices ................................................................................................................................................20
4.2.1 S140 ....................................................................................................................................................20
4.2.2 S340 ....................................................................................................................................................20
4.2.3 IEEE 802.15.4 (Thread and Zigbee) ..............................................................................................21
4.3 Bluetooth address .....................................................................................................................................21
5 Mechanical specifications ............................................................................................................... 22
5.1 Dimensions .................................................................................................................................................22
5.2 Recommended PCB land pads ...............................................................................................................22
5.3 Module marking .........................................................................................................................................23
6 RF design notes ................................................................................................................................... 24
6.1 Recommended RF layout and ground plane ........................................................................................24
UBX-19033643 - R03 Contents Page 3 of 36
BMD-341 - Data sheet
6.2 Mechanical enclosure ...............................................................................................................................24
6.3 Approved external antennas ..................................................................................................................24
7 BMD-341 evaluation development kit ......................................................................................... 25
8 Qualification and approvals............................................................................................................. 26
8.1 United States (FCC): ................................................................................................................................26
8.1.1 Labeling and user information requirements .............................................................................26
8.1.2 RF exposure .......................................................................................................................................26
8.2 Canada (ISED) ............................................................................................................................................27
8.2.1 Labeling and user information requirements .............................................................................27
8.2.2 RF exposure .......................................................................................................................................27
8.3 Europe (CE-RED) .......................................................................................................................................28
8.3.1 Labeling and user information requirements .............................................................................28
8.4 Australia / New Zealand (RCM) ..............................................................................................................28
8.5 Bluetooth qualification .............................................................................................................................28
9 Environmental...................................................................................................................................... 29
9.1 RoHS ............................................................................................................................................................29
9.2 REACH .........................................................................................................................................................29
9.3 California proposition 65 (P65) ..............................................................................................................29
10 Product handling ................................................................................................................................. 30
10.1 Packaging ...................................................................................................................................................30
10.2 Reel packaging ...........................................................................................................................................30
10.3 Carrier tape dimensions ..........................................................................................................................30
10.4 Moisture sensitivity level .........................................................................................................................30
10.6 Reflow soldering ........................................................................................................................................31
11 Labeling and ordering information ............................................................................................... 32
11.1 Batch Label .................................................................................................................................................32
11.2 Multipack label...........................................................................................................................................32
11.3 Ordering information ................................................................................................................................33
12 Support and other high-risk use warning .................................................................................. 34
Related documents ................................................................................................................................... 35
Revision history .......................................................................................................................................... 35
Contact .......................................................................................................................................................... 36
UBX-19033643 - R03 Contents Page 4 of 36
BMD-341 - Data sheet
1 Functional description
The BMD-341 is an advanced, highly flexible, ultra-low power multiprotocol SoM that enables
Bluetooth 5 (Bluetooth low energy) and IEEE 802.15.4 (Thread and Zigbee) connectivity for portable,
extremely low power embedded systems. With an ARM® Cortex™-M4F CPU, integrated 2.4 GHz
transceiver, and a U.FL connector for an external antenna, the BMD-341 provides a complete RF
solution allowing faster time to market with reduced development costs. Providing full use of the
Nordic Semiconductor nRF52840 capabilities and peripherals, the BMD-341 can power the most
demanding applications, all while simplifying designs and reducing BOM costs. The BMD-341 is an
ideal solution for designs that require the latest Bluetooth 5 features or 802.15.4 based networking
for Thread. Increased integration with built in USB and 5.5V compatible DC/DC supply reduces design
complexity and BOM cost, while expanding possible applications. BMD-341 designs are footprint
compatible with the BMD-300/301/330/360, providing low-cost flexibility for tiered product lineups.
1.1 Features
Based on the Nordic Semiconductor nRF52840 SoC
Bluetooth 5 2M low energy, Advertising Extensions, CSA #2, Coded PHY (Long Range)
Bluetooth mesh
IEEE 802.15.4 with Thread and Zigbee support
Complete RF solution with U.FL connector for an external antenna
Integrated DC-DC converter
No external components required
ARM® Cortex™-M4F 32-bit processor
ARM® TrustZone® Cryptocell 310 security
True random number generator
Serial Wire Debug (SWD)
Nordic Semiconductor SoftDevice ready
1 MB embedded flash memory
256 KB RAM
48 General Purpose I/O Pins
12-bit/200 KSPS ADC
One Full-Speed USB (12 Mbps)
Four SPI Master/Slave (8 Mbps)
Quad SPI with Execute in Place (XIP)
Low power comparator
Temperature sensor
Two 2-wire Master/Slave (I2C compatible)
I2S audio interface
Two UARTs (w/ CTS/RTS and DMA)
20 channel CPU independent Programmable Peripheral Interconnect (PPI)
Quadrature Demodulator (QDEC)
128-bit AES HW encryption
5 x 32 bit, 3 x 24 bit Real Timer Counters (RTC)
NFC-A tag interface for OOB pairing
Dimensions: 15.0 x 10.2 x 1.9 mm
UBX-19033643 - R03 Functional description Page 5 of 36
BMD-341 - Data sheet
1.2 Applications
Climate control
Lighting products
Safety and security
Home appliances
Access control
Internet of Things
Home Health Care
Advanced Remote Controls
Smart Energy Management
Low-Power Sensor Networks
Interactive Entertainment Devices
Environmental Monitoring
Hotel Automation
Office Automation
1.3 Block diagram
Figure 1: Block diagram of BMD-341
UBX-19033643 - R03 Functional description Page 6 of 36
BMD-341 - Data sheet
Detail
Description
Bluetooth
Bluetooth version
Bluetooth 5 Low Energy, Concurrent Central & Peripheral (S140)
Coded PHY (Long Range), 2 Mbps & 1 Mbps PHY, Advertising Extensions,
CSA #2, Bluetooth mesh
Security
AES-128
LE connections
Concurrent central, observer, peripheral, and broadcaster roles with up to
twenty concurrent connections along with one Observer and one
Broadcaster (S140)
IEEE 802.15.4
Thread stack
OpenThread, Thread 1.1 certified
Thread security
AES-128, ARM® Cryptocell accelerated
Zigbee stack
Zigbee 3.0 compliant
Radio
Frequency
2.360 GHz to 2.500 GHz
Modulations
GFSK at 1 Mbps and 2 Mbps, QPSK at 250 Kbps
Transmit power
+8 dBm maximum (at IC pin)
Receiver sensitivity
-96 dBm (BLE 1Mbps PHY)
Antenna
U.FL connector for an external antenna
Current consumption
TX only @ +8 dBm, 0 dBm @ 3V, DCDC enabled
14.8 mA, 4.8 mA
TX only @ +8 dBm, 0 dBm
32.7 mA, 10.6 mA
RX only @ 1 Mbps @ 3V, DCDC enabled
4.6 mA
RX only @ 1 Mbps
9.9 mA
CPU @ 64 MHz from flash, from RAM
6.3 mA, 5.2 mA
CPU @ 64 MHz from flash, from RAM @ 3V,
DCDC enabled
3.3 mA, 2.8 mA
System Off, On (Supply on VCC), no RAM
retention
0.4 µA, 0.97 µA
System Off, On (Supply on VCC), full 256 KB
RAM retention
1.86 µA, 2.35 µA
Dimensions
BMD-341
Length: 15.0 mm ± 0.3mm
Width: 10.2 mm ± 0.3mm
Height: 1.9 mm ± 0.1mm
Hardware
Interfaces
SPI Master/Slave x 4
Quad SPI x 1
UART x 2
Two-Wire Master/Slave (I2C) x 2
GPIO x 48
I2S x1
PWM x 12
PDM x 1
USB 2.0 x 1
Analog input x 8
Power supply
VCC: 1.7 V to 3.6 V, 1.75 V required to start DCDC
VCCH: 2.5 V to 5.5 V
VBUS: 4.35 V to 5.5 V (For USB operation)
1.4 Radio performance
UBX-19033643 - R03 Functional description Page 7 of 36
BMD-341 - Data sheet
Detail
Description
Temperature range
-40 °C to +85 °C
Certifications
USA (FCC)
Canada (ISED)
Europe (CE) (Pending)
Australia / New Zealand (RCM) (Pending)
Bluetooth
FCC part 15.247 modular certification
FCC ID: XPYBMD341
Innovation, Science and Economic Development Canada RSS-247 modular
certification IC: 8595A-BMD341
EN 60950-1: A2:2013 3.1 (a): Health and Safety of the User
EN 301 489-1 V2.1.1 & 3.1 (b): Electromagnetic Compatibility
EN 301 489-17 V3.1.1
EN 300 328 V2.1.1 3.2: Effective use of spectrum allocated
AS/NZS 4268:2017, Radio equipment and systems – Short range devices
BMD-341 RF-PHY Component (Tested) – DID: D040773; QDID: 95452
Export
BMD-341
ECCN: 5A992.C, Exception 742.15(b)(1)
HTS: 8473.30.1180
Nordic Semiconductor nRF52840
nRF52840 Product Specification
nRF5 Software Development Kit
UBX-19033643 - R03 Functional description Page 8 of 36
BMD-341 - Data sheet
No.
Name
I/O
Description
nRF52 pin
Remarks
1
GND
Power
Electrical Ground
GND
2
GND
Power
Electrical Ground
GND 3
GND
Power
Electrical Ground
GND 4
GND
Power
Electrical Ground
GND 5
GND
Power
Electrical Ground
GND 6
P0.25
I/O
GPIO
P0.25
7 P0.26
I/O
GPIO
P0.26
8 P0.27
I/O
GPIO
P0.27
9 P0.28
I/O
GPIO/AIN4
P0.28
Standard drive, low frequency I/O only (<10 kHz)
10
P0.29
I/O
GPIO/AIN5
P0.29
Standard drive, low frequency I/O only (<10 kHz)
11
P0.30
I/O
GPIO/AIN6
P0.30
Standard drive, low frequency I/O only (<10 kHz)
12
P0.31
I/O
GPIO/AIN7
P0.31
Standard drive, low frequency I/O only (<10 kHz)
13
P0.00
I/O
GPIO/XTAL1 (32.768 kHz)
P0.00
14
P0.01
I/O
GPIO/XTAL2 (32.768 KHz)
P0.01
15
P0.02
I/O
GPIO/AIN0
P0.02
Standard drive, low frequency I/O only (<10 kHz)
16
GND
Power
Electrical Ground
GND
17
VCC
Power
In/Out
LV Mode: 1.7 V to 3.6 V in
HV Mode: 1.8 V to 3.3 V
supply out1
VCC
An internal 4.7 µF bulk capacitor is included on
the module. However, it is good design practice to
add additional bulk capacitance as required for
your application, i.e. those with heavy GPIO usage
and/or current draw.
18
GND
Power
Electrical Ground
GND 19
P0.03
I/O
GPIO/AIN1
P0.03
Standard drive, low frequency I/O only (<10 kHz)
20
P0.04
I/O
GPIO/AIN2
P0.04
21
P0.05
I/O
GPIO/AIN3
P0.05
22
P0.06
I/O
GPIO
P0.06
23
P0.07
I/O
GPIO/TRACECLK
P0.07
2 Pin definition
2.1 Pin assignment
Figure 2: BMD-341 Pin assignment (Top view)
UBX-19033643 - R03 Pin definition Page 9 of 36
BMD-341 - Data sheet
No.
Name
I/O
Description
nRF52 pin
Remarks
24
P0.08
I/O
GPIO
P0.08
25
P0.09
I/O
GPIO/NFC1
P0.09
Standard drive, low frequency I/O only (<10 kHz)
26
P0.10
I/O
GPIO/NFC2
P0.10
Standard drive, low frequency I/O only (<10 kHz)
27
P0.11
I/O
GPIO/TRACEDATA[2]
P0.11
28
P0.12
I/O
GPIO/TRACEDATA[1]
P0.12
29
GND
Power
Electrical Ground
GND 30
GND
Power
Electrical Ground
GND 31
P0.13
I/O
GPIO
P0.13
32
P0.14
I/O
GPIO
P0.14
33
P0.15
I/O
GPIO
P0.15
34
P0.16
I/O
GPIO
P0.16
35
P0.17
I/O
GPIO
P0.17
36
P0.21
I/O
GPIO
P0.21
37
P0.19
I/O
GPIO
P0.19
38
P0.20
I/O
GPIO
P0.20
39
P0.18
I/O
GPIO/RESET_N
P0.18
40
P0.22
I/O
GPIO
P0.22
41
P0.23
I/O
GPIO
P0.23
42
P0.24
I/O
GPIO
P0.24
43
SWCLK
I
SWD Clock
SWCLK
44
SWDIO
I/O
SWD IO
SWDIO
45
GND
Power
Electrical Ground
GND 46
GND
Power
Electrical Ground
GND 47
GND
Power
Electrical Ground
GND 48
P1.05
I/O
GPIO
P1.05
Standard drive, low frequency I/O only (<10 kHz)
49
P1.06
I/O
GPIO
P1.06
Standard drive, low frequency I/O only (<10 kHz)
50
P1.07
I/O
GPIO
P1.07
Standard drive, low frequency I/O only (<10 kHz)
51
P1.08
I/O
GPIO
P1.08
52
P1.09
I/O
GPIO/TRACEDATA[3]
P1.09
53
P1.10
I/O
GPIO
P1.10
Standard drive, low frequency I/O only (<10 kHz)
54
P1.11
I/O
GPIO
P1.11
Standard drive, low frequency I/O only (<10 kHz)
55
GND
Power
Electrical Ground
GND
56
P1.00
I/O
GPIO/TRACEDATA[0]/SWO
P1.00
57
P1.01
I/O
GPIO
P1.01
Standard drive, low frequency I/O only (<10 kHz)
58
P1.02
I/O
GPIO
P1.02
Standard drive, low frequency I/O only (<10 kHz)
59
P1.03
I/O
GPIO
P1.03
Standard drive, low frequency I/O only (<10 kHz)
60
P1.04
I/O
GPIO
P1.04
Standard drive, low frequency I/O only (<10 kHz)
61
P1.12
I/O
GPIO
P1.12
Standard drive, low frequency I/O only (<10 kHz)
62
P1.13
I/O
GPIO
P1.13
Standard drive, low frequency I/O only (<10 kHz)
63
P1.14
I/O
GPIO
P1.14
Standard drive, low frequency I/O only (<10 kHz)
64
P1.15
I/O
GPIO
P1.15
Standard drive, low frequency I/O only (<10 kHz)
67
USB-D-
I/O
USB Data-
USB-D-
68
USB-D+
I/O
USB Data+
USB-D+
66
VBUS
Power
USB PHY supply: 4.35 V to
5.5 V in
VBUS
UBX-19033643 - R03 Pin definition Page 10 of 36
BMD-341 - Data sheet
No.
Name
I/O
Description
nRF52 pin
Remarks
Connect to USB Host device 5
V supply
65
VCCH
Power
LV Mode: Connect to VCC
HV Mode: 2.5 V to 5.5 V in
VCCH
An internal 4.7 µF bulk capacitor is included on
the module. However, it is good design practice to
add additional bulk capacitance as required for
your application, i.e. those with heavy GPIO usage
and/or current draw.
Peripheral
Signal
Pin Options
UART0, UART1,
I2C0, I2C1,
SPI0, SPI1, SPI2, SPI3,
I2S0, QSPI0, PDN0,
PWM0, PWM1, PWM2, PWM3
All
P0.00-P0.31, P1.00-P1.15
ADC, COMP, LPCOMP
All
P0.02-P0.05, P0.28-P0.31 (AIN0-AIN7)
NFC
NFC1
NFC2
P0.09
P0.10
Reset
RESET_N
P0.18
Trace
TRACECLK
SWO/TRACEDATA[0]
TRACEDATA[1]
TRACEDATA[2]
TRACEDATA[3]
P0.07
P1.00
P0.12
P0.11
P1.09
SWD
SWD Clock
SWD IO
SWCLK
SWDIO
32.768 kHz Crystal
XTAL1
XTAL2
P0.00
P0.01
USB
USB Data +
USB Data -
USB-D+
USB-D-
Peripheral ID
Base Address
Shared Peripherals
3
0x40003000
SPI0
I2C0 4 0x40004000
SPI1
I2C1
Table 1: BMD-341 pin-out
1: In HV mode, VCC acts as a regulated supply that can power other external devices. The voltage output of VCC can be
configured in software but is limited to no more than VCCH-0.3 V. In System Off mode, VCC can supply no more than 1mA.
2.2 Peripheral pins
The BMD-341 features a pin multiplexing system that allows most internal peripherals, such as UART
and SPI, to be used on any GPIO pin. This freedom in pin choice enables better optimization of designs
and PCB layout. Note that only one peripheral signal can be multiplexed to a GPIO pin at a time. Some
functions are restricted to certain pins due to additional internal circuitry required by the interface.
These include: Trace signals, analog inputs, XTAL signals, USB signals, SWD interface, and reset. See
Table 2 for details:
Table 2: Peripheral pin options
☞ Some peripherals on the BMD-341 share the same memory location for their registers. This means
that only one of these peripherals can be used at a time. It is possible to switch between
peripherals sharing a register location by clearing and reinitializing the associated configuration
registers. See the Nordic Semiconductor nRF52840 Product Specification for details.
Table 3: Peripherals with shared registers
UBX-19033643 - R03 Pin definition Page 11 of 36
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