alone Bluetooth® low energy and IEEE
802.15.4 module. The OEMs can embed their own application on top of the integrated Bluetooth low
BMD-340
Stand-alone Bluetooth 5 low energy and IEEE 802.15.4
module
Data sheet
Abstract
This technical data sheet describes the BMD-340 stand-
energy stack using Nordic Semiconductor SDK integrated development environment (IDE).
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UBX-19033353 - R11
BMD-340 - Data sheet
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Document information
Title BMD-340
Subtitle Stand-alone Bluetooth 5 low energy and IEEE 802.15.4 module
Document type Data sheet
Document number UBX-19033353
Revision and date R11 20-May-2020
Disclosure restriction
Product status Corresponding content status
Functional sample Draft For functional testing. Revised and supplementary data will be published later.
In development /
Prototype
Engineering sample Advance information Data based on early testing. Revised and supplementary data will be published later.
Initial production Early production information Data from product verification. Revised and supplementary data may be published later.
Mass production /
End of life
Objective specification Target values. Revised and supplementary data will be published later.
Production information Document contains the final product specification.
This document applies to the following products:
Product name Type number Firmware version PCN reference Product status
BMD-340 BMD-340-A-R-00 N/A UBX-19039722 Mass production
BMD-340 BMD-340-A-R-01 N/A UBX-19039722 Mass production
BMD-340 BMD-340-A-R-10 N/A UBX-20009068 Mass production
UBX-19033353 - R11 Document information Page 2 of 41
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BMD-340 - Data sheet
Contents
Document information ................................................................................................................................ 2
Contents .......................................................................................................................................................... 3
1 Functional description ......................................................................................................................... 5
1.1 Features ........................................................................................................................................................ 5
1.2 Applications ................................................................................................................................................. 6
1.3 Block diagram .............................................................................................................................................. 6
1.4 Product specifications ............................................................................................................................... 7
2 Pin definition ........................................................................................................................................... 9
2.1 Pin assignment ............................................................................................................................................ 9
2.2 Peripheral pins ...........................................................................................................................................11
2.3 BMD-300 series footprint compatibility and migration ....................................................................12
2.3.1 BMD-300/301/330/360 to BMD-340 pad differences ..............................................................13
2.3.2 BMD-300/301/330 to BMD-340 design migration ....................................................................13
2.4 BMD-340 fan-out example ......................................................................................................................14
3 Electrical specifications ................................................................................................................... 15
3.1 Absolute maximum ratings ....................................................................................................................15
3.2 Operating conditions ................................................................................................................................15
3.3 Power and DCDC configuration ..............................................................................................................16
3.3.1 USB power ..........................................................................................................................................16
3.3.2 Normal (LV) power mode examples ..............................................................................................17
3.3.3 High voltage (HV) power mode examples ....................................................................................18
3.4 General purpose I/O ..................................................................................................................................19
3.5 Module reset ..............................................................................................................................................19
3.6 Debug and programming .........................................................................................................................19
3.7 Clocks ..........................................................................................................................................................20
3.7.1 32.768 kHz crystal (LFXO) ..............................................................................................................20
3.7.2 32.768 kHz clock source comparison ...........................................................................................20
4 Firmware ................................................................................................................................................ 21
4.1 Factory image ............................................................................................................................................21
4.2 SoftDevices ................................................................................................................................................21
4.2.1 S140 ....................................................................................................................................................21
4.2.2 S340 ....................................................................................................................................................21
4.2.3 IEEE 802.15.4 (Thread and Zigbee) ..............................................................................................22
4.3 Bluetooth device address ........................................................................................................................22
5 Mechanical specifications ............................................................................................................... 23
5.1 Dimensions .................................................................................................................................................23
5.2 Recommended PCB land pads ...............................................................................................................23
5.3 Module marking .........................................................................................................................................24
5.3.1 Module marking for type number BMD-340-A-R-00 .................................................................24
5.3.2 Module marking for type number BMD-340-A-R-01 .................................................................24
UBX-19033353 - R11 Contents Page 3 of 41
BMD-340 - Data sheet
5.3.3 Module marking for type number BMD-340-A-R-10 .................................................................25
6 RF Design notes .................................................................................................................................. 26
6.1 Recommended RF layout and ground plane ........................................................................................26
6.2 Mechanical enclosure ...............................................................................................................................26
6.3 Antenna patterns ......................................................................................................................................27
6.3.1 X-Y plane .............................................................................................................................................27
6.3.2 X-Z plane .............................................................................................................................................28
6.3.3 Y-Z plane.............................................................................................................................................28
7 BMD-340 evaluation development kit ......................................................................................... 29
8 Qualification and approvals............................................................................................................. 30
8.1 United States (FCC) .................................................................................................................................30
8.1.1 Labeling and user information requirements .............................................................................30
8.1.2 RF exposure .......................................................................................................................................30
8.2 Canada (ISED) ............................................................................................................................................31
8.2.1 Labeling and user information requirements .............................................................................31
8.2.2 RF exposure .......................................................................................................................................31
8.3 European Union regulatory compliance ...............................................................................................32
8.3.1 Radio Equipment Directive (RED) 2014/53/EU ..........................................................................32
8.4 Australia / New Zealand (RCM) ..............................................................................................................32
8.5 Japan (MIC) ................................................................................................................................................32
8.6 Bluetooth qualification .............................................................................................................................33
9 Environmental...................................................................................................................................... 34
9.1 RoHS ............................................................................................................................................................34
9.2 REACH .........................................................................................................................................................34
9.3 California proposition 65 (P65) ..............................................................................................................34
10 Product handling ................................................................................................................................. 35
10.1 Packaging ...................................................................................................................................................35
10.1.1 Reel packaging for type number BMD-340-A-R-00 and BMD-340-A-R-01 ..........................35
10.1.2 Reel packaging for type number BMD-340-A-R-10 ...................................................................35
10.1.3 Carrier tape dimensions for type number BMD-340-A-R-00 and BMD-340-A-R-01..........36
10.1.4 Carrier tape dimensions for type number BMD-340-A-R-10 ..................................................36
10.2 Moisture sensitivity level .........................................................................................................................37
10.3 Reflow soldering ........................................................................................................................................37
10.4 ESD precautions ........................................................................................................................................37
11 Ordering information ......................................................................................................................... 38
12 Life support and other high-risk use warning ........................................................................... 39
Related Documents ................................................................................................................................... 40
Revision history .......................................................................................................................................... 40
Contact .......................................................................................................................................................... 41
UBX-19033353 - R11 Contents Page 4 of 41
BMD-340 - Data sheet
1 Functional description
The BMD-340 is an advanced, highly flexible, ultra-low power multiprotocol System on Module (SoM)
that enables Bluetooth 5 low energy and IEEE 802.15.4 (Thread and Zigbee) connectivity for portable,
and extremely low power embedded systems. With an Arm® Cortex®-M4 with FPU processor,
integrated 2.4G Hz transceiver, and an integrated antenna, the BMD-340 provides a complete RF
solution allowing faster time to market with reduced development costs. Providing full use of the
Nordic Semiconductor nRF52840’s capabilities and peripherals, the BMD-340 can power the most
demanding applications, all while simplifying designs and reducing BOM costs. The BMD-340 is an
ideal solution for designs that require Bluetooth 5 features or 802.15.4 based networking for Thread
and Zigbee. Increased integration with built in USB and 5.5 V compatible DC/DC supply reduces design
complexity and BOM cost, while expanding possible applications. BMD-340 designs are footprint
compatible with the BMD-300/301/330/360, providing low-cost flexibility for tiered product lineups.
1.1 Features
• Based on the Nordic Semiconductor nRF52840 SoC
• Bluetooth 5 PHYs: LE 1M, LE 2M, and LE Coded (long range)
• Bluetooth 5 features: Advertising Extensions, Channel Selection Algorithm #2
• Bluetooth mesh
• IEEE 802.15.4 with Thread and Zigbee support
• Complete RF solution with an integrated PCB antenna
• Integrated DC-DC converter
• No external components required
• Arm® Cortex®-M4 with FPU 32-bit processor
• Arm® TrustZone® Cryptocell 310 security
• True random number generator
• Serial Wire Debug (SWD)
• Nordic Semiconductor SoftDevice ready
• 1 MB embedded flash memory
• 256 KB RAM
• 48 General Purpose I/O Pins
• 12-bit/200 KSPS ADC
• One Full-Speed USB (12 Mbps)
• Four SPI Master/Slave (8 Mbps)
• Quad SPI with Execute in Place (XIP)
• PWM 4 blocks x 4-channels each
• General Purpose and Low power comparators
• Temperature sensor
• Two 2-wire Master/Slave (I2C compatible)
• I2S audio interface
• Two UARTs (w/ CTS/RTS and DMA)
• 20-channel CPU independent Programmable Peripheral Interconnect (PPI)
• Quadrature Demodulator (QDEC)
• 5 x 32 bit timer/counters
• 3 x 24 bit Real Timer Counters (RTC)
• NFC-A tag interface for OOB pairing
• Dimensions: 15.0 x 10.2 x 1.9 mm
UBX-19033353 - R11 Functional description Page 5 of 41
BMD-340 - Data sheet
1.2 Applications
• Climate control
• Lighting products
• Safety and security
• Home appliances
• Access control
• Internet of Things
• Home Health Care
• Advanced Remote Controls
• Smart Energy Management
• Low-Power Sensor Networks
• Interactive Entertainment Devices
• Environmental Monitoring
• Hotel Automation
• Office Automation
1.3 Block diagram
Figure 1: Block diagram of BMD-340
UBX-19033353 - R11 Functional description Page 6 of 41
BMD-340 - Data sheet
1.4 Product specifications
Detail Description
Bluetooth
Bluetooth version
Security AES-128, Arm® Cryptocell accelerated
LE connections
IEEE 802.15.4
Thread stack OpenThread, Thread 1.1
Thread security AES-128, Arm® Cryptocell accelerated
Zigbee stack Zigbee Compliant Platform
Radio
Frequency 2.360 GHz to 2.500 GHz
Modulations GFSK at 1 Mbps and 2 Mbps, QPSK at 250 Kbps
Transmit power +8 dBm maximum
Receiver sensitivity -96 dBm (Bluetooth low energy mode)
Antenna Integrated PCB (-1dBi max gain)
Current consumption
TX only @ +8 dBm, 0 dBm @ 3V, DCDC enabled 14.8 mA, 4.8 mA
TX only @ +8 dBm, 0 dBm 32.7 mA, 10.6 mA
RX only @ 1 Mbps @ 3V, DCDC enabled 4.6 mA
RX only @ 1 Mbps 9.9 mA
CPU @ 64 MHz from flash, from RAM 6.3 mA, 5.2 mA
CPU @ 64 MHz from flash, from RAM @ 3V, DCDC enabled 3.3 mA, 2.8 mA
System Off, On (Supply on VCC), no RAM retention 0.4 µA, 0.97 µA
System Off, On (Supply on VCC), full 256 KB RAM
retention
Dimensions
BMD-340 Length: 15.0 mm ± 0.3 mm
Width: 10.2 mm ± 0.3 mm
Height: 1.9 mm ± 0.1 mm
Hardware
Interfaces SPI Master/Slave x 4
Power supply VCC: 1.7 V to 3.6 V, 1.75 V required to start DCDC
Temperature range -40 °C to +85 °C
Bluetooth 5 Low Energy, Concurrent Central & Peripheral
(S140), LE Coded PHY (Long Range), LE 2M PHY, LE 1M PHY,
Advertising Extensions,
CSA #2, Bluetooth mesh
Concurrent central, observer, peripheral, and broadcaster roles
with up to twenty concurrent connections along with one
Observer and one Broadcaster (S140)
1.86 µA, 2.35 µA
Quad SPI x 1
UART x 2
Two-Wire Master/Slave (I2C) x 2
GPIO x 48
I2S x1
PWM x 16 (4 blocks x 4-channels each)
PDM x 1
USB 2.0 x 1
Analog input x 8
VCCH: 2.5 V to 5.5 V
VBUS: 4.35 V to 5.5 V (For USB operation)
UBX-19033353 - R11 Functional description Page 7 of 41
BMD-340 - Data sheet
Detail Description
Certifications
USA (FCC) FCC part 15.247 modular certification FCC ID: 2AA9B10
Canada (ISED)
Europe (CE) EN 60950-1: A2:2013 3.1 (a): Health and Safety of the User
Australia / New Zealand (RCM)
Japan (MIC)
Bluetooth
Radio chip
Nordic semiconductor nRF52840
Table 1: Product specifications
Innovation, Science and Economic Development Canada RSS247 modular certification IC: 12208A-10
EN 301 489-1 V2.1.1 & 3.1 (b): Electromagnetic Compatibility
EN 301 489-17 V3.1.1
EN 300 328 V2.1.1 3.2: Effective use of spectrum allocated
AS/NZS 4268:2017, Radio equipment and systems – Short
range devices
Ministry of Internal Affairs and Communications (MIC) of Japan
pursuant to the Radio Act of Japan – MIC: 204-B00161
BMD-340 RF-PHY Component (Tested) – DID: D040773; QDID:
95452
Additional details: nRF52840 Product Specification
Software Development Kit
UBX-19033353 - R11 Functional description Page 8 of 41
BMD-340 - Data sheet
2 Pin definition
2.1 Pin assignment
Figure 2: BMD-340 Pin assignment (Top view)
No. Name I/O Description nRF52 pin Remarks
1 GND Power Electrical Ground
2 GND Power Electrical Ground
3 GND Power Electrical Ground
4 GND Power Electrical Ground
5 GND Power Electrical Ground
6 P0.25 I/O GPIO P0.25
7 P0.26 I/O GPIO P0.26
8 P0.27 I/O GPIO P0.27
9 P0.28 I/O GPIO/AIN4 P0.28 Standard drive, low frequency I/O only (<10 kHz)
10 P0.29 I/O GPIO/AIN5 P0.29 Standard drive, low frequency I/O only (<10 kHz)
11 P0.30 I/O GPIO/AIN6 P0.30 Standard drive, low frequency I/O only (<10 kHz)
12 P0.31 I/O GPIO/AIN7 P0.31 Standard drive, low frequency I/O only (<10 kHz)
13 P0.00 I/O GPIO/XTAL1 (32.768 kHz) P0.00
14 P0.01 I/O GPIO/XTAL2 (32.768 kHz) P0.01
15 P0.02 I/O GPIO/AIN0 P0.02 Standard drive, low frequency I/O only (<10 kHz)
16 GND Power Electrical Ground
17 VCC
18 GND Power Electrical Ground
19 P0.03 I/O GPIO/AIN1 P0.03 Standard drive, low frequency I/O only (<10 kHz)
20 P0.04 I/O GPIO/AIN2 P0.04
21 P0.05 I/O GPIO/AIN3 P0.05
22 P0.06 I/O GPIO P0.06
23 P0.07 I/O GPIO/TRACECLK P0.07
24 P0.08 I/O GPIO P0.08
Power
I/O
LV Mode: 1.7 V to 3.6 V in
HV Mode: 1.8 V to 3.3 V supply out
VDD
1
An internal 4.7 µF bulk capacitor is included on
the module. However, it is good design practice
to add additional bulk capacitance as required
for your application, i.e. those with heavy GPIO
usage and/or current draw.
1
In HV mode, VCC acts as a regulated supply that can power other external devices. The voltage output of VCC can be
configured in software but is limited to no more than VCCH-0.3 V. In System Off mode, VCC can supply no more than 1mA.
UBX-19033353 - R11 Pin definition Page 9 of 41
BMD-340 - Data sheet
No. Name I/O Description nRF52 pin Remarks
25 P0.09 I/O GPIO/NFC1 P0.09 Standard drive, low frequency I/O only (<10 kHz)
26 P0.10 I/O GPIO/NFC2 P0.10 Standard drive, low frequency I/O only (<10 kHz)
27 P0.11 I/O GPIO/TRACEDATA[2] P0.11
28 P0.12 I/O GPIO/TRACEDATA[1] P0.12
29 GND Power Electrical Ground
30 GND Power Electrical Ground
31 P0.13 I/O GPIO P0.13
32 P0.14 I/O GPIO P0.14
33 P0.15 I/O GPIO P0.15
34 P0.16 I/O GPIO P0.16
35 P0.17 I/O GPIO P0.17
36 P0.21 I/O GPIO P0.21
37 P0.19 I/O GPIO P0.19
38 P0.20 I/O GPIO P0.20
39 P0.18 I/O GPIO/RESET P0.18
40 P0.22 I/O GPIO P0.22
41 P0.23 I/O GPIO P0.23
42 P0.24 I/O GPIO P0.24
43 SWCLK I SWD Clock SWCLK
44 SWDIO I/O SWD IO SWDIO
45 GND Power Electrical Ground
46 GND Power Electrical Ground
47 GND Power Electrical Ground
48 P1.05 I/O GPIO P1.05 Standard drive, low frequency I/O only (<10 kHz)
49 P1.06 I/O GPIO P1.06 Standard drive, low frequency I/O only (<10 kHz)
50 P1.07 I/O GPIO P1.07 Standard drive, low frequency I/O only (<10 kHz)
51 P1.08 I/O GPIO P1.08
52 P1.09 I/O GPIO/TRACEDATA[3] P1.09
53 P1.10 I/O GPIO P1.10 Standard drive, low frequency I/O only (<10 kHz)
54 P1.11 I/O GPIO P1.11 Standard drive, low frequency I/O only (<10 kHz)
55 GND Power Electrical Ground
56 P1.00 I/O GPIO/TRACEDATA[0]/SWO P1.00
57 P1.01 I/O GPIO P1.01 Standard drive, low frequency I/O only (<10 kHz)
58 P1.02 I/O GPIO P1.02 Standard drive, low frequency I/O only (<10 kHz)
59 P1.03 I/O GPIO P1.03 Standard drive, low frequency I/O only (<10 kHz)
60 P1.04 I/O GPIO P1.04 Standard drive, low frequency I/O only (<10 kHz)
61 P1.12 I/O GPIO P1.12 Standard drive, low frequency I/O only (<10 kHz)
62 P1.13 I/O GPIO P1.13 Standard drive, low frequency I/O only (<10 kHz)
63 P1.14 I/O GPIO P1.14 Standard drive, low frequency I/O only (<10 kHz)
64 P1.15 I/O GPIO P1.15 Standard drive, low frequency I/O only (<10 kHz)
65 VCCH Power LV Mode: Connect to VCC
HV Mode: 2.5 V to 5.5 V in
VCCH
An internal 4.7 µF bulk capacitor is included on
the module. However, it is good design practice
to add additional bulk capacitance as required
for your application, i.e. those with heavy GPIO
usage and/or current draw.
UBX-19033353 - R11 Pin definition Page 10 of 41
BMD-340 - Data sheet
No. Name I/O Description nRF52 pin Remarks
66 VBUS Power
67 USB-D- I/O USB Data- USB-D-
68 USB-D+ I/O USB Data+ USB-D+
Table 2: BMD-340 pin-out
USB PHY supply: 4.35 V to 5.5 V in
Connect to USB Host device
5 V supply
VBUS Connect to USB Host device 5 V supply
2.2 Peripheral pins
The BMD-340 features a pin multiplexing system that allows most internal peripherals, such as UART
and SPI, to be used on any GPIO pin. This freedom in pin choice enables better optimization of designs
and PCB layout.
☞ Only one peripheral signal can be multiplexed to a GPIO pin at a time. Some functions are restricted
to certain pins due to additional internal circuitry required by the interface. These include: Trace
signals, analog inputs, XTAL signals, USB signals, SWD interface, and reset. See Table 3.
Peripheral Signal Pin Options
UART0, UART1,
I2C0, I2C1,
SPI0, SPI1, SPI2, SPI3,
I2S0, QSPI0, PDM0,
PWM0, PWM1, PWM2, PWM3
ADC, COMP, LPCOMP All P0.02-P0.05, P0.28-P0.31 (AIN0-AIN7)
NFC NFC1
Reset RESET P0.18
Trace TRACECLK
SWD SWD Clock
32.768 kHz Crystal XTAL1
USB USB Data +
Table 3: Peripheral pin options
All P0.00-P0.31, P1.00-P1.15
P0.09
NFC2
SWO/TRACEDATA[0]
TRACEDATA[1]
TRACEDATA[2]
TRACEDATA[3]
SWD IO
XTAL2
USB Data -
P0.10
P0.07
P1.00
P0.12
P0.11
P1.09
SWCLK
SWDIO
P0.00
P0.01
USB-D+
USB-D-
☞ Some peripherals on the BMD-340 share the same memory location for their registers. This means
that only one of these peripherals can be used at a time. It is possible to switch between
peripherals that share the same register location by clearing and reinitializing the associated
configuration registers. See Nordic Semiconductor nRF52840 Product Specification for details.
Peripheral ID Base Address Shared Peripherals
3 0x40003000 SPI0 I2C0
4 0x40004000 SPI1 I2C1
Table 4: Peripherals with shared registers
UBX-19033353 - R11 Pin definition Page 11 of 41
BMD-340 - Data sheet
2.3 BMD-300 series footprint compatibility and migration
Figure 3: BMD-340 and BMD-300/301/330 footprint comparison
The BMD-340 footprint has been designed to allow for backwards compatibility with the BMD-300,
BMD-301, BMD-330, and BMD-360 modules with pins 1 through 47 of the BMD-340 directly mapping
to the same pin numbers on the BMD-300/301/330/360. This allows BMD-300, BMD-301, BMD-330
and BMD-360 modules to be placed directly onto the BMD-340 footprint for easy migration and
enabling tiered product design.
Generally, all pin names and functions remain the same, except for some differences noted below.
Pins 48 through 68 of the BMD-340 footprint are new pads used for new features that are not present
on the BMD-300/301/330/360 modules, such as USB interface and additional GPIO and power
connections.
Figure 4: BMD-300 Module soldered to BMD-340 footprint
UBX-19033353 - R11 Pin definition Page 12 of 41
BMD-340 - Data sheet
2.3.1 BMD-300/301/330/360 to BMD-340 pad differences
Due to changes in the nRF52840 SoC used by the BMD-340, not all functions (such as SWO/TRACE
signals) are found on the same pins as on the BMD-300/301/330/360. Particularly of note is the reset
pin function which on the BMD-340 is now available on P0.18 instead of P0.21 as on the
BMD-300/301/330/360. To maintain pin for pin compatibility of the reset signal, P0.18 and P0.21
have swapped pad locations on the BMD-340 footprint. These differences are detailed in Table 5
below:
Pin BMD-300/301
Name
39 P0.21 GPIO/RESET P0.18 GPIO/RESET
38 P0.20 GPIO/TRACECLK P0.20 GPIO
36 P0.18 GPIO/TRACEDATA[0]/SWO P0.21 GPIO
34 P0.16 GPIO/TRACEDATA[1] P0.16 GPIO
33 P0.15 GPIO/TRACEDATA[2] P0.15 GPIO
32 P0.14 GPIO/TRACEDATA[3] P0.14 GPIO
23 P0.07 GPIO P0.07 GPIO/TRACECLK
56 N/A N/A P1.00 GPIO/TRACEDATA[0]/SWO
28 P0.12 GPIO P0.12 GPIO/TRACEDATA[1]
27 P0.11 GPIO P0.11 GPIO/TRACEDATA[2]
52 N/A N/A P1.09 GPIO/TRACEDATA[3]
Table 5: BMD-300/301/330 to BMD-340 pad differences
BMD-300/301
Function
BMD-340
Name
BMD-340
Function
2.3.2 BMD-300/301/330 to BMD-340 design migration
Existing designs incorporating the BMD-300, BMD-301, BMD-330 or BMD-360 module can be
migrated over to the BMD-340 with the addition of a single footprint pad for VCCH (pin 65). This
migration option is only suitable for applications that do not require the new USB interface, additional
GPIO, or higher supply voltage functionality. The VCCH pad must be present and electrically
connected to the same supply as VCC for the module to operate correctly. Vias underneath the BMD340 should be tented to avoid shorts to unused module pads. Firmware written for the BMD300/301/330 can generally be ported to the BMD-340 with minimal effort. See the Nordic
Semiconductor SDK documentation for details.
New Pad VCCH:
Connect to VCC
Figure 5: BMD-300 to BMD-340 Migration Example
UBX-19033353 - R11 Pin definition Page 13 of 41
BMD-340 - Data sheet
Top Layer
Bottom Layer
Figure
Using the BMD-340 minimal footprint, with only the additional VCCH pad added, allows BMD-300
designs to gain the following BMD-340 features with typically minor layout re-work:
• Bluetooth 5 long range modes
• IEEE 802.15.4 (Thread and Zigbee) connectivity
• Doubled Flash memory (1MB vs. 512 KB)
• Quadrupled RAM (256 KB vs. 64 KB)
• Arm® TrustZone® Cryptocell 310 security co-processor
To take advantage of new hardware features, such as the additional UART and Quad SPI interface,
the full BMD-340 footprint should be used. Designs that require the 5V DCDC converter, trace
interface, USB interface, or the additional GPIO (P1.00-P1.15) must use the full BMD-340 footprint.
☞ Since the BMD-300/301/330/360 can be soldered to the full BMD-340 footprint, it is highly
recommended that all new BMD-300 and BMD-340 projects use the full BMD-340 footprint. When
migrating designs, the full BMD-340 footprint should be used whenever possible as it is better
suited for use with mass production SMT processing.
2.4 BMD-340 fan-out example
The following figure is a BMD-340 fan-out example on a simple 2-layer PCB. This example is powered
via VCCH from a USB connection. See section 3.3 for details on power and DCDC operation.
6: BMD-340 two-layer fan-out example
UBX-19033353 - R11 Pin definition Page 14 of 41
BMD-340 - Data sheet
3 Electrical specifications
⚠ Stressing the device above one or more of the ratings listed in the Absolute maximum rating
section may cause permanent damage. These are stress ratings only. Operating the module at
these or at any conditions other than those specified in the Operating conditions section of this
document should be avoided. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
☞ Operating condition ranges define those limits within which the functionality of the device is
guaranteed. Where application information is given, it is advisory only and does not form part of
the specification.
3.1 Absolute maximum ratings
Symbol Description Min Max Unit
V
Voltage on VCC supply pin −0.3 3.9 V
CC_MAX
V
V
V
V
TS Storage Temperature Range −40 125 °C
Table 6: Absolute maximum ratings
Voltage on VCCH supply pin −0.3 5.8 V
CCH_MAX
Voltage on VBUS supply pin −0.3 5.8 V
BUS_MAX
Voltage on GPIO pins (VCC > 3.6V) −0.3 3.9 V
IO_MAX
Voltage on GPIO pins (VCC ≤ 3.6V) −0.3 VCC+0.3 V V
IO_MAX
⚠ The product is not protected against overvoltage or reversed voltages. If necessary, voltage spikes
exceeding the power supply voltage specification, given in table above, must be limited to values
within the specified boundaries by using appropriate protection devices.
3.2 Operating conditions
☞ Unless otherwise specified, all operating condition specifications are at an ambient temperature
of 25 °C and a supply voltage of 3.3 V.
⚠ Operation beyond the specified operating conditions is not recommended and extended exposure
beyond them may affect device reliability.
Symbol Parameter Min Typ. Max Unit
V
VCC operating supply voltage in 1.7 3.0 3.6 V
CC_IN
V
V
V
T
T
TA Operating Ambient Temperature Range −40 25 85 °C
Table 7: Operating conditions
VCC DCDC starting voltage 1.75 - - V
CC_START
VCCH operating supply voltage in 2.5 5.0 5.5 V
CCH_HV
VBUS operating supply voltage in 4.35 5.0 5.5 V
BUS_IN
VCC Supply rise time (0 V to 1.7 V) - - 60 ms
R_VCC
VCCH Supply rise time (0 V to 3.7 V)2 - - 1 ms
R_VCCH
2
Applies when the module is configured to use HV mode. When using LV mode T
nRF52840 Rev 1 errata [202] for details on T
UBX-19033353 - R11 Electrical specifications Page 15 of 41
requirement.
R_VCCH
applies. See Nordic Semiconductor
R_VCC
BMD-340 - Data sheet
3.3 Power and DCDC configuration
The BMD-340 has two internal regulator stages that each contains an LDO and DCDC regulator. The
first regulator, REG0, is fed by the VCCH pin and can accept a source voltage of 2.5 V to 5.5 V. The
output of REG0 is connected to the VCC pin and the input of the second regulator stage REG1. REG1
supplies power to the module core and can accept an input source voltage of 1.7 V to 3.6 V. Depending
on how the VCC and VCCH pins are connected, the module will operate in one of two modes:
Normal/Low Voltage (LV) or High Voltage (HV). The voltage present on the VCC pin is always the GPIO
high logic level voltage, regardless of power mode.
To enter LV Mode, the same source voltage is applied to both the VCC and VCCH pins causing REG0
to automatically shut down leaving only the REG1 stage active. To enter HV, the source voltage is only
applied to VCCH causing the VCC pin to become an output source supplied by REG0.
Mode Pin Name Connection
Normal (LV) 17
65
High Voltage (HV) 17
65
Table 8: Power mode pin connections
VCC
VCCH
VCC
VCCH
1.7 V to 3.6 V source in
Same source as VCC
1.8 V to 3.3 V supply out
2.5 V to 5.5 V source in
⚠ Important: In both LV and HV mode, the GPIO logic level voltage is determined by the VCC pin. In
HV mode, all external devices that are connected to the BMD-340’s GPIO must either be powered
by the module (from VCC) or use level translation.
REG0 can supply a maximum current of 25mA for the module and external circuits in System On Mode
and 1 mA in System Off Mode. External circuits powered from VCC in HV mode should be limited to
no more than 5mA to ensure stability at all radio transmit power levels.
☞ Important Note regarding REG0: Type number BMD-340-A-R-01 and newer use revision 2 of the
Nordic Semiconductor nRF52840 silicon, while BMD-340-A-R-00 and engineering samples use
revision 1. Revision 2 solves Nordic Semiconductor nRF52840 errata 197 and 202, while revision
1 is affected by those errata, affecting the REG0 regulator.
☞ For BMD-340-A-R-00 (nRF52840 silicon rev 1) the following thus applies: The REG0 DC-DC
converter mode cannot be used reliably. The LDO mode of REG0 can be used in High Voltage mode
but when applying power, the input voltage must have a rise time of 1ms or less. Due to the rise
time constraint and higher current consumption of LDO mode compared to DCDC, High Voltage
mode should be considered non-functional for most applications and should not be used.
BMD-340 type number nRF52840 Silicon Version
BMD-340-A-R-00 Rev 1
BMD-340-A-R-01 and newer Rev 2 or newer
Table 9: BMD-340 type number and silicon version
3.3.1 USB power
The USB interface on the BMD-340 can be used when the module is in either Normal (LV) or High
Voltage (HV) mode. The BMD-340 USB PHY is powered by a dedicated, internal LDO regulator that is
fed by the VBUS pin (66). This means that applying power to only the VBUS pin will not power the
rest of the module. In order for the USB PHY to operate, VBUS must be externally powered.
UBX-19033353 - R11 Electrical specifications Page 16 of 41
BMD-340 - Data sheet
3.3.2 Normal (LV) power mode examples
Figure 7: LV Mode w/ Coin Cell Example
Figure 8: LV Mode w/ USB and external regulator
UBX-19033353 - R11 Electrical specifications Page 17 of 41
BMD-340 - Data sheet
3.3.3 High voltage (HV) power mode examples
Figure 9: USB-powered HV mode example
Figure 10: LiPo-powered HV example with USB charger
⚠ Important: The LiPo circuit above is meant to be a generic example of how the BMD-341’s power
modes can be used. Great care must be taken when integrating Lithium-Ion batteries into a
design. Protection circuits suitable for the type of battery used and the application must always
be implemented.
UBX-19033353 - R11 Electrical specifications Page 18 of 41
BMD-340 - Data sheet
3.4 General purpose I/O
The general purpose I/O is organized as two ports enabling access and control of the 48 available GPIO
pins. The first port allows access of P0.00 to P0.31, similar to the one port available on the
BMD-300/301. The second port, new to the BMD-341, allows access to P1.00 to P1.15. Each GPIO can
be accessed individually with the following user configurable features:
• Input/output direction
• Output drive strength
• Internal pull-up and pull-down resistors
• Wake-up from high- or low-level triggers on all pins
• Trigger interrupt on all pins
• All pins can be used by the PPI task/event system; the maximum number of pins that can be
interfaced through the PPI at the same time is limited by the number of GPIOTE channels
• All pins can be individually configured to carry serial interface or quadrature demodulator signals
Symbol Parameter Min. Typ. Max. Unit
VIH Input High Voltage 0.7 x VCC - VCC V
VIL Input Low Voltage GND - 0.3 x VCC V
VOH Output High Voltage VCC − 0.4 - VCC V
VOL Output Low Voltage GND - GND + 0.4 V
RPU Pull-up Resistance 11 13 16 kΩ
RPD Pull-down Resistance 11 13 16 kΩ
Table 10: GPIO electrical specifications
3.5 Module reset
GPIO pin P0.18 may be used for a hardware reset. In order to utilize P0.18 as a hardware reset, the
UICR registers PSELRESET[0] and PSELRESET[1] must be set alike, to the value of 0x7FFFFFD2.
When P0.18 is programmed as RESET, the internal pull-up is automatically enabled. Nordic
Semiconductor example applications and development kits program P0.18 as RESET_N.
3.6 Debug and programming
The BMD-340 series supports the two pin Serial Wire Debug (SWD) interface and offers flexible and
powerful mechanism for non-intrusive debugging of program code. Breakpoints, single stepping, and
instruction trace capture of code execution flow are part of this support.
The BMD-340 also supports ETM and ITM trace. The trace data from the ETM and the ITM is sent to
an external debugger via a 4-bit wide parallel trace port. In addition to parallel trace, the TPIU supports
serial trace via the Serial Wire Output (SWO) trace protocol.
UBX-19033353 - R11 Electrical specifications Page 19 of 41
BMD-340 - Data sheet
3.7 Clocks
The BMD-340 requires two clocks, a high frequency clock and a low frequency clock. The high
frequency clock is provided on-module by a high-accuracy 32 MHz crystal as required by the
nRF528340 for radio operation.
The low frequency clock can be provided internally by an RC oscillator or synthesized from the fast
clock, or externally by a 32.768 kHz crystal. An external crystal provides the lowest power
consumption and greatest accuracy. Using the internal RC oscillator with calibration provides
acceptable performance for Bluetooth low energy applications at a reduced cost and slight increase
in power consumption.
3.7.1 32.768 kHz crystal (LFXO)
Symbol Parameter Typ. Max. Unit
F
F
f
TOL_LFX O_ANT
C
C
R
C
Table 11: 32.768 kHz crystal (LFXO)
Crystal frequency 32.768 - kHz
NOM_LFXO
TOL_LFXO_BLE
Frequency tolerance, Bluetooth low energy
applications
3
- ±500 ppm
Frequency Tolerance, ANT applications4 - ±50 ppm
Load Capacitance - 12.5 pF
L_LFXO
Shunt Capacitance - 2 pF
0_LFXO
Equivalent series resistance - 100 kΩ
S_LFXO
Input Capacitance on XL1 & XL2 pads 4 - pF
pin
3.7.2 32.768 kHz clock source comparison
Symbol Parameter Min. Typ. Max. Unit
I
Current for 32.768 kHz Crystal Oscillator - 0.23 - µA
LFXO
I
Current for 32.768 kHz RC Oscillator - 0.7 1 µA
LFRC
I
Current for 32.768 kHz Synthesized Oscillator - 100 - µA
LFSYNT
f
TOL_LFXO_BLE
f
TOL_LFX O_ANT
f
f
f
Frequency Tolerance, 32.768 kHz RC Oscillator - - ±5 %
TOL_LFRC
TOL_CAL_LFRC
TOL_LF SYNT
Frequency Tolerance, 32.768 kHz Synthesized Oscillator - - ±48 ppm
Table 12: 32.768 kHz clock source comparison
Frequency Tolerance, 32.768 kHz Crystal Oscillator (Bluetooth low
energy Stack)
3
- - ±500 ppm
Frequency Tolerance, 32.768 kHz Crystal Oscillator (ANT Stack)4 - - ±50 ppm
Frequency tolerance, 32.768 kHz RC after calibration - - ±500 ppm
3
f
TOL_LFXO_BLE
depends on the crystal used.
4
The ANT protocol requires the use of an external crystal.
UBX-19033353 - R11 Electrical specifications Page 20 of 41
and f
TOL_LFX O_ANT
are the maximum allowed for Bluetooth low energy and ANT applications. Actual tolerance
BMD-340 - Data sheet
4 Firmware
Projects for the BMD-340 should utilize the Nordic Semiconductor SDK and the nRF52840 tools for
new development. This will allow access to the very latest Bluetooth support from Nordic
Semiconductor and provide an ongoing path as new features are released.
4.1 Factory image
The BMD-340 module is not loaded with a factory firmware image. The unique, public IEEE Bluetooth
device address is printed on the module label and is also programmed into the UICR.
4.2 SoftDevices
Nordic Semiconductor protocol stacks for Bluetooth and ANT are known as SoftDevices. SoftDevices
are pre-compiled, pre-linked binary files. SoftDevices can be programmed in nRF52 series SoCs and
are downloadable from the Nordic Semiconductor website. The BMD-340 with the nRF52840 SoC
supports the S140 (Bluetooth low energy Central & Peripheral) and S340 (ANT and Bluetooth low
energy) SoftDevices.
4.2.1 S140
The SoftDevice S140 is a feature complete Bluetooth 5 qualified protocol stack for the nRF52840
SoC. It supports up to 20 concurrent links in all roles. It supports Bluetooth 5 features: 2 Mbps, Long
Range, Advertising Extensions and channel selection algorithm #2(CSA #2). The number of
connections and bandwidth per connection are configurable, offering memory and performance
optimization.
It is a complete stack with GAP, GATT, ATT, SM, L2CAP, and Link Layer. Both GATT Server and Client
are supported. The broad feature set also includes Privacy 1.2, LE Data Length Extension (DLE),
configurable ATT MTU, L2CAP connection-oriented channels and LE Secure Connections.
SoftDevice S140 is available for download
here.
4.2.2 S340
SoftDevice S340 is a combined Bluetooth 5 and ANT™ protocol stack for the nRF52840 SoC,
supporting concurrent operation of the two.
It is a Bluetooth 5 qualified protocol stack that offers up to 20 concurrent links in all roles. It supports
all Bluetooth 5 features: 2 Mbps, Long Range, Advertising Extensions and channel selection algorithm
#2 (CSA #2). The number of connections and bandwidth per connection is configurable, offering
memory and performance optimization.
It is a complete Bluetooth LE stack with GAP, GATT, ATT, SM, L2CAP, and Link Layer. Both GATT
Server and Client are supported. The broad feature set also includes Privacy 1.2, LE Data Length
Extension (DLE), configurable ATT MTU, L2CAP connection-oriented channels and LE Secure
Connections.
It supports all ANT features and offers a variety of network topologies, including peer-to-peer, star
and tree. Up to 15 individual channels are available, with broadcast, acknowledged, or burst transfer
communication.
SoftDevice S340 is available for download
UBX-19033353 - R11 Firmware Page 21 of 41
here.
BMD-340 - Data sheet
4.2.3 IEEE 802.15.4 (Thread and Zigbee)
IEEE 802.15.4 based protocols, such as Thread and Zigbee, on the BMD-340 are not implemented
using a SoftDevice. Nordic Semiconductor provides an IEEE 802.15.4 compliant MAC stack which
does not require a SoftDevice to be loaded to operate. Nordic Semiconductor also provides
pre-compiled Thread and Zigbee stacks. See the Nordic Semiconductor SDK for more information on
developing applications that utilize IEEE 802.15.4. Both allow for concurrent operation with Bluetooth
low energy SoftDevices.
4.3 Bluetooth device address
The BMD-340 module is preprogrammed from the factory with a unique public Bluetooth device
(MAC) address stored in the CUSTOMER[0] and CUSTOMER[1] registers of the User Information
Configuration Registers (UICR). The Bluetooth device address consists of the IEEE Organizationally
Unique Identifier (OUI) combined with the six hexadecimal digits that are printed on a 2D barcode and
in human-readable text on the module label, as described in section 5.3. The Bluetooth device address
is stored in little endian format. The most significant bytes of the CUSTOMER[1] register are 0xFF to
complete the 32-bit register.
UICR Register Address Description Remarks
CUSTOMER[0] 0x10001080 Bluetooth_addr [0] (0xFF) Example value. Actual value printed on label
CUSTOMER[0] 0x10001081 Bluetooth_addr [1] (0xEE) Example value. Actual value printed on label
CUSTOMER[0] 0x10001082 Bluetooth_addr [2] (0xDD) Example value. Actual value printed on label
CUSTOMER[0] 0x10001083 Bluetooth_addr [3] (0xCC) IEEE OUI
CUSTOMER[1] 0x10001084 Bluetooth_addr [4] (0xBB) IEEE OUI
CUSTOMER[1] 0x10001085 Bluetooth_addr [5] (0xAA) IEEE OUI
CUSTOMER[1] 0x10001086 0xFF Unused
CUSTOMER[1] 0x10001087 0xFF Unused
Table 13: Bluetooth device address
5,6
5,6
5,6
5
The IEEE OUI for type numbers BMD-340-A-R-00 and BMD-340-A-R-01 is: 94:54:93. The full Bluetooth device address is
stored in the UICR.
6
Type number BMD-340-A-R-10 encodes the full Bluetooth device address in the label data matrix and is stored in the UICR.
UBX-19033353 - R11 Firmware Page 22 of 41
BMD-340 - Data sheet
5 Mechanical specifications
5.1 Dimensions
Length: ± 0.3 mm, Width: ± 0.3 mm, Height: ± 0.1 mm
Figure 11: BMD-340 mechanical drawing
5.2 Recommended PCB land pads
Figure 12: Recommended PCB land pads
UBX-19033353 - R11 Mechanical specifications Page 23 of 41
BMD-340 - Data sheet
3 2 4 5 3 2 1 4 5
1
5.3 Module marking
5.3.1 Module marking for type number BMD-340-A-R-00
Figure 13: Module marking for type number BMD-340-A-R-00
Reference Description
1 Product name
2 No marking here indicates nRF52840 Revision 1 silicon
3
4 FCC ID (USA)
5 ISED ID (Canada)
Table 14: Module marking for type number BMD-340-A-R-00
Data Matrix with unique serial number of six alphanumeric symbols, also in human-readable form. The full
Bluetooth address consists of the IEEE OUI (94:54:93) with the six symbols appended: Example value:
94:54:93:XX:YY:ZZ
5.3.2 Module marking for type number BMD-340-A-R-01
Figure 14: Module marking for type number BMD-340-A-R-01
Reference Description
1 Product name
2 “2” indicates nRF52840 Revision 2 silicon
3
4 FCC ID (USA)
5 ISED (IC) ID (Canada)
Table 15: Module marking for type number BMD-340-A-R-01
Data Matrix with unique serial number of six alphanumeric symbols, also in human-readable form. The full
Bluetooth address consists of the IEEE OUI (94:54:93) with the six symbols appended: Example value:
94:54:93:XX:YY:ZZ
UBX-19033353 - R11 Mechanical specifications Page 24 of 41
BMD-340 - Data sheet
5.3.3 Module marking for type number BMD-340-A-R-10
1a
4
5
2
1b
3
6
Figure 15: Module marking for type number BMD-340-A-R-10
Reference Description
1a
1b Second half of Bluetooth device address in human-readable format (DDEEFF above)
2 FCC ID (USA)
3 ISED (IC) ID (Canada)
4 Product name (Model)
4+5 Product type number
6 Date of production encoded YY/WW (year / week)
Table 16: Module marking for type number BMD-340-A-R-10
Data Matrix with unique serial number of 19 alphanumeric symbols. The first 3 symbols represent module
type number unique to each module variant, the next 12 symbols represent the unique hexadecimal Bluetooth
device address of the module AABBCCDDEEFF, and the last 4 symbols represent the hardware and firmware
version encoded HHFF.
UBX-19033353 - R11 Mechanical specifications Page 25 of 41
BMD-340 - Data sheet
6 RF Design notes
6.1 Recommended RF layout and ground plane
The integrated antenna requires a suitable ground plane to radiate effectively.
The area under and extending out from the antenna portion of the module should be kept clear of
copper and other metal. The module should be placed at the edge of the PCB with the antenna edge
facing out. Reducing the ground plane from that shown in Figure 16 will reduce the effective radiated
power.
Figure 16: BMD-340 RF example based on the evaluation board
6.2 Mechanical enclosure
Care should be taken when designing and placing the module into an enclosure. Metal should be kept
clear from the antenna area, both above and below. Any metal around the module can negatively
impact RF performance.
The module is designed and tuned for the antenna and RF components to be in free air. Any potting,
epoxy fill, plastic over-molding, or conformal coating can negatively impact RF performance and must
be evaluated by the customer.
UBX-19033353 - R11 RF Design notes Page 26 of 41
BMD-340 - Data sheet
Vertical
6.3 Antenna patterns
Antenna patterns are based on the BMD-340 Evaluation Kit with a ground plane size of
109 mm x 56 mm. The X-Y-Z orientation is shown in Figure 17:
Figure 17: BMD-340 evaluation kit X-Y-Z orientation
6.3.1 X-Y plane
Horizontal
UBX-19033353 - R11 RF Design notes Page 27 of 41
BMD-340 - Data sheet
Horizontal
6.3.2 X-Z plane
6.3.3 Y-Z plane
Vertical
Horizontal
Vertical
UBX-19033353 - R11 RF Design notes Page 28 of 41
BMD-340 - Data sheet
7 BMD-340 evaluation development kit
u-blox has developed full featured evaluation boards that provide a complete I/O pin out to headers,
on-board programming and debugging, 32.768 kHz crystal, power and virtual COM port over USB,
BMD-340 USB connector, 64 Mb quad SPI Flash, four user LEDs, and four user buttons. The
evaluation boards also provide the option to be powered from a CR2032 coin cell battery or a LiPo
battery through a JST-PH connecter and have current sense resistors and headers to allow for
convenient current measurements. Arduino Mega style headers are provided for easy prototyping of
additional functions. The evaluation boards also support programming off-board u-blox modules
based on Nordic Semiconductor nRF5 SoCs.
UBX-19033353 - R11 BMD-340 evaluation development kit Page 29 of 41
BMD-340 - Data sheet
8 Qualification and approvals
8.1 United States (FCC)
The BMD-340 module has received Federal Communications Commission (FCC) CFR47
Telecommunications, Part 15 Subpart C “Intentional Radiators” modular approval in accordance with
Part 15.212 and 15.247. The modular approval allows the end user to integrate the module into a
finished product without obtaining subsequent and separate FCC approvals for intentional radiation,
provided no changes or modifications are made to the module circuitry. Changes or modifications
could void the user’s authority to operate the equipment. The end user must comply with all of the
instructions provided by the Grantee, which indicate installation and/or operating conditions
necessary for compliance.
The finished product is required to comply with all applicable FCC equipment authorizations
regulations, requirements and equipment functions not associated with the transmitter module
portion. For example, compliance must be demonstrated to regulations for other transmitter
components within the host product; to requirements for unintentional radiators (Part 15 Subpart B
“Unintentional Radiators”), such as digital devices, computer peripherals, radio receivers, etc.; and to
additional authorization requirements for the non-transmitter functions on the transmitter module
(that is, Verification, or Declaration of Conformity) (for example, transmitter modules may also
contain digital logic functions) as appropriate.
☞ Modification to this product will void the users’ authority to operate this equipment.
⚠ The OEM is still responsible for verifying end product compliance with FCC Part 15, subpart B
limits for unintentional radiators through an accredited test facility.
8.1.1 Labeling and user information requirements
The BMD-340 is assigned the FCC ID number: 2AA9B10
If the FCC ID is not visible when the module is installed inside another device, then the outside of the
finished product into which the module is installed must also display a label referring to the enclosed
module. This exterior label can use the following or similar wording:
Contains FCC ID: 2AA9B10
In addition to marking the product with the appropriate FCC ID, the end product shall bear the
following statement in a conspicuous location on the device (FCC Rules, Title 47, Subchapter A, Part
15, Subpart B, Chapter §15.19):
This device complies with part 15 of the FCC Rules. Operation is subject to the following two
conditions: (1) This device may not cause harmful interference, and (2) this device must
accept any interference received, including interference that may cause undesired operation.
8.1.2 RF exposure
All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498 General
RF Exposure Guidance provides guidance in determining whether proposed or existing transmitting
facilities, operations or devices comply with limits for human exposure to Radio Frequency (RF) fields
adopted by the Federal Communications Commission (FCC).
This module is approved for installation into mobile and/or portable host platforms and must not be
co-located or operating in conjunction with any other antenna or transmitter except in accordance
with FCC multi-transmitter guidelines. End users must be provided with transmitter operating
conditions for satisfying RF Exposure compliance.
UBX-19033353 - R11 Qualification and approvals Page 30 of 41
BMD-340 - Data sheet
8.2 Canada (ISED)
The BMD-340 module is certified for use in Canada under Innovation, Science and Economic
Development Canada (ISED) Radio Standards Specification (RSS) RSS-247 and RSSGen.
8.2.1 Labeling and user information requirements
The BMD-300 is assigned the IC ID number: 12208A-10
Labeling Requirements for the Host Device (from Section 3.2.1, RSS-Gen, Issue 3, December 2010):
The host device shall be properly labeled to identify the module within the host device. The Industry
Canada certification label of a module shall be clearly visible at all times when installed in the host
device, otherwise the host device must be labeled to display the Industry Canada certification number
of the module, preceded by the words “Contains transmitter module”, or the word “Contains”, or
similar wording expressing the same meaning, as follows:
Contains transmitter module IC: 12208A-10
User Manual Notice for License-Exempt Radio Apparatus (from Section 7.1.3 RSS-Gen, Issue 3,
December 2010): User manuals for license-exempt radio apparatus shall contain the following or
equivalent notice in a conspicuous location in the user manual or alternatively on the device or both:
This device complies with Industry Canada license exempt RSS standard(s). Operation is
subject to the following two conditions: (1) this device may not cause interference, and (2) this
device must accept any interference, including interference that may cause undesired
operation of the device.
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio
exempts de licence. L'exploitation est autorisée aux deux conditions suivantes: (1) l'appareil
ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit accepter tout brouillage
radioélectrique subi, même si le brouillage est susceptible d'en compromettre le
fonctionnement.
Transmitter Antenna (from Section 7.1.2 RSS-Gen, Issue 3, December 2010): User manuals
for transmitters shall display the following notice in a conspicuous location:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna
of a type and maximum (or lesser) gain approved for the transmitter by Industry Canada. To
reduce potential radio interference to other users, the antenna type and its gain should be so
chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that
necessary for successful communication.
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut
fonctionner avec une antenne d'un type et d'un gain maximal (ou inférieur) approuvé pour
l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage radioélectrique
à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la
puissance isotrope rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à
l'établissement d'une communication satisfaisante.
8.2.2 RF exposure
All transmitters regulated by ISED must comply with RF exposure requirements listed in RSS-102 Radio Frequency (RF) Exposure Compliance of Radiocommunication Apparatus (All Frequency
Bands). This module is approved for installation into mobile and/or portable host platforms and must
not be co-located or operating in conjunction with any other antenna or transmitter except in
accordance with Industry Canada's multi-transmitter guidelines. End users must be provided with
transmitter operating conditions for satisfying RF Exposure compliance.
UBX-19033353 - R11 Qualification and approvals Page 31 of 41
BMD-340 - Data sheet
8.3 European Union regulatory compliance
Information about regulatory compliance of the European Union for the BMD-340 module is available
in the BMD-340 Declaration of Conformity.
8.3.1 Radio Equipment Directive (RED) 2014/53/EU
The BMD-340 module complies with the essential requirements and other relevant provisions of
Radio Equipment Directive (RED) 2014/53/EU.
8.4 Australia / New Zealand (RCM)
The BMD-340 has been tested to comply with the AS/NZS 4268:2017, Radio equipment and systems
– Short range devices – Limits and methods of measurement. The report may be obtained from your
local FAE, and may be used as evidence in obtaining permission to use the Regulatory Compliance
Mark (RCM).
Information on registration as a Responsible Party, license and labeling requirements may be found
at the following websites:
Australia: http://www.acma.gov.au/theACMA/radiocommunications-short-range-devices-standard-
2004
New Zealand: http://www.rsm.govt.nz/compliance
Only Australian-based and New Zealand-based companies who are registered may be granted
permission to use the RCM. An Australian-based or New Zealand-based agent or importer may also
register as a Responsible Party to use the RCM on behalf of a company not in Australia or New
Zealand.
8.5 Japan (MIC)
MIC applies to type number BMD-340-A-R-10 and newer.
The BMD-340 module has received type certification and conforms to the technical standards
regulated by the Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the
Radio Act of Japan. Integration of this module into a final end product does not require additional
radio certification provided installation instructions are followed and no modifications of the module
are allowed. Additional testing may be required:
• If the host product is subject to electrical appliance safety (for example, powered from an AC mains), the host
product may require Product Safety Electrical Appliance and Material (PSE) testing. The integrator should
contact their conformance laboratory to determine if this testing is required.
• There is a voluntary Electromagnetic Compatibility (EMC) test for the host product administered by VCCI:
http://www.vcci.jp/vcci_e/index.html
The label on the end product which contains a BMD-340 module must follow the MIC marking
requirements. Labeling requirements for Japan available at the Ministry of Internal Affairs and
Communications (MIC) website: http://www.tele.soumu.go.jp/e/index.htm.
UBX-19033353 - R11 Qualification and approvals Page 32 of 41
BMD-340 - Data sheet
Figure
R 204-B00161
The BMD-340 module is assigned the technical conformity mark and certification number noted in
Figure 18 below. The end product in which this module is being used must have an external label
referring to the type certified module inside:
Contains transmitter module with certificate number:
18: Japan technical conformity mark and certification number
8.6 Bluetooth qualification
The Bluetooth SIG maintains the Bluetooth Specification, and ensures that products are properly
tested and comply with the Bluetooth license agreements. Companies that list products with the
Bluetooth SIG are required to be members of the SIG and submit the listed fees. Refer to this link for
details: https://www.bluetooth.com/develop-with-bluetooth/qualification-listing
The BMD-340 Bluetooth low energy module based on Nordic Semiconductor SoCs is listed as a
“Tested Component”. This allows an end product based on a u-blox module to inherit the component
listings without the need to run all of the tests again. The end product will often inherit several
different listings, known as Qualified Design IDs (QDID), and are identified on a “Declaration of
Compliance”.
The list of qualified products is found here: https://launchstudio.bluetooth.com/Listings/Search
The BMD-340 primarily utilizes the S140 SoftDevice.
UBX-19033353 - R11 Qualification and approvals Page 33 of 41
BMD-340 - Data sheet
9 Environmental
9.1 RoHS
BMD-340 modules are in compliance with Directive 2011/65/EU, 2015/863/EU of the European
Parliament and the Council on the restriction of the use of certain hazardous substances in electrical
and electronic equipment.
9.2 REACH
BMD-340 modules do not contain the SVHC (Substance of Very High Concern), as defined by Directive
EC/1907/2006 Article according to REACH Annex XVII.
9.3 California proposition 65 (P65)
This product can expose you to Nickel (metallic), which is known to the State of California to cause
cancer. For more information go to www.P65Warnings.ca.gov.
☞ Warnings are not required where the listed chemical is inaccessible to the average user of the end
product.
UBX-19033353 - R11 Environmental Page 34 of 41
BMD-340 - Data sheet
10 Product handling
10.1 Packaging
10.1.1 Reel packaging for type number BMD-340-A-R-00 and BMD-340-AR-01
Modules are packaged on 330 mm reels loaded with 1000 modules. Each reel is placed in an antistatic
bag with a desiccant pack and humidity card and placed in a 340 x 350 x 65 mm box. An antistatic
warning and reel label are adhered to the outside of the bag.
Figure 19 – Reel cartons used for type number BMD-340-A-R-00 and BMD-340-A-R-01
10.1.2 Reel packaging for type number BMD-340-A-R-10
Modules are packaged on 330 mm reels loaded with 1000 modules. Each reel is placed in an antistatic
bag with a desiccant pack and humidity card and placed in a 370x355x56 mm box. See the u-blox
Package Information Guide [1] for full specifications on reel dimensions, box sizes and shipping label
content. BMD-340-A-R-10 modules use u-blox reel type A3.
UBX-19033353 - R11 Product handling Page 35 of 41
BMD-340 - Data sheet
10.1.3 Carrier tape dimensions for type number BMD-340-A-R-00 and BMD-340-A-R-01
Figure 20 – BMD-340-A-R-00 and BMD-340-A-R-01 carrier tape dimensions
10.1.4 Carrier tape dimensions for type number BMD-340-A-R-10
Figure 21: BMD-340-A-R-10 carrier tape dimensions
UBX-19033353 - R11 Product handling Page 36 of 41
BMD-340 - Data sheet
10.2 Moisture sensitivity level
The BMD-340 Series is rated for MSL 3, 168-hour floor life after opening.
10.3 Reflow soldering
Figure 22: Reflow Profile for Lead Free Solder
10.4 ESD precautions
⚠ The BMD-340 module contains highly sensitive electronic circuitry and is an Electrostatic
Sensitive Device (ESD). Handling the BMD-340 module without proper ESD protection may
destroy or damage them permanently.
Proper ESD handling and packaging procedures must be applied throughout the processing, handling
and operation of any application that incorporates the BMD-340 module. Failure to observe these
recommendations can result in severe damage to the device.
UBX-19033353 - R11 Product handling Page 37 of 41
BMD-340 - Data sheet
11 Ordering information
Ordering Code Product
BMD-340-A-R BMD-340 module, nRF52840-QIAA, Tape & Reel, 1000 pieces per reel
Type number BMD-340-A-R-00 uses nRF52840-QIAA rev 1
Type number BMD-340-A-R-01 and above uses nRF52840-QIAA rev 2
BMD-340-EVAL BMD-340 evaluation kit w/ SEGGER J-Link-OB debug probe
Table 17: Product ordering codes
UBX-19033353 - R11 Ordering information Page 38 of 41
BMD-340 - Data sheet
12 Life support and other high-risk use warning
This product is neither designed nor intended for use in a life support device or system, nor for use in
other fault-intolerant, hazardous or other environments requiring fail-safe performance, such as any
application in which the failure or malfunction of the product could lead directly or indirectly to death,
bodily injury, or physical or property damage (collectively, “high-risk environments”).
⚠ u-blox expressly disclaims any express or implied warranty of fitness for use in high-risk
environments.
The customer using this product in a high-risk environment agrees to indemnify and defend u-blox
from and against any claims and damages arising out of such use.
UBX-19033353 - R11 Life support and other high-risk use warning Page 39 of 41
BMD-340 - Data sheet
Related Documents
[1] u-blox Package Information Guide, doc. no. UBX-14001652
[2] Nordic Semiconductor, nRF52840 Product Specification
[3] Nordic Semiconductor, nRF5 Software Development Kit
☞ For regular updates to u-blox documentation and to receive product change notifications, register
on our homepage (www.u-blox.com).
Revision history
Revision Date Name Comments
0.8 05-Jul-2017 brec Initial release.
1.0 21-May-2018 brec
1.1 24-Jul-2018 Added Antenna data and updated certification information.
2.0 01-Feb-2019 brec Updated to new format
2.1 28-Feb-2019 brec Corrected output power in Table 7 to +8 dBm
2.2 10-May-2019 brec Added reference to S340 SoftDevice
R07 21-Oct-2019 brec, kgom Document converted from Rigado to u-blox style data sheet.
R08 07-Jan-2020 brec
R09 26-Mar-2020 brec
R10 27-Apr-2020 brec
R11 08-Jun-2020 brec
Production release. Updated power specifications. Added details on REG0
related silicon errata. Updated certification information. Added Zigbee
information. Removed outdated factory firmware information.
Updated Life Support and other High-Risk Use Warning
Corrected superscript note on low frequency GPIO pins
Updated Nordic Semiconductor links
Updated HV power output specifications
Updated RC Oscillator specifications
Changed packing and shipping carton labeling in Section 11
Edits for consistency with other BMD-3 modules; Added information about
Nordic Semiconductor errata related to the DCDC configuration, which are
solved in BMD-340-A-R-01 and newer (section 3.3)
Added type number BMD-340-A-R-10; Added u-blox logo to Figure 11 to show
orientation of label; Added label information for new type number in section 5.3;
Added ESD precautions in section 10.4; Changed images to be u-blox branded;
Added packaging specification for type number BMD-340-A-R-10 in section
10.1; Updated antenna patterns to show both horizontal and vertical plots.
Removed remark pin 51 in Table 2: no restriction on pin use for P1.08, clarified
PWM feature, updated block diagram (Figure 1), minor typographical corrections
Added Japan (MIC) certification in Table 1 and section 8.5, moved Bluetooth
declaration to section 8.6
UBX-19033353 - R11 Related Documents Page 40 of 41
BMD-340 - Data sheet
Contact
For complete contact information, visit us at www.u-blox.com.
u-blox Offices
North, Central and South America
u-blox America, Inc.
Phone: +1 703 483 3180
E-mail: info_us@u-blox.com
Regional Office West Coast:
Phone: +1 408 573 3640
E-mail: info_us@u-blox.com
Technical Support:
Phone: +1 703 483 3185
E-mail: support@u-blox.com
Headquarters
Europe, Middle East, Africa
u-blox AG
Phone: +41 44 722 74 44
E-mail: info@u-blox.com
Support: support@u-blox.com
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u-blox Singapore Pte. Ltd.
Phone: +65 6734 3811
E-mail: info_ap@u-blox.com
Support: support_ap@u-blox.com
Regional Office Australia:
Phone: +61 2 8448 2016
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Support: support_ap@u-blox.com
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Phone: +86 10 68 133 545
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Support: support_cn@u-blox.com
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Support: support_cn@u-blox.com
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Support: support_cn@u-blox.com
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Support: support_in@u-blox.com
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Phone: +81 6 6941 3660
E-mail:
Support: support_jp@u-blox.com
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Phone: +81 3 5775 3850
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Support: support_jp@u-blox.com
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Phone: +82 2 542 0861
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Support: support_kr@u-blox.com
Regional Office Taiwan:
Phone: +886 2 2657 1090
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Support: support_tw@u-blox.com
info_jp@u-blox.com
UBX-19033353 - R11 Contact Page 41 of 41
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