u-blox BMD-300 User Manual
alone Bluetooth® low energy module. The
OEMs can embed their own application on top of the integrated Bluetooth low energy stack using
BMD-300
Stand-alone Bluetooth low energy module
Data sheet
Abstract
This technical data sheet describes the BMD-300 stand-
Nordic Semiconductor SDK integrated development environment (IDE).
UBX-19033350 - R26
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BMD-300 - Data sheet
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Document information
Title BMD-300
Subtitle Stand-alone Bluetooth low energy module
Document type Data sheet
Document number UBX-19033350
Revision and date R26 31-Mar-2021
Disclosure restriction C1-Public
Product status Corresponding content status
Functional sample Draft For functional testing. Revised and supplementary data will be published later.
In development /
Prototype
Engineering sample Advance information Data based on early testing. Revised and supplementary data will be published later.
Initial production Early production information Data from product verification. Revised and supplementary data may be published later.
Mass production /
End of life
Objective specification Target values. Revised and supplementary data will be published later.
Production information Document contains the final product specification.
This document applies to the following products:
Product name Type number Firmware version IN/PCN reference Product status
BMD-300 BMD-300-A-R-00 All UBX-19039722 Mass production
BMD-300 BMD-300-A-R-10 AE UBX-20007336 Mass production
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BMD-300 - Data sheet
Contents
Document information ............................................................................................................................. 2
Contents ....................................................................................................................................................... 3
1 Functional description ....................................................................................................................... 5
Features ........................................................................................................................................................ 5
Applications ................................................................................................................................................. 5
Block diagram .............................................................................................................................................. 6
Product specifications ............................................................................................................................... 7
2 Pin definition......................................................................................................................................... 9
Pin assignment ............................................................................................................................................ 9
3 Electrical specifications ................................................................................................................. 11
Absolute maximum ratings .................................................................................................................... 11
Operating conditions ................................................................................................................................ 11
General purpose I/O .................................................................................................................................. 11
3.4 Peripheral pin assignments .................................................................................................................... 12
Module reset .............................................................................................................................................. 12
Debug and programming ......................................................................................................................... 12
Clocks .......................................................................................................................................................... 12
3.7.1 32.768 kHz crystal (LFXO) .............................................................................................................. 13
3.7.2 32.768 kHz clock source comparison ........................................................................................... 13
4 Firmware ............................................................................................................................................. 14
Factory image ............................................................................................................................................ 14
4.1.1 Firmware version “AA” ..................................................................................................................... 14
4.1.2 Firmware version “AB” ..................................................................................................................... 14
4.1.3 Firmware version “AC” ..................................................................................................................... 14
4.1.4 Firmware version “AD” ..................................................................................................................... 15
4.1.5 Firmware version “AE” ..................................................................................................................... 15
Module programming and read-back protection ............................................................................... 15
SoftDevices ................................................................................................................................................ 15
4.3.1 S132 .................................................................................................................................................... 16
4.3.2 S212 .................................................................................................................................................... 16
4.3.3 S332 .................................................................................................................................................... 16
Bluetooth device address ........................................................................................................................ 16
5 Mechanical specifications ............................................................................................................. 17
Dimensions ................................................................................................................................................. 17
Recommended PCB land pads ............................................................................................................... 17
Module marking ......................................................................................................................................... 18
5.3.1 Module marking for type number BMD-300-A-R-00 ................................................................. 18
5.3.2 Module marking for type number BMD-300-A-R-10 ................................................................. 19
6 RF design notes ................................................................................................................................ 20
Recommended RF layout and ground plane ........................................................................................ 20
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BMD-300 - Data sheet
Mechanical enclosure ............................................................................................................................... 20
Antenna patterns ...................................................................................................................................... 21
6.3.1 X-Y plane ............................................................................................................................................. 21
6.3.2 X-Z plane ............................................................................................................................................. 22
6.3.3 Y-Z plane ............................................................................................................................................ 22
7 BMD-300 evaluation development kit ....................................................................................... 23
8 Qualification and approvals .......................................................................................................... 24
United States (FCC): ................................................................................................................................ 24
8.1.1 Labeling and user information requirements ............................................................................. 24
8.1.2 RF exposure ....................................................................................................................................... 24
Canada (ISED) ............................................................................................................................................ 25
8.2.1 Labeling and user information requirements ............................................................................. 25
8.2.2 RF exposure ....................................................................................................................................... 25
European Union regulatory compliance ............................................................................................... 26
8.3.1 Radio Equipment Directive (RED) 2014/53/EU .......................................................................... 26
8.3.2 Labeling and user information requirements ............................................................................. 26
Japan (MIC) ................................................................................................................................................ 26
Australia / New Zealand (RCM) .............................................................................................................. 26
South Korea (KCC) .................................................................................................................................... 27
Brazil (ANATEL) ......................................................................................................................................... 27
Mexico (IFETEL) ........................................................................................................................................ 27
Bluetooth qualification ............................................................................................................................. 27
9 Environmental ................................................................................................................................... 28
RoHS ............................................................................................................................................................ 28
REACH ......................................................................................................................................................... 28
California proposition 65 (P65) .............................................................................................................. 28
10 Product handling .............................................................................................................................. 29
Packaging ................................................................................................................................................... 29
10.1.1 Reel packaging for type number BMD-300-A-R-00 ................................................................... 29
10.1.2 Reel packaging for type number BMD-300-A-R-10 ................................................................... 29
10.1.3 Carrier tape dimensions for type number BMD-300-A-R-00 .................................................. 30
10.1.4 Carrier tape dimensions for type number BMD-300-A-R-10 .................................................. 30
Moisture sensitivity level ......................................................................................................................... 31
Reflow soldering ........................................................................................................................................ 31
ESD precautions ........................................................................................................................................ 31
11 Ordering information ...................................................................................................................... 32
12 Life support and other high-risk use warning ......................................................................... 33
Related documents ................................................................................................................................ 34
Revision history ....................................................................................................................................... 34
Contact ....................................................................................................................................................... 36
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BMD-300 - Data sheet
1 Functional description
The BMD-300 is a powerful, highly flexible, ultra-low power Bluetooth low energy module based on the
nRF52832 SoC from Nordic Semiconductor. With an Arm® Cortex®-M4 with FPU 32-bit processor,
embedded 2.4GHz transceiver, and integrated antenna, the BMD-300 provides a complete RF
solution with no additional RF design, allowing faster time to market. Providing full use of the
nRF52832’s capabilities and peripherals, the BMD-300 can power the most demanding applications,
all while simplifying designs and reducing BOM costs. With an internal DC-DC converter and
intelligent power control, the BMD-300 provides class-leading power efficiency, enabling ultra-low
power sensitive applications. Regulatory pre-approvals reduce the burden to enter the market.
Features
• Based on the Nordic Semiconductor nRF52832 SoC
• Bluetooth 5 PHYs: LE 1M, LE 2M
• Bluetooth 5 features: Advertising Extensions, Channel Selection Algorithm #2
• Bluetooth mesh
• Complete RF solution with an integrated DC-DC converter
• Nordic Semiconductor SoftDevice ready
• Over-the-Air (OTA) firmware updates
• No external components required
• Arm® Cortex®-M4 with FPU 32-bit processor
• 512 kB embedded flash memory
• 64 kB RAM
• –40 °C to +85 °C Temperature range
• 32 General Purpose I/O Pins
• 12-bit/200 KSPS ADC
• Serial Wire Debug (SWD)
• Three SPI Master/Slave (8 Mbps)
• Two 2-wire Master/Slave (I2C compatible)
• Footprint compatible with BMD-301, BMD-330, BMD-360, and BMD-340 (superset)
• UART (w/ CTS/RTS and DMA)
• I2S audio interface
• Low power comparator
• Temperature sensor
• Random number generator
• 20 channel CPU independent Programmable Peripheral Interconnect (PPI)
• Quadrature Demodulator (QDEC)
• 128-bit AES HW encryption
• 5 x 32 bit, 3 x 24 bit Real Timer Counters (RTC)
• NFC-A tag interface for OOB pairing
• Dimensions: 14 x 9.8 x 1.9 mm
• USA (FCC): 2AA9B04
• Canada (IC): 12208A-04
• Japan (MIC): 210-106799
Applications
• Beacons – iBeacon™, Eddystone, AltBeacon, etc.
• Low-power sensors
• Fitness devices
• Wearables
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BMD-300 - Data sheet
BMD-300 Series Modules
32 MHz
Crystal
nRF52832
512kB
Flash
DC-DC
Inductor
Decoupling
Capacitors
Bulk
Capacitors
2.4GHz Radio
Multi-protocol
TWI
Master x2
SPI
Master x3
SPI Slave
X3
DC/DC Buck
Regulator
Core LDO
64
kB RAM
Low Power
Comparator
8-ch 12-bit
ADC
UART
Quadrature
Decoder
SWD Debug &
Programming
Temperature
Sensor
Clock
Management
Watchdog
Timer
Random Number
Gen
Timer x5
Accel Address
Resolver
AES CCM Mode
Encryption
AES ECB
Real Time
Counter x3
GPIO Task
Event Blocks
Programmable
Peripheral
Interconnect
ARM Cortex-M4F
@ 64MHz
Matching
Network
Antenna
/ U.FL
GPIO x32
(Analog x8)
I2S
TWI Slave
x2
PWM PDM
General
Purpose
Comparator
NFC Tag
Balun
• Climate control
• Lighting
• Safety and security
• Home appliances
• Access control
• Internet of Things
• Home health care
• Advanced remote controls
• Smart energy management
• Low-power sensor networks
• Interactive entertainment
• Key fobs
• Environmental monitoring
• Hotel automation
• Office automation
Block diagram
Figure 1: Block diagram of BMD-300
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BMD-300 - Data sheet
Product specifications
Detail Description
Bluetooth
Bluetooth version Bluetooth 5 low energy, Concurrent Central & Peripheral (S132), 2M LE PHY, 1M
LE PHY, Advertising Extensions, CSA #2
Bluetooth Mesh
Security AES-128
LE connections Concurrent central, observer, peripheral, and broadcaster roles with up to twenty
concurrent connections along with one Observer and one Broadcaster (S132)
Radio
Frequency 2.360 GHz to 2.500 GHz
Modulations GFSK at 1 Mbps, 2 Mbps data rates
Transmit power +4 dBm maximum
Receiver sensitivity –96 dBm (Bluetooth low energy mode)
Antenna Integrated (–1dBi peak)
Current consumption
TX only @ +4 dBm, 0 dBm @ 3V, DCDC
enabled
TX only @ +4 dBm, 0 dBm 16.6 mA, 11.6 mA
RX only @ 1 Mbps @ 3V, DCDC enabled 5.4 mA
RX only @ 1 Mbps 11.7 mA
CPU @ 64MHz from flash, from RAM 7.4 mA, 6.7 mA
CPU @ 64MHz from flash, from RAM @
3V, DCDC
System Off, On 0.3 µA, 1.2 µA
Additional current for RAM retention 30 nA / 4KB block
Dimensions
Length 14.0 mm ± 0.3mm
Width 9.8 mm ± 0.3mm
Height 1.9 mm ± 0.1mm
Hardware
Interfaces SPI Master/Slave x 3
Power supply 1.7 V to 3.6 V
Temperature range –40 °C to +85 °C
Certifications
USA (FCC)
Canada (ISED) ISED RSS-247 modular certification IC: 12208A-04
Europe (CE) EN 60950-1: A2:2013 3.1 (a): Health and Safety of the User
Japan (MIC) Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the
7.5 mA, 5.3 mA
3.7 mA, 3.3 mA
UART
Two-Wire Master/Slave (I2C) x 2
I2S
PWM
PDM
GPIO x 32
FCC part 15.247 modular certification
FCC ID: 2AA9B04
EN 301 489-1 V2.1.1 & 3.1 (b): Electromagnetic Compatibility
EN 301 489-17 V3.1.1
EN 300 328 V2.1.1 3.2: Effective use of spectrum allocated
Radio Act of Japan: MIC: 210-106799
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BMD-300 - Data sheet
Detail Description
Australia / New Zealand (RCM) AS/NZS 4268:2017, Radio equipment and systems – Short range devices
South Korea (KCC) Certified under Clause 2, Article 58-2 of the Radio Waves Act: R-CRM-Rgd-BMD-
300
Brazil (ANATEL) Resolution 680 of 27/06/2017, Act 14448 of 04/12/2017
Certificate number: 00820-21-05903
Mexico (IFETEL) Modular certification: NYCE/CT/0146/17/TS
Bluetooth BMD-300/301 BT5 RF-PHY Component (Tested) – DID: D037298;
QDID: 101625
Radio chip
Nordic Semiconductor nRF52832 Additional details: nRF52832 Product Specification
Software Development Kit
Table 1: Product specifications
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BMD-300 - Data sheet
frequency GPIO only
2 Pin definition
The BMD-300, BMD-301, BMD-330, and BMD-360 share an identical pin-out. This pin-out is also a
subset of the BMD-340 footprint, allowing a single design to support any of these modules.
Pin assignment
Figure 2: BMD-300 Pin assignment (top view)
No. Name I/O Description nRF52 pin Remarks
1 GND Power Electrical Ground
2 GND Power Electrical Ground
3 GND Power Electrical Ground
4 GND Power Electrical Ground
5 GND Power Electrical Ground
6 P0.25 I/O GPIO P0.25 Use as low drive, low frequency GPIO only
Add 12 pF capacitance to ground. See Nordic
Semiconductor errata 138 [5]
7 P0.26 I/O GPIO P0.26 Use as low drive, low frequency GPIO only
Add 12 pF capacitance to ground. See Nordic
Semiconductor errata 138 [5]
8 P0.27 I/O GPIO P0.27 Use as low drive, low frequency GPIO only
9 P0.28 I/O GPIO/AIN4 P0.28 Pin is analog capable, use as low drive, low
frequency GPIO only
10 P0.29 I/O GPIO/AIN5 P0.29
11 P0.30 I/O GPIO/AIN6 P0.30 Pin is analog capable, use as low drive, low
12 P0.31 I/O GPIO/AIN7 P0.31 Pin is analog capable, use as low drive, low
13 P0.00 I/O GPIO/XTAL1 (32.768 kHz) P0.00
14 P0.01 I/O GPIO/XTAL2 (32.768 kHz) P0.01
15 P0.02 I/O GPIO/AIN0 P0.02 Pin is analog capable
16 GND Power Electrical Ground
17 VCC Power +1.7V to +3.6V An internal 4.7 µF bulk capacitor is included
18 GND Power Electrical Ground
Pin is analog capable, use as low drive, low
frequency GPIO only
frequency GPIO only
on the module. However, it is good design
practice to add additional bulk capacitance
as required for your application, i.e. those
with heavy GPIO usage and/or current draw.
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BMD-300 - Data sheet
No. Name I/O Description nRF52 pin Remarks
19 P0.03 I/O GPIO/AIN1 P0.03 Pin is analog capable
20 P0.04 I/O GPIO/AIN2 P0.04 Pin is analog capable
21 P0.05 I/O GPIO/AIN3 P0.05 Pin is analog capable
22 P0.06 I/O GPIO P0.06
23 P0.07 I/O GPIO P0.07
24 P0.08 I/O GPIO P0.08
25 P0.09 I/O GPIO/NFC1 P0.09 NFC pin 1 (default)
26 P0.10 I/O GPIO/NFC2 P0.10 NFC pin 2 (default)
27 P0.11 I/O GPIO P0.11
28 P0.12 I/O GPIO P0.12
29 GND Power Electrical Ground
30 GND Power Electrical Ground
31 P0.13 I/O GPIO P0.13
32 P0.14 I/O GPIO/TRACEDATA[3] P0.14
33 P0.15 I/O GPIO/TRACEDATA[2] P0.15
34 P0.16 I/O GPIO/TRACEDATA[1] P0.16
35 P0.17 I/O GPIO P0.17
36 P0.18 I/O GPIO/TRACEDATA[0]/SWO P0.18
37 P0.19 I/O GPIO P0.19
38 P0.20 I/O GPIO/TRACECLK P0.20
39 P0.21 I/O GPIO/RESET_N P0.21 May be used as active low reset input
40 P0.22 I/O GPIO P0.22 Use as low drive, low frequency GPIO only
41 P0.23 I/O GPIO P0.23 Use as low drive, low frequency GPIO only
42 P0.24 I/O GPIO P0.24 Use as low drive, low frequency GPIO only
43 SWCLK I SWD Clock SWCLK
44 SWDIO I/O SWD IO SWDIO
45 GND Power Electrical Ground
46 GND Power Electrical Ground
47 GND Power Electrical Ground
Table 2: BMD-300 pin-out
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BMD-300 - Data sheet
3 Electrical specifications
⚠ Stressing the device above one or more of the ratings listed in the Absolute maximum rating
section may cause permanent damage. These are stress ratings only. Operating the module at
these or at any conditions other than those specified in the Operating conditions section of this
document should be avoided. Exposure to absolute maximum rating conditions for extended
periods may affect device reliability.
☞ Operating condition ranges define those limits within which the functionality of the device is
guaranteed. Where application information is given, it is advisory only and does not form part of
the specification.
Absolute maximum ratings
Symbol Description Min Max Unit
V
Voltage on supply pin –0.3 3.9 V
CC_MAX
V
Voltage on GPIO pins (VCC > 3.6 V) –0.3 3.9 V
IO_MAX
V
Voltage on GPIO pins (VCC ≤ 3.6V) –0.3 VCC+0.3 V V
IO_MAX
TS Storage Temperature Range –40 125 °C
Table 3: Absolute maximum ratings
⚠ The product is not protected against overvoltage or reversed voltages. If necessary, voltage spikes
exceeding the power supply voltage specification, given in table above, must be limited to values
within the specified boundaries by using appropriate protection devices.
Operating conditions
☞ Unless otherwise specified, all operating condition specifications are at an ambient temperature
of 25 °C and a supply voltage of 3.0 V.
⚠ Operation beyond the specified operating conditions is not recommended and extended exposure
beyond them may affect device reliability.
Symbol Parameter Min Typ. Max Unit
VCC Operating supply voltage 1.7 3.0 3.6 V
T
Supply rise time (0 V to 1.7 V) - - 60 ms
R_VCC
TA Operating ambient temperature range –40 25 85 ° C
Table 4: Operating conditions
General purpose I/O
The general purpose I/O is organized as one port enabling access and control of the 32 available GPIO
pins via one port, P0. Each GPIO can be accessed with the following user configurable features:
• Input/output direction
• Output drive strength
• Internal pull-up and pull-down resistors
• Wake-up from high- or low-level triggers on all pins
• Trigger interrupt on all pins
• All pins can be used by the PPI task/event system; the maximum number of pins that can be
interfaced through the PPI at the same time is limited by the number of GPIOTE channels
• All pins can be individually configured to carry serial interface or quadrature demodulator signals
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