u blox 1EHQ24NN Test Setup photos
Abstract
This document describes the features and the system integration of
TOBY-R2 series multi-mode cellular modules.
These modules are a complete, cost efficient and performance
optimized LTE Cat 1 / 3G / 2G multi-mode solution covering up to five
LTE bands, up to four 3G UMTS/HSPA bands and up to four 2G
GSM/EGPRS bands in the compact TOBY LGA form factor.
www.u-blox.com
UBX-16010572 - R01
TOBY-R2 series
LTE Cat 1 / HSPA / EGPRS modules
System Integration Manual
Document Information
Title
TOBY-R2 series
Subtitle
LTE Cat 1 / HSPA / EGPRS modules
Document type
System Integration Manual
Document number
UBX-16010572
Revision and date
R01
08-Jul-2016
Document status
Objective Specification
Document status explanation
Objective Specification
Document contains target values. Revised and supplementary data will be published later.
Advance Information
Document contains data based on early testing. Revised and supplementary data will be published later.
Early Production Information
Document contains data from product verification. Revised and supplementary data may be published later.
Production Information
Document contains the final product specification.
Name
Type number
Modem version
Application version
PCN / IN
TOBY-R200
TOBY-R200-02B-00
TBD
TBD
TBD
TOBY-R201
TOBY-R201-02B-00
TBD
TBD
TBD
TOBY-R202
TOBY-R202-02B-00
30.01
A01.00
UBX-16016282
This document applies to the following products:
TOBY-R2 series - System Integration Manual
u-blox reserves all rights to this document and the information contained herein. Products, names, logos and designs described herein may in
whole or in part be subject to intellectual property rights. Reproduction, use, modification or disclosure to third parties of this document or
any part thereof without the express permission of u-blox is strictly prohibited.
The information contained herein is provided “as is” and u-blox assumes no liability for the use of the information. No warranty, either
express or implied, is given, including but not limited, with respect to the accuracy, correctness, reliability and fitness for a particular purpose
of the information. This document may be revised by u-blox at any time. For most recent documents, please visit www.u-blox.com.
Copyright © 2016, u-blox AG
u-blox® is a registered trademark of u-blox Holding AG in the EU and other countries. Microsoft and Windows are either registered
trademarks or trademarks of Microsoft Corporation in the United States and/or other countries. All other registered trademarks or
trademarks mentioned in this document are property of their respective owners.
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Preface
u-blox Technical Documentation
As part of our commitment to customer support, u-blox maintains an extensive volume of technical
documentation for our products. In addition to our product-specific technical data sheets, the following manuals
are available to assist u-blox customers in product design and development.
AT Commands Manual: This document provides the description of the AT commands supported by the
u-blox cellular modules.
System Integration Manual: This document provides the description of u-blox cellular modules’ system
from the hardware and the software point of view, it provides hardware design guidelines for the optimal
integration of the cellular modules in the application device and it provides information on how to set up
production and final product tests on application devices integrating the cellular modules.
Application Note: These documents provide guidelines and information on specific hardware and/or
software topics on u-blox cellular modules. See Related documents for a list of Application Notes related to
your Cellular Module.
How to use this Manual
The TOBY-R2 series System Integration Manual provides the necessary information to successfully design and
configure the u-blox cellular modules.
This manual has a modular structure. It is not necessary to read it from the beginning to the end.
The following symbols are used to highlight important information within the manual:
An index finger points out key information pertaining to module integration and performance.
A warning symbol indicates actions that could negatively impact or damage the module.
Questions
If you have any questions about u-blox Cellular Integration:
Read this manual carefully.
Contact our information service on the homepage http://www.u-blox.com/
Technical Support
Worldwide Web
Our website (http://www.u-blox.com/) is a rich pool of information. Product information, technical documents
can be accessed 24h a day.
By E-mail
Contact the closest Technical Support office by email. Use our service pool email addresses rather than any
personal email address of our staff. This makes sure that your request is processed as soon as possible. You will
find the contact details at the end of the document.
Helpful Information when Contacting Technical Support
When contacting Technical Support, have the following information ready:
Module type (TOBY-R202) and firmware version
Module configuration
Clear description of your question or the problem
A short description of the application
Your complete contact details
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Contents
Preface ................................................................................................................................ 3
Contents .............................................................................................................................. 4
1 System description ....................................................................................................... 8
1.1 Overview .............................................................................................................................................. 8
1.2 Architecture ........................................................................................................................................ 10
1.3 Pin-out ............................................................................................................................................... 12
1.4 Operating modes ................................................................................................................................ 16
1.5 Supply interfaces ................................................................................................................................ 18
1.5.1 Module supply input (VCC) ......................................................................................................... 18
1.5.2 RTC supply input/output (V_BCKP) .............................................................................................. 26
1.5.3 Generic digital interfaces supply output (V_INT) ........................................................................... 27
1.6 System function interfaces .................................................................................................................. 28
1.6.1 Module power-on ....................................................................................................................... 28
1.6.2 Module power-off ....................................................................................................................... 30
1.6.3 Module reset ............................................................................................................................... 32
1.6.4 Module / host configuration selection ......................................................................................... 32
1.7 Antenna interface ............................................................................................................................... 33
1.7.1 Antenna RF interfaces (ANT1 / ANT2) .......................................................................................... 33
1.7.2 Antenna detection interface (ANT_DET) ...................................................................................... 35
1.8 SIM interface ...................................................................................................................................... 35
1.8.1 SIM interface ............................................................................................................................... 35
1.8.2 SIM detection interface ............................................................................................................... 35
1.9 Data communication interfaces .......................................................................................................... 36
1.9.1 UART interface ............................................................................................................................ 36
1.9.2 USB interface............................................................................................................................... 47
1.9.3 DDC (I2C) interface ...................................................................................................................... 50
1.9.4 SDIO interface ............................................................................................................................. 51
1.10 Audio .............................................................................................................................................. 52
1.10.1 Digital audio over I2S interface ..................................................................................................... 52
1.11 General Purpose Input/Output ........................................................................................................ 53
1.12 Reserved pins (RSVD) ...................................................................................................................... 53
1.13 System features............................................................................................................................... 54
1.13.1 Network indication ...................................................................................................................... 54
1.13.2 Antenna supervisor ..................................................................................................................... 54
1.13.3 Jamming detection ...................................................................................................................... 54
1.13.4 Dual stack IPv4/IPv6 ..................................................................................................................... 55
1.13.5 TCP/IP and UDP/IP ....................................................................................................................... 55
1.13.6 FTP .............................................................................................................................................. 55
1.13.7 HTTP ........................................................................................................................................... 55
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1.13.8 SSL / TLS ...................................................................................................................................... 56
1.13.9 Bearer Independent Protocol ....................................................................................................... 57
1.13.10 AssistNow clients and GNSS integration ................................................................................... 57
1.13.11 Hybrid positioning and CellLocate® .......................................................................................... 58
1.13.12 Wi-Fi integration ...................................................................................................................... 60
1.13.13 Firmware update Over AT (FOAT)............................................................................................. 60
1.13.14 Firmware update Over The Air (FOTA) ...................................................................................... 60
1.13.15 Smart temperature management ............................................................................................. 61
1.13.16 Power saving ........................................................................................................................... 63
2 Design-in ..................................................................................................................... 64
2.1 Overview ............................................................................................................................................ 64
2.2 Supply interfaces ................................................................................................................................ 65
2.2.1 Module supply (VCC) .................................................................................................................. 65
2.2.2 RTC supply output (V_BCKP) ....................................................................................................... 79
2.2.3 Generic digital interfaces supply output (V_INT) ........................................................................... 81
2.3 System functions interfaces ................................................................................................................ 82
2.3.1 Module power-on (PWR_ON) ...................................................................................................... 82
2.3.2 Module reset (RESET_N) .............................................................................................................. 83
2.3.3 Module / host configuration selection ......................................................................................... 84
2.4 Antenna interface ............................................................................................................................... 85
2.4.1 Antenna RF interfaces (ANT1 / ANT2) .......................................................................................... 85
2.4.2 Antenna detection interface (ANT_DET) ...................................................................................... 92
2.5 SIM interface ...................................................................................................................................... 94
2.5.1 Guidelines for SIM circuit design.................................................................................................. 94
2.5.2 Guidelines for SIM layout design ................................................................................................. 99
2.6 Data communication interfaces ........................................................................................................ 100
2.6.1 UART interface .......................................................................................................................... 100
2.6.2 USB interface............................................................................................................................. 105
2.6.3 DDC (I2C) interface .................................................................................................................... 107
2.6.4 SDIO interface ........................................................................................................................... 111
2.7 Audio interface ................................................................................................................................. 112
2.7.1 Digital audio interface ............................................................................................................... 112
2.8 General Purpose Input/Output .......................................................................................................... 116
2.9 Reserved pins (RSVD) ........................................................................................................................ 117
2.10 Module placement ........................................................................................................................ 117
2.11 Module footprint and paste mask ................................................................................................. 118
2.12 Thermal guidelines ........................................................................................................................ 119
2.13 ESD guidelines .............................................................................................................................. 120
2.13.1 ESD immunity test overview ...................................................................................................... 120
2.14 Schematic for TOBY-R2 series module integration ......................................................................... 121
2.14.1 Schematic for TOBY-R2 series module “02” product version ..................................................... 121
2.15 Design-in checklist ........................................................................................................................ 122
2.15.1 Schematic checklist ................................................................................................................... 122
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2.15.2 Layout checklist ......................................................................................................................... 123
2.15.3 Antenna checklist ...................................................................................................................... 123
3 Handling and soldering ........................................................................................... 124
3.1 Packaging, shipping, storage and moisture preconditioning ............................................................. 124
3.2 Handling ........................................................................................................................................... 124
3.3 Soldering .......................................................................................................................................... 125
3.3.1 Soldering paste.......................................................................................................................... 125
3.3.2 Reflow soldering ....................................................................................................................... 125
3.3.3 Optical inspection ...................................................................................................................... 126
3.3.4 Cleaning .................................................................................................................................... 126
3.3.5 Repeated reflow soldering ......................................................................................................... 127
3.3.6 Wave soldering.......................................................................................................................... 127
3.3.7 Hand soldering .......................................................................................................................... 127
3.3.8 Rework ...................................................................................................................................... 127
3.3.9 Conformal coating .................................................................................................................... 127
3.3.10 Casting ...................................................................................................................................... 127
3.3.11 Grounding metal covers ............................................................................................................ 127
3.3.12 Use of ultrasonic processes ........................................................................................................ 127
4 Approvals .................................................................................................................. 128
4.1 Product certification approval overview ............................................................................................. 128
4.2 US Federal Communications Commission notice ............................................................................... 129
4.2.1 Safety warnings review the structure ......................................................................................... 129
4.2.2 Declaration of Conformity ......................................................................................................... 129
4.2.3 Modifications ............................................................................................................................ 129
4.3 Industry Canada notice ..................................................................................................................... 130
4.3.1 Declaration of Conformity ......................................................................................................... 130
4.3.2 Modifications ............................................................................................................................ 131
4.4 R&TTED / RED and European Conformance CE mark ........................................................................ 133
5 Product testing ......................................................................................................... 134
5.1 u-blox in-series production test ......................................................................................................... 134
5.2 Test parameters for OEM manufacturer ............................................................................................ 135
5.2.1 “Go/No go” tests for integrated devices .................................................................................... 135
5.2.2 RF functional tests ..................................................................................................................... 135
Appendix ........................................................................................................................ 137
A Migration between TOBY-L2 and TOBY-R2 ............................................................ 137
A.1 Overview .......................................................................................................................................... 137
A.2 Pin-out comparison between TOBY-L2 and TOBY-R2 ........................................................................ 139
A.3 Schematic for TOBY-L2 and TOBY-R2 integration ............................................................................. 141
B Glossary .................................................................................................................... 142
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Related documents......................................................................................................... 144
Revision history .............................................................................................................. 145
Contact ............................................................................................................................ 146
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TOBY-R2 series - System Integration Manual
Model
Region
Radio Access Technology
Positioning
Interfaces
Audio
Features
Grade
LTE Bands*
UMTS Bands
GSM Bands
GNSS via modem
AssistNow Software
CellLocate
®
UART
USB 2.0
SDIO
DDC (I
2
C)
GPIOs
Analog audio
Digital audio
Network indication
Antenna supervisor
Rx Diversity
Jamming detection
Embedded TCP/UDP stack
Embedded HTTP,FTP,SSL
FOTA
Dual stack IPv4/IPv6
Standard
Professional
Automotive
TOBY-R200
North
America
2,4,
5,12
850,900,
1900,2100
Quad
● ● ● ● ● ● ●
● ● ● ●
● ● ● ● ●
●
TOBY-R201
North
America
2,4,5,
12,13
850,1900
● ● ● ● ● ● ●
● ● ● ● ● ● ● ● ● ●
TOBY-R202
North
America
2,4,
5,12
850,1900
● ● ● ● ● ● ●
● ● ● ● ● ● ● ● ● ●
* = LTE band 12 is a superset that includes band 17
1 System description
1.1 Overview
The TOBY-R2 series comprises LTE Cat 1 / 3G / 2G multi-mode modules supporting up to five LTE bands, up to
four 3G UMTS/HSPA bands and up to four 2G GSM/(E)GPRS bands for voice and/or data transmission in the
small TOBY LGA form-factor (35.6 x 24.8 mm), easy to integrate in compact designs:
TOBY-R200 are designed for worldwide operation, and primarily in North America (on AT&T network)
TOBY-R201 are designed primarily for operation in North America (on AT&T / Verizon network)
TOBY-R202 are designed primarily for operation in North America (on AT&T network)
TOBY-R2 series modules are form-factor compatible with u-blox SARA, LISA and LARA cellular module families
and are pin-to-pin compatible with u-blox TOBY-L cellular module families: this facilitates easy migration from
the u-blox GSM/GPRS, CDMA, UMTS/HSPA, and LTE high data rate modules, maximizes the investments of
customers, simplifies logistics, and enables very short time-to-market.
The modules are ideal for applications that are transitioning to LTE from 2G and 3G, due to the long term
availability and scalability of LTE networks.
With a range of interface options and an integrated IP stack, the modules are designed to support a wide range
of data-centric applications. The unique combination of performance and flexibility make these modules ideally
suited for medium speed M2M applications, such as smart energy gateways, remote access video cameras,
digital signage, telehealth and telematics.
TOBY-R2 series modules support Voice over LTE (VoLTE) and voice service over 3G (CSFB) for applications that
require voice, such as security and surveillance systems.
Table 1 summarizes the main features and interfaces of TOBY-R2 series modules.
Table 1: TOBY-R2 series main features summary
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4G LTE
3G UMTS/HSDPA/HSUPA
2G GSM/GPRS/EDGE
3GPP Release 9
Long Term Evolution (LTE)
Evolved Uni.Terrestrial Radio Access (E-UTRA)
Frequency Division Duplex (FDD)
DL Rx Diversity
3GPP Release 9
High Speed Packet Access (HSPA)
UMTS Terrestrial Radio Access (UTRA)
Frequency Division Duplex (FDD)
DL Rx diversity
3GPP Release 9
Enhanced Data rate GSM Evolution (EDGE)
GSM EGPRS Radio Access (GERA)
Time Division Multiple Access (TDMA)
DL Advanced Rx Performance
Band support1:
TOBY-R200:
Band 12 (700 MHz)
2
Band 5 (850 MHz)
Band 4 (1700 MHz)
Band 2 (1900 MHz)
TOBY-R201:
Band 12 (700 MHz)
2
Band 13 (750 MHz)
Band 5 (850 MHz)
Band 4 (1700 MHz)
Band 2 (1900 MHz)
TOBY-R202:
Band 12 (700 MHz)
2
Band 5 (850 MHz)
Band 4 (1700 MHz)
Band 2 (1900 MHz)
Band support:
TOBY-R200:
Band 5 (850 MHz)
Band 8 (900 MHz)
Band 2 (1900 MHz)
Band 1 (2100 MHz)
TOBY-R201:
Band 5 (850 MHz)
Band 2 (1900 MHz)
TOBY-R202:
Band 5 (850 MHz)
Band 2 (1900 MHz)
Band support:
TOBY-R200:
GSM 850 MHz
E-GSM 900 MHz
DCS 1800 MHz
PCS 1900 MHz
LTE Power Class
Class 3 (23 dBm)
UMTS/HSDPA/HSUPA Power Class
Class 3 (24 dBm)
GSM/GPRS (GMSK) Power Class
Class 4 (33 dBm) for GSM/E-GSM band
Class 1 (30 dBm) for DCS/PCS band
EDGE (8-PSK) Power Class
Class E2 (27 dBm) for GSM/E-GSM band
Class E2 (26 dBm) for DCS/PCS band
Data rate
LTE category 1:
up to 10.3 Mb/s DL, 5.2 Mb/s UL
Data Rate
HSDPA category 8:
up to 7.2 Mb/s DL
HSUPA category 6:
up to 5.76 Mb/s UL
Data Rate3
GPRS multi-slot class 12
4
, CS1-CS4,
up to 85.6 kb/s DL/UL
EDGE multi-slot class 12
4
, MCS1-MCS9,
up to 236.8 kb/s DL/UL
1
2
3
4
Table 2 reports a summary of cellular radio access technologies characteristics and features of the modules.
Table 2: TOBY-R2 series LTE, 3G and 2G characteristics summary
TOBY-R2 modules provide Voice over LTE (VoLTE) as well as Circuit-Switched-Fall-Back (CSFB) audio capability.
TOBY-R2 series modules support all the E-UTRA channel bandwidths for each operating band according to 3GPP TS 36.521-1 [21].
LTE band 12 is a superset that includes band 17
GPRS/EDGE multi-slot class determines the number of timeslots available for upload and download and thus the speed at which data can
be transmitted and received, with higher classes typically allowing faster data transfer rates.
GPRS/EDGE multi-slot class 12 implies a maximum of 4 slots in DL (reception) and 4 slots in UL (transmission) with 5 slots in total.
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Cellular
Base-band
Processor
Memory
Power Management Unit
26 MHz
32.768 kHz
ANT1
RF
Transceiver
ANT2
V_INT (I/O)
V_BCKP (RTC)
VCC (Supply)
SIM
USB
GPIO
Power On
External Reset
PAs
LNAs Filters
Filters
Duplexer
Filters
PAs
LNAs Filters
Filters
Duplexer
Filters
LNAs FiltersFilters
LNAs FiltersFilters
Switch
Switch
DDC(I2C)
SDIO
UART
Digital audio (I2S)
ANT_DET
Host Select
1.2 Architecture
Figure 1 summarizes the internal architecture of TOBY-R2 series modules.
Figure 1: TOBY-R2 series modules simplified block diagram
TOBY-R2 series modules internally consists of the RF, Baseband and Power Management sections here described
with more details than the simplified block diagrams of Figure 1.
RF section
The RF section is composed of RF transceiver, PAs, LNAs, crystal oscillator, filters, duplexers and RF switches.
Tx signal is pre-amplified by RF transceiver, then output to the primary antenna input/output port (ANT1) of the
module via power amplifier (PA), SAW band pass filters band, specific duplexer and antenna switch.
Dual receiving paths are implemented according to LTE Receiver Diversity radio technology supported by the
modules as LTE category 1 User Equipments: incoming signal is received through the primary (ANT1) and the
secondary (ANT2) antenna input ports which are connected to the RF transceiver via specific antenna switch,
diplexer, duplexer, LNA, SAW band pass filters.
RF transceiver performs modulation, up-conversion of the baseband I/Q signals for Tx, down-conversion and
demodulation of the dual RF signals for Rx. The RF transceiver contains:
Single chain high linearity receivers with integrated LNAs for multi band multi mode operation,
Highly linear RF demodulator / modulator capable GMSK, 8-PSK, QPSK, 16-QAM,
RF synthesizer,
VCO.
Power Amplifiers (PA) amplify the Tx signal modulated by the RF transceiver
RF switches connect primary (ANT1) and secondary (ANT2) antenna ports to the suitable Tx / Rx path
SAW duplexers and band pass filters separate the Tx and Rx signal paths and provide RF filtering
26 MHz voltage-controlled temperature-controlled crystal oscillator generates the clock reference in
active-mode or connected-mode.
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Baseband and power management section
The Baseband and Power Management section is composed of the following main elements:
A mixed signal ASIC, which integrates
Microprocessor for control functions
DSP core for cellular Layer 1 and digital processing of Rx and Tx signal paths
Memory interface controller
Dedicated peripheral blocks for control of the USB, SIM and generic digital interfaces
Interfaces to RF transceiver ASIC
Memory system, which includes NAND flash and LPDDR2 RAM
Voltage regulators to derive all the subsystem supply voltages from the module supply input VCC
Voltage sources for external use: V_BCKP and V_INT
Hardware power on
Hardware reset
Low power idle-mode support
32.768 kHz crystal oscillator to provide the clock reference in the low power idle-mode, which can be set by
enable power saving configuration using the AT+UPSV command.
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Function
Pin Name
Pin No
I/O
Description
Remarks
Power
VCC
70,71,72
I
Module supply input
VCC supply circuit affects the RF performance and
compliance of the device integrating the module with
applicable required certification schemes.
See section 1.5.1 for functional description / requirements.
See section 2.2.1 for external circuit design-in.
GND
2, 30, 32, 44,
46, 69, 73, 74,
76, 78, 79, 80,
82, 83, 85, 86,
88-90, 92-152
N/A
Ground
GND pins are internally connected each other.
External ground connection affects the RF and thermal
performance of the device.
See section 1.5.1 for functional description.
See section 2.2.1 for external circuit design-in.
V_BCKP
3
I/O
RTC supply
input/output
V_BCKP = 1.8 V (typical) generated by internal regulator
when valid VCC supply is present.
See section 1.5.2 for functional description.
See section 2.2.2 for external circuit design-in.
V_INT
5 O Generic digital
interfaces supply
output
V_INT = 1.8 V (typical) generated by internal DC/DC
regulator when the module is switched on.
Test-Point for diagnostic access is recommended.
See section 1.5.3 for functional description.
See section 2.2.3 for external circuit design-in.
System
PWR_ON
20 I Power-on input
Internal 10 k pull-up resistor to V_BCKP.
See section 1.6.1 for functional description.
See section 2.3.1 for external circuit design-in.
RESET_N
23 I External reset input
Internal 10 k pull-up resistor to V_BCKP.
Test-Point for diagnostic access is recommended.
See section 1.6.3 for functional description.
See section 2.3.2 for external circuit design-in.
HOST_SELECT0
26
I/O
Selection of module
/ host configuration
Not supported.
See section 1.6.4 for functional description.
See section 2.3.3 for external circuit design-in.
HOST_SELECT1
62
I/O
Selection of module
/ host configuration
Not supported.
See section 1.6.4 for functional description.
See section 2.3.3 for external circuit design-in.
Antennas
ANT1
81
I/O
Primary antenna
Main Tx / Rx antenna interface.
50 nominal characteristic impedance.
Antenna circuit affects the RF performance and application
device compliance with required certification schemes.
See section 1.7 for functional description / requirements.
See section 2.4 for external circuit design-in.
ANT2
87 I Secondary antenna
Rx only for Rx diversity.
50 nominal characteristic impedance.
Antenna circuit affects the RF performance and application
device compliance with required certification schemes.
See section 1.7 for functional description / requirements
See section 2.4 for external circuit design-in.
ANT_DET
75 I Antenna detection
ADC for antenna presence detection function
See section 1.7.2 for functional description.
See section 2.4.2 for external circuit design-in.
1.3 Pin-out
Table 3 lists the pin-out of the TOBY-R2 series modules, with pins grouped by function.
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Function
Pin Name
Pin No
I/O
Description
Remarks
SIM
VSIM
59 O SIM supply output
VSIM = 1.8 V / 3 V output as per the connected SIM type.
See section 1.8 for functional description.
See section 2.5 for external circuit design-in.
SIM_IO
57
I/O
SIM data
Data input/output for 1.8 V / 3 V SIM
Internal 4.7 k pull-up to VSIM.
See section 1.8 for functional description.
See section 2.5 for external circuit design-in.
SIM_CLK
56 O SIM clock
3.25 MHz clock output for 1.8 V / 3 V SIM
See section 1.8 for functional description.
See section 2.5 for external circuit design-in.
SIM_RST
58 O SIM reset
Reset output for 1.8 V / 3 V SIM
See section 1.8 for functional description.
See section 2.5 for external circuit design-in.
UART
RXD
17 O UART data output
1.8 V output, Circuit 104 (RXD) in ITU-T V.24,
for AT commands, data communication, FOAT, FW update
by u-blox EasyFlash tool and diagnostic.
Test-Point and series 0 for diagnostic access recommended.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.
TXD
16 I UART data input
1.8 V input, Circuit 103 (TXD) in ITU-T V.24,
for AT commands, data communication, FOAT, FW update
by u-blox EasyFlash tool and diagnostic.
Internal active pull-up to V_INT.
Test-Point and series 0 for diagnostic access recommended.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.
CTS
15 O UART clear to send
output
1.8 V output, Circuit 106 (CTS) in ITU-T V.24.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.
RTS
14 I UART ready to send
input
1.8 V input, Circuit 105 (RTS) in ITU-T V.24.
Internal active pull-up to V_INT.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.
DSR
10
O
UART data set ready
output
1.8 V, Circuit 107 in ITU-T V.24.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.
RI
11
O
UART ring indicator
output
1.8 V, Circuit 125 in ITU-T V.24.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.
DTR
13
I
UART data terminal
ready input
1.8 V, Circuit 108/2 in ITU-T V.24.
Internal active pull-up to V_INT.
Test-Point and series 0 for diagnostic access recommended.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.
DCD
12
O
UART data carrier
detect output
1.8 V, Circuit 109 in ITU-T V.24.
Test-Point and series 0 for diagnostic access recommended.
See section 1.9.1 for functional description.
See section 2.6.1 for external circuit design-in.
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Function
Pin Name
Pin No
I/O
Description
Remarks
USB
VUSB_DET
4 I USB detect input
VBUS (5 V typical) USB supply generated by the host must
be connected to this input pin to enable the USB interface.
If the USB interface is not used by the Application Processor,
Test-Point for diagnostic / FW update access is recommended
See section 1.9.2 for functional description.
See section 2.6.2 for external circuit design-in.
USB_D-
27
I/O
USB Data Line D-
USB interface for AT commands, data communication,
FOAT, FW update by u-blox EasyFlash tool and diagnostic.
90 nominal differential impedance (Z0)
30 nominal common mode impedance (Z
CM
)
Pull-up or pull-down resistors and external series resistors as
required by the USB 2.0 specifications [6] are part of the
USB pin driver and need not be provided externally.
If the USB interface is not used by the Application Processor,
Test-Point for diagnostic / FW update access is recommended.
See section 1.9.2 for functional description.
See section 2.6.2 for external circuit design-in.
USB_D+
28
I/O
USB Data Line D+
USB interface for AT commands, data communication,
FOAT, FW update by u-blox EasyFlash tool and diagnostic.
90 nominal differential impedance (Z0)
30 nominal common mode impedance (Z
CM
)
Pull-up or pull-down resistors and external series resistors as
required by the USB 2.0 specifications [6] are part of the
USB pin driver and need not be provided externally.
If the USB interface is not used by the Application Processor,
Test-Point for diagnostic / FW update access is recommended.
See section 1.9.2 for functional description.
See section 2.6.2 for external circuit design-in.
DDC
SCL
54 O I2C bus clock line
1.8 V open drain, for communication with I2C-slave devices.
See section 1.9.3 for functional description.
See section 2.6.3 for external circuit design-in.
SDA
55
I/O
I2C bus data line
1.8 V open drain, for communication with I2C-slave devices.
See section 1.9.3 for functional description.
See section 2.6.3 for external circuit design-in.
SDIO
SDIO_D0
66
I/O
SDIO serial data [0]
Not supported by “02” product versions.
SDIO interface for communication with u-blox Wi-Fi module
See section 1.9.4 for functional description.
See section 2.6.4 for external circuit design-in.
SDIO_D1
68
I/O
SDIO serial data [1]
Not supported by “02” product versions.
SDIO interface for communication with u-blox Wi-Fi module
See section 1.9.4 for functional description.
See section 2.6.4 for external circuit design-in.
SDIO_D2
63
I/O
SDIO serial data [2]
Not supported by “02” product versions.
SDIO interface for communication with u-blox Wi-Fi module
See section 1.9.4 for functional description.
See section 2.6.4 for external circuit design-in.
SDIO_D3
67
I/O
SDIO serial data [3]
Not supported by “02” product versions.
SDIO interface for communication with u-blox Wi-Fi module
See section 1.9.4 for functional description.
See section 2.6.4 for external circuit design-in.
SDIO_CLK
64 O SDIO serial clock
Not supported by “02” product versions.
SDIO interface for communication with u-blox Wi-Fi module
See section 1.9.4 for functional description.
See section 2.6.4 for external circuit design-in.
SDIO_CMD
65
I/O
SDIO command
Not supported by “02” product versions.
SDIO interface for communication with u-blox Wi-Fi module
See section 1.9.4 for functional description.
See section 2.6.4 for external circuit design-in.
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Function
Pin Name
Pin No
I/O
Description
Remarks
Audio
I2S_TXD
51
O /
I/O
I2S transmit data /
GPIO
I2S transmit data output, alternatively configurable as GPIO.
See sections 1.10 and 1.11 for functional description.
See sections 2.7 and 2.8 for external circuit design-in.
I2S_RXD
53
I /
I/O
I2S receive data /
GPIO
I2S receive data input, alternatively configurable as GPIO.
See sections 1.10 and 1.11 for functional description.
See sections 2.7 and 2.8 for external circuit design-in.
I2S_CLK
52
I/O /
I/O
I2S clock /
GPIO
I2S serial clock, alternatively configurable as GPIO.
See sections 1.10 and 1.11 for functional description.
See sections 2.7 and 2.8 for external circuit design-in.
I2S_WA
50
I/O /
I/O
I2S word alignment /
GPIO
I2S word alignment, alternatively configurable as GPIO.
See sections 1.10 and 1.11 for functional description.
See sections 2.7 and 2.8 for external circuit design-in.
GPIO
GPIO1
21
I/O
GPIO
1.8 V GPIO with alternatively configurable functions.
See section 1.11 for functional description.
See section 2.8 for external circuit design-in.
GPIO2
22
I/O
GPIO
1.8 V GPIO with alternatively configurable functions.
See section 1.11 for functional description.
See section 2.8 for external circuit design-in.
GPIO3
24
I/O
GPIO
1.8 V GPIO with alternatively configurable functions.
See section 1.11 for functional description.
See section 2.8 for external circuit design-in.
GPIO4
25
I/O
GPIO
1.8 V GPIO with alternatively configurable functions.
See section 1.11 for functional description.
See section 2.8 for external circuit design-in.
GPIO5
60
I/O
GPIO
1.8 V GPIO with alternatively configurable functions.
See section 1.11 for functional description.
See section 2.8 for external circuit design-in.
GPIO6
61
I/O
GPIO
1.8 V GPIO with alternatively configurable functions.
See section 1.11 for functional description.
See section 2.8 for external circuit design-in.
Reserved
RSVD
6
N/A
Reserved pin
This pin must be connected to ground.
See sections 1.12 and 2.9
RSVD
18, 19
N/A
Reserved pin
Test-Point for diagnostic access is recommended.
See sections 1.12 and 2.9
RSVD
1, 7-9, 29,
31, 33-43,
45, 47-49,
77, 84, 91
N/A
Reserved pin
Leave unconnected.
See sections 1.12 and 2.9
Table 3: TOBY-R2 series module pin definition, grouped by function
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General Status
Operating Mode
Definition
Power-down
Not-Powered Mode
VCC supply not present or below operating range: module is switched off.
Power-Off Mode
VCC supply within operating range and module is switched off.
Normal Operation
Idle-Mode
Module processor core runs with 32 kHz reference generated by the internal oscillator.
Active-Mode
Module processor core runs with 26 MHz reference generated by the internal oscillator.
Connected-Mode
RF Tx/Rx data connection enabled and processor core runs with 26 MHz reference.
Mode
Description
Transition between operating modes
Not-Powered
Module is switched off.
Application interfaces are not accessible.
When VCC supply is removed, the modules enter not-powered mode.
When in not-powered mode, the modules cannot be switched on by
PWR_ON, RESET_N or RTC alarm
When in not-powered mode, the modules can be switched on by
applying VCC supply (see 1.6.1) so that the modules switch from notpowered to active-mode
Power-Off
Module is switched off: normal shutdown by an
appropriate power-off event (see 1.6.2).
Application interfaces are not accessible.
When the modules are switched off by an appropriate power-off event
(see 1.6.2), the modules enter power-off mode from active-mode.
When in power-off mode, the modules can be switched on by
PWR_ON, RESET_N or an RTC alarm.
When in power-off mode, the modules enter not-powered mode by
removing VCC supply.
Idle
Module is switched on with application
interfaces temporarily disabled or suspended:
the module is temporarily not ready to
communicate with an external device by means
of the application interfaces as configured to
reduce the current consumption.
The module enters the low power idle-mode
whenever possible if power saving is enabled by
AT+UPSV (see u-blox AT Commands Manual [2])
reducing current consumption (see 1.5.1.5).
The CTS output line indicates when the UART
interface is disabled/enabled due to the module
idle/active-mode according to power saving and
HW flow control settings (see 1.9.1.3, 1.9.1.4).
Power saving configuration is not enabled by
default: it can be enabled by AT+UPSV (see the
u-blox AT Commands Manual [2]).
The modules automatically switch from the active-mode to low power
idle-mode whenever possible if power saving is enabled (see sections
1.5.1.5, 1.9.1.4, 1.9.2.4 and u-blox AT Commands Manual [2],
AT+UPSV command).
The modules wake up from low power idle-mode to active-mode in the
following events:
Automatic periodic monitoring of the paging channel for the
paging block reception according to network conditions (see
1.5.1.5, 1.9.1.4)
Automatic periodic enable of the UART interface to receive / send
data, with AT+UPSV=1 (see 1.9.1.4)
Data received over UART, according to HW flow control (AT&K)
and power saving (AT+UPSV) settings (see 1.9.1.4)
RTS input set ON by the host DTE, with HW flow control disabled
and AT+UPSV=2 (see 1.9.1.4)
DTR input set ON by the host DTE, with AT+UPSV=3 (see 1.9.1.4)
USB detection, applying 5 V (typ.) to VUSB_DET input (see 1.9.2)
The connected USB host forces a remote wakeup of the module as
USB device (see 1.9.2.4)
The connected u-blox GNSS receiver forces a wakeup of the
cellular module using the GNSS Tx data ready function over GPIO3
(see 1.9.3)
The connected SDIO device forces a wakeup of the module as
SDIO host (see 1.9.4)
A preset RTC alarm occurs (see u-blox AT Commands Manual [2],
AT+CALA)
1.4 Operating modes
TOBY-R2 series modules have several operating modes. The operating modes are defined in Table 4 and
described in detail in Table 5, providing general guidelines for operation.
Table 4: TOBY-R2 series modules operating modes definition
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Mode
Description
Transition between operating modes
Active
Module is switched on with application
interfaces enabled or not suspended: the
module is ready to communicate with an
external device by means of the application
interfaces unless power saving configuration is
enabled by AT+UPSV (see 1.9.1.4, 1.9.2.4 and
u-blox AT Commands Manual [2]).
When the modules are switched on by an appropriate power-on event
(see 1.6.1), the module enter active-mode from not-powered or
power-off mode.
If power saving configuration is enabled by the AT+UPSV command,
the module automatically switches from active to idle-mode whenever
possible and the module wakes up from idle to active-mode in the
events listed above (see idle-mode to active-mode transition description
above).
When a RF Tx/Rx data or voice connection is initiated or when RF Tx/Rx
is required due to a connection previously initiated, the module
switches from active to connected-mode.
Connected
RF Tx/Rx data connection is in progress.
The module is prepared to accept data signals
from an external device unless power saving
configuration is enabled by AT+UPSV (see
sections 1.9.1.4, 1.9.2.4 and u-blox AT
Commands Manual [2]).
When a data or voice connection is initiated, the module enters
connected-mode from active-mode.
Connected-mode is suspended if Tx/Rx data is not in progress, due to
connected discontinuous reception and fast dormancy capabilities of
the module and according to network environment settings and
scenario. In such case, the module automatically switches from
connected to active mode and then, if power saving configuration is
enabled by the AT+UPSV command, the module automatically switches
to idle-mode whenever possible. Vice-versa, the module wakes up from
idle to active mode and then connected mode if RF Tx/Rx is necessary.
When a data connection is terminated, the module returns to the
active-mode.
Switch ON:
• Apply VCC
If power saving is enabled
and there is no activity for
a defined time interval
Any wake up event described
in the module operating
modes summary table above
Incoming/outgoing call or
other dedicated device
network communication
No RF Tx/Rx in progress,
Call terminated,
Communication dropped
Remove VCC
Switch ON:
• PWR_ON
• RTC alarm
• RESET_N
Not
powered
Power off
ActiveConnected Idle
Switch OFF:
• AT+CPWROFF
Table 5: TOBY-R2 series modules operating modes description
Figure 2 describes the transition between the different operating modes.
Figure 2: TOBY-R2 series modules operating modes transitions
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72
VCC
71
VCC
70
VCC
TOBY-R201 / TOBY-R202
Power
Management
Unit
Memory
Baseband
Processor
Transceiver
RF PMU
LTE/3G PAs
72
VCC
71
VCC
70
VCC
TOBY-R200
Power
Management
Unit
Memory
Baseband
Processor
Transceiver
RF PMU
LTE/3G/2G PAs
1.5 Supply interfaces
1.5.1 Module supply input (VCC)
The modules must be supplied via the three VCC pins that represent the module power supply input.
The VCC pins are internally connected to the RF power amplifier and to the integrated Power Management Unit:
all supply voltages needed by the module are generated from the VCC supply by integrated voltage regulators,
including V_BCKP Real Time Clock supply, V_INT digital interfaces supply and VSIM SIM card supply.
During operation, the current drawn by the TOBY-R2 series modules through the VCC pins can vary by several
orders of magnitude. This ranges from the pulse of current consumption during GSM transmitting bursts at
maximum power level in connected-mode (as described in section 1.5.1.2) to the low current consumption
during low power idle-mode with power saving enabled (as described in section 1.5.1.5).
TOBY-R200 modules provide separate supply inputs over the three VCC pins:
VCC pins #71 and #72 represent the supply input for the internal RF power amplifier, demanding most of
the total current drawn of the module when RF transmission is enabled during a voice/data call
VCC pin #70 represents the supply input for the internal baseband Power Management Unit and the internal
transceiver, demanding minor part of the total current drawn of the module when RF transmission is
enabled during a voice/data call
Figure 3 provides a simplified block diagram of TOBY-R2 series modules internal VCC supply routing.
Figure 3: TOBY-R2 series modules internal VCC supply routing simplified block diagram
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Item
Requirement
Remark
VCC nominal voltage
Within VCC normal operating range:
3.30 V min. / 4.40 V max
RF performance is guaranteed when VCC PA voltage is
inside the normal operating range limits.
RF performance may be affected when VCC PA voltage is
outside the normal operating range limits, though the
module is still fully functional until the VCC voltage is
inside the extended operating range limits.
VCC voltage during
normal operation
Within VCC extended operating range:
3.00 V min. / 4.50 V max
VCC voltage must be above the extended operating range
minimum limit to switch-on the module.
The module may switch-off when the VCC voltage drops
below the extended operating range minimum limit.
Operation above VCC extended operating range is not
recommended and may affect device reliability.
VCC average current
Support with adequate margin the highest averaged
VCC current consumption value in connected-mode
conditions specified in TOBY-R2 Data Sheet [1].
The maximum average current consumption can be
greater than the specified value according to the actual
antenna mismatching, temperature and supply voltage.
Sections 1.5.1.2, 1.5.1.3 and 1.5.1.4 describe current
consumption profiles in 2G, 3G and LTE connected-mode.
VCC peak current
Support with margin the highest peak VCC current
consumption value in connected-mode conditions
specified in TOBY-R2 Data Sheet [1]
The specified maximum peak of current consumption
occurs during GSM single transmit slot in 850/900 MHz
connected-mode, in case of mismatched antenna.
Section 1.5.1.2 describes 2G Tx peak/pulse current.
VCC voltage drop
during 2G Tx slots
Lower than 400 mV
Supply voltage drop values greater than recommended
during 2G TDMA transmission slots directly affect the RF
compliance with applicable certification schemes.
Figure 5 describes supply voltage drop during 2G Tx slots.
VCC voltage ripple
during 2G/3G/LTE Tx
Noise in the supply has to be minimized
High supply voltage ripple values during LTE/3G/2G RF
transmissions in connected-mode directly affect the RF
compliance with applicable certification schemes.
Figure 5 describes supply voltage ripple during RF Tx.
VCC under/over-shoot
at start/end of Tx slots
Absent or at least minimized
Supply voltage under-shoot or over-shoot at the start or
the end of 2G TDMA transmission slots directly affect the
RF compliance with applicable certification schemes.
Figure 5 describes supply voltage under/over-shoot
1.5.1.1 VCC supply requirements
Table 6 summarizes the requirements for the VCC modules supply. See section 2.2.1 for suggestions to properly
design a VCC supply circuit compliant with the requirements listed in Table 6.
The supply circuit affects the RF compliance of the device integrating TOBY-R2 series modules
with applicable required certification schemes as well as antenna circuit design. Compliance is
guaranteed if the requirements summarized in the Table 6 are fulfilled.
Table 6: Summary of VCC modules supply requirements
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Time [ms]
RX
slot
unused
slot
unused
slot
TX
slot
unused
slot
unused
slot
MON
slot
unused
slot
RX
slot
unused
slot
unused
slot
TX
slot
unused
slot
unused
slot
MON
slot
unused
slot
GSM frame
4.615 ms
(1 frame = 8 slots)
Current [A]
200 mA
60-120 mA
1900 mA
Peak current depends
on TX power and
actual antenna load
GSM frame
4.615 ms
(1 frame = 8 slots)
60-120 mA
10-40 mA
0.0
1.5
1.0
0.5
2.0
2.5
Time [ms]
undershoot
overshoot
ripple
drop
Voltage [mV]
3.8 V
(typ)
RX
slot
unused
slot
unused
slot
TX
slot
unused
slot
unused
slot
MON
slot
unused
slot
RX
slot
unused
slot
unused
slot
TX
slot
unused
slot
unused
slot
MON
slot
unused
slot
GSM frame
4.615 ms
(1 frame = 8 slots)
GSM frame
4.615 ms
(1 frame = 8 slots)
1.5.1.2 VCC current consumption in 2G connected-mode
When a GSM call is established, the VCC module current consumption is determined by the current
consumption profile typical of the GSM transmitting and receiving bursts.
The peak of current consumption during a transmission slot is strictly dependent on the RF transmitted power,
which is regulated by the network (the current base station). The transmitted power in the transmit slot is also
the more relevant factor for determining the average current consumption.
If the module is transmitting in 2G single-slot mode in the 850 or 900 MHz bands, at the maximum RF power
level (approximately 2 W or 33 dBm in the allocated transmit slot/burst) the current consumption can reach an
high peak (see the “Current consumption” section in the TOBY-R2 series Data Sheet [1]) for 576.9 µs (width of
the transmit slot/burst) with a periodicity of 4.615 ms (width of 1 frame = 8 slots/burst), so with a 1/8 duty cycle
according to GSM TDMA (Time Division Multiple Access).
If the module is transmitting in 2G single-slot mode in the 1800 or 1900 MHz bands, the current consumption
figures are quite less high than the one in the low bands, due to 3GPP transmitter output power specifications.
During a GSM call, current consumption is not so significantly high in receiving or in monitor bursts and is low in
the inactive unused bursts.
Figure 4 shows an example of the module current consumption profile versus time in 2G single-slot mode.
Figure 4: VCC current consumption profile versus time during a 2G single-slot call (1 TX slot, 1 RX slot)
Figure 5 illustrates VCC voltage profile versus time during a 2G single-slot call, according to the relative VCC
current consumption profile described in Figure 4.
Figure 5: VCC voltage profile versus time during a 2G single-slot call (1 TX slot, 1 RX slot)
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Time [ms]
RX
slot
unused
slot
TX
slot
TX
slot
TX
slot
TX
slot
MON
slot
unused
slot
RX
slot
unused
slot
TX
slot
TX
slot
TX
slot
TX
slot
MON
slot
unused
slot
GSM frame
4.615 ms
(1 frame = 8 slots)
Current [A]
200mA
60-130mA
Peak current depends
on TX power and
actual antenna load
GSM frame
4.615 ms
(1 frame = 8 slots)
1600 mA
0.0
1.5
1.0
0.5
2.0
2.5
When a GPRS connection is established, more than one slot can be used to transmit and/or more than one slot
can be used to receive. The transmitted power depends on network conditions, which set the peak current
consumption, but following the 3GPP specifications the maximum Tx RF power is reduced if more than one slot
is used to transmit, so the maximum peak of current is not as high as can be in case of a 2G single-slot call.
The multi-slot transmission power can be further reduced by configuring the actual Multi-Slot Power Reduction
profile with the dedicated AT command, AT+UDCONF=40 (see the u-blox AT Commands Manual [2]).
If the module transmits in GPRS class 12 in the 850 or 900 MHz bands, at the maximum RF power control level,
the current consumption can reach a quite high peak but lower than the one achievable in 2G single-slot mode.
This happens for 2.307 ms (width of the 4 transmit slots/bursts) with a periodicity of 4.615 ms (width of 1 frame
= 8 slots/bursts), so with a 1/2 duty cycle, according to 2G TDMA.
If the module is in GPRS connected mode in the 1800 or 1900 MHz bands, the current consumption figures are
quite less high than the one in the low bands, due to 3GPP transmitter output power specifications.
Figure 6 reports the current consumption profiles in GPRS class 12 connected mode, in the 850 or 900 MHz
bands, with 4 slots used to transmit and 1 slot used to receive.
Figure 6: VCC current consumption profile during a 2G GPRS/EDGE multi-slot connection (4 TX slots, 1 RX slot)
In case of EDGE connections the VCC current consumption profile is very similar to the GPRS current profile, so
the image shown in Figure 6, representing the current consumption profile in GPRS class 12 connected mode, is
valid for the EDGE class 12 connected mode as well.
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Time
[ms]
3G frame
10 ms
(1 frame = 15 slots)
Current [mA]
Current consumption value
depends on TX power and
actual antenna load
170 mA
1 slot
666 µs
850 mA
0
300
200
100
500
400
600
700
1.5.1.3 VCC current consumption in 3G connected mode
During a 3G connection, the module can transmit and receive continuously due to the Frequency Division Duplex
(FDD) mode of operation with the Wideband Code Division Multiple Access (WCDMA).
The current consumption depends on output RF power, which is always regulated by the network (the current
base station) sending power control commands to the module. These power control commands are logically
divided into a slot of 666 µs, thus the rate of power change can reach a maximum rate of 1.5 kHz.
There are no high current peaks as in the 2G connection, since transmission and reception are continuously
enabled due to FDD WCDMA implemented in the 3G that differs from the TDMA implemented in the 2G case.
In the worst scenario, corresponding to a continuous transmission and reception at maximum output power
(approximately 250 mW or 24 dBm), the average current drawn by the module at the VCC pins is considerable
(see the “Current consumption” section in TOBY-R2 series Data Sheet [1]). At the lowest output RF power
(approximately 0.01 µW or –50 dBm), the current drawn by the internal power amplifier is strongly reduced. The
total current drawn by the module at the VCC pins is due to baseband processing and transceiver activity.
Figure 7 shows an example of current consumption profile of the module in 3G WCDMA/DC-HSPA+ continuous
transmission mode.
Figure 7: VCC current consumption profile versus time during a 3G connection (TX and RX continuously enabled)
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Time
[ms]
Current [mA]
Current consumption value
depends on TX power and
actual antenna load
1 Slot
1 Resource Block
(0.5 ms)
1 LTE Radio Frame
(10 ms)
0
300
200
100
500
400
600
700
1.5.1.4 VCC current consumption in LTE connected-mode
During an LTE connection, the module can transmit and receive continuously due to the Frequency Division
Duplex (FDD) mode of operation used in LTE radio access technology.
The current consumption depends on output RF power, which is always regulated by the network (the current
base station) sending power control commands to the module. These power control commands are logically
divided into a slot of 0.5 ms (time length of one Resource Block), thus the rate of power change can reach a
maximum rate of 2 kHz.
The current consumption profile is similar to that in 3G radio access technology. Unlike the 2G connection
mode, which uses the TDMA mode of operation, there are no high current peaks since transmission and
reception are continuously enabled in FDD.
In the worst scenario, corresponding to a continuous transmission and reception at maximum output power
(approximately 250 mW or 24 dBm), the average current drawn by the module at the VCC pins is considerable
(see the “Current consumption” section in TOBY-R2 series Data Sheet [1]). At the lowest output RF power
(approximately 0.1 µW or –40 dBm), the current drawn by the internal power amplifier is strongly reduced and
the total current drawn by the module at the VCC pins is due to baseband processing and transceiver activity.
Figure 8 shows an example of the module current consumption profile versus time in LTE connected-mode.
Detailed current consumption values can be found in TOBY-R2 series Data Sheet [1].
Figure 8: VCC current consumption profile versus time during LTE connection (TX and RX continuously enabled)
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~50 ms
IDLE MODE ACTIVE MODE IDLE MODE
Active Mode
Enabled
Idle Mode
Enabled
2G case: 0.44-2.09 s
3G case: 0.61-5.09 s
LTE case: 0.27-2.51 s
IDLE MODE
~50 ms
ACTIVE MODE
Time [s]
Current [mA]
Time [ms]
Current [mA]
RX
Enabled
0
100
0
100
1.5.1.5 VCC current consumption in cyclic idle/active mode (power saving enabled)
The power saving configuration is by default disabled, but it can be enabled using the AT +UPSV command (see
the u-blox AT Commands Manual [2]). When power saving is enabled, the module automatically enters the low
power idle-mode whenever possible, reducing current consumption.
During low power idle-mode, the module processor runs with 32 kHz reference clock frequency.
When the power saving configuration is enabled and the module is registered or attached to a network , the
module automatically enters the low power idle-mode whenever possible, but it must periodically monitor the
paging channel of the current base station (paging block reception), in accordance to the 2G/3G/LTE system
requirements, even if connected-mode is not enabled by the application. When the module monitors the paging
channel, it wakes up to the active-mode, to enable the reception of paging block. In between, the module
switches to low power idle-mode. This is known as discontinuous reception (DRX).
The module processor core is activated during the paging block reception, and automatically switches its
reference clock frequency from 32 kHz to the 26 MHz used in active-mode.
The time period between two paging block receptions is defined by the network. This is the paging period
parameter, fixed by the base station through broadcast channel sent to all users on the same serving cell:
In case of 2G radio access technology, the paging period can vary from 470.8 ms (DRX = 2, length of 2 x 51
2G frames = 2 x 51 x 4.615 ms) up to 2118.4 ms (DRX = 9, length of 9 x 51 2G frames = 9 x 51 x 4.615 ms)
In case of 3G radio access technology, the paging period can vary from 640 ms (DRX = 6, i.e. length of 2
3G frames = 64 x 10 ms) up to 5120 ms (DRX = 9, length of 29 3G frames = 512 x 10 ms).
In case of LTE radio access technology, the paging period can vary from 320 ms (DRX = 5, i.e. length of 2
LTE frames = 32 x 10 ms) up to 2560 ms (DRX = 8, length of 28 LTE frames = 256 x 10 ms).
Figure 9 illustrates a typical example of the module current consumption profile when power saving is enabled.
The module is registered with network, automatically enters the low power idle-mode and periodically wakes up
to active-mode to monitor the paging channel for the paging block reception. Detailed current consumption
values can be found in TOBY-R2 series Data Sheet [1].
6
5
Figure 9: VCC current consumption profile with power saving enabled and module registered with the network: the module is
in low-power idle-mode and periodically wakes up to active-mode to monitor the paging channel for paging block reception
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ACTIVE MODE
2G case: 0.44-2.09 s
3G case: 0.61-5.09 s
LTE case: 0.32-2.56 s
Paging period
Time [s]
Current [mA]
Time [ms]
Current [mA]
RX
Enabled
0
100
0
100
1.5.1.6 VCC current consumption in fixed active-mode (power saving disabled)
When power saving is disabled, the module does not automatically enter the low power idle-mode whenever
possible: the module remains in active-mode. Power saving configuration is by default disabled. It can also be
disabled using the AT+UPSV command (see u-blox AT Commands Manual [2] for detail usage).
The module processor core is activated during idle-mode, and the 26 MHz reference clock frequency is used. It
would draw more current during the paging period than that in the power saving mode.
Figure 10 illustrates a typical example of the module current consumption profile when power saving is disabled.
In such case, the module is registered with the network and while active-mode is maintained, the receiver is
periodically activated to monitor the paging channel for paging block reception. Detailed current consumption
values can be found in TOBY-R2 series Data Sheet [1].
Figure 10: VCC current consumption profile with power saving disabled and module registered with the network: active-mode
is always held and the receiver is periodically activated to monitor the paging channel for paging block reception
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Baseband
Processor
70
VCC
71
VCC
72
VCC
3
V_BCKP
Linear
LDO
Power
Management
TOBY-R2 series
32 kHz
RTC
1.5.2 RTC supply input/output (V_BCKP)
The V_BCKP pin of TOBY-R2 series modules connects the supply for the Real Time Clock (RTC). A linear LDO
regulator integrated in the Power Management Unit internally generates this supply, as shown in Figure 11, with
low current capability (see the TOBY-R2 series Data Sheet [1]). The output of this regulator is always enabled
when the main module voltage supply applied to the VCC pins is within the valid operating range.
Figure 11: TOBY-R2 series RTC supply (V_BCKP) simplified block diagram
The RTC provides the module time reference (date and time) that is used to set the wake-up interval during the
low power idle-mode periods, and is able to make available the programmable alarm functions.
The RTC functions are available also in power-down mode when the V_BCKP voltage is within its valid range
(specified in the “Input characteristics of Supply/Power pins” table in TOBY-R2 series Data Sheet [1]). The RTC
can be supplied from an external back-up battery through the V_BCKP, when the main module voltage supply is
not applied to the VCC pins. This lets the time reference (date and time) run until the V_BCKP voltage is within
its valid range, even when the main supply is not provided to the module.
Consider that the module cannot switch on if a valid voltage is not present on VCC even when the RTC is
supplied through V_BCKP (meaning that VCC is mandatory to switch on the module).
The RTC has very low current consumption, but is highly temperature dependent. For example, V_BCKP current
consumption at the maximum operating temperature can be higher than the typical value at 25 °C specified in
the “Input characteristics of Supply/Power pins” table in the TOBY-R2 series Data Sheet [1].
If V_BCKP is left unconnected and the module main supply is not applied to the VCC pins, the RTC is supplied
from the bypass capacitor mounted inside the module. However, this capacitor is not able to provide a long
buffering time: within few milliseconds the voltage on V_BCKP will go below the valid range. This has no impact
on cellular connectivity, as all the module functionalities do not rely on date and time setting.
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Baseband
Processor
70
VCC
71
VCC
72
VCC
5
V_INT
Switching
Step-Down
Power
Management
TOBY-R2 series
Digital I/O
1.5.3 Generic digital interfaces supply output (V_INT)
The V_INT output pin of the TOBY-R2 series modules is connected to an internal 1.8 V supply with current
capability specified in the TOBY-R2 series Data Sheet [1]. This supply is internally generated by a switching stepdown regulator integrated in the Power Management Unit and it is internally used to source the generic digital
I/O interfaces of the cellular module, as described in Figure 12. The output of this regulator is enabled when the
module is switched on and it is disabled when the module is switched off.
Figure 12: TOBY-R2 series generic digital interfaces supply output (V_INT) simplified block diagram
The switching regulator operates in Pulse Width Modulation (PWM) mode for greater efficiency at high output
loads and it automatically switches to Pulse Frequency Modulation (PFM) power save mode for greater efficiency
at low output loads. The V_INT output voltage ripple is specified in the TOBY-R2 series Data Sheet [1].
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Baseband
Processor
20
PWR_ON
TOBY-R2 series
3
V_BCKP
Power-on
Power
Management
Power-on
10k
1.6 System function interfaces
1.6.1 Module power-on
When the TOBY-R2 series modules are in the not-powered mode (switched off, i.e. the VCC module supply is
not applied), they can be switched on as following:
Rising edge on the VCC supply input to a valid voltage for module supply, starting from a voltage value
lower than 2.25 V, so that the module switches on applying a proper VCC supply within the normal
operating range.
Alternately, the RESET_N pin can be held to the low level during the VCC rising edge, so that the module
switches on releasing the RESET_N pin when the VCC module supply voltage stabilizes at its proper nominal
value within the normal operating range.
The status of the PWR_ON input pin of TOBY-R2 series modules while applying the VCC module supply is not
relevant: during this phase the PWR_ON pin can be set high or low by the external circuit.
When the TOBY-R2 series modules are in the power-off mode (i.e. switched off with valid VCC module supply
applied), they can be switched on as following:
Low pulse on the PWR_ON pin, which is normally set high by an internal pull-up, for a valid time period.
Rising edge on the RESET_N pin, i.e. releasing the pin from the low level, as that the pin is normally set high
by an internal pull-up.
RTC alarm, i.e. pre-programmed alarm by AT+CALA command (see u-blox AT Commands Manual [2]).
As described in Figure 13, the TOBY-R2 series PWR_ON input is equipped with an internal active pull-up resistor
to the V_BCKP supply: the PWR_ON input voltage thresholds are different from the other generic digital
interfaces. Detailed electrical characteristics are described in TOBY-R2 series Data Sheet [1].
Figure 13: TOBY-R2 series PWR_ON input description
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VCC
V_BCKP
PWR_ON
RESET_N
V_INT
Internal Reset
System State
BB Pads State
Interna l Reset → Operational Operational
Tristate / Floating
Interna l Reset
OFF
ON
Start of interface
configuration
Module interfaces
are configured
Start-up
event
Figure 14 shows the module power-on sequence from the not-powered mode, describing the following phases:
The external supply is applied to the VCC module supply inputs, representing the start-up event.
The V_BCKP RTC supply output is suddenly enabled by the module as VCC reaches a valid voltage value.
The PWR_ON and the RESET_N pins suddenly rise to high logic level due to internal pull-ups.
All the generic digital pins of the module are tri-stated until the switch-on of their supply source (V_INT).
The internal reset signal is held low: the baseband core and all the digital pins are held in the reset state. The
reset state of all the digital pins is reported in the pin description table of TOBY-R2 series Data Sheet [1].
When the internal reset signal is released, any digital pin is set in a proper sequence from the reset state to
the default operational configured state. The duration of this pins’ configuration phase differs within generic
digital interfaces and the USB interface due to host / device enumeration timings (see section 1.9.2).
The module is fully ready to operate after all interfaces are configured.
Figure 14: TOBY-R2 series power-on sequence description
The greeting text can be activated by means of +CSGT AT command (see u-blox AT Commands Manual [2]) to
notify the external application that the module is ready to operate (i.e. ready to reply to AT commands) and the
first AT command can be sent to the module, given that autobauding has to be disabled on the UART to let the
module sending the greeting text: the UART has to be configured at fixed baud rate (the baud rate of the
application processor) instead of the default autobauding, otherwise the module does not know the baud rate
to be used for sending the greeting text (or any other URC) at the end of the internal boot sequence.
The Internal Reset signal is not available on a module pin, but the host application can monitor the V_INT
pin to sense the start of the TOBY-R2 series module power-on sequence.
Before the switch-on of the generic digital interface supply source (V_INT) of the module, no voltage
driven by an external application should be applied to any generic digital interface of the module.
Before the TOBY-R2 series module is fully ready to operate, the host application processor should not
send any AT command over the AT communication interfaces (USB, UART) of the module.
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1.6.2 Module power-off
TOBY-R2 series can be properly switched off by:
AT+CPWROFF command (see u-blox AT Commands Manual [2]). The current parameter settings are saved in
the module’s non-volatile memory and a proper network detach is performed.
An abrupt under-voltage shutdown occurs on TOBY-R2 series modules when the VCC module supply is
removed. If this occurs, it is not possible to perform the storing of the current parameter settings in the module’s
non-volatile memory or to perform the proper network detach.
It is highly recommended to avoid an abrupt removal of the VCC supply during TOBY-R2 series modules
normal operations: the power off procedure must be started by the AT+CPWROFF command, waiting the
command response for a proper time period (see u-blox AT Commands Manual [2]), and then a proper
VCC supply has to be held at least until the end of the modules’ internal power off sequence, which
occurs when the generic digital interfaces supply output (V_INT) is switched off by the module.
An abrupt hardware shutdown occurs on TOBY-R2 series modules when a low level is applied on RESET_N pin.
In this case, the current parameter settings are not saved in the module’s non-volatile memory and a proper
network detach is not performed.
It is highly recommended to avoid an abrupt hardware shutdown of the module by forcing a low level on
the RESET_N input pin during module normal operation: the RESET_N line should be set low only if reset
or shutdown via AT commands fails or if the module does not reply to a specific AT command after a time
period longer than the one defined in the u-blox AT Commands Manual [2].
An over-temperature or an under-temperature shutdown occurs on TOBY-R2 series modules when the
temperature measured within the cellular module reaches the dangerous area, if the optional Smart
Temperature Supervisor feature is enabled and configured by the dedicated AT command. For more details see
section 1.13.15 and u-blox AT Commands Manual [2], +USTS AT command.
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