u blox 10 User Manual
BMD-340-DS V1.0 Page 1 of 31
Rigado Inc.
3950 Fairview Industrial Dr.
Salem, Oregon 97302
866-6-RIGADO modules@rigado.com
www.rigado.com/modules
BMD-340 Module for Bluetooth 5 and 802.15.4
The BMD-340 is an advanced, highly flexible, ultra-low power multiprotocol SoM that
enables Bluetooth 5 (BLE) and IEEE 802.15.4 (Thread and Zigbee) connectivity for
portable, extremely low power embedded systems. With an ARM® Cortex™-M4F CPU,
integrated 2.4GHz transceiver, and an integrated antenna, the BMD-340 provides a
complete RF solution allowing faster time to market with reduced development costs.
Providing full use of the Nordic nRF52840’s capabilities and peripherals, the BMD-340
can power the most demanding applications, all while simplifying designs and reducing
BOM costs. The BMD-340 is an ideal solution for designs that require the latest
Bluetooth 5 features or 802.15.4 based networking for Thread. Increased integration
with built in USB and 5.5V compatible DC/DC supply reduces design complexity and BOM
cost, while expanding possible applications. BMD-340 designs are footprint compatible
with the BMD-300/301, providing low-cost flexibility for tiered product lineups.
1. Features
• Based on the Nordic nRF52840 SoC
• Bluetooth 5 Long Range, 2Mbs, and Advertising
Extension support
• IEEE 802.15.4 with Thread and Zigbee support
• Complete RF solution with integrated antenna
• Integrated DC-DC converter
• No external components required
• ARM® Cortex™-M4F 32-bit processor
• ARM® TrustZone® Cryptocell 310 security
• True Random Number Generator
• Serial Wire Debug (SWD)
• Nordic SoftDevice ready
• 1MB embedded flash memory
• 256kB RAM
• 48 General Purpose I/O Pins
• -40C to +85 Temperature Range
• FCC: 2AA9B10
• 12-bit/200KSPS ADC
• One Full-Speed USB (12Mbps)
• Four SPI Master/Slave (8 Mbps)
• Quad SPI with Execute in Place (XIP)
• Low power comparator
• Temperature sensor
• Two 2-wire Master/Slave (I2C compatible)
• I2S audio interface
• Two UARTs (w/ CTS/RTS and DMA)
• 20 channel CPU independent Programmable
Peripheral Interconnect (PPI)
• Quadrature Demodulator (QDEC)
• 128-bit AES HW encryption
• 5 x 32bit, 3 x 24bit Real Timer Counters (RTC)
• NFC-A tag interface for OOB pairing
• Dimensions: 15.0 x 10.2 x 1.9mm
• IC: 12208A-10
2. Applications
• Climate Control
• Lighting Products
• Safety and Security
• Home Appliances
• Access Control
• Internet of Things
• Home Health Care
• Advanced Remote Controls
• Smart Energy Management
• Low-Power Sensor Networks
• Interactive Entertainment
Devices
• Environmental Monitoring
• Hotel Automation
• Office Automation
Industry Canada
BMD-340 Module Datasheet
Bluetooth 5 + 802.15.4
May 16, 2018
BMD-340-DS V1.0 Page 2 of 31
3. Ordering Information
Email modules@rigado.com for quotes and ordering or visit www.rigado.com/BMD-340
Part Number
Description
BMD-340-A-R
BMD-340 module, Rev A, nRF52840-QIAA, Tape & Reel, 1000 piece multiples
BMD-340-ES1
BMD-340 module, ENG, nRF52840-QIAA, Engineering A silicon
BMD-340-ES2
BMD-340 module, ENG, nRF52840-QIAA, Engineering B silicon
BMD-340-A-EVK
BMD-340-A Evaluation Kit with Segger J-Link programmer
BMD-340-ES1-EVK
BMD-340-ES1 Evaluation Kit with Segger J-Link programmer
Table 1 – Ordering Part Numbers
4. Block Diagram
BMD-340 Bluetooth 5 Low Energy SoC Module
32 MHz
Crystal
nRF52840-QIAA
1MB Flash
DC-DC
Inductor
Decoupling
Capacitors
Bulk
Capacitors
2.4GHz Radio
Multi-protocol
TWI
Master x2
SPI
Master x4
SPI Slave
x3
Core DC/DC
Buck Regulator
Core LDO
256kB
RAM
Low Power
Comparator
8-ch 12-bit
ADC
UART
x2
Quadrature
Decoder
SWD Debug &
Programming
Temperature
Sensor
Cloc k
Man ageme nt
Watchdog
Timer
Random Number
Gen
Timer x5
Accel Address
Resolver
AES CCM Mode
Encryption
AES ECB
Real Time
Counter x3
GPIO Task
Event Blocks
Programmable
Peripheral
Interconnect
ARM Cortex-M4F
@ 64MHz
Matching
Networ k
Internal
Trace
Antenna
GPIO x48
(Analog x8)
I2S
TWI Slave
x2
PWM
x4
PDM
General
Purpose
Comparator
NFC Tag
Balun
DC-DC
Inductor
5V DC/DC Buck
Regulator
TWI Slave
x2
QSPI Master
w/XIP
USB2.0
5V LDO
ARM CryptoCell
SW
Interrupts
Memory
Watch Unit
Figure 1 – Block Diagram
BMD-340 Module Datasheet
Bluetooth 5 + 802.15.4
May 21, 2018
BMD-340-DS V1.0 Page 3 of 31
Table of Contents
1. FEATURES ............................................................................................................................................................................... 1
2. APPLICATIONS ........................................................................................................................................................................ 1
3. ORDERING INFORMATION...................................................................................................................................................... 2
4. BLOCK DIAGRAM .................................................................................................................................................................... 2
5. QUICK SPECIFICATIONS .......................................................................................................................................................... 5
6. PIN DESCRIPTIONS ................................................................................................................................................................. 6
6.1 BMD-340 .............................................................................................................................................................................................. 6
6.2 PERIPHERAL PINS ...................................................................................................................................................................................... 8
6.3 BMD-300 SERIES FOOTPRINT COMPATIBILITY AND MIGRATION ....................................................................................................................... 9
6.3.1 BMD-300/301 to BMD-340 Pad Differences .................................................................................................................................. 10
6.3.2 BMD-300/301 to BMD-340 Design Migration ............................................................................................................................... 10
6.4 BMD-340 FANOUT EXAMPLE .................................................................................................................................................................. 11
7. ELECTRICAL SPECIFICATIONS ................................................................................................................................................ 12
7.1 ABSOLUTE MAXIMUM RATINGS ................................................................................................................................................................. 12
7.2 OPERATING CONDITIONS .......................................................................................................................................................................... 12
7.3 POWER AND DCDC CONFIGURATION ......................................................................................................................................................... 13
7.3.1 USB Power ....................................................................................................................................................................................... 13
7.3.2 Normal (LV) Power Mode Examples ............................................................................................................................................... 14
7.3.3 High Voltage (HV) Power Mode Examples ..................................................................................................................................... 15
7.4 GENERAL PURPOSE I/O ........................................................................................................................................................................... 16
7.5 MODULE RESET .................................................................................................................................................................................... 16
7.6 DEBUG & PROGRAMMING ........................................................................................................................................................................ 16
7.7 CLOCKS ................................................................................................................................................................................................. 17
8. FIRMWARE ........................................................................................................................................................................... 18
8.1 FACTORY IMAGE ..................................................................................................................................................................................... 18
8.2 SOFTDEVICES ......................................................................................................................................................................................... 18
8.2.1 S140 ................................................................................................................................................................................................. 18
8.3 IEEE 802.15.4 (THREAD AND ZIGBEE) ...................................................................................................................................................... 18
8.4 MAC ADDRESS INFO ............................................................................................................................................................................... 19
9. MECHANICAL DATA .............................................................................................................................................................. 20
9.1 MECHANICAL DIMENSIONS ....................................................................................................................................................................... 20
9.2 RECOMMENDED PCB LAND PADS .............................................................................................................................................................. 20
10. MODULE MARKING .............................................................................................................................................................. 21
11. RF DESIGN NOTES ................................................................................................................................................................. 21
11.1 RECOMMENDED RF LAYOUT & GROUND PLANE ........................................................................................................................................... 21
11.2 MECHANICAL ENCLOSURE......................................................................................................................................................................... 22
11.3 ANTENNA PATTERNS ............................................................................................................................................................................... 22
12. EVALUATION BOARDS .......................................................................................................................................................... 23
13. EDGE CONNECTIVITY SOLUTIONS ......................................................................................................................................... 23
14. BLUETOOTH QUALIFICATION ................................................................................................................................................ 24
15. REGULATORY STATEMENTS .................................................................................................................................................. 24
15.1 FCC STATEMENT: ................................................................................................................................................................................... 24
15.2 FCC IMPORTANT NOTES .......................................................................................................................................................................... 24
15.3 IC STATEMENT: ...................................................................................................................................................................................... 26
15.4 IC IMPORTANT NOTES ............................................................................................................................................................................. 26
15.5 CE REGULATORY ..................................................................................................................................................................................... 27
15.6 AUSTRALIA / NEW ZEALAND ..................................................................................................................................................................... 27
16. SOLDER REFLOW TEMPERATURE-TIME PROFILE ................................................................................................................... 28
16.1 MOISTURE SENSITIVITY LEVEL.................................................................................................................................................................... 28
17. PACKAGING AND LABELING .................................................................................................................................................. 28
17.1 CARRIER TAPE DIMENSIONS ...................................................................................................................................................................... 28
17.2 REEL PACKAGING .................................................................................................................................................................................... 29
17.3 PACKAGING LABEL ................................................................................................................................................................................... 29
18. CAUTIONS ............................................................................................................................................................................ 30
19. LIFE SUPPORT POLICY ........................................................................................................................................................... 30
20. DOCUMENT HISTORY ........................................................................................................................................................... 31
21. RELATED DOCUMENTS ......................................................................................................................................................... 31
BMD-340 Module Datasheet
Bluetooth 5 + 802.15.4
May 21, 2018
BMD-340-DS V1.0 Page 4 of 31
List of Figures
FIGURE 1 – BLOCK DIAGRAM ............................................................................................................................................................ 2
FIGURE 2 – BMD-340 PIN OUT (TOP VIEW) ........................................................................................................................................ 6
FIGURE 3 – BMD-340 AND BMD-300/301 FOOTPRINT COMPARISON .................................................................................................... 9
FIGURE 4 – BMD-300 MODULE SOLDERED TO BMD-340 FOOTPRINT...................................................................................................... 9
FIGURE 5 – BMD-300 TO BMD-340 MIGRATION EXAMPLE................................................................................................................. 10
FIGURE 6 – BMD-340 2 LAYER FANOUT EXAMPLE .............................................................................................................................. 11
FIGURE 7 – LV MODE W/ COIN CELL EXAMPLE ................................................................................................................................... 14
FIGURE 8 – LV MODE EXAMPLE W/ USB AND EXTERNAL REGULATOR ...................................................................................................... 14
FIGURE 9 – USB POWERED HV MODE EXAMPLE ................................................................................................................................ 15
FIGURE 10 – LIPO POWERED HV EXAMPLE W/ USB CHARGER ............................................................................................................... 15
FIGURE 11 – BMD-340 MAC ADDRESS ON LABEL.............................................................................................................................. 19
FIGURE 12 – BMD-340 MODULE DIMENSIONS.................................................................................................................................. 20
FIGURE 13 – BMD-340/301 DIMENSIONS (TOP VIEW) ...................................................................................................................... 20
FIGURE 14 – BMD-340 MODULE MARKING - REV 1 (ES1) .................................................................................................................. 21
FIGURE 15 – BMD-340 RF EXAMPLE BASED ON EVAL BOARD .............................................................................................................. 21
FIGURE 16 – X-Y-Z ANTENNA ORIENTATION ...................................................................................................................................... 22
FIGURE 17 – BMD-340 EVALUATION BOARD .................................................................................................................................... 23
FIGURE 18 – REFLOW PROFILE FOR LEAD FREE SOLDER ......................................................................................................................... 28
FIGURE 19 - BMD-340 TAPE DIMENSIONS ....................................................................................................................................... 28
FIGURE 20 – REEL PACKAGING ........................................................................................................................................................ 29
FIGURE 21 – PACKAGING LABEL....................................................................................................................................................... 29
List of Tables
TABLE 1 – ORDERING PART NUMBERS ................................................................................................................................................ 2
TABLE 2 – QUICK SPECIFICATIONS ...................................................................................................................................................... 5
TABLE 3 – BMD-340 PIN DESCRIPTIONS ............................................................................................................................................ 7
TABLE 4 – PERIPHERAL PIN OPTIONS .................................................................................................................................................. 8
TABLE 5 – PERIPHERALS WITH SHARED REGISTERS.................................................................................................................................. 8
TABLE 6 – BMD-300/301 TO BMD-340 PAD DIFFERENCES ................................................................................................................ 10
TABLE 9 – ABSOLUTE MAXIMUM RATINGS ......................................................................................................................................... 12
TABLE 10 – OPERATING CONDITIONS ................................................................................................................................................ 12
TABLE 11 – POWER MODE PIN CONNECTIONS .................................................................................................................................... 13
TABLE 12 – GPIO ........................................................................................................................................................................ 16
TABLE 13 – 32.768 KHZ CRYSTAL ................................................................................................................................................... 17
TABLE 14 – 32.768 KHZ OSCILLATOR............................................................................................................................................... 17
BMD-340 Module Datasheet
Bluetooth 5 + 802.15.4
May 21, 2018
BMD-340-DS V1.0 Page 5 of 31
5. Quick Specifications
Bluetooth
Version
5.0 (Bluetooth Smart) Concurrent Central & Peripheral (S140)
Security
AES-128
LE connections
Up to 8 as Central, 1 as Peripheral, Observer, Broadcaster (S140)
IEEE 802.15.4
Thread Stack
OpenThread, Thread 1.1 certified
Thread Security
AES-128, ARM® Cryptocell accelerated
Zigbee Stack
Zigbee 3.0 (Certification Pending)
Radio
Frequency
2.402GHz to 2.480GHz
Modulations
GFSK at 1 Mbps and 2Mbps, QPSK at 250kbps
Transmit power
+8 dBm
Receiver sensitivity
-93dBm (2Mbps), -96 dBm (1Mbps), -103 (125ksps BLE), -100 dBm (IEEE 802.15.4)
Antenna
Integrated
Current Consumption
TX only @ +8 dBm, 0 dBm @ 3V, DCDC enabled
14.8 mA, 4.8 mA
TX only @ +8 dBm, 0 dBm
32.7 mA, 10.6 mA
RX only @ 1 Mbps @ 3V, DCDC enabled
4.6 mA
RX only @ 1 Mbps
9.9 mA
CPU @ 64MHz from flash, from RAM
6.3 mA, 5.2mA
CPU @ 64MHz from flash, from RAM @ 3V, DCDC enabled
3.3 mA, 2.8mA
System Off, On (Supply on VDD), no RAM retention
0.4 µA, 0.97 µA
System Off, On (Supply on VDD), full 256kB RAM retention
1.86 µA, 2.35µA
Dimensions
BMD-340
Length
Width
Height
15.0 mm ± 0.3mm
10.2 mm ± 0.3mm
1.9 mm ± 0.1mm
Hardware
Interfaces
SPI Master/Slave x4
Quad SPI x1
UART x2
Two-Wire Master/Slave (I2C) x2
GPIO x48
I2S x1
PWM x12
PDM x1
USB 2.0 x1
Analog input x8
Power supply
VDD: 1.7V to 3.6V, 1.75V required to start DCDC
VDDH: 2.5V to 5.5V
VBUS: 4.35V to 5.5V (For USB operation)
Temperature Range
-40 to +85°C
Certifications
FCC
FCC part 15 modular certification
BMD-340 FCC ID: 2AA9B10
IC
Industry Canada RSS-247 modular certification
BMD-340 IC: 12208A-10
CE
EN 301 489-1 V2.1.1& 3.1 (b): Electromagnetic Compatibility
EN 301 489-17 V3.1.1
EN 300 328 V2.1.1 3.2: Effective use of spectrum allocated
Australia / New Zealand
AS/NZS 4268 :2012+AMDT 1:2013, Radio equipment and systems – Short range devices
Bluetooth
BMD-340 RF-PHY Component (Tested) – DID: TBD; QDID: TBD
Table 2 – Quick Specifications
BMD-340 Module Datasheet
Bluetooth 5 + 802.15.4
May 21, 2018
BMD-340-DS V1.0 Page 6 of 31
6. Pin Descriptions
6.1 BMD-340
Figure 2 – BMD-340 Pin out (Top View)
Pin description
Pin
Name
Direction
Description
6
P0.25
In/Out
GPIO
7
P0.26
In/Out
GPIO
8
P0.27
In/Out
GPIO
9
P0.28
In/Out
GPIO/AIN42
10
P0.29
In/Out
GPIO/AIN52
11
P0.30
In/Out
GPIO/AIN62
12
P0.31
In/Out
GPIO/AIN72
13
P0.00
In/Out
GPIO/XTAL1 (32.768kHz)
14
P0.01
In/Out
GPIO/XTAL2 (32.768kHz)
15
P0.02
In/Out
GPIO/AIN0
2
19
P0.03
In/Out
GPIO/AIN1
2
20
P0.04
In/Out
GPIO/AIN2
21
P0.05
In/Out
GPIO/AIN3
22
P0.06
In/Out
GPIO
23
P0.07
In/Out
GPIO/TRACECLK
24
P0.08
In/Out
GPIO
25
P0.09
In/Out
GPIO/NFC1
2
26
P0.10
In/Out
GPIO/NFC2
2
27
P0.11
In/Out
GPIO/TRACEDATA[2]
28
P0.12
In/Out
GPIO/TRACEDATA[1]
31
P0.13
In/Out
GPIO
32
P0.14
In/Out
GPIO
BMD-340 Module Datasheet
Bluetooth 5 + 802.15.4
May 21, 2018
BMD-340-DS V1.0 Page 7 of 31
Pin
Name
Direction
Description
33
P0.15
In/Out
GPIO
34
P0.16
In/Out
GPIO
35
P0.17
In/Out
GPIO
36
P0.21
In/Out
GPIO
37
P0.19
In/Out
GPIO
38
P0.20
In/Out
GPIO
39
P0.18
In/Out
GPIO/RESET
40
P0.22
In/Out
GPIO
41
P0.23
In/Out
GPIO
42
P0.24
In/Out
GPIO
43
SWCLK
In
SWD Clock
44
SWDIO
In/Out
SWD IO
48
P1.05
In/Out
GPIO
2
49
P1.06
In/Out
GPIO
2
50
P1.07
In/Out
GPIO
2
51
P1.08
In/Out
GPIO
52
P1.09
In/Out
GPIO/TRACEDATA[3]
53
P1.10
In/Out
GPIO
2
54
P1.11
In/Out
GPIO
2
56
P1.00
In/Out
GPIO/TRACEDATA[0]/SWO
57
P1.01
In/Out
GPIO
2
58
P1.02
In/Out
GPIO
2
59
P1.03
In/Out
GPIO
2
60
P1.04
In/Out
GPIO
2
61
P1.12
In/Out
GPIO
2
62
P1.13
In/Out
GPIO
2
63
P1.14
In/Out
GPIO
2
64
P1.15
In/Out
GPIO
2
67
USB-D-
In/Out
USB Data -
68
USB-D+
In/Out
USB Data +
66
VBUS
Power
USB PHY supply: 4.35V to 5.5V in
Connect to USB Host device 5V supply
17
VCC1 Power In/Out
LV Mode: 1.7V to 3.6V in
HV Mode: 1.8V to 3.3V supply out
3
65
VCCH
1
Power
LV Mode: Connect to VCC
HV Mode: 2.5V to 5.5V in
1, 2, 3, 4, 5, 16, 18, 29, 30,
45, 46, 47, 55
GND
Power
Electrical Ground
Note 1: An internal 4.7µF bulk capacitor is included on the module. However, it is good design practice to add additional bulk
capacitance as required for your application, i.e. those with heavy GPIO usage and/or current draw.
Note 2: These pins are in close proximity to the nRF52 radio power supply and antenna pins. Radio performance parameters, such
as sensitivity, may be affected by high frequency digital I/O with large sink/source current on these pins. Nordic recommends using
only low frequency, low-drive functions when possible.
Note 3: In HV mode, VCC acts as a regulated supply that can power other external devices. The voltage output of VCC can be
configured in software but is limited to no more than VCCH-0.3V. In System Off mode VCC can supply no more than 1mA.
Table 3 – BMD-340 Pin Descriptions
BMD-340 Module Datasheet
Bluetooth 5 + 802.15.4
May 21, 2018
BMD-340-DS V1.0 Page 8 of 31
6.2 Peripheral Pins
The BMD-340 features a pin muxing system that allows most internal peripherals, such as UART and SPI, to be
used on any GPIO pin. This freedom in pin choice enables better optimization of designs and PCB layout. Note that
only one peripheral signal can be muxed to a GPIO pin at a time. Some functions are restricted to certain pins due
to additional internal circuitry required by the interface. These include: Trace signals, analog inputs, XTAL signals,
USB signals, SWD interface, and reset. See Table 4 below for details:
Peripheral
Signal
Pin Options
UART0, UART1
All
P0.00-P0.31, P1.00-P1.15
I2C0, I2C1
SPI0, SPI1, SPI2, SPI3
I2S0
QSPI0
PWM0, PWM1, PWM2, PWM3
PDN0
ADC, COMP, LPCOMP
All
P0.02-P0.05, P0.28-P0.31
(AIN0-AIN7)
NFC
NFC1
P0.09
NFC2
P0.10
Reset
RESET
P0.18
Trace
TRACECLK
P0.07
SWO/TRACEDATA[0]
P1.00
TRACEDATA[1]
P0.12
TRACEDATA[2]
P0.11
TRACEDATA[3]
P1.09
SWD
SWD Clock
SWCLK
SWD IO
SWDIO
32.768kHz Crystal
XTAL1
P0.00
XTAL2
P0.01
USB
USB Data +
USB-D+
USB Data -
USB-D-
Table 4 – Peripheral Pin Options
Note: Some peripherals on the BMD-340 share the same memory location for their registers. This means that only
one of these peripherals can be used at a time. It is possible to switch between peripherals that share the same
register location by clearing and reinitializing the associated configuration registers. See the Nordic Semiconductor
nRF52840 Product Specification for details.
Peripheral
ID
Base Address
Shared Peripherals
3
0x40003000
SPI0
I2C0
4
0x40004000
SPI1
I2C1
Table 5 – Peripherals with Shared Registers
BMD-340 Module Datasheet
Bluetooth 5 + 802.15.4
May 21, 2018
BMD-340-DS V1.0 Page 9 of 31
6.3 BMD-300 Series Footprint Compatibility and Migration
Figure 3 – BMD-340 and BMD-300/301 Footprint Comparison
The BMD-340 footprint has been designed to allow for backwards compatibility with the BMD-300 and BMD-301
modules with pins 1 through 47 of the BMD-340 directly mapping to the same pin numbers on the BMD-300/300.
This allows BMD-300 and BMD-301 modules to be placed directly onto the BMD-340 footprint for easy migration
and enabling tiered product design. Generally, all pin names and functions remain the same, except for some
differences noted below. Pins 48 through 68 of the BMD-340 footprint are new pads used for new features that
are not present on the BMD-300/301 modules, such as USB interface and additional GPIO and power connections.
Figure 4 – BMD-300 Module Soldered to BMD-340 Footprint
BMD-340 Module Datasheet
Bluetooth 5 + 802.15.4
May 21, 2018
BMD-340-DS V1.0 Page 10 of 31
6.3.1 BMD-300/301 to BMD-340 Pad Differences
Due to changes in the nRF52840 SoC used by the BMD-340, not all functions (such as SWO/TRACE signals) are
found on the same pins as on the BMD-300/301. Particularly of note is the reset pin function which on the BMD340 is now available on P0.18 instead of P0.21 as on the BMD-300/301. To maintain pin for pin compatibility of
the reset signal, P0.18 and P0.21 have swapped pad locations on the BMD-340 footprint. These differences are
detailed in Table 6 below:
Pin
BMD-300/301
Name
BMD-300/301
Function
BMD-340
Name
BMD-340
Function
39
P0.21
GPIO/RESET
P0.18
GPIO/RESET
38
P0.20
GPIO/TRACECLK
P0.20
GPIO
36
P0.18
GPIO/TRACEDATA[0]/SWO
P0.21
GPIO
34
P0.16
GPIO/TRACEDATA[1]
P0.16
GPIO
33
P0.15
GPIO/TRACEDATA[2]
P0.15
GPIO
32
P0.14
GPIO/TRACEDATA[3]
P0.14
GPIO
23
P0.07
GPIO
P0.07
GPIO/TRACECLK
56
N/A
N/A
P1.00
GPIO/TRACEDATA[0]/SWO
28
P0.12
GPIO
P0.12
GPIO/TRACEDATA[1]
27
P0.11
GPIO
P0.11
GPIO/TRACEDATA[2]
52
N/A
N/A
P1.09
GPIO/TRACEDATA[3]
Table 6 – BMD-300/301 to BMD-340 Pad Differences
6.3.2 BMD-300/301 to BMD-340 Design Migration
Existing designs incorporating the BMD-300 or BMD-301 module can be migrated over to the BMD-340 with the
addition of a single footprint pad for VCCH (pin 65). This migration option is only suitable for applications that do
not require the new USB interface, additional GPIO, or higher supply voltage functionality. The VCCH pad must be
present and electrically connected to the same supply as VCC in order for the module to operate correctly. Vias
underneath the BMD-340 should be tented to avoid shorts to unused module pads. Firmware written for the
BMD-300/301 can generally be ported to the BMD-340 with minimal effort. See the Nordic Semiconductor SDK
documentation for details.
Figure 5 – BMD-300 to BMD-340 Migration Example
New Pad VCCH:
Connect to VCC
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