u blox 09 User Manual

User Manual

Product Name: BMD-330

Brand: RIGADO
Model:BMD-330

Manufacture: Rigado, Inc.

BMD-330 Module for Bluetooth 5 LE

The BMD-330 from Rigado is a powerful, highly flexible, ultra-low power Bluetooth Smart
module based on the nRF52810 SoC from Nordic Semiconductor. With an ARM®
Cortex™ M4 CPU, embedded 2.4GHz transceiver, and integrated antenna, it provides a
complete RF solution with no additional RF design, allowing faster time to market.
Providing full use of the nRF52810’s capabilities and peripherals, the BMD-330 can
power demanding applications, while simplifying designs and reducing BOM costs. With
an internal DC-DC converter and intelligent power control, the BMD-330 provides class­leading power efficiency, enabling ultra-low power sensitive applications. Regulatory
pre-approvals reduce the burden to enter the market. As a drop in replacement for the
BMD-300/301, the BMD-330 completes Rigado’s BMD-300 Series lineup with an
optimized peripheral set that is attractive for a wide range of cost-sensitive applications.

1. Features

• Based on the Nordic nRF52810 SoC

• Complete RF solution with integrated antenna

• Integrated DC-DC converter

• No external components required

• ARM® Cortex™-M4 32-bit processor

• Serial Wire Debug (SWD)

• Nordic SoftDevice ready

• Over-the-Air (OTA) firmware updates

• 192kB embedded flash memory

• 24kB RAM

• 32 General Purpose I/O Pins

• 12-bit/200KSPS ADC

• -40C to +85C Temperature Range

• FCC: 2AA9B09 (Pending)

2. Applications

• Climate Control

• Lighting Products

• Safety and Security

• Home Appliances

• Access Control

• Internet of Things (IoT)

• Home Health care

• Advanced Remote Controls

• Smart Energy Management

• Low-Power Sensors

• Beacons– iBeacon™,

AltBeacon, Eddystone, etc.

• SPI Master/Slave (8 Mbps)

• General purpose comparator

• Temperature sensor

• Random Number Generator

• 2-wire serial Master/Slave (I2C compatible)

• UART (w/ CTS/RTS and DMA)

• 20 channel CPU independent Programmable

Peripheral Interconnect (PPI)

• Quadrature Demodulator (QDEC)

• 128-bit AES HW encryption

• 3 x 32bit, 2 x 24bit Real Timer Counters (RTC)

• Dimensions: 14 x 9.8 x 1.9mm

• IC: 12208A-09 (Pending)

• Environmental Monitoring

• Hotel Automation

• Office Automation

• Wearables

BMD-330-DS V0.9 Page 1 of 24

Industry Canada

3. Ordering Information

Email [e-mail] for quotes and ordering or visit http://www.rigado.com/BMD-330

Part Number Description

BMD-330-A-R BMD-330 module, Rev A, Tape & Reel, 1000 piece multiples
BMD-330-EVAL BMD-330 Evaluation Kit with Segger J-Link programmer

Table 1 – Ordering Part Numbers

4. Block Diagram

BMD-330 Module

BMD-330 Module Datasheet

Bluetooth 5

September 13, 2017

nRF52810

192kB

Flash

24kB RAM

SWD Debug &

Programming

Core LDO

DC/DC Buck

Regulator

DC-DC

Inductor

Accel Address

Resolver

ARM Cortex-M4

AES ECB

@ 64MHz

AES CCM Mode

Encryption

Cloc k

Manageme nt

Watchdog

Timer

TWI

Master

TWI Slave 4ch PWM PDM

Bulk

Capacitors

Real Time

Counter x2

Timer x3

SPI

Master

SPI Slave

Decoupling

Capacitors

Random Number

Gen

UART

GPIO x32

(Analog x8)

Figure 1 – Block Diagram

2.4GHz Radio

Multi-protocol

Programmable

Peripheral

Interconnect

GPIO Task

Event Blocks

Quadrature

Decoder

32 MHz

Crystal

Temperature

Sensor

General
Purpose

Comparator

8-ch 12-bit

ADC

Balun

Matching

Network

Antenna

BMD-330-DS V0.9 Page 2 of 24

BMD-330 Module Datasheet

Bluetooth 5

September 13, 2017

Table of Contents

1. FEATURES ...............................................................................................................................................................................1

2. APPLICATIONS ........................................................................................................................................................................1

3. ORDERING INFORMATION......................................................................................................................................................2

4. BLOCK DIAGRAM ....................................................................................................................................................................2

5. QUICK SPECIFICATIONS ..........................................................................................................................................................4

6. PIN DESCRIPTIONS .................................................................................................................................................................5

7. ELECTRICAL SPECIFICATIONS ..................................................................................................................................................7

7.1 ABSOLUTE MAXIMUM RATINGS ..................................................................................................................................................... 7

7.2 OPERATING CONDITIONS .............................................................................................................................................................. 7

7.3 GENERAL PURPOSE I/O ............................................................................................................................................................... 7

7.4 MODULE RESET ....................................................................................................................................................................... 8

7.5 DEBUG & PROGRAMMING ............................................................................................................................................................ 8

7.6 CLOCKS ................................................................................................................................................................................... 8

8. FIRMWARE .............................................................................................................................................................................9

8.1 FACTORY IMAGE ........................................................................................................................................................................ 9

8.2 SOFTDEVICES ............................................................................................................................................................................ 9

8.2.1 S132 ................................................................................................................................................................................... 9

8.3 MAC ADDRESS INFO ................................................................................................................................................................ 10

9. MECHANICAL DATA .............................................................................................................................................................. 11

9.1 MECHANICAL DIMENSIONS ......................................................................................................................................................... 11

9.2 RECOMMENDED PCB LAND PADS ................................................................................................................................................. 12

10. MODULE MARKING .............................................................................................................................................................. 12

11. RF DESIGN NOTES ................................................................................................................................................................. 13

11.1 RECOMMENDED RF LAYOUT & GROUND PLANE ............................................................................................................................... 13

11.1.1 BMD-300 .......................................................................................................................................................................... 13

11.2 MECHANICAL ENCLOSURE........................................................................................................................................................... 13

11.3 ANTENNA PATTERNS ................................................................................................................................................................. 14

12. EVALUATION BOARDS .......................................................................................................................................................... 16

13. SOLUTION SERVICES ............................................................................................................................................................. 16

14. BLUETOOTH QUALIFICATION ................................................................................................................................................ 17

15. REGULATORY STATEMENTS .................................................................................................................................................. 17

15.1 FCC STATEMENT: .................................................................................................................................................................... 17

15.2 FCC IMPORTANT NOTES ............................................................................................................................................................ 17

15.3 IC STATEMENT: ....................................................................................................................................................................... 19

15.4 IC IMPORTANT NOTES ............................................................................................................................................................... 19

15.5 CE REGULATORY ...................................................................................................................................................................... 20

15.6 AUSTRALIA / NEW ZEALAND ........................................................................................................................................................ 20

16. SOLDER REFLOW TEMPERATURE-TIME PROFILE ................................................................................................................... 21

16.1 MOISTURE SENSITIVITY LEVEL ...................................................................................................................................................... 21

17. PACKAGING AND LABELING.................................................................................................................................................. 21

17.1 CARRIER TAPE DIMENSIONS ........................................................................................................................................................ 21

17.2 REEL PACKAGING ..................................................................................................................................................................... 22

17.3 PACKAGING LABEL .................................................................................................................................................................... 22

18. CAUTIONS ............................................................................................................................................................................ 23

19. LIFE SUPPORT POLICY ........................................................................................................................................................... 23

20. DOCUMENT HISTORY ........................................................................................................................................................... 24

21. RELATED DOCUMENTS ......................................................................................................................................................... 24

BMD-330-DS V0.9 Preliminary – Subject to Change Page 3 of 24

5. Quick Specifications

Bluetooth

Version 5.0 (Bluetooth Smart) Concurrent Central & Peripheral (S132)
Security AES-128

LE connections

Radio

Frequency
Modulations GFSK at 1 Mbps, 2 Mbps data rates
Transmit power +4 dBm
Receiver sensitivity -96 dBm (BLE mode)
Antenna Integrated

Current Consumption

TX only @ +4 dBm, 0 dBm @ 3V, DCDC enabled 7.0 mA, 4.6 mA
TX only @ +4 dBm, 0 dBm 15.4 mA, 10.1 mA
RX only @ 1 Mbps @ 3V, DCDC enabled 4.6 mA
RX only @ 1 Mbps 10.0 mA
RX only @ 2 Mbps @ 3V, DCDC enabled 5.8 mA
RX only @ 2 Mbps 11.2 mA
CPU @ 64MHz from flash, from RAM 4.0 mA, 3.8 mA
CPU @ 64MHz from flash, from RAM @ 3V, DCDC 2.4 mA, 2.1 mA
System Off, On 0.3 µA, 0.6 µA
Additional current for RAM retention 30 nA / 4KB block

Dimensions

BMD-330

Hardware

Interfaces

Power supply 1.7V to 3.6V
Temperature Range -40C to +85°C

Certifications

FCC

IC

CE

Australia / New Zealand

Bluetooth RF-PHY Component (Pending)

Export

ECCN 5A992.C, Exception 742.15(b)(1)
HTS 8473.30.1180

Concurrent central, observer, peripheral, and broadcaster roles with multiple
concurrent connections along with one Observer and one Broadcaster (S132)

2402-2480MHz

Length
Width
Height

SPI Master/Slave
UART
Two-Wire Master/Slave (I2C)
GPIO x 32

FCC part 15 modular certification (Pending)
FCC ID: 2AA9B09
Industry Canada RSS-210 modular certification
IC: 12208A-09
EN 60950-1: A2:2013 3.1 (a): Health and Safety of the User
EN 301 489-1 V2.1.1 & 3.1 (b): Electromagnetic Compatibility
EN 301 489-17 V3.1.1
EN 300 328 V2.1.1 3.2: Effective use of spectrum allocated
AS/NZS 4268 :2012+AMDT 1:2013, Radio equipment and systems – Short range devices
(Pending)

BMD-330 Module Datasheet

Bluetooth 5

September 13, 2017

14.0 mm ± 0.3mm

9.8 mm ± 0.3mm

1.9 mm ± 0.1mm

I2S
PWM
PDM
ADC

Table 2 – Quick Specifications

BMD-330-DS V0.9 Preliminary – Subject to Change Page 4 of 24

6. Pin Descriptions

BMD-330 Module Datasheet

Bluetooth 5

September 13, 2017

Figure 2 – BMD-330 Pin out (Top View)

Pin description

Pin Name Direction Description

6 P0.25 In/Out GPIO2
7 P0.26 In/Out GPIO2
8 P0.27 In/Out
9 P0.28 In/Out
10 P0.29
11 P0.30
12 P0.31
13 P0.00
14 P0.01
15 P0.02
19 P0.03
20 P0.04
21 P0.05
22 P0.06
23 P0.07
24 P0.08
25 P0.09
26 P0.10
27 P0.11
28 P0.12
31 P0.13

In/Out GPIO/AIN52
In/Out GPIO/AIN62
In/Out GPIO/AIN72
In/Out
In/Out
In/Out GPIO/AIN0
In/Out GPIO/AIN1
In/Out GPIO/AIN2
In/Out GPIO/AIN3
In/Out GPIO
In/Out GPIO
In/Out GPIO
In/Out GPIO
In/Out GPIO
In/Out GPIO
In/Out GPIO
In/Out GPIO

GPIO2
GPIO/AIN42

GPIO/XTAL1 (32.768kHz)
GPIO/XTAL2 (32.768kHz)

BMD-330-DS V0.9 Preliminary – Subject to Change Page 5 of 24

BMD-330 Module Datasheet

Bluetooth 5

September 13, 2017

Pin Name Direction Description

32
33
34
35
36
37
38
39
40
41
42
43
44
17
1, 2, 3, 4, 5, 16, 18, 29,

30, 45, 46, 47

Note 1: An internal 4.7µF bulk capacitor is included on the module. However, it is good design practice to add additional
bulk capacitance as required for your application, i.e. those with heavy GPIO usage and/or current draw.

Note 2: These pins are in close proximity to the nRF52 radio power supply and antenna pins. Radio performance
parameters, such as sensitivity, may be affected by high frequency digital I/O with large sink/source current on these
pins. Nordic recommends using only low frequency, low-drive functions when possible.

P0.14 In/Out GPIO
P0.15 In/Out GPIO
P0.16 In/Out GPIO
P0.17 In/Out GPIO
P0.18 In/Out GPIO
P0.19 In/Out GPIO
P0.20 In/Out GPIO
P0.21 In/Out

GPIO/RESET
P0.22 In/Out GPIO2
P0.23 In/Out GPIO2
P0.24 In/Out GPIO2
SWCLK In
SWDIO In/Out
VCC Power

SWD Clock

SWD IO

+1.7V to +3.6V1

GND Power Electrical Ground

Table 3 – BMD-330 Pin Descriptions

BMD-330-DS V0.9 Preliminary – Subject to Change Page 6 of 24

7. Electrical Specifications

7.1 Absolute Maximum Ratings

Symbol Parameter Min. Max. Unit

BMD-330 Module Datasheet

Bluetooth 5

September 13, 2017

V
V
V

Voltage on supply pin -0.3 3.9 V

CC_MAX

Voltage on GPIO pins (VCC > 3.6V) -0.3 3.9 V

IO_MAX

Voltage on GPIO pins (VCC ≤ 3.6V) -0.3 VCC + 0.3V V

IO_MAX

TS Storage Temperature Range -40 125 °C

Table 4 – Absolute Maximum Ratings

7.2 Operating Conditions

Symbol Parameter Min. Typ. Max. Unit

VCC Operating supply voltage 1.7 3.0 3.6 V

T

Supply rise time (0V to 1.7V) - - 60 ms

R_VCC

TA Operating Ambient Temperature Range -40 25 85 °C

Table 5 – Operating Conditions

7.3 General Purpose I/O

The general purpose I/O is organized as one port enabling access and control of the 32 available GPIO pins through
one port. Each GPIO can be accessed individually with the following user configurable features:

• Input/output direction

• Output drive strength

• Internal pull-up and pull-down resistors

• Wake-up from high or low level triggers on all pins

• Trigger interrupt on all pins

• All pins can be used by the PPI task/event system; the maximum number of pins that can be interfaced

through the PPI at the same time is limited by the number of GPIOTE channels

• All pins can be individually configured to carry serial interface or quadrature demodulator signals

Symbol Parameter Min. Typ. Max. Unit

VIH Input High Voltage 0.7 x VCC - VCC V
VIL Input Low Voltage VSS - 0.3 x VCC V

VOH Output High Voltage V

VOL Output Low Voltage VSS - V

RPU Pull-up Resistance 11 13 16 kΩ

RPD Pull-down Resistance 11 13 16 kΩ

Table 6 – GPIO

− 0.4 - VCC V

CC

+ 0.4 V

SS

BMD-330-DS V0.9 Preliminary – Subject to Change Page 7 of 24

BMD-330 Module Datasheet

Bluetooth 5

September 13, 2017

7.4 Module RESET

GPIO pin P0.21 may be used for a hardware reset. In order to utilize P0.21 as a hardware reset, the UICR registers
PSELRESET[0] and PSELRESET[1] must be set alike, to the value of 0x7FFFFF15. When P0.21 is programmed as

RESET, the internal pull-up is automatically enabled. Rigado and Nordic example applications and development
kits program P0.21 as RESET.

7.5 Debug & Programming

The BMD-330 supports the two pin Serial Wire Debug (SWD) interface and offers flexible and powerful mechanism
for non-intrusive debugging of program code. Breakpoints, single stepping, and instruction trace capture of code
execution flow are part of this support.

7.6 Clocks

The BMD-330 requires two clocks, a high frequency clock and a low frequency clock.

The high frequency clock is provided on-module by a high-accuracy 32-MHz crystal as required by the
nRF52810 for radio operation.

The low frequency clock can be provided internally by an RC oscillator or synthesized from the fast clock; or
externally by a 32.768 kHz crystal. An external crystal provides the lowest power consumption and greatest
accuracy. Using the internal RC oscillator with calibration provides acceptable performance for BLE
applications at a reduced cost and slight increase in power consumption. Note: the ANT protocol requires the
use of an external crystal.

32.768 kHz Crystal (LFXO)

Symbol Parameter Typ. Max. Unit

F

NOM_LFXO

F

TOL_LFXO_BLE

C
C
R

Crystal frequency 32.768 - kHz

Frequency tolerance, BLE applications - ±250 ppm

Load Capacitance - 12.5 pF

L_LFXO

Shunt Capacitance - 2 pF

0_LFXO

Equivalent series resistance - 100 kΩ

S_LFXO

C

Input Capacitance on XL1 & XL2 pads 4 - pF

pin

Table 7 – 32.768 kHz Crystal

32.768 kHz Oscillator Comparison

Symbol Parameter Min. Typ. Max. Unit

I

Current for 32.768kHz Crystal Oscillator - 0.25 - µA

LFXO

I

Current for 32.768kHz RC Oscillator - 0.6 1 µA

LFRC

I

Current for 32.768kHz Synthesized Oscillator - 100 - µA

LFSYNT

f

TOL_LFXO_BLE

f

TOL_LFXO_ANT

Frequency Tolerance, 32.768kHz Crystal Oscillator
(BLE Stack)1
Frequency Tolerance, 32.768kHz Crystal Oscillator
(ANT Stack)1

- - ±250 ppm

- - ±50 ppm

BMD-330-DS V0.9 Preliminary – Subject to Change Page 8 of 24