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u blox 07 Users Manual

R41Z-DS-V1.0 Page 1 of 30
Rigado LLC 3950 Fairview Industrial Dr. Salem, Oregon 97302 866-6-RIGADO  modules@rigado.com www.rigado.com/modules
R41Z Module for Thread and Bluetooth 4.2 LE
The R41Z Module from Rigado is a highly-integrated, ultra-low power module that enables Bluetooth Low Energy and IEEE 802.15.4 connectivity based on the Kinetis KW41Z SoC from NXP Semiconductors. With and ARM® Cortex™ M0+ processor, embedded
2.4GHz transceiver supporting FSK/GFSK and O-QPSK modulations, and integrated antenna, the R41Z provides a complete RF solution with no additional RF design allowing faster time to market. Equipped with the ability to concurrently communicate over Bluetooth and Thread connections, the R41Z offers an unprecedented level of connectivity in a single module. With an internal DC-DC Converter and a wide supply voltage range of 0.9V to 4.2V, the R41Z can be directly powered by sources ranging from single alkaline cells to lithium polymer batteries.
1. Features
Based on the NXP Kinetis KW41Z SoC Complete RF solution with integrated
antenna
Integrated DC-DC converter Arm® Cortex™-M0+ 32-bit processor Serial Wire Debug Over-the-Air (OTA) firmware updates 512kB embedded flash memory 128kb RAM 25 GPIO, 2 dedicated analog pins 16-bit/500KSPS ADC 12-bit DAC -40°C to +105°C Temperature Range Rigado Software Suite 16 Capacitive Touch Sensing Inputs
Two SPI Master/Slave (12Mbps) Two I
2
C Master/Slave
UART (w/ CTS/RTS and DMA) Low power comparator Temperature sensor Infrared communication interface Nine low power modes True Random Number Generator 128-bit AES HW encryption 32bit Real-Time Clock (RTC) Wi-Fi coexistence support Dimensions: 10.6 x 16.2 x 2.1mm FCC: 2AA9B07 IC: 12208A-07 Japan: TBD
2. Applications
Home/Office/Hotel Automation Low-Power Sensor Networks Home Appliances Lighting Products Climate Control
Environmental Monitoring Home Health Care Safety and Security Access Control Smart Energy Management
R41Z Module Data Sheet
Thread + Bluetooth 4.2 LE
November 17, 2016
R41Z-DS-1.0 Page 2 of 30
3. Ordering Information
Email module@rigado.com for quotes and ordering, or visit www.rigado.com/R41Z
Part Number
Description
R41Z-TA-R
R41Z module, Rev A, Tape & Reel, 1000 piece multiples
R41Z-TA-EVAL
R41Z Evaluation Kit with OpenSDA programmer
Table 1 - Ordering Part Numbers
4. Block Diagram
Figure 1 - Block Diagram
R41Z Module Data Sheet
Thread + Bluetooth 4.2 LE
November 17, 2016
R41Z-DS-1.0 Page 3 of 30
Table of Contents
1. FEATURES .................................................................................................................................................. 1
2. APPLICATIONS ........................................................................................................................................... 1
3. ORDERING INFORMATION ......................................................................................................................... 2
4. BLOCK DIAGRAM ....................................................................................................................................... 2
5. QUICK SPECIFICATIONS .............................................................................................................................. 6
6. PIN DESCRIPTIONS ..................................................................................................................................... 7
6.1 R41Z PIN FUNCTIONS ........................................................................................................................................... 7
6.2 RIGDFU PIN FUNCTIONS ....................................................................................................................................... 8
7. ELECTRICAL SPECIFICATIONS ...................................................................................................................... 9
7.1 ABSOLUTE MAXIMUM RATINGS .............................................................................................................................. 9
7.2 OPERATING CONDITIONS ....................................................................................................................................... 9
7.3 DCDC CONVERTER OPERATION .............................................................................................................................. 9
7.3.1 DCDC BYPASS MODE ....................................................................................................................................... 10
7.3.2 DCDC BUCK MODE .......................................................................................................................................... 11
7.3.3 DCDC BOOST MODE ........................................................................................................................................ 12
7.4 GENERAL PURPOSE I/O AND PORTS ....................................................................................................................... 14
7.5 ANALOG I/O AND VREF ...................................................................................................................................... 15
7.5.1 ANALOG SIGNALS AND MAPPING ......................................................................................................................... 15
7.5.2 VDDA AND VREF ............................................................................................................................................ 15
7.6 MODULE RESET ................................................................................................................................................. 16
7.7 DEBUG AND PROGRAMMING ................................................................................................................................ 16
7.8 CLOCKS ............................................................................................................................................................ 16
8. FIRMWARE .............................................................................................................................................. 17
8.1 FACTORY IMAGE ................................................................................................................................................. 17
8.1.1 FIRMWARE VERSION ‘00’ ................................................................................................................................... 17
8.2 MAC ADDRESS INFO ........................................................................................................................................... 17
9. MECHANICAL DATA ................................................................................................................................. 18
9.1 PACKAGE DIMENSIONS ........................................................................................................................................ 18
9.2 RECOMMENDED PCB FOOTPRINT .......................................................................................................................... 19
10. MODULE MARKING ................................................................................................................................. 19
11. RF DESIGN NOTES .................................................................................................................................... 20
11.1 RECOMMENDED RF LAYOUT AND GROUND PLANE .................................................................................................... 20
11.2 MECHANICAL ENCLOSURE .................................................................................................................................... 20
11.3 ANTENNA PATTERNS ........................................................................................................................................... 21
11.3.1 X-Y PLANE ...................................................................................................................................................... 21
11.3.2 Y-Z PLANE ...................................................................................................................................................... 21
11.3.3 Z-X PLANE ...................................................................................................................................................... 21
12. EVALUATION BOARDS ............................................................................................................................. 21
13. CUSTOM DEVELOPMENT ......................................................................................................................... 22
14. BLUETOOTH QUALIFICATION ................................................................................................................... 22
15. REGULATORY STATEMENTS ..................................................................................................................... 22
15.1 FCC STATEMENT ................................................................................................................................................ 22
15.2 FCC IMPORTANT NOTES: ..................................................................................................................................... 23
15.3 IC STATEMENT: .................................................................................................................................................. 24
15.4 IC IMPORTANT NOTES: ........................................................................................................................................ 25
15.5 CE REGULATORY: ............................................................................................................................................... 25
15.6 JAPAN (MIC) .................................................................................................................................................... 26
15.7 AUSTRALIA / NEW ZEALAND ................................................................................................................................. 26
16. SOLDER REFLOW TEMPERATURE-TIME PROFILE ...................................................................................... 27
16.1 MOISTURE SENSITIVITY LEVEL ............................................................................................................................... 27
R41Z Module Data Sheet
Thread + Bluetooth 4.2 LE
November 17, 2016
R41Z-DS-1.0 Page 4 of 30
17. PACKAGING AND LABELING ..................................................................................................................... 28
17.1 CARRIER TAPE DIMENSION ................................................................................................................................... 28
17.2 REEL PACKAGING ............................................................................................................................................... 28
17.3 PACKAGING LABEL .............................................................................................................................................. 29
18. CAUTIONS ................................................................................................................................................ 29
19. LIFE SUPPORT POLICY .............................................................................................................................. 30
20. DOCUMENT HISTORY ............................................................................................................................... 30
21. RELATED DOCUMENTS ............................................................................................................................. 30
R41Z Module Data Sheet
Thread + Bluetooth 4.2 LE
November 17, 2016
R41Z-DS-1.0 Page 5 of 30
Table of Figures
FIGURE 1 - BLOCK DIAGRAM ............................................................................................................................... 2
FIGURE 2 - R41Z PIN OUT (TOP VIEW) ................................................................................................................. 7
FIGURE 3 - SCHEMATIC: DCDC BYPASS MODE EXAMPLE ....................................................................................... 10
FIGURE 4 - SCHEMATIC: DCDC BUCK MODE EXAMPLE .......................................................................................... 11
FIGURE 5 - SCHEMATIC: DCDC BUCK MODE PSWITCH EXAMPLE .......................................................................... 12
FIGURE 6 - SCHEMATIC: DCDC BOOST MODE EXAMPLE ........................................................................................ 13
FIGURE 7 - PCB: BOOST MODE SUGGESTED LAYOUT ............................................................................................ 14
FIGURE 8 - SCHEMATIC: LOW FREQUENCY CRYSTAL .............................................................................................. 17
FIGURE 9 - R41Z MAC ADDRESS ON LABEL ......................................................................................................... 18
FIGURE 10 - R41Z MODULE DIMENSIONS ........................................................................................................... 18
FIGURE 11 - R41Z PAD LAYOUT (TOP VIEW) ....................................................................................................... 19
FIGURE 12 - R41Z MODULE MARKING - ENG REV2 ............................................................................................. 19
FIGURE 13 - R41Z RF EXAMPLE BASED ON EVAL BOARD ...................................................................................... 20
FIGURE 14 - R41Z EVALUATION BOARD.............................................................................................................. 21
FIGURE 15 - REFLOW PROFILE FOR LEAD FREE SOLDER .......................................................................................... 27
FIGURE 16 - REEL CARTONS .............................................................................................................................. 28
FIGURE 17 - PACKAGING LABEL ......................................................................................................................... 29
Specification Tables
TABLE 1 - ORDERING PART NUMBERS ................................................................................................................... 2
TABLE 2 - QUICK SPECIFICATIONS ......................................................................................................................... 6
TABLE 3 - R41Z PIN DESCRIPTIONS ...................................................................................................................... 8
TABLE 4 - RIGDFU FUNCTIONS ............................................................................................................................ 8
TABLE 5 - ABSOLUTE MAXIMUM RATINGS ............................................................................................................. 9
TABLE 6 - OPERATING CONDITIONS ...................................................................................................................... 9
TABLE 7 - DCDC MODE CONNECTIONS ............................................................................................................... 10
TABLE 8 - DCDC BUCK MODE CONNECTIONS ...................................................................................................... 11
TABLE 9 - DCDC BOOST MODE CONNECTIONS .................................................................................................... 12
TABLE 10 - GPIO PROPERTIES ........................................................................................................................... 15
TABLE 11 - ANALOG SIGNALS ............................................................................................................................ 15
TABLE 12 - ANALOG PROPERTIES ....................................................................................................................... 16
TABLE 13 – LOW FREQUENCY CRYSTAL RECOMMENDED SPECIFICATIONS ................................................................. 16
R41Z Module Data Sheet
Thread + Bluetooth 4.2 LE
November 17, 2016
R41Z-DS-1.0 Page 6 of 30
5. Quick Specifications
Bluetooth
Version
4.2
Security
AES-128
LE Connections
2
Thread (IEEE 802.15.4)
Security
AES-128
Node Types
Router Eligible, End Device, REED
Radio
Frequency
2.360GHz to 2.483GHz
Modulations
GFSK @ 1Mbps, OQPSK @ 250kbps
Transmit power
+3.5dbm
Receiver sensitivity
-95dBm (BLE), -100dBm (IEEE 802.15.4)
Antenna
Integrated
Current Consumptions
TX only @ 0dBm, bypass mode
14.7 mA
TX only @ 0dBm, DCDC enabled, 3.6V Vin
6.1mA
RX only, bypass mode
16.2mA
RX only, DCDC enabled, 3.6V Vin
6.7mA
Normal Run CPU @ 48MHz @ 3.0V, DCDC enabled
4.8mA
Very-Low-Power Run CPU @ 4MHz @ 3.0V, DCDC enabled
137µA
Very-Low-Leakage Stop 3 (RAM retained) @ 3.0V @ 25°C, DCDC enabled
1.8 µA
Very-Low-Leakage Stop 0 @ 3.0V @25°C, bypass mode
182 nA
Dimensions
Length Width Height
16.2 mm ± 0.3mm
10.6 mm ± 0.3mm
2.1 mm ± 0.1mm
Hardware
Interfaces
SPI Master/Slave x2 UART x1 Touch Sense Interface x16
Two-Wire Mast/Slave (I2C) x2 GPIO x25 Analog input x6
Power Supply
Boost mode: 0.9V to 1.8V, 1.1V required at startup Bypass mode: 1.71V to 3.6V Buck mode: 1.8V to 4.2V, 2.1V required at startup
Temperature Range
-40 to +105 °C
Certifications
FCC
FCC part 15 modular certification ID: 2AA9B07
IC
Industry Canada RSS-210 modular certification IC: 12208A-07
CE
EN 60950-1: 2011-01 3.1 (a): Health and Safety of the User EN 301 489-1 V1.9.2 & 3.1 (b): Electromagnetic Compatibility EN 301 489-17 V2.2.1 EN 300 328 V1.9.1 3.2: Effective use of spectrum allocated
Japan (MIC)
Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan
Australia / New Zealand
AS/NZS 4268 :2012+AMDT 1:2013, Radio equipment and systems – Short range devices
Bluetooth
Pending
Thread
Pending
Table 2 - Quick Specifications
R41Z Module Data Sheet
Thread + Bluetooth 4.2 LE
November 17, 2016
R41Z-DS-1.0 Page 7 of 30
6. Pin Descriptions
6.1 R41Z Pin Functions
Figure 2 - R41Z Pin out (Top View)
GPIO/Analog
Pin
Name
Direction
Description
Default State at POR
2
PTC1
In/Out
GPIO
Disabled
3
PTC2
In/Out
GPIO
Disabled
4
PTC3
In/Out
GPIO
Disabled
5
PTC4
In/Out
GPIO
Disabled
6
PTC5
In/Out
GPIO
Disabled
7
PTC6
In/Out
GPIO
Disabled
8
PTC7
In/Out
GPIO
Disabled
10
PTC16
In/Out
GPIO
Disabled
11
PTC17
In/Out
GPIO
Disabled
12
PTC18
In/Out
GPIO
Disabled
13
PTC19
In/Out
GPIO
Disabled
14
PTA0
In/Out
GPIO
SWDIO, Pullup EN
15
PTA1
In/Out
GPIO
SWCLK, Pulldown EN
17
PTA2
In/Out
GPIO
Reset, Pullup EN
18
PTA16
In/Out
GPIO
Disabled
19
PTA17
In/Out
GPIO
Disabled
20
PTA18
In/Out
GPIO
Disabled
21
PTA19
In/Out
GPIO
Disabled
R41Z Module Data Sheet
Thread + Bluetooth 4.2 LE
November 17, 2016
R41Z-DS-1.0 Page 8 of 30
Pin
Name
Direction
Description
Default State at POR
30
PTB0
In/Out
GPIO
Disabled
31
PTB1
In/Out
GPIO
Disabled
32
PTB2
In/Out
GPIO
Disabled
33
PTB3
In/Out
GPIO
Disabled
34
PTB16
In/Out
GPIO
EXTAL32K
36
PTB17
In/Out
GPIO
XTAL23K
37
PTB18
In/Out
GPIO
Non Maskable Interrupt Req.
38
ADC0_P
In
ADC/Comparator input
N/A
39
ADC0_N
In
ADC/Comparator input
N/A
Reference Signals
Pin
Name
Direction
Description
40
XTAL_OUT
Out
32MHz Clock output
41
VREF
In/Out
Analog reference voltage. Internally or externally sourced
42
VDDA
Power
Analog supply. Internally sourced1
Power
Pin
Name
Direction
Description
22
PSWITCH
Input
DCDC start signal2
23
DCDC_CFG
Input
DCDC mode2
25
VCC
Power
DCDC input2
26
DCDC_LP
Power
DCDC signal2
27
V1P8
Power
DCDC IO and peripheral voltage2
29
V1P5
Power
DCDC RF supply2
1, 9, 16, 24, 28, 35, 43, 44, 45
GND
Power
Electrical Ground
Note 1: VDDA is tied to V1P8 through a power filtering circuit on the R41Z module
Note 2: See the DCDC Converter Operation section for details on signal usage and DCDC modes
Table 3 - R41Z Pin Descriptions
6.2 RigDFU Pin Functions
When loaded with RigDFU, two GPIO pins are configured as UART pins for transferring new firmware images to the R41Z. Pins are configured only when the bootloader is running and are fully available to the application firmware. RigDFU can be removed from the R41Z by performing a full-chip erase.
Pin
Name
Direction
RigDFU Functions
7
PTC6
In
UART-RX for bootloader. Internal pulldown enabled.
8
PTC7
Out
UART-TX for bootloader. Hi-Z until bootloader activation message received on UART RX
Table 4 - RigDFU Functions
R41Z Module Data Sheet
Thread + Bluetooth 4.2 LE
November 17, 2016
R41Z-DS-1.0 Page 9 of 30
7. Electrical Specifications
7.1 Absolute Maximum Ratings
Symbol
Parameter
Condition
Min.
Max.
Unit
V
cc_MAX
Voltage on Supply Pin
DCDC Boost Mode
-0.3
1.8
V
DCDC Bypass Mode
-0.3
3.6
V
DCDC Buck Mode
-0.3
4.2
V
V
1P8_MAX
Voltage on V1P8 and GPIO
All DCDC modes
-0.3
3.6
V
V
RF_MAX
Voltage on V1P5
All DCDC modes
-0.3
3.6
V
TS Storage Temperature
-
-40
125
°C
Table 5 - Absolute Maximum Ratings
7.2 Operating Conditions
Symbol
Parameter
Condition
Min.
Typ.
Max.
Unit
V
cc
Voltage on Supply Pin
DCDC Boost Mode
0.9
1
1.5
1.8
V
DCDC Bypass Mode
1.71
3.3
3.6 V DCDC Buck Mode
1.8
2
3.3
4.2 V V
1P8
Voltage on V1P8 and GPIO
All DCDC modes
1.45
3.3
3.6 V V
RF
Voltage on V1P5
All DCDC modes
1.8
3.3
3.6
V
I
1P8
V1P8 output current
DCDC Buck Mode,
1.8Vout
- - 45
mA
DCDC Buck Mode,
3.0Vout
- - 27
mA
DCDC Boost Mode,
1.7Vin, 1.8 Vout
- - 45
mA
DCDC Boost Mode,
0.9Vin, 3.0Vout
- - 10
mA
TA Ambient Temperature
-
-40
25
85
°C
Note 1: In Boost mode a minimum of 1.1V is required to start the DCDC converter. Once started, the converter can operate at 0.9V
Note 2: In Buck mode a minimum of 2.1V is required to start the DCDC converter.
Table 6 - Operating Conditions
7.3 DCDC Converter Operation
The R41Z module contains an integrated DCDC converter which allows for three modes of operation without additional components. When operating in DCDC Buck mode, power consumption from using the radio can be reduced compared to DCDC Bypass mode. DCDC Boost mode allows the use of a single alkaline or other low voltage source. While it is possible to switch between these modes in a single design, for example the R41Z Evaluation Board, it is not recommended to switch between modes while power is applied.
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