u blox 05 Users Manual

BMD-300-Series-DS V1.7 Page 1 of 34
Rigado LLC 3950 Fairview Industrial Dr. Salem, Oregon 97302 866-6-RIGADO modules@rigado.com www.rigado.com/modules
BMD-300 Series Module for Bluetooth 4.2 LE
The BMD-300 Series from Rigado is a line of powerful, highly flexible, ultra-low power Bluetooth Smart modules based on the nRF52832 SoC from Nordic Semiconductor. With an ARM® Cortex™ M4F CPU, embedded 2.4GHz transceiver, and integrated antenna, they provide a complete RF solution with no additional RF design, allowing faster time to market. Providing full use of the nRF52832’s capabilities and peripherals, the BMD-300 Series can power the most demanding applications, all while simplifying designs and reducing BOM costs. With an internal DC-DC converter and intelligent power control, the BMD-300 Series provide class-leading power efficiency, enabling ultra-low power sensitive applications. Regulatory pre-approvals reduce the burden to enter the market, and the included BMD Software Suite provides access to great features like a secure BLE & UART bootloader, iOS & Android Bluetooth libraries, and more. Available in three variants: internal antenna (BMD-300), U.FL connector (BMD-
301), and ultra-miniature (BMD-350).
1. Features
Based on the Nordic nRF52832 SoC Complete RF solution with integrated antenna
(BMD-300 & BMD-350) or U.FL connector (BMD-
301)
Integrated DC-DC converter No external components required ARM® Cortex™-M4F 32-bit processor Serial Wire Debug (SWD) Nordic SoftDevice ready Over-the-Air (OTA) firmware updates 512kB embedded flash memory 64kB RAM 32 General Purpose I/O Pins 12-bit/200KSPS ADC -40C to +85 Temperature Range BMD Software Suite included FCC: 2AA9B04 (BMD-300/BMD-301) 2AA9B05
(BMD-350)
Three SPI Master/Slave (8 Mbps) Low power comparator Temperature sensor Random Number Generator Two 2-wire Master/Slave (I2C compatible) I2S audio interface UART (w/ CTS/RTS and DMA) 20 channel CPU independent Programmable
Peripheral Interconnect (PPI)
Quadrature Demodulator (QDEC) 128-bit AES HW encryption 5 x 32bit, 3 x 24bit Real Timer Counters (RTC) NFC-A tag interface for OOB pairing BMD-300/301 Dimensions: 14 x 9.8 x 1.9mm BMD-350 Dimensions: 8.7 x 6.4 x 1.5mm IC: 12208A-04 (BMD-300/BMD-301) 12208A-05
(BMD-350)
Japan: 210-106799 (BMD-300) 210-107153 (BMD-301)
2. Applications
App-cessories Beacons – iBeacon, AltBeacon, Eddystone, etc. Low-Power Sensors Lighting Products Fitness devices Wearables
BMD-300 Series Module Datasheet
Bluetooth 4.2 LE
October 20, 2016
BMD-300-Series-DS V1.7 Page 2 of 34
3. Ordering Information
Email modules@rigado.com for quotes and ordering or visit www.rigado.com/BMD-300
Part Number
Description
BMD-300-A-CT
BMD-300 module, Rev A, Cut Tape
BMD-300-A-R
BMD-300 module, Rev A, Tape & Reel, 1000 piece multiples
BMD-301-A-CT
BMD-301 module, Rev A, Cut Tape
BMD-301-A-R
BMD-301 module, Rev A, Tape & Reel, 1000 piece multiples
BMD-350-A-CT
BMD-350 module, Rev A, Cut Tape
BMD-350-A-R
BMD-350 module, Rev A, Tape & Reel, 1000 piece multiples
BMD-300-EVAL-S
BMD-300 Evaluation Kit with Segger J-Link programmer
BMD-301-EVAL-S
BMD-301 Evaluation Kit with Segger J-Link programmer w/antennas
Table 1 – Ordering Part Numbers
4. Block Diagram
BMD-300 Series Modules
32 MHz
Crystal
nRF52832
512kB
Flash
DC-DC
Inductor
Decoupling
Capacitors
Bulk
Capacitors
2.4GHz Radio
Multi-protocol
TWI
Master x2
SPI
Master x3
SPI Slave
X3
DC/DC Buck
Regulator
Core LDO
64
kB RAM
Low Power
Comparator
8-ch 12-bit
ADC
UART
Quadrature
Decoder
SWD Debug &
Programming
Temperature
Sensor
Clock
Management
Watchdog
Timer
Random Number
Gen
Timer x5
Accel Address
Resolver
AES CCM Mode
Encryption
AES ECB
Real Time
Counter x3
GPIO Task
Event Blocks
Programmable
Peripheral
Interconnect
ARM Cortex-M4F
@ 64MHz
Matching
Network
Antenna
/ U.FL
GPIO x32
(Analog x8)
I2S
TWI Slave
x2
PWM PDM
General Purpose
Comparator
NFC Tag
Balun
Figure 1 – Block Diagram
BMD-300 Series Module Datasheet
Bluetooth 4.2 LE
October 20, 2016
BMD-300-Series-DS V1.7 Page 3 of 34
Table of Contents
1. FEATURES ............................................................................................................................................................................... 1
2. APPLICATIONS ........................................................................................................................................................................ 1
3. ORDERING INFORMATION...................................................................................................................................................... 2
4. BLOCK DIAGRAM .................................................................................................................................................................... 2
5. QUICK SPECIFICATIONS .......................................................................................................................................................... 5
6. PIN DESCRIPTIONS ................................................................................................................................................................. 6
6.1 BMD-300 / BMD-301 ..................................................................................................................................................................... 6
6.2 BMD-350 ....................................................................................................................................................................................... 7
6.3 RIGDFU PIN FUNCTIONS ..................................................................................................................................................................... 9
6.4 BMDWARE PIN FUNCTIONS ................................................................................................................................................................. 9
7. ELECTRICAL SPECIFICATIONS ................................................................................................................................................ 10
7.1 ABSOLUTE MAXIMUM RATINGS........................................................................................................................................................... 10
7.2 OPERATING CONDITIONS ................................................................................................................................................................... 10
7.3 GENERAL PURPOSE I/O ..................................................................................................................................................................... 10
7.4 MODULE RESET ............................................................................................................................................................................. 10
7.5 DEBUG & PROGRAMMING ................................................................................................................................................................. 11
7.6 CLOCKS .......................................................................................................................................................................................... 11
8. FIRMWARE ........................................................................................................................................................................... 13
8.1 FACTORY IMAGE .............................................................................................................................................................................. 13
8.1.1 Firmware Version ‘AA’ .............................................................................................................................................................. 13
8.1.2 Firmware Version ‘AB’ .............................................................................................................................................................. 13
8.1.3 Module Programming and Read-Back Protection .................................................................................................................... 13
8.2 SOFTDEVICES .................................................................................................................................................................................. 14
8.2.1 S132 .......................................................................................................................................................................................... 14
8.2.2 S212 .......................................................................................................................................................................................... 14
8.2.3 S332 .......................................................................................................................................................................................... 15
8.3 MAC ADDRESS INFO ........................................................................................................................................................................ 15
9. MECHANICAL DATA .............................................................................................................................................................. 16
9.1 MECHANICAL DIMENSIONS ................................................................................................................................................................. 16
9.1.1 BMD-300 Dimensions ............................................................................................................................................................... 16
9.1.2 BMD-301 Dimensions ............................................................................................................................................................... 16
9.1.3 BMD-350 Dimensions ............................................................................................................................................................... 17
9.2 RECOMMENDED PCB LAND PADS ........................................................................................................................................................ 17
9.2.1 BMD-300/301 ........................................................................................................................................................................... 17
9.2.2 BMD-350 ................................................................................................................................................................................... 18
10. MODULE MARKING .............................................................................................................................................................. 18
10.1 BMD-300 MODULE MARKING .......................................................................................................................................................... 18
10.2 BMD-301 MODULE MARKING .......................................................................................................................................................... 19
10.3 BMD-350 MODULE MARKING .......................................................................................................................................................... 19
11. RF DESIGN NOTES ................................................................................................................................................................. 20
11.1 RECOMMENDED RF LAYOUT & GROUND PLANE ..................................................................................................................................... 20
11.1.1 BMD-300 ................................................................................................................................................................................... 20
11.1.2 BMD-301 ................................................................................................................................................................................... 20
11.1.3 BMD-350 ................................................................................................................................................................................... 20
11.2 MECHANICAL ENCLOSURE .................................................................................................................................................................. 21
11.3 ANTENNA PATTERNS ......................................................................................................................................................................... 22
11.3.1 BMD-300 ................................................................................................................................................................................... 22
11.3.2 BMD-350 ................................................................................................................................................................................... 24
12. EVALUATION BOARDS .......................................................................................................................................................... 25
13. CUSTOM DEVELOPMENT ...................................................................................................................................................... 25
14. BLUETOOTH QUALIFICATION ................................................................................................................................................ 26
15. REGULATORY STATEMENTS .................................................................................................................................................. 26
15.1 FCC STATEMENT: ............................................................................................................................................................................ 26
15.2 FCC IMPORTANT NOTES: ................................................................................................................................................................... 30
15.3 IC STATEMENT: ............................................................................................................................................................................... 28
15.4 IC IMPORTANT NOTES: ...................................................................................................................................................................... 28
15.5 CE REGULATORY: ............................................................................................................................................................................. 29
15.6 JAPAN (MIC) .................................................................................................................................................................................. 29
15.7 AUSTRALIA / NEW ZEALAND ............................................................................................................................................................... 30
15.8 APPROVED EXTERNAL ANTENNAS......................................................................................................................................................... 30
16. SOLDER REFLOW TEMPERATURE-TIME PROFILE ................................................................................................................... 31
BMD-300 Series Module Datasheet
Bluetooth 4.2 LE
October 20, 2016
BMD-300-Series-DS V1.7 Page 4 of 34
16.1 MOISTURE SENSITIVITY LEVEL ............................................................................................................................................................. 31
17. PACKAGING AND LABELING .................................................................................................................................................. 31
17.1 CARRIER TAPE DIMENSIONS ................................................................................................................................................................ 31
17.1.1 BMD-300 & BMD-301 ............................................................................................................................................................... 31
17.1.2 BMD-350 ................................................................................................................................................................................... 32
17.2 REEL PACKAGING ............................................................................................................................................................................. 32
17.3 PACKAGING LABEL ............................................................................................................................................................................ 33
18. CAUTIONS ............................................................................................................................................................................ 33
19. LIFE SUPPORT POLICY ........................................................................................................................................................... 33
20. DOCUMENT HISTORY ........................................................................................................................................................... 34
21. RELATED DOCUMENTS ......................................................................................................................................................... 34
BMD-300 Series Module Datasheet
Bluetooth 4.2 LE
October 20, 2016
BMD-300-Series-DS V1.7 Page 5 of 34
5. Quick Specifications
Bluetooth
Version
4.2 (Bluetooth Smart) Concurrent Central & Peripheral (S132)
Security
AES-128
LE connections
Up to 8 as Central, 1 as Peripheral, Observer, Broadcaster (S132)
Radio
Frequency
2.360GHz to 2.500GHz
Modulations
GFSK at 1 Mbps, 2 Mbps data rates
Transmit power
+4 dBm
Receiver sensitivity
-96 dBm (BLE mode)
Antenna
Integrated
Current Consumption
TX only @ +4 dBm, 0 dBm @ 3V, DCDC enabled
7.5 mA, 5.3 mA
TX only @ +4 dBm, 0 dBm
16.6 mA, 11.6 mA
RX only @ 1 Mbps @ 3V, DCDC enabled
5.4 mA
RX only @ 1 Mbps
11.7 mA
CPU @ 64MHz from flash, from RAM
7.4 mA, 6.7 mA
CPU @ 64MHz from flash, from RAM @ 3V, DCDC
3.7 mA, 3.3 mA
System Off, On
0.3 µA, 1.2 µA
Additional current for RAM retention
30 nA / 4KB block
Dimensions
BMD-300 BMD-301
Length Width Height
14.0 mm ± 0.3mm
9.8 mm ± 0.3mm
1.9 mm ± 0.1mm
BMD-350
Length Width Height
8.7 mm ± 0.2mm
6.4 mm ± 0.2mm
1.5 mm ± 0.1mm
Hardware
Interfaces
SPI Master/Slave x 3 UART Two-Wire Master/Slave (I2C) x 2 GPIO x 32
I2S PWM PDM Power supply
1.7V to 3.6V
Temperature Range
-40 to +85°C
Certifications
FCC
FCC part 15 modular certification BMD-300/BMD-301 FCC ID: 2AA9B04 BMD-350 FCC ID: 2AA9B05
IC
Industry Canada RSS-210 modular certification BMD-300/BMD-301 IC: 12208A-04 BMD-350 IC: 12208A-05
CE
EN 60950-1: 2011-01 3.1 (a): Health and Safety of the User (pending) EN 301 489-1 V1.9.2 & 3.1 (b): Electromagnetic Compatibility EN 301 489-17 V2.2.1 EN 300 328 V1.9.1 3.2: Effective use of spectrum allocated
Japan (MIC)
Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan BMD-300: 210-106799 BMD-301: 210-107153
Australia / New Zealand
AS/NZS 4268 :2012+AMDT 1:2013, Radio equipment and systems – Short range devices
Bluetooth
RF-PHY Component (Tested) – DID: D030629; QDID: 81876
Table 2 – Quick Specifications
BMD-300 Series Module Datasheet
Bluetooth 4.2 LE
October 20, 2016
BMD-300-Series-DS V1.7 Page 6 of 34
6. Pin Descriptions
6.1 BMD-300 / BMD-301
Figure 2 – BMD-300/301 Pin out (Top View)
Pin description
Pin
Name
Direction
Description
6
P0.25
In/Out
GPIO2
7
P0.26
In/Out
GPIO2
8
P0.27
In/Out
GPIO2
9
P0.28
In/Out
GPIO/AIN42
10
P0.29
In/Out
GPIO/AIN52
11
P0.30
In/Out
GPIO/AIN62
12
P0.31
In/Out
GPIO/AIN72
13
P0.00
In/Out
GPIO/XTAL1 (32.768kHz)
14
P0.01
In/Out
GPIO/XTAL2 (32.768kHz)
15
P0.02
In/Out
GPIO/AIN0
19
P0.03
In/Out
GPIO/AIN1
20
P0.04
In/Out
GPIO/AIN2
21
P0.05
In/Out
GPIO/AIN3
22
P0.06
In/Out
GPIO
23
P0.07
In/Out
GPIO
24
P0.08
In/Out
GPIO
25
P0.09
In/Out
GPIO/NFC1
26
P0.10
In/Out
GPIO/NFC2
27
P0.11
In/Out
GPIO
28
P0.12
In/Out
GPIO
31
P0.13
In/Out
GPIO
32
P0.14
In/Out
GPIO/TRACEDATA[3]
33
P0.15
In/Out
GPIO/TRACEDATA[2]
BMD-300 Series Module Datasheet
Bluetooth 4.2 LE
October 20, 2016
BMD-300-Series-DS V1.7 Page 7 of 34
Pin
Name
Direction
Description
34
P0.16
In/Out
GPIO/TRACEDATA[1]
35
P0.17
In/Out
GPIO
36
P0.18
In/Out
GPIO/TRACEDATA[0]/SWO
37
P0.19
In/Out
GPIO
38
P0.20
In/Out
GPIO/TRACECLK
39
P0.21
In/Out
GPIO/RESET
40
P0.22
In/Out
GPIO2
41
P0.23
In/Out
GPIO2
42
P0.24
In/Out
GPIO2
43
SWCLK
In
SWD Clock
44
SWDIO
In/Out
SWD IO
17
VCC
Power
+1.7V to +3.6V1
1, 2, 3, 4, 5, 16, 18, 29, 30, 45, 46, 47
GND
Power
Electrical Ground
Note 1: An internal 4.7µF bulk capacitor is included on the module. However, it is good design practice to add additional bulk capacitance as required for your application, i.e. those with heavy GPIO usage and/or current draw.
Note 2: These pins are in close proximity to the nRF52 radio power supply and antenna pins. Radio performance parameters, such as sensitivity, may be affected by high frequency digital I/O with large sink/source current on these pins. Nordic recommends using only low frequency, low-drive functions when possible.
Table 3 – BMD-300/301 Pin Descriptions
6.2 BMD-350
Figure 3 – BMD-350 Pin out (Top View)
Pin description
Pin
Name
Direction
Description
4
SWCLK
In
SWD Clock
5
SWDIO
In/Out
SWD IO
6
P0.20
In/Out
GPIO/TRACECLK
7
P0.21
In/Out
GPIO/RESET
BMD-300 Series Module Datasheet
Bluetooth 4.2 LE
October 20, 2016
BMD-300-Series-DS V1.7 Page 8 of 34
Pin
Name
Direction
Description
8
P0.18
In/Out
GPIO/TRACEDATA[0]/SWO
9
P0.16
In/Out
GPIO/TRACEDATA[1]
10
P0.17
In/Out
GPIO
11
P0.15
In/Out
GPIO/TRACEDATA[2]
12
P0.13
In/Out
GPIO
13
P0.12
In/Out
GPIO
14
P0.14
In/Out
GPIO/TRACEDATA[3]
16
P0.09
In/Out
GPIO/NFC1
17
P0.10
In/Out
GPIO/NFC2
18
P0.11
In/Out
GPIO
19
P0.06
In/Out
GPIO
20
P0.08
In/Out
GPIO
21
P0.05
In/Out
GPIO/AIN3
22
P0.07
In/Out
GPIO
23
P0.01
In/Out
GPIO/XTAL2 (32.768kHz)
24
P0.00
In/Out
GPIO/XTAL1 (32.768kHz)
27
P0.04
In/Out
GPIO/AIN2
28
P0.02
In/Out
GPIO/AIN0
29
P0.30
In/Out
GPIO/AIN62
30
P0.31
In/Out
GPIO/AIN72
31
P0.29
In/Out
GPIO/AIN52
32
P0.27
In/Out
GPIO2
33
P0.25
In/Out
GPIO2
34
P0.26
In/Out
GPIO2
35
P0.23
In/Out
GPIO2
36
P0.24
In/Out
GPIO2
41
P0.22
In/Out
GPIO2
42
P0.19
In/Out
GPIO
44
P0.03
In/Out
GPIO/AIN1
45
P0.28
In/Out
GPIO/AIN42
25
VCC
Power
+1.7V to +3.6V1
1, 2, 3, 15, 26, 37, 38, 39, 40, 43, 46, 47
GND
Power
Electrical Ground
Note 1: An internal 4.7µF bulk capacitor is included on the module. However, it is good design practice to add additional bulk capacitance as required for your application, i.e. those with heavy GPIO usage and/or current draw.
Note 2: These pins are in close proximity to the nRF52 radio power supply and antenna pins. Radio performance parameters, such as sensitivity, may be affected by high frequency digital I/O with large sink/source current on these pins. Nordic recommends using only low frequency, low-drive functions when possible.
Table 4 – BMD-350 Pin Descriptions
BMD-300 Series Module Datasheet
Bluetooth 4.2 LE
October 20, 2016
BMD-300-Series-DS V1.7 Page 9 of 34
6.3 RigDFU Pin Functions
Rigado RigDFU is programmed on the BMD-300 Series at the factory. Two GPIO pins are configured as UART pins for transferring new firmware images to the BMD-300. Pins are configured only when bootloader is running, and are fully available to the application firmware. RigDFU can be removed from the BMD-300 by performing a full­chip erase.
BMD-300/1
Pin
BMD-350
Pin
Name
Direction
RigDFU Functions
22
19
P0.06
Out
UART TX for bootloader
Hi-Z until bootloader activation message received on UART RX.
24
20
P0.08
In
UART RX for bootloader
Internal 12kΩ pull-down enabled
Table 5 – RigDFU Functions
6.4 BMDware Pin Functions
Rigado BMDware is programmed on the BMD-300 Series at the factory. BMDware provides UART-to-BLE Bridge, beaconing, and Direct Test Mode (DTM) functionality. The pins in Table 6 below describe the pin functionality in BMDware. DTM Mode, Beacon-Only Mode, and AT Command Mode pin states are checked at BMDware start-up to configure BMDware as required by the user, and are then set to Hi-Z to conserve power. For further details on BMDware operation, please see the BMDware Datasheet that can be found at www.rigado.com. BMDware can be overwritten by RigDFU with custom application firmware, or removed along with RigDFU by a full chip erase.
BMD-300/1
Pin
BMD-350
Pin
Name
Direction
BMDware Functions
21
21
P0.05
Out
Bridge UART RTS
Disabled in Beacon-Only & DTM modes, N/C if not used.
22
19
P0.06
Out
Bridge UART TX
Disabled in Beacon-Only & DTM modes, N/C if not used.
23
22
P0.07
In
Bridge UART CTS
Disabled in Beacon-Only & DTM modes, N/C if not used.
24
20
P0.08
In
Bridge UART RX Disabled in Beacon-Only & DTM modes, N/C if not used.
27
18
P0.11
Out
DTM UART TX
Only enabled in DTM mode; N/C if not used.
28
13
P0.12
In
DTM UART RX / DTM Mode
Only enabled in DTM mode; N/C if not used. On BMDware Start-up: High = Enter DTM mode; Low = Enter Normal Operation
Internal 12kΩ pull-down during BMDware start-up, then Hi-Z
31
12
P0.13
In
Beacon Only Mode
On BMDware Start-up: High = Bridge UART enabled; Low = Bridge UART disabled
Internal 12kΩ pull-up during BMDware start-up, then Hi-Z
32
14
P0.14
In
UART AT Command Mode On BMDware Start-up: High = Full pass-through mode; Low = AT command mode
Internal 12kΩ pull-up during BMDware start-up, then Hi-Z
Table 6 – BMDware Functions at Start-up
BMD-300 Series Module Datasheet
Bluetooth 4.2 LE
October 20, 2016
BMD-300-Series-DS V1.7 Page 10 of 34
7. Electrical Specifications
7.1 Absolute Maximum Ratings
Symbol
Parameter
Min.
Max.
Unit
V
CC_MAX
Voltage on supply pin
-0.3
3.9
V
V
IO_MAX
Voltage on GPIO pins (VCC > 3.6V)
-0.3
3.9
V
V
IO_MAX
Voltage on GPIO pins (VCC ≤ 3.6V)
-0.3
VCC + 0.3V
V
TS
Storage Temperature Range
-40
125
°C
Table 7 – Absolute Maximum Ratings
7.2 Operating Conditions
Symbol
Parameter
Min.
Typ.
Max.
Unit
VCC
Operating supply voltage
1.7
3.0
3.6 V T
R_VCC
Supply rise time (0V to 1.7V)
- - 60
ms
TA
Operating Ambient Temperature Range
-40
25
85
°C
Table 8 – Operating Conditions
7.3 General Purpose I/O
The general purpose I/O is organized as one port enabling access and control of the 32 available GPIO pins through one port. Each GPIO can be accessed individually with the following user configurable features:
Input/output direction Output drive strength Internal pull-up and pull-down resistors Wake-up from high or low level triggers on all pins Trigger interrupt on all pins All pins can be used by the PPI task/event system; the maximum number of pins that can be interfaced
through the PPI at the same time is limited by the number of GPIOTE channels
All pins can be individually configured to carry serial interface or quadrature demodulator signals
Symbol
Parameter
Min.
Typ.
Max.
Unit
VIH
Input High Voltage
0.7 x VCC
-
VCC V VIL
Input Low Voltage
VSS
-
0.3 x VCC
V
VOH
Output High Voltage
V
CC
0.4
-
VCC
V
VOL
Output Low Voltage
VSS
-
V
SS
+ 0.4 V RPU
Pull-up Resistance
11
13
16
kΩ
RPD
Pull-down Resistance
11
13
16
kΩ
Table 9 – GPIO
7.4 Module RESET
GPIO pin P0.21 may be used for a hardware reset. In order to utilize P0.21 as a hardware reset, the UICR registers PSELRESET[0] and PSELRESET[1] must be set alike, to the value of 0x7FFFFF15. When P0.21 is programmed as RESET, the internal pull-up is automatically enabled. Rigado and Nordic example applications and development kits program P0.21 as RESET.
BMD-300 Series Module Datasheet
Bluetooth 4.2 LE
October 20, 2016
BMD-300-Series-DS V1.7 Page 11 of 34
7.5 Debug & Programming
The BMD-300 Series supports the two pin Serial Wire Debug (SWD) interface and offers flexible and powerful mechanism for non-intrusive debugging of program code. Breakpoints, single stepping, and instruction trace capture of code execution flow are part of this support.
The BMD-300 also supports ETM and ITM trace. Trace data from the ETM and the ITM is sent to an external debugger via a 4-bit wide parallel trace port. In addition to parallel trace, the TPIU supports serial trace via the Serial Wire Output (SWO) trace protocol.
7.6 Clocks
The BMD-300 Series requires two clocks, a high frequency clock and a low frequency clock.
The high frequency clock is provided on-module by a high-accuracy 32-MHz crystal as required by the nRF52832 for radio operation.
The low frequency clock can be provided internally by an RC oscillator or synthesized from the fast clock; or externally by a 32.768 kHz crystal. An external crystal provides the lowest power consumption and greatest accuracy. Using the internal RC oscillator with calibration provides acceptable performance for BLE applications at a reduced cost and slight increase in power consumption. Note: the ANT protocol requires the use of an external crystal.
32.768 kHz Crystal (LFXO)
Symbol
Parameter
Typ.
Max.
Unit
F
NOM_LFXO
Crystal frequency
32.768
-
kHz
F
TOL_LFXO_BLE
Frequency tolerance, BLE applications
-
±250
ppm
C
L_LFXO
Load Capacitance
-
12.5
pF
C
0_LFXO
Shunt Capacitance
-
2
pF
R
S_LFXO
Equivalent series resistance
-
100
kΩ
C
pin
Input Capacitance on XL1 & XL2 pads
4
-
pF
Table 10 – 32.768 kHz Crystal
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