BMD-300 Series Module Datasheet
Bluetooth 4.2 LE
October 20, 2016
BMD-300-Series-DS V1.7 Page 3 of 34
Table of Contents
1. FEATURES ............................................................................................................................................................................... 1
2. APPLICATIONS ........................................................................................................................................................................ 1
3. ORDERING INFORMATION...................................................................................................................................................... 2
4. BLOCK DIAGRAM .................................................................................................................................................................... 2
5. QUICK SPECIFICATIONS .......................................................................................................................................................... 5
6. PIN DESCRIPTIONS ................................................................................................................................................................. 6
6.1 BMD-300 / BMD-301 ..................................................................................................................................................................... 6
6.2 BMD-350 ....................................................................................................................................................................................... 7
6.3 RIGDFU PIN FUNCTIONS ..................................................................................................................................................................... 9
6.4 BMDWARE PIN FUNCTIONS ................................................................................................................................................................. 9
7. ELECTRICAL SPECIFICATIONS ................................................................................................................................................ 10
7.1 ABSOLUTE MAXIMUM RATINGS........................................................................................................................................................... 10
7.2 OPERATING CONDITIONS ................................................................................................................................................................... 10
7.3 GENERAL PURPOSE I/O ..................................................................................................................................................................... 10
7.4 MODULE RESET ............................................................................................................................................................................. 10
7.5 DEBUG & PROGRAMMING ................................................................................................................................................................. 11
7.6 CLOCKS .......................................................................................................................................................................................... 11
8. FIRMWARE ........................................................................................................................................................................... 13
8.1 FACTORY IMAGE .............................................................................................................................................................................. 13
8.1.1 Firmware Version ‘AA’ .............................................................................................................................................................. 13
8.1.2 Firmware Version ‘AB’ .............................................................................................................................................................. 13
8.1.3 Module Programming and Read-Back Protection .................................................................................................................... 13
8.2 SOFTDEVICES .................................................................................................................................................................................. 14
8.2.1 S132 .......................................................................................................................................................................................... 14
8.2.2 S212 .......................................................................................................................................................................................... 14
8.2.3 S332 .......................................................................................................................................................................................... 15
8.3 MAC ADDRESS INFO ........................................................................................................................................................................ 15
9. MECHANICAL DATA .............................................................................................................................................................. 16
9.1 MECHANICAL DIMENSIONS ................................................................................................................................................................. 16
9.1.1 BMD-300 Dimensions ............................................................................................................................................................... 16
9.1.2 BMD-301 Dimensions ............................................................................................................................................................... 16
9.1.3 BMD-350 Dimensions ............................................................................................................................................................... 17
9.2 RECOMMENDED PCB LAND PADS ........................................................................................................................................................ 17
9.2.1 BMD-300/301 ........................................................................................................................................................................... 17
9.2.2 BMD-350 ................................................................................................................................................................................... 18
10. MODULE MARKING .............................................................................................................................................................. 18
10.1 BMD-300 MODULE MARKING .......................................................................................................................................................... 18
10.2 BMD-301 MODULE MARKING .......................................................................................................................................................... 19
10.3 BMD-350 MODULE MARKING .......................................................................................................................................................... 19
11. RF DESIGN NOTES ................................................................................................................................................................. 20
11.1 RECOMMENDED RF LAYOUT & GROUND PLANE ..................................................................................................................................... 20
11.1.1 BMD-300 ................................................................................................................................................................................... 20
11.1.2 BMD-301 ................................................................................................................................................................................... 20
11.1.3 BMD-350 ................................................................................................................................................................................... 20
11.2 MECHANICAL ENCLOSURE .................................................................................................................................................................. 21
11.3 ANTENNA PATTERNS ......................................................................................................................................................................... 22
11.3.1 BMD-300 ................................................................................................................................................................................... 22
11.3.2 BMD-350 ................................................................................................................................................................................... 24
12. EVALUATION BOARDS .......................................................................................................................................................... 25
13. CUSTOM DEVELOPMENT ...................................................................................................................................................... 25
14. BLUETOOTH QUALIFICATION ................................................................................................................................................ 26
15. REGULATORY STATEMENTS .................................................................................................................................................. 26
15.1 FCC STATEMENT: ............................................................................................................................................................................ 26
15.2 FCC IMPORTANT NOTES: ................................................................................................................................................................... 30
15.3 IC STATEMENT: ............................................................................................................................................................................... 28
15.4 IC IMPORTANT NOTES: ...................................................................................................................................................................... 28
15.5 CE REGULATORY: ............................................................................................................................................................................. 29
15.6 JAPAN (MIC) .................................................................................................................................................................................. 29
15.7 AUSTRALIA / NEW ZEALAND ............................................................................................................................................................... 30
15.8 APPROVED EXTERNAL ANTENNAS......................................................................................................................................................... 30
16. SOLDER REFLOW TEMPERATURE-TIME PROFILE ................................................................................................................... 31