TYAN YR188-B537M Service Manual

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YR188-B537M
Service Engineer’s Manual
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PREFACE
Copyright
This publication, including all photographs, illustrations, and software, is protected under international copyright laws, with all rights reserved. Neither this manual, nor any material contained herein, may be reproduced without written consent of manufacturer.
Copyright 2009 MiTAC International Corporation. All rights reserved. TYAN® is a registered trademark of MiTAC International Corporation.
Version 1.00
Disclaimer
Information contained in this document is furnished by MiTAC International Corporation and has been reviewed for accuracy and reliability prior to printing. MiTAC assumes no liability whatsoever, and disclaims any
express or implied warranty, relating to sale and/or use of TYAN® products including liability or warranties relating to fitness for a particular purpose or merchantability. MiTAC retains the right to make changes to produce descriptions and/or specifications at any time, without notice. In no event will MiTAC be held liable for any direct or indirect, incidental or consequential damage, loss of use, loss of data or other malady resulting from errors or inaccuracies of information contained in this document.
Trademark Recognition
All registered and unregistered trademarks and company names contained in this manual are property of their respective owners including, but not limited to the following.
TYAN® is a trademark of MiTAC International Corporation. Intel
®
is a trademark of Intel® Corporation.
AMI
®
, AMIBIOS® and combinations thereof are trademarks of AMI Technologies. Microsoft®, Windows® are trademarks of Microsoft Corporation. IBM
®
, PC®, AT® and PS/2® are trademarks of IBM Corporation. Winbond
®
is a trademark of Winbond Electronics Corporation.
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Federal Communication Commission (FCC)
Notice for the USA
Compliance Information Statement (Declaration of Conformity Procedure) DoC FCC Part 15: This device complies with part 15 of the FCC Rules
Operation is subject to the following conditions:
1) This device may not cause harmful interference;
2) This device must accept any interference received including interference that may cause undesired operation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try one or more of the following measures:
– Reorient or relocate the receiving antenna. – Increase the separation between the equipment and the receiver. – Plug the equipment into an outlet on a circuit different from that of
the receiver.
Consult the dealer on an experienced radio/television technician for help.
Notice for Canada
This apparatus complies with the Class A limits for radio interference as specified in the Canadian Department of Communications Radio Interference Regulations. (Cet appareil est conforme aux norms de Classe A d’interference radio tel que specifie par le Ministere Canadien des Communications dans les reglements d’ineteference radio.)
Notice for Europe (CE Mark) This product is in conformity with the Council Directive 89/336/EEC, 92/31/EEC (EMC).
CAUTION: Lithium battery included with this board. Do not puncture, mutilate, or dispose of battery in fire. There will be danger of explosion if battery is incorrectly replaced. Replace only with the same or equivalent type recommended by manufacturer. Dispose of used battery according to manufacturer instructions and in accordance with your local regulations.
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About this Manual
This manual provides you with instructions on installing your TYAN YR188-B537M. This Manual is intended for experienced users and integrators with hardware knowledge of personal computers.
This manual consists of the following parts:
Chapter1:
Provides an introduction to the TYAN YR188-B537M barebones, standard parts list, describes the external components, gives a table of key components, and provides block diagram of the system.
Chapter2:
Covers procedures on installing the CPU, memory modules and hard drives.
Chapter3:
Covers removal and replacement procedures for pre-installed components.
Chapter4:
Covers the block diagram, MB layout and pin definitions for headers and jumpers.
Chapter5:
Covers various BIOS settings that can be used to
configure your system.
Appendix:
List the cable connection and FRU part tables for reference of system setup, and technical support
in
case a problem arises with your system.
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SAFETY INFORMATION
Before installing and using TYAN YR188-B537M, take note of the following precautions:
·Read all instructions carefully.
·Do not place the unit on an unstable surface, cart, or stand.
·Do not block the slots and opening on the unit, which are provided for
ventilation.
·Only use the power source indicated on the marking label. If you are not sure, contact the power company.
·The unit uses a three-wire ground cable, which is equipped with a third pin to ground the unit and prevent electric shock. Do not defeat the purpose of this pin. If you outlet does not support this kind of plug, contact your electrician to replace your obsolete outlet.
·Do not place anything on the power cord. Place the power cord where it will not be in the way of foot traffic.
·Follow all warnings and cautions in this manual and on the unit case.
·Do not push objects in the ventilation slots as they may touch high
voltage components and result in shock and damage to the components.
·When replacing parts, ensure that you use parts specified by the
manufacturer.
·When service or repairs have been done, perform routine safety checks to verify that the system is operating correctly.
·Avoid using the system near water, in direct sunlight, or near a heating device.
·Cover the unit when not in use.
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Table of Contents
Chapter 1: Overview......................................................................... 9
1.1 About the TYAN YR188-B537M ............................................... 9
1.2 Product Models....................................................................... 10
1.3 Features.................................................................................. 11
1.4 Standard Parts List ................................................................. 15
1.4.1 Box Contents Per Node................................................... 15
1.4.2 Accessories ..................................................................... 16
1.5 About the Product................................................................... 18
1.5.1 System Front View (Per Node)........................................ 18
1.5.2 System Rear View (Per Node) ........................................ 20
1.5.3 Internal View (Per Node) ................................................. 21
Chapter 2: Setting Up..................................................................... 23
2.0.1 Before you Begin ............................................................. 23
2.0.2 Work Area........................................................................ 23
2.0.3 Tools ................................................................................ 23
2.0.4 Precautions...................................................................... 24
2.1 Installing Motherboard Components....................................... 25
2.1.1 Installing Hard Drives....................................................... 25
2.1.2 Installing the CPU and Heatsink...................................... 28
2.1.3 Installing the Memory....................................................... 31
2.2 Rack Mounting........................................................................ 33
2.2.1 Installing the Server in a Rack......................................... 33
2.2.2 Installing the inner Rails to the Chassis........................... 34
2.2.3 Installing the Outer Rails to the Rack .............................. 35
2.2.4 Rack mounting the Server ............................................... 36
Chapter 3: Replacing Pre-Installed Components ........................37
3.1 Introduction ............................................................................. 37
3.2 Disassembly Flowchart........................................................... 37
3.3 Removing the Cover............................................................... 39
3.4 Replacing Motherboard Components..................................... 39
3.4.1 Replacing Expansion Card .............................................. 39
3.4.2 Disconnecting All Motherboard Cables ........................... 41
3.4.3 Removing the Motherboard ............................................. 42
3.5 Replacing the Power Distribution Board ............................... 43
3.6 Replacing the Front Panel Board.......................................... 44
3.6.1 Front Panel Board Features ............................................ 46
3.6.2 Front Panel Board Connector Pin Definition ................... 46
3.7 Replacing the System Fan.................................................... 47
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3.8 Replacing the SATA Backplane Board................................. 49
3.8.1 SATA Backplane Board Features.................................... 50
3.8.2 SATA Backplane Board Connector Pin Definitions ......... 51
Chapter 4: Hardware Setup............................................................55
4.1 Motherboard (S537M) Image ................................................. 55
4.2 System Block Diagram ........................................................... 56
4.3 Board Parts, Jumpers and Connectors .................................. 57
4.4 Installing Optional SO-DIMM modules ................................... 63
Chapter 5: BIOS Setup ................................................................... 65
5.1 About the BIOS....................................................................... 65
5.2 BIOS Menu Bar....................................................................... 65
5.3 Setup Basics........................................................................... 66
5.4 Getting Help............................................................................ 66
5.5 In Case of Problems ............................................................... 66
5.6 BIOS Main Menu .................................................................... 67
5.7 Advanced Menu...................................................................... 68
5.7.1 CPU Configuration........................................................... 70
5.7.2 IDE Configuration Sub-Menu........................................... 72
5.7.3 Super IO Configuration Sub-Menu .................................. 76
5.7.4 USB Configuration Sub-Menu ......................................... 77
5.7.5 ACPI Configuration Sub-Menu ........................................ 80
5.7.6 AHCI Configuration Sub-Menu ........................................ 83
5.7.7 APM Configuration........................................................... 85
5.7.8 Event Log Configuration Sub-Menu ................................ 87
5.7.9 Hardware Health Configuration Sub-Menu ..................... 88
5.7.10 PCI Express Configuration Sub-Menu........................... 92
5.7.11 Remote Access Configuration Sub-Menu ..................... 93
5.8 PCI PnP Menu ........................................................................ 95
5.9 Boot Menu .............................................................................. 97
5.9.1 Boot Settings Configuration Sub-Menu ........................... 98
5.9.2 Boot Device Priority Sub-menu ..................................... 100
5.9.3 Hard Disk Drives Sub-menu .......................................... 101
5.9.4 CD/DVD Drives Sub-menu ............................................ 102
5.10 Security Menu..................................................................... 103
5.11 Chipset Menu...................................................................... 105
5.11.1 North Bridge Configuration Sub-Menu ........................ 106
5.11.2 South Bridge Configuration Sub-Menu........................ 108
5.12 Exit Menu............................................................................ 110
Appendix I: Cable Connection Tables ........................................ 113
Appendix II: FRU Parts Table ...................................................... 115
Appendix III: Technical Support.................................................. 117
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Chapter 1: Overview
1.1 About the TYAN YR188-B537M
Congratulations on your purchase of the TYAN
®
YR188-B537M, a highly
optimized rack-mountable barebone system. The YR188-B537M is designed to support one Intel
®
5200/5400 processor and up to 32GB
DDR2-667/533 memory per node, providing a rich feature set and incredible performance. Leveraging advanced technology from Intel
®
, YR188-B537M server system is capable of offering scalable 32 and 64-bit computing, high bandwidth memory design, and lightning-fast PCI-E bus implementation. The YR188-B537M not only empowers your company in nowadays IT demand but also offers a smooth path for future application usage.
TYAN® is also proud to deliver the YR188-B537M in flavor while supporting up to eight hot-swap hard drives (four per node). The
YR188-B537M uses TYAN
®
’s latest chassis featuring a robust structure and a solid mechanical enclosure. All of this provides YR188-B537M the power and flexibility to meet the needs of nowadays server application.
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1.2 Product Models
Model HDD Bays Power supply
B537MY188S1
(one node)
Hot-swap, 4 HDDs (1) 450W
B537MY188S2
(two nodes)
Hot-swap, 8 HDDs (2) 450W
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1.3 Features
TYAN YR188-B537M (B537MY188S2)
Form Factor
1U Rackmount
Chassis Name
YR188
Dimension (H x W x D)
1.71" x 17.26" x 28.74" (43.5 x 438.5 x 730mm)
Node Carrier Dimension
1.61" x 8.35" x 28.74" (40.8 x 212 x 730mm)
System
Feature
Two nodes in one chassis
Buttons
(1) RST / (1) ID / (1) PWR
LEDs
(1) Power / (1) BMC / (2) LAN / (1) HDD
Front Panel
I/O Ports
(2) USB ports
Type / Q'ty
2.5" Hot-Swap / (4) per node, total (8)
External Drive Bay
Supported HDD Interface
SATA-II 3.0Gb/s
System Cooling Configuration
FAN (3) 4cm fans per node, total (6)
Output Watts
(1) 450 Watts per node, total (2)
Power Supply
Efficiency
PFC
Supported CPU Series
Intel® Xeon® processor 5400/5200 series
Socket Type / Q'ty
LGA771
Thermal Design Power (TDP) wattage
80W
Processor
System Bus
FSB 1333/1066MHz
MCH / ICH
Intel 5100 / ICH9R
Chipset
Super I/O
Winbond W83627DHG
Supported DIMM Qty
(8) DIMM sockets per node, total (16)
DIMM Type / Speed
DDR2 667/533 RDIMM
Capacity
Up to 32GB RDIMM per node, total 64GB
Memory
Memory channel
2 Channels
PCI-E
(1) PCI-E Low-Profile x16 slot per node, total (2)
Expansion Slots
Pre-installed TYAN Riser Card
M2087-R, PCI-E x16 1U riser card (right)
Port Q'ty
(2) per node, total (4)
LAN
Controller
Intel 82571EB
Controller
ICH9R
Speed
3.0 Gb/s
Storage SATA
RAID
RAID 0/1/10/5 (Intel
®
Matrix RAID)
Graphic Chipset
XGI Volari™ Z9s
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USB
(4) ports (2 at front, 2 at rear) per node, total (8)
COM
(1) DB-9 port per node, total (2)
VGA
(1) D-sub port per node, total (2)
I/O Ports
RJ-45
(3) ports per node, total (6)
Chipset Winbond W83793G
Voltage
Monitors voltage for CPU, memory, chipset & power supply
Temperature Monitors temperature for CPU & system environment
LED
Fan fail LED indicator / Over temperature warning indicator
System Monitoring
Others Watchdog timer support
Optional SMDC M3296 IPMI 2.0 remote system management card
Server Management
M3296 Feature
KIRA 100 (Single Chip KVM/IP+IPMI processor) / KVM over IP / Video output over LAN (1280x1024) / Card interface: DDR2 SO-DIMM socket / USB2 high speed interface / Remote CD-ROM (media) redirect / Remote power on/off, reset and soft off
Brand / ROM size AMI / 1MB
BIOS
Feature
Plug and Play (PnP) /PCI2.3 /WfM2.0 /SMBIOS2.3 /PXE boot / ACPI 2.0 power management /Power on mode after power recovery / User-configurable H/W monitoring / Auto-configurable of hard disk types / Multiple boot options
Operating System OS supported list
Please refer to our OS supported list.
FCC (DoC) Class A
Regulation
CE (DoC) Yes
Operating Temp. 10° C ~ 35° C (50° F~ 95° F)
Non-operating Temp. - 40° C ~ 70° C (-40° F ~ 158° F)
Operating Environment
In/Non-operating Humidity 90%, non-condensing at 35° C
RoHS RoHS 6/6 Complaint Yes
Barebone (1) B537MY188S2 Barebone
Manual (1) MB Quick Reference + (1) BB User's manual
Installation CD (1) TYAN installation CD
Heatsink / Cooler (2) LGA771 CPU heatsinks
Rail kit (1) sliding rail kit
Contains
Cable Power Cord
(2) CCBL-0310, US type power cord / (2) CCBL-0300, EU type power cord
Optional accessories for future upgrade
SMDC IPMI Card M3296
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TYAN YR188-B537M (B537MY188S1)
Form Factor
1U Rackmount
Chassis Name
YR188
Dimension (H x W x D)
1.71" x 17.26" x 28.74" (43.5 x 438.5 x 730mm)
Node Carrier Dimension
1.61" x 8.35" x 28.74" (40.8 x 212 x 730mm)
System
Feature
One nodes in one chassis
Buttons
(1) RST / (1) ID / (1) PWR
LEDs
(1) Power / (1) BMC / (2) LAN / (1) HDD
Front Panel
I/O Ports
(2) USB ports
Type / Q'ty
2.5" Hot-Swap / (4) per node
External Drive Bay
Supported HDD Interface
SATA-II 3.0Gb/s
System Cooling Configuration
FAN (3) 4cm fans per node
Output Watts
(1) 450 Watts per node
Power Supply
Efficiency
PFC
Supported CPU Series
Intel® Xeon® processor 5400/5200 series
Socket Type / Q'ty
LGA771
Thermal Design Power (TDP) wattage
80W
Processor
System Bus
FSB 1333/1066MHz
MCH / ICH
Intel 5100 / ICH9R
Chipset
Super I/O
Winbond W83627DHG
Supported DIMM Qty
(8) DIMM sockets per node
DIMM Type / Speed
DDR2 667/533 RDIMM
Capacity
Up to 32GB RDIMM per node
Memory
Memory channel
2 Channels
PCI-E
(1) PCI-E Low-Profile x16 slot per node
Expansion Slots
Pre-installed TYAN Riser Card
M2087-R, PCI-E x16 1U riser card (right)
Port Q'ty
(2) per node
LAN
Controller
Intel 82571EB
Controller
ICH9R
Speed
3.0 Gb/s
Storage SATA
RAID
RAID 0/1/10/5 (Intel
®
Matrix RAID)
Graphic Chipset
XGI Volari™ Z9s
USB
(4) ports (2 at front, 2 at rear) per node
I/O Ports
COM
(1) DB-9 port per node
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VGA
(1) D-sub port per node
RJ-45
(3) ports per node
Chipset Winbond W83793G
Voltage
Monitors voltage for CPU, memory, chipset & power supply
Temperature Monitors temperature for CPU & system environment
LED
Fan fail LED indicator / Over temperature warning indicator
System Monitoring
Others Watchdog timer support
Optional SMDC M3296 IPMI 2.0 remote system management card
Server Management
M3296 Feature
KIRA 100 (Single Chip KVM/IP+IPMI processor) / KVM over IP / Video output over LAN (1280x1024) / Card interface: DDR2 SO-DIMM socket / USB2 high speed interface / Remote CD-ROM (media) redirect / Remote power on/off, reset and soft off
Brand / ROM size AMI / 1MB
BIOS
Feature
Plug and Play (PnP) /PCI2.3 /WfM2.0 /SMBIOS2.3 /PXE boot / ACPI 2.0 power management /Power on mode after power recovery / User-configurable H/W monitoring / Auto-configurable of hard disk types / Multiple boot options
Operating System OS supported list Please refer to our OS supported list.
FCC (DoC) Class A
Regulation
CE (DoC) Yes
Operating Temp. 10° C ~ 35° C (50° F~ 95° F)
Non-operating Temp. - 40° C ~ 70° C (-40° F ~ 158° F)
Operating Environment
In/Non-operating Humidity 90%, non-condensing at 35° C
RoHS RoHS 6/6 Complaint Yes
Barebone (1) B537MY188S1 Barebone
Manual (1) MB Quick Reference + (1) BB User's manual
Installation CD (1) TYAN installation CD
Heatsink / Cooler (1) LGA771 CPU heatsink
Rail kit (1) sliding rail kit
Contains
Cable Power Cord
(2) CCBL-0310, US type power cord / (2) CCBL-0300, EU type power cord
Optional accessories for future upgrade
SMDC IPMI Card M3296
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1.4 Standard Parts List
This section describes the YR188-B537M package contents and accessories. Open the box carefully and ensure that all components are present and undamaged. The product should arrive packaged as illustrated below.
1.4.1 Box Contents Per Node
Component Description
1U chassis, 2 nodes (B537MY188S2) 1U chassis, 1 node (B537MY188S1) (4) hot swap HDD bays per node
TYAN® S537M system board (pre-installed)
450W single Power Supply (pre-installed)
(3) System FAN (pre-installed)
Power Distribution Board (pre-installed)
SATA HDD Backplane Board (pre-installed)
M2087-R PCI-E riser card (pre-installed)
Front Panel Board (pre-installed)
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1.4.2 Accessories
If any items are missing or appear damaged, contact your retailer or browse to TYAN
®
’s website for service: http://www.tyan.com
The web site also provides information of other TYAN
®
products, as
well as FAQs, compatibility lists, BIOS settings, etc.
1 x TYAN
®
Motherboard Drive
CD
1 Heatsink (B537MY188S1)
2 Heatsinks (B537MY188S2)
HDD Screws
Power Cables
(Left to right: Europe, US) 1 Europe + 1 US (B537MY188S1) 2 Europe + 2 US (B537MY188S2)
Barebone Manual Mainboard Quick Reference
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Rail Kit
Rail x 2 Screw Pack
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1.5 About the Product
The following views show you the product.
1.5.1 System Front View (Per Node)
HDD LED Description
Activity LED: Off
Fault LED: Off
Drive present, no activity
Activity LED: blinking green
Fault LED: Off
Drive present, with activity
Activity LED: Off
Fault LED: Red
HDD Fail
Activity LED: random
Fault LED: blinking red @ 4 Hz
Identify
Activity LED: random
Fault LED: blinking red @ 1 Hz
Rebuild
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Front Panel LED Description
Power Green: Power On
IPMI
Green: Normal Status
Amber: System Failed
Without IPMI module:
FAN failed system thermal problem
With IPMI module:
IPMI fault alert event is raised.
LAN1
Green: Link
Blinking Green: Activity
LAN2
Green: Link
Blinking Green: Activity
HDD
Green: Ready
Blinking Green: Activity
Red: TBD
Front Panel Button Description
Power On/ Off Power up and power down the system (Use a pin)
ID (UID)
Press once and the blue ID LED on the rear panel will light up
Reset Press to reset the system
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1.5.2 System Rear View (Per Node)
ÆID LED: When the ID button on the front panel is pressed, the blue
ID LED on the rear panel will light up. The technical personnel can easily locate the system on the rack, disconnect cables from the system, and remove it from the rack for later repair.
ÆLAN LED: The three onboard Ethernet ports have green and
amber LEDs to indicate LAN status. The table below illustrates the different LED states.
Ethernet LAN Link/Activity LED Description
Left: slow blinking green
Right: Off
10 Mbps Link
Left: blinking green
Right: Off
10 Mbps Activity
Left: slow blinking green
Right: green
100 Mbps Link
Left: blinking green
Right: green
100 Mbps Activity
Left: slow blinking green
Right: amber
1000 Mbps Link
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Left: blinking green
Right: amber
1000 Mbps Activity
Left: Off
Right: Off
No Link
1.5.3 Internal View (Per Node)
Number Description
1 HDD Cage
2 SATA HDD Backplane Board
3 Power Distribution Board
4 System Fans
5 Power Supply
6 PCI-E Riser Card Assembly
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NOTE
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Chapter 2: Setting Up
2.0.1 Before you Begin
This chapter explains how to install the CPUs, CPU heatsinks, memory modules, and hard drives. Instructions on inserting add on cards are also given.
2.0.2 Work Area
Make sure you have a stable, clean working environment. Dust and dirt can get into components and cause malfunctions. Use containers to keep small components separated. Putting all small components in separate containers prevents them from becoming lost. Adequate lighting and proper tools can prevent you from accidentally damaging the internal components.
2.0.3 Tools
The following procedures require only a few tools, including the following:
z A cross head (Phillips) screwdriver
z A grounding strap or an anti-static pad
Most of the electrical and mechanical connections can be disconnected with your hands. It is recommended that you do not use pliers to remove connectors as it may damage the soft metal or plastic parts of the connectors.
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2.0.4 Precautions
Components and electronic circuit boards can be damaged by discharges of static electricity. Working on a system that is connected to a power supply can be extremely dangerous. Follow the guidelines below to avoid damage to YR188-B537M or injury to yourself.
z Ground yourself properly before removing the top cover of the
system. Unplug the power from the power supply and then touch a safely grounded object to release static charge (i.e. power supply case). If available, wear a grounded wrist strap. Alternatively, discharge any static electricity by touching the bare metal chassis of the unit case, or the bare metal body of any other grounded appliance.
z Avoid touching motherboard components, IC chips, connectors,
memory modules, and leads.
z The motherboard is pre-installed in the system. When
removing the motherboard, always place it on a grounded anti-static surface until you are ready to reinstall it.
z Hold electronic circuit boards by the edges only. Do not touch
the components on the board unless it is necessary to do so. Do not flex or stress circuit boards.
z Leave all components inside the static-proof packaging that
they ship with until they are ready for installation.
z After replacing optional devices, make sure all screws, springs,
or other small parts are in place and are not left loose inside the case. Metallic parts or metal flakes can cause electrical shorts.
Note:
All connectors are keyed to only attach one way.
All use the correct screw size as indicated in the procedures.
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2.1 Installing Motherboard Components
This section describes how to install components on to the mainboard, including CPUs, memory modules, HDD and add on cards.
2.1.1 Installing Hard Drives
The YR188-B537M supports four 2.5” hard drives per node. Follow these instructions to install a hard drive.
1. Press the locking tabs at both sides to pull the node out.
2. First remove the power supply (see 3.9 Replacing the Power Supply for details). Unscrew to lift up the node cover.
3. Press the locking lever latch and pull the locking lever open.
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4. Slide the HDD tray out.
5. Unscrew the HDD tray bracket.
6. Place a hard drive into the drive tray. Use four screws to secure the HDD.
7. Reinsert the HDD tray into the chassis.
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8. Press the locking lever to secure the tray. Repeat the same procedures to install other HDD trays.
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2.1.2 Installing the CPU and Heatsink
Follow the steps below to install the processor and heatsink.
1. Locate the CPU socket.
2. Take off the CPU protection cap.
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3. Pull the CPU lever
up to unlock the CPU socket
4. Open the socket in the direction as shown.
5. Place the CPU in the CPU socket, ensuring that pin 1 is located as shown below.
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6. Close the socket and press the CPU socket lever down to secure the CPU.
7. Place the heatsink on top of the CPU and secure it with 4 screws.
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2.1.3 Installing the Memory
Follow these instructions to install the memory modules onto the motherboard.
1. Locate the memory slots on the motherboard.
2. Press the memory slot locking levers in the direction of the arrows as shown in the following illustration.
3. Align the memory module with the slot. When inserted properly, the memory slot locking levers lock automatically onto the indentations at the ends of the module.
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Memory Population Option Table
The following table outlines the suggested rules for populating memory.
Memory Population Rules DIMM Configuration
DIMM7 DIMM5 DIMM3 DIMM1
Empty Empty Empty Single Rank Empty Empty Single Rank Single Rank Empty Single Rank Single Rank Single Rank Single Rank Single Rank Single Rank Single Rank Empty Empty Empty Dual Rank
Four DIMMs per Channel 1
Empty Empty Dual Rank Dual Rank
DIMM Configuration
DIMM6 DIMM4 DIMM2 DIMM0
Empty Empty Empty Single Rank Empty Empty Single Rank Single Rank Empty Single Rank Single Rank Single Rank Single Rank Single Rank Single Rank Single Rank Empty Empty Empty Dual Rank
Four DIMMs per Channel 0
Empty Empty Dual Rank Dual Rank
Note:
1). For optimal dual channel operations, always install memory in pairs beginning with DIMM0 and DIMM1.
2). For single channel mode, install one DIMM at DIMM0 or
DIMM1. Others must be in dual channel mode.
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2.2 Rack Mounting
After installing the necessary components, the TYAN YR188-B537M can be mounted in a rack using the supplied rack mounting kit.
Rack mounting kit
No. Item Description Quantity
A
Sliding rails 2
B
Screw kit 1
2.2.1 Installing the Server in a Rack
Follow these instructions to mount the TYAN YR188-B537M into an industry standard 19” rack.
NOTE: Before mounting the TYAN YR188-B537M in a rack, ensure that all internal components have been installed and that the unit has been fully tested.
Screw Kit List
No. Screw Size Quantity
A
M5 8
B
Washer 8
Total: A+B
M5 and Washer Total: 8 sets
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2.2.2 Installing the inner Rails to the Chassis
1. Draw out the inner rails from the rail assembly. Install inner rails to left and right side of chassis.
2. Pull the rails backwards to lock the rails in place.
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2.2.3 Installing the Outer Rails to the Rack
1. Measure the distance between inner side of the front and rear mounting brackets in the rack.
2. Secure the outer rail to the rack using 4 M5 screws and 4 washers
(2 sets front / 2 sets rear) for each side. Secure the rails to the rack as shown.
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2.2.4 Rack mounting the Server
3. Draw out the middle rail to the latch position.
4. Lift the chassis and then insert the inner slide rails into the middle rails.
5. Press the front latch keys on both sides of the chassis to push the system into the rack. To pull the whole system out, press the rear latch keys on both sides of the chassis.
Note:
To avoid injury, it is strongly recommended that two people lift the TYAN YR188-B537M into the place while a third person screws it to the rack.
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Chapter 3: Replacing Pre-Installed
Components
3.1 Introduction
This chapter explains how to replace the pre-installed components, including the Motherboard, front panel board, SATA HDD board, M2087-R PCI-E Riser card, System fans, and Power supply unit etc.
3.2 Disassembly Flowchart
The following flowchart outlines the disassembly procedure.
Rear Components
Node Cover
Power
Mainboard
DIMMs
CPU/Heatsink Assembly
PCI-E Card
Mainboard
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Front Components
Node Cover
HDD
PCBs
FAN
Front Panel Board
SATA HDD Board
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3.3 Removing the Cover
Before replacing any parts you must pull the node out first. Follow Chapter 2.1.4 to remove the node cover.
3.4 Replacing Motherboard Components
Follow these instructions to replace motherboard components,
including the motherboard.
3.4.1 Replacing Expansion Card
The YR188-B537M has one preinstalled M2087-R riser card, Follow the instructions below to disassemble the M2087-R and install a new riser card.
1. Locate the riser card assembly in the chassis. Lift the assembly up.
2. Unscrew the riser card assembly. Remove the bracket.
3. Install a low-profile riser card onto the assembly.
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4. Screw the riser card to the assembly.
5. (optional for M2087-R) Unscrew to replace a new M2087-R card.
6. Follow the procedures mentioned earlier in reverse order to place the riser card assembly back into the chassis.
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3.4.2 Disconnecting All Motherboard Cables
Before replacing the motherboard or certain components, remove cables connected to the motherboard. Follow these instructions to remove all motherboard cables.
1. Disconnect all the power cable.
2. Disconnect SATA cables and front panel cable.
3. Disconnect fan cables.
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3.4.3 Removing the Motherboard
After removing all of the aforementioned cables, follow the instructions below to remove the motherboard from the chassis.
1. Remove the heatsink and processor if installed.
2. Remove the seven screws securing the motherboard to the chassis.
3. Carefully lift the motherboard from the chassis.
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3.5 Replacing the Power Distribution Board
Follow these instructions to replace the Power Distribution Board.
1. Disconnect all cables from the power distribution board.
2. Unscrew to take out the power distribution board.
3. Repeat the procedures described earlier to replace a new power distribution board.
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3.6 Replacing the Front Panel Board
Follow these instructions to replace the Front Panel board.
1. Release cables from the cable clip.
2. Unscrew the front panel tray.
3. Pull the front panel tray from the chassis.
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4. Disconnect cables from the front panel board.
5. Unscrew to take out the front panel board.
6. Replace a new front panel board and screw it to the front panel tray.
7. Repeat the procedures described earlier in reverse order to place the front panel tray back into place.
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3.6.1 Front Panel Board Features
Front Rear
NOTE:
See 1.5.1 System Front View (Per Node) for details on Front Panel LEDs and buttons.
3.6.2 Front Panel Board Connector Pin Definition
J1: FPIO Connector
Pin Net Name Description Pin Net Name Description
1 HD LED+ HDD LED 16 LAN1_LINK# LAN1 LED ­2 HD LED- HDD LED 17 LAN2_ACT LAN2 LED + 3 RESET+ System Reset Switch+18 LAN2_LINK# LAN2 LED ­4 RESET- System Reset Switch- 19 ID_LED + Location LED + 5 PW_LED+ FPB power LED + 20 ID_LED - Location LED ­6 PW_LED- FPB power LED - 21 ID_SW + Location Switch + 7 WLED+ IPMI LED 22 FP5V_STBY 5VSB power 8 WLED- IPMI LED 23 FPB_HDD_ACTIVITY_G- HDD Green LED
9 SMBDAT I2C BUS Data 24 FPB_HDD_FAULT_R- HDD Red LED 10 SMBCLK I2C BUS Clock 25 SMBCLK I2C BUS Clock 11 EXT_INT FPB NMI 26 BPGND Ground 12 FP_GND Ground 27 SMBDAT I2C BUS Data 13 PWR_SW+ Power Switch + 28 EXT_INT FPB NMI 14 PWR_SW# Power Switch - 29 NC 15 LAN1_ACT LAN1 LED + 30 NC
J3: USB Connector
Pin Net Name Function Pin Net Name Function
1 VCC_USB0 Power connect to 5V (for USB)6 USB_P1_P USB_P1 + 2 VCC_USB1 Power connect to 5V (for USB)7 GND Ground 3 USB_P0_N USB_P0 - 8 GND Ground 4 USB_P1_N USB_P1 - 9 NC 5 USB_P0_P USB_P0 + 10 NC
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3.7 Replacing the System Fan
Follow these instructions to replace the cooling fans in your system.
1. Locate the cooling fans in your system.
2. Unplug the cables connected to the mainboard and lift the fan unit up from the chassis.
3. Remove the rubber screws from the fan.
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4. After replacing the new fans, reinstall the rubber screws into the fan.
5. Reinstall the fans into the chassis following the procedures described earlier in reverse order.
6. Connect the fan cables.
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3.8 Replacing the SATA Backplane Board
1. Disconnect all cables from the backplane board.
2. Unscrew the backplane bracket.
3. Lift the bracket up from the chassis.
4. Unscrew the backplane board from the bracket. Replace a new SATA Backplane Board and reinstall it into the chassis following the above steps in reverse.
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3.8.1 SATA Backplane Board Features
Front View
Rear View
Connector Description
J24~27 SATA Connector
CN1~CN4 HDD Connector
ATX100 Power Connector
J100 I/O Connector
J101 SMBus Connector
J103 Sideband Connector
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3.8.2 SATA Backplane Board Connector Pin Definitions
SATA Connector J24~J27
Pin Definition Description
1 GND GND
2 TXP Transmit pair
3 TXN Transmit pair
4 GND GND
5 RXN Receive pair
6 RXP Receive pair
7 GND GND
HDD Connector CN1~CN4
Pin Definition Pin Definition
S1 GND P1 NC
S2 TX_P_HDD P2 NC
S3 TX_N_HDD P3 NC
S4 GND P4 PRES
S5 RX_N_HDD P5 GND
S6 RX_P_HDD P6 GND
S7 GND P7 VCC5_PRE
S8 GND P8 5V
S9 NC P9 5V
S10 NC P10 GND
S11 GND P11 ACTIVE#_HDD
S12 NC P12 GND
S13 NC P13 VCC12_PRE
S14 GND P14 12V
P15 12V
Power Connector ATX100
Pin Definition Description Pin Definition Description
B1 GND Power Ground A1 VCC+12V_A 12V
B2 GND Power Ground A2 VCC+12V_A 12V
B3 GND Power Ground A3 VCC+5V_A 5V
B4 GND Power Ground A4 VCC3 3.3V
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I/O Connector J100
Pin Definition Description
1 GLOBAL_ACT_OUT GLOBAL_ACT_LED pin
2 GLOBAL_FAIL_OUT GLOBAL_FAIL_LED pin
3 FPIO_SCL FP SMBus Clock
4 GND Ground
5 FPIO_SDA FP SMBus Data
6 SMB_ALERT SMBus Alert
SMBus Connector J101
Pin Definition Description
1 NC NC
2 SMB_ALERT Power Management
3 FPIO_SCL SMBus Clock
4 FPIO_SDA SMBus Data
5 GND Ground
Sideband Connector J103
Pin Definition Description
1 SCLOCK SGPIO
2 SDATAOUT SGPIO
3 SLOAD SGPIO
4 SDATAIN SGPIO
5 NC NC
6 NC NC
7 NC NC
8 NC NC
9 GND Ground
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3.9 Replacing the Power Supply
1. Press and hold the latch to pull the power supply out.
2. After replacing a new power supply, press and hold the latch to push the power supply back into the chassis.
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NOTE
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Chapter 4: Hardware Setup
4.1 Motherboard (S537M) Image
This picture is representative of the latest board revision available at the time of publishing. The board you receive may or may not look exactly like the above picture.
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4.2 System Block Diagram
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4.3 Board Parts, Jumpers and Connectors
The diagram is representative of the latest board revision available at the time of publishing. The board you receive may not look exactly like the above diagram.
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Jumper/Connector Function
J2 (USB2) USB Header
J3 IPMI Connector
J4 (USB1) USB Front Panel Header
FAN1/FAN2/FAN3/FAN4 8-pin Fan Connector with Speed Control
TYFP3 (J5) Front Panel Header
CCMOS1
Clear CMOS Jumper Pin 1-2 closed: Normal (Default) Pin 2-3 closed: Clear
SATA0/SATA1/SATA2/SATA3 Serial ATA RAID Connector
Jumper Legend

OPEN - Jumper OFF, without jumper cover

CLOSED – Jumper ON, with jumper cover
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J5
J2
J4
SATA0 SATA1 SATA2 SATA3
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J5: TYFP3 Connector Front Panel Header
27 28
12
Use this header to connect some control or signal wires from motherboard to chassis, such as HDD LED, power LED, power button, and reset button.
Pin Signal Pin Signal
1
HD_LED+ 2 HD_LED-
3
RESET+ 4 RESET-
5
PWR_LED+ 6 PWR_LED-
7
WLED+ 8 WLED-
9
SMBDAT 10 SMBCLK
11
EXT_INT 12 +5V
13
5VSB 14 INTRUDER_N
15
PWR_SW+ 16 PWR_SW-
17
LAN1_LED+ 18 LAN1_LED-
19
LAN2_LED+ 20 LAN2_LED-
21
LAN3_LED+ 22 LAN3_LED-
23
ID_LED+ 24 ID_LED-
25
ID_SW+ 26 ID_SW-
27
Key 28 RSV
J4: USB Front Panel Header (USB1) / J2: USB Header (USB2)
1
910
2
Each USB header supports 2 additional USB ports. Use these headers to connect the PCI USB bracket or internal USB header cable to the front or rear I/O.
Pin Signal Pin Signal
1
+5V
2
+5V
3
USB_P0_N
4
USB_P1_N
5
USB_P0_P
6
USB_P1_P
7
GND
8
GND
9 Key 10
RSV
SATA0/1/2/3: Serial ATA RAID Connector
1
7
Connects to the Serial ATA ready drives via the Serial ATA cable.
Pin Signal
1 GND 2 TX+ 3 TX­4 GND 5 RX­6 RX+ 7 GND
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CCMOS1
FAN1/ FAN2/ FAN3 /FAN4
PW1
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FAN1/ FAN2/ FAN3/ FAN4: 8-pin Fan Connector
1
Use this header to connect the cooling fan to your motherboard to keep the system at optimum performance levels.
Pin Signal
1
FAN_PWM1
2
+12V
3
FAN_TACH1
4
GND
5
GND
6
FAN_TACH2
7
+12V
8
FAN_PWM2
CCMOS1: Clear CMOS Jumper
31
Normal
(Default)
31
Clear
Use this jumper when you forgot your system/setup password or need to clear system BIOS setting.
How to clear the CMOS data
- Power off system and disconnect power supply
from AC source
- Use jumper cap to close Pin_2 and 3 for several seconds to Clear CMOS
- Replace jumper cap to close Pin_1 and 2 Reconnect power supply to AC source
- Power on system
PW1: 18-pin 12V/5V Power Connector
1
Pin Signal Pin Signal
1 +3.3V 10 +3.3V 2 COM 11 -12V 3 COM 12 COM 4 +5V 13 PS-ON# 5 5VSB 14 +5V 6 COM 15 PWR_OK 7 COM 16 COM 8 +12V1 17 COM 9 +12V2 18 +12V3
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4.4 Installing Optional SO-DIMM modules
Your S537M motherboard is equipped with an optional proprietary SO-DIMM connector. The 200-pin vertical SO-DIMM connector can be used for TYAN M3296 expansion card to provide such features as additional TYAN SMDC module support. For details of available expansions cards, visit the TYAN website at http://www.tyan.com
.
To install a SO-DIMM expansion card:
1. Open the spring levers as shown.
2. Insert the SO-DIMM card as shown, making sure that the card is the right way up. The card will fit in only one way and the screw holes in the card should line up exactly with the mounting posts on the motherboard.
3. Push the SO-DIMM card down into place and make sure the spring levers click into place as shown.
NOTE: The SO-DIMM expansion
cards will fit in the slot only one way. Make sure that you align the slot in the card with the key in the card slot.
4. Removal of a SO-DIMM card is a reversal of the installation procedure. Push out the spring levers as shown and pull the card out of the socket.
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NOTE
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Chapter 5: BIOS Setup
5.1 About the BIOS
The BIOS is the basic input/output system, the firmware on the motherboard that enables your hardware to interface with your software. The BIOS determines what a computer can do without accessing programs from a disk. The BIOS contains all the code required to control the keyboard, display screen, disk drives, serial communications, and a number of miscellaneous functions. This chapter describes the various BIOS settings that can be used to configure your system.
The BIOS section of this manual is subject to change without notice and is provided for reference purposes only. The settings and configurations of the BIOS are current at the time of print and are subject to change, and therefore may not match exactly what is displayed on screen.
This section describes the BIOS setup program. The setup program lets you modify basic configuration settings. The settings are then stored in a dedicated, battery-backed memory (called NVRAM) that retains the information even when the power is turned off.
To start the BIOS setup utility:
1. Turn on or reboot your system.
2. Press <Del> during POST (<F4> on remote console) to start the BIOS setup utility.
5.2 BIOS Menu Bar
The menu bar at the top of the windows lists these selections:
Main To configure basic system setups
Advanced To configure the advanced chipset features
PCI/PnP To configure legacy Plug & Play or PCI settings
Boot To configure system boot order
Security To configure user and supervisor passwords
Chipset To configure chipset management features
Exit To exit setup utility
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5.3 Setup Basics
The table below shows how to navigate in the setup program using the keyboard.
Key Function
<F1> General help window
<ESC> Exit current menu
Å Æ arrow keys Select a different menu
or arrow keys
Move cursor up/down
<Tab> or <Shift-Tab> Cycle cursor up/down
<Home> or <End> Move cursor to top/bottom of the window
<PgUp> or <PgDn> Move cursor to next/previous page
<-> Select the previous value/setting of the field
<+> Select the next value/setting of the field <F8> Load Fail Safe default configuration values of the menu <F9> Load the Optimal default configuration values of the
menu
<F10> Save and exit
<Enter> Execute command or select submenu
5.4 Getting Help
Press [F1] to display a small help window that describes the appropriate keys to use and the possible selections for the highlighted item. To exit the Help Window, press [ESC].
5.5 In Case of Problems
If you have trouble booting your computer after making and saving the changes with the BIOS setup program, you can restart the computer by holding the power button down until the computer shuts off (usually within 4 seconds); resetting by pressing CTRL-ALT-DEL; or clearing the CMOS. The best advice is to only alter settings that you thoroughly understand. In particular, do not change settings in the Chipset section unless you are absolutely sure of what you are doing. The Chipset defaults have been carefully chosen either by TYAN or your system manufacturer for best performance and reliability. Even a seemingly small change to the Chipset setup options may cause the system to become unstable or unusable.
NOTE: The following pages provide the details of BIOS menu. Please be noticed that the BIOS menu are continually changing due to the BIOS updating. The BIOS menu provided are the most updated when this manual is written. Please visit Tyan’s website at
http://www.tyan.com
for the information of BIOS updating.
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5.6 BIOS Main Menu
The Main BIOS Menu is the first screen that you can navigate. The Main BIOS setup menu screen has two main frames. The left frame displays all the options that can be configured. "Grayed-out" options cannot be configured, options in blue can be changed.
The right frame displays the key legend. Above the key legend is an area reserved for a text message. When an option is selected in the left frame, it is highlighted in white. Often, a text message will accompany it.
Feature Option Description
Main
System Time HH : MM : SS Set the system time
System Date MM : DD : YYYY Set the system date
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5.7 Advanced Menu
You can select any of the items in the left frame of the screen, such as Super I/O Configuration, to go to the sub menu for that item. You can display an Advanced BIOS Setup option by highlighting it using the <Arrow> keys. All Advanced BIOS Setup options are described in this section. The Advanced BIOS Setup screen is shown below. The sub menus are described on the following pages.
Feature Option Description
Advanced Settings
CPU Configuration Menu Item Options for CPU
IDE Configuration Menu Item Configure the IDE device(s)
Super IO Configuration Menu Item
Configures Super IO Chipset Win627DHG
USB Configuration Menu Item Configure the USB support
ACPI Configuration Menu Item
Section for Advanced ACPI Configuration
AHCI Configuration Menu Item
Section for Advanced AHCI Configuration
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Feature Option Description
Advanced Settings
APM Configuration Menu Item Section for APM configuration
Event Log Configuration Menu Item
Mark as read, Clear or View Event Log statistics
Hardware Health
Configuration
Menu Item
Configure/monitor the Hardware Health
PCI Express Configuration Menu Item
Select options for PCI Express Devices.
Remote Access Configuration Menu Item Configure Remote Access
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5.7.1 CPU Configuration
You can use this screen to view CPU Configuration Menu. Use the up and down arrow
(Ç/È) keys to select an item. Use the Plus and Minus (+/-) keys to change the value of the selected option. The settings are described on the following pages.
Feature Option Description
CPU Configuration
Manufacturer Intel ® CPU Frequency FSB Speed Cache L1 Cache L2 Ratio Status Ratio Actual Value
Read only Displays information about CPU
Ratio CMOS Setting
According to
CPU ratio
It allows users to select the ratio of CPU frequency to front side bus. The default is auto-detected by BIOS. Use [+] or [-] to adjust values.
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Enabled
C1E Support
Disabled
Enable or disable the C1 Enhanced mode
Enabled
Hardware Prefetcher
Disabled
When enabled, the processor's hardware prefetcher will be enabled and allowed to automatically prefetch data and code for the processor. When disabled, the processor's hardware prefetcher will be disabled.
Enabled
Adjacent Cache Line Prefetch
Disabled
When enabled, the processor will retrieve the currently requested cache line, as well as the subsequent cache line. When disabled, the processor will only retrieve the currently requested cache line.
Enabled
Intel® Virtualization Technology
Disabled
Intel Virtualization Technology is a set of platform features that support virtualization of platform hardware and multiple software environments. When enabled, it offers data center managers the ability to consolidate multiple workloads on one physical server system.
Enabled
Execute-Disable Bit Capability
Disabled
Intel’s Execute Disable Bit functionality can help prevent certain classes of malicious buffer overflow attacks when combined with a supporting operating system. Execute Disable Bit allows the processor to classify areas in memory by where application code can execute and where it cannot. When a malicious worm attempts to insert code in the buffer, the processor disables code execution, preventing damage and worm propagation.
Enabled
Core Multi-Processing
Disabled
When disabled, it disables one execution core.
Enabled
Intel® SpeedstepTM Tech
Disabled
This feature allows the system to dynamically adjust processor voltage and core frequency, which can result in decreased average power consumption and decreased average heat production.
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5.7.2 IDE Configuration Sub-Menu
You can use this screen to select options for the IDE Configuration Settings. Use the up and down <Arrow> keys to select an item. Use the <Plus> and <Minus> keys to change the value of the selected option.
Feature Option Description
IDE Configuration
Enhanced
Disabled
SATA Configuration
Compatible
This defines the operation mode of SATA channel. NOTE: This item can only be displayed when Configure SATA as is set to [IDE].
IDE
RAID
Configure SATA as
AHCI
Select legacy IDE, RAID or AHCI as the SATA interface.
Disabled
Hot Plug
Enabled
Available if either RAID or AHCI is enabled. Provides Hot Plugging capability.
Disabled
Hard Disk Write Protect
Enabled
Enable/Disable device write protection. This will be effective only if device is accessed through BIOS.
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IDE Detect Time Out (Sec)
0~35
(at 5 interval)
Select the time out value for detecting ATA/ATAPI device(s).
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5.7.2.1 SATA0 ~ SATA3 Sub-Menu
Feature Option Description
SATA0
Auto
Not Installed
CD/DVD
Type
ARMD
Selects the type of device connected to the system.
Auto
LBA/Large Mode
Disabled
Auto: Enabled LBA Mode if the device supports it and the device is not already formatted with LBA Mode disabled. Disabled: Disabled LBA Mode.
Auto
Block (Multi-Sector Transfer)
Disabled
Disabled: The Data transfer from and to the device occurs one sector at a time. Auto: The Data transfer from and to the device occurs multiple sectors at a time if the device supports it.
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Auto
PIO Mode
0~4
(at 1 interval)
Selects the PIO Mode. Select Auto to enhance hard disk performance by optimizing the hard disk timing.
DMA Mode Auto
Selects DMA Mode. Auto: Auto detected.
Auto
Disabled
S.M.A.R.T.
Enabled
S.M.A.R.T (Self-Monitoring Analysis and Reporting Technology) is a utility that monitors your disk status to predict hard disk failure.
Enabled
32Bit Data Transfer
Disabled
Enables 32-bit to maximize the IDE hard disk data transfer rate.
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5.7.3 Super IO Configuration Sub-Menu
You can use this screen to select options for the Super I/O settings. Use the up and
down arrow (Ç/È) keys to select an item. Use the Plus and Minus (+/-) keys to change the value of the selected option
Feature Option Description
Configure Win627DHG Super IO Chipset
3F8 IRQ4
3E8 IRQ4 2E8 IRQ3 2F8 IRQ3
Serial Port1 Address
Disabled
Allow BIOS to select Serial Port1 Base Addresses.
Disabled
POST
OS
Watchdog Mode
Power ON
POST: Watchdog timer counting, start at Power on, stop at OS Boot OS: Start at OS Boot Power on: Start at power on
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5.7.4 USB Configuration Sub-Menu
You can use this screen to view the USB Configuration Menu. Use the up and down
arrow (Ç/È) keys to select an item. Use the Plus and Minus (+/-) keys to change the value of the selected option. The settings are described on the following pages.
Feature Option Description
USB Configuration
Disabled
Auto
Legacy USB Support
Enabled
Enables support for legacy USB. AUTO option disables legacy support if no USB devices are connected.
Enabled
Port 64/60 Emulation
Disabled
This feature allows you to enable emulation of I/O ports 64h and 60h so that there is full PS/2 legacy support for USB keyboards and mice.
Hi Speed
USB 2.0 Controller Mode
Full Speed
Configure the USB 2.0 controller in Hi Speed (480 Mbps) or Full Speed (12Mbps).
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Enabled
BIOS EHCI Hand-Off
Disabled
This is a work around for OSes without EHCI hand-off support. The EHCI ownership change should claim by EHCI driver.
Enabled
Disabled
Hotplug USB FDD Support
Auto
Enable or disable hotplug USB floppy support
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5.7.4.1 USB Mass Storage Device Configuration Sub-Menu
Feature Option Description
USB Mass Storage Device Configuration
10 Sec
20 Sec
30 Sec
USB Mass Storage Reset Delay
40 Sec
It enables you to set the number of seconds the POST waits for the USB mass storage device after the start unit command is sent.
Device #1 Read only
Auto
Floppy
Forced
FDD
Hard Disk
Emulation Type
CDROM
If Auto, USB devices less than 530 MB will be emulated as Floppy and remaining as hard drive. Forced FDD option can be used to force a HDD formatted drive to boot as FDD (Ex. ZIP drive).
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5.7.5 ACPI Configuration Sub-Menu
Use this screen to select options for ACPI. Use the up and down arrow (Ç/È) keys to
select an item. Use the Plus and Minus (+/-) keys to change the value of the selected option. A description of the selected item appears on the right side of the screen. The settings are described on this page. The screen is shown below.
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5.7.5.1 Advanced ACPI Configuration Sub-Menu
Feature Option Description
Advanced ACPI Configuration
ACPI v3.0
ACPI v2.0
ACPI Version Features
ACPI v1.0
Set this value to allow or prevent the system to be complaint with the ACPI 2.0 specification.
Enabled
ACPI APIC Support
Disabled
This option allows you to define whether or not to enable APIC features.
Enabled
AMI OEMB table
Disabled
Set this value to allow the ACPI BIOS to add a pointer to an OEMB table in the Root System Description Table (RSDT) table. Note: OEMB table is used to pass POST data to the AMI code during ACPI O/S operations.
Enabled
Headless mode
Disabled
Enable or disable Headless operation mode through ACPI.
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5.7.5.2 Chipset ACPI Configuration Sub-Menu
Feature Option Description
South Bridge ACPI Configuration
Disabled
Energy Lake Feature
Enabled
Allow you to configure Intel’s Energy Lake power management technology. If you are running a Media Center you can install the Intel VIIV software to get the correct driver; otherwise disable the Energy Lake feature in BIOS (it relates purely to Intel's Quick Resume feature, which is generally useless).
Disabled
ACPI APIC SCI IRQ
Enabled
Enable / Disable ACPI APIC SCI IRQ
Disabled
High Performance Event Timer
Enabled
Enable/Disable High Performance Event Timer
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5.7.6 AHCI Configuration Sub-Menu
You can use this screen to view the AHCI Configuration Menu. Use the up and down
arrow (Ç/È) keys to select an item. Use the Plus and Minus (+/-) keys to change the value of the selected option. The settings are described on the following pages.
Feature Option Description
AHCI Configuration
0 5
10
15
20 25 30
AHCI CD/DVD Boot Time Out
35
Some SATA CD/DVD in AHCI mode need to wait ready longer.
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5.7.6.1 AHCI Port0/Port1/Port2/Port3/Port4/Port5 Sub-Menu
Feature Option Description
AHCI Port0 Configuration
Auto
SATA Port0
Not Installed
Select the type of device connected to the system.
Enabled
S.M.A.R.T.
Disabled
S.M.A.R.T (Self-Monitoring Analysis and Reporting Technology) is a utility that monitors your disk status to predict hard disk failure.
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5.7.7 APM Configuration
Feature Option Description
APM Configuration
Enabled
Power Management/APM
Disabled
Enable/Disable APM
Suspend
Video Power Down Mode
Disabled
Power Down Video in Suspend or Standby Mode.
Suspend Hard Disk Power Down
Mode
Disabled
Power Down Hard Disk in Suspend or Standby Mode.
Disabled
1 Min 2 Min 4 Min
8 Min 10 Min 20 Min 30 Min 40 Min 50 Min
Suspend Time Out
60 Min
Go into Suspend in the specified Time.
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87.5%
75.0%
62.5%
50%
37.5% 25%
Throttle Slow Clock Ratio
12.5%
Select the duty cycle in throttle mode
On/Off
Power Button Mode
Suspend
Go into On/Off, or Suspend when Power Button is pressed.
Disabled
Resume On RTC Alarm
Enabled
Enable/Disable RTC to generate a wake event
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5.7.8 Event Log Configuration Sub-Menu
You can use this screen to view the Event Log Control Menu. This logs system events
(such as CMOS clear) and writes the log into NVRAM. Use the up and down arrow (Ç/È) keys to select an item. Use the Plus and Minus (+/-) keys to change the value of the selected option. The settings are described on the following pages.
Feature Option Description
Event Logging details
View Event Log __
Views all unread events on the Event Log.
OK
Mark All Events as Read
Cancel
Marks all unread events as read.
OK
Clear Event Log
Cancel
Erases all of events.
Enabled
ECC Event Logging
Disabled
Enable or disable ECC Event Logging
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5.7.9 Hardware Health Configuration Sub-Menu
You can use this screen to view the Hardware Health Configuration Settings. Use the
up and down arrow (Ç/È) keys to select an item. Use the Plus and Minus (+/-) keys to change the value of the selected option. The settings are described on the following pages.
Hardware Health Configuration Submenu (M296 present)
Feature Option Description
Hardware Health Configuration
Enabled
H/W Health Function
Disabled
Enables Hardware Health Monitoring Device.
Disabled
Enabled
Auto FAN Control
30%
FAN power duty cycle is auto dynamic programmed in selected temperature range. Disabled: Fan Power On. Enabled: Fan Power Duty Cycle=30%(40°C)-100%(60°C), see max
(CPU0, CPU1)
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Hardware Health Configuration Submenu (M296 absent)
Feature Option Description
Hardware Health Configuration
Enabled
H/W Health Function
Disabled
Enables Hardware Health Monitoring Device.
Disabled
Auto FAN Control
Enabled
FAN power duty cycle is auto dynamic programmed in selected temperature range. Disabled: Fan Power On. Enabled: Fan Power Duty Cycle=30%(40°C)-
100%(60°C), see max (CPU0, CPU1)
30%
40%
PWM Minimal Duty Cycle
50%
This item allows you to set minimum PWM Duty Cycle. Note: This item is hidden and will appear when Auto FAN Power Control is set to [Enabled].
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5.7.9.1 Sensor Data Register Monitoring Sub-Menu (M3296 present)
Read only. It cannot be modified in user mode.
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5.7.9.2 Mainboard Voltages Report Sub-Menu (M3296 absent)
Read only. It cannot be modified in user mode.
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5.7.10 PCI Express Configuration Sub-Menu
You can use this screen to enable PCI Express support. Use the up and down arrow
(Ç/È) keys to select an item. The settings are described on the following pages.
Feature Option Description
PCI Express Configuration
Enabled
Active State Power-Management
Disabled
Enabled/Disabled PCI Express L0s and L1 link power states.
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5.7.11 Remote Access Configuration Sub-Menu
You can use this screen to view the Remote Access Configuration Menu. This feature
allows access to the Server remotely via serial port. Use the up and down arrow (Ç/È) keys to select an item. Use the Plus and Minus (+/-) keys to change the value of the selected option. The settings are described on the following pages.
Feature Option Description
Configure Remote Access type and parameters
Enabled
Remote Access
Disabled
Enables remote access to system through serial port.
115200 8,n,1
57600 8,n,1
38400 8,n,1
19200 8,n,1
Serial Port Mode
9600 8,n,1
Select Serial Port settings.
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None
Hardware
Flow Control
Software
Select Flow Control for console redirection.
Disabled
Boot Loader
Redirection After BIOS POST
Always
Disable: Turns off the redirection after POST Boot Loader: Redirection is active during POST and during Boot Loader. Always: Redirection is always active. <Some OSs may not work if set to Always>
ANSI
VT100
Terminal Type
VT-UTF8
Select the target terminal type.
Enabled VT-UTF8 Combo Key
Support
Disabled
Enable VT-UTF8 Combination key Support for ANSI/VT100 terminals.
No Delay
Delay 1 Sec Delay 2 Sec
Sredir Memory Display Delay
Delay 4 Sec
Gives the delay in seconds to display memory information
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5.8 PCI PnP Menu
You can use this screen to view PnP (Plug & Play) BIOS Configuration Menu. This
menu allows the user to configure how the BIOS assigns resources & resolves conflicts. Use the up and down arrow (Ç/È) keys to select an item. Use the Plus and Minus (+/-) keys to change the value of the selected option. The settings are described on the following pages.
Feature Option Description
Advanced PCI/PnP Settings
No
Clear NVRAM
Yes
Clears NVRAM during system Boot.
Yes
Plug & Play OS
No
No: lets the BIOS configure all the devices in the system. Yes: lets the operating system configure Plug and Play (PnP) devices not required for boot if your system has a Plug and Play operating system.
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32
64
96
128
160
192
224
PCI Latency Timer
248
This setting controls how many PCI clocks each PCI device can hold the bus before another PCI device takes over. When set to higher values, every PCI device can conduct transactions for a longer time and thus improve the effective PCI bandwidth. Values in units of PCI clocks for PCI device latency timer register.
Yes
Allocate IRQ to PCI VGA
No
Yes: assigns IRQ to PCI VGA card if card requests IRQ.
Disabled
Palette Snooping
Enabled
This is the default setting and should not be changed unless the VGA card manufacturer requires Palette Snooping to be Enabled. Enabled: informs the PCI devices that an ISA graphics device is installed in the system so the card will function correctly.
Disabled
PCI IDE BusMaster
Enabled
Enabled: BIOS uses PCI bus mastering for reading / writing to IDE drives.
Ascent
PCI Bus Scan Order
Descent
Ascent: Scan PCI bus from bus 0 to maximum Descent: Scan PI bus from bus maximum to 0
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5.9 Boot Menu
You can display Boot Setup option by highlighting it using the Arrow (Ç/È) keys and
pressing Enter. The settings are described on the following pages.
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5.9.1 Boot Settings Configuration Sub-Menu
Use this screen to select options for the Boot Settings Configuration. Use the up and
down arrow (Ç/È) keys to select an item. Use the Plus and Minus (+/-) keys to change the value of the selected option.
Feature Option Description
Boot Settings Configuration
Enabled
Quick Boot
Disabled
This option allows user bypass BIOS self test during POST.
Disabled
Quiet Boot
Enabled
Disabled: displays normal POST messages. Enabled: displays OEM log instead of POST messages.
Force BIOS
Add On ROM Display Mode
Keep Current
Allows user to force BIOS/Option ROM of add-on cards to be displayed during quiet boot.
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On
Bootup Num-Lock
Off
Selects Power-on state for Numlock.
Enabled
Wait for ‘F1’ If Error
Disabled
Waits for F1 key to be present if error occurs.
Enabled
Hit ‘DEL’ Message Display
Disabled
Displays “Press DEL to run Setup” in POST.
Disabled
Interrupt 19 Capture
Enabled
Enabled: allows option ROMs to trap interrupt 19.
Disabled
Endless Boot
Enabled
Enable/Disable endless loop boot from BBS table.
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5.9.2 Boot Device Priority Sub-menu
Use this screen to select options for the Boot Device Priority. Use the up and down
arrow (Ç/È) keys to select an item. Use the Plus and Minus (+/-) keys to change the value of the selected option.
Feature Option Description
Boot Device Priority
xx,xxx-xxxxx:xxx
xx,xxx-xxxxx:xxx
1st Boot Device 2nd Boot Device 3rd Boot Device 4th Boot Device
Disabled
Settings for boot priority. These can be customized depending on your preference. NOTE: When you select a boot category from the boot menu, a list of devices in that category appears.
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