All registered and unregistered trademarks and company names contained in this manual are
property of their respective owners including, but not limited to the following.
TYAN, Trinity i845GL S2098 are trademarks of TYAN Computer Corporation.
Intel, Xeon, and combinations thereof are trademarks of Intel Corporation.
AwardBIOS are trademarks of Phoenix Technology.
Microsoft, Windows are trademarks of Microsoft Corporation.
IBM, PC, AT, PS/2 are trademarks of IBM Corporation.
Promise is a trademark of Promise Technology.
ATI, ATI RAGE is a trademark of ATI Technologies Incorporated.
Winbond is a trademark of Winbond Electronics Corporation.
Information contained in this document is furnished by TYAN Computer Corporation and has been
reviewed for accuracy and reliability prior to printing. TYAN assumes no liability whatsoever, and
disclaims any express or implied warranty, relating to sale and/or use of TYAN products including
liability or warranties relating to fitness for a particular purpose or merchantability. TYAN retains the
right to make changes to product descriptions and/or specifications at any time, without notice. In
no event will TYAN be held liable for any direct or indirect, incidental or consequential damage,
loss of use, loss of data or other malady resulting from errors or inaccuracies of information
contained in this document.
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Table of Contents
Before you begin…
Chapter 1: Introduction
1.1 Congratulations!
1.2 Hardware Specifications
Chapter 2: Board Installation
2.1 Board
2.2 Board Jumpers
2.3 Fan Connectors
2.4 CMOS Reset (JP3)
2.5 Front Panel Connector (J9)
2.6 Wake-On-LAN (J10)
2.7 Wake-On-Ring (J12)
2.8 USB Header (J16)
2.9 Mounting the Motherboard
2.10 Installing the Memory
2.11 Memory Installation Procedure
2.12 Installing the Processors/Heatsink
2.13 Attaching Drive Cables
2.14 Installing Add-In Cards
2.15 Connecting External Devices
2.16 LAN LED Scheme
2.17 Installing the Power Supply
2.18 Finishing Up
Chapter 3: BIOS
3.1 Entering Setup
3.2 Standard CMOS Features
3.3 Advanced BIOS Features
3.4 Advanced Chipset Features
3.5 Integrated Peripherals
3.6 Power Management Setup
3.7 PnP/PCI Configuration
3.8 PC Health Status
3.9 Frequency and Voltage Control
Chapter 4: Diagnostics
4.1 Beep Codes
4.2 Flash Utility
Appendix I: Glossary
Technical Support
The retail motherboard package should contain the following:
1x Trinity i845GL motherboard
If any of these items are missing, please contact your vendor/dealer for replacement before
continuing with the installation process.
1x 34-Pin floppy drive cable
1x Ultra-DMA-133/100/66 IDE cable
1x Trinity i845GL User’s Manual
1 x Trinity i845GL Quick Reference
1x TYAN driver CD
1x I/O shield
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Chapter 1: Introduction
1.1 – Congratulations!
You have just bought one of the most advanced platforms suited for digital content creation,
productivity and 3D gaming applications. The Trinity i845GL is based on Intel’s 845GL chipset,
supporting the Intel Pentium 4 or Celeron Processor with 400MHz FSB, DDR memory, Intel
Extreme Graphics, and more. These features enable breakthrough performance for today’s rapidly
developing multimedia applications.
Visit TYAN’s Website at http://www.TYAN.com . There you can find information on all of TYAN’s
products with FAQ’s, distributor’s list and BIOS setting explanations.
1.2 – Hardware Specifications
Processors
• Single ZIF PGA478 Socket
• Intel P4 “Northwood” and “Celeron”
processor
• 400 MHz FSB support
Expansion Slots
• Two 32bit/33Mhz PCI 2.2 slots
Chipset
• Intel 845GL chipset
• Intel ICH4
• ITE IT8712F LPC I/O chip
System Management
• 3-pin Fan monitoring headers
• Temperature and voltage monitoring
• 3-pin Wake-On-Ring header
• 3-pin Wake-On-LAN header
Memory
• Two DDR DIMM sockets
• Up to 2GB of Unbuffered PC1600/2100 DDR
• Supports Non-ECC type memory modules
Integrated PCI IDE
• Dual channel master mode support up to four
IDE devices
• Support for ATA-100/66/33 IDE drives and
ATAPI compliant devices
• Headers for CPU/Power Supply/Chassis Fans
Integrated LAN Controller(s)
• One 10/100 Base-T LAN controller
§ Intel 82551 LAN controller
§ Operating at 32bit/33MHz PCI bus
• (Optional) one 10/100 Base-T LAN controller
§ Intel 82551 LAN controller
§ Operating at 32bit/33MHz PCI bus
Integrated Audio (optional)
• Realtek ALC202 audio CODEC
• Dual-channel audio
• Line-In/Line-Out/Mic-In audio jack
• CD-in connector
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Integrated Graphics
• Intel Extreme Graphics Core
• Optimized 256-bit BLT engine
• Up to 2.1GB/s data access in UMA
configuration
• Supports analog monitor up to 2048x1536 at
60Hz
BIOS
• Award BIOS 4Mbit Flash
• Supports APM 1.2 & ACPI 1.0
• Auto detection of memory size
• Auto configuration of IDE hard disk types
• User settings of hardware monitoring
• Multiple boot options
• Power Management: S1, S3, S4
• Jumper free setting for CPU over clocking
Form Factor
• Flex ATX footprint
• 9” x 7.5” (228.6cm x 190.5mm)
Regulatory
• FCC Class B (Declaration of Conformity)
• European Community CE (Declaration of
Conformity)
• BSMI (to be defined)
Operating System Support
• Windows 2000 and XP
• Windows 98SE and NT4
• Windows ME
• Linux (Tested under Red Hat 7.3)
TYAN reserves the right to add or
discontinue support for any OS with or
without notice.
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Chapter 2: Board Installation
Installation
You are now ready to install your motherboard. The mounting hole pattern of the Trinity i845GL
matches the FlexATX system board specifications. Your chassis should support a standard
FlexATX motherboard form factor.
How to install our products right…. the first time!
The first thing you should do is read this user’s manual. It contains important information that will
make configuration and setup much easier. Here are some precautions you should take when
installing your motherboard:
(1) Ground yourself properly before remov ing your motherboard from the antistatic bag.
Unplug the power from your computer power supply and then touch a safely grounded
object to release static charge (i.e. power supply case). For the safest conditions, TYAN
recommends wearing a static safety wrist strap.
(2) Hold the motherboard by its edges and do not touch the bottom of the board, or flex the
board in any way.
(3) Avoid touching the motherboard components, IC chips, connectors, memory modules,
and leads.
(4) Place the motherboard on a grounded antistatic surface or on the antistatic bag that the
board was shipped in.
(5) Inspect the board for damage.
The following pages include details on how to install your motherboard into your chassis, as well
as installing the processor, memory, disk drives and cables.
NOTE DO NOT APPLY POWER TO THE BOARD IF IT HAS BEEN DAMAGED
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2.1 – Board
The following is an image of the Trinity i845GL S2098.
The above photograph is purely representative. Due to engineering updates and new board
revisions, certain components may change and or be repositioned. The picture above may
or may not look exactly like the board you received.
The following page includes details on the vital components of this motherboard.
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2.2 – Board Jumpers
This jumper diagram is representative of the latest board revision available at the time of
publishing. The board you receive may or may not look exactly like the above diagram.
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2.3 – Fan Connectors
Use these headers to connect cooling fans, both chassis and
processor fans, to your motherboard. Cooling fans help keep the
system more stable and operating reliably for its product life.
2.4 – CMOS Reset (JP3)
1
Clear CMOS
1
Pin 2
Power
LED
Pin 1
HDD
LED
Pin 4
Power
LED
Pin 3
HDD
LED
Default
2.5 – Front Panel Connector (J9)
Your chassis will usually come with connectors to install onto the motherboard, such as HDD and
Power LEDs. The Front Panel Connector has been implemented for such purposes.
Connect pins 2 and 3 together to reset the CMOS settings in case an incorrect
setting causes system instability or you have forgotten your system/setup
password or have just flashed your BIOS.
Power off the system and disconnect the power supply.
- Close pins 2 and 3 on JP1
- Wait about 5 seconds
- Close pins 1 and 2 on JP1
- Reconnect the power supply and power on the system
Pin 6
Power
Switch
Pin 5
Reset
Switch
Pin 8
Power
Switch
Pin 7
GND
Pin 10
Reserved
Pin 9
Reserved
Pin 12
Speaker
Pin 11
Infrared
Pin 14
Speaker
Pin 13
Infrared
Pin 16
Speaker
Pin 15
Infrared
Pin 18
Speaker
Pin 17
Infrared
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2.6 – Wake-On-LAN (J10)
2.7 – Wake-On-Ring (J12)
2.8 – USB Header (J16)
Pins grouped together:
1,2: VCC
3,4: USB +
5,6: USB –
7,8,9,10: GND
Pin 2
VCC
Pin 1
VCC
Plugging your LAN card cable into J10 enables the Wake -On-LAN feature. This
automatically resumes the system power when the LAN port receives an
incoming signal during power-saving mode.
Similarly to the Wake-On-LAN, plugging your modem into J12 enables the
Wake-On-Ring feature. This automatically resumes the system power when the
modem receives an incoming signal during power-saving mode.
Pin 4
USB +
Pin 3
USB +
Pin 6
USB –
Pin 5
USB –
Pin 8
GND
Pin 7
GND
Pin 10
GND
Pin 9
GND
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2.9 – Mounting the Motherboard
Before installing your motherboard, make sure your chassis has the necessary motherboard
support studs installed. These studs are usually metal and are gold in color. Usually, the chassis
manufacturer will pre-install the support studs. If you’re unsure of stud placement, simply lay the
motherboard inside the chassis and align the screw holes of the motherboard to the studs inside
the case. If there are any studs missing, you will know right away since the motherboard will not
be able to be securely installed.
Some chassis’ include plastic studs instead of metal. Although the plastic studs are usable, TYAN
recommends using metal studs with screws that will fasten the motherboard more securely
in place.
Below is a chart detailing what the most common motherboard studs look like and how they
should be installed.
TIP: Use metal studs if possible, as they hold the motherboard into place more securely than
plastic standoffs.
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2.10 – Installing the Memory
Before attempting to install any memory, make sure that the memory you have is compatible with
the motherboard as well as the processor. For example, while PC1600 DDR modules are
compatible with all DDR based motherboards, they will not work if you are required to run the
motherboard and processor buses at 133MHz. For this, PC2100 DDR modules are required.
Critically important is whether you’re using the recommended memory for the current board you
have. For this information, please check TYAN’s web site at: www.TYAN.com.
The following diagram shows the types of RAM modules you may encounter.
Use only 184-pin unbuffered non-ECC memory for S2098.
Note: The Trinity i845GL has two DIMM sockets, which supports a maximum of four banks of
DDR memory (only supports 64 Mb, 128 Mb, 256 Mb, and 512 Mb technologies for
x8 and x16 devices.)
Unbuffered
Non-ECC
= 8 Chips
Unbuffered
ECC
= 9 Chips
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2.11 – Memory Installation Procedure
When you install the memory modules, make sure the module aligns properly with the memory
slot. The modules are keyed to ensure that it is inserted only one way. The method of installing
memory modules are detailed by the following diagrams.
Once the memory modules are firmly seated in the slot, two latches on either side will close and
secure the module into the slot. Sometimes you may need to close the latches yourself.
To remove the memory module, simply push the latches outwards until the memory module pops
up. Then simply remove the module.
NOTE
Due to the PCI v2.2 specifications, you MUST unplug the power connector to the
motherboard before performing system hardware changes to avoid having your
motherboard boot-up automatically.
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2.12 – Installing the Processor and Heatsink
Your brand new Trinity i845GL supports the latest processor technologies from Intel. Check
TYAN’s website for latest processor support:
http://www.TYAN.com
The following diagrams will detail how to install your processor:
The processor you choose to use may not look exactly like the one pictured above, nor will the
socket look exactly the same. For example, your processor may appear to be in a different color
and have different markings on it. The diagram is provided as a visual guide to help you install the
processor.
1. Lift the lever on the socket until it is approximately 90o or as far back as possible
to the socket.
2. Align the processor with the socket. There are keys underneath the processor just like
on memory modules to ensure that they insert the correct way.
3. Seat the processor firmly into the socket by gently pressing down until the processor
sits flush with the socket.
4. Place the socket lever back down until it snaps into place.
5. Your processor is installed.
Take care when installing Pentium 4 processors as they have very fragile connector pins
below the processor and can bend and break if inserted improperly.
Heatsink Installation
After you are done installing the processor, you should proceed to installing the heatsink. The
heatsink will ensure that the processor does not overheat, and will continue to operate at
maximum performance. An overheated processor is also dangerous to the long-term reliability of
the motherboard.
Because there are many different types of heatsinks available from many different manufacturers,
many have their own method of installation. For the safest method of installation and information
on choosing the appropriate heatsink, please refer to TYAN’s website: http://www.TYAN.com .
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Finishing Installing the Heatsink
After you finish installing the heatsink onto the processor and socket, attach the end wire of the
fan (which should already be attached to the heatsink) to the motherboard. The following diagram
illustrates how to connect fans onto the motherboard.
After you’re finished installing all the fans you can connect your drives (hard drives, CD-ROM
drives, etc.) to your motherboard.
2.13 – Attaching Drive Cables
Attaching IDE cables to your drives is simple because they only go in one way. TYAN
motherboards have two on-board IDE channels for you to use, each supporting two drives. There
is a white and a black IDE connector on your motherboard. The black connector is the Primary
IDE channel and the white connector is the Secondary IDE channel.
Attaching IDE cables to the IDE connectors is illustrated below:
Simply plug in the BLUE END of the IDE cable into the motherboard IDE connector, and the other
ends into the drive(s). Each standard IDE cable has three connectors, two being close to each
other. The BLUE connector that is far on its own is the end that plugs into the motherboard
whereas the other two connectors are used to connect to drives.
TIP: Pin 1 on the IDE cable (usually denoted by a colored wire) faces the drive’s power
connector.
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Floppy Drives
Attaching floppy diskette drives are done in a similar manner to hard drives. See the picture below
for an example of a floppy cable. Most of the current floppy drives on the market require that the
cable be installed with the colored stripe positioned next to the power connector. In most cases,
there will be a key pin on the cable which will force a proper connection of the cable.
The first floppy drive (sometimes denoted as
A:) is usually attached to the end of the cable
with the twist in it. Drive B: is usually connected
to the second or third connector in the cable
(the second or third connector after you install
Drive A:).
Refer to your floppy drive’s installation
instructions (if available), or co ntact your dealer
if you are unsure about how to attach the
floppy drive(s). Remember, you can only have
2 floppy drives connected at any given time.
Below are some symptoms of incorrectly installed floppy drives. While they are minor and
installing them incorrectly doesn’t cause severe problems, it may cause your system to freeze or
crash when trying to read and or write to disks.
Drive is not automatically detected
Drive Fail message at bootup
Drive does not power on
Drive activity light is constantly on
NOTE
Before continuing onto Connecting External Devices, make sure everything is
properly connected. Things like jumpers and case wiring are the most common
causes of troubleshooting frustrations, both for the end-user and for any
company doing technical support.
Symptoms of incorrectly installed floppy drives
Usually caused by faulty cables, cables put in
backwards or a bad floppy drive or
motherboard. Try another floppy drive to verify
the problem if the cable is properly installed or
try replacing the actual cable. Also check to
see if the onboard floppy controller is enabled
in the BIOS setup.
The cable, floppy drive or motherboard may be
faulty. Try another drive or cable to verify.
Check power cable and cabling. Maybe a bad
power supply or drive cable problem.
Usually signifies that the cable on the drive is
on backwards, which is a common issue.
Reverse the cable at the floppy drive end and
try again.
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2.14 –Installing Add-In Cards
Before installing add-in cards, it’s good to be aware if they’re fully compatible with your
motherboard. For this reason, we’ve provided a chart, listing the most common slots that may
appear on your motherboard. Not all the slots in this diagram will be on the same board though,
but there will be combinations. See below for the way the slots look and what each one means.
Simply find the appropriate slot for your expansion card and insert the card in firmly. Do not force
any expansion cards (or anything else) into any slots if they refuse to go in. It’s better to try
another slot or return the faulty card rather than damaging both the motherboard and the card.
TIP: It’s good practice to spread out cards as far apart from each other as possible if you can. This
gives more breathing room and sensitive electronics will cool better and perform more reliably.
NOTE
YOU MUST unplug the power connector to the motherboard before performing
system hardware changes, to avoid having your motherboard boot-up
automatically, due to the PCI v2.2 spec.
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2.15 – Connecting External Devices
The standard devices you should expect to plug into the motherboard are keyboards, mice, and
printer cables. The following diagram will detail the ATX port stack for the following board:
S2098 Trinity i845GL
Although primarily to connect printers, the parallel printer port is also used for devices such as ZIP
drives, external CD-RW drives, scanners, and other external devices. Serial ports, also known as
COM ports, are primarily used to connect external modems and other RS-232C devices.
TIP: While the ports have been created to accept connectors in only one direction, make sure to
be careful when inserting connectors. At times, attaching connectors in the incorrect orientation
can damage, bend and or break the pins.
2.16 – LAN LED Scheme
Link LEDActivity LED
Linked at
10Mbps
Linked at
100Mbps
Off
Yellow Blink
Blink
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2.17 – Installing the Power Supply
There are two power connectors on your Trinity i845GL. By default, the Trinity i845GL requires
that you have an ATX12V power supply that has a 20-pin and a 4-pin power connector. Do not
use any other type of power supply.
1. Disconnect power supply from electrical outlet
2. Connect ATX12V 4 -pin power connector
3. Connect ATX12V 20 -pin power connector
4. Connect power cable to power supply to power outlet
Make sure you have connected BOTH the 20-pin and 4-pin connectors before attempting to
apply power to the board.
2.18 – Finishing Up
Congratulations on making it this far! You’re finished setting up the hardware aspect of your
computer. Before closing up your chassis, make sure that all cables and wires are connected
properly, especially IDE cables and most importantly, jumpers. You may have difficulty powering
on your system if the motherboard jumpers are not set correctly.
In the rare circumstance that you have experienced difficulty, even though the instructions herein
were followed, you can find help by asking your vendor for assistance. If they are not available for
assistance, please find setup information and documentation online at our website or by calling
your vendor’s support line.
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Chapter 3: BIOS Setup
Installation
The BIOS is the basic input/output system, the firmware on the motherboard that enables your
hardware to interface with your software. This chapter describes different settings for the BIOS
that can be used to configure your system.
The BIOS section of this manual is subject to change without notice and is provided for reference
purposes only. The settings and configurations of the BIOS are current at the time of print, and
therefore may not match exactly what is displayed on screen.
This section describes the BIOS setup program. The setup program lets you modify basic
configuration settings. The settings are then stored in a dedicated, battery-backed memory (called
NVRAM) that retains the information when the power is turned off.
This motherboard’s BIOS is a customized version of the industry-standard BIOS for IBM PC
compatible personal computers. The BIOS provides critical, low -level support for the system’s
central processing unit (CPU), memory, and I/O subsystems.
This BIOS has been customized by adding important features such as virus and password
protection, power management, and chipset “tuning” features that control the system. This section
will guide you through the process of configuring the BIOS for your system setup.
Starting Setup
The BIOS is immediately activated when you turn on the computer. The BIOS reads system
configuration in CMOS RAM and begins the process of checking out the system and configuring it
through the Power-On-Self-Test (POST).
When these preliminary tests are complete, the BIOS searches for an operating system on one of
the system’s data storage devices (hard drive, CD-ROM, etc). If one is found, the BIOS will launch
that operating system and hand control over to it. You can enter the BIOS setup by pressing the
[Delete] key when the machine boots up and begins to show the memory count.
NOTE
THE FOLLOWING SECTION DETAILS MOST IF NOT ALL OF THIS BOARD’S
BIOS FEATURES.
HOWEVER, YOUR ACTUAL BIOS SETUP MAY NOT BE EXACTLY AS THE
ONE DETAILED IN THIS MANUAL.
PLEASE REFER TO THE TYAN WEBSITE FOR UP TO DATE FEATURES
CONCERNING BIOS AND OTHER DATA.
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Setup Keys
The table below shows how to navigate in the setup program using the keyboard.
Left/Right Arrow Keys Change from one menu to the
Up/Down Arrow Keys More between selections
Getting Help
Pressing [F1] will display a small help window that describes the appropriate keys to use and the
possible selections for the highlighted item. To exit the Help Window, press [ESC] or the [F1] key
again.
In Case of Problems
If you discover that you have trouble booting the computer after making and saving the changes
with the BIOS setup program, you can restart the computer by holding the power button down until
the computer shuts off (usually within 4 seconds).
The best advice is to alter only settings that you thoroughly understand. In particular do not
change settings in the Chipset section unless you are absolutely sure you need to. The Chipset
defaults were carefully chosen by TYAN or your system manufacturer for the best performance
and reliability. Even a seemingly small change to the Chipset setup options may cause the system
to become unstable or unusable.
Setup Variations
Not all systems have the same BIOS setup layout or options. While the basic look and function of
the BIOS setup remains more or less the same for most systems, the appearance of your Setup
screen may differ from the screen shown here. Each system design and chipset combination
requires custom configurations. In addition, the final appearance of the Setup program depends
on your system designer. Your system designer can decide that certain items should not be
available for user configuration, and remove them from the BIOS setup program.
On the following pages, options written in bold type represent the BIOS Setup default.
Key Function
Tab Moves from one selection to
the next
next
Enter Opens highlighted section
PgUp/PgDn Keys Change settings.
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3.1 – Entering Setup
When you enter Phoenix AwardBIOS CMOS Setup Utility, the following screen will appear:
3.2 – Standard CMOS Features
In this section, you can alter general features such as the data and time, as well as access to the
IDE configuration options. Note that the options listed below are for options that can directly be
changed within the Main Setup screen.
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(Standard CMOS Features continued)
System Time
System Date
IDE Primary
Master/Slave
IDE Secondary
Master/Slave
Drive A
Drive B
Video
Halt On
HH: Hours (24 hr. format)
MM: Minutes
SS: Seconds
MM: Month
DD: Day
YYYY: Year
None
Auto
Manual
None
Auto
Manual
None
360K, 5.25 in.
1.2M, 5.25 in.
720K, 3.5 in.
1.44M, 3.5 in.
2.88M, 3.5 in.
Same options as Drive A
None
EGA/VGA
CGA 40
CGA80
MONO
No Errors
All Errors
All, but keyboard
All, but diskette
All, but disk/key
Adjusts the system clock.
Adjusts the system date.
Detects IDE drives.
Detects IDE drives.
Defines floppy drive type.
Defines floppy drive type.
Defines video display
mode.
Determines if the
computer should stop
when an error is detected
during power up.
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3.3 – Advanced BIOS Features
In Advanced BIOS Features, you will be able to adjust many of the feature that effect system
speed and boot-up options.
Virus Warning
CPU L1 & L2 Cache
Quick Power On Self Test
First, Second, Third, Other
Boot Device
Swap Floppy Drive
Boot Up Floppy Seek
Boot Up NumLock Status
Gate A20 Option
Typematic Rate Setting
Typematic Rate
(chars/Sec)
Typematic Delay (MSec)
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Disabled
Auto
Enabled
Disabled
Enabled
Disabled
Options Dependant on
system.
Enabled
Disabled
Enabled
Disabled
On
Off
Normal
Fast
E nabled
Disabled
6, 8, 10, 12, 15, 20, 24, 30 Defines how many characters are
250, 500, 750, 1000 Defines the delay that occurs at
This settings toggles virus
protection on or off for boot sector
writes.
Toggles the use of CPU L1 and L2
cache.
This option allows the system to
skip self-tests for faster startup.
Selects the startup device
sequence.
This option switches A: to B: drive.
This option causes the floppy
drives to be detected at startup.
Sets the Num Lock on or off.
(Leave as default)
Toggles control of keyboard key
repeat rate.
repeated per second when holding
down a key on the keyboard.
keystroke before that key will start
to repeat.
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(Advanced BIOS Features continued)
Security Option
OS Select for DRAM >
64MB
Report No FDD for WIN95
Small Logo (EPA) Show
3.4 – Advanced Chipset Features
In Advanced Chipset Features, you will be able to adjust many of the chipset special features.
Setup
System
Non-OS2
OS2
No
Yes
Enabled
Disabled
Set the password on either just
the BIOS setup or the entire
system (BIOS setup included).
Select OS2 only if you are running
OS/2 operating system with more
than 64MB of RAM.
Tells Win9x not to display the
floppy drive if there are none
installed.
Toggles the display of the EPA
Energy Star logo at POST.
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(Advanced Chipset Features continued)
DRAM Ti ming Selectable
CAS Latency Time
Active to Precharge Delay
DRAM RAS# to CAS#
DRAM RAS# Precharge
Memory Frequency For
System BIOS Cacheable
Video BIOS Cacheable
Memory Hole At 15M-16M
Delayed Transaction
Delay Prior to Thermal
AGP Aperture Size (MB)
On-Chip Frame Buffer Size
Delay
(minutes)
On-Chip VGA
Boot Display
By SPD
Manual
1.5, 2, 2.5, 3 Set the latency between the
5, 6, 7 Set the number of DDR
2, 3Set the latency between the
2, 3Set the idle clocks after
PC100
PC133
Auto
Enabled
Disabled
Enabled
Disabled
Enabled
Disabled
Enabled
Disabled
4, 8, 16, 32, 64
4, 8, 16, 32, 64, 128, 256
Enabled
Disabled
1MB
8MB
Auto, CRT, TV, EFP Selects the display device
Set DDR SDRAM
configuration. By SPD is
recommended.
DRAM read command and
the data actually available
SDRAM clocks used for
DDR SDRAM parameters
DDR SDRAM active
command and the
read/write command
issuing a precharge
command to DDR SDRAM
Set the frequency for the
DDR SDRAM. Auto is
recommended.
Toggles BIOS caching on
and off. For performance,
use Enabled.
Toggles video card BIOS
caching. Leave as Default.
Creates a memory reserve
at 15 to 16MB address in
RAM for ISA devices that
require it. Leave as Default.
(Leave as Default)
Set CPU Thermal function
after booting xx minutes.
(Leave as Default)
Sets a RAM amount used
for AGP functions.
Enables or Disables
onboard VGA.
Sets the on-chip VGA
Frame buffer size
during bootup.
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3.5 – Integrated Peripherals
Options related to onboard peripheral features can be altered through the following:
On-Chip Primary PCI IDE
Primary Master/Slave PIO
Primary
Master/Slave UDMA
On-Chip Secondary
PCI IDE
Secondary Master/Slave
PIO
Secondary Master/Slave
UDMA
USB Controller
USB Keyboard Support
AC97 Audio
Onboard LAN Device 1
Onboard LAN Device 2
Enables or Disables onboard IDE
controller.
Changes PIO (Programmed I/O)
interface mode for HDD.
Changes UDMA (Ultra Direct
Memory Access) interface mode
for HDD.
Enables or Disables onboard IDE
controller 2.
Changes PIO (Programmed I/O)
interface mode for HDD.
Changes UDMA (Ultra Direct
Memory Access) interface mode
for HDD.
Toggles the use of onboard USB
ports.
Toggles the use of a USB
keyboard under DOS.
Choose to detect onboard AC97
Audio by BIOS.
Enables or disables LAN 1
(10/100Mbit)
Enables or disables LAN 2
(Optional 10/100Mbit)
Selects the primary graphics card.
(Integrated Peripherals Continued)
IDE HDD Block Mode
Onboard FDC Controller
Onboard Serial Port 1
Enabled
Disabled
Enabled
Disabled
Disable,
3F8/IRQ4, 2F8/IRQ3,
3E8/IRQ4, 2E8/IRQ3,
Auto
Leave this setting as it is.
Leave this setting as it is.
Sets the address for the onboard
Serial Port .
Onboard Serial Port 2
UART2 Mode Select
Onboard Parallel Port
Parallel Port Mode
ECP Mode Use DMA
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Disable,
3F8/IRQ4, 2F8/IRQ3,
3E8/IRQ4, 2E8/IRQ3,
Auto
Normal
IRDA, ASKIR, SCR
Disable
378/IRQ7
278/IRQ5
3BC/IRQ7
SPP, EPP, ECP,
ECP+EPP
1
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Sets the address for the onboard
Serial Port 2.
Selects the device on which to
assign UART2.
Sets the address of the onboard
parallel port.
Sets the operation mode of the
parallel port.
Configures the parallel port DMA
channel for the selected ECP
mode.
3.6 – Power Management Setup
Options related to power management can be altered through the following:
ACPI function
ACPI Suspend Type
Power Management
Video Off Method
Video Off In Suspend
Suspend Type
MODEM Use IRQ
Suspend Mode
HDD Power Down
Soft-Off by PWRBTN
PWRON After PWR-Fail
Wake Up by PCI Card
Power On by Ring or
Wake Up on LAN
Enabled
Disabled
S1 (POS) Defines ACPI system suspend
User Define
Maximum Saving
Minimum Saving
V/H SYNC+Blank
Blank
DPMS
No
Yes
Stop Grant
Power On Suspend
3 Sets the IRQ for the used
Disabled
1/2/4/8/12/20/3040/60 Min
Disabled
1,5,10,20,30,45,60 minutes
Instant-Off
4-seconds
Off
On
Disabled
Enabled
Disabled
Enabled
Toggles advanced power and
configuration done by OS.
mode.
Defines the type of power saving
features the system should follow.
Defines the method used to power
off graphics.
Sets the video on/off in suspend
mode.
Defines the suspend type for Stop
Grant or power on suspend.
MODEM.
Set the time period before the
system goes into suspend mode.
Defines hard drive power down
delay.
Defines the action of the power
button when pressed.
Defines whether the system will
remain off if power fails or turn on
when power is restored.
Defines whether the system can be
powered on by a PCI Card.
Defines whether the system will
wake up if the modem is dialed
into. Set for default.
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(Power Management Setup continued)
Resume by Alarm
Primary/Secondary IDE
0 & 1
FDD, COM, LPT Port
PCI, PIRQ [A -D] #
Disabled
Enabled
Disabled
Enabled
Disabled
Enabled
Disabled
Enabled
Defines the time/date when the
system will wake up.
Enables or Disables monitoring
Primary IDE 0/1 for power saving.
Enables or Disable of monitoring
FDD, COM, LPT for power saving.
Enables or Disables monitoring
PCI PIRQ [A -D] # IRQ Active.
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3.7 – PnP/PCI Configuration
Options related to all the configurations of Pnp/PCI resources.
Rest Configuration data Enabled
Resources Controller
PCI/VGA Palette Snoop Enabled
Disabled
Auto (ESCD)
Manual
Disabled
Leave as Default.
Defines whether system
resources are controlled by BIOS
or by user.
Leave as Default.
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3.8 – PC Health Status
This menu is related to detecting system temperature, voltage, fan, and speed.
Shutdown Temperature
60° C / 140° F
65° C / 149° F
70° C / 158° F
75° C / 167° F
To shut down the system when
the temperature reaches a certain
degree.
The onboard hardware monitoring ASIC automatically detects the system, motherboard, and CPU
temperatures. It detects the CPU and chassis fan speeds in RPM. The hardware monitor ASIC
also detects the voltage output through the voltage regulators.
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3.9 – Frequency and Voltage Control
Options related to control CPU clock and frequency ratio.
Warning: The following options are to be changed only by a certified technician or at TYAN’s
discretion. Damage to your processor, motherboard, memory, or any other device in your system
can be caused by mishandling the following settings.
Auto
16X… 22x
CPU Clock Ratio
Sets the CPU multiplier.
TYAN does not recommend
changing this setting from the
default setting.
Auto Detect PCI/DIMM Clk
Spread Spectrum
CPU Host/3V66/PCI Clock
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Enabled
Disabled
Enabled
Disabled
Default
100 – 152MHz
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Sets the BIOS to
automatically adjust CPI and
memory bus speeds
accordingly.
Reduces interference on the
motherboard. Leave as
default if your system works
correctly.
Sets the front side bus speed
of the motherboard. Default
is recommended
Chapter 4: Diagnostics
Note: if you experience problems with setting up your system, always check the following things in
the following order:
By checking these items, you will most likely find out what the problem might have been when
setting up your system. For more information on troubleshooting, check the TYAN website at:
http://www.TYAN.com .
4.1 Beep Codes
Fatal errors, which halt the boot process, are communicated through a series of audible beeps.
For example, if the BIOS POST can initialize the video but an error occurs, an error message will
be displayed. If it cannot display the message, it will report the e rror as a series of beeps.
The most common type of error is memory error:
Memory not installed or memory not seated in the socket properly. If this occurs, the board
will beep continuously and will not stop until power off. Please ensure that the correct type
of memory is installed in the correct location.
If you get this error, please check your memory configuration, order, type, and check for faulty
modules. Please check our website for memory compatibility.
Before calling your vendor or calling TYAN Tech Support, be sure that you know how many beeps
your board made, and how long the beeps were. Also have other information such as your
attached add-in cards, drives and OS to help speed up the support process and come to a
possible solution faster.
4.2 Flash Utility
Every BIOS file is unique for the motherboard it was designed for. For Flash Utilities, BIOS
downloads, and information on how to properly use the Flash Utility with your motherboard, you
must check the TYAN website: http://www.TYAN.com/
Please be aware that by flashing your BIOS, you agree that in the even of a BIOS
NOTE
flash failure, you must contact your dealer for a replacement BIOS. There are no
exceptions. TYAN does not have a policy of replaci ng BIOS chips directly with end
users. In no event will TYAN be held responsible for damage done to the BIOS by
the end user.
Memory, Video, CPU
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Appendix I: Glossary
ACPI (Advanced Configuration and Power Interface): a power management specification that
allows the operating system to control the amount of power distributed to the computer’s devices.
Devices not in use can be turned off, reducing unnecessary power expenditure.
AGP (Accelerated Graphics Port): an interface specifically designed for the demands of 3D
graphics applications. The 32-bit AGP channel directly links the graphics controller to the system
memory. While the channel runs at just 66MHz, it supports data transmission during both the
rising and falling ends of the clock cycle, yielding an effective speed of 133MHz.
ATAPI (AT Attachment Packet Interface): also known as IDE or ATA; a drive implementation
that includes the disk controller on the device itself. It allows CD-ROMs and tape drives to be
configured as master or slave devices, just like hard drives.
ATX: the form factor designed to replace the AT form factor. It improves on the AT design by
rotating the board 90 degrees, so that the IDE connectors are closer to the drive bays, and the
CPU is closer to the power supply and cooling fan. The keyboard, mouse, USB, serial, and
parallel ports are built-in.
Bandwidth: refers to carrying capacity. The greater the bandwidth, the more data the bus, phone
line, or other electrical path, can carry. Greater bandwidth, then, also results in greater speed.
BBS (BIOS Boot Specification): is a feature within the BIOS that creates, prioritizes, and
maintains a list of all Initial Program Load (IPL) devices, and then stores that list in NVRAM. IPL
devices have the ability to load and execute an O/S, as well as provide the ability to return to the
BIOS if the O/S load process fails for some reason. At that point, the next IPL device is called
upon to attempt loading of the O/S.
BIOS (Basic Input/Output System): the firmware that resides in the ROM chip, and provides the
basic instructions for controlling your computer’s hardware. Both the operating system and
application software use BIOS routines to ensure compatibility.
Buffer: a portion of RAM which is used to temporarily store data, usually from an application,
though it is also used when printing, and in most keyboard drivers. The CPU can manipulate data
in a buffer before copying it, all at once, to a disk drive. While this improves system performance --
- reading to or writing from a disk drive a single time is much faster than doing so repeatedly --there is also the possibility of losing your data should the system crash. Information stored in a
buffer is temporarily stored, not permanently saved.
Bus: a data pathway. The term is commonly used to refer to the connection between the
processor and system memory, and between the processor and AGP, PCI or ISA buses.
Bus mastering: allows peripheral devices and IDE controllers to access the system memory
without going through the CPU (similar to DMA channels).
Cache: a temporary storage area for data that will be needed often by an application. Using a
cache lowers data access times, since the needed information is stored in the SRAM instead of in
the slower DRAM. Note that the cache is also much smaller than your system memory: a typical
cache size is 512KB, while you may have as much as 4GB or more of system memory.
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Cache size: refers to the physical size of the cache. This should not be confused with the
cacheable area, which is the total amount of memory which can be scanned by the system in
search of data to put into the cache. A typical setup would be a cache size of 512KB, and a
cacheable area of 512MB. In this case, up to 512KB of system memory is capable of being
cached. However, only 512KB of this memory will be in the cache at any given moment.
Closed and open jumpers: jumpers and jumper pins are active when they are “on” or “closed”,
and inactive when they are “off” or “open”.
CMOS (Complementary Metal-Oxide Semiconductor): chips that hold the basic startup
information for the BIOS.
COM port: another name for the serial port, which is called such because it transmits the eight
bits of a byte of data along one wire, and receives data on another single wire (that is, the data is
transmitted in serial form, one bit after another). Parallel ports transmit the bits of a byte on eight
different wires at the same time (that is, in parallel form, eight bits at the same time).
DDR (Double Data Rate): is a technology designed to double the clock speed of the m emory. It
activates output on both the rising and falling edge of the system clock rather than on just the
rising edge, potentially doubling throughput.
DIMM (Dual In-line Memory Module): faster and more capacious form of RAM than SIMMs.
DIMM bank: sometimes called DIMM sockets, because the physical slot and the logical unit are
the same. That is, one DIMM module fits into one DIMM socket, which is capable of acting as a
memory bank.
DMA (Direct Memory Access): channels that are similar to IRQs. DMA channels allow hardware
devices (like soundcards or keyboards) to access the main memory without involving the CPU.
This frees up CPU resources for other tasks. As with IRQs, it is vital that you do not double up
devices on a single line. Plug-n-Play devices w ill take care of this for you.
Doze mode: in this mode, only the CPU’s speed is slowed.
DRAM (Dynamic RAM): widely available, very affordable form of RAM which will lose data if it is
not recharged regularly (every few milliseconds). This refresh requirement makes DRAM three to
ten times slower than non-recharged RAM such as SRAM.
ECC (Error Correction Code or Error Checking and Correcting): allows data to be checked for
errors during run-time. Errors can subsequently be corrected at the same time that they’re found.
EEPROM (Electrically Erasable Programmable ROM): also called Flash BIOS, is a ROM chip
which can, unlike normal ROM, be updated. This allows you to keep up with changes in the BIOS
programs without having to replace the BIOS chip. TYAN’s BIOS updates can be found at
http://www.TYAN.com .
ESCD (Extended System Configuration Data): a format for storing information about Plug-nPlay devices in the system BIOS. This information helps properly configure the system each time
it boots.
Fault-tolerance: a term describing a system where one component can quickly be replaced
without causing a loss of service, such as in a RAID system.
Firmware: low-level software that controls the system hardware.
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Form factor: an industry term for the size, shape, power supply type, and external connector type
of the Personal Computer Board (PCB) or motherboard. The most common form factors in use
today are; ATX, microATX, FlexATX, Extended ATX, SSI EEB, and SSI MEB.
Global timer: onboard hardware timer, such as the Real-Time Clock (RTC).
Handshaking: a form of encryption. One system, typically the server, sends an encryption
scheme to another agent, typically a client. Thus, the client’s data is protected during transmittal to
the server.
HDD: stands for Hard Disk Drive, a type of fixed drive.
H-SYNC: controls the horizontal synchronization/properties of the monitor.
IC (Integrated Circuit): the common, formal name for a computer chip.
IDE (Integrated Device/Drive Electronics): a simple, self-contained HDD interface. It can handle
drives up to 8.4 GB in size. Almost all IDE drives sold today are a form of Enhanced IDE (EIDE),
with maximum capacity determined by the hardware controller.
IDE INT (IDE Interrupt): a hardware interrupt signal that goes to the IDE.
I/O (Input/Output): the connection between a computer and another device (mouse, keyboard,
etc.)
Initial Program Load (IPL): a feature built into BBS-compliant devices, describing those devices
as capable of loading and executing an O/S, as well as being able to provide control back to the
BIOS if the loading attempt fails.
IPL: see Initial Program Load.
IRQ (Interrupt Request): an electronic request that runs from a hardware device to the CPU. The
interrupt controller assigns priorities to incoming requests and delivers them to the CPU. It is
important that there is only one device hooked up to each IRQ line. Doubling up devices on IRQ
lines can cause problems. Plug-n-Play operating systems can take care of these details for you.
ISA (Industry Standard Architecture): a slower 8- or 16-bit bus (data pathway). The original IBM
PC, PC-XT, and PC-AT utilized these bus architectures.
Latency: the amount of time that one part of a system spends waiting for another part to catch up.
This is most common when the system sends data out to a peripheral device, and waits for the
peripheral to send data back (peripherals tend to be slower than onboard system components).
Mirroring: see RAID.
NVRAM: ROM and EEPROM are both examples of Non-Volatile RAM, memory that holds its data
without power. DRAM, in contrast, is volatile.
OEM (Original Equipment Manufacturer): manufacturers that commonly package other
companies’ motherboards and hardware inside their chassis and sell them.
Parallel port: transmits the bits of a byte on eight different wires at the same time (that is, in
parallel form, eight bits at the same time).
PCI (Peripheral Component Interconnect): a 32 or 64-bit local bus (data pathway) which is
faster than the ISA bus. Local buses are those which operate within a single system (as opposed
to a network bus, which connects multiple systems).
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PCI PIO (PCI Programmable Input/Output) modes: the data transfer modes used by IDE drives.
These modes use the CPU for data transfer (in contrast, DMA channels do not). PCI refers to the
type of bus used by these modes to communicate with the CPU.
PCI-to-PCI bridge: allows you to connect multiple PCI devices onto one PCI bus.
Pipeline burst SRAM: a fast secondary cache. It is used as a secondary cache because SRAM
is slower than SDRAM, but usually larger. Data is cached first to the faster primary cache, and
then, when the primary cache is full, to the slower secondary cache.
Pipelining: improves system performance by allowing the CPU to begin executing a second
instruction before the first is completed. A pipeline can be likened to an assembly line, with a given
part of the pipeline repeatedly executing a set part of an operation on a series of instructions.
PM timers (Power Management timers): software timers that count down the number of
seconds or minutes until the system times out and enters sleep, suspend, or doze mode.
PnP (Plug-n-Play): a design standard that has become ascendant in the industry. Plug-n-Play
devices require little set-up to use. Novice end users can simply plug them into a computer that is
running on a Plug-n-Play aware operating system (such as Windows 98/Me/XP), and go to work.
Devices and operating systems that are not Plug-n-Play require you to reconfigure your system
each time you add or change any part of your hardware.
PXE (Preboot Execution Environment): one of four components that together make up the
Wired for Management 2.0 baseline specification. PXE was designed to define a standard set of
preboot protocol services within a client, towards the goal of allowing networked-based booting to
boot using industry standard protocols.
RAID (Redundant Array of Independent/Inexpensive Disks): a way for the same data to be
stored in different places on many hard drives. By using this method, the data is stored
redundantly, also the multiple hard drives will appear as a single drive to the O/S. RAID Level 0 is
known as striping, where data is striped (or overlapped) across multiple hard drives, but offers no
fault-tolerance. RAID Level 1 is known as mirroring, which stores the data within at least two hard
drives, but does not stripe. RAID Level 1 also allows for faster access time and fault-tolerance,
since either hard drive can be read at the same time. RAID Level 0+1 features both striping and
mirroring, providing fault-tolerance, striping, and faster access, all at the same time.
RAM (Random Access Memory): technically refers to a type of memory where any byte can be
accessed without touching the adjacent data, is often used to refer to the system’s main memory.
This memory is available to any program running on the computer.
ROM (Read-Only Memory): a storage chip which contains the BIOS; the basic instructions
required to boot the computer and start up the operating system.
SDRAM (Synchronous Dynamic RAM): called as such because it can keep two sets of memory
addresses open simultaneously. By transferring data alternately from one set of addresses and
then the other, SDRAM cuts down on the delays associated with non-synchronous RAM, which
must close one address bank before opening the next.
Serial port: called as such because it transmits the eight bits of a byte of data along one wire, and
receives data on another single wire (that is, the data is transmitted in serial form, one bit after
another).
Sleep/Suspend mode: in this mode, all devices except the CPU shut down.
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SRAM (Static RAM): unlike DRAM, this type of RAM does not need to be refreshed in order to
prevent data loss. Thus, it is faster and more expensive.
Standby mode: in this mode, the video and hard drives shut down; all other devices continue to
operate normally.
Striping: see RAID
UltraDMA-33/66/100/133 (aka ATA -133/100/66/33): a fast version of the original DMA channel.
UltraDMA is also called UltraATA. Without a proper UltraDMA controller, your system cannot take
advantage of higher data transfer rates of the new UltraDMA/UltraATA hard drives.
USB (Universal Serial Bus): a versatile port. This one port type can function as a serial, parallel,
mouse, keyboard or joystick port. It is fast enough to support video transfer, and is capable of
supporting up to 127 daisy-chained peripheral devices.
VGA (Video Graphics Array): the PC video display standard
V-SYNC: controls the vertical scanning properties of the monitor.
ZIF Socket (Zero Insertion Force socket): these sockets make it possible to insert CPUs without
damaging the sensitive CPU pins. The CPU is lightly placed in an open ZIF socket, and a lever is
pulled down. This shifts the processor over and down, guiding into the board and locking it into
place.
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Technical Support
If a problem arises with your system, you should turn to your dealer for help first. They have most
likely configured your system, and should have the best idea of what hardware and software your
system contains. Furthermore, if you purchased your system from a dealer near you, you can
bring your system to them to have it serviced, instead of attempting to do so yourself (which can
have expensive consequences).
Help Resources:
Returning Merchandise for Service
During the warranty period, contact your distributor or system vendor FIRST for any product
problems. This warranty only covers normal customer use and does not cover damages incurred
during shipping or failure due to the alteration, misuse, abuse, or improper maintenance of
products.
NOTE: A receipt or copy of your invoice marked with the date of purchase is required
before any warranty service can be rendered. You may obtain service by calling the
manufacturer for a Return Merchandise Authorization (RMA) number. The RMA number
should be prominently displayed on the outside of the shipping carton and the package
should be mailed prepaid. TYAN will pay to have the board shipped back to you.
1. See the beep codes section of this manual.
2. See the TYAN website for FAQs, bulletins, driver updates, and other
information: http://www.TYAN.com
3. Contact your dealer for help BEFORE calling TYAN.
4. Check the TYAN user group: alt.comp.periphs.mainboard.TYAN
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Notice for the USA
Compliance Information Statement (Declaration of Conformity Procedure) DoC
FCC Part 15: This device complies with part 15 of the FCC Rules
Operation is subject to the following conditions:
Notice for Canada
This apparatus complies with the Class B limits for radio interference as specified in the Canadian
Department of Communications Radio Interference Regulations. (Cet appareil est conforme aux
norms de Classe B d’interference radio tel que specifie par le Ministere Canadien des
Communications dans les reglements d’ineteference radio.)
CAUTION: Lithium battery included with this board. Do not puncture, mutilate, or dispose of
battery in fire. Danger of explosion if battery is incorrectly replaced. Replace only with the same or
equivalent type recommended by manufacturer. Dispose of used battery according to
manufacturer instructions and in accordance with your local regulations.
1) This device may not cause harmful interference, and
2) This device must accept any interference received including interference that may
cause undesired operation. If this equipment does cause harmful interference to radio
or television reception, which can be determined by turning the equipment off and on,
the user is encouraged to try one or more of the following measures:
• Reorient or relocate the receiving antenna.
• Increase the separation between the equipment and the receiver.
• Plug the equipment into an outlet on a circuit different from that of the
receiver.
•Consult the dealer on an experienced radio/television technician for help.
Notice for Europe (CE Mark)
This product is in conformity with the Council Directive 89/336/EEC,
92/31/EEC (EMC).
Document #: D1493 - 100
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